RY A IN IM EL PR Central CTLSH05-2M521HL SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY DIODE TM TINY LEADLESS MODULE Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH05-2M521HL is a high performance HiLo™ 0.5A Schottky diode designed for applications where small size and operational efficiency are the prime requirements. With a maximum power dissipation of 0.90W, and a very small package footprint (comparable to the SOT-563), this leadless package design is capable of dissipating over 3 times the power of similar devices in comparable sized surface mount packages. FEATURES: TLM521 CASE MARKING CODE: CF APPLICATIONS: • DC/DC Converters • Voltage Clamping • Protection Circuits SYMBOL N I M Continuous Reverse Voltage VR LI Power Dissipation E R Peak Forward Surge Current (8.3ms) P SYMBOL UNITS 20 V 0.5 A PD 0.9 W* IFSM 3.0 A TJ, Tstg -65 to +150 °C ΘJA 139 °C/W* IF Thermal Resistance ELECTRICAL CHARACTERISTICS: • Battery Powered Portable Equipment Y R A MAXIMUM RATINGS: (TA=25°C) Operating and Storage Junction Temperature • High Thermal Efficiency • Small TLM 2x1mm case • HiLo™ Device Characteristics (High Current/Low VF) • Ultra Low Forward Voltage Drop (VF=0.39V Typ. @ 0.5A) Average Forward Current TM (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP MAX UNITS 0.2 1.0 mA IR BVR VR=10V IR=1.0mA VF IF=100µA 0.030 0.060 V 20 V VF IF=500µA 0.065 0.100 V VF IF=10mA 0.145 0.200 V VF IF=100mA 0.235 0.280 V VF IF=200mA 0.280 0.330 V VF IF=500mA 0.390 0.460 V TBD pF CT * FR-4 Epoxy PCB with copper mounting pad area of 33mm2. R0 (20-January 2006) RY A IN CTLSH05-2M521HL Central TM Semiconductor Corp. MOUNT IM SURFACE ULTRA LOW V P L RE F SILICON SCHOTTKY DIODE TM TINY LEADLESS MODULE TLM521 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) 2) 3) 4) 5) CATHODE CATHODE CATHODE ANODE ANODE For standard mounting refer to TLM521 Package Details MARKING CODE: CF R0 (20-January 2006)