SN54HC688, SN74HC688 8-BIT IDENTITY COMPARATORS SCLS010D – DECEMBER 1982 – REVISED AUGUST 2003 D D D D D D D Wide Operating Voltage Range of 2 V to 6 V High-Current Outputs Drive Up To 10 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 14 ns ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max Compare Two 8-Bit Words SN54HC688 . . . J OR W PACKAGE SN74HC688 . . . DW, N, OR PW PACKAGE (TOP VIEW) 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 Q0 P0 OE VCC P=Q 1 VCC P=Q Q7 P7 Q6 P6 Q5 P5 Q4 P4 P1 Q1 P2 Q2 P3 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 Q7 P7 Q6 P6 Q5 Q3 GND P4 Q4 P5 OE P0 Q0 P1 Q1 P2 Q2 P3 Q3 GND SN54HC688 . . . FK PACKAGE (TOP VIEW) description/ordering information These identity comparators perform comparisons of two 8-bit binary or BCD words. An output-enable (OE) input may be used to force the output to the high level. ORDERING INFORMATION PDIP – N –40°C 85°C –40 C to 85 C TOP-SIDE MARKING Tube of 20 SN74HC688N Tube of 25 SN74HC688DW Reel of 2000 SN74HC688DWR Tube of 2000 SN74HC688PWR Reel of 250 SN74HC688PWT CDIP – J Tube of 20 SNJ54HC688J SNJ54HC688J CFP – W Tube of 85 SNJ54HC688W SNJ54HC688W LCCC – FK Tube of 55 SNJ54HC688FK SNJ54HC688FK SOIC – DW TSSOP – PW –55°C 125°C –55 C to 125 C ORDERABLE PART NUMBER PACKAGE† TA SN74HC688N HC688 HC688 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS DATA P, Q OE OUTPUT P=Q P=Q L L P>Q X H P<Q X H X H H Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HC688, SN74HC688 8-BIT IDENTITY COMPARATORS SCLS010D – DECEMBER 1982 – REVISED AUGUST 2003 logic diagram (positive logic) OE P0 Q0 P1 Q1 P2 Q2 P3 Q3 P4 Q4 P5 Q5 P6 Q6 P7 Q7 1 2 3 4 5 6 7 19 8 P=Q 9 11 12 13 14 15 16 17 18 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HC688, SN74HC688 8-BIT IDENTITY COMPARATORS SCLS010D – DECEMBER 1982 – REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC688 VCC Supply voltage VIH VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL Low-level input voltage VI VO MAX 2 5 6 NOM MAX 2 5 6 1.5 3.15 3.15 4.2 4.2 0 UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition (rise and fall) time MIN 1.5 0 Output voltage tt NOM VCC = 4.5 V VCC = 6 V Input voltage SN74HC688 MIN 0 VCC VCC 0 1000 1000 500 500 V V V ns VCC = 6 V 400 400 TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS Ci TA = 25°C TYP MAX SN54HC688 MIN MAX SN74HC688 MIN MAX UNIT 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = –4 mA IOH = –5.2 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA A 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 8 160 80 µA 3 10 10 10 pF VI = VIH or VIL VI = VIH or VIL VI = VCC or 0 VI = VCC or 0, MIN IOH = –20 µA A IOL = 4 mA IOL = 5.2 mA II ICC VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 V V 3 SN54HC688, SN74HC688 8-BIT IDENTITY COMPARATORS SCLS010D – DECEMBER 1982 – REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER TA = 25°C TYP MAX SN54HC688 SN74HC688 FROM (INPUT) TO (OUTPUT) VCC 2V 113 210 313 265 P or Q P=Q 4.5 V 30 42 63 53 6V 24 36 53 45 2V 66 120 179 151 4.5 V 16 24 36 30 6V 14 20 30 26 tpd OE tt P=Q Any MIN MIN MAX MIN MAX 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP 40 UNIT pF SN54HC688, SN74HC688 8-BIT IDENTITY COMPARATORS SCLS010D – DECEMBER 1982 – REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input VCC 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr tPHL VCC 50% 10% 0 V Out-of-Phase Output 90% tf VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86818012A ACTIVE LCCC FK 20 1 TBD 5962-8681801RA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type N / A for Pkg Type SN54HC688J ACTIVE CDIP J 20 1 TBD A42 SNPB SN74HC688DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC688NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC688PWLE OBSOLETE TSSOP PW 20 SN74HC688PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC688PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC688FK ACTIVE LCCC FK 20 1 TBD SNJ54HC688J ACTIVE CDIP J 20 1 TBD TBD Call TI Call TI POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC688DWR DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 SN74HC688PWR PW 20 SITE 41 330 16 6.95 7.1 1.6 8 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74HC688DWR DW 20 SITE 41 346.0 346.0 41.0 SN74HC688PWR PW 20 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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