TC54 Voltage Detector Features General Description • Precise Detection Thresholds: Standard ±2.0%, Custom ±1.0% • Small Packages: 3-Pin SOT-23A, 3-Pin SOT-89, TO-92 and 5-Pin SOT-23A (7.7V only) • Low Current Drain: Typ. 1 µA • Wide Detection Range: 1.1V to 6.0V and 7.7V • Wide Operating Voltage Range: 0.7V to 10V The TC54 series are CMOS voltage detectors that are especially well suited for battery-powered applications because of their extremely low 1 µA operating current and small surface-mount packaging. Each part is lasertrimmed to the desired threshold voltage, which can be specified from 1.4V to 7.7V for a 2% tolerance and from 1.5V to 6.0V for a 1% tolerance. Applications • • • • • Battery Voltage Monitoring Microprocessor Reset System Brown-Out Protection Switching Circuit in Battery Backup Level Discriminator During operation, the TC54's output (VOUT) remains in the logic-high state as long as VIN is greater than the specified threshold voltage (VDET –). When VIN falls below VDET –, the output is driven to a logic-low. VOUT remains low until VIN rises above VDET – by an amount VHYST, whereupon it resets to a logic-high. Functional Block Diagram TC54VC only 2 The device includes a comparator, low-current highprecision reference, laser-trimmed divider, hysteresis circuit and output driver. The TC54 is available with either an open-drain or complementary output stage. VIN Package Types 3-Pin SOT-23A VIN – + 3-Pin SOT-89 VIN 3 VOUT 1 TC54 TC54 1 VREF VSS VOUT 3 2 VSS 3-Pin TO-92 TC54VN has open-drain output. TC54VC has complementary output. 123 1 2 3 VOUT VIN VSS 5-Pin SOT-23A NC NC 5 4 TC54 1 VOUT VIN VSS Note: 2004 Microchip Technology Inc. 2 3 VOUT VIN VSS 3-Pin SOT-23A is equivalent to the EIAJ SC-59 5-Pin SOT-23A is equivalent to the EIAJ SC-74A. (7.7V ONLY) DS21434G-page 1 TC54 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ...................................................................+12V † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Output Current ..............................................................50 mA Output Voltage: CMOS................(VSS – 0.3V) to (VIN + 0.3V) Open-Drain.....................(VSS – 0.3V) to 12V PIN FUNCTION TABLE Power Dissipation (TA ≤ 70°C): 3-Pin SOT-23A .......................................................240 mW 3-Pin SOT-89..........................................................500 mW 5-Pin SOT-23A .......................................................240 mW 3-Pin TO-92 ............................................................300 mW Symbol Operating Temperature Range........................-40°C to +85°C Storage Temperature Range .........................-65°C to +150°C Description VOUT Digital Output VIN Analog Input VSS Ground Terminal NC No Connect NC No Connect DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25°C. Sym Min Typ Max Units Operating Voltage Parameter VIN 0.7 — 10.0 V Quiescent Current ISS — 0.8 2.7 µA — 0.9 3.0 VIN = 3.0V — 1.0 3.2 VIN = 4.0V — 1.1 3.6 VIN = 5.0V 1.37 1.4 1.43 2.06 2.1 2.14 TC54VX21 2.65 2.7 2.75 TC54VX27 2.84 2.9 2.96 TC54VX29 2.94 3.0 3.06 TC54VX30 4.12 4.2 4.28 TC54VX42 4.21 4.3 4.39 TC54VX43 7.54 7.7 7.86 TC54VX77 (5-pin SOT-23A only) Threshold Voltage (Note 1) Hysteresis Voltage Output Current Tempco of (VDET–) Delay Time Note 1: VDET – VHYST IOUT V mV Test Conditions (VDET –) = 0.8 to 6.0V VIN = 2.0V TC54VX14 28 70 112 42 105 168 VDET = 2.1V (typ) 54 135 216 VDET = 2.7V (typ) 58 145 232 VDET = 2.9V (typ) 60 150 240 VDET = 3.0V (typ) 84 210 336 VDET = 4.2V (typ) 86 215 344 VDET = 4.3V (typ) 154 385 616 VDET = 7.7V (typ) mA VDET = 1.4V (typ) — 7.7 — — 10.1 — VIN = 3.0V VOL = 0.5V, VIN = 2.1V — 11.5 — VIN = 4.0V — 13.0 — VIN = 5.0V — -10.0 — TC54VC Only: VOH = VIN – 2.1V, VIN = 8.0V TC (VDET –) — ±100 — tDLY — — 0.2 ppm/°C -40°C ≤ TA ≤ 85°C ms VDET – → VOUT inversion For other voltage options, please contact your regional Microchip sales office. DS21434G-page 2 2004 Microchip Technology Inc. TC54 VDET – VDD tDLY OUTPUT FIGURE 1-1: VOH Timing Diagram. 2004 Microchip Technology Inc. DS21434G-page 3 TC54 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (3-Pin SOT-23A) 2.1 Pin No. (3-Pin SOT-89) (3-Pin TO-92) Pin No. (5-Pin SOT-23A) Symbol 1 1 1 VOUT Digital Output 3 2 2 VIN Analog Input 2 3 3 VSS Ground Terminal — — 4 NC No Connect — — 5 NC No Connect Digital Output (VOUT) VOUT goes low when VIN drops below VDET – and returns high when VIN rises above VDET – + VHYST. (See Figure 3-1). 2.3 Analog Input (VIN) Ground Terminal (VSS) VSS provides the negative reference for the analog input voltage. Typically, the circuit ground is used. 2.4 2.2 Description No Connect (NC) No internal connection. VIN can be used for power supply monitoring or a voltage level that requires monitoring. DS21434G-page 4 2004 Microchip Technology Inc. TC54 3.0 DETAILED DESCRIPTION In normal steady-state operation when VIN > VDET –, the output will be at a logic-high (see Figure 3-1). In the case of the TC54VN, this is an open-drain condition. If the input falls below VDET –, the output will pull down (Logic 0) to VSS. Generally, VOUT can pull down to within 0.5V of VSS at rated output current and input voltage. (See Section 1.0 “Electrical Characteristics”). VIN The output (VOUT) will stay valid until the input voltage falls below the minimum operating voltage (VINMIN) of 0.7V. Below this minimum operating voltage the output is undefined. During power-up (or anytime VIN has fallen below VINMIN), VOUT will remain undefined until VIN rises above VINMIN. Once this occurs, the output will become valid. VOUT will be in its active-low state, while VINMIN < VIN < VDET+ (therefore, VDET + = VDET – + VHYST). If the input rises above VDET+, the output will assume its inactive state (high for TC54VC, open-drain for TC54VN). VDET + VHYST Release Voltage or RESET Voltage Detect Voltage VDET – Minimum Operating Voltage Ground Level VOUT Output Voltage Ground Level FIGURE 3-1: Timing Diagram. 2004 Microchip Technology Inc. DS21434G-page 5 TC54 4.0 APPLICATIONS INFORMATION 4.1 Modifying The Trip Point, VDET – Although the TC54 has a pre-programmed VDET –, it is sometimes necessary to make adjustments during prototyping. This can be accomplished by connecting an external resistor divider to a TC54, which has a VDET – lower than that of VSOURCE (Figure 4-1). To maintain detector accuracy, the bleeder current through the divider should be significantly higher than the 1 µA operating current required by the TC54. A reasonable value for this bleeder current is 100 µA (100 times the 1 µA required by the TC54). For example, if VDET – = 2V and the desired trip point is 2.5V, the value of R1 + R2 is 25 kΩ (2.5V/100 µA). The value of R1 + R2 can be rounded to the nearest standard value and plugged into the equation of Figure 4-1 to calculate values for R1 and R2. 1% tolerance resistors are recommended. 4.2 Other Applications Low operating power and small physical size make the TC54 series ideal for many voltage detector applications, such as those shown in Figures 4-2, 4-3 and 4-4. Figure 4-2 shows a low-voltage gate drive protection circuit that prevents overheating of the logic-level MOSFET due to insufficient gate voltage. When the input signal is below the threshold of the TC54VN, its output grounds the gate of the MOSFET. Figure 4-3 and Figure 4-4 show the TC54 in conventional voltage monitoring applications. 4.3V 270Ω VCC VIN RL VOUT TC54VX MTP3055EL VSOURCE VSS R2 VIN R1 TC54 VOUT VSS FIGURE 4-2: Protection. MOSFET Low Drive + VIN – TC54VX VOUT R 1 V = -------------------- = V SOURCE DET R1 + R 2 VSS Where: VSOURCE = Voltage to be monitored (VDET –) = Threshold Voltage setting of TC54 Note: In this example, VSOURCE must be greater than (VDET –) FIGURE 4-1: Modify trip-point of the TC54 using external resistor divider. BATLOW FIGURE 4-3: Battery Voltage Monitor. VIN + Pwr Sply TC54VX VOUT Power Good – VSS FIGURE 4-4: DS21434G-page 6 Power Good Monitor. 2004 Microchip Technology Inc. TC54 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Pin SOT-23A 1 1 2 3 4 1 3 represents output configuration (CMOS or Nch) and first integer of voltage 1 1 D Symbol Output Voltage B CMOS 1. C CMOS 2. D CMOS 3. E CMOS 4. F CMOS 5. H CMOS 6. I CMOS 7. Symbol Output 2 2 3 4 represents output configuration and first integer of voltage Symbol Output Voltage T Nch 7. represents first decimal of output voltage Symbol Voltage 0 .0 1 .1 2 .2 3 .3 4 .4 Voltage 5 .5 .6 L Nch 1. 6 M Nch 2. 7 .7 .8 .9 N Nch 3. 8 P Nch 4. 9 R Nch 5. S Nch 6. T Nch 7. 3 & 4 represents assembly lot code represents first decimal of output voltage (0-9) Ex: CMOS 3.x = 3 2 4 Ex: CMOS 3.x = 2 5-Pin SOT-23A 3-Pin SOT-89 D 4 Symbol Voltage Symbol Voltage 0 .0 6 .6 1 .1 7 .7 2 .2 8 .8 3 .3 9 .9 4 .4 5 .5 & 4 represents assembly lot code 2004 Microchip Technology Inc. DS21434G-page 7 TC54 Package Marking Information (Continued) 3-Pin TO-92 1 2 3 4 5 6 7 8 1 , 2 ,& 3 4 = 54X (fixed) represents output configuration (CMOS or Nch) Ex: CMOS 3.x = C Symbol 5 6 7 8 Output C CMOS N N-Channel represents first integer of detect voltage Symbol Voltage 2 2. 3 3. 4 4. 5 5. 6 6. represents first decimal of detect voltage Symbol Voltage Symbol Voltage 0 .0 5 .5 1 .1 6 .6 2 .2 7 .7 3 .3 8 .8 4 .4 9 .9 represents the output Delay Time Symbol Delay Time 0 No Delay respresents the device accuracy Symbol Accuracy 1 ±1.0% (custom) 2 ±2.0% (standard) DS21434G-page 8 2004 Microchip Technology Inc. TC54 3-Lead Plastic Small Outline Transistor (CB) (SOT23A) E E1 2 B p1 n D p 1 c A φ A2 A1 L Units Dimension Limits n p Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width p1 A A2 A1 E E1 D L φ c B MIN .067 .035 .035 .000 .098 .055 .106 .014 0 .004 .012 INCHES NOM 3 .037 .075 – – – – – – – – – MAX .083 .055 .051 .004 .118 .071 .122 .022 10 .014 .019 MILLIMETERS* NOM 3 0.95 1.70 1.90 0.90 – 0.90 – 0.00 – 2.50 – 1.40 – 2.70 – 0.35 – 0 – 0.10 – 0.30 – MIN MAX 2.10 1.40 1.30 0.10 3.00 1.80 3.10 0.55 10 0.35 0.50 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-59 Drawing No. C04-130 2004 Microchip Technology Inc. DS21434G-page 9 TC54 3-Lead Plastic Small Outline Transistor (MB) (SOT89) H E B1 3 B D D1 p1 2 p R 1 B1 L E1 A C Pitch Outside lead pitch (basic) Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Tab Corner Radii Foot Length Lead Thickness Lead 2 Width Leads 1 & 3 Width Units Dimension Limits p p1 A H E E1 D D1 R L c B B1 INCHES MIN MAX .059 BSC .118 BSC .055 .063 .155 .167 .090 .102 .084 .090 .173 .181 .064 .072 .010 .035 .047 .014 .017 .017 .022 .014 .019 MILLIMETERS* MIN MAX 1.50 BSC 3.00 BSC 1.40 1.60 3.94 4.25 2.29 2.60 2.13 2.29 4.40 4.60 1.62 1.83 0.254 0.89 1.20 0.35 0.44 0.43 0.56 0.36 0.48 *Controlling Parameter Notes: Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: TO-243 Drawing No. C04-29 DS21434G-page 10 Revised 07-24-03 2004 Microchip Technology Inc. TC54 5-Lead Plastic Small Outline Transistor (CT) (SOT23) E E1 p B p1 n D 1 α c A L β Units Dimension Limits n p MIN φ A2 A1 INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX MIN MILLIMETERS NOM 5 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 5 0.15 0.43 5 5 Number of Pins Pitch p1 Outside lead pitch (basic) Overall Height A .035 .057 0.90 Molded Package Thickness A2 .035 .051 0.90 Standoff A1 .000 .006 0.00 Overall Width E .102 .118 2.60 Molded Package Width E1 .059 .069 1.50 Overall Length D .110 .122 2.80 Foot Length L .014 .022 0.35 φ Foot Angle 0 10 0 c Lead Thickness .004 .008 0.09 Lead Width B .014 .020 0.35 α Mold Draft Angle Top 0 10 0 β Mold Draft Angle Bottom 0 10 0 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 EIAJ Equivalent: SC-74A Drawing No. C04-091 2004 Microchip Technology Inc. DS21434G-page 11 TC54 3-Lead Plastic Transistor Outline (ZB) (TO-92) E1 D n 1 L 1 2 3 α B p c A R Units Dimension Limits n p β INCHES* NOM 3 .050 .130 .143 .175 .186 .170 .183 .085 .090 .500 .555 .014 .017 .016 .019 4 5 2 3 MIN MAX MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 MIN Number of Pins Pitch Bottom to Package Flat A .155 Overall Width E1 .195 Overall Length D .195 Molded Package Radius R .095 Tip to Seating Plane L .610 c Lead Thickness .020 Lead Width B .022 α 6 Mold Draft Angle Top β Mold Draft Angle Bottom 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 DS21434G-page 12 MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 2004 Microchip Technology Inc. TC54 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X XX X X X XX XX Output Detected Extra Tolerance Temp. Pkg Taping Config. Voltage Feature Direction Code Examples: a) b) Device: TC54V: Voltage Detector Output Configuration: N C = Nch Open-Drain = CMOS Output Detected Voltage: 14 21 27 29 30 42 43 = = = = = = = Extra Feature Code: 0 = Fixed Tolerance: 1 2 = 1% (custom) = 2% (standard) Temperature: E = -40°C to +85°C Package: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 CT = 5-Pin SOT-23A (equivalent to EIAJ SC-74A) (7.7V ONLY) ZB = Transistor Outline (TO-92), 3-lead Taping Direction: 713 = Standard Taping 1.4V 2.1V 2.7V 2.9V 3.0V 4.2V 4.3V c) d) e) f) g) h) i) j) TC54VC1402ECB713: 1.4V Voltage Detector, 2% Tol., SOT-23A-3-TR. TC54VC1402EMB713: 1.4V Voltage Detector, 2% Tol., SOT-89-3-TR. TC54VC1402EZB: 1.4V Voltage Detector, 2% Tol., TO-92. TC54VC2102ECB713: 2.1V Voltage Detector, 2% Tol., SOT-23A-3-TR. TC54VC2102EMB713: 2.1V Voltage Detector, 2% Tol., SOT-89-3-TR. TC54VC2102EZB: 2.1V Voltage Detector, 2% Tol., TO-92. TC54VC2702ECB713: 2.7V Voltage Detector, 2% Tol., SOT-23A-3-TR. TC54VC3002ECB713: 3.0V Voltage Detector, 2% Tol., SOT-23A-3-TR. TC54VN4202ECB713: 4.2V Voltage Detector, 2% Tol., SOT-23A-3-TR. TC54VN7702ECT713: 7.7V Voltage Detector, 2% Tol., SOT-23A-3-TR. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21434G-page 13 TC54 NOTES: DS21434G-page 14 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. 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