MC100ES60T22 Rev 2, 2/2005 Freescale Semiconductor Technical Data 3.3 V Dual LVTTL/LVCMOS to Differential LVPECL Translator MC100ES60T22 The MC100ES60T22 is a low skew dual LVTTL/LVCMOS to differential LVPECL translator. The low voltage PECL levels, small package, and dual gate design are ideal for clock translation applications. Features • • • • • 280 ps typical propagation delay 100 ps max output-to-output skew LVPECL operating range: VCC = 3.135 V to 3.8 V 8-lead SOIC and 8-lead TSSOP packages Ambient temperature range –40°C to +85°C D SUFFIX 8-LEAD SOIC PACKAGE CASE 751-06 DT SUFFIX 8-LEAD TSSOP PACKAGE CASE 1640-01 Q0 1 8 ORDERING INFORMATION VCC Device Q0 2 7 LVPECL Q1 D0 LVTTL/LVCMOS 3 6 SOIC-8 MC100ES60T22DR2 SOIC-8 MC100ES60T22DT TSSOP-8 MC100ES60T22DTR2 TSSOP-8 PIN DESCRIPTION D1 Pin Q1 4 5 GND Figure 1. 8-Lead Pinout (Top View) and Logic Diagram © Freescale Semiconductor, Inc., 2005. All rights reserved. Package MC100ES60T22D Function D0, D1 LVTTL/LVCMOS Inputs Qn, Qn LVPECL Differential Outputs VCC Positive Supply GND Negative Supply Table 1. General Specifications Characteristics Value Internal Input Pulldown Resistor 75 kΩ Internal Input Pullup Resistor 75 kΩ ESD Protection Human Body Model Machine Model > 2000 V > 200 V θJA Thermal Resistance (Junction-to-Ambient) 0 LFPM, 8 SOIC 500 LFPM, 8 SOIC 0 LFPM, 8 TSSOP 500 LFPM, 8 TSSOP 190°C/W 130°C/W 185°C/W 140°C/W Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Table 2. Absolute Maximum Ratings(1) Symbol Rating Conditions Rating Units 3.9 V VCC + 0.3 VEE – 0.3 V V 50 100 mA mA Power Supply Voltage Difference between VCC & VEE VIN Input Voltage VCC – VEE ≤ 3.6 V Iout Output Current Continuous Surge TA Operating Temperature Range –40 to +85 °C Storage Temperature Range –65 to +150 °C VSUPPLY TSTG 1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated conditions is not implied. Table 3. DC Characteristics (VCC = 3.135 V to 3.8 V; VEE = 0 V) -40°C Symbol (1) VOL(1) VOH Characteristic Min Typ Output HIGH Voltage VCC – 1150 Output LOW Voltage VCC – 1950 0°C to 85°C Max Min VCC – 1020 VCC – 800 VCC – 1200 VCC – 1620 VCC – 1250 VCC – 2000 Typ Max Unit VCC – 970 VCC – 750 mV VCC – 1680 VCC – 1300 mV Max Unit 1. Outputs are terminated through a 50 Ω resistor to VCC – 2 volts. Table 4. LVTTL / LVCMOS Input DC Characteristics (VCC = 3.135 V to 3.8 V) -40°C Symbol Characteristic Condition Min Typ 0°C to 85°C Max Min Typ IIN Input Current VIN = VCC ±150 ±150 µA VIK Input Clamp Voltage IIN = –18 mA –1.2 –1.2 V VIH Input HIGH Voltage VCC+0.3 V VIL Input LOW Voltage 0.8 V 2.0 VCC+0.3 0.8 2.0 MC100ES60T22 2 Advanced Clock Drivers Devices Freescale Semiconductor Table 5. AC Characteristics (VCC = 3.134 V to 3.8 V; VEE = 0 V) -40°C Symbol Characteristic fmax Maximum Toggle Frequency tPLH, tPHL Propagation Delay tSKEW Skew Min Max Min Typ 1 100 260 400 85°C Max Min Typ 1 100 280 400 100 280 Max Unit 1 GHz 450 ps part-to-part 300 300 350 ps RMS (1σ) 1 1 1 ps tJITTER Cycle-to-Cycle Jitter VoutPP Output Peak-to-Peak Voltage tr / tf Typ 25°C 350 Output Rise/Fall Times (20% – 80%) 750 50 350 400 750 50 Q 350 400 50 750 mV 400 ps D Driver Device Receiver Device Qb Db 50Ω 50Ω V TT Figure 2. Typical Termination for Output Driver and Device Evaluation MC100ES60T22 Advanced Clock Drivers Devices Freescale Semiconductor 3 PACKAGE DIMENSIONS D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B e X 45˚ θ A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A S DIM A A1 B C D E e H h L θ MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0˚ 7˚ SOIC-8 D SUFFIX 8-LEAD SOIC PACKAGE CASE 751-06 ISSUE T MC100ES60T22 4 Advanced Clock Drivers Devices Freescale Semiconductor PACKAGE DIMENSIONS 2X 3 0.20 C 3.00 1.95 1.5 A D 8 2 0.60 1 0.60 2.45 B 1.5 3 3.00 H 4.90 B 2X SEE VIEW C 0.20 C D VIEW A-A 0.65 0.325 B 8X 0.18 0.13 8 0.38 0.25 0.13 0.23 0.13 BASE METAL C A-B D M 0.48 MAX TOP VIEW DETAIL "B" A 0.38 0.25 0.33 0.25 0.25 C 8 SECTION B-B SEE NOTE 6 DAMBAR PROTRUSION DETAIL "B" 0.95 0.75 8X 0.10 C 1.10 MAX SEATING PLANE 0.15 0.05 C A SIDE VIEW 4X 15˚ 5˚ 0.07 MIN 0.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT DATUM H, MOLD FLASH OR PROTRUSIONS, SHALL NOT EXCEED 0.15mm PER SIDE. 4. DIMENSION IS THE LENGTH OF TERMINAL FOR SOLDERING TO A SUBSTRATE. 5. THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.14mm SEE DETAIL "B" AND SECTION B-B. 6. SECTION B-B TO BE DETERMINED AT 0.10 TO 0.25mm FROM THE LEAD TIP. 7. THIS PART IS COMPLIANT WITH JEDEC REGISTRATION MO-187 AA. 8. DATUMS A AND B TO BE DETERMINED DATUM PLANE H. GAUGE PLANE SEATING PLANE 6˚ 0˚ 0.70 0.40 4 4X 15˚ 5˚ C (0.95) VIEW C TSSOP-8 DT SUFFIX 8-LEAD TSSOP PACKAGE CASE 1640-01 ISSUE O MC100ES60T22 Advanced Clock Drivers Devices Freescale Semiconductor 5 NOTES MC100ES60T22 6 Advanced Clock Drivers Devices Freescale Semiconductor NOTES MC100ES60T22 Advanced Clock Drivers Devices Freescale Semiconductor 7 NOTES How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. 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