FREESCALE MSC8144

Freescale Semiconductor
Data Sheet: Product Preview
Document Number: MSC8144
Rev. 1, 5/2007
MSC8144
FC-PBGA–783
29 mm × 29 mm
Quad Core Digital Signal
Processor
• Four StarCore™ SC3400 DSP subsystems, each with an SC3400
DSP core, 16 Kbyte L1 instruction cache, 32 Kbyte L1 data cache,
memory management unit (MMU), extended programmable
interrupt controller (EPIC), two general-purpose 32-bit timers,
debug and profiling support, and low-power Wait and Stop
processing modes.
• Chip-level arbitration and system (CLASS) that provides full
fabric non-blocking arbitration between the processing elements
and other initiators and the M2 memory, DDR SRAM controller,
device configuration control and status registers, and other
targets.
• 128 Kbyte L2 shared instruction cache.
• 512 Kbyte M2 memory for critical data and temporary data
buffering.
• 10 Mbyte 128-b8t wide M3 memory.
• 96 Kbyte boot ROM.
• Three input clocks (shared, global, and differential).
• Four PLLs (system, core, global, and serial RapidIO).
• DDR controller with up to a 200 MHz clock (400 MHz data rate),
16/32 bit data bus, supporting up to 1 Gbyte in up to two banks
and support for DDR1 and DDR2.
• DMA controller with 16 bidirectional channels with up to 1024
buffer descriptors, and programmable priority, buffer, and
multiplexing configuration.
• Up to eight independent TDM modules with programmable word
size (2, 4, 8, or 16-bit), hardware-base A-law/μ-law conversion,
up to 128 Mbps data rate for all channels, with glueless interface
to E1 or T1 framers, and can interface with H-MVIP/H.110
devices, TSI, and codecs such as AC-97.
• QUICC Engine™ technology subsystem with dual RISC
processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction
RAM, supporting three communication controllers with one ATM
and two Gigabit Ethernet interfaces, to offload scheduling tasks
from the DSP cores.
•
•
•
•
•
•
•
•
•
•
•
•
– The two Ethernet controllers support 10/100/1000 Mbps
operations via MII/RMII/SMII/RGMII/SGMII and the SGMII
protocol using a 4-pin SerDes interface at 1000 Mbps data rate
only.
– The ATM controller supports UTOPIA level II 8/16 bits at
25/50 MHz in UTOPIA/POS mode with adaptation layer
support AAL0, AAL2, and AAL5.
PCI designed to comply with the PCI specification revision 2.2 at
33 MHz or 66 MHz with access to all PCI address spaces.
Serial RapidIO® 1x/4x endpoint corresponds to Specification 1.2
of the RapidIO trade association, and supports read, write,
messages, doorbells, and maintenance accesses in inbound mode,
and messages and doorbells in outbound mode.
I/O interrupt concentrator consolidates all chip maskable interrupt
and non-maskable interrupt sources and routes them to
INT_OUT, NMI_OUT, and the cores.
UART that permits full-duplex operation with a bit rate of up to
6.25 Mbps.
Serial peripheral interface (SPI).
Four timer modules, each with four configurable16-bit timers.
Four software watchdog timer (SWT) modules.
Up to 32 general-purpose input/output (GPIO) ports, 16 of which
can be configured as maskable interrupt inputs.
I2C interface that allows booting from EEPROM devices.
Eight programmable hardware semaphores.
Thirty two virtual maskable interrupts and one virtual NMI that
can be generated by a simple write access.
Optional booting via serial RapidIO port, PCI, I2C, SPI, or
Ethernet interfaces.
Note:
This document supports mask set M31H.
This document contains information on a product under development. Freescale reserves
the right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Table of Contents
1
2
3
4
5
6
7
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .4
1.1 FC-PBGA Ball Layout Diagrams . . . . . . . . . . . . . . . . . . .4
1.2 Signal List By Ball Location. . . . . . . . . . . . . . . . . . . . . . .6
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
2.2 Recommended Operating Conditions. . . . . . . . . . . . . .27
2.3 Default Output Driver Characteristics . . . . . . . . . . . . . .27
2.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .28
2.5 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .28
2.6 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .29
2.7 AC Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . .65
3.1 Start-up Sequencing Recommendations . . . . . . . . . . .65
3.2 Power Supply Design Considerations. . . . . . . . . . . . . .66
3.3 Connectivity Guidelines . . . . . . . . . . . . . . . . . . . . . . . .66
3.4 External DDR SDRAM Selection . . . . . . . . . . . . . . . . .75
3.5 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . .76
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
List of Figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
MSC8144 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 3
StarCore SC3400 DSP Core Subsystem Block Diagram 3
MSC8144 FC-PBGA Package, Top View . . . . . . . . . . . . 4
MSC8144 FC-PBGA Package, Bottom View . . . . . . . . . 5
SerDes Reference Clocks Input Stage . . . . . . . . . . . . . 31
Overshoot/Undershoot Voltage for VIH and VIL. . . . . . . 35
Start-Up Sequence with VDD Raised Before VDDIO with
CLKIN Started with VDDIO . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 8. Timing for a Reset Configuration Write . . . . . . . . . . . . . 39
Figure 9. Timing for tDDKHMH . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 10.DDR SDRAM Output Timing. . . . . . . . . . . . . . . . . . . . . 41
Figure 11.DDR AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 12.Differential VPP of Transmitter or Receiver . . . . . . . . . . 43
Figure 13.Transmitter Output Compliance Mask . . . . . . . . . . . . . .
Figure 14.Single Frequency Sinusoidal Jitter Limits . . . . . . . . . . .
Figure 15.Receiver Input Compliance Mask . . . . . . . . . . . . . . . . .
Figure 16.PCI AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 17.PCI Input AC Timing Measurement Conditions . . . . . . .
Figure 18.PCI Output AC Timing Measurement Condition . . . . . .
Figure 19.TDM Inputs Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 21.TDM Output Signals . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 22.UART Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 23.UART Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 24.Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 25.MII Management Interface Timing . . . . . . . . . . . . . . . . .
Figure 26.MII Transmit AC Timing . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 27.AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 28.MII Receive AC Timing . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 29.RMII Transmit and Receive AC Timing . . . . . . . . . . . . .
Figure 30.AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 31.SMII Mode Signal Timing. . . . . . . . . . . . . . . . . . . . . . . .
Figure 32.RGMII AC Timing and Multiplexing s. . . . . . . . . . . . . . .
Figure 33.UTOPIA AC Test Load. . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 34.UTOPIA AC Timing (External Clock) . . . . . . . . . . . . . . .
Figure 35.UTOPIA AC Timing (Internal Clock) . . . . . . . . . . . . . . .
Figure 36.SPI AC Test Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 37.SPI AC Timing in Slave Mode (External Clock). . . . . . .
Figure 38.SPI AC Timing in Master Mode (Internal Clock) . . . . . .
Figure 39.GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 40.EE Pin Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 41.Test Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 42.Boundary Scan (JTAG) Timing . . . . . . . . . . . . . . . . . . .
Figure 43.Test Access Port Timing . . . . . . . . . . . . . . . . . . . . . . . .
Figure 44.TRST Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 45.VDDM3, VDDM3IO and V25M3 Power-on Sequence . . . . .
Figure 47.MSC8144 Mechanical Information, 783-ball FC-PBGA
Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
46
48
49
51
51
51
52
53
53
53
54
55
55
56
56
57
57
58
59
60
60
60
61
61
62
62
63
63
64
64
64
65
77
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
2
Freescale Semiconductor
DDR Interface 16/32-bit at 400 MHz data rate
10 Mbytes
M3
Memory
512 Kbytes
M2
Memory
I/O-Interrupt
Concentrator
DDR
Controller
UART
128-bit at
400 MHz
Clocks
Timers
CLASS
Reset
QUICC Engine
Subsystem
RMU
Ethernet
Ethernet
Semaphores
Serial RapidIO
Subsystem
Dual RISC
Processors
ATM
SRIO
Virtual
Interrupts
PCI
128 Kbyte
L2
ICache
8 TDMs
DMA
Four DSP
Subsystems
Boot ROM
SPI
I2C
Other
Modules
JTAG
Eight TDMs
256-Channels each
PCI 32-bit
33/66 MHz
SPI
10/100/1000 Mbps
10/100/1000 Mbps
16-bit/8-bit
UTOPIA
Note: The arrow direction indicates master or slave.
1x/4x
Figure 1. MSC8144 Block Diagram
Two Internal Buses
(128 bits wide each)
Interrupts
IQBus
Timer
EPIC
Bus Interface
DQBus
TWB
Task
Protection
Debug Support
OCE30 DPU
Instruction
Cache
WriteThrough
Buffer
(WTB)
Data
Cache
WriteBack
Buffer
Address
Translation
(WBB)
MMU
P-bus
Xa-bus
Xb-bus
SC3400
Core
Figure 2. StarCore SC3400 DSP Core Subsystem Block Diagram
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
3
Pin Assignments and Reset States
1
Pin Assignments and Reset States
This section includes diagrams of the MSC8144 package ball grid array layouts and tables showing how the pinouts are
allocated for the package.
1.1
FC-PBGA Ball Layout Diagrams
Top and bottom views of the FC-PBGA package are shown in Figure 3 and Figure 4 with their ball location index numbers.
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
15
14
16
17
18
19
20
21
22
23
24
25
26
27
28
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
MSC8144
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
Figure 3. MSC8144 FC-PBGA Package, Top View
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
4
Freescale Semiconductor
Bottom View
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
MSC8144
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
8
9
10
11
12
13
15
14
16
17
18
19
20
21
22
23
24
25
26
27 28
Figure 4. MSC8144 FC-PBGA Package, Bottom View
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
5
1.2
Signal List By Ball Location
Table 1 presents the signal list sorted by ball number. The functionality of multi-functional (multiplexed) pins is separated for
each mode. When designing a board, make sure that the reference supply for each signal is appropriately considered. The
specified reference supply must be tied to the voltage level specified in this document if any of the related signal functions are
used (active).
Table 1. Signal List by Ball Number
Ball
Number
A2
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
GND
Ref.
Supply
GND
A3
GE2_RX_ER/PCI_AD31
A4
VDDGE2
Ethernet 2
PCI
Ethernet 2
VDDGE2
A5
GE2_RX_DV/PCI_AD30
Ethernet 2
PCI
Ethernet 2
VDDGE2
A6
GE2_TD0/PCI_CBE0
Ethernet 2
PCI
Ethernet 2
VDDGE2
A7
SRIO_IMP_CAL_RX
A8
Reserved1
—
A9
Reserved
1
—
A10
Reserved1
—
A11
Reserved1
A12
SRIO_RXD0
VDDGE2
VDDSXC
—
VDDSXC
A13
VDDSXC
VDDSXC
A14
SRIO_RXD1
VDDSXC
A15
VDDSXC
VDDSXC
A16
SRIO_REF_CLK
VDDSXC
A17
VDDRIOPLL
A18
GNDSXC
A19
SRIO_RXD2/
GE1_SGMII_RX
GNDRIOPLL
GNDSXC
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXC
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXC
A20
VDDSXC
A21
SRIO_RXD3/
GE2_SGMII_RX
A22
VDDSXC
A23
SRIO_IMP_CAL_TX
VDDSXP
A24
MDQ28
VDDDDR
A25
MDQ29
VDDDDR
A26
MDQ30
VDDDDR
A27
MDQ31
VDDDDR
A28
MDQS3
VDDDDR
B1
Reserved1
B2
GE2_TD1/PCI_CBE1
Ethernet 2
B3
GE2_TX_EN/PCI_CBE2
Ethernet 2
B4
GE_MDIO
B5
GND
B6
GE_MDC
B7
GNDSXC
B8
Reserved1
—
B9
1
—
Reserved
VDDSXC
VDDSXC
—
PCI
Ethernet 2
VDDGE2
PCI
Ethernet 2
VDDGE2
Ethernet
VDDGE2
Ethernet
VDDGE2
GND
GNDSXC
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
6
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
B10
Reserved1
B11
Reserved1
B12
SRIO_RXD0
VDDSXC
B13
GNDSXC
GNDSXC
B14
SRIO_RXD1
VDDSXC
B15
GNDSXC
GNDSXC
B16
SRIO_REF_CLK
VDDSXC
B17
Reserved1
B18
VDDSXC
B19
SRIO_RXD2/
GE1_SGMII_RX
—
—
—
VDDSXC
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXC
B20
GNDSXC
B21
SRIO_RXD3/
GE2_SGMII_RX
GNDSXC
B22
GNDSXC
GNDSXC
B23
GNDSXP
GNDSXP
B24
MDQ27
VDDDDR
B25
VDDDDR
VDDDDR
B26
GND
B27
VDDDDR
VDDDDR
B28
MDQS3
VDDDDR
C1
Reserved1
C2
GE2_RX_CLK/PCI_AD29
C3
VDDGE2
C4
TDM7RSYN/GE2_TD2/
PCI_AD2/UTP_TER
TDM
PCI
Ethernet 2
UTOPIA
VDDGE2
C5
TDM7RCLK/GE2_RD2/
PCI_AD0/UTP_RVL
TDM
PCI
Ethernet 2
UTOPIA
VDDGE2
C6
VDDGE2
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXC
GND
—
Ethernet 2
PCI
Ethernet 2
VDDGE2
VDDGE2
VDDGE2
C7
GE2_RD0/PCI_AD27
C8
Reserved1
Ethernet 2
PCI
Ethernet 2
VDDGE2
—
C9
Reserved
1
—
C10
Reserved1
—
C11
Reserved1
C12
VDDSXP
VDDSXP
C13
SRIO_TXD0
VDDSXP
C14
VDDSXP
VDDSXP
—
C15
SRIO_TXD1
VDDSXP
C16
GNDSXC
GNDSXC
C17
GNDRIOPLL
GNDRIOPLL
C18
Reserved1
—
C19
VDDSXP
C20
SRIO_TXD2/GE1_SGMII_T
X
VDDSXP
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXP
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
7
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
C21
VDDSXP
VDDSXP
C22
SRIO_TXD3/GE2_SGMII_T
X
C23
VDDSXP
VDDSXP
C24
MDQ26
VDDDDR
C25
MDQ25
VDDDDR
C26
MDM3
VDDDDR
C27
GND
C28
MDQ24
D1
Reserved1
D2
GE2_RD1/PCI_AD28
D3
GND
D4
TDM7TDAT/GE2_TD3/
PCI_AD3/UTP_TMD
TDM
PCI
Ethernet 2
UTOPIA
VDDGE2
D5
TDM7RDAT/GE2_RD3/
PCI_AD1/UTP_STA
TDM
PCI
Ethernet 2
UTOPIA
VDDGE2
D6
GE1_RD0/UTP_RD2/
PCI_CBE2
Ethernet 1 UTOPIA
VDDGE1
D7
TDM7TCLK/GE2_TCK/
PCI_IDS/UTP_RER
D8
Reserved1
—
D9
Reserved
1
—
D10
Reserved1
—
D11
Reserved1
D12
GNDSXP
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXP
GND
VDDDDR
—
Ethernet 2
PCI
Ethernet 2
VDDGE2
GND
UTOPIA
TDM
Ethernet 1
PCI
PCI
UTOPIA
Ethernet 2
UTOPIA
VDDGE2
—
GNDSXP
D13
SRIO_TXD0
VDDSXP
D14
GNDSXP
GNDSXP
D15
SRIO_TXD1
VDDSXP
D16
VDDSXC
VDDSXC
D17
Reserved1
—
D18
Reserved1
—
D19
GNDSXP
D20
SRIO_TXD2/GE1_SGMII_T
X
D21
GNDSXP
D22
SRIO_TXD3/GE2_SGMII_T
X
D23
GNDSXP
GNDSXP
D24
MDQ23
VDDDDR
D25
VDDDDR
VDDDDR
D26
MDQ22
VDDDDR
D27
MDQ21
VDDDDR
D28
MDQS2
VDDDDR
E1
GNDSXP
SGMII support on SERDES is enabled by Reset Configuration Word
VDDSXP
GNDSXP
SGMII support on SERDES is enabled by Reset Configuration Word
Reserved1
VDDSXP
—
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
8
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
E2
GE1_RX_CLK/UTP_RD6/
PCI_PAR
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
E3
GE1_RD2/UTP_RD4/
PCI_FRAME
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
E4
GE1_RD1/UTP_RD3/
PCI_CBE3
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
E5
GE1_RD3/UTP_RD5/
PCI_IRDY
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
E6
VDDGE1
E7
GE1_TX_EN/UTP_TD6/
PCI_CBE0
E8
Reserved1
—
E9
Reserved1
—
E10
GND
GND
E11
VDD
VDD
E12
GND
GND
E13
VDD
VDD
E14
GND
GND
E15
VDD
VDD
E16
GND
GND
E17
VDD
VDD
E18
GND
GND
E19
VDD
VDD
E20
GND
GND
E21
VDD
VDD
E22
GND
E23
VDDDDR
VDDDDR
E24
MDQ20
VDDDDR
E25
GND
E26
VDDDDR
E27
GND
E28
VDDGE1
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
GND
GND
VDDDDR
GND
MDQS2
VDDDDR
F1
Reserved1
F2
GE1_TX_CLK/UTP_RD0/
PCI_AD31
—
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
F3
VDDGE1
F4
GE1_TD3/UTP_TD5/
PCI_AD30
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
F5
GE1_TD1/UTP_TD3/
PCI_AD28
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
F6
GND
F7
GE1_TD0/UTP_TD2/
PCI_AD27
F8
VDDGE1
F9
GND
VDDGE1
GND
UTOPIA
Ethernet 1
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDGE1
VDDGE1
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
9
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
F10
VDD
VDD
F11
GND
GND
F12
VDD
VDD
F13
GND
GND
F14
VDD
VDD
F15
GND
GND
F16
VDD
VDD
F17
GND
GND
F18
VDD
VDD
F19
GND
GND
F20
VDD
VDD
1
F21
Reserved
F22
VDDDDR
—
F23
GND
F24
MDQ19
VDDDDR
F25
MDQ18
VDDDDR
F26
MDM2
VDDDDR
F27
MDQ17
VDDDDR
F28
MDQ16
VDDDDR
G1
Reserved1
—
G2
SRESET4
VDDIO
G3
GND
GND
G4
PORESET4
VDDIO
VDDDDR
GND
G5
GE1_COL/UTP_RD1
UTOPIA
Ethernet 1
G6
GE1_TD2/UTP_TD4/
PCI_AD29
UTOPIA
Ethernet 1
G7
GE1_RX_DV/UTP_RD7
UTOPIA
Ethernet 1
G8
GE1_TX_ER/UTP_TD7/
PCI_CBE1
UTOPIA
Ethernet 1
UTOPIA
PCI
UTOPIA
UTOPIA
PCI
UTOPIA
Ethernet 1 UTOPIA
VDDIO
Ethernet 1 UTOPIA
VDDGE1
Ethernet 1 UTOPIA
VDDGE1
Ethernet 1 UTOPIA
VDDGE1
G9
VDD
VDD
G10
GND
GND
G11
VDD
VDD
G12
GND
GND
G13
VDD
VDD
G14
GND
GND
G15
VDD
VDD
G16
GND
GND
G17
VDD
VDD
G18
GND
GND
G19
VDD
VDD
G20
GND
GND
G21
Reserved1
G22
GND
—
—
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
10
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
G23
MBA1
VDDDDR
G24
MA3
VDDDDR
G25
MA8
VDDDDR
G26
VDDDDR
VDDDDR
G27
GND
GND
G28
MCK0
VDDDDR
H1
Reserved1
—
H2
CLKIN
VDDIO
H3
HRESET
VDDIO
H4
PCI_CLK_IN
VDDIO
H5
NMI
VDDIO
H6
URXD/GPIO14/IRQ8/
RC_LDF3, 6
H7
GE1_RX_ER/PCI_AD6/
GPIO25/IRQ153, 6
H8
GE1_CRS/PCI_AD5
RC_LDF
UART/GPIO/IRQ
GPIO/
IRQ
Ethernet
1
PCI
Ethernet
1
PCI
VDDIO
GPIO/
IRQ
PCI
Ethernet 1
VDDIO
Ethernet 1
VDDIO
H9
GND
GND
H10
VDD
VDD
H11
GND
GND
H12
VDD
VDD
H13
GND
GND
H14
VDD
VDD
H15
VDD
VDD
H16
VDD
VDD
H17
GND
GND
H18
VDD
VDD
H19
GND
GND
H20
VDD
VDD
H21
VDD
H22
VDDDDR
VDDDDR
H23
MBA0
VDDDDR
H24
MA15
VDDDDR
H25
VDDDDR
VDDDDR
H26
MA9
VDDDDR
H27
MA7
VDDDDR
H28
MCK0
J1
Reserved
J2
GND
VDD
VDDDDR
1
—
GND
J3
VDDIO
VDDIO
J4
STOP_BS
VDDIO
J5
NMI_OUT4
VDDIO
J6
INT_OUT4
J7
VDDIO
3, 4, 6
SDA/GPIO27
I2C/GPIO
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
11
Table 1. Signal List by Ball Number (continued)
Ball
Number
Signal Name
J8
VDDIO
PowerOn
Reset
Value
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
VDDIO
J9
VDD
VDD
J10
GND
GND
J11
VDD
VDD
J12
GND
GND
J13
VDD
VDD
J14
GND
GND
J15
GND
GND
J16
GND
GND
J17
VDD
VDD
J18
GND
GND
J19
VDD
VDD
J20
GND
GND
J21
GND
GND
J22
GND
GND
J23
GND
J24
VDDDDR
J25
GND
J26
VDDDDR
J27
GND
J28
VDDDDR
K1
Reserved1
—
K2
Reserved1
—
K3
Reserved
1
—
K4
Reserved1
—
VDDPLL2A
GND
VDDDDR
GND
VDDDDR
GND
VDDDDR
K5
VDDPLL2A
K6
GND
K7
VDDPLL0A
VDDPLL0A
K8
VDDPLL1A
VDDPLL1A
GND
K9
VDD
VDD
K10
GND
GND
K11
VDD
VDD
K12
GND
GND
K13
VDD
VDD
K14
VDD
VDD
K15
VDD
VDD
K16
VDD
VDD
K17
VDD
VDD
K18
GND
GND
K19
VDD
VDD
K20
GND
GND
K21
VDD
K22
VDDDDR
VDD
VDDDDR
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
12
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
K23
MBA2
VDDDDR
K24
MA10
VDDDDR
K25
MA12
VDDDDR
K26
MA14
VDDDDR
K27
MA4
VDDDDR
MVREF
VDDDDR
K28
L1
Reserved1
—
L2
CLKOUT
L3
TMR1/UTP_IR/PCI_CBE3/
GPIO173, 6
VDDIO
L4
TMR4/PCI_PAR/GPIO203,
6/ UTP_REOP
L5
GND
L6
TMR2/PCI_FRAME/
GPIO183, 6
L7
SCL/GPIO263, 4, 6
L8
UTXD/GPIO15/IRQ93, 6
UTOPIA
TMR/
GPIO
TIMER/GPIO
UTOPIA
PCI
UTOPIA
VDDIO
PCI
TIMER/GPIO
VDDIO
GND
TIMER/GPIO
PCI
TIMER/GPIO
UTOPIA
VDDIO
I2C/GPIO
VDDIO
UART/GPIO/IRQ
VDDIO
L9
GND
GND
L10
VDD
VDD
L11
GND
GND
L12
VDD
VDD
L13
GND
GND
L14
VDD
VDD
1
L15
Reserved
L16
VDD
VDD
L17
GND
GND
L18
VDD
VDD
L19
GND
GND
L20
VDD
VDD
L21
GND
GND
L22
GND
GND
L23
MCKE1
VDDDDR
L24
MA1
VDDDDR
L25
VDDDDR
VDDDDR
L26
GND
L27
VDDDDR
L28
MCK1
GND
GND
VDDDDR
VDDDDR
1
M1
Reserved
M2
TRST
VDDIO
—
M3
EE0
VDDIO
M4
EE1
VDDIO
M5
UTP_RCLK/PCI_AD13
UTOPIA
PCI
UTOPIA
VDDIO
M6
UTP_RADDR0/PCI_AD7
UTOPIA
PCI
UTOPIA
VDDIO
M7
UTP_TD8/PCI_AD30
UTOPIA
PCI
UTOPIA
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
13
Table 1. Signal List by Ball Number (continued)
Ball
Number
M8
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
VDDIO
Ref.
Supply
VDDIO
M9
VDD
VDD
M10
GND
GND
M11
VDD
VDD
M12
GND
GND
M13
VDD
VDD
M14
GND
GND
M15
VDD
VDD
M16
GND
GND
M17
VDD
VDD
M18
GND
GND
M19
VDD
VDD
M20
GND
GND
M21
VDD
M22
VDDDDR
M23
MCS1
VDDDDR
M24
MA13
VDDDDR
M25
MA2
VDDDDR
M26
MA0
VDDDDR
M27
GND
GND
M28
MCK1
VDDDDR
VDD
VDDDDR
N1
Reserved1
N2
VDDIO
N3
TMS
N4
UTP_RD10/PCI_AD145
N5
VDDIO
N6
—
VDDIO
VDDIO
UTOPIA
PCI
UTP_RADDR1/PCI_AD8
UTOPIA
PCI
N7
UTP_TD9/PCI_AD31
UTOPIA
PCI
N8
TMR3/PCI_IRDY/GPIO193,
6
/ UTP_TEOP
N9
GND
N10
VDDM3
N11
VDD
N12
VDDM3
N13
VDD
N14
VDDM3
N15
VDD
N16
VDDM3
N17
VDD
N18
VDDM3
N19
VDD
N20
VDDM3
N21
GND
UTOPIA
VDDIO
Power
TIMER/GPIO
VDDIO
UTOPIA
VDDIO
UTOPIA
PCI
VDDIO
TIMER/GPIO
UTOPIA
VDDIO
GND
VDDM3
VDD
VDDM3
VDD
VDDM3
VDD
VDDM3
VDD
VDDM3
VDD
VDDM3
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
14
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
N22
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
GND
7 (111)
Ref.
Supply
GND
N23
MODT1
VDDDDR
N24
MCKE0
VDDDDR
N25
VDDDDR
VDDDDR
N26
MA5
VDDDDR
N27
MA6
VDDDDR
N28
MA11
VDDDDR
P1
Reserved1
P2
TDI5
—
VDDIO
P3
UTP_RD11/PCI_AD15
P4
GND
UTOPIA
PCI
UTOPIA
VDDIO
P5
UTP_RADDR3/PCI_AD10
UTOPIA
PCI
UTOPIA
VDDIO
P6
UTP_RADDR2/PCI_AD9
UTOPIA
PCI
UTOPIA
VDDIO
P7
PCI_GNT/GPIO29/IRQ73. 6
GPIO/IRQ
PCI
GPIO/IRQ
VDDIO
P8
PCI_STOP/GPIO30/IRQ23,
GPIO/IRQ
PCI
GPIO/IRQ
VDDIO
GND
6
P9
GND
GND
P10
GND
P11
VDDM3
P12
GND
P13
VDDM3
P14
GND
P15
VDDM3
P16
GND
P17
VDDM3
P18
GND
P19
VDDM3
P20
GND
GND
P21
GND
GND
P22
VDDDDR
VDDDDR
P23
MCS0
VDDDDR
P24
MRAS
VDDDDR
P25
GND
P26
VDDDDR
P27
GND
GND
P28
MCK2
VDDDDR
R1
Reserved1
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDDDR
—
R2
TCK
VDDIO
R3
TDO
VDDIO
R4
UTP_RD12/PCI_AD16
UTOPIA
PCI
UTOPIA
VDDIO
R5
UTP_RCLAV_PDRPA/
PCI_AD12
UTOPIA
PCI
UTOPIA
VDDIO
R6
UTP_RADDR4/PCI_AD11
UTOPIA
PCI
UTOPIA
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
15
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
R7
VDDIO
R8
PCI_REQ
R9
GND
GND
R10
GND
GND
R11
GND
GND
R12
GND
GND
R13
GND
GND
R14
GND
GND
R15
GND
GND
R16
GND
GND
R17
GND
GND
R18
GND
GND
R19
GND
GND
R20
GND
GND
R21
GND
GND
R22
GND
R23
MODT0
VDDDDR
R24
MDIC1
VDDDDR
R25
MDIC0
VDDDDR
R26
MCAS
VDDDDR
R27
MWE
VDDDDR
MCK2
VDDDDR
R28
T1
VDDIO
PCI
VDDIO
GND
Reserved1
—
T2
UTP_RPRTY/PCI_AD21
UTOPIA
PCI
UTOPIA
VDDIO
T3
UTP_RD13/PCI_AD17
UTOPIA
PCI
UTOPIA
VDDIO
UTOPIA
VDDIO
UTOPIA
VDDIO
T4
VDDIO
T5
UTP_RD14/PCI_AD18
UTOPIA
PCI
VDDIO
T6
UTP_RD15/PCI_AD19
UTOPIA
PCI
T7
PCI_TRDY
T8
PCI_DEVSEL/GPIO31/
IRQ33, 6
PCI
GPIO/IRQ
PCI
VDDIO
GPIO/IRQ
VDDIO
T9
GND
GND
T10
GND
GND
T11
GND
GND
T12
GND
GND
T13
GND
GND
T14
GND
GND
T15
GND
GND
T16
GND
GND
T17
GND
GND
T18
GND
GND
T19
GND
GND
T20
GND
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
16
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
T21
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
GND
T22
VDDDDR
T23
GND
T24
VDDDDR
T25
GND
T26
VDDDDR
T27
GND
7 (111)
Ref.
Supply
GND
VDDDDR
GND
VDDDDR
GND
VDDDDR
GND
VDDDDR
T28
VDDDDR
U1
Reserved1
U2
UTP_TCLK/PCI_AD29
UTOPIA
PCI
UTOPIA
VDDIO
U3
UTP_TADDR4/PCI_AD27
UTOPIA
PCI
UTOPIA
VDDIO
U4
UTP_TADDR2
U5
GND
—
UTOPIA
VDDIO
GND
UTOPIA
PCI
UTOPIA
VDDIO
U6
UTP_REN/PCI_AD20
U7
PCI_AD26
PCI
VDDIO
U8
PCI_AD25
PCI
VDDIO
U9
Reserved1
VDDIO
U10
VDDM3
VDDM3
U11
GND
U12
VDDM3
U13
GND
U14
VDDM3
U15
GND
U16
VDDM3
U17
GND
U18
VDDM3
U19
GND
U20
VDDM3
U21
GND
U22
GND
U23
MDQ7
VDDDDR
U24
MDQ3
VDDDDR
U25
MDQ4
VDDDDR
U26
MDQ5
VDDDDR
U27
MDQ1
VDDDDR
MDQ0
VDDDDR
U28
V1
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
GND
Reserved1
—
V2
UTP_TD10/PCI_CBE0
V3
UTP_TADDR3
V4
UTP_TD1/PCI_PERR
UTOPIA
V5
UTP_TADDR0/PCI_AD23
UTOPIA
UTOPIA
PCI
UTOPIA
UTOPIA
PCI
PCI
VDDIO
VDDIO
UTOPIA
UTOPIA
VDDIO
VDDIO
V6
UTP_TADDR1/PCI_AD24
UTOPIA
PCI
UTOPIA
VDDIO
V7
UTP_TCLAV/PCI_AD28
UTOPIA
PCI
UTOPIA
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
17
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
V8
VDDIO
VDDIO
V9
Reserved1
VDDIO
V10
GND
GND
V11
VDDM3
V12
GND
V13
VDDM3
V14
GND
V15
VDDM3
V16
GND
V17
VDDM3
V18
GND
V19
VDDM3
V20
GND
V21
GND
V22
VDDDDR
VDDDDR
V23
MDQ2
VDDDDR
V24
VDDDDR
VDDDDR
V25
MDQ6
VDDDDR
V26
GND
V27
VDDDDR
VDDDDR
V28
MDQS0
VDDDDR
W1
Reserved1
W2
UTP_TD12/PCI_CBE2
UTOPIA
PCI
UTOPIA
W3
UTP_TD11/PCI_CBE1
UTOPIA
PCI
UTOPIA
W4
VDDIO
W5
GND
W6
UTP_TD15/PCI_IRDY
UTOPIA
W7
UTP_TD0/PCI_SERR
UTOPIA
W8
UTP_RSOC/PCI_AD22
UTOPIA
W9
Reserved1
VDDIO
W10
VDDM3
VDDM3
W11
GND
GND
W12
V25M3
V25M3
W13
GND
W14
VDDM3
W15
V25M3
V25M3
W16
VDDM3
VDDM3
W17
GND
GND
W18
V25M3
V25M3
W19
GND
W20
VDDM3
W21
GND
GND
W22
GND
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
GND
GND
—
VDDIO
VDDIO
VDDIO
GND
PCI
UTOPIA
PCI
PCI
VDDIO
UTOPIA
UTOPIA
VDDIO
VDDIO
GND
VDDM3
GND
VDDM3
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
18
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
W23
MDQ10
W24
GND
W25
MDQ11
VDDDDR
W26
MDM0
VDDDDR
W27
GND
W28
Y1
VDDDDR
GND
GND
MDQS0
VDDDDR
Reserved1
UTOPIA
PCI
UTOPIA
VDDIO
Y2
UTP_TD14/PCI_FRAME
Y3
TDM5TSYN/PCI_AD18/
GPIO123, 6
TDM/GPIO
PCI
TDM/GPIO
VDDIO
Y4
TDM5TCLK/PCI_AD16
TDM
PCI
TDM
VDDIO
Y5
TDM4RCLK/PCI_AD7
TDM
PCI
TDM
VDDIO
Y6
TDM4TSYN/PCI_AD12
TDM
PCI
TDM
VDDIO
Y7
UTP_TPRTY/RC14
Y8
UTP_TEN/PCI_PAR
RC14
UTOPIA
Y9
Reserved1
VDDIO
Y10
GND
GND
Y11
VDDM3
Y12
GND
Y13
VDDM3
Y14
GND
Y15
VDDM3
Y16
GND
Y17
VDDM3
Y18
GND
Y19
VDDM3
Y20
GND
Y21
GND
Y22
VDDDDR
VDDDDR
Y23
MDQ13
VDDDDR
Y24
VDDDDR
VDDDDR
Y25
GND
Y26
MDQ9
Y27
VDDDDR
VDDDDR
Y28
MDQ8
VDDDDR
AA1
Reserved1
AA2
UTP_TD13/PCI_CBE3
AA3
TDM5RSYN/PCI_AD15/
GPIO103, 6
TDM/GPIO
PCI
TDM/GPIO
VDDIO
AA4
TDM5TD3, AT/PCI_AD17/
GPIO116
TDM/GPIO
PCI
TDM/GPIO
VDDIO
AA5
TDM5RCLK/PCI_AD13/
GPIO283, 6
TDM/GPIO
PCI
TDM/GPIO
VDDIO
AA6
GND
UTOPIA
PCI
VDDIO
UTOPIA
VDDIO
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
GND
GND
VDDDDR
—
UTOPIA
PCI
UTOPIA
VDDIO
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
19
Table 1. Signal List by Ball Number (continued)
Ball
Number
AA7
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
TDM4TCLK/PCI_AD10
TDM
PCI
TDM
VDDIO
AA8
TDM4TDAT/PCI_AD11
TDM
PCI
TDM
VDDIO
AA9
VDDIO
VDDIO
AA10
VDDM3
VDDM3
AA11
GND
AA12
VDDM3
AA13
GND
AA14
VDDM3
AA15
GND
AA16
VDDM3
AA17
GND
AA18
VDDM3
AA19
GND
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
AA20
VDDM3
AA21
GND
AA22
GND
AA23
MDQ15
VDDDDR
AA24
MDQ14
VDDDDR
AA25
MDM1
VDDDDR
AA26
MDQ12
VDDDDR
AA27
MDQS1
VDDDDR
AA28
MDQS1
VDDDDR
AB1
Reserved1
GND
GND
-
AB2
UTP_TSOC/RC15
AB3
VDDIO
RC15
UTOPIA
VDDIO
AB4
TDM6RDAT/PCI_AD20/
GPIO5/IRQ113, 6
TDM/GPIO/ IRQ
PCI
TDM/GPIO/ IRQ
VDDIO
AB5
TDM5RDAT/PCI_AD14/
GPIO93, 6
TDM/GPIO
PCI
TDM/GPIO
VDDIO
AB6
TDM6TSYN/PCI_AD24/
GPIO8/ IRQ143, 6
TDM/GPIO/IRQ
PCI
TDM/GPIO/IRQ
VDDIO
AB7
TDM6RCLK/PCI_AD19/
GPIO4/IRQ103, 6
TDM/GPIO/IRQ
PCI
TDM/GPIO/IRQ
VDDIO
AB8
TDM4RSYN/PCI_AD9
TDM
PCI
TDM
VDDIO
AB9
TDM4RDAT/PCI_AD8
TDM
PCI
TDM
VDDIO
AB10
GND
AB11
VDDM3
AB12
GND
AB13
VDDM3
AB14
GND
AB15
VDDM3
AB16
GND
AB17
VDDM3
AB18
GND
VDDIO
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
20
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
AB19
VDDM3
VDDM3
AB20
GND
GND
AB21
GND
GND
AB22
VDDDDR
VDDDDR
AB23
MECC7
VDDDDR
AB24
MECC1
VDDDDR
AB25
MECC4
VDDDDR
AB26
MECC5
VDDDDR
AB27
MECC2
VDDDDR
AB28
ECC_MDQS
VDDDDR
AC1
Reserved1
—
AC2
UTP_RD9/RC13
RC13
UTOPIA
VDDIO
AC3
UTP_RD8/RC12
RC12
UTOPIA
VDDIO
AC4
TDM6TCLK/PCI_AD22
TDM
PCI
TDM
VDDIO
AC5
TDM6RSYN/PCI_AD21/
GPIO6/ IRQ123, 6
TDM/GPIO/IRQ
PCI
TDM/GPIO/IRQ
VDDIO
AC6
VDDIO
AC7
TDM3TSYN/RC11
AC8
PCI_AD23/GPIO7/IRQ13/
TDM6TDAT3, 6/UTP_RMOD
TDM/GPIO/IRQ
AC9
TDM7TSYN/ PCI_AD4
TDM
AC10
VDDM3IO
AC11
GND
AC12
VDDM3
AC13
GND
AC14
VDDM3
AC15
GND
AC16
VDDM3
AC17
GND
AC18
VDDM3
AC19
GND
VDDIO
RC11
TDM
PCI
VDDIO
TDM/GPIO/IRQ
PCI
reserved
UTOPIA
VDDIO
VDDIO
VDDM3IO
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
VDDM3
GND
AC20
VDDM3IO
AC21
Reserved1
VDDM3IO
—
AC22
MECC6
VDDDDR
AC23
MECC3
VDDDDR
AC24
ECC_MDM
VDDDDR
AC25
VDDDDR
VDDDDR
AC26
MECC0
VDDDDR
AC27
VDDDDR
VDDDDR
AC28
ECC_MDQS
VDDDDR
AD1
Reserved1
3, 6
AD2
GPIO1
AD3
TMR0/GPIO13
—
GPIO
VDDIO
TIMER/GPIO
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
21
Table 1. Signal List by Ball Number (continued)
Ball
Number
Signal Name
AD4
GPIO23, 6
AD5
GND
AD6
TDM1TCLK
PowerOn
Reset
Value
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
GPIO
6 (110)
7 (111)
Ref.
Supply
VDDIO
GND
TDM
VDDIO
AD7
TDM3TDAT/RC10
RC10
TDM
VDDIO
AD8
TDM3RSYN/RC9
RC9
TDM
VDDIO
RC8
TDM
VDDIO
AD9
TDM3RDAT/RC8
AD10
GND
GND
AD11
V25M3
V25M3
AD12
GND
GND
AD13
VDDM3
AD14
GND
GND
AD15
V25M3
V25M3
AD16
GND
GND
AD17
VDDM3
AD18
GND
GND
AD19
V25M3
V25M3
AD20
GND
AD21
Reserved
AD22
VDDDDR
AD23
GND
AD24
VDDDDR
AD25
GND
AD26
VDDDDR
AD27
GND
AD28
VDDDDR
VDDM3
VDDM3
GND
1
—
VDDDDR
GND
VDDDDR
GND
VDDDDR
GND
VDDDDR
AE1
Reserved1
AE2
GPIO03, 6
GPIO
VDDIO
AE3
GPIO33, 6
GPIO
VDDIO
AE4
TDM1RCLK
TDM
VDDIO
—
AE5
TDM1TSYN/RC3
RC3
TDM
VDDIO
AE6
TDM1TDAT/RC2
RC2
TDM
VDDIO
AE7
TDM1RSYN/RC1
RC1
TDM
VDDIO
AE8
TDM3RCLK/RC16
RC16
TDM
VDDIO
TDM
VDDIO
RC6
TDM
VDDIO
GPIO/IRQ/SPI_SCK
VDDIO
AE9
TDM3TCLK
AE10
TDM2TDAT/RC6
AE11
GPIO21/IRQ13. 6
AE12
GND
GND
1
AE13
Reserved
AE14
GND
AE15
Reserved1
—
AE16
Reserved1
—
AE17
Reserved1
AE18
GND
—
GND
—
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
22
Freescale Semiconductor
Table 1. Signal List by Ball Number (continued)
Ball
Number
AE19
PowerOn
Reset
Value
Signal Name
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
GND
6 (110)
7 (111)
Ref.
Supply
GND
VDDM3IO
AE20
VDDM3IO
AE21
Reserved1
AE22
GND
GND
AE23
GND
GND
AE24
GND
AE25
VDDDDR
AE26
GND
AE27
VDDDDR
AE28
GND
AF1
—
GND
VDDDDR
GND
VDDDDR
GND
Reserved1
—
AF2
VDDIO
VDDIO
AF3
GND
GND
AF4
TDM0RDAT/
RCFG_CLKIN_RNG
RCFG_
CLKIN_
RNG
TDM
VDDIO
AF5
TDM0TSYN/RCW_SRC2
RCW_
SRC2
TDM
VDDIO
AF6
TDM1RDAT/RC0
RC0
TDM
VDDIO
AF7
VDDIO
VDDIO
AF8
GND
GND
AF9
TDM2RDAT/RC4
AF10
TDM2TCLK
AF11
GPIO22/IRQ4
AF12
GND
AF13
GND
AF14
VDDM3IO
AF15
GND
AF16
GND
3, 6
RC4
TDM
VDDIO
TDM
VDDIO
GPIO/IRQ/SPI_MOSI
VDDIO
GND
GND
VDDM3IO
GND
GND
1
AF17
Reserved
AF18
VDDM3IO
AF19
GND
AF20
Reserved1
AF21
Reserved
1
AF22
M3_RESET
AF23
GND
AF24
VDDDDR
AF25
GND
AF26
VDDDDR
AF27
GND
AF28
VDDDDR
AG1
Reserved1
AG2
GPIO16/IRQ03, 6
AG3
TDM0TCLK
—
VDDM3IO
GND
—
—
VDDM3IO
GND
VDDDDR
GND
VDDDDR
GND
VDDDDR
—
GPIO/IRQ
VDDIO
TDM
VDDIO
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
23
Table 1. Signal List by Ball Number (continued)
Ball
Number
PowerOn
Reset
Value
Signal Name
AG4
TDM0RSYN/RCW_SRC0
AG5
TDM0RCLK
AG6
TDM0TDAT/RCW_SRC1
AG7
TDM2TSYN/RC7
AG8
TDM2RCLK
RCW_
SRC0
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
TDM
VDDIO
TDM
VDDIO
RCW_
SRC1
TDM
VDDIO
RC7
TDM
VDDIO
TDM
VDDIO
AG9
TDM2RSYN/RC5
TDM
VDDIO
AG10
GPIO24/IRQ63, 6
RC5
GPIO/IRQ/SPI_SL
VDDIO
AG11
GPIO23/IRQ53, 6
GPIO/IRQ/SPI_MISO
VDDIO
AG12
Reserved1
AG13
GND
GND
AG14
GND
GND
AG15
GND
GND
AG16
GND
—
GND
AG17
Reserved
1
—
AG18
Reserved1
—
AG19
GND
GND
AG20
GND
GND
AG21
VDDM3IO
AG22
GND
GND
AG23
GND
GND
AG24
GND
GND
AG25
VDDDDR
AG26
GND
AG27
VDDDDR
AG28
GND
VDDM3IO
VDDDDR
GND
VDDDDR
GND
AH1
Reserved
1
—
AH2
Reserved1
—
AH3
Reserved1
—
AH4
Reserved1
—
AH5
Reserved
1
—
AH6
Reserved1
—
AH7
Reserved
1
—
AH8
Reserved1
—
AH9
Reserved
1
—
AH10
Reserved1
—
AH11
Reserved
1
—
AH12
Reserved1
—
AH13
Reserved1
—
AH14
Reserved1
—
AH15
Reserved
1
—
AH16
Reserved1
—
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
24
Freescale Semiconductor
Electrical Characteristics
Table 1. Signal List by Ball Number (continued)
Ball
Number
Signal Name
PowerOn
Reset
Value
I/O Multiplexing Mode2
0 (000)
1 (001)
2 (010)
3 (011)
4 (100)
5 (101)
6 (110)
7 (111)
Ref.
Supply
AH17
Reserved1
—
AH18
Reserved1
—
AH19
Reserved1
—
AH20
Reserved
1
—
AH21
Reserved1
—
AH22
Reserved
1
—
AH23
Reserved1
—
AH24
Reserved1
—
AH25
Reserved1
—
AH26
Reserved
1
—
AH27
Reserved1
—
AH28
1
—
Notes:
Reserved
1.
2.
3.
4.
5.
6.
2
Reserved signals should be disconnected for compatibility with future revisions of the device.
For signals with same functionality in all modes the appropriate cells are empty.
The choice between GPIO function and other function is by GPIO registers setup. For configuration details, see Chapter 23,
GPIO in the MSC8144 Reference Manual.
Open-drain signal.
Internal 20 KΩ pull-up resistor.
For signals with GPIO functionality, the open-drain and internal 20 KΩ pull-up resistor can be configured by GPIO register
programming. See Chapter 23, GPIO of the MSC8144 Reference Manual for configuration details.
Electrical Characteristics
This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing
specifications. For additional information, see the MSC8144 Reference Manual.
2.1
Maximum Ratings
CAUTION
This device contains circuitry protecting against damage
due to high static voltage or electrical fields; however,
normal precautions should be taken to avoid exceeding
maximum voltage ratings. Reliability is enhanced if unused
inputs are tied to an appropriate logic voltage level (for
example, either GND or VDD).
In calculating timing requirements, adding a maximum value of one specification to a minimum value of another specification
does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values
in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction.
Therefore, a “maximum” value for a specification never occurs in the same device with a “minimum” value for another
specification; adding a maximum to a minimum represents a condition that can never exist.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
25
Electrical Characteristics
Table 2 describes the maximum electrical ratings for the MSC8144.
Table 2. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Core supply voltage
Vdd
–0.3 to 1.1
V
PLL supply voltage
VDDPLL0
VDDPLL1
VDDPLL2
–0.3 to 1.1
V
M3 memory Internal voltage
VDDM3
–0.3 to 1.32
V
DDR memory supply voltage
• DDR mode
• DDR2 mode
VDDDDR
–0.3 to 2.75
–0.3 to 1.98
V
V
DDR reference voltage
MVREF
–0.3 to 0.51 × VDDDDR
V
Input DDR voltage
VINDDR
–0.3 to VDDDDR + 0.3
V
Ethernet 1 I/O voltage
VDDGE1
–0.3 to 3.465
V
Input Ethernet 1 I/O voltage
VINGE1
–0.3 to VDDGE1 + 0.3
V
Ethernet 2 I/O voltage
VDDGE2
–0.3 to 3.465
V
Input Ethernet 2I/O voltage
VINGE2
–0.3 to VDDGE2 + 0.3
V
I/O voltage excluding Ethernet, DDR, M3, and RapidIO lines
VDDIO
–0.3 to 3.465
V
Input I/O voltage
VINIO
–0.3 to VDDIO + 0.3
V
M3 memory I/O and M3 memory charge pump voltage
VDDM3IO
V25M3
–0.3 to 2.75
V
Input M3 memory I/O voltage
VINM3IO
–0.3 to VDDM3IO + 0.3
V
Rapid I/O C voltage
VDDSXC
–0.3 to 1.21
V
Rapid I/O P voltage
VDDSXP
–0.3 to 1.26
V
Rapid I/O PLL voltage
VDDRIOPLL
–0.3 to 1.21
V
Operating temperature
TJ
–40 to 105
°C
TSTG
–55 to +150
°C
Storage temperature range
Notes:
1.
2.
3.
4.
Functional operating conditions are given in Table 3.
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the listed limits may affect device reliability or cause permanent damage.
Section 3.5, Thermal Considerations includes a formula for computing the chip junction temperature (TJ).
PLL supply voltage is specified at input of the filter and not at pin of the MSC8144 (see Figure 46)
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
26
Freescale Semiconductor
Electrical Characteristics
2.2
Recommended Operating Conditions
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
Table 3. Recommended Operating Conditions
Rating
Symbol
Min
Nominal
Core supply voltage
VDD
0.97
1.0
1.05
V
PLL supply voltage
VDDPLL0
VDDPLL1
VDDPLL2
0.97
1.0
1.05
V
M3 memory Internal voltage
VDDM3
1.14
1.2
1.26
V
DDR memory supply voltage
• DDR mode
• DDR2 mode
DDR reference voltage
VDDDDR
2.375
1.71
0.49 × VDDDDR
2.5
1.8
0.5 × VDDDDR
2.625
1.89
0.51 × VDDDDR
V
V
V
Ethernet 1 I/O voltage
• 2.5 V mode
• 3.3 V mode
VDDGE1
2.375
3.135
2.5
3.3
2.625
3.465
V
V
Ethernet 2 I/O voltage
• 2.5 V mode
• 3.3 V mode
VDDGE2
2.375
3.135
2.5
3.3
2.625
3.465
V
V
MVREF
Max
Unit
I/O voltage excluding Ethernet,
DDR, M3, and RapidIO lines
VDDIO
3.135
3.3
3.465
V
M3 memory I/O and M3 charge
pump voltage
VDDM3IO
V25M3
2.375
2.5
2.625
V
Rapid I/O C voltage
VDDSXC
0.95
1.0
1.05
V
Rapid I/O P voltage
• Short run (haul) mode
• Long run (haul) mode
VDDSXP
0.95
1.14
1.0
1.2
1.05
1.26
V
V
VDDRIOPLL
0.95
1.0
1.05
V
TJ
TA
TJ
0
–40
—
90
—
105
°C
°C
°C
Rapid I/O PLL voltage
Operating temperature range:
• Standard
• Extended
Note:
PLL supply voltage is specified at input of the filter and not at pin of the MSC8144 (see Figure 46).
2.3
Default Output Driver Characteristics
Table 4 provides information on the characteristics of the output driver strengths. The values are preliminary estimates.
Table 4. Output Drive Impedance
Driver Type
Output Impedance (Ω)
DDR signal
18
DDR2 signal
18
35 (half strength mode)
PCI signals
25
Rapid I/O signals
100
Other signals
50
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
27
Electrical Characteristics
2.4
Thermal Characteristics
Table 5 describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
Table 5. Thermal Characteristics for the MSC8144
Characteristic
FC-PBGA
29 × 29 mm5
Symbol
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
RθJA
20
15
Junction-to-ambient, four-layer board
RθJA
15
12
Junction-to-board (bottom)4
RθJB
7
°C/W
Junction-to-case5
RθJC
0.8
°C/W
Junction-to-ambient1, 2
1, 3
Notes:
1.
2.
3.
4.
5.
°C/W
°C/W
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
2.5
Power Characteristics
The estimated typical power dissipation for MSC8144 versus the core frequency is shown in Table 6.
Table 6. Power Dissipation
Extended Core Frequency
Core Frequency
Typical
Unit
266
400
TBD
W
533
TBD
667
TBD
800
TBD
500
TBD
667
TBD
833
TBD
1000
TBD
400
TBD
600
TBD
800
TBD
1000
TBD
500
TBD
750
TBD
1000
TBD
333
400
500
Note:
W
W
W
Measured for 1.0 V core at 25°C junction temperature.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
28
Freescale Semiconductor
Electrical Characteristics
The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No
peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and
all four cores. It was created using CodeWarrior® 3.0. These values are provided as examples only. Power consumption is
application dependent and varies widely. To assure proper board design with regard to thermal dissipation and maintaining
proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Section 3 of
this document.
At allowable voltage levels, Table 7 lists the estimated power dissipation on the 1.0-V AVDD supplies for the MSC8144 PLLs.
Table 7. MSC8144 PLLs Power Dissipation
Note:
PLL supply
Typical
Maximum
Unit
VDDPLL0
TBD
10
mW
VDDPLL1
TBD
10
mW
VDDPLL2
TBD
10
mW
Typical value is based on VDD = 1.0 V, TA = 70°C, TJ = 105°C.
2.6
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MSC8144.
2.6.1
DDR SDRAM DC Electrical Characteristics
This section describes the DC electrical specifications for the DDR SDRAM interface of the MSC8144.
Note:
DDR SDRAM uses VDDDDR(typ) = 2.5 V and DDR2 SDRAM uses VDDDDR(typ) = 1.8 V.
2.6.1.1
DDR2 (1.8 V) SDRAM DC Electrical Characteristics
Table 8 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MSC8144 when
VDDDDR(typ) = 1.8 V.
Table 8. DDR2 SDRAM DC Electrical Characteristics for VDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
I/O supply voltage1
VDDDDR
1.7
1.9
V
I/O reference voltage2
MVREF
0.49 × VDDDDR
0.51 × VDDDDR
V
I/O termination voltage3
VTT
MVREF – 0.04
MVREF + 0.04
V
Input high voltage
VIH
MVREF + 0.125
VDD + 0.3
V
Input low voltage
VIL
–0.3
MVREF – 0.125
V
Output leakage current4
IOZ
–30
30
μA
Output high current (VOUT = 1.420 V)
IOH
–13.4
—
mA
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
Notes:
1.
2.
3.
4.
VDDDDR is expected to be within 50 mV of the DRAM VDD at all times.
MVREF is expected to be equal to 0.5 × VDDDDR, and to track VDDDDR DC variations as measured at the receiver.
Peak-to-peak noise on MVREF may not exceed ±2% of the DC value.
VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of VDDDDR.
Output leakage is measured with all outputs are disabled, 0 V ≤ VOUT ≤ VDDDDR.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
29
Electrical Characteristics
Table 9 provides the DDR capacitance when VDDDDR(typ) = 1.8 V.
Table 9. DDR2 SDRAM Capacitance for VDDDDR(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Input/output capacitance: DQ, DQS, DQS
CIO
6
8
pF
Delta input/output capacitance: DQ, DQS, DQS
CDIO
—
0.5
pF
Note:
This parameter is sampled. VDDDDR = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = VDDDDR/2, VOUT (peak-to-peak) = 0.2 V.
2.6.1.2
DDR (2.5V) SDRAM DC Electrical Characteristics
Table 10 provides the recommended operating conditions for the DDR SDRAM component(s) of the MSC8144 when
VDDDDR(typ) = 2.5 V.
Table 10. DDR SDRAM DC Electrical Characteristics for VDDDDR (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
VDDDDR
2.3
2.7
V
MVREF
0.49 × VDDDDR
0.51 × VDDDDR
V
I/O termination voltage
VTT
MVREF – 0.04
MVREF + 0.04
V
Input high voltage
VIH
MVREF + 0.15
VDD + 0.3
V
VIL
–0.3
MVREF – 0.15
V
Output leakage current
IOZ
–30
30
μA
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
I/O supply voltage1
I/O reference
voltage2
3
Input low voltage
4
Notes:
1.
2.
3.
4.
VDDDDR is expected to be within 50 mV of the DRAM VDD at all times.
MVREF is expected to be equal to 0.5 × VDDDDR, and to track VDDDDR DC variations as measured at the receiver.
Peak-to-peak noise on MVREF may not exceed ±2% of the DC value.
VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of VDDDDR.
Output leakage is measured with all outputs are disabled, 0 V ≤ VOUT ≤ VDDDDR.
Table 11 provides the DDR capacitance when VDDDDR (typ) = 2.5 V.
Table 11. DDR SDRAM Capacitance for VDDDDR (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Input/output capacitance: DQ, DQS
CIO
6
8
pF
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
Note:
This parameter is sampled. VDDDDR = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = VDDDDR/2, VOUT (peak-to-peak) = 0.2 V.
Table 12 lists the current draw characteristics for MVREF.
Table 12. Current Draw Characteristics for MVREF
Parameter / Condition
Current draw for MVREF
Note:
Symbol
Min
Max
Unit
IMVREF
—
500
μA
The voltage regulator for MVREF must be able to supply up to 500 μA current.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
30
Freescale Semiconductor
Electrical Characteristics
2.6.2
Serial RapidIO DC Electrical Characteristics
DC receiver logic levels are not defined since the receiver is AC-coupled.
2.6.2.1
DC Requirements for SerDes Reference Clocks
The SerDes reference clocks SRIO_REF_CLK and SRIO_REF_CLK are AC-coupled differential inputs. Each differential
clock input has an internal 50 Ω termination to GNDSXC. The reference clock must be able to drive this termination. The
recommended minimum operating voltage is –0.4 V; the recommended maximum operating voltage is 1.32 V; and the
maximum absolute voltage is 1.72 V.
The maximum average current allowed in each input is 8 mA. This current limitation sets the maximum common mode input
voltage to be less than 0.4 V (0.4 V/50 Ω = 8 mA) while the minimum common mode input level is GNDSXC. For example, a
clock with a 50/50 duty cycle can be driven by a current source output that ranges from 0 mA to 16 mA (0–0.8 V). The input is
AC-coupled internally, so, therefore, the exact common mode input voltage is not critical.
Note:
This internal AC-couple network does not function correctly with reference clock frequencies below 90 MHz.
If the device driving the SRIO_REF_CLK inputs cannot drive 50 Ω to GNDSXC, or if it exceeds the maximum input current
limitations, then it must use external AC-coupling. The minimum differential peak-to-peak amplitude of the input clock is 0.4 V
(0.2 V peak-to-peak per phase). The maximum differential peak-to-peak amplitude of the input clock is 1.6 V peak-to-peak (see
Figure 5. The termination to GNDSXC allows compatibility with HCSL type reference clocks specified for PCI-Express
applications. Many other low voltage differential type outputs can be used but will probably need to be AC-coupled due to the
limited common mode input range. LVPECL outputs can produce too large an amplitude and may need to be source terminated
with a divider network to reduce the amplitude. The amplitude of the clock must be at least a 400 mV differential peak-peak for
single-ended clock. If driven differentially, each signal wire needs to drive 100 mV around common mode voltage. The
differential reference clock (SRIO_REF_CLK/ SRIO_REF_CLK) input is HCSL-compatible DC coupled or LVDS-compatible
with AC-coupling.
SRIO_REF_CLK
50 Ω
GNDSXC
50 Ω
SRIO_REF_CLK
Figure 5. SerDes Reference Clocks Input Stage
2.6.2.2
Spread Spectrum Clock
SRIO_REF_CLK/ SRIO_REF_CLK is designed to work with a spread spectrum clock (0 to 0.5% spreading at 3033 kHz rate
is allowed), assuming both ends have same reference clock. For better results use a source without significant unintended
modulation.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
31
Electrical Characteristics
2.6.3
PCI DC Electrical Characteristics
The measurements in Table 13 assume the following system conditions:
•
•
Note:
TA = 25 °C
GND = 0 VDC
The leakage current is measured for nominal conditions.
Table 13. PCI DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
VDDPCI
3.135
3.465
V
Input high voltage
VIH
0.5 × VDDPCI
3.465
V
Input low voltage
VIL
–0.5
0.3 × VDDPCI
V
10
μA
Supply voltage 3.3 V
2
VIPU
0.7 × VDDPCI
Input leakage current, 0<VIN <VDDPCI
IIN
–10
Tri-state (high impedance off state) leakage current, 0<VIN <VDDPCI
IOZ
–10
10
μA
IL
–10
10
μA
Input Pull-up voltage
Signal low input current, VIL = 0.4 V2
V2
IH
–10
10
μA
Output high voltage, IOH = –0.5 μA,
except open drain pins
VOH
0.9 × VDDPCI
—
V
Output low voltage, IOL= 1.5 μA
VOL
—
0.1 × VDDPCI
V
Input Pin Capacitance
CIN
10
pF
Signal high input current, VIH = 2.0
Notes:
2.6.4
1.
2.
See Figure 6 for undershoot and overshoot voltages.
Not tested. Guaranteed by design.
TDM DC Electrical Characteristics
The measurements in Table 14 assume the following system conditions:
•
•
Note:
TA = 25 °C
GND = 0 VDC
The leakage current is measured for nominal conditions.
Table 14. TDM DC Electrical Characteristics
Characteristic
Supply voltage 3.3 V
Symbol
Min
Max
Unit
VDDTDM
3.135
3.465
V
Input high voltage
VIH
2.0
3.465
V
Input low voltage
VIL
–0.3
0.8
V
Input leakage current, 0<VIN <VDDTDM
IIN
–10
10
μA
Tri-state (high impedance off state) leakage current,
IOZ
–10
10
μA
IL
–10
10
μA
Signal input current,1
Output high voltage, IOH = –1.6 mA,
VOH
2.4
—
V
Output low voltage, IOL= 0.4mA
VOL
—
0.4
V
Pin Capacitance
Cp
8
pF
Note:
2.6.5
Not tested. Guaranteed by design.
UART DC Electrical Characteristics
TBD
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
32
Freescale Semiconductor
Electrical Characteristics
2.6.6
Ethernet DC Electrical Characteristics
The measurements assume:
•
•
TA = 25 °C
GND = 0 VDC
2.6.6.1
MII, SMII and RMII DC Electrical Characteristics
Table 15. MII, SMII and RMII DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
VDDGE1
VDDGE2
3.135
3.465
V
Input high voltage
VIH
2.0
3.465
V
Input low voltage
VIL
–0.3
0.8
V
Supply voltage 3.3 V
IIN
–10
10
μA
1
IL
–10
10
μA
V1
IH
–10
10
μA
Output high voltage, IOH = –4 mA,
VOH
2.4
3.465
V
Output low voltage, IOL= 4mA
VOL
—
0.4
V
Input Pin Capacitance
CIN
8
pF
Input leakage current, VIN = supply voltage
Signal low input current, VIL = 0.4 V
Signal high input current, VIH = 2.4
Note:
Not tested. Guaranteed by design.
2.6.6.2
RGMII DC Electrical Characteristics
Table 16. RGMII DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
VDDGE1
VDDGE2
2.375
2.625
V
Input high voltage
VIH
1.7
2.625
V
Input low voltage
VIL
–0.3
0.7
V
Input high voltage ac
VIH-AC
1.9
—
V
Input low voltage ac
VIL-AC
—
0.7
V
IIN
–10
10
μA
IL
–10
10
μA
IH
–10
10
μA
Output high voltage, IOH = –1 mA,
VOH
2.0
2.625
V
Output low voltage, IOL= 1 mA
VOL
—
0.4
V
Input Pin Capacitance
CIN
8
pF
Supply voltage 2.5V
Input leakage current, VIN = supply voltage
Signal low input current, VIL = 0.4
V1
Signal high input current, VIH = 2.4 V
Note:
1
Not tested. Guaranteed by design.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
33
Electrical Characteristics
2.6.7
ATM/UTOPIA DC Electrical Characteristics
Table 17. ATM/UTOPI DC Electrical Characteristics
Characteristic
Supply voltage 3.3 V
Symbol
Min
Max
Unit
VDDIO
3.135
3.465
V
Input high voltage
VIH
2.0
3.465
V
Input low voltage
VIL
–0.3
0.8
V
IIN
–10
10
μA
Signal low input current, VIL = 0.4 V
IL
–10
10
μA
Signal high input current, VIH = 2.4 V1
IH
–10
10
μA
Output high voltage, IOH = –8 mA,
VOH
2.4
3.465
V
Output low voltage, IOL= 8 mA
VOL
—
0.5
V
Input leakage current, VIN = supply voltage
1
Notes:
1.
Not tested. Guaranteed by design.
2.6.8
SPI DC Electrical Characteristics
Table 18 provides the SPI DC electrical characteristics.
Table 18. SPI DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
2.0
OVDD+0.3
V
Input low voltage
VIL
–0.3
0.8
V
Input current
IIN
±5
μA
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
2.6.9
GPIO, EE, CLKIN, JTAG Ports DC Electrical Characteristics
The measurements in Table 19 assume:
•
TA = 25 °C
•
GND
Note:
= 0 VDC
The leakage current is measured for nominal conditions.
Table 19. GPIO and CLKIN DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
VDDIO
3.135
3.465
V
Input leakage current, VIN = supply voltage
IIN
–10
10
μA
Tri-state (high impedance off state) leakage current, VIN = supply voltage
IOZ
–10
10
μA
Supply voltage 3.3 V
Signal low input current, VIL = 0.4 V
2
Signal high input current, VIH = 2.0 V2
Output high voltage, IOH = –2 mA,
except open drain pins
IL
–10
10
μA
IH
–10
10
μA
VOH
2.4
3.465
V
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
34
Freescale Semiconductor
Electrical Characteristics
Table 19. GPIO and CLKIN DC Electrical Characteristics (continued)
Characteristic
Output low voltage, IOL= 3.2 mA
Notes:
1.
2.
Symbol
Min
Max
Unit
VOL
—
0.4
V
See Figure 6 for undershoot and overshoot voltages.
Not tested. Guaranteed by design.
VIH
VIL
VDDIO + 17%
VDDIO + 5%
VDDIO
GND
GND – 0.3 V
GND – 0.7 V
Must not exceed 10% of clock period
Figure 6. Overshoot/Undershoot Voltage for VIH and VIL
2.7
AC Timings
The following sections include illustrations and tables of clock diagrams, signals, and parallel I/O outputs and inputs.
2.7.1
Start-Up Timing
Starting the device requires coordination among several input sequences including clocking, reset, and power. Section 2.7.2
describes the clocking characteristics. Section 2.7.3 describes the reset and power-up characteristics. You must use the
following guidelines when starting up an MSC8144 device:
•
Note:
•
•
PORESET and TRST must be asserted externally for the duration of the power-up sequence using the VDDIO (3.3 V)
supply. See Table 24 for timing. TRST deassertion does not have to be synchronized with PORESET deassertion.
During functional operation when JTAG is not used, TRST can be asserted and remain asserted after the power ramp.
For applications that use M3 memory, M3_RESET should replicate the PORESET sequence timing, but using the
VDDM3IO (2.5 V) supply. See Section 3.1.1, Power-on Sequence for additional design information.
CLKIN should start toggling at least 32 cycles before the PORESET deassertion to guarantee correct device operation
(see Figure 7). 32 cycles should be accounted only after VDDIO reaches its nominal value.
CLKIN and PCI_CLK_IN should either be stable low during the power-up of VDDIO supply and start their swings after
power-up or should swing within VDDIO range during VDDIO power-up., so their amplitude grows as VDDIO grows
during power-up.
Figure 7 shows a sequence in which VDDIO is raised after VDD and CLKIN begins to toggle with the raise of VDDIO supply.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
35
Electrical Characteristics
VDDIO = Nominal
VDD = Nominal
1
VDDIO Nominal
Voltage
3.3 V
VDD Nominal
1.0 V
Time
PORESET/TRST asserted
VDD applied
CLKIN starts toggling
PORESET
VDDIO applied
Figure 7. Start-Up Sequence with VDD Raised Before VDDIO with CLKIN Started with VDDIO
2.7.2
Clock and Timing Signals
The following sections include a description of clock signal characteristics. Table 20 shows the maximum frequency values for
internal (Core, Reference, Bus and DSI) and external (CLKIN, PCI_CLK_IN and CLKOUT. The user must ensure that
maximum frequency values are not exceeded.
Table 20. Clock Frequencies
Characteristic
CLKIN frequency
PCI_CLK_IN frequency
CLKIN duty cycle
PCI_CLK_IN duty cycle
Symbol
MIN
Max
Unit
FCLKIN
25
150
MHz
FPCI_CLK_IN
25
150
MHz
DCLKIN
40
60
%
DPCI_CLK_IN
40
60
%
Table 21. Clock Parameters
Characteristic
Min
Max
Unit
CLKIN slew rate
1
—
V/ns
PCI_CLK_IN slew rate
1
—
V/ns
2.7.3
Reset Timing
The MSC8144 has several inputs to the reset logic:
•
•
•
•
•
•
•
•
Power-on reset (PORESET)
External hard reset (HRESET)
External soft reset (SRESET)
Software watchdog reset
JTAG reset
RapidIO reset
Software hard reset
Software soft reset
All MSC8144 reset sources are fed into the reset controller, which takes different actions depending on the source of the reset.
The reset status register indicates the most recent sources to cause a reset. Table 22 describes the reset sources.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
36
Freescale Semiconductor
Electrical Characteristics
Table 22. Reset Sources
Name
Direction
Description
Power-on reset
(PORESET)
Input
Initiates the power-on reset flow that resets the MSC8144 and configures various attributes of the
MSC8144. On PORESET, the entire MSC8144 device is reset. All PLLs states is reset, HRESET
and SRESET are driven, the extended cores are reset, and system configuration is sampled. The
reset source and word are configured only when PORESET is asserted.
External hard
reset (HRESET)
Input/ Output
Initiates the hard reset flow that configures various attributes of the MSC8144. While HRESET is
asserted, SRESET is also asserted. HRESET is an open-drain pin. Upon hard reset, HRESET and
SRESET are driven, the extended cores are reset, and system configuration is sampled. Note that
the RCW (reset Configuration Word) is not reloaded during HRESET assertion after out of power on
reset sequence. The reset configuration word is described in the Reset chapter in the MSC8144
Reference Manual.
External soft reset
(SRESET)
Input/ Output
Initiates the soft reset flow. The MSC8144 detects an external assertion of SRESET only if it occurs
while the MSC8144 is not asserting reset. SRESET is an open-drain pin. Upon soft reset, SRESET is
driven, the extended cores are reset, and system configuration is maintained.
Host reset
command through
the TAP
Internal
When a host reset command is written through the Test Access Port (TAP), the TAP logic asserts the
soft reset signal and an internal soft reset sequence is generated.
Software
watchdog reset
Internal
When the MSC8144 watchdog count reaches zero, a software watchdog reset is signalled. The
enabled software watchdog event then generates an internal hard reset sequence.
RapidIO reset
Internal
When the RapidIO logic asserts the RapidIO hard reset signal, it generates an internal hard reset
sequence.
Software hard
reset
Internal
A hard reset sequence can be initialized by writing to a memory mapped register (RCR)
Software soft reset
Internal
A soft reset sequence can be initialized by writing to a memory mapped register (RCR)
Table 23 summarizes the reset actions that occur as a result of the different reset sources.
Table 23. Reset Actions for Each Reset Source
Power-On Reset
(PORESET)
Hard Reset (HRESET)
External only
External or Internal
(Software Watchdog,
Software or RapidIO)
External or
internal
Software
JTAG Command:
EXTEST, CLAMP, or
HIGHZ
Yes
No
No
No
Soft Reset (SRESET)
Reset Action/Reset Source
Configuration pins sampled (Refer to
Section 2.7.3.2 for details).
PLL state reset
Yes
No
No
No
Select reset configuration source
Yes
No
No
No
System reset configuration write
Yes
No
No
No
HRESET driven
Yes
Yes
No
No
IPBus modules reset (TDM, UART, SWT,
DDRC, IPBus master, GIC, HS, and GPIO)
Yes
Yes
Yes
Yes
Depends on command
SRESET driven
Yes
Yes
Yes
Extended cores reset
Yes
Yes
Yes
Yes
CLASS registers reset
Yes
Yes
Some
registers
Some registers
Timers, Performance Monitor
Yes
Yes
No
No
Packet Processor, PCI, DMA
Yes
Yes
Most
registers
Most registers
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
37
Electrical Characteristics
2.7.3.1
Power-On Reset (PORESET) Pin
Asserting PORESET initiates the power-on reset flow. PORESET must be asserted externally for at least 32 CLKIN cycles after
VDD and VDDIO are both at their nominal levels.
2.7.3.2
Reset Configuration
The MSC8144 has two mechanisms for writing the reset configuration:
•
•
•
Through the I2C port
Through external pins
Through internal hard coded
Twenty-three signals (see Section 1 for signal description details) are sampled during the power-on reset sequence to define the
Reset Word Configuration Source and operating conditions:
•
•
RCW_SRC[2–0]
RC[16–0]
The RCFG_CLKIN_RNG pin must be valid during power-on or hard reset sequence. The STOP_BS pin must be always valid
and is also sampled during power-on reset sequence for RCW loading from an I2C EEPROM.
2.7.3.3 Reset Timing Tables
Table 24 and Figure 8 describe the reset timing for a reset configuration.
Table 24. Timing for a Reset Configuration Write
No.
1
2
3
Note:
Characteristics
Required external PORESET duration minimum
• 25 MHz <= CLKIN < 44 MHz
• 44 MHz <= CLKIN < 66 MHz
• 66 MHz <= CLKIN < 100 MHz
• 100 MHz <= CLKIN < 133 MHz
Expression
Max
Min
Unit
1280
728
485
320
727
484
320
241
ns
ns
ns
ns
32/CLKIN
Delay from de-assertion of external PORESET to HRESET deassertion for
external pins and hard coded RCW
• 25 MHz <= CLKIN < 66 MHz
• 66 MHz <= CLKIN <= 133 MHz
15369/CLKIN
34825/CLKIN
615
528
233
262
μs
μs
Delay from de-assertion of external PORESET to HRESET deassertion for
loading RCW the I2C interface
• 25 MHz <= CLKIN < 44 MHz
• 44 MHz <= CLKIN < 66 MHz
• 66 MHz <= CLKIN < 100 MHz
• 100 MHz <= CLKIN < 133 MHz
92545/CLKIN
107435/CLKIN
124208/CLKIN
157880/CLKIN
3702
2441
1882
1579
2103
1627
1242
1187
μs
μs
μs
μs
16/CLKIN
640
120
ns
Delay from HRESET deassertion to SRESET deassertion
• REFCLK = 25 MHz to 133 MHz
Timings are not tested, but are guaranteed by design.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
38
Freescale Semiconductor
Electrical Characteristics
RCW_SRC2,RCW_SRC1,RCW_SRC0,STOP_BS and RCFG_CLKIN_RNG
pins must be valid
1
PORESET
Input
HRESET
Output (I/O)
2
SRESET
Output (I/O)
Reset configuration write
sequence during this
period.
3
Figure 8. Timing for a Reset Configuration Write
See also Reset Errata for PLL lock and reset duration.
2.7.4
DDR SDRAM AC Timing Specifications
This section describes the AC electrical characteristics for the DDR SDRAM interface.
2.7.4.1
DDR SDRAM Input Timings
Table 22 provides the input AC timing specifications for the DDR SDRAM when VDD(typ) = 2.5 V.
Table 22. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
MVREF – 0.31
V
AC input high voltage
VIH
MVREF + 0.31
—
V
Note:
At recommended operating conditions with VDD of 2.5 ± 5%.
Table 23 provides the input AC timing specifications for the DDR SDRAM when VDD(typ) = 1.8 V.
Table 23. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
Parameter
Symbol
Min
Max
Unit
AC input low voltage
VIL
—
VREF – 0.25
V
AC input high voltage
VIH
VREF + 0.25
—
V
Note:
At recommended operating conditions with VDD of 1.8 ± 5%.
Table 24 provides the input AC timing specifications for the DDR SDRAM interface.
Table 24. DDR SDRAM Input AC Timing Specifications
Parameter
Controller Skew for MDQS—MDQ/MECC/MDM
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
Notes:
1.
2.
Symbol
1
Min
Max
Unit
–365
–390
–428
–490
365
390
428
490
ps
ps
ps
ps
tCISKEW
tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that is
captured with MDQS[n]. Subtract this value from the total timing budget.
At recommended operating conditions with VDD (1.8 V or 2.5 V) ± 5%
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
39
Electrical Characteristics
2.7.4.2
DDR SDRAM Output AC Timing Specifications
Table 25 provides the output AC timing specifications for the DDR SDRAM interface.
Table 25. DDR SDRAM Output AC Timing Specifications
Parameter
MCK[n] cycle time, (MCK[n]/MCK[n]
crossing)2
Symbol 1
Min
Max
Unit
tMCK
3
10
ns
1.95
2.40
3.15
4.20
—
—
—
—
ns
ns
ns
ns
1.95
2.40
3.15
4.20
—
—
—
—
ns
ns
ns
ns
1.95
2.40
3.15
4.20
—
—
—
—
ns
ns
ns
ns
1.95
2.40
3.15
4.20
—
—
—
—
ns
ns
ns
ns
–0.6
0.6
ns
700
900
1100
1200
—
—
—
—
ps
ps
ps
ps
700
900
1100
1200
—
—
—
—
ps
ps
ps
ps
ADDR/CMD output setup with respect to MCK3
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHAS
ADDR/CMD output hold with respect to MCK3
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHAX
MCSn output setup with respect to MCK3
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHCS
MCSn output hold with respect to MCK3
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHCX
MCK to MDQS Skew4
tDDKHMH
MDQ/MECC/MDM output setup with respect to MDQS5
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHDS,
tDDKLDS
MDQ/MECC/MDM output hold with respect to MDQS5
• 400 MHz
• 333 MHz
• 266 MHz
• 200 MHz
tDDKHDX,
tDDKLDX
MDQS preamble start6
tDDKHMP
–0.5 × tMCK – 0.6
–0.5 × tMCK +0.6
ns
MDQS epilogue end6
tDDKHME
–0.6
0.6
ns
Notes:
1.
2.
3.
4.
5.
6.
7.
The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs
(A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the
ADDR/CMD setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by
1/2 applied cycle.
Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD)
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control
of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MSC8144 Reference Manual for a description and understanding of the timing modifications
enabled by use of these bits.
Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
At recommended operating conditions with VDD (1.8 V or 2.5 V) ± 5%.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
40
Freescale Semiconductor
Electrical Characteristics
Figure 9 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).
MCK[n]
MCK[n]
tMCK
tDDKHMHmax) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 9. Timing for tDDKHMH
Figure 10 shows the DDR SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tDDKHAS, tDDKHCS
tDDKHAX ,tDDKHCX
ADDR/CMD
Write A0
NOOP
tDDKHMP
tDDKHMH
MDQS[n]
tDDKHME
tDDKHDS
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 10. DDR SDRAM Output Timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
41
Electrical Characteristics
Figure 11 provides the AC test load for the DDR bus.
Z0 = 50 Ω
Output
RL = 50 Ω
VDD/2
Figure 11. DDR AC Test Load
2.7.5
2.7.5.1
Serial RapidIO Timing and SGMII Timing
AC Requirements for SRIO_REF_CLK and SRIO_REF_CLK
Table 26 lists AC requirements.
Table 26. SDn_REF_CLK and SDn_REF_CLK AC Requirements
Parameter Description
Symbol
Min
Typical
Max
Units
Comments
tREF
—
10 (8, 6.4)
—
ns
8 ns applies only to serial RapidIO system
with 125-MHz reference clock. 6.4 ns
applies only to serial RapidIO systems with
a 156.25 MHz reference clock.
Note:
SGMII uses the 8 ns (125 MHz)
value only.
REFCLK cycle-to-cycle
jitter
tREFCJ
—
—
80
ps
Difference in the period of any two
adjacent REFCLK cycles
Phase jitter
tREFPJ
–40
—
40
ps
Deviation in edge location with respect to
mean edge location
REFCLK cycle time
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
42
Freescale Semiconductor
Electrical Characteristics
2.7.5.2
Signal Definitions
LP-Serial links use differential signaling. This section defines terms used in the description and specification of differential
signals. Figure 12 shows how the signals are defined. The figure shows waveforms for either a transmitter output (TD and TD)
or a receiver input (RD and RD). Each signal swings between voltage levels A and B, where A > B.
TD or RD
A
TD or RD
B
Differential Peak-Peak = 2 × (A – B)
Figure 12. Differential VPP of Transmitter or Receiver
Note:
This explanation uses generic TD/TD/RD/RD signal names. These correspond to SRIO_TXD/SRIO_TXD/
SRIO_RXD/SRIO_RXD respectively.
Using these waveforms, the definitions are as follows:
1.
2.
3.
4.
5.
6.
The transmitter output signals and the receiver input signals TD, TD, RD and RD each have a peak-to-peak voltage
(VPP) swing of A – B.
The differential output signal of the transmitter, VOD, is defined as VTD – VTD.
The differential input signal of the receiver, VID, is defined as VRD – VRD.
The differential output signal of the transmitter and the differential input signal of the receiver each range from A – B
to –(A – B).
The peak value of the differential transmitter output signal and the differential receiver input signal is A – B.
The value of the differential transmitter output signal and the differential receiver input signal is 2 × (A – B) VPP.
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic) transmitter that has a common
mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 V and 2.0 V. Using these values,
the peak-to-peak voltage swing of the signals TD and TD is 500 mVPP. The differential output signal ranges between 500 mV
and –500 mV. The peak differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mVPP.
Note:
AC electrical specifications are given for transmitter and receiver. Long run and short run interfaces at three baud
rates (a total of six cases) are described. The parameters for the AC electrical specifications are guided by the XAUI
electrical interface specified in Clause 47 of IEEE™ Std 802.3ae-2002™. XAUI has similar application goals to
serial RapidIO. The goal of this standard is that electrical designs for serial RapidIO can reuse electrical designs for
XAUI, suitably modified for applications at the baud intervals and reaches described herein.
2.7.5.3
Equalization
With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such
as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye
opening at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be
used. The most common equalization techniques that can be used are:
•
•
A passive high pass filter network placed at the receiver. This is often referred to as passive equalization.
The use of active circuits in the receiver. This is often referred to as adaptive equalization.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
43
Electrical Characteristics
2.7.5.4
Transmitter Specifications
LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section. The differential return
loss, S11, of the transmitter in each case shall be better than
•
•
–10 dB for (baud frequency)/10 < freq(f) < 625 MHz, and
–10 dB + 10log(f/625 MHz) dB for 625 MHz ≤ freq(f) ≤ baud frequency
The reference impedance for the differential return loss measurements is 100 Ω resistive. Differential return loss includes
contributions from internal circuitry, packaging, and any external components related to the driver. The output impedance
requirement applies to all valid output levels. It is recommended that the 20–80% rise/fall time of the transmitter, as measured
at the transmitter output, have a minimum value 60 ps in each case. It is also recommended that the timing skew at the output
of an LP-Serial transmitter between the two signals comprising a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50
GB, and 15 ps at 3.125 GB.
Table 27. Short Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Symbol
Unit
Min
Max
VO
–0.40
2.30
V
VDIFFPP
500
1000
mVPP
Notes
Voltage relative to COMMON of either signal
comprising a differential pair
Deterministic Jitter
JD
0.17
UIPP
Total Jitter
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
800
ps
±100 ppm
Multiple output skew
Unit Interval
UI
800
Table 28. Short Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Deterministic Jitter
Symbol
Unit
Max
VO
–0.40
2.30
V
VDIFFPP
500
1000
mVPP
0.17
UIPP
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
400
ps
±100 ppm
JD
Total Jitter
Multiple Output skew
Unit Interval
Notes
Min
UI
400
Voltage relative to COMMON of either signal
comprising a differential pair
Table 29. Short Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Symbol
Unit
Min
Max
VO
-0.40
2.30
V
VDIFFPP
500
1000
mVPP
Notes
Voltage relative to COMMON of either signal
comprising a differential pair
Deterministic Jitter
JD
0.17
UIPP
Total Jitter
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
320
ps
±100 ppm
Multiple output skew
Unit Interval
UI
320
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
44
Freescale Semiconductor
Electrical Characteristics
Table 30. Long Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Symbol
Unit
Min
Max
VO
-0.40
2.30
V
VDIFFPP
800
1600
mVPP
Notes
Voltage relative to COMMON of either signal
comprising a differential pair
Deterministic Jitter
JD
0.17
UIPP
Total Jitter
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
800
ps
±100 ppm
Multiple output skew
Unit Interval
UI
800
Table 31. Long Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Symbol
Unit
Min
Max
VO
-0.40
2.30
V
VDIFFPP
800
1600
mVPP
Notes
Voltage relative to COMMON of either signal
comprising a differential pair
Deterministic Jitter
JD
0.17
UIPP
Total Jitter
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
400
ps
±100 ppm
Multiple output skew
Unit Interval
UI
400
Table 32. Long Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Output Voltage,
Differential Output Voltage
Deterministic Jitter
Total Jitter
Multiple output skew
Unit Interval
Symbol
Unit
Notes
Min
Max
VO
-0.40
2.30
V
VDIFFPP
800
1600
mVPP
0.17
UIPP
JT
0.35
UIPP
SMO
1000
ps
Skew at the transmitter output between lanes of a
multilane link
320
ps
±100 ppm
JD
UI
320
Voltage relative to COMMON of either signal
comprising a differential pair
For each baud rate at which an LP-Serial transmitter is specified to operate, the output eye pattern of the transmitter shall fall
entirely within the unshaded portion of the transmitter output compliance mask shown in Figure 13 with the parameters
specified in Table 33 when measured at the output pins of the device and the device is driving a 100 Ω ±5% differential resistive
load. The output eye pattern of an LP-Serial transmitter that implements pre-emphasis (to equalize the link and reduce
inter-symbol interference) need only comply with the transmitter output compliance mask when pre-emphasis is disabled or
minimized.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
45
Transmitter Differential Output Voltage
Electrical Characteristics
VDIFF max
VDIFF min
0
-VDIFF min
-VDIFF max
0
A
B
1-B
1-A
1
Time in UI
Figure 13. Transmitter Output Compliance Mask
Table 33. Transmitter Differential Output Eye Diagram Parameters
Transmitter Type
VDIFFmin (mV)
VDIFFmax (mV)
A (UI)
B (UI)
1.25 GBaud short range
250
500
0.175
0.39
1.25 GBaud long range
400
800
0.175
0.39
2.5 GBaud short range
250
500
0.175
0.39
2.5 GBaud long range
400
800
0.175
0.39
3.125 GBaud short range
250
500
0.175
0.39
3.125 GBaud long range
400
800
0.175
0.39
2.7.5.5
Receiver Specifications
LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section. Receiver input impedance
shall result in a differential return loss better that 10 dB and a common mode return loss better than 6 dB from 100 MHz to 0.8
× baud frequency. This includes contributions from internal circuitry, the package, and any external components related to the
receiver. AC coupling components are included in this requirement. The reference impedance for return loss measurements is
100 Ω resistive for differential return loss and 25 Ω resistive for common mode.
Table 34. Receiver AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
1600
Notes
Differential Input Voltage
VIN
200
mVPP
Measured at receiver
Deterministic Jitter Tolerance
JD
0.37
UIPP
Measured at receiver
Combined Deterministic and Random
Jitter Tolerance
JDR
0.55
UIPP
Measured at receiver
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
46
Freescale Semiconductor
Electrical Characteristics
Table 34. Receiver AC Timing Specifications—1.25 GBaud (continued)
Range
Characteristic
Symbol
Min
Total Jitter Tolerance
JT
Multiple Input Skew
SMI
24
Bit Error Rate
BER
10–12
Unit Interval
UI
0.65
800
Unit
Notes
UIPP
Measured at receiver. Total jitter is composed of
three components, deterministic jitter, random jitter
and single frequency sinusoidal jitter. The sinusoidal
jitter may have any amplitude and frequency in the
unshaded region of Figure 14. The sinusoidal jitter
component is included to ensure margin for low
frequency jitter, wander, noise, crosstalk and other
variable system effects.
Max
800
ns
Skew at the receiver input between lanes of a
multilane link
ps
±100 ppm
Table 35. Receiver AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
VIN
200
1600
Deterministic Jitter Tolerance
JD
Combined Deterministic and Random
Jitter Tolerance
JDR
Total Jitter Tolerance
JT
Multiple Input Skew
SMI
24
Bit Error Rate
BER
10–12
Differential Input Voltage
Unit Interval
UI
Notes
mVPP
Measured at receiver
0.37
UIPP
Measured at receiver
0.55
UIPP
Measured at receiver
0.65
UIPP
Measured at receiver. Total jitter is composed of
three components, deterministic jitter, random jitter
and single frequency sinusoidal jitter. The sinusoidal
jitter may have any amplitude and frequency in the
unshaded region of Figure 14. The sinusoidal jitter
component is included to ensure margin for low
frequency jitter, wander, noise, crosstalk and other
variable system effects.
400
400
ns
Skew at the receiver input between lanes of a
multilane link
ps
±100 ppm
Table 36. Receiver AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Max
VIN
200
1600
Deterministic Jitter Tolerance
JD
Combined Deterministic and Random
Jitter Tolerance
JDR
Total Jitter Tolerance
JT
Multiple Input Skew
SMI
Differential Input Voltage
Notes
mVPP
Measured at receiver
0.37
UIPP
Measured at receiver
0.55
UIPP
Measured at receiver
0.65
UIPP
Measured at receiver. Total jitter is composed of
three components, deterministic jitter, random jitter
and single frequency sinusoidal jitter. The sinusoidal
jitter may have any amplitude and frequency in the
unshaded region of Figure 14. The sinusoidal jitter
component is included to ensure margin for low
frequency jitter, wander, noise, crosstalk and other
variable system effects.
22
ns
Skew at the receiver input between lanes of a
multilane link
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
47
Electrical Characteristics
Table 36. Receiver AC Timing Specifications—3.125 GBaud (continued)
Range
Characteristic
Symbol
Unit
Min
Bit Error Rate
10–12
BER
Unit Interval
UI
Notes
Max
320
320
ps
±100 ppm
8.5 UI p-p
Sinusoidal
Jitter
Amplitude
0.10 UI p-p
22.1 kHz
Frequency
1.875 MHz
20 MHz
Figure 14. Single Frequency Sinusoidal Jitter Limits
2.7.5.6
Receiver Eye Diagrams
For each baud rate at which an LP-Serial receiver is specified to operate, the receiver shall meet the corresponding bit error rate
specification (Table 34, Table 35, and Table 36) when the eye pattern of the receiver test signal (exclusive of sinusoidal jitter)
falls entirely within the unshaded portion of the receiver input compliance mask shown in Figure 15 with the parameters
specified in Table 37. The eye pattern of the receiver test signal is measured at the input pins of the receiving device with the
device replaced with a 100 Ω ±5% differential resistive load.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
48
Freescale Semiconductor
Electrical Characteristics
Receiver Differential Input Voltage
VDIFF max
VDIFF min
0
–VDIFF min
–VDIFF max
0
A
B
1–B
1
1–A
Time (UI)
Figure 15. Receiver Input Compliance Mask
Table 37. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter
Receiver Type
VDIFFmin (mV)
VDIFFmax (mV)
A (UI)
B (UI)
1.25 GBaud
100
800
0.275
0.400
2.5 GBaud
100
800
0.275
0.400
3.125 GBaud
100
800
0.275
0.400
2.7.5.7
Measurement and Test Requirements
Since the LP-Serial electrical specification are guided by the XAUI electrical interface specified in Clause 47 of IEEE Std.
802.3ae-2002™, the measurement and test requirements defined here are similarly guided by Clause 47. In addition, the CJPAT
test pattern defined in Annex 48A of IEEE Std. 802.3ae-2002 is specified as the test pattern for use in eye pattern and jitter
measurements. Annex 48B of IEEE Std. 802.3ae-2002 is recommended as a reference for additional information on jitter test
methods.
2.7.5.8
Eye Template Measurements
For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point at (baud
frequency)/1667 is applied to the jitter. The data pattern for template measurements is the continuous jitter test pattern (CJPAT)
defined in Annex 48A of IEEE Std. 802.3ae. All lanes of the LP-Serial link shall be active in both the transmit and receive
directions, and opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined
in Annex 48A. Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0.
The amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10–12. The eye pattern
shall be measured with AC coupling and the compliance template centered at 0 Volts differential. The left and right edges of
the template shall be aligned with the mean zero crossing points of the measured data eye. The load for this test shall be 100 Ω
resistive ±5% differential to 2.5 GHz.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
49
Electrical Characteristics
2.7.5.9
Jitter Test Measurements
For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (baud frequency)/1667 is
applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter Test Pattern (CJPAT) pattern defined in
Annex 48A of IEEE Std. 802.3ae. All lanes of the LP-Serial link shall be active in both the transmit and receive directions, and
opposite ends of the links shall use asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A.
Single lane implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be
measured with AC coupling and at 0 V differential. Jitter measurement for the transmitter (or for calibration of a jitter tolerance
setup) shall be performed with a test procedure resulting in a BER curve such as that described in Annex 48B of IEEE Std.
802.3ae.
2.7.5.10
Transmit Jitter
Transmit jitter is measured at the driver output when terminated into a load of 100 Ω resistive ±5% differential to 2.5 GHz.
2.7.5.11
Jitter Tolerance
Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first producing the sum
of deterministic and random jitter defined in Section 2.7.5.9 and then adjusting the signal amplitude until the data eye contacts
the 6 points of the minimum eye opening of the receive template shown in Figure 15 and Table 37. Note that for this to occur,
the test signal must have vertical waveform symmetry about the average value and have horizontal symmetry (including jitter)
about the mean zero crossing. Eye template measurement requirements are as defined above. Random jitter is calibrated using
a high pass filter with a low frequency corner at 20 MHz and a 20 dB/decade roll-off below this. The required sinusoidal jitter
specified in Section 8.6 is then added to the signal and the test load is replaced by the receiver being tested.
2.7.6
PCI Timing
This section describes the general AC timing parameters of the PCI bus. Table 38 provides the PCI AC timing specifications.
Table 38. PCI AC Timing Specifications
33 MHz
Parameter
66 MHz
Symbol
Unit
Min
Max
Min
Max
tPCVAL
2.0
11.0
1.0
6.0
ns
High-Z to Valid Output delay
tPCON
2.0
—
1.0
—
ns
Valid to High-Z Output delay
tPCOFF
—
28
—
14
ns
Input setup
tPCSU
7.0
—
3.0
—
ns
Input hold
tPCH
0
—
0
—
ns
Reset active time after PCI_CLK_IN stable
tPCRST-CLK
100
—
100
—
μs
Reset active to output float delay
tPCRST-OFF
—
40
—
40
ns
Output delay
Reset active time after power stable
tPCRST
1
—
1
—
ms
HRESET high to first Configuration Access
tPCRHFA
32M
—
32M
—
clocks
Notes:
1.
2.
3.
4.
5.
See the timing measurement conditions in the PCI 2.2 Local Bus Specifications.
All PCI signals are measured from OVDD/2 of the rising edge of PCI_SYNC_IN to 0.4 × OVDD of the signal in question for
3.3-V PCI signaling levels.
For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
Input timings are measured at the pin.
The reset assertion timing requirement for HRESET is in Table 24 and Figure 8
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
50
Freescale Semiconductor
Electrical Characteristics
Figure 16 provides the AC test load for the PCI.
Z0 = 50 Ω
Output
RL = 50 Ω
VDD/2
Figure 16. PCI AC Test Load
Figure 17 shows the PCI input AC timing conditions.
CLK
tPCSU
tPCH
Input
Figure 17. PCI Input AC Timing Measurement Conditions
Figure 18 shows the PCI output AC timing conditions.
CLK
tPCVAL
Output Delay
tPCOFF
tPCON
High-Impedance
Output
Figure 18. PCI Output AC Timing Measurement Condition
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
51
Electrical Characteristics
2.7.7
TDM Timing
Table 39. TDM Timing
Characteristic
Symbol
Expression
Min
Max
Units
TDMxRCLK/TDMxTCLK
tTDMC
TC1
16
—
ns
TDMxRCLK/TDMxTCLK high pulse width
tTDMCH
(0.5 ± 0.1) × TC
7
—
ns
TDMxRCLK/TDMxTCLK low pulse width
tTDMCL
(0.5 ± 0.1) × TC
7
—
ns
TDM receive all input set-up time related to TDMxRCLK
TDMxTSYN input set-up time related to TDMxTCLK in TSO=0 mode
tTDMVKH
3.6
—
ns
TDM receive all input hold time related to TDMxRCLK
TDMxTSYN input hold time related to TDMxTCLK in TSO=0 mode
tTDMXKH
1.9
—
ns
TDMxTCLK high to TDMxTDAT output active2
tTDMDHOX
2.5
—
ns
TDMxTCLK high to TDMxTDAT output valid2
tTDMDHOV
—
9.8
ns
All output hold time (except TDMxTSYN) 3
tTDMHOX
2.5
—
ns
TDMxTCLK high to TDMxTDAT output high impedance2
tTDMDHOZ
—
9.8
ns
TDMxTCLK high to TDMxTSYN output valid2
tTDMSHOV
—
9.25
ns
TDMxTSYN output hold time3
tTDMSHOX
1.6
—
ns
Notes:
1.
2.
3.
Values are based on a a maximum frequency of 62.5 MHz. The TDM interface supports any frequency below 62.5 MHz.
Values are based on 20 pF capacitive load.
Values are based on 10 pF capacitive load.
Figure 19 shows the TDM input AC timing.
tTDMC
tTDMCH
tTDMCL
TDMxRCLK
tTDMXKH
tTDMVKH
TDMxRDAT
tTDMXKH
tTDMVKH
TDMxRSYN
Figure 19. TDM Inputs Signals
Note: For some TDM modes receive data and receive sync are being input on other pins. This timing is valid for them as well.
See the MSC8144 Reference Manual.
Figure 20 shows TDMxTSYN AC timing in TSO=0 mode.
TDMxTCLK
tTDMXKH
tTDMVKH
TDMxTSYN
Figure 20. TDMxTSYN in TSO=0 mode
Figure 21 shows the TDM Output AC timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
52
Freescale Semiconductor
tTDMC
tTDMCH
tTDMCL
TDMxTCLK
tTDMDHOX
TDMxTDAT
tTDMSHOV
TDMxTSYN
~
~ ~
~
tTDMDHOZ
tTDMDHOV
tTDMHOX
tTDMSHOX
Figure 21. TDM Output Signals
Note: For some TDM modes transmit data is being output on other pins. This timing is valid for it as well. See the MSC8144
Reference Manual
2.7.8
UART Timing
Table 40. UART Timing
Characteristics
URXD and UTXD inputs high/low duration
Symbol
Expression
Min
Max
Unit
TUREFCLK
16 × TREFCLK
160
—
ns
URXD and UTXD inputs rise/fall time
TUAVKH
6
ns
UTXD output rise/fall time
TUAVXH
5.5
ns
Note:
TUREFCLK = TREFCLK is guaranteed by design.
Figure 22 shows the UART input AC timing
TUAVKH
TUAVKH
UTXD, URXD
inputs
TUREFCLK
TUREFCLK
Figure 22. UART Input Timing
Figure 23 shows the UART output AC timing
TUAVXH
TUAVXH
UTXD output
Figure 23. UART Output Timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
53
2.7.9
Timer Timing
Table 41. Timer Timing
Characteristics
Symbol
Min
Unit
TTMREFCLK
10.0
ns
TIMERx Input high phase
TTMCH
4.0
ns
TIMERx Output low phase
TTMCL
4.0
ns
TIMERx frequency
Figure 24 shows the timer input AC timing
TTMREFCLK
TTMCH
TTMCL
TIMERx (Input)
Figure 24. Timer Timing
2.7.10
Ethernet Timing
This section describes the AC electrical characteristics for the Ethernet interface.
There are programmable delay units (PDU) that should be programmed differently for each Interface to meet timing. There is
a general configuration register 4 (GCR4) used to configure the timing. For additional information, see the MSC8144 Reference
Manual.
2.7.10.1
Management Interface Timing
Table 42. Ethernet Controller Management Interface Timing
Characteristics
Symbol
Min
Max
Unit
tMDCH
32
—
ns
ETHMDC to ETHMDIO delay2
tMDKHDX
10
70
ns
ETHMDIO to ETHMDC rising edge set-up time
tMDDVKH
5
—
ns
ETHMDC rising edge to ETHMDIO hold time
ETHMDC clock pulse width high
tMDDXKH
0
—
ns
ETHMDC rise time.
tMDCR
—
10
ns
ETHMDC fall time.
tMDHF
—
10
ns
Notes:
1.
2.
Typical ETHMDC frequency (fMDC) is 2.5 MHz with a 400 ns period (tMDC). The value depends on the source clock. For
example, for a source clock of 267 MHz, the maximum frequency is 8.3 MHz and the minimum frequency is 1.2 MHz. For a
375 MHz clock, the maximum frequency is 11.7 MHz and the minimum frequency is 1.7 MHz.
The value depends on the source clock. For example, for a source clock of 267 MHz, the delay is 70 ns. For a source clock of
333 MHz, the delay is 58 ns.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
54
Freescale Semiconductor
tMDC
tMDCR
ETHMDC
tMDCH
tMDHF
ETHMDIO
(Input)
tMDDVKH
ETHMDIO
(Output)
tMDDXKH
tMDKHDX
Figure 25. MII Management Interface Timing
2.7.10.2
MII Transmit AC Timing Specifications
Table 43 provides the MII transmit AC timing specifications.
Table 43. MII Transmit AC Timing Specifications
Symbol 1
Min
Max
Unit
tMTXH/tMTX
35
65
%
tMTKHDX
0
25
ns
TX_CLK data clock rise
tMTXR
1.0
4.0
ns
TX_CLK data clock fall
tMTXF
1.0
4.0
ns
Symbol 1
Min
Max
Unit
tMRXH/tMRX
35
65
%
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
Notes:
1.
2.
Typical TX_CLK period (tMTX) for 10 Mbps is 400 ns and for 100 Mbps is 40 ns.
Program GCR4 as 0x00030CC3.
Figure 26 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 26. MII Transmit AC Timing
2.7.10.3
MII Receive AC Timing Specifications
Table 44 provides the MII receive AC timing specifications.
Table 44. MII Receive AC Timing Specifications
Parameter/Condition
RX_CLK duty cycle
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
55
Table 44. MII Receive AC Timing Specifications (continued)
Symbol 1
Min
Max
Unit
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
2
—
ns
RX_CLK clock rise
tMRXR
1.0
4.0
ns
RX_CLK clock fall time
tMRXF
1.0
4.0
ns
Symbol 1
Min
Max
Unit
Parameter/Condition
Notes:
1.
2.
Typical RX_CLK period (tMRX) for 10 Mbps is 400 ns and for 100 Mbps is 40 ns.
Program GCR4 as 0x00030CC3.
Figure 27 provides the AC test load.
Z0 = 50 Ω
Output
RL = 50 Ω
VDD/2
Figure 27. AC Test Load
Figure 28 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXH
RXD[3:0]
RX_DV
RX_ER
tMRXF
Valid Data
tMRDVKH
tMRDXKH
Figure 28. MII Receive AC Timing
2.7.10.4
RMII Transmit and Receive AC Timing Specifications
Table 45 provides the RMII transmit and receive AC timing specifications.
Table 45. RMII Transmit and Receive AC Timing Specifications
Parameter/Condition
tRMXH/tRMX
35
65
%
REF_CLK to RMII data TXD[1–0], TX_EN delay
tRMTKHDX
2
10
ns
RXD[1–0], CRS_DV, RX_ER setup time to REF_CLK
tRMRDVKH
4.0
—
ns
RXD[1–0], CRS_DV, RX_ER hold time to REF_CLK
tRMRDXKH
2.0
—
ns
REF_CLK data clock rise
tRMXR
1.0
4.0
ns
REF_CLK data clock fall
tRMXF
1.0
4.0
ns
REF_CLK duty cycle
Typical REF_CLK clock period (tRMX) is 20 ns
Notes:
1.
2.
Typical REF_CLK clock period (tRMX) is 20 ns
Program GCR4 as 0x00001405
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
56
Freescale Semiconductor
Figure 29 shows the RMII transmit and receive AC timing diagram.
tRMXR
tRMX
REF_CLK
tRMXF
tRMXH
TXD[1–0]
TX_EN
tRMTKHDX
RXD[1–0]
CRS_DV
RX_ER
Valid Data
tRMRDVKH
tRMRDXKH
Figure 29. RMII Transmit and Receive AC Timing
Figure 30 provides the AC test load.
Z0 = 50 Ω
Output
VDD/2
RL = 50 Ω
Figure 30. AC Test Load
2.7.10.5
SMII AC Timing Specification
Table 46. SMII Mode Signal Timing
Characteristics
Symbol
Min
Max
Unit
ETHSYNC_IN, ETHRXD to ETHCLOCK rising edge set-up time
tSMDVKH
1.5
—
ns
ETHCLOCK rising edge to ETHSYNC_IN, ETHRXD hold time
tSMDXKH
1.0
—
ns
ETHCLOCK rising edge to ETHSYNC, ETHTXD output delay
tSMXR
1.5
5.0
ns
Notes:
1.
2.
3.
4.
5.
Typical REF_CLK clock period is 8ns
Measured using a 5 pF load.
Measured using a 15 pF load
REF_CLK duty cycle is TBD.
Program GCR4 as 0x00002008
Figure 31 provides the AC test load.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
57
ETHCLOCK
tSMDVKH
tSMDXKH
ETHSYNC_IN
ETHRXD
Valid
tSMXR
ETHSYNC
ETHTXD
Valid
Valid
Figure 31. SMII Mode Signal Timing
2.7.10.6
RGMII AC Timing Specifications
Table 47 presents the RGMII AC timing specifications for applications requiring an on-board delayed clock.
Table 47. RGMII with On-Board Delay AC Timing Specifications
Parameter/Condition
Symbol
Min
Data to clock output skew (at transmitter)
tSKEWT
-0.5
—
0.5
ns
Data to clock input skew (at receiver) 2
tSKEWR
0.9
—
2.6
ns
Clock cycle duration 3
Typ
Max
Unit
tRGT
7.2
8.0
8.8
ns
Duty cycle for 1000Base-T 4, 5
tRGTH/tRGT
45
50
55
%
Duty cycle for 10BASE-T and 100BASE-TX 3, 5
tRGTH/tRGT
40
50
60
%
tRGTR
—
—
0.75
ns
Fall time (20%–80%)
tRGTF
—
—
0.75
ns
GTX_CLK125 reference clock period
tG12 6
—
8.0
—
ns
tG125H/tG125
47
—
53
%
Rise time (20%–80%)
GTX_CLK125 reference clock duty cycle
Notes:
1.
2.
3.
4.
5.
6.
7.
At recommended operating conditions with LVDD of 2.5 V +/- 5%.
This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than 1.5 ns will
be added to the associated clock signal.
For 10 and 100 Mbps, tRGT scales to 400 ns +/- 40 ns and 40 ns +/- 4 ns, respectively.
Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
Duty cycle reference is LVdd/2.
This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
GCR4 should be programmed as 0x00001004.
Table 48 presents the RGMII AC timing specification for applications required non-delayed clock on board.
Table 48. RGMII with No On-Board Delay AC Timing Specifications
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tSKEWT
0.9
—
2.6
ns
tSKEWR
-0.5
—
0.5
ns
tRGT
7.2
8.0
8.8
ns
Duty cycle for 1000Base-T 4, 5
tRGTH/tRGT
45
50
55
%
Duty cycle for 10BASE-T and 100BASE-TX 3, 5
tRGTH/tRGT
40
50
60
%
Rise time (20%–80%)
tRGTR
—
—
0.75
ns
Fall time (20%–80%)
tRGTF
—
—
0.75
ns
6
—
8.0
—
ns
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
2
Clock cycle duration 3
GTX_CLK125 reference clock period
tG12
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
58
Freescale Semiconductor
Table 48. RGMII with No On-Board Delay AC Timing Specifications (continued)
Parameter/Condition
GTX_CLK125 reference clock duty cycle
Notes:
1.
2.
3.
4.
5.
6.
7.
Symbol
Min
Typ
Max
Unit
tG125H/tG125
47
—
53
%
At recommended operating conditions with LVDD of 2.5 V +/- 5%.
This implies that PC board design will require clocks to be routed with no additional trace delay
For 10 and 100 Mbps, tRGT scales to 400 ns +/- 40 ns and 40 ns +/- 4 ns, respectively.
Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
Duty cycle reference is LVdd/2.
This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
GCR4 should be programmed as 0x00048120.
Figure 32 shows the RGMII AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKEWT
TXD[8:5][3:0]
TXD[7:4][3:0]
TX_CTL
TXD[3:0]
TXD[8:5]
TXD[7:4]
TXD[4]
TXEN
TXD[9]
TXERR
tSKEWR
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[3:0]
RXD[8:5]
RXD[7:4]
tSKEWT
RX_CTL
RXD[4]
RXDV
RXD[9]
RXERR
tSKEWR
RX_CLK
(At PHY)
Figure 32. RGMII AC Timing and Multiplexing s
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
59
2.7.11
ATM/UTOPIA Timing
Table 49 provides the UTOPIA input and output AC timing specifications.
Table 49. UTOPIA AC Timing Specifications
Characteristic
Symbol
Min
Max
Unit
UTOPIA outputs—External clock delay
tUEKHOV
1
9
ns
UTOPIA outputs—External clock High Impedance
tUEKHOX
1
9
ns
UTOPIA inputs—External clock input setup time
tUEIVKH
4
ns
UTOPIA inputs—External clock input hold time
tUEIXKH
1
ns
Note:
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are
measured at the pin. Although the specifications generally reference the rising edge of the clock, these AC timing diagrams also
apply when the falling edge is the active edge.
Figure 33 provides the AC test load for the UTOPIA.
Z0 = 50 Ω
Output
RL = 50 Ω
VDD/2
Figure 33. UTOPIA AC Test Load
Figure 34 shows the UTOPIA timing with external clock.
UTOPIA CLK (input)
Input Signals:
UTOPIA
tUEIXKH
tUEIVKH
tUEKHOV
Output Signals:
UTOPIA
tUEKHOX
Figure 34. UTOPIA AC Timing (External Clock)
Figure 35 shows the UTOPIA timing with internal clock.
UTOPIA CLK (output)
Input Signals:
UTOPIA
Output Signals:
UTOPIA
tUIIVKH
tUIIXKH
tUIKHOV
tUIKHOX
Figure 35. UTOPIA AC Timing (Internal Clock)
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
60
Freescale Semiconductor
2.7.12
SPI Timing
Table 49 provides the SPI input and output AC timing specifications.
Table 50. SPI AC Timing Specifications 1
Symbol 2
Characteristic
Min
Max
Unit
6
ns
SPI outputs valid—Master mode (internal clock) delay
tNIKHOV
SPI outputs hold—Master mode (internal clock) delay
tNIKHOX
SPI outputs valid—Slave mode (external clock) delay
tNEKHOV
SPI outputs hold—Slave mode (external clock) delay
tNEKHOX
2
ns
SPI inputs—Master mode (internal clock input setup time
tNIIVKH
4
ns
SPI inputs—Master mode (internal clock input hold time
tNIIXKH
0
ns
SPI inputs—Slave mode (external clock) input setup time
tNEIVKH
4
ns
SPI inputs—Slave mode (external clock) input hold time
tNEIXKH
2
ns
0.5
ns
8
ns
Notes:
1. Output specifications are measured from the 50 percent level of the rising edge of CLKIN to the 50 percent level of the signal.
Timings are measured at the pin.
2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing
(NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X).
Figure 36 provides the AC test load for the SPI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 36. SPI AC Test Load
Figure 37 through Figure 38 represent the AC timings from Table 49. Note that although the specifications generally reference
the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the active edge.
Figure 37 shows the SPI timings in slave mode (external clock).
SPICLK (Input)
Input Signals:
SPIMOSI
(See Note)
tNEIVKH
tNEIXKH
tNEKHOX
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
Figure 37. SPI AC Timing in Slave Mode (External Clock)
Figure 38 shows the SPI timings in master mode (internal clock).
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
61
SPICLK (Output)
tNIIXKH
tNIIVKH
Input Signals:
SPIMISO
(See Note)
tNIKHOX
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
Figure 38. SPI AC Timing in Master Mode (Internal Clock)
2.7.13
GPIO Timing
Table 51. GPIO Timing
Characteristics
Symbol
Min
Max
Unit
REFCLK edge to GPIO out valid (GPIO out delay time)
tGPKHOV
-
6.9
ns
REFCLK edge to GPIO out not valid (GPIO out hold time)
tGPKHOX
1.3
-
ns
REFCLK edge to high impedance on GPIO out
tGPKHOZ
-
6.2
ns
GPIO in valid to REFCLK edge (GPIO in set-up time)
tGPIVKH
3.7
-
ns
REFCLK edge to GPIO in not valid (GPIO in hold time)
tGPIXKH
0.5
-
ns
Figure 39 shows the GPIO timing.
REFCLK
tGPKHOV
tGPKHOZ
GPIO
(Output)
High Impedance
tGPIVKH
GPIO
(Input)
tGPIXKH
Valid
Figure 39. GPIO Timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
62
Freescale Semiconductor
2.7.14
EE Signals
Table 52. EE Pin Timing
Characteristics
Symbol
EE (input)
tEEIN
EE (output)
tEEOUT
Notes:
1.
2.
Type
Min
Asynchronous
4 core clock periods
Synchronous to Core clock
1 core clock period
The ratio between the core clock and CLKOUT is configured during power-on-reset.
Refer to Table 1-4 on page 1-6 for details on EE pin functionality.
Figure 40 shows the signal behavior of the EE pins.
tEEIN
EE in
tEEOUT
EE out
Figure 40. EE Pin Timing
2.7.14.1
JTAG Signals
Table 53. JTAG Timing
All frequencies
Characteristics
Symbol
Unit
Min
Max
TCK cycle time
tTCKX
33.0
—
TCK clock high phase measured at VM = 1.6 V
tTCKH
13.0
—
ns
TCK rise and fall times
tTCKR
—
3.0
ns
Boundary scan input data set-up time
tBSVKH
0.0
—
ns
Boundary scan input data hold time
tBSXKH
10.0
—
ns
TCK fall to output data valid
tTCKHOV
—
20.0
ns
TCK fall to output high impedance
tTCKHOZ
—
24.0
ns
TMS, TDI data set-up time
tTDIVKH
0.0
—
ns
TMS, TDI data hold time
tTDIXKH
5.0
—
ns
TCK fall to TDO data valid
tTDOHOV
—
10.0
ns
TCK fall to TDO high impedance
tTDOHOZ
—
12.0
ns
tTRST
100.0
—
ns
TRST assert time
Note:
ns
All timings apply to OnCE module data transfers as well as any other transfers via the JTAG port.
Figure 41 Shows the Test Clock Input Timing Diagram
tTCKX
tTCKH
VM
TCK
(Input)
tTCKR
VM
tTCKR
Figure 41. Test Clock Input Timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
63
Figure 42 Shows the boundary scan (JTAG) timing diagram.
TCK
(Input)
tBSXKH
tBSVKH
Data
Inputs
Input Data Valid
tTCKHOV
Data
Outputs
Output Data Valid
tTCKHOZ
Data
Outputs
Figure 42. Boundary Scan (JTAG) Timing
Figure 43 Shows the test access port timing diagram
TCK
(Input)
tTDIVKH
TDI
TMS
(Input)
tTDIXKH
Input Data Valid
tTDOHOV
TDO
(Output)
Output Data Valid
tTDOHOZ
TDO
(Output)
Figure 43. Test Access Port Timing
Figure 44 Shows the TRST timing diagram.
TRST
(Input)
tTRST
Figure 44. TRST Timing
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
64
Freescale Semiconductor
Hardware Design Considerations
3
Hardware Design Considerations
The following sections discuss areas to consider when the MSC8144 device is designed into a system.
3.1
Start-up Sequencing Recommendations
3.1.1
Power-on Sequence
Use the following guidelines for power-on sequencing:
•
•
•
There are no dependencies in power-on/power-off sequence between VDDM3 and VDD supplies.
There are no dependencies in power-on/power-off sequence between RapidIO supplies: VDDSXC, VDDSXP,
VDDRIOPLL and other MSC8144 supplies.
VDDPLL should be coupled with the VDD power rail with extremely low impedance path.
External voltage applied to any input line must not exceed the related to this port I/O supply by more than 0.6 V at any time,
including during power-up. Some designs require pull-up voltages applied to selected input lines during power-up for
configuration purposes. This is an acceptable exception to the rule during start-up. However, each such input can draw up to 80
mA per input pin per MSC8144 device in the system during start-up. An assertion of the inputs to the high voltage level before
power-up should be with slew rate less than 4V/ns.
The following supplies should rise before any other supplies in any sequence
•
•
VDD and VDDPLL coupled together
VDDM3
After the above supplies rise to 90% of their nominal value the following I/O supplies may rise in any sequence (see Figure 45):
•
•
•
•
•
•
VDDGE1
VDDGE2
VDDIO
VDDDDR and MVREF coupled one to another. MVREF should be either at same time or after VDDDDR.
VDDM3IO
V25M3
I/O supplies
VDDM3, VDD, and VDDPLL
90%
Figure 45. VDDM3, VDDM3IO and V25M3 Power-on Sequence
Note:
1.
2.
3.
4.
5.
6.
This recommended power sequencing is different from the MSC8122/MSC8126.
If no pins that require VDDGE1 as a reference supply are used (see Table 1), VDDGE1 can be tied to GND.
If no pins that require VDDGE2 as a reference supply are used (see Table 1), VDDGE2 can be tied to GND.
If the DDR interface is not used, VDDDDR and MVREF can be tied to GND.
If the M3 memory is not used, VDDM3, VDDM3IO, and V25M3 can be tied to GND.
If the RapidIO interface is not used, VDDSX, VDDSXP, and VDDRIOPLL can be tied to GND.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
65
Hardware Design Considerations
3.1.2
Start-Up Timing
Section 2.7.1 describes the start-up timing.
3.2
Power Supply Design Considerations
3.2.1
PLL Supplies
Each PLL supply must have an external RC filter for the VDDPLL input. The filter is a 10 Ω resistor in series with two 2.2 μF,
low ESL (<0.5 nH) and low ESR capacitors. All three PLLs can connect to a single supply voltage source (such as a voltage
regulator) as long as the external RC filter is applied to each PLL separately (see Figure 46). For optimal noise filtering, place
the circuit as close as possible to its VDDPLL inputs. These traces should be short and direct.
MSC8144
10 Ω
Voltage Regulator
VDDPLL0
2.2 μF
2.2 μF
10 Ω
VDDPLL0
2.2 μF
2.2 μF
10 Ω
VDDPLL0
2.2 μF
2.2 μF
Figure 46. PLL Supplies
3.2.2
Other Supplies
TBD
3.3
Note:
Connectivity Guidelines
Although the package actually uses a ball grid array, the more conventional term pin is used to denote signal
connections in this discussion.
First, select the pin multiplexing mode to allocate the required I/O signals. Then use the guidelines presented in the following
subsections for board design and connections. The following conventions are used in describing the connectivity requirements:
1.
GND indicates using a 10 kΩ pull-down resistor (recommended) or a direct connection to the ground plane. Direct
connections to the ground plane may yield DC current up to 50mA through the I/O supply that adds to overall power
consumption.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
66
Freescale Semiconductor
Hardware Design Considerations
2.
3.
4.
5.
Note:
VDD indicates using a 10 kΩ pull-up resistor (recommended) or a direct connection to the appropriate power supply.
Direct connections to the supply may yield DC current up to 50mA through the I/O supply that adds to overall power
consumption.
Mandatory use of a pull-up or pull-down resistor it is clearly indicated as “pull-up/pull-down”.
NC indicates “not connected” and means do not connect anything to the pin.
The phrase “in use” indicates a typical pin connection for the required function.
Please see recommendations #1 and #2 as mandatory pull-down or pull-up connection for unused pins in case of
subset interface connection.
3.3.1
DDR Memory Related Pins
This section discusses the various scenarios that can be used with DDR1 and DDR2 memory.
Note:
For information about unused differential/non-differential pins in DDR1/DDR2 modes (that is, unused negative lines
of strobes in DDR1), please refer to Table 54.
3.3.1.1
DDR Interface Is Not Used
Table 54. Connectivity of DDR Related Pins When the DDR Interface Is Not Used
Signal Name
Pin Connection
MDQ[0–31]
NC
MDQS[0–3]
NC
MDQS[0–3]
NC
MA[0–15]
NC
MCK[0–2]
NC
MCK[0–2]
NC
MCS[0–1]
NC
MDM[0–3]
NC
MBA[0–2]
NC
MCAS
NC
MCKE[0–1]
NC
MODT[0–1]
NC
MDIC[0–1]
NC
MRAS
NC
MWE
NC
MECC[0–7]
NC
ECC_MDM
NC
ECC_MDQS
NC
ECC_MDQS
NC
MVREF
GND
VDDDDR
GND
Note:
If the DDR controller is not used, disable the internal DDR clock by writing a 1 to the CLK11DIS bit in the System Clock Control
Register (SCCR[CLK!11DIS]). See Chapter 7, Clocks, in the MSC8144 Reference Manual for details.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
67
Hardware Design Considerations
3.3.1.2
16-Bit DDR Memory Only
Table 55 lists unused pin connection when using 16-bit DDR memory. The 16 most significant data lines are not used.
Table 55. Connectivity of DDR Related Pins When Using 16-bit DDR Memory Only
Signal Name
Pin connection
MDQ[0–15]
in use
MDQ[16–31]
pull-up to VDDDDR
MDQS[0–1]
in use
MDQS[2–3]
pull-down to GND
MDQS[0–1]
in use
MDQS[2–3]
pull-up to VDDDDR
MA[0–15]
in use
MCK[0–2]
in use
MCK[0–2]
in use
MCS[0–1]
in use
MDM[0–1]
in use
MDM[2–3]
NC
MBA[0–2]
in use
MCAS
in use
MCKE[0–1]
in use
MODT[0–1]
in use
MDIC[0–1]
in use
MRAS
in use
MWE
in use
MVREF
1/2*VDDDDR
VDDDDR
2.5 V or 1.8 V
3.3.1.3
ECC Unused Pin Connections
When the error code corrected mechanism is not used in any 32- or 16-bit DDR configuration, refer to Table 56 to determine
the correct pin connections.
Table 56. Connectivity of Unused ECC Mechanism Pins
Signal Name
Pin connection
MECC[0–7]
pull-up to VDDDDR
ECC_MDM
NC
ECC_MDQS
pull-down to GND
ECC_MDQS
pull-up to VDDDDR
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
68
Freescale Semiconductor
Hardware Design Considerations
3.3.2
Serial RapidIO Interface Related Pins
3.3.2.1
Serial RapidIO interface Is Not Used
Table 57. Connectivity of Serial RapidIO Interface Related Pins When the RapidIO Interface Is Not Used
Signal Name
Pin Connection
SRIO_IMP_CAL_RX
GND
SRIO_IMP_CAL_TX
GND
SRIO_REF_CLK
GND
SRIO_REF_CLK
GND
SRIO_RXD[0–3]
GND
SRIO_RXD[0–3]
GND
SRIO_TXD[0–3]
NC
SRIO_TXD[0–3]
NC
VDDRIOPLL
GND
GNDRIOPLL
GND
GNDSXP
GND
GNDSXC
GND
VDDSXP
GND
VDDSXC
GND
3.3.2.2
Serial RapidIO Specific Lane Is Not Used
Table 58. Connectivity of Serial RapidIO Related Pins When Specific Lane Is Not Used
Signal Name
Pin Connection
SRIO_IMP_CAL_RX
in use
SRIO_IMP_CAL_TX
in use
SRIO_REF_CLK
in use
SRIO_REF_CLK
in use
SRIO_RXDx
GNDSXC
SRIO_RXDx
GNDSXC
SRIO_TXDx
NC
SRIO_TXDx
NC
VDDRIOPLL
in use
GNDRIOPLL
in use
GNDSXP
GNDSXP
GNDSXC
GNDSXC
VDDSXP
1.0 V
VDDSXC
1.0 V
Note:
The x indicates the lane number {0,1,2,3} for all unused lanes.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
69
Hardware Design Considerations
3.3.3
M3 Memory Related Pins
Table 59. Connectivity of M3 Related Pins When M3 Memory Is Not Used
Signal Name
M3_RESET
Pin Connection
NC
V25M3
GND
VDDM3
GND
VDDM3IO
GND
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
70
Freescale Semiconductor
Hardware Design Considerations
3.3.4
Ethernet Related Pins
3.3.4.1
Note:
Ethernet Controller 1 (GE1) Related Pins
Table 60 and Table 61 assume that the alternate function of the specified pin is not used. If the alternate function is
used, connect the pin as required to support that function.
3.3.4.1.1
GE1 Interface Is Not Used
Table 60 assumes that the GE1 signals are not used for any purpose (including any multiplexed functions) and that VDDGE1 is
tied to GND.
Table 60. Connectivity of GE1 Related Pins When the GE1 Interface Is Not Used
Signal Name
Pin Connection
GE1_COL
NC
GE1_CRS
NC
GE1_RD[0–4]
NC
GE1_RX_ER
NC
GE1_RX_CLK
NC
GE1_RX_DV
NC
GE1_SGMII_RX
GNDSXC
GE1_SGMII_RX
GNDSXC
GE1_SGMII_TX
NC
GE1_SGMII_TX
NC
GE1_TD[0–4]
NC
GE1_TX_CLK
NC
GE1_TX_EN
NC
GE1_TX_ER
NC
3.3.4.1.2
Subset of GE1 Pins Required
When only a subset of the whole GE1 interface is used, such as for RMII, the unused GE1 pins should be connected as described
in Table 61. This table assumes that the unused GE1 pins are not used for any purpose (including any multiplexed function) and
that VDDGE1 is tied to either 2.5 V or 3.3 V.
Table 61. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required
Signal Name
Pin Connection
GE1_COL
GND
GE1_CRS
GND
GE1_RD[0–3]
GND
GE1_RX_ER
GND
GE1_RX_CLK
GND
GE1_RX_DV
GND
GE1_SGMII_RX
GNDSXC
GE1_SGMII_RX
GNDSXC
GE1_SGMII_TX
NC
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
71
Hardware Design Considerations
Table 61. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required (continued)
Signal Name
Pin Connection
GE1_SGMII_TX
NC
GE1_TD[0-3]
NC
GE1_TX_CLK
GND
GE1_TX_EN
NC
GE1_TX_ER
NC
3.3.4.2
Note:
Ethernet Controller 2 (GE2) Related Pins
Table 62 and Table 64 assume that the alternate function of the specified pin is not used. If the alternate function is
used, connect the pin as required to support that function.
3.3.4.2.1
GE2 interface Is Not Used
Table 62 assumes that the GE2 pins are not used for any purpose (including any multiplexed function) and that VDDGE2 is tied
to GND.
Table 62. Connectivity of GE2 Related Pins When the GE2 Interface Is Not Used
Signal Name
Pin Connection
GE2_RD[0-3]
NC
GE2_RX_CLK
NC
GE2_RX_DV
NC
GE2_RX_ER
NC
GE2_SGMII_RX
GNDSXC
GE2_SGMII_RX
GNDSXC
GE2_SGMII_TX
NC
GE2_SGMII_TX
NC
GE2_TCK
Nc
GE2_TD[0–3]
Nc
GE2_TX_EN
NC
3.3.4.2.2
Subset of GE2 Pins Required
When only a subset of the whole GE2 interface is used, such as for RMII, the unused GE2 pins should be connected as described
in Table 63. The table assumes that the unused GE2 pins are not used for any purpose (including any multiplexed functions)
and that VDDGE2 is tied to either 2.5 V or 3.3 B.
Table 63. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required
Signal Name
Pin Connection
GE2_RD[0-3]
GND
GE2_RX_CLK
GND
GE2_RX_DV
GND
GE2_RX_ER
GND
GE2_SGMII_RX
GNDSXC
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
72
Freescale Semiconductor
Hardware Design Considerations
Table 63. Connectivity of GE1 Related Pins When only a subset of the GE1 Interface Is required (continued)
Signal Name
Pin Connection
GE2_SGMII_RX
GNDSXC
GE2_SGMII_TX
NC
GE2_SGMII_TX
NC
GE2_TCK
NC
GE2_TD[0–3]
NC
GE2_TX_EN
NC
3.3.4.3
GE1 and GE2 Management Pins
GE_MDC and GE_MDIO pins should be connected as required by the specified protocol. If neither GE1 nor GE2 is used (that
is, VDDGE2 is connected to GND), Table 64 lists the recommended management pin connections.
Table 64. Connectivity of GE Management Pins When GE1 and GE2 Are Not Used
Signal Name
Pin Connection
GE_MDC
NC
GE_MDIO
NC
3.3.5
UTOPIA Related Pins
Table 65 lists the board connections of the UTOPIA pins when the entire UTOPIA interface is not used or subset of UTOPIA
interface is used. For multiplexing options that select a subset of the UTOPIA interface, use the connections described in
Table 65 for those signals that are not selected. Table 65 assumes that the alternate function of the specified pin is not used. If
the alternate function is used, connect that pin as required to support the selected function.
Table 65. Connectivity of UTOPIA Related Pins When UTOPIA Interface Is Not Used
Signal Name
Pin Connection
UTP_IR
GND
UTP_RADDR[0–4]
VDDIO
UTP_RCLAV_PDRPA
NC
UTP_RCLK
GND
UTP_RD[0–15]
GND
UTP_REN
VDDIO
UTP_RPRTY
GND
UTP_RSOC
GND
UTP_TADDR[0–4]
VDDIO
UTP_TCLAV
UTP_TCLK
UTP_TD[0–15]
UTP_TEN
NC
GND
NC
VDDIO
UTP_TPRTY
NC
UTP_TSOC
NC
VDDIO
3.3 V
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
73
Hardware Design Considerations
3.3.6
TDM Interface Related Pins
Table 66 lists the board connections of the TDM pins when an entire specific TDM is not used. For multiplexing options that
select a subset of a TDM interface, use the connections described in Table 66 for those signals that are not selected. Table 66
assumes that the alternate function of the specified pin is not used. If the alternate function is used, connect that pin as required
to support the selected function.
Table 66. Connectivity of TDM Related Pins When TDM Interface Is Not Used
Signal Name
Pin Connection
TDMxRCLK
GND
TDMxRDAT
GND
TDMxRSYN
GND
TDMxTCLK
GND
TDMTxDAT
GND
TDMxTSYN
GND
VDDIO
3.3 V
Notes:
1.
2.
3.3.7
x = {0, 1, 2,3, 4, 5, 6, 7}
In case of subset of TDM interface usage please make sure to disable unused TDM modules. See Chapter 20, TDM, in the
MSC8144 Reference Manual for details.
PCI Related Pins
Table 67 lists the board connections of the pins when PCI is not used. Table 67 assumes that the alternate function of the
specified pin is not used. If the alternate function is used, connect that pin as required to support the selected function.
Table 67. Connectivity of PCI Related Pins When PCI Is Not Used
Signal Name
Pin Connection
PCI_AD[0–31]
GND
PCI_CBE[0–3]
GND
PCI_CLK_IN
GND
PCI_DEVSEL
VDDIO
PCI_FRAME
VDDIO
PCI_GNT
VDDIO
PCI_IDS
GND
PCI_IRDY
VDDIO
PCI_PAR
GND
PCI_PERR
VDDIO
PCI_REQ
NC
PCI_SERR
VDDIO
PCI_STOP
VDDIO
PCI_TRDY
VDDIO
VDDIO
3.3 V
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
74
Freescale Semiconductor
Hardware Design Considerations
3.3.8
Miscellaneous Pins
Table 68 lists the board connections for the pins if they are required by the system design. Table 68 assumes that the alternate
function of the specified pin is not used. If the alternate function is used, connect that pin as required to support the selected
function.
Table 68. Connectivity of Individual Pins When They Are Not Required
Signal Name
Pin Connection
CLKOUT
NC
EE0
GND
EE1
NC
GPIO[0–31]
NC
SCL
See the GPIO connectivity guidelines in this table.
SDA
See the GPIO connectivity guidelines in this table.
NC
INT_OUT
IRQ[0–15]
See the GPIO connectivity guidelines in this table.
VDDIO
NMI
NMI_OUT
NC
RC[0–16]
GND
RC_LDF
NC
STOP_BS
GND
TCK
GND
TDI
GND
TDO
NC
TMR[0–4]
See the GPIO connectivity guidelines in this table.
TMS
GND
TRST
GND
URXD
See the GPIO connectivity guidelines in this table.
UTXD
See the GPIO connectivity guidelines in this table.
3.3 V
VDDIO
Note:
Note:
3.4
When using I/O multiplexing mode 5 or 6, tie the TDM7TSYN/PCI_AD4 signal (ball number AC9) to GND.
For details on configuration, see the MSC8144 Reference Manual. For additional information, refer to the MSC8144
Design Checklist (AN3202).
External DDR SDRAM Selection
TBD
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
75
Ordering Information
3.5
Thermal Considerations
An estimation of the chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (RθJA × PD)
Equation 1
where
TA = ambient temperature near the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = PINT + PI/O = power dissipation in the package (W)
PINT = IDD × VDD = internal power dissipation (W)
PI/O = power dissipated from device on output pins (W)
The power dissipation values for the MSC8144 are listed in Table 5. The ambient temperature for the device is the
air temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances
are JEDEC standard values that provide a quick and easy estimation of thermal performance. There are two values
in common usage: the value determined on a single layer board and the value obtained on a board with two planes.
The value that more closely approximates a specific application depends on the power dissipated by other
components on the printed circuit board (PCB). The value obtained using a single layer board is appropriate for
tightly packed PCB configurations. The value obtained using a board with internal planes is more appropriate for
boards with low power dissipation (less than 0.02 W/cm2 with natural convection) and well separated components.
Based on an estimation of junction temperature using this technique, determine whether a more detailed thermal
analysis is required. Standard thermal management techniques can be used to maintain the device thermal junction
temperature below its maximum. If TJ appears to be too high, either lower the ambient temperature or the power
dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small
diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case
that is painted black. The MSC8144 device case surface is too shiny (low emissivity) to yield an accurate infrared
temperature measurement. Use the following equation to determine TJ:
TJ = TT + (θJA × PD)
Equation 2
where
TT = thermocouple (or infrared) temperature on top of the package (°C)
θJA = thermal characterization parameter (°C/W)
PD = power dissipation in the package (W)
4
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
MSC8144
Package Type
Flip Chip Plastic Ball Grid Array (FC-PBGA)
Spheres
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
Lead-free
1.0 V
–40° to 105°C
800
TBD
0° to 90°C
1000
TBD
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
76
Freescale Semiconductor
Package Information
5
Package Information
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Maximum solder ball diameter
measured parallel to Datum A.
4. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
5. Parallelism measurement
should exclude any effect of
marking.
6. Capacitors may not be present
on all devices.
7. Caution must be taken not to
short exposed metal capacitor
pads on package top.
CASE NO. 1842-02
Figure 47. MSC8144 Mechanical Information, 783-ball FC-PBGA Package
6
Product Documentation
•
•
•
•
•
MSC8144 Technical Data Sheet (MSC8144). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8144 device.
MSC8144 Reference Manual (MSC8144RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8144 device.
SC3400 DSP Core Reference Manual. Covers the SC3400 core architecture, control registers, clock registers, program
control, and instruction set.
MSC8144 SC3400 DSP Core Subsystem Reference Manual. Covers core subsystem architecture, functionality, and
registers.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
77
Revision History
7
Revision History
Table 69 provides a revision history for this data sheet.
Table 69. Document Revision History
Revision
Date
Description
0
Feb. 2007
• Initial public release.
1
Apr. 2007
•
•
•
•
•
•
•
•
•
•
Adds new I/O multiplexing mode 7 that supports POS functionality.
Updates reference voltage supply for pins G5, H7, and H8 in Table 1.
Updates start-up timing recommendations with regard to TRST and M3_RESET in Section 2.7.1.
Adds input clock duty cycles in Table 20.
Updates PCI AC timings in Table 38.
Removes UTOPIA internal clock specifications in Table 49.
Updates JTAG timings in Table 53.
Clarifies connectivity guidelines for Ethernet pins in Section 3.3.4.
Miscellaneous pin connectivity guidelines were updated in Table 68.
Updates name of core subsystem reference manual.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
78
Freescale Semiconductor
Revision History
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
79
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Document Number: MSC8144
Rev. 1
5/2007
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