GS8170DD36C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x2Lp CMOS I/O Double Data Rate SigmaRAM™ Features • Double Data Rate Read and Write mode • Late Write; Pipelined read operation • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • 2 user-programmable chip enable inputs • IEEE 1149.1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices SigmaRAM Family Overview GS8170DD36 SigmaRAMs are built in compliance with the SigmaRAM pinout standard for synchronous SRAMs. They are 18,874,368-bit (18Mb) SRAMs. This family of wide, very low voltage CMOS I/O SRAMs is designed to operate at the speeds needed to implement economical high performance networking systems. ΣRAMs are offered in a number of configurations including Late Write, Double Late Write, and Double Data Rate (DDR). The logical differences between the protocols employed by these RAMs mainly involve various approaches to write 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O cueing and data transfer rates. The ΣRAM™ family standard allows a user to implement the interface protocol best suited to the task at hand. Functional Description Because SigmaRAMs are synchronous devices, address data inputs and read/write control inputs are captured on the rising edge of the input clock. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing. In DDR mode the device captures Data In on both rising and falling edges of clock and drives data on both clock edges as well. Because the DDR ΣRAM always transfers data in two halves, A0 is internally set to 0 for the first half of each read or write transfer, and automatically incremented to 1 for the falling edge transfer. The address field of a DDR ΣRAM is always one address pin less than the advertised index depth (e.g., the 512k x 36 has a 512k addressable index). ΣRAMs support pipelined reads utilizing a rising-edgetriggered output register. DDR ΣRAMs incorporate risingand falling-edge-triggered output registers. They also utilize a Dual Cycle Deselect (DCD) output deselect protocol. ΣRAMs are implemented with high performance CMOS technology and are packaged in a 209-bump BGA. Parameter Synopsis Rev: 2.03 1/2005 Key Fast Bin Specs Symbol - 333 Cycle Time tKHKH 3.0 ns Access Time tKHQV 1.8 ns 1/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 512K x 36 Common I/O—Top View (Package C) 1 2 3 4 5 6 7 8 9 10 11 A NC NC A E2 A ADV A E3 A DQb DQb B NC NC MCL NC A W A MCL NC DQb DQb C NC NC NC MCL NC (144M) E1 NC NC MCL DQb DQb D NC NC VSS NC NC MCL NC NC VSS DQb DQb E NC DQc VDDQ VDDQ VDD VDD VDD VDDQ VDDQ NC DQb F DQc DQc VSS VSS VSS ZQ VSS VSS VSS NC NC G DQc DQc VDDQ VDDQ VDD EP2 VDD VDDQ VDDQ NC NC H DQc DQc VSS VSS VSS EP3 VSS VSS VSS NC NC J DQc DQc VDDQ VDDQ VDD MCH VDD VDDQ VDDQ NC NC K CQ2 CQ2 CK NC VSS MCL VSS NC NC CQ1 CQ1 L NC NC VDDQ VDDQ VDD MCL VDD VDDQ VDDQ DQa DQa M NC NC VSS VSS VSS MCH VSS VSS VSS DQa DQa N NC NC VDDQ VDDQ VDD MCH VDD VDDQ VDDQ DQa DQa P NC NC VSS VSS VSS MCL VSS VSS VSS DQa DQa R DQd NC VDDQ VDDQ VDD VDD VDD VDDQ VDDQ DQa NC T DQd DQd VSS NC NC MCL NC NC VSS NC NC U DQd DQd NC A NC (72M) A NC (36M) A NC NC NC V DQd DQd A A A A1 A A A NC NC W DQd DQd TMS TDI A MCL A TDO TCK NC NC 11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch • 2002.06 • Note: Users of CMOS I/O SigmaRAMs may wish to connect “NC, VREF” and the “NC, CK” pins to VREF (i.e., VDDQ/2) to allow alternate use of future HSTL I/O SigmaRAMs. Rev: 2.03 1/2005 2/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Pin Description Table Symbol Description Type Comments A Address Input — ADV Advance Input Active High W Write Enable Input Active Low E1 Chip Enable Input Active Low E2 & E3 Chip Enable Input Programmable Active High or Low EP2 & EP3 Chip Enable Program Pin Mode Input To be tied directly to VDD, VDDQ or VSS CK Clock Input Active High CQ, CQ Echo Clock Output Three State - Deselect via E2 or E3 False DQ Data I/O Input/Output Three State MCH Must Connect High Input Active High To be tied directly to VDD or VDDQ MCL Must Connect Low Input Active Low To be tied directly to VSS ZQ Output Impedance Control Mode Input Low = Low Impedance [High Drive] High = High Impedance [Low Drive] To be tied directly to VDDQ or VSS TCK Test Clock Input Active High TDI Test Data In Input — TDO Test Data Out Output — TMS Test Mode Select Input — NC No Connect — Not connected to die or any other pin VDD Core Power Supply Input 1.8 V Nominal VDDQ Output Driver Power Supply Input 1.8 V Nominal VSS Ground Input — Operation Control All address, data and control inputs (with the exception of EP2, EP3, ZQ, and the mode pins, L6, M6, and J6) are synchronized to rising clock edges. Data in is captured on both rising and falling edges of CK. Read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2, and E3). Deassertion of any one of the Enable inputs will deactivate the device. It should be noted that ONLY deactivation of the RAM via E2 and/or E3 deactivates the Echo Clocks, CQ1–CQ2. Rev: 2.03 1/2005 3/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Read Operations Double Data Rate Read In applications where a data rate markedly faster than the RAM’s latency is desired, the Double Data Rate protocol doubles the data transfer rate (read or write bandwidth) achieved in Pipeline mode while keeping the RAM’s clock frequency constant. In Double Data Rate mode, the RAM multiplexes the results of a read out of the RAM on half the usual number of data pins. The output register/mux behaves just as if it were in Pipeline mode for the first transfer, but then makes a second transfer in response to the next falling edge of clock as well. SigmaRAM DDR RAMs burst in linear order only. Double Data Rate Pipelined Read Read Deselect Read Read Read A XX C D E CK Address F ADV /E1 /W QA0 QA1 QC0 QC1 QD0 QD1 DQ CQ Key Hi-Z Access Write Operations Write operation occurs when the following conditions are satisfied at the rising edge of clock: All three chip enables (E1, E2, and E3) are active, the write enable input signal (W) is asserted low, and ADV is asserted low. Double Data Rate Write A Double Data Rate Write is a specialized form of Late Write. In Double Data Rate mode, the RAM will capture Data In on both rising and falling edges of the RAM clock, CK, beginning with the rising edge of clock that follows the capture of the write address and command. Rev: 2.03 1/2005 4/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 SigmaRAM Double Data Rate Read and Write Read Deselect Write Read Read A B C D E CK Address F ADV /E1 /W QA0 QA1 DC0 DC1 QD0 QD1 DQ CQ Key Hi-Z Rev: 2.03 1/2005 Access 5/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Special Functions Burst Cycles SRAMs provide an on-chip burst address generator that can be utilized, if desired, to simplify burst read or write implementations. The ADV control pin, when driven high, commands the SRAM to advance the internal address counter and use the counter generated address to read or write the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM by driving the ADV pin low, into Load mode. SigmaRAM DDR Burst Read with Counter Wrap-around Read Continue Continue Read Continue External Address A2 XX XX B0 XX Internal Address A2 CK A3 A0 A1 A2 A3 B0 B1 XX B2 B3 B1 ADV Counter Wraps /E1 /W QA2 QA3 QA0 QA1 QA2 QA3 QB0 QB1 DQ CQ Rev: 2.03 1/2005 6/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 SigmaRAM DDR Burst Write with Counter Wrap-around Write Continue Continue Write Continue External Address A2 XX XX B0 XX Internal Address A2 CK A3 A0 A1 A2 A3 XX B0 B1 B2 B3 B1 DA2 DA3 DB0 DB1 DB2 Counter Wraps ADV /E1 /W DQ DA2 DA3 DA0 DA1 CQ Rev: 2.03 1/2005 7/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Burst Order The burst address counter wraps around to its initial state after four internal addresses (the loaded address and three more) have been accessed. SigmaRAMs always count in linear burst order. Linear Burst Order A[1:0] 1st address (Rising Edge CK) 00 10 2nd address (Falling Edge CK) 01 11 3rd address (Rising Edge CK) 10 00 4th address (Falling Edge CK) 11 01 Notes: 1. The burst counter wraps to initial state on the 3rd rising edge of clock. 2. The DDR SigmaRAM always begins an read or write at A0 = 0. A0 is internally set to 0 at the rising edge of clock and is not available to the user. Echo Clock ΣRAMs feature Echo Clocks, CQ1, CQ2, CQ1, and CQ2 that track the performance of the output drivers. The Echo Clocks are delayed copies of the main RAM clock, CK. Echo Clocks are designed to track changes in output driver delays due to variance in die temperature and supply voltage. The Echo Clocks are designed to fire with the rest of the data output drivers. SigmaRAMs provide both in-phase, or true, Echo Clock outputs (CQ1 and CQ2) and inverted Echo Clock outputs (CQ1 and CQ2). It should be noted that deselection of the RAM via E2 and E3 also deselects the Echo Clock output drivers. The deselection of Echo Clock drivers is always pipelined to the same degree as output data. Deselection of the RAM via E1 does not deactivate the Echo Clocks. Programmable Enables ΣRAMs feature two user-programmable chip enable inputs, E2 and E3. The sense of the inputs, whether they function as active low or active high inputs, is determined by the state of the programming inputs, EP2 and EP3. For example, if EP2 is held at VDD, E2 functions as an active high enable. If EP2 is held to VSS, E2 functions as an active low chip enable input. Programmability of E2 and E3 allows four banks of depth expansion to be accomplished with no additional logic. By programming the enable inputs of four SRAMs in binary sequence (00, 01, 10, 11) and driving the enable inputs with two address inputs, four SRAMs can be made to look like one larger RAM to the system. Rev: 2.03 1/2005 8/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Example Four Bank Depth Expansion Schematic—Σ1x2Lp A1–An E1 CK W DQ0–DQn A1–An – 2 An – 1 An Bank 0 Bank 1 A1–An – 2 A E3 An – 1 E2 An A1–An – 2 A Bank 3 Bank 2 E3 An – 1 E2 An A1–An – 2 A A E3 An – 1 E3 E2 An E2 E1 E1 E1 E1 CK CK CK CK EP3 0 W EP3 1 W EP3 0 W EP3 1 DQ EP2 CQ 0 DQ EP2 0 DQ EP2 CQ 1 DQ EP2 CQ 1 W CQ CQ Bank Enable Truth Table Rev: 2.03 1/2005 EP2 EP3 E2 E3 Bank 0 VSS VSS Active Low Active Low Bank 1 VSS VDD Active Low Active High Bank 2 VDD VSS Active High Active Low Bank 3 VDD VDD Active High Active High 9/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Echo Clock Control in Two Banks of Double Data Rate SigmaRAMs Read Read Read Read Read A B C D E CK Address F ADV /E2 Bank 1 E2 Bank 2 QA0 QA1 QC0 QC1 DQ Bank 1 CQ Bank 1 CQ1 + CQ2 CQ Bank 2 QB0 QB1 QD0 QD1 DQ Bank 2 Note: E1\ does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false. It should be noted that deselection of the RAM via E2 and E3 also deselects the Echo Clock output drivers. The deselection of Echo Clock drivers is always pipelined to the same degree as output data. Deselection of the RAM via E1 does not deactivate the Echo Clocks. In some applications it may be appropriate to pause between banks; to deselect both RAMs with E1 before resuming read operations. An E1 deselect at a bank switch will allow at least one clock to be issued from the new bank before the first read cycle in the bank. Although the following drawing illustrates a E1 read pause upon switching from Bank 1 to Bank 2, a write to Bank 2 would have the same effect, causing the RAM in Bank 2 to issue at least one clock before it is needed. Rev: 2.03 1/2005 10/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 SigmaRAM DDR Bank Switch with E1 Deselect Read No Op Read Read Read A XX C D E CK Address F ADV /E1 /E2 Bank 1 E2 Bank 2 QA0 QA1 DQ Bank 1 CQ Bank 1 CQ1 + CQ2 CQ Bank 2 QC0 QC1 QD0 QD1 DQ Bank 2 Note: E1\ does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false. CMOS Output Driver Impedance Control CMOS I/O SigmaRAMs are supplied with selectable (high or low) impedance output drivers. The ZQ pin allows selection between SRAM nominal drive strength (ZQ low) for multi-drop bus applications and low drive strength (ZQ high) point-to-point applications. Rev: 2.03 1/2005 11/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 DDR Late Write, Pipelined Read Truth Table CK E1 E (tn) (tn) ADV (tn) W (tn) Previous Operation Current Operation DQ/CQ (tn) DQ/CQ (tn+½) DQ/CQ (tn+1) DQ/CQ (tn+1½) 0→ 1 X F 0 X X Bank Deselect ***/*** Hi-Z/Hi-Z 0→ 1 X X 1 X Bank Deselect Bank Deselect (Continue) Hi-Z/Hi-Z Hi-Z/Hi-Z 0→ 1 1 T 0 X X Deselect ***/*** Hi-Z/CQ 0→ 1 X X 1 X Deselect Deselect (Continue) Hi-Z/CQ Hi-Z/CQ 0→ 1 0 T 0 0 X Write Loads new address ***/*** 0→ 1 X X 1 X Write Write Continue Increments address by 2 0→ 1 0 T 0 1 X Read Loads new address 0→ 1 X X 1 X Read Read Continue Increments address by 2 Dn-2/CQ Dn-1/CQ ***/*** Qn-2/CQ Qn-2/CQ D1/CQ D2/CQ Dn/CQ Dn+1/CQ Q1/CQ Q2/CQ Qn/CQ Qn+1/CQ Notes: 1. If E2 = EP2 and E3 = EP3 then E = “T” else E = “F”. 2. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”. 3. “***” indicates that the DQ input requirement / output state and CQ output state are determined by the previous operation. 4. DQs are tri-stated in response to Bank Deselect, Deselect, and Write commands, one full cycle after the command is sampled. 5. CQs are tri-stated in response to Bank Deselect commands only, one full cycle after the command is sampled. 6. One (1) Continue operation may be initiated after a Read or Write operation is initiated to burst transfer a total of four (4) distinct pieces of data per single external address input. If a second (2nd) Continue operation is initiated, the internal address wraps back to the initial external (base) address. Rev: 2.03 1/2005 12/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Common I/O State Diagram X,F,0,X or X,X,1,X Bank Deselect 0,T,0,1 0,T,0,0 1,T,0,X X,F,0,X Deselect 0,T,0,1 0,T,0,0 1,T,0,X or X,X,1,X 1,T,0,X 1,T,0,X 0,T,0,0 Read Write 0,T,0,1 X,F,0,X 0,T,0,1 X,X,1,X X,F,0,X X,X,1,X 0,T,0,1 1,T,0,X X,F,0,X 0,T,0,0 Read Continue 0,T,0,0 0,T,0,1 X,F,0,X X,X,1,X n Input Command Code 1,T,0,X Write Continue X,X,1,X Key 0,T,0,0 n+1 n+2 n+3 Clock (CK) ƒ Transition Current State (n) Next State (n + 1) ƒ Command Current State ƒ ƒ ƒ Next State Current State & Next State Definition for Read/Write Control State Diagram Notes: 1. The notation “X,X,X,X” controlling the state transitions above indicate the states of inputs E1, E, ADV, and W respectively. 2. If (E2 = EP2 and E3 = EP3) then E = “T” else E = “F”. 3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”. Rev: 2.03 1/2005 13/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Absolute Maximum Ratings (All voltages reference to VSS) Symbol Description Value Unit VDD Voltage on VDD Pins –0.5 to 2.5 V VDDQ Voltage in VDDQ Pins –0.5 to VDD V VI/O Voltage on I/O Pins –0.5 to VDDQ + 0.5 (≤ 2.5 V max.) V VIN Voltage on Other Input Pins –0.5 to VDDQ + 0.5 (≤ 2.5 V max.) V IIN Input Current on Any Pin +/–100 mA dc IOUT Output Current on Any I/O Pin +/–100 mA dc TJ Maximum Junction Temperature 125 oC TSTG Storage Temperature –55 to 125 ºC Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect reliability of this component. Recommended Operating Conditions Power Supplies Parameter Symbol Min. Typ. Max. Unit Notes Supply Voltage VDD 1.7 1.8 1.95 V 1.8 V I/O Supply Voltage VDDQ 1.7 1.8 VDD V Ambient Temperature (Commercial Range Versions) TA 0 25 70 °C 1 Ambient Temperature (Industrial Range Versions) TA –40 25 85 °C 1 Note: The part number of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. CMOS I/O DC Input Characteristics Parameter Symbol Min. Typ. Max. Unit Notes CMOS Input High Voltage VIH 0.65 * VDDQ — VDDQ + 0.3 V 1 CMOS Input Low Voltage VIL –0.3 — 0.35 * VDDQ V 1 Note: For devices supplied with CMOS input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers. Rev: 2.03 1/2005 14/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Undershoot Measurement and Timing Overshoot Measurement and Timing VIH 20% tKC VDD + 1.0 V VSS 50% 50% VDD VSS – 1.0 V 20% tKC VIL Capacitance (TA = 25oC, f = 1 MHZ, VDD = 1.8 V) Parameter Symbol Test conditions Typ. Max. Unit Input Capacitance CIN VIN = 0 V 4 5 pF Output Capacitance COUT VOUT = 0 V 6 7 pF Note: This parameter is sample tested. AC Test Conditions Parameter Conditions Input high level VDDQ Input low level 0V Max. input slew rate 2 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 AC Test Load Diagram DQ RQ = 250 Ω (HSTL I/O) 50Ω VT = VDDQ/2 Rev: 2.03 1/2005 15/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Input and Output Leakage Characteristics Parameter Symbol Test Conditions Min. Max Notes Input Leakage Current (except mode pins) IIL VIN = 0 to VDDQ –2 uA 2 uA — ZQ, MCH, MCL, EP2, EP3 Pin Input Current IINM VIN = 0 to VDDQ –50 uA 50 uA — Output Leakage Current IOL Output Disable, VOUT = 0 to VDDQ –2 uA 2 uA — Selectable Impedance Output Driver DC Electrical Characteristics Parameter Symbol Test Conditions Min. Max Notes Low Drive Output High Voltage VOHL IOHL = –4 mA VDDQ – 0.4 V — 1 Low Drive Output Low Voltage VOLL IOLL = 4 mA — 0.4 V 1 High Drive Output High Voltage VOHH IOHH = –8 mA VDDQ – 0.4 V — 2 High Drive Output Low Voltage VOLH IOLH = 8 mA — 0.4 V 2 Notes: 1. ZQ = 1; High Impedance output driver setting 2. ZQ = 0; Low Impedance output driver setting Operating Currents -333 Parameter Operating Current Chip Disable Current Bank Deselect Current CMOS Deselect Current Rev: 2.03 1/2005 Symbol x36 x36 x36 IDDP (PL) ISB1 (PL) ISB2 (PL) IDD3 0°C to 70°C 345 mA 75 mA 75 mA 45 mA –40°C to +85°C 355 mA 85 mA 85 mA 55 mA -300 0°C to 70°C 320 mA 70 mA 70 mA 45 mA –40°C to +85°C 330 mA 80 mA 80 mA 55 mA -250 0°C to 70°C 275 mA 65 mA 65 mA 45 mA –40°C to +85°C 285 mA 75 mA 75 mA 55 mA -200 0°C to 70°C 225 mA 60 mA 60 mA 45 mA 16/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. –40°C to +85°C Test Conditions 235 mA E1 ≤ VIL Max. tKHKH ≥ tKHKH Min. All other inputs VIL ≥ VIN ≥ VIH 70 mA E1 ≥ VIH Min. or tKHKH ≥ tKHKH Min. All other inputs VIL ≥ VIN ≥ VIH 70 mA E2 or E3 False tKHKH ≥ tKHKH Min. All other inputs VIL ≥ VIN ≥ VIH 55 mA Device Deselected All inputs VSS + 0.10 V ≥ VIN ≥ VDD – 0.10 V © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 AC Electrical Characteristics Parameter Symbol Clock Cycle Time -333 -300 -250 -200 Unit Notes — ns — 1.8 — ns — — 1.8 — ns — 0.5 — 0.5 — ns 2 1.8 — 2.1 — 2.1 ns — 1.8 1.8 — 2.1 — 2.1 ns — 1.8 1.8 — 2.1 — 2.1 ns 1, 2 tKHQX1 0.5 — — 0.5 — 0.5 — ns 1 Clock High to Output Valid tKHQV — 1.8 1.8 — 2.1 — 2.1 ns — Clock Low to Output Invalid tKLQX 0.5 — 0.5 — 0.5 — 0.5 — ns — Clock Low to Output Valid tKLQV — 1.8 — 1.8 — 2.1 — 2.1 ns — Clock High to Output Invalid tKHQX 0.5 — 0.5 — 0.5 — 0.5 — ns — Clock High to Output High-Z tKHQZ — 1.8 1.8 — 2.1 — 2.1 ns 1 Echo Clock High to Output Valid tCHQV — 0.27 — 0.29 — 0.35 — 0.35 ns 2 Echo Clock Low to Output Invalid tCLQX –0.27 — –0.29 — –0.35 — –0.35 — ns 2 Echo Clock Low to Output Valid tCLQV — 0.27 — 0.29 — 0.35 — 0.35 ns 2 Echo Clock High to Output Invalid tCHQX -0.27 — -0.29 — -0.35 — -0.35 — ns 2 Address Valid to Clock High tAVKH 0.6 — 0.7 — 0.8 — 0.8 — ns — Clock High to Address Don’t Care tKHAX 0.4 — 0.4 — 0.5 — 0.5 — ns — Enable Valid to Clock High tEVKH 0.6 — 0.7 — 0.8 — 0.8 — ns — Clock High to Enable Don’t Care tKHEX 0.4 — 0.4 — 0.5 — 0.5 — ns — Write Valid to Clock High tWVKH 0.6 — 0.7 — 0.8 — 0.8 — ns — Clock High to Write Don’t Care tKHWX 0.4 — 0.4 — 0.5 — 0.5 — ns — Data In Valid to Clock High tDVKH 0.32 — 0.35 — 0.40 — 0.40 — ns — Min Max Min Max Min Max Min Max tKHKH 3.0 — 3.3 — 4.0 — 5.0 Clock High Time tKHKL 1.2 — 1.3 — 1.6 — Clock Low Time tKLKH 1.2 — 1.3 — 1.6 Clock High to Echo Clock Low-Z tKHCX1 0.5 — 0.5 — Clock High to Echo Clock High tKHCH — 1.8 Clock Low to Echo Clock Low tKLCL — Clock High to Echo Clock High-Z tKHCZ Clock High to Output Low-Z 0.5 Notes: 1. Measured at 100 mV from steady state. Not 100% tested. 2. Guaranteed by design. Not 100% tested. 3. For any specific temperature and voltage tKHCZ < tKHCX1. Rev: 2.03 1/2005 17/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 AC Electrical Characteristics (Continued) Parameter Symbol Clock High to Data In Don’t Care -333 -300 -250 -200 Unit Notes — ns — 0.40 — ns — 0.35 — ns 0.8 — 0.8 — ns — 0.5 — 0.5 — ns — Min Max Min Max Min Max Min Max tKHDX 0.27 — 0.30 — 0.35 — 0.35 Data In Valid to Clock Low tDVKL 0.32 — 0.35 — 0.40 — Clock Low to Data In Don’t Care tKLDX 0.27 — 0.30 — 0.35 ADV Valid to Clock High tadvVKH 0.6 — 0.7 — Clock High to ADV Don’t Care tKHadvX 0.4 — 0.4 — Notes: 1. Measured at 100 mV from steady state. Not 100% tested. 2. Guaranteed by design. Not 100% tested. 3. For any specific temperature and voltage tKHCZ < tKHCX1. Rev: 2.03 1/2005 18/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Timing Parameter Key—Read Cycle Timing tKHKH tKHKL CK tKHAX tKLKH tAVKH C A D E tKHQZ tKHQX tKLQV tKLQX tKHQV tKHQX1 DQ (Data Out) QB1 QB2 tCLQX tCHQV tCHQX tCLQV tKHCH tKHCX1 tCHCL tCLCH tKHCZ CQ = CQ High Z Rev: 2.03 1/2005 19/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Timing Parameter Key—DDR Control and Data In Timing CK tKHAX tAVKH A A B C tnVKH tKHnX E1, E2, E3, W, ADV tDVKH DQ (Data In) DDR Write tKHDX DA1 tDVKL DA2 DB1 DB2 tKLDX Note: tnVKH = tEVKH, tWVKH, etc. and tKHnX = tKHEX, tKHWX, etc. JTAG Port Operation Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDDQ. Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected. Rev: 2.03 1/2005 20/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 JTAG Pin Descriptions Pin Pin Name I/O Description TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. In The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level. TDI Test Data In TDO Test Data Out Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up. JTAG Port Registers Overview The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM’s JTAG Port to another device in the scan chain with as little delay as possible. Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register. Rev: 2.03 1/2005 21/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 JTAG TAP Block Diagram · · · · · · · · Boundary Scan Register · · 1 · 108 0 0 Bypass Register 2 1 0 Instruction Register TDI TDO ID Code Register 31 30 29 · · · · 2 1 0 Control Signals TMS Test Access Port (TAP) Controller TCK Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. Die Revision Code GSI Technology JEDEC Vendor ID Code I/O Configuration Not Used Presence Register ID Register Contents Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 x36 X 1 X Rev: 2.03 1/2005 X X 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 22/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 0 0 1 1 0 1 1 0 0 1 © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Tap Controller Instruction Set Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table. JTAG Tap Controller State Diagram 1 0 Test Logic Reset 0 Run Test Idle 1 Select DR 1 Select IR 0 0 1 1 Capture DR Capture IR 0 0 Shift DR 1 1 Shift IR 0 0 1 1 Exit1 DR Exit1 IR 0 0 Pause DR 1 Exit2 DR 1 Update DR 1 1 0 0 Pause IR 1 Exit2 IR 0 0 0 1 Update IR 1 0 Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Rev: 2.03 1/2005 23/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is still determined by its input pins. Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK when the controller is in the Update-IR state. Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction. Rev: 2.03 1/2005 24/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 JTAG Port AC Test Conditions Parameter Conditions Input high level VDD – 0.2 V Input low level 0.2 V Input slew rate 1 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 JTAG Port AC Test Load DQ 50Ω 30pF* VDDQ/2 * Distributed Test Jig Capacitance Notes: 1. Include scope and jig capacitance. 2. Test conditions as as shown unless otherwise noted. JTAG TAP Instruction Set Summary Instruction Code Description Notes EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1 IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2 SAMPLE-Z 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z. 1 RFU 011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1 GSI 101 GSI private instruction. 1 RFU 110 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 BYPASS 111 Places Bypass Register between TDI and TDO. 1 Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state. Rev: 2.03 1/2005 25/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 JTAG Port Recommended Operating Conditions and DC Characteristics Parameter Symbol Min. Max. Unit Notes 3.3 V Test Port Input High Voltage VIHJ3 2.0 VDD3 +0.3 V 1 3.3 V Test Port Input Low Voltage VILJ3 –0.3 0.8 V 1 2.5 V Test Port Input High Voltage VIHJ2 0.6 * VDD2 VDD2 +0.3 V 1 2.5 V Test Port Input Low Voltage VILJ2 –0.3 0.3 * VDD2 V 1 TMS, TCK and TDI Input Leakage Current IINHJ –300 1 uA 2 TMS, TCK and TDI Input Leakage Current IINLJ –1 100 uA 3 TDO Output Leakage Current IOLJ –1 1 uA 4 Test Port Output High Voltage VOHJ 1.7 — V 5, 6 Test Port Output Low Voltage VOLJ — 0.4 V 5, 7 Test Port Output CMOS High VOHJC VDDQ – 100 mV — V 5, 8 Test Port Output CMOS Low VOLJC — 100 mV V 5, 9 Notes: 1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ ≤ VIN ≤ VDDn 3. 0 V ≤ VIN ≤ VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDDQ supply. 6. IOHJ = –4 mA 7. IOLJ = + 4 mA 8. IOHJC = –100 uA 9. IOHJC = +100 uA Rev: 2.03 1/2005 26/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 JTAG Port Timing Diagram tTKC tTKH tTKL TCK tTH tTS TDI tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input Parameter Symbol Min Max Unit TCK Cycle Time tTKC 50 — ns TCK Low to TDO Valid tTKQ — 20 ns TCK High Pulse Width tTKH 20 — ns TCK Low Pulse Width tTKL 20 — ns TDI & TMS Set Up Time tTS 10 — ns TDI & TMS Hold Time tTH 10 — ns Rev: 2.03 1/2005 27/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 209 BGA Package Drawing (Package C) 14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array C A1 A Side View D aaa D1 ∅b E E1 e Bottom View e Symbol Min Typ Max Units Symbol Min Typ Max Units A — — 1.70 mm D1 — 18.0 (BSC) — mm A1 0.40 0.50 0.60 mm E 13.9 14.0 14.1 mm ∅b 0.50 0.60 0.70 mm E1 — 10.0 (BSC) — mm c 0.31 0.36 0.38 mm e — 1.00 (BSC) — mm D 21.9 22.0 22.1 mm aaa — 0.15 — mm Rev 1.0 Rev: 2.03 1/2005 28/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc. GS8170DD36C-333/300/250/200 Ordering Information—GSI SigmaRAM Org Part Number Type I/O Speed (MHz) TA 512K x 36 GS8170DD36C-333 Double Data Rate Σ1x2Lp SRAM CMOS 333 MHz C 512K x 36 GS8170DD36C-300 Double Data Rate Σ1x2Lp SRAM CMOS 300 MHz C 512K x 36 GS8170DD36C-250 Double Data Rate Σ1x2Lp SRAM CMOS 250 MHz C 512K x 36 GS8170DD36C-200 Double Data Rate Σ1x2Lp SRAM CMOS 200 MHz C 512K x 36 GS8170DD36C-333I Double Data Rate Σ1x2Lp SRAM CMOS 333 MHz I 512K x 36 GS8170DD36C-300I Double Data Rate Σ1x2Lp SRAM CMOS 300 MHz I 512K x 36 GS8170DD36C-250I Double Data Rate Σ1x2Lp SRAM CMOS 250 MHz I 512K x 36 GS8170DD36C-200I Double Data Rate Σ1x2Lp SRAM CMOS 200 MHz I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS817xx36C-300T. 2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. DS/DateRev. Code: Old; New Types of Changes Format or Content Page;Revisions;Reason • Creation of new datasheet 8170DD18_r1 • Removed all references to FT mode 8170DD18_r1; 8170DD18_r1_01 Content 8170DD18_r1_01; 8170DD18_r2 Content 8170DD18_r2; 8170DD18_r2_01 Content/format • Added 200 MHz speed bin • Updated format 8170DD18_r2_01; 8170DD18_r2_02 Content/format • Pervasive edit • Added x72 information to ordering information 8170DDxx_r2_02; 8170DDxx_r2_03 Content/format • Updated format • Removed Preliminary banner due to qualification Rev: 2.03 1/2005 • Complete rewrite (DC from 36Mb) 29/29 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology, Inc.