SN5410, SN54LS10, SN54S10, SN7410, SN74LS10, SN74S10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035A – DECEMBER 1983 – REVISED APRIL 2003 Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN5410, SN54LS10, SN54S10, SN7410, SN74LS10, SN74S10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035A – DECEMBER 1983 – REVISED APRIL 2003 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN5410, SN7410, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LS10, SN74LS10, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 – DECEMBER 1983 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54S10, SN74S10, TRIPLE 3-INPUT POSITIVE-NAND GATES SDLS035 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/00103BCA OBSOLETE CDIP J 14 None Call TI Call TI JM38510/00103BDA OBSOLETE CFP W 14 None Call TI Call TI JM38510/07005BCA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC JM38510/07005BDA ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC JM38510/30005B2A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC JM38510/30005BCA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC JM38510/30005BDA ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC JM38510/30005SCA ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC 1 None Call TI Level-NC-NC-NC None Call TI Call TI None Call TI Level-NC-NC-NC Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30005SDA ACTIVE CFP W 14 SN5410J OBSOLETE CDIP J 14 SN54LS10J ACTIVE CDIP J 14 SN54S10J ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC SN7410N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN7410N3 OBSOLETE PDIP N 14 None Call TI SN74LS10D ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74LS10DR ACTIVE SOIC D 14 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74LS10N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC 1 Call TI SN74LS10N3 OBSOLETE PDIP N 14 None Call TI SN74LS10NSR ACTIVE SO NS 14 2000 Pb-Free (RoHS) CU NIPDAU Call TI Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74S10D ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74S10N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC None Call TI 2000 Pb-Free (RoHS) CU NIPDAU SN74S10N3 OBSOLETE PDIP N 14 SN74S10NSR ACTIVE SO NS 14 Call TI SNJ5410J OBSOLETE CDIP J 14 None Call TI Call TI Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SNJ5410W OBSOLETE CFP W 14 None Call TI Call TI SNJ5410WA OBSOLETE CFP WA 14 None Call TI Call TI SNJ54LS10FK ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC SNJ54LS10J ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC SNJ54LS10W ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC SNJ54S10FK ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC SNJ54S10J ACTIVE CDIP J 14 1 None Call TI Level-NC-NC-NC SNJ54S10W ACTIVE CFP W 14 1 None Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated