SCDS003O − NOVEMBER 1992 − REVISED JULY 2004 D 5-Ω Switch Connection Between Two Ports D TTL-Compatible Input Levels SN54CBT3383 . . . JT OR W PACKAGE SN74CBT3383 . . . DB, DBQ, DGV, DW, OR PW PACKAGE (TOP VIEW) BE 1B1 1A1 1A2 1B2 2B1 2A1 2A2 2B2 3B1 3A1 GND description/ordering information The ’CBT3383 devices provide ten bits of high-speed TTL-compatible bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The devices operate as a 10-bit bus switch or a 5-bit bus exchanger, which provides swapping of the A and B pairs of signals. The bus-exchange function is selected when BX is high. The switches are connected when BE is low. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC 5B2 5A2 5A1 5B1 4B2 4A2 4A1 4B1 3B2 3A2 BX ORDERING INFORMATION SN74CBT3383DW Tape and reel SN74CBT3383DWR SSOP − DB Tape and reel SN74CBT3383DBR CU383 SSOP (QSOP) − DBQ Tape and reel SN74CBT3383DBQR CBT3383 Tube SN74CBT3383PW Tape and reel SN74CBT3383PWR TVSOP − DGV Tape and reel SN74CBT3383DGVR CU383 CDIP − JT Tube SNJ54CBT3383JT SNJ54CBT3383JT CFP − W Tube SNJ54CBT3383W TSSOP − PW −55°C to 125°C TOP-SIDE MARKING Tube SOIC − DW −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA CBT3383 CU383 SNJ54CBT3383W † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS INPUTS/OUTPUTS BE BX 1A1−5A1 1A2−5A2 L L 1B1−5B1 1B2−5B2 L H 1B2−5B2 1B1−5B1 H X Z Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- )!,'&$% &")+#$ $ 34 #++ )#!#"($(!% #!( $(%$(, '+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCDS003O − NOVEMBER 1992 − REVISED JULY 2004 logic diagram (positive logic) 1A1 1A2 5A1 5A2 BE BX 3 2 4 5 21 20 22 23 1B1 1B2 5B1 5B2 1 13 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS003O − NOVEMBER 1992 − REVISED JULY 2004 recommended operating conditions (see Note 3) SN54CBT3383 VCC VIH Supply voltage VIL TA Low-level control input voltage High-level control input voltage SN74CBT3383 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 2 2 0.8 Operating free-air temperature −55 125 0 UNIT V V 0.8 V 70 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER SN54CBT3383 TYP† MAX TEST CONDITIONS MIN VIK II VCC = 4.5 V, VCC = 5.5 V, ICC VCC = 5.5 V, IO = 0, VI = VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ∆ICC‡ Control inputs Ci Control inputs VI = 3 V or 0 VI = 2.5 V VO = 3 V or 0, VO = 2.5 V, Cio(OFF) ron§ II = −18 mA VI = 5.5 V or GND VCC = 4.5 V SN74CBT3383 TYP† MAX MIN UNIT −1.2 −1.2 V ±5 ±1 µA 50 50 µA 2.5 2.5 mA 3 pF 5 BE = VCC 6 BE = VCC VI = 0 pF 6 II = 64 mA II = 30 mA 5 9.2 5 7 5 7 Ω VI = 2.4 V, II = 15 mA 10 17 10 15 † All typical values are at VCC = 5 V, TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. § Measured by the voltage drop between the input terminal and the output terminal at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd¶ A or B B or A tpd BX ten BE PARAMETER SN54CBT3383 SN74CBT3383 MIN MAX 0.25 ns A or B 1 10.2 1 9.2 ns A or B 1 10.8 1 8.6 ns 1.5 MAX UNIT MIN tdis A or B 1 8.2 1 7.5 ns BE ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCDS003O − NOVEMBER 1992 − REVISED JULY 2004 PARAMETER MEASUREMENT INFORMATION 7V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V 3.5 V 1.5 V tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) tPLZ 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH − 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) 5962-9668801QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type 5962-9668801QLA ACTIVE CDIP JT 24 1 TBD A42 SNPB N / A for Pkg Type Package Type Package Drawing Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish SN74CBT3383DBLE OBSOLETE SSOP DB 24 SN74CBT3383DBQR ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74CBT3383DBQRE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74CBT3383DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PWLE OBSOLETE TSSOP PW 24 SN74CBT3383PWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3383PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54CBT3383JT ACTIVE CDIP JT 24 1 TBD A42 SNPB N / A for Pkg Type SNJ54CBT3383W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type TBD Call TI MSL Peak Temp (3) Call TI Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MCER004A – JANUARY 1995 – REVISED JANUARY 1997 JT (R-GDIP-T**) CERAMIC DUAL-IN-LINE 24 LEADS SHOWN PINS ** A 13 24 B 1 24 28 A MAX 1.280 (32,51) 1.460 (37,08) A MIN 1.240 (31,50) 1.440 (36,58) B MAX 0.300 (7,62) 0.291 (7,39) B MIN 0.245 (6,22) 0.285 (7,24) DIM 12 0.070 (1,78) 0.030 (0,76) 0.100 (2,54) MAX 0.320 (8,13) 0.290 (7,37) 0.015 (0,38) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.014 (0,36) 0.008 (0,20) 0.100 (2,54) 4040110/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCFP007 – OCTOBER 1994 W (R-GDFP-F24) CERAMIC DUAL FLATPACK 0.375 (9,53) 0.340 (8,64) Base and Seating Plane 0.006 (0,15) 0.004 (0,10) 0.090 (2,29) 0.045 (1,14) 0.045 (1,14) 0.026 (0,66) 0.395 (10,03) 0.360 (9,14) 0.360 (9,14) 0.240 (6,10) 1 0.360 (9,14) 0.240 (6,10) 24 0.019 (0,48) 0.015 (0,38) 0.050 (1,27) 0.640 (16,26) 0.490 (12,45) 0.030 (0,76) 0.015 (0,38) 12 13 30° TYP 1.115 (28,32) 0.840 (21,34) 4040180-5 / B 03/95 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD Index point is provided on cap for terminal identification only. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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