OP A2 OPA211 OPA2211 11 OP A2 11 OP A2 211 OP A2 211 SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007 1.1nV/√Hz Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package • • • • • • • • • • • • • LOW-VOLTAGE NOISE: 1.1nV/√Hz at 1kHz 100nVPP INPUT VOLTAGE NOISE, 0.1Hz–10Hz LOW OFFSET VOLTAGE: 100µV (max) LOW OFFSET VOLTAGE DRIFT: 0.2µV/°C (typ) LOW SUPPLY CURRENT: 3.6mA/Ch UNITY GAIN STABLE GAIN BANDWIDTH PRODUCT: 80MHz (G = 100) SLEW RATE: 27V/µs WIDE SUPPLY RANGE: ±2.25V to ±18V, +4.5V to +36V RAIL-TO-RAIL OUTPUT OUTPUT CURRENT: 30mA SHUTDOWN: 20µA (max) AVAILABLE IN TINY DFN-8 (3x3mm), MSOP-8, SO-8 APPLICATIONS • • • • • • • • • • • • PLL LOOP FILTER LOW-NOISE, LOW-POWER SIGNAL PROCESSING HIGH-PERFORMANCE ADC DRIVERS HIGH-PERFORMANCE DAC OUTPUT AMPLIFIER ACTIVE FILTERS LOW-NOISE INSTRUMENTATION AMPS ULTRASOUND AMPLIFIERS PROFESSIONAL AUDIO PREAMPLIFIERS LOW-NOISE FREQUENCY SYNTHESIZERS INFRARED DETECTOR AMPLIFIERS HYDROPHONE AMPLIFIERS MEDICAL DESCRIPTION The OPA211 series achieves very low 1.1nV/√Hz noise density with a supply current of only 3.6mA. It also offers rail-to-rail output swing, which helps to maximize dynamic range. The OPA211 series’ extremely low voltage and current noise, high speed and wide output swing make it an excellent choice as a loop filter amplifier in PLL applications. In precision data acquisition applications, the OPA211 series of op amps provide <1µs settling time to 16-bit accuracy even for 10V output swings. This ac performance, combined with only 100µV of offset and low drift over temperature, make the OPA211 highly suitable for driving fast, high-precision analog-to-digital converters (ADCs) or buffering the outputs of high-resolution digital-to-analog converters (DACs). The OPA211 is specified over the very wide dual-power supply range of ±2.25V to ±18V, or single-supply operation from +4.5V to +36V. The OPA211 is available in the tiny DFN-8 (3×3mm) and MSOP-8 and SO-8 packages. A dual version, the OPA2211, is available in the DFN-8 (3×3mm) or an MSOP-8 package. This series of op amps is specified from –40°C to +125°C. OPA211 NC 1 8 Enable -IN 2 7 V+ +IN 3 6 OUT V- 4 5 NC MSOP-8 OPA2211 OUT A 1 -IN A 2 +IN A 3 V- 4 8 A B V+ 7 OUT B 6 -IN B 5 +IN B MSOP-8 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2006–2007, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES OPA211 OPA2211 www.ti.com SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) Supply Voltage VALUE UNIT ±20 V Input Voltage (V–) – 0.7 to (V+) + 0.7 V Input Current ±10 mA Output Short-Circuit (2) Continuous Operating Temperature –55 to +150 °C Storage Temperature –65 to +150 °C Junction Temperature +150 °C (1) PRODUCT PREVIEW (2) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Short-circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE DESIGNATOR PACKAGE MARKING ü DRG TBD ü DCK TBD D TBD PACKAGE-LEAD SINGLE ENABLE DFN-8 (3×3mm) (2) ü MSOP-8 (2) ü SO-8 ü DUAL Standard Grade OPA211A OPA211A OPA2211A DFN-8 (3×3mm) (2) ü DRG TBD MSOP-8 (2) ü DCK TBD High Grade OPA211I OPA2211I (1) (2) 2 DFN-8 (3×3mm) (2) ü ü DRG TBD MSOP-8 (2) ü ü DCK TBD SO-8 ü D TBD DFN-8 (3×3mm) (2) ü DRG TBD MSOP-8 (2) ü DCK TBD For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Available Q4, 2007. Submit Documentation Feedback OPA211 OPA2211 www.ti.com SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007 PIN CONFIGURATIONS OPA211 -IN +IN V- OPA211 1 8 NC 2 7 V+ 3 6 4 5 (1) 1 +IN 3 (1) OPA211 8 Enable Exposed Thermal Die Pad on (2) Underside -IN 2 OUT NC NC (1) V- 4 (3) NC 7 V+ 6 OUT 5 NC (1) (1) 1 8 Enable -IN 2 7 V+ +IN 3 6 OUT V- 4 5 NC DFN-8 (3x3mm) SO-8 -IN A 2 +IN A 3 V- 4 Exposed Thermal Die Pad on (2) Underside DFN-8 (3x3mm) (1) MSOP-8 OPA2211 OUT A 1 (3) OPA2211 8 V+ 7 OUT B OUT A -IN A 1 2 6 -IN B +IN A 3 5 +IN B V- 4 A B 8 V+ 7 OUT B 6 -IN B 5 +IN B PRODUCT PREVIEW NC (1) MSOP-8 (1) NC denotes no internal connection. Pin can be left floating or connected to any voltage between (V-) and (V+). (2) Connect thermal die pad to V-. (3) Enable function: (V-) £ ENABLED £ (V+) - 3V; DISABLED ³ (V+) - 0.35V. Submit Documentation Feedback 3 OPA211 OPA2211 www.ti.com SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007 ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C and RL = 10kΩ, unless otherwise noted. Standard Grade OPA211A, OPA2211A PARAMETER CONDITIONS MIN High Grade OPA211I, OPA2211I (1) TYP MAX ±20 0.35 MIN TYP MAX UNIT ±100 ±20 TBD µV 1 0.35 OFFSET VOLTAGE Input Offset Voltage Drift vs Power Supply VOS ±15V dVOS/dT PSRR VS = ±2.25V to ±18V 2 µV/°C TBD µV/V INPUT BIAS CURRENT Input Bias Current IB VCM = 0V Over Temperature Offset Current IOS VCM = 0V Over Temperature 30 150 30 TBD nA TBD TBD TBD TBD nA 10 100 10 TBD nA TBD TBD TBD TBD nA NOISE Input Voltage Noise: en 0.1 0.1 µVPP f = 10Hz 2.5 2.5 nV/√Hz f = 100Hz 1.6 1.6 nV/√Hz f = 1kHz 1.1 1.1 nV/√Hz f = 10Hz TBD TBD pA/√Hz f = 1kHz 1.5 1.5 pA/√Hz f = 0.1Hz to 10Hz Voltage Noise Density: PRODUCT PREVIEW Input Current Noise Density: in INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio VCM CMRR (V–)+1.8 (V–)+1.8V < VCM < (V+)–1.4V 114 (V+)–1.4 120 (V–)+1.8 114 (V+)–1.4 V 120 dB 1010||TBD 1010 ||TBD Ω || pF 109|| 2 109 || 2 Ω || pF 120 dB 114 dB 114 dB INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain AOL (V–)+0.2V < VO < (V+)–0.2V, RL = 10kΩ 114 120 AOL (V–)+0.6V < VO < (V+)–0.6V, RL = 600Ω 110 114 (V–)+0.6V < VO < (V+)–0.6V, RL = 600Ω, IO < 25mA 110 114 Over Temperature 114 110 FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.01% GBW 4 80 MHz 58 58 MHz 27 27 V/µs tS G = –1, 10V Step, CL = 100pF TBD TBD µs G = –1, 10V Step, CL = 100pF TBD TBD µs G = –1 <1 <1 µs G = +10, f = 20kHz, VO = 20VPP, 600Ω TBD TBD % Overload Recovery Time (1) 80 G=1 SR 0.0015% (16-bit) Total Harmonic Distortion + Noise G = 100 THD+N Shaded cells indicate different specifications from low-grade version of device. Submit Documentation Feedback OPA211 OPA2211 www.ti.com SBOS377A – OCTOBER 2006 – REVISED FEBRUARY 2007 ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued) BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C and RL = 10kΩ, unless otherwise noted. Standard Grade OPA211A, OPA2211A PARAMETER CONDITIONS MIN RL = 10kΩ, AOL > 114dB RL = 600Ω, AOL > 110dB RL = 600Ω, AOL > 110dB, IO < 25mA TYP High Grade OPA211I, OPA2211I (1) MAX MIN (V–)+0.2 (V+)–0.2 (V–)+0.6 (V+)–0.6 (V–)+0.6 (V+)–0.6 TYP MAX UNIT (V–)+0.2 (V+)–0.2 V (V–)+0.6 (V+)–0.6 V (V–)+0.6 (V+)–0.6 V OUTPUT Voltage Output Short-Circuit Current Capacitive Load Drive VOUT ISC +30/–45 CLOAD +30/–45 See Typical Characteristics mA See Typical Characteristics pF Specified Voltage VS Quiescent Current (per channel) IQ ±2.25 IOUT = 0 Over Temperature Shutdown Current Disabled ENABLE Pin Input Voltage Enabled ENABLE Pin Input Voltage Disabled ±18 ±2.25 ±18 V 3.6 TBD 3.6 TBD mA TBD TBD TBD TBD mA TBD 20 TBD 20 µA (V+)–3 V (V+)–3 (V+)–0.35 (V+)–0.35 PRODUCT PREVIEW POWER SUPPLY V TEMPERATURE RANGE Specified Range –40 +125 –40 +125 °C Operating Range –55 +150 –55 +150 °C Thermal Resistance DFN (3mm × 3mm) SO-8, MSOP-8 θ JA Soldered to approximately 5cm × 5cm copper area 65 65 °C/W 150 150 °C/W Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) OPA211AID PREVIEW SOIC D 8 75 TBD Call TI Call TI OPA211AIDGKR PREVIEW MSOP DGK 8 2500 TBD Call TI Call TI OPA211AIDGKT PREVIEW MSOP DGK 8 250 TBD Call TI Call TI OPA211AIDR PREVIEW SOIC D 8 2500 TBD Call TI Call TI POPA211AID PREVIEW SOIC D 8 75 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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