MC100LVEL16 3.3VECL Differential Receiver Description Features • • • • • • • • 300 ps Propagation Delay High Bandwidth Output Transitions The 100 Series Contains Temperature Compensation PECL Mode Operating Range: VCC = 3.0 V to 3.8 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −3.8 V Internal Input Pulldown Resistors on D, Pullup and Pulldown Resistors on D Q Output will Default LOW with Inputs Open or at VEE Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS* 8 8 1 KVL16 ALYW G SOIC−8 D SUFFIX CASE 751 1 8 8 1 TSSOP−8 DT SUFFIX CASE 948R 1 KV16 ALYWG G 4B M G G The MC100LVEL16 is a differential receiver. The device is functionally equivalent to the EL16 device, operating from a 3.3 V supply. The LVEL16 exhibits a wider VIHCMR range than its EL16 counterpart. With output transition times and propagation delays comparable to the EL16 the LVEL16 is ideally suited for interfacing with high frequency sources at 3.3 V supplies. Under open input conditions, the Q input will be pulled down to VEE and the Q input will be biased to VCC/2. This condition will force the Q output low. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. 1 4 DFN8 MN SUFFIX CASE 506AA A L Y W M G = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 5 1 Publication Order Number: MC100LVEL16/D MC100LVEL16 Table 1. PIN DESCRIPTION NC 1 8 VCC D 2 7 Q D 3 6 Q VBB 4 5 VEE PIN FUNCTION D, D Q, Q VBB VCC VEE NC EP ECL Data Inputs ECL Data Outputs Reference Voltage Output Positive Supply Negative Supply No Connect Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Figure 1. Logic Diagram and Pinout Assignment Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 75 kW ESD Protection Human Body Model Machine Model Charged Device Model Moisture Sensitivity (Note 1) Flammability Rating > 4 KV > 400 V > 2 kV Level 1 Oxygen Index: 28 to 34 Transistor Count UL 94 V−0 @ 0.125 in 79 Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. Refer to Application Note AND8003/D for additional information. http://onsemi.com 2 MC100LVEL16 Table 3. MAXIMUM RATINGS Rating Unit VCC Symbol PECL Mode Power Supply Parameter VEE = 0 V Condition 1 8 to 0 V VEE NECL Mode Power Supply VCC = 0 V −8 to 0 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 LFPM 500 LFPM SO−8 SO−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SO−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 LFPM 500 LFPM TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free Condition 2 VI VCC VI VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 MC100LVEL16 Table 4. LVPECL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V (Note 2) −40°C Symbol Min Characteristic 25°C Typ Max 17 23 Min 85°C Typ Max 17 23 Min Typ Max Unit 18 24 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 3) 2215 2295 2420 2275 2345 2420 2275 2345 2420 mV VOL Output LOW Voltage (Note 3) 1470 1605 1745 1490 1595 1680 1490 1595 1680 mV VIH Input HIGH Voltage (Single−Ended) 2135 2420 2135 2420 2135 2420 mV VIL Input LOW Voltage (Single−Ended) 1490 1825 1490 1825 1490 1825 mV VBB Output Voltage Reference 1.92 2.04 1.92 2.04 1.92 2.04 V VIHCMR Input HIGH Voltage Common Mode Range (Differential) (Note 4) Vpp < 500 mV Vpp y 500 mV 1.2 2.9 1.1 2.9 1.1 2.9 V 1.5 2.9 1.4 2.9 1.4 2.9 V 150 mA IIH Input HIGH Current IIL Input LOW Current 150 D D 0.5 −600 150 0.5 −600 0.5 −600 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 3. Outputs are terminated through a 50 W resistor to VCC − 2 V. 4. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. Table 5. LVNECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −3.3 V (Note 5) −40°C Symbol Min Characteristic 25°C Typ Max 17 23 Min 85°C Typ Max 17 23 Min Typ Max Unit 18 24 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 6) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 6) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage (Single−Ended) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single−Ended) −1810 −1475 −1810 −1475 −1810 −1475 mV VBB Output Voltage Reference −1.38 −1.26 −1.38 −1.26 −1.38 −1.26 V VIHCMR Input HIGH Voltage Common Mode Range (Differential) (Note 7) Vpp < 500 mV Vpp y 500 mV −2.1 −0.4 −2.2 −0.4 −2.2 −0.4 V −1.8 −0.4 −1.9 −0.4 −1.9 −0.4 V 150 mA IIH Input HIGH Current IIL Input LOW Current 150 D D 0.5 −600 150 0.5 −600 0.5 −600 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 6. Outputs are terminated through a 50 W resistor to VCC − 2 V. 7. VIHCMR min varies 1:1 with VEE, max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V. http://onsemi.com 4 MC100LVEL16 Table 6. AC CHARACTERISTICS VCC= 3.3 V; VEE= 0.0 V or VCC= 0.0 V; VEE= −3.3 V (Note 8) −40°C Symbol Min Characteristic fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tSKEW Duty Cycle Skew (Differential) (Note 9) tJITTER Random Clock Jitter (RMS) VPP Input Swing (Note 10) 150 tr tf Output Rise/Fall Times Q (20% − 80%) 120 Differential Single−Ended Typ 25°C Max Min 1.75 150 100 Max Min 1.75 275 275 400 450 5 30 225 175 0.7 220 85°C Typ 150 320 120 Max 1.75 300 300 375 425 5 20 240 190 0.7 1000 Typ 315 315 390 440 5 20 0.7 220 1000 150 320 120 220 Unit GHz ps ps ps 1000 mV 320 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. VEE can vary ±0.3 V. 9. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device. 10. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40. Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 5 MC100LVEL16 ORDERING INFORMATION Package Shipping† SO−8 98 Units / Rail MC100LVEL16DG SO−8 (Pb−Free) 98 Units / Rail MC100LVEL16DR2 SO−8 2500 Tape & Reel MC100LVEL16DR2G SO−8 (Pb−Free) 2500 Tape & Reel MC100LVEL16DT TSSOP−8 100 Units / Rail MC100LVEL16DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100LVEL16DTR2 TSSOP−8 2500 Tape & Reel MC100LVEL16DTR2G TSSOP−8 (Pb−Free) 2500 Tape & Reel MC100LVEL16MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC100LVEL16D MC100LVEL16MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC100LVEL16 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC100LVEL16 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 8 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC100LVEL16 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 0.10 C TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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