TI SN74AHCT86DR

SN54AHCT86, SN74AHCT86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS250M – OCTOBER 1995 – REVISED JULY 2003
D
Inputs Are TTL-Voltage Compatible
Latch-Up Performance Exceeds 250 mA Per
JESD 17
SN54AHCT86 . . . J OR W PACKAGE
SN74AHCT86 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
13
3
12
4
11
5
10
6
9
7
8
SN54AHCT86 . . . FK PACKAGE
(TOP VIEW)
1B
1Y
2A
2B
2Y
14
1B
1A
NC
VCC
4B
1
2
13 4B
3
12 4A
1Y
NC
2A
NC
2B
11 4Y
4
10 3B
9 3A
5
6
7
8
4
3
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
2
VCC
4B
4A
4Y
3B
3A
3Y
VCC
14
3Y
1
1A
1A
1B
1Y
2A
2B
2Y
GND
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
SN74AHCT86 . . . RGY PACKAGE
(TOP VIEW)
GND
D
D
NC – No internal connection
description/ordering information
The ’AHCT86 devices are quadruple 2-input exclusive-OR gates. These devices perform the Boolean function
Y = A ⊕ B or Y = AB + AB in positive logic.
ORDERING INFORMATION
Tape and reel
SN74AHCT86RGYR
HB86
PDIP – N
Tube
SN74AHCT86N
SN74AHCT86N
Tube
SN74AHCT86D
Tape and reel
SN74AHCT86DR
SOP – NS
Tape and reel
SN74AHCT86NSR
AHCT86
SSOP – DB
Tape and reel
SN74AHCT86DBR
HB86
Tube
SN74AHCT86PW
Tape and reel
SN74AHCT86PWR
TVSOP – DGV
Tape and reel
SN74AHCT86DGVR
HB86
CDIP – J
Tube
SNJ54AHCT86J
SNJ54AHCT86J
CFP – W
Tube
SNJ54AHCT86W
SNJ54AHCT86W
LCCC – FK
Tube
SNJ54AHCT86FK
SNJ54AHCT86FK
TSSOP – PW
–55°C to 125°C
TOP-SIDE
MARKING
QFN – RGY
SOIC – D
–40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
AHCT86
HB86
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AHCT86, SN74AHCT86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS250M – OCTOBER 1995 – REVISED JULY 2003
FUNCTION TABLE
(each gate)
INPUTS
A
OUTPUT
Y
B
L
L
L
L
H
H
H
L
H
H
H
L
exclusive-OR logic
An exclusive-OR gate has many applications, some of which can be represented better by alternative
logic symbols.
EXCLUSIVE OR
=1
These are five equivalent exclusive-OR symbols valid for an SN74AHCT86 gate in positive logic; negation may be shown at any two ports.
LOGIC-IDENTITY ELEMENT
=
The output is active (low) if
all inputs stand at the same
logic level (i.e., A = B).
EVEN-PARITY ELEMENT
2k
The output is active (low) if
an even number of inputs
(i.e., 0 or 2) are active.
ODD-PARITY ELEMENT
2k + 1
The output is active (high) if
an odd number of inputs
(i.e., only 1 of the 2) are
active.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54AHCT86, SN74AHCT86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS250M – OCTOBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 4)
SN54AHCT86
SN74AHCT86
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
0.8
V
Input voltage
0
5.5
0
5.5
V
VO
IOH
Output voltage
0
0
VCC
–8
V
High-level output current
VCC
–8
mA
IOL
∆t/∆v
Low-level output current
8
8
mA
20
20
ns/V
High-level input voltage
2
2
0.8
Input transition rise or fall rate
V
V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
IOH = –50 mA
IOH = –8 mA
45V
4.5
VOL
IOL = 50 mA
IOL = 8 mA
45V
4.5
II
ICC
VI = 5.5 V or GND
VI = VCC or GND,
∆ICC†
One input at 3.4 V,
Other inputs at VCC or GND
MIN
TA = 25°C
TYP
MAX
4.4
4.5
3.94
MIN
MAX
SN74AHCT86
MIN
4.4
4.4
3.8
3.8
MAX
UNIT
V
0.1
0.1
0.1
0.36
0.44
0.44
V
±0.1
±1*
±1
mA
5.5 V
2
20
20
mA
5.5 V
1.35
1.5
1.5
mA
10
pF
0 V to 5.5 V
IO = 0
SN54AHCT86
Ci
VI = VCC or GND
5V
4
10
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
† This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
SN54AHCT86
SN74AHCT86
MIN
MAX
MIN
MAX
5**
6.9**
1**
8**
1
8
5**
6.9**
1**
8**
1
8
5.5
8.8
1
10
1
10
5.5
8.8
1
10
1
10
UNIT
ns
ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54AHCT86, SN74AHCT86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS250M – OCTOBER 1995 – REVISED JULY 2003
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74AHCT86
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.4
0.8
V
Quiet output, minimum dynamic VOL
–0.4
–0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
4.4
High-level dynamic input voltage
V
2
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
V
0.8
V
TYP
UNIT
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
18
pF
SN54AHCT86, SN74AHCT86
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
SCLS250M – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
3V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9681701Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9681701QCA
ACTIVE
CDIP
J
14
1
TBD
5962-9681701QDA
ACTIVE
CFP
W
14
1
SN74AHCT86D
ACTIVE
SOIC
D
14
50
SN74AHCT86DBLE
OBSOLETE
SSOP
DB
14
SN74AHCT86DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHCT86NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHCT86NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWLE
OBSOLETE
TSSOP
PW
14
SN74AHCT86PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74AHCT86RGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
TBD
TBD
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SNJ54AHCT86FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54AHCT86J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54AHCT86W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9681701Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9681701QCA
ACTIVE
CDIP
J
14
1
TBD
5962-9681701QDA
ACTIVE
CFP
W
14
1
SN74AHCT86D
ACTIVE
SOIC
D
14
50
SN74AHCT86DBLE
OBSOLETE
SSOP
DB
14
SN74AHCT86DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DGVRG4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHCT86NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHCT86NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWLE
OBSOLETE
TSSOP
PW
14
SN74AHCT86PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
TBD
TBD
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AHCT86PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT86RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74AHCT86RGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SNJ54AHCT86FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54AHCT86J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54AHCT86W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AHCT86DBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74AHCT86DGVR
TVSOP
DGV
14
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74AHCT86DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74AHCT86NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74AHCT86PWR
TSSOP
PW
14
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
SN74AHCT86RGYR
QFN
RGY
14
1000
180.0
12.4
3.85
3.85
1.35
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHCT86DBR
SSOP
DB
14
2000
346.0
346.0
33.0
SN74AHCT86DGVR
TVSOP
DGV
14
2000
346.0
346.0
29.0
SN74AHCT86DR
SOIC
D
14
2500
346.0
346.0
33.0
SN74AHCT86NSR
SO
NS
14
2000
346.0
346.0
33.0
SN74AHCT86PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
SN74AHCT86RGYR
QFN
RGY
14
1000
190.5
212.7
31.8
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated