TI SN74CBT16214DGGR

SN74CBT16214
12-BIT 1-OF-3 FET MULTIPLEXER/DEMULTIPLEXER
SCDS008L – MAY 1993 – REVISED NOVEMBER 2001
D
D
D
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments
Widebus Family
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
S0
1A
1B3
2A
2B3
3A
3B3
GND
4A
4B3
5A
5B3
6A
6B3
7A
7B3
VCC
8A
GND
8B3
9A
9B3
10A
10B3
11A
11B3
12A
12B3
description
The SN74CBT16214 provides 12 bits of
high-speed TTL-compatible bus switching
between three separate ports. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
The device operates as a 12-bit bus-select switch
via the data-select (S0–S2) terminals.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
S1
S2
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
ORDERING INFORMATION
TA
–40°C to 85°C
PACKAGE†
ORDERABLE
PART NUMBER
Tube
SN74CBT16214DL
Tape and reel
SN74CBT16214DLR
SSOP – DL
TOP-SIDE
MARKING
CBT16214
TSSOP – DGG Tape and reel
SN74CBT16214DGGR
CBT16214
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74CBT16214
12-BIT 1-OF-3 FET MULTIPLEXER/DEMULTIPLEXER
SCDS008L – MAY 1993 – REVISED NOVEMBER 2001
FUNCTION TABLE
INPUTS
S0
INPUT/OUTPUT
A
FUNCTION
S2
S1
L
L
L
Z
Disconnect
L
L
H
B1
A port = B1 port
L
H
L
B2
A port = B2 port
Disconnect
L
H
H
Z
H
L
L
Z
Disconnect
H
L
H
B3
A port = B3 port
H
H
L
B1
A port = B1 port
H
H
H
B2
A port = B2 port
logic diagram (positive logic)
54
2
1A
1B1
53
1B2
3
1B3
12A
27
30
12B1
29
12B2
28
12B3
1
S0
S1
56
55
S2
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBT16214
12-BIT 1-OF-3 FET MULTIPLEXER/DEMULTIPLEXER
SCDS008L – MAY 1993 – REVISED NOVEMBER 2001
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
MAX
5.5
VCC
VIH
Supply voltage
4
High-level control input voltage
2
VIL
TA
Low-level control input voltage
Operating free-air temperature
–40
UNIT
V
V
0.8
V
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
II
ICC
∆ICC§
Control inputs
Ci
Control inputs
Cio(OFF)
TEST CONDITIONS
VCC = 4.5 V,
VCC = 0,
II = –18 mA
VI = 5.5 V
VCC = 5.5 V,
VCC = 5.5 V,
VI = 5.5 V or GND
IO = 0,
VCC = 5.5 V,
VI = 3 V or 0
One input at 3.4 V,
VO = 3 V or 0,
VCC = 4 V,
TYP at VCC = 4 V
ron¶
VCC = 4.5 V
MIN
TYP‡
MAX
UNIT
–1.2
V
10
±1
VI = VCC or GND
Other inputs at VCC or GND
µA
3
µA
2.5
mA
4
pF
S0, S1, and S2 = GND
7.5
pF
VI = 2.4 V,
II = 15 mA
14
20
VI = 0
II = 64 mA
II = 30 mA
4
7
4
7
Ω
VI = 2.4 V,
II = 15 mA
6
12
‡ All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74CBT16214
12-BIT 1-OF-3 FET MULTIPLEXER/DEMULTIPLEXER
SCDS008L – MAY 1993 – REVISED NOVEMBER 2001
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MIN
FROM
(INPUT)
TO
(OUTPUT)
tpd†
A or B
B or A
0.35
tpd
ten
S
B or A
15.3
S
A or B
16
PARAMETER
MAX
UNIT
MAX
0.25
ns
5.5
13.9
ns
5.1
14.5
ns
tdis
S
A or B
12.1
3.6
11.7
ns
† The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
7V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPLZ
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
1.5 V
VOH
VOH – 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CBT16214DGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16214DGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16214DGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16214DL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16214DLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16214DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16214DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74CBT16214DGGR
TSSOP
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
SN74CBT16214DLR
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBT16214DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74CBT16214DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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