SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54LS673, SN54LS674, SN74LS673, SN74LS674 16-BIT SHIFT REGISTERS SDLS195 – MARCH 1985 – REVISED MARCH 1988 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-88602013A ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC 5962-8860201JA ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC 1 Lead/Ball Finish MSL Peak Temp (3) 5962-8860201JA ACTIVE CDIP J 24 TBD Call TI Level-NC-NC-NC 5962-8860201KA OBSOLETE CFP W 24 TBD Call TI Call TI 5962-8860201KA OBSOLETE CFP W 24 TBD Call TI Call TI 5962-8860201LA ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC 5962-8860201LA ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC 5962-88607013A ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC 5962-88607013A ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC 5962-8860701JA ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC 5962-8860701JA ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC 5962-8860701KA OBSOLETE CFP W 24 TBD Call TI Call TI 5962-8860701KA OBSOLETE CFP W 24 TBD Call TI Call TI SN54LS673J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54LS673J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54LS673JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SN54LS673JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SN54LS674J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54LS674J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SN54LS674JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SN54LS674JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SN74LS673DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS673DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS673DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS673DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS673N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS673N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS673NE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS673NE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS674DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS674DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS674N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS674N ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS674NE4 ACTIVE PDIP N 24 15 Pb-Free CU NIPDAU Level-NC-NC-NC Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS674NE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SNJ54LS673FK ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC SNJ54LS673FK ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC SNJ54LS673J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC Lead/Ball Finish MSL Peak Temp (3) (RoHS) SNJ54LS673J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS673JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS673JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS673W OBSOLETE CFP W 24 TBD Call TI Call TI SNJ54LS673W OBSOLETE CFP W 24 TBD Call TI Call TI SNJ54LS674FK ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC SNJ54LS674FK ACTIVE LCCC FK 28 1 TBD Call TI Level-NC-NC-NC SNJ54LS674J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS674J ACTIVE CDIP J 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS674JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS674JT ACTIVE CDIP JT 24 1 TBD Call TI Level-NC-NC-NC SNJ54LS674W OBSOLETE CFP W 24 TBD Call TI Call TI SNJ54LS674W OBSOLETE CFP W 24 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCER004A – JANUARY 1995 – REVISED JANUARY 1997 JT (R-GDIP-T**) CERAMIC DUAL-IN-LINE 24 LEADS SHOWN PINS ** A 13 24 B 1 24 28 A MAX 1.280 (32,51) 1.460 (37,08) A MIN 1.240 (31,50) 1.440 (36,58) B MAX 0.300 (7,62) 0.291 (7,39) B MIN 0.245 (6,22) 0.285 (7,24) DIM 12 0.070 (1,78) 0.030 (0,76) 0.100 (2,54) MAX 0.320 (8,13) 0.290 (7,37) 0.015 (0,38) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.014 (0,36) 0.008 (0,20) 0.100 (2,54) 4040110/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCFP007 – OCTOBER 1994 W (R-GDFP-F24) CERAMIC DUAL FLATPACK 0.375 (9,53) 0.340 (8,64) Base and Seating Plane 0.006 (0,15) 0.004 (0,10) 0.090 (2,29) 0.045 (1,14) 0.045 (1,14) 0.026 (0,66) 0.395 (10,03) 0.360 (9,14) 0.360 (9,14) 0.240 (6,10) 1 0.360 (9,14) 0.240 (6,10) 24 0.019 (0,48) 0.015 (0,38) 0.050 (1,27) 0.640 (16,26) 0.490 (12,45) 0.030 (0,76) 0.015 (0,38) 12 13 30° TYP 1.115 (28,32) 0.840 (21,34) 4040180-5 / B 03/95 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD Index point is provided on cap for terminal identification only. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS–010 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0°– 15° 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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