TI SN74LS674N

SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
Copyright  1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-88602013A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
5962-8860201JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
1
Lead/Ball Finish
MSL Peak Temp (3)
5962-8860201JA
ACTIVE
CDIP
J
24
TBD
Call TI
Level-NC-NC-NC
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SN54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
CU NIPDAU
Level-NC-NC-NC
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
1
12
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.175 (4,45)
0.140 (3,56)
0.090 (2,29)
0.060 (1,53)
A
Seating Plane
0.018 (0,46) MIN
24
PINS **
DIM
”A”
”B”
”C”
NARR
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
28
WIDE
NARR
40
32
WIDE
NARR
WIDE
NARR
WIDE
MAX
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
MIN
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
MIN
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
MIN
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
4040084/C 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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