STMICROELECTRONICS M27C4002

M27C4002
4 Mbit (256Kb x16) UV EPROM and OTP EPROM
Feature summary
■
5V ± 10% Supply voltage for Read operations
■
Access time: 45ns
■
Low Power consumption
– Active Current 70mA at 10MHz
– Standby current 100µa
■
Programming Voltage: 12.75V ± 0.25V
■
Programming Time: 100µs/word
■
Electronic Signature
– Manufacturer Code: 20h
– Device Code: 44h
■
ECOPACK® packages available
April 2006
40
40
1
Rev 4
1
FDIP40W (F)
PDIP40 (B)
PLCC44 (C)
TSOP40 (N)
10 x 20 mm
1/24
www.st.com
1
Contents
M27C4002
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Two line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
PRESTO II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10
Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27C4002
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode AC Characteristics 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Mode AC Characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Mode AC Characteristics 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data . . . . . . 18
PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . . 19
PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data. . . . . . . . . . . . 20
TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data . . . . . . . . . . . 21
Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27C4002
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
4/24
Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18
PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline . . . . . . . . . . 21
M27C4002
1
Summary description
Summary description
The M27C4002 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organized as 262,144 words of 16 bits.
The FDIP40W (window ceramic frit-seal package) has transparent lids which allow the user
to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4002 is offered in PDIP40, PLCC44 and TSOP40 (10 x 20 mm)
packages.
In order to meet environmental requirements, ST offers the M27C4002 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Logic Diagram
VCC
VPP
18
16
A0-A17
E
Q0-Q15
M27C4002
G
VSS
AI00727B
5/24
Summary description
Table 1.
M27C4002
Signal Names
A0-A17
Address Inputs
Q0-Q15
Data Outputs
E
Chip Enable
G
Output Enable
VPP
Program Supply
VCC
Supply Voltage
VSS
Ground
NC
Not Connected Internally
Figure 2.
DIP Connections
VPP
E
Q15
Q14
Q13
Q12
Q11
Q10
Q9
Q8
VSS
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
G
1
40
2
39
3
38
4
37
5
36
6
35
7
34
8
33
9
32
10
31
M27C4002
11
30
12
29
13
28
14
27
15
26
16
25
17
24
18
23
19
22
20
21
AI00728
6/24
VCC
A17
A16
A15
A14
A13
A12
A11
A10
A9
VSS
A8
A7
A6
A5
A4
A3
A2
A1
A0
M27C4002
Summary description
LCC Connections
Q13
Q14
Q15
E
VPP
NC
VCC
A17
A16
A15
A14
Figure 3.
1 44
Q12
Q11
Q10
Q9
Q8
VSS
NC
Q7
Q6
Q5
Q4
12
A13
A12
A11
A10
A9
VSS
NC
A8
A7
A6
A5
34
M27C4002
Q3
Q2
Q1
Q0
G
NC
A0
A1
A2
A3
A4
23
AI00729
Figure 4.
TSOP Connections
A9
A10
A11
A12
A13
A14
A15
A16
A17
VCC
VPP
E
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
1
10
11
20
40
M27C4002
(Normal)
31
30
21
VSS
A8
A7
A6
A5
A4
A3
A2
A1
A0
G
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VSS
AI01831
7/24
Device operation
2
M27C4002
Device operation
The operating modes of the M27C4002 are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V
on A9 for Electronic Signature.
2.1
Read mode
The M27C4002 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV.
2.2
Standby mode
The M27C4002 has a standby mode which reduces the supply current from 50mA to 100µA.
The M27C4002 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.
2.3
Two line output control
Because EPROMs are usually used in larger memory arrays, the product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
●
The lowest possible memory power dissipation
●
Complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
8/24
M27C4002
2.4
Device operation
System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the output capacitive and inductive loading of the device. The
associated transient voltage peaks can be suppressed by complying with the two line output
control and by properly selected decoupling capacitors. It is recommended that a 0.1µF
ceramic capacitor be used on every device between VCC and VSS. This should be a high
frequency capacitor of low inherent inductance and should be placed as close to the device
as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and
VSS for every eight devices. The bulk capacitor should be located near the power supply
connection point.The purpose of the bulk capacitor is to overcome the voltage drop caused
by the inductive effects of PCB traces.
2.5
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C4002 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The
M27C4002 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is
pulsed to VIL. The data to be programmed is applied to 16 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be
6.25V ± 0.25V.
2.6
PRESTO II programming algorithm
PRESTO II Programming Algorithm allows the whole array to be programmed with a
guaranteed margin, in a typical time of 26.5 seconds. Programming with PRESTO II
consists of applying a sequence of 100µs program pulses to each byte until a correct verify
occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is
automatically activated in order to guarantee that each cell is programmed with enough
margin. No overprogram pulse is applied since the verify in MARGIN MODE provides
necessary margin to each programmed cell.
9/24
Device operation
Figure 5.
M27C4002
Programming Flowchart
VCC = 6.25V, VPP = 12.75V
n=0
E = 100µs Pulse
NO
++n
= 25
YES
FAIL
NO
++ Addr
VERIFY
YES
Last
Addr
NO
YES
CHECK ALL WORDS
1st: VCC = 6V
2nd: VCC = 4.2V
AI00726C
2.7
Program Inhibit
Programming of multiple M27C4002 devices in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C4002 may be
common. A TTL low level pulse applied to a M27C4002 E input, with VPP at 12.75V, will
program that M27C4002. A high level E input inhibits the other M27C4002 devices from
being programmed.
2.8
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and
VCC at 6.25V.
2.9
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C4002. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C4002 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer
code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics
10/24
M27C4002
Device operation
M27C4002, these two identifier bytes are given in Table 3: Electronic Signature and can be
read-out on outputs Q7 to Q0.
2.10
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27C4002 are such that erasure begins when the cells
are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Research shows that constant exposure to room level fluorescent lighting could
erase a typical M27C4002 in about 3 years, while it would take approximately 1 week to
cause erasure when exposed to direct sunlight. If the M27C4002 is to be exposed to these
types of lighting conditions for extended periods of time, it is suggested that opaque labels
be put over the M27C4002 window to prevent unintentional erasure. The recommended
erasure procedure for the M27C4002 is exposure to short wave ultraviolet light which has
wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C4002
should be placed within 2.5cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.
Table 2.
Operating modes(1)
Mode
E
G
A9
VPP
Q15-Q0
Read
VIL
VIL
X
VCC or VSS
Data Out
Output Disable
VIL
VIH
X
VCC or VSS
Hi-Z
VIL Pulse
VIH
X
VPP
Data In
Verify
VIH
VIL
X
VPP
Data Out
Program Inhibit
VIH
VIH
X
VPP
Hi-Z
Standby
VIH
X
X
VCC or VSS
Hi-Z
Electronic Signature
VIL
VIL
VID
VCC
Codes
Program
1. X = VIH or VIL, VID = 12V ± 0.5V.
Table 3.
Electronic Signature(1)
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer’s
Code
VIL
0
0
1
0
0
0
0
0
20h
Device Code
VIH
0
1
0
0
0
1
0
0
44h
1. Outputs Q15-Q8 are set to '0'.
11/24
Maximum rating
3
M27C4002
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Absolute Maximum Ratings
Symbol
TA
Parameter
Ambient Operating
Temperature(1)
Value
Unit
–40 to 125
°C
TBIAS
Temperature Under Bias
–50 to 125
°C
TSTG
Storage Temperature
–65 to 150
°C
VIO(2)
Input or Output Voltage (except A9)
–2 to 7
V
Supply Voltage
–2 to 7
V
–2 to 13.5
V
–2 to 14
V
VCC
VA9(2)
VPP
A9 Voltage
Program Supply Voltage
1. Depends on range.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than
20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less
than 20ns.
12/24
M27C4002
4
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 5.
AC Measurement Conditions
Parameter
High Speed
Standard
Input Rise and Fall Times
≤10ns
≤20ns
Input Pulse Voltages
0 to 3V
0.4V to 2.4V
1.5V
0.8V and 2V
Input and Output Timing Ref. Voltages
Figure 6.
AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
2.0V
0.8V
0.4V
AI01822
Figure 7.
AC Testing Load Circuit
1.3V
1N914
3.3kΩ
DEVICE
UNDER
TEST
OUT
CL
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
AI01823B
13/24
DC and AC parameters
Table 6.
M27C4002
Capacitance(1)(2)
Symbol
CIN
COUT
Parameter
Test Condition
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Input Capacitance
Output Capacitance
Min
1. TA = 25 °C, f = 1 MHz.
2. Sampled only, not 100% tested.
Table 7.
Symbol
Read Mode DC Characteristics(1)(2)
Parameter
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Supply Current
Test Condition
Min
Max
Unit
0V ≤VIN ≤VCC
±10
µA
0V ≤VOUT ≤VCC
±10
µA
E = VIL, G = VIL,
IOUT = 0mA, f = 10MHz
70
mA
E = VIL, G = VIL,
IOUT = 0mA, f = 5MHz
50
mA
E = VIH
1
mA
E > VCC – 0.2V
100
µA
VPP = VCC
10
µA
ICC1
Supply Current (Standby) TTL
ICC2
Supply Current (Standby) CMOS
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
Input High Voltage
2
VCC + 1
V
0.4
V
VIH
(3)
VOL
VOH
Output Low Voltage
IOL = 2.1mA
Output High Voltage TTL
IOH = –400µA
2.4
V
Output High Voltage CMOS
IOH = –100µA
VCC –
0.7V
V
1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Maximum DC voltage on Output is VCC +0.5V.
Table 8.
Symbol
Programming Mode DC Characteristics(1)(2)
Parameter
Test Condition
Min
VIL ≤VIN ≤VIH
Max
Unit
±10
µA
50
mA
50
mA
ILI
Input Leakage Current
ICC
Supply Current
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
VIH
Input High Voltage
2
VCC + 0.5
V
VOL
Output Low Voltage
0.4
V
VOH
Output High Voltage TTL
VID
A9 Voltage
E = VIL
IOL = 2.1mA
IOH = –400µA
2.4
11.5
V
12.5
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
14/24
V
M27C4002
Table 9.
DC and AC parameters
Read Mode AC Characteristics 1(1)(2)
M27C4002
Symbol
Alt
Parameter
- 45(3)
Test Condition
Min
tAVQV
tACC
Address Valid to
Output Valid
tELQV
tCE
tGLQV
-60 (3)
Max
Min
-70
Max
Min
Unit
Max
E = VIL, G = VIL
45
60
70
ns
Chip Enable Low to
Output Valid
G = VIL
45
60
70
ns
tOE
Output Enable Low
to Output Valid
E = VIL
25
30
35
ns
tEHQZ(4)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
0
30
0
30
0
30
ns
tGHQZ(4)
tDF
Output Enable High
to Output Hi-Z
E = VIL
0
30
0
30
0
30
ns
tAXQX
tOH
Address Transition
to Output Transition
E = VIL, G = VIL
0
0
0
ns
1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.
Table 10.
Read Mode AC Characteristics 2(1)(2)
M27C4002
Symbol
Alt
Parameter
Test Condition
-80
Min
tAVQV
tACC
Address Valid to Output
Valid
tELQV
tCE
tGLQV
-90
Max
Min
-10
Max
Min
Unit
Max
E = VIL, G = VIL
80
90
100
ns
Chip Enable Low to
Output Valid
G = VIL
80
90
100
ns
tOE
Output Enable Low to
Output Valid
E = VIL
40
40
50
ns
tEHQZ(3)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
0
30
0
30
0
30
ns
tGHQZ(3)
tDF
Output Enable High to
Output Hi-Z
E = VIL
0
30
0
30
0
30
ns
tAXQX
tOH
Address Transition to
Output Transition
E = VIL, G = VIL
0
0
0
ns
1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
15/24
DC and AC parameters
M27C4002
Read Mode AC Characteristics 3(1)(2)
Table 11.
M27C4002
Symbol
Alt
Parameter
Test Condition
-12
Min
tAVQV
tACC
Address Valid to
Output Valid
tELQV
tCE
tGLQV
-15
Max
Min
-20
Max
Min
Unit
Max
E = VIL, G = VIL
120
150
200
ns
Chip Enable Low to
Output Valid
G = VIL
120
150
200
ns
tOE
Output Enable Low
to Output Valid
E = VIL
60
60
70
ns
tEHQZ(3)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
0
40
0
50
0
80
ns
tGHQZ(3)
tDF
Output Enable High
to Output Hi-Z
E = VIL
0
40
0
50
0
80
ns
tAXQX
tOH
Address Transition
to Output Transition
E = VIL, G = VIL
0
0
0
ns
1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
Figure 8.
Read Mode AC Waveforms
A0-A17
VALID
tAVQV
VALID
tAXQX
E
tGLQV
tEHQZ
G
tELQV
Q0-Q15
tGHQZ
Hi-Z
AI00731B
16/24
M27C4002
DC and AC parameters
Programming Mode AC Characteristics(1)(2)(3)
Table 12.
Symbol
Alt
Parameter
Test Condition
Min
Max
tAVEL
tAS
Address Valid to Chip Enable Low
2
µs
tQVEL
tDS
Input Valid to Chip Enable Low
2
µs
tVPHEL
tVPS
VPP High to Chip Enable Low
2
µs
tVCHEL
tVCS
VCC High to Chip Enable Low
2
µs
tELEH
tPW
Chip Enable Program Pulse Width
95
tEHQX
tDH
Chip Enable High to Input Transition
2
µs
tQXGL
tOES
Input Transition to Output Enable Low
2
µs
tGLQV
tOE
Output Enable Low to Output Valid
tGHQZ
tDFP
Output Enable High to Output Hi-Z
0
tGHAX
tAH
Output Enable High to Address
Transition
0
105
Unit
µs
100
ns
130
ns
ns
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
Figure 9.
Programming and Verify Modes AC Waveforms
VALID
A0-A17
tAVEL
Q0-Q15
DATA OUT
DATA IN
tQVEL
tEHQX
VPP
tVPHEL
tGLQV
tGHQZ
VCC
tVCHEL
tGHAX
E
tELEH
tQXGL
G
PROGRAM
VERIFY
AI00730
17/24
Package mechanical data
5
M27C4002
Package mechanical data
Figure 10. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline
A2
A3
A
A1
B1
B
L
e
α
eA
D2
C
eB
D
S
N
∅
E1
E
1
FDIPW-a
1. Drawing is not to scale.
Table 13.
FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
5.72
Max
0.225
A1
0.51
1.40
0.020
0.055
A2
3.91
4.57
0.154
0.180
A3
3.89
4.50
0.153
0.177
B
0.41
0.56
0.016
0.022
–
–
–
–
C
0.23
0.30
0.009
0.012
D
51.79
52.60
2.039
2.071
B1
1.45
0.057
D2
48.26
–
–
1.900
–
–
E
15.24
–
–
0.600
–
–
13.06
13.36
0.514
0.526
E1
e
2.54
–
–
0.100
–
–
eA
14.99
–
–
0.590
–
–
eB
16.18
18.03
0.637
0.710
L
3.18
S
1.52
2.49
–
–
α
4°
11°
N
40
∅
18/24
Max
7.62
0.125
0.300
0.060
0.098
–
–
4°
11°
40
M27C4002
Package mechanical data
Figure 11. PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline
A2
A1
B1
B
A
L
e1
α
eA
D2
C
eB
D
S
N
E1
E
1
PDIP
1. Drawing is not to scale.
Table 14.
PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
Max
Typ
Min
Max
A
4.45
–
–
0. 175
–
–
A1
0.64
0.38
–
0.025
0.015
–
A2
3.56
3.91
0.140
0.154
B
0.38
0.53
0.015
0.021
B1
1.14
1.78
0.045
0.070
C
0.20
0.31
0.008
0.012
D
51.78
52.58
2.039
2.070
–
–
–
–
E
14.80
16.26
0.583
0.640
E1
13.46
13.99
0.530
0.551
–
D2
48.26
1.900
e1
2.54
–
–
0.100
–
eA
15.24
–
–
0.600
–
eB
15.24
17.78
0.600
0.700
L
3.05
3.81
0.120
0.150
S
1.52
2.29
0.060
0.090
α
0°
15°
0°
15°
N
40
40
19/24
Package mechanical data
M27C4002
Figure 12. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline
D
D1
A1
c
1 N
B1
E3
e
E2
E1 E
B
D3
A2
A
CP
D2
PLCC-B
1. Drawing is not to scale.
Table 15.
PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data
millimeters
inches
Symbol
Typ
Min
Max
A
4.200
A1
Min
Max
4.570
0.1654
0.1799
2.290
3.040
0.0902
0.1197
A2
3.650
3.700
0.1437
0.1457
B
0.331
0.533
0.0130
0.0210
B1
0.661
0.812
0.0260
0.0320
CP
c
0.101
0.510
0.0040
0.0201
D
17.400
17.650
0.6850
0.6949
D1
16.510
16.662
0.6500
0.6560
D2
14.990
16.000
0.5902
0.6299
–
–
–
–
E
17.400
17.650
0.6850
0.6949
E1
16.510
16.660
0.6500
0.6559
E2
14.990
16.000
0.5902
0.6299
D3
20/24
Typ
12.700
0.5000
E3
12.700
–
–
0.5000
–
–
e
1.270
–
–
0.0500
–
–
N
44
44
M27C4002
Package mechanical data
Figure 13. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline
A2
N
1
e
E
B
N/2
D1
A
CP
D
DIE
C
A1
TSOP-a
α
L
1. Drawing is not to scale.
Table 16.
TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.200
Max
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
0.950
1.050
0.0374
0.0413
B
0.170
0.270
0.0067
0.0106
C
0.100
0.210
0.0039
0.0083
CP
0.100
0.0039
D
19.800
20.200
0.7795
0.7953
D1
18.300
18.500
0.7205
0.7283
–
–
–
–
E
9.900
10.100
0.3898
0.3976
L
0.500
0.700
0.0197
0.0276
α
0
5
0
5
e
N
0.500
40
0.0197
40
21/24
Part numbering
6
M27C4002
Part numbering
Table 17.
Ordering Information Scheme
Example:
M27C4002
-80 X
C 1
TR
Device Type
M27
Supply Voltage
C = 5V
Device Function
4002 = 4 Mbit (256Kb x16)
Speed
-45 = 45 ns (1)
-60 (1) = 60 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
-20 = 200 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
Package
F = FDIP40W
B = PDIP40
C = PLCC44
N = TSOP40: 10 x 20 mm
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Options
TR = Tape & Reel Packing
1. High Speed, see Section 4: DC and AC parameters for further information.
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/24
M27C4002
7
Revision history
Revision history
Table 18.
Document revision history
Date
Revision
September
1998
1
First Issue
25-Sep-2000
2
AN620 Reference removed
30-Aug-2001
3
70ns speed class added
4
Datasheet converted to new corporate template.
Packages are ECOPACK® compliant.
JLCCC32W package removed. PLCC44 outline and mechanical
data. TSOP40 10x20mm mechanical data updated.
Additional Burn-in options removed from Table 17: Ordering
Information Scheme.
06-Apr-2006
Changes
23/24
M27C4002
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