ST2054 CURRENT LIMITED POWER DISTRIBUTION SWITCHES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 80mΩ HIGH-SIDE MOSFET SWITCH 500mA CONTINUOUS CURRENT PER CHANNEL INDEPENDENT THERMAL AND SHORT-CIRCUIT PROTECTION WITH OVERCURRENT LOGIC OUTPUT OPERATING RANGE FROM 2.7V TO 5.5V CMOS- AND TTL-COMPATIBLE ENABLE INPUTS 10 ms OC_N FAULT BLANKING 2.5ms TYPICAL RISE TIME UNDERVOLTAGE LOCKOUT 20µA MAXIMUM STANDBY SUPPLY CURRENT AMBIENT TEMPERATURE RANGE, 0°C TO 85°C ESD PROTECTION DESCRIPTION The ST2054 power distribution switches is intended for application where heavy capacitive loads and short circuits are likely to be encountered. These devices incorporate 80mΩ N-channel MOSFET high-side power switches for power-distribution systems that require multiple powers switches in a single package. Each switch is controlled by an independent logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external SOP components and allows operation from supplies as low as 2.7 V. When the output load exceeds the current-limit threshold or a short is present, these devices limit the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. A 10ms deglitching circuit provides fault-blanking feature, preventing the OC_N pin to be asserted during hot-insertion or short spikes of overcurrent conditions. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch remains off until valid input voltage is present. These power-distribution switches are designed to current limit at 0.9 A. Table 1: Order Codes Type Temperature Range Package Comments ST2054BD ST2054BDR -40 to 85 °C -40 to 85 °C SO-16 (Tube) SO-16 (Tape & Reel) 50parts per tube / 40tube per box 2500 parts per reel July 2005 Rev. 3 1/9 ST2054 Figure 1: Pin Configuration Table 2: Pin Description Pln N° Symbol Name And Function 1 2 3 GNDA IN1 EN1 4 EN2 5 6 7 GNDB IN2 EN3 8 EN4 9 OC4 10 11 12 OUT4 OUT3 OC3 13 OC2 14 15 16 OUT2 OUT1 OC1 Ground Input Voltage Enable Input. Logic High Turns On Power Switch IN-OUT1 Enable Input. Logic High Turns On Power Switch IN-OUT2 Ground Input Voltage Enable Input. Logic High Turns On Power Switch IN-OUT3 Enable Input. Logic High Turns On Power Switch IN-OUT4 Overcurrent. Logic Output Active Low IN-OUT4 Power Switch Output Power Switch Output Overcurrent. Logic Output Active Low IN-OUT3 Overcurrent. Logic Output Active Low IN-OUT2 Power Switch Output Power Switch Output Overcurrent. Logic Output Active Low IN-OUT1 Table 3: Absolute Maximum Ratings Symbol Parameter VI Input Voltage Range (Note 1) VO Output Voltage Range (Note 1) VIENX IO ESD TJ Value Input Voltage Range Continuous Output Current Unit -0.3 to 6 V -0.3 to (VI +0.3) V -0.3 to 6 V Internally Limited Electrostatic Discharge Operating Junction Temperature 2 kV -40 to 125 °C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied. Note1: All voltage are referred to GND Table 4: Recommended Operating Condition Symbol 2/9 Parameter Min. Typ. Max. Unit VI Input Voltage Range (Note 1) 2.7 5.5 V VO Output Voltage Range (Note 1) 0 5.5 V IO Continuous Output Current (Per Switch) 0 500 mA ST2054 Figure 2: Block Diagram 3/9 ST2054 Table 5: Power Switch Electrical Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol Parameter RDS(ON) Static Drain-Source ON-State Resistance Test Conditions Min. Typ. Max. Unit 80 100 mΩ VI =5V IO = 0.5A VI =5V IO = 0.5ATJ=85°C 90 120 VI =5V IO = 0.5ATJ=125°C 100 135 VI =3.3V IO = 0.5A 90 125 VI =3.3V IO = 0.5ATJ=85°C 110 145 160 VI =3.3V IO = 0.5ATJ=125°C 120 tr Output Rise Time VI =5.5V RL=10Ω CL=1µF VI =2.7V RL=10Ω CL=1µF 2.5 tf Output Fall Time VI =5.5V RL=10Ω CL=1µF VI =2.7V RL=10Ω CL=1µF 0.3 ms 3 ms 0.2 Table 6: Enable Input ENx Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol Parameter Test Conditions VIH High level Input Voltage VI =2.7V to 5.5V VIL Low level Input Voltage VI =4.5V to 5.5V II Input Current VIENX = VI or 0V ton Turn-on Time toff Turn-off Time RL=10Ω CL=100µF RL=10Ω CL=100µF Min. Typ. Max. Unit 0.8 V 2 V VI =2.7V to 4.5V 0.4 -0.5 0.5 µA 20 ms 40 ms Table 7: Current Limit Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol IOS Parameter Test Conditions Short Circuit Output Current VI =5V, OUT connected to GND, device enabled into short circuit Min. Typ. Max. Unit 0.7 1 1.3 A Table 8: Supply Current Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol ISOL Parameter Current Low Level Output Test Conditions VIENX = 0, No Load, VIENX = 0, No Load, ISOH IL Current Low High Output Output Leakage Current Min. Typ. 0.05 TJ=-40 to 125°C Max. Unit 2 µA 20 VIENX = VI, No Load, 140 180 VIENX = VI, No Load, TJ=-40 to 125°C 200 VIENX = 0, Output Connected to GND, TJ=-40 to 125°C 20 µA µA Table 9: Undervoltage Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol VIL VHYS 4/9 Parameter Low Level Input Voltage Hysteresys Test Conditions Min. Typ. 2 Max. 2.5 100 Unit V mV ST2054 Table 10: Overcurrent (OC) Characteristics (VI = 5.5V, IO = rated current, VIEN =VI, TJ = 25°C, unless otherwise specified.) (See Note 1) Symbol ISINK Parameter Test Conditions Sink Current VO =5V VO Output Low Voltage IO =5mA IOFF OFF-State Current VO =5V VO =3.3V TFB Fault-Blanking period VI =5.5V, TJ=25°C (See Note 2 and 3) Min. Typ. Max. 10 2 Unit mA 10 0.5 V 1 µA ms Note 1: Pulse testing techniques maintain junction temperature close to ambient temperature: thermal effect must be takes into account separately. Note 2: Specified by design, not production tested. Note 3: Guaranteed by design. Figure 3: Test Circuit Figure 4: Waveform - Propagation Delays (f=1MHz; 50% duty cycle) 5/9 ST2054 SO-16 MECHANICAL DATA DIM. mm. MIN. TYP A a1 inch MAX. MIN. TYP. 1.75 0.1 0.068 0.25 a2 MAX. 0.004 0.010 1.64 0.063 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 9.8 10 0.385 0.393 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 M S 0.62 0.050 0.024 8° (max.) 0016020D 6/9 ST2054 Tape & Reel SO-16 MECHANICAL DATA mm. inch DIM. MIN. A TYP MAX. MIN. 330 MAX. 12.992 C 12.8 D 20.2 0.795 N 60 2.362 T 13.2 TYP. 0.504 22.4 0.519 0.882 Ao 6.45 6.65 0.254 0.262 Bo 10.3 10.5 0.406 0.414 Ko 2.1 2.3 0.082 0.090 Po 3.9 4.1 0.153 0.161 P 7.9 8.1 0.311 0.319 7/9 ST2054 Table 11: Revision History 8/9 Date Revision 28-Oct-2004 2 13-Jul-2005 3 Description of Changes Maturity Change. Add bullet on pag. 1, add paragraph in the description on pag. 1 and add row TFB on Table 10. ST2054 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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