TDE1747 Interface circuit - relay and lamp-driver Features ■ Open ground protection ■ High output current ■ Adjustable short-circuit protection to ground ■ Thermal protection with hysteresis to avoid the intermediate output levels ■ Large supply voltage range: + 8V to +45V ■ Short-circuit protection to VCC SO14 DIP-8 Description The TDE1747 is a monolithic comparator designed for high current and high voltage applications, specifically to drive lamps, relays, stepping motors. This device is essentially blow-out proof. Current limiting is available to limit the peak output current to safe values. Adjustment only requires one external resistor. In addition, thermal shut down is provided to keep the IC from overheating. If internal dissipation becomes too high, the driver will shut down to prevent excessive heating. TDE1747 has an open ground protection. The output is also protected from shortcircuits with the positive power supply. The device operates over a wide range of supply voltages from standard ± 15V operational amplifier supplies down to the single +12V or +24V used for industrial electronic systems. . Order codes Part number Temp range, ° C Package Packing TDE1747DP -25°C to +85°C DIP-8 Tube TDE1747FP -25°C to +85°C SO14 Tube TDE1747FPT -25°C to +85°C SO14 Tape and reel September 2006 Rev 1 1/17 www.st.com 17 TDE1747 Contents Contents 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections and schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 TDE1747 Maximum ratings 1 Maximum ratings 1.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Value Unit 50 (1) V Input voltage 50 V VID Differential input voltage 50 V IO Output current 1 A Internally Limited W VCC VI Parameter Supply voltage Ptot Power dissipation (TA = +25°C) Toper Operating Free–air Temperature Range – 25 to + 85 °C TSTG Storage temperature range – 65 to + 150 °C 1. 60V, t ≤10ms 1.2 Table 2. Symbol Thermal data Thermal data Description Value Unit RthJA Thermal Resistance Junction-ambient 120 °C/W RthJC Thermal Resistance Junction-case 50 °C/W Rth Junction-ceramic Substrate (case glued to substrate) SO14 90 °C/W Rth Junction-ceramic Substrate (case glued to substrate, substrate temperature maintained constant) SO14 65 °C/W 3/17 TDE1747 Electrical characteristics 2 Electrical characteristics TJ = Table 3. − 25 to +85°C, VCC = 8 to 45 V, unless otherwise specified (note 1) Electrical characteristics Symbol Parameter Min Typ Max Unit VIO Input offset voltage(1)(2) – 2 50 mV IIB Input bias current – 0.1 1.5 mA High level Low level – – 4 2 6 4 mA mA Common–mode input voltage range 2 – VCC–2 V – – 480 35 – 50 mA mA – – 1.15 1.05 1.4 1.3 V V – 0.01 10 µA Supply Current (VCC = +24V, IO = 0) ICC VI(max) Short–circuit Current Limit (TA = 25°C, VCC = +24V) ISC RSC= 1.5Ω RSC= ∞ VCC–VO Output saturation voltage (output low) (VI+– VI- ≥ 50mV, RSC = 0, IO = 300mA, ) TJ = + 25°C TA = + 25°C IOL Output leakage current (output high) (VO = 0, VCC = +24V, TA = + 25°C) 1. For operating at high temperature, the TDE1747, must be derated based on a +150°C maximum junction temperature and junction-ambient thermal resistance of 120°C/W for DIP-8 and 100°C/W for the SO14. 2. The offset voltage given is the maximum value of input voltage required to drive the output voltage within 2V of the ground or the supply voltage. 4/17 TDE1747 3 Pin connections and schematic diagrams Pin connections and schematic diagrams Figure 1. Pin connections (top views) Figure 2. Schematic diagram 5/17 Pin connections and schematic diagrams 6/17 Figure 3. Test circuit Figure 4. Simplified schematic TDE1747 TDE1747 4 Typical characteristics Typical characteristics Figure 5. Available output current vs limiting resistors Figure 6. Peak short-circuit vs limiting resistor Figure 7. Short-circuit current vs case temperature Figure 8. Minimum limiting resistor value vs supply voltage 7/17 TDE1747 Typical characteristics Figure 9. Output current vs output saturation voltage Figure 11. Supply current vs junction temperature 8/17 Figure 10. Supply current vs supply voltage Figure 12. Safe operating area (not repetitive surge) TDE1747 Typical characteristics Figure 13. Response time 9/17 Typical applications 5 Typical applications Figure 14. Base circuit Figure 15. Output current extension (5A) 10/17 TDE1747 TDE1747 Typical applications Figure 16. Driving low impedance relays (IO = 300mA) 11/17 Waveforms 6 Waveforms Figure 17. Input current vs time Figure 18. Response time with zener diode Figure 19. Response time without zener diode 12/17 TDE1747 TDE1747 7 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 13/17 TDE1747 Package mechanical data Table 4. SO14 Mechanical data mm Inch Dim. Min Typ Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.30 0.004 0.012 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.01 (1) 8.55 8.75 0.337 0.344 E 3.80 4.0 0.150 0.157 D e H 1.27 5.8 0.050 6.20 0.228 0.244 h 0.25 0.50 0.01 0.02 L 0.40 1.27 0.016 0.050 k ddd 0° (min.), 8° (max.) 0.10 0.004 1. “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. Figure 20. Package dimensions 0016019 D 14/17 TDE1747 Table 5. Package mechanical data DIP-8 Mechanical data mm Inch Dim. Min A Typ Min 3.32 a1 0.51 B 1.15 b b1 Typ 0.131 1.65 0.045 0.065 0.356 0.55 0.014 0.022 0.204 0.304 0.008 0.012 10.92 7.95 9.75 0.430 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 I L Max 0.020 D E Max 0.260 5.08 3.18 Z 3.81 1.52 0.200 0.125 0.150 0.060 Figure 21. Package dimensions 15/17 TDE1747 Revision history 8 Revision history Table 6. 16/17 Revision history Date Revision 20-Sep-2006 1 Changes New template TDE1747 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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