SN65LVDM1676
SN65LVDM1677
www.ti.com
SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
HIGH-SPEED DIFFERENTIAL LINE TRANSCEIVERS
FEATURES
•
•
•
•
•
•
•
•
•
Sixteen Low-Voltage Differential Transceivers.
Designed for Signaling Rates up to 200 Mbps
per Receiver or 650 Mbps per Transmitter.
Simplex (Point-to-Point) or Half-Duplex
(Multipoint) Interface
Typical Differential Output Voltage of 340 mV
Into a 50-Ω Load
Integrated 110-Ω Line Termination on
'LVDM1677 Product
Propagation Delay Time:
– Driver: 2.5 ns Typ
– Receiver: 3 ns Typ
Driver is High Impedance When Disabled or
With VCC < 1.5 V for Power Up/Down
Glitch-Free Performance and Hot-Plugging
Events
Bus-Terminal ESD Protection Exceeds 12 kV
Low-Voltage TTL (LVTTL) Logic Input Levels
Are 5-V Tolerant
Packaged in Thin Shrink Small-Outline
Package With 20 mil Terminal Pitch
DESCRIPTION
The
SN65LVDM1676
and
SN65LVDM1677
(integrated termination) are sixteen differential line
transmitters or receivers (tranceivers) that use
low-voltage differential signaling (LVDS) to achieve
signaling rates up to 200 Mbps per transceiver
configured as a receiver and up to 650 Mbps per
transceiver configured as a transmitter. These
products are similar to TIA/EIA-644 standard
compliant devices (SN65LVDS) counterparts except
that the output current of the drivers are doubled.
This modification provides a minimum differential
output voltage magnitude of 247 mV into a 50-Ω load
and allows double-terminated lines and half-duplex
operation. The receivers detect a voltage difference
of 100 mV with up to 1 V of ground potential
difference between a transmitter and receiver.
SN65LVDM1676DGG ( Marked as LVDM1676)
SN65LVDM1677DGG (Marked as LVDM1677)
(TOP VIEW)
GND
VCC
VCC
GND
ATX/RX
A1A
A2A
A3A
A4A
BTX/RX
B1A
B2A
B3A
B4A
GND
VCC
VCC
GND
C1A
C2A
C3A
C4A
CTX/RX
D1A
D2A
D3A
D4A
DTX/RX
GND
VCC
VCC
GND
1
64
2
63
3
62
4
61
5
60
6
59
7
58
8
57
9
56
10
55
11
54
12
53
13
52
14
51
15
50
16
49
17
48
18
47
19
46
20
45
21
44
22
43
23
42
24
41
25
40
26
39
27
38
28
37
29
36
30
35
31
34
32
33
A1Y
A1Z
A2Y
A2Z
A3Y
A3Z
A4Y
A4Z
B1Y
B1Z
B2Y
B2Z
B3Y
B3Z
B4Y
B4Z
C1Y
C1Z
C2Y
C2Z
C3Y
C3Z
C4Y
C4Z
D1Y
D1Z
D2Y
D2Z
D3Y
D3Z
D4Y
D4Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2007, Texas Instruments Incorporated
SN65LVDM1676
SN65LVDM1677
www.ti.com
SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The intended application of this device and signaling technique is for point-to-point baseband data transmission
over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board
traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with
the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for
synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the
attenuation characteristics of the media, the noise coupling to the environment, and other system
characteristics.)
The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from –40°C to 85°C.
FUNCTION TABLE (1)
INPUTS
(1)
OUTPUTS
(Y – Z)
TX/RX
A
Y
Z
A
VID≥ 100 mV
L
NA
Z
Z
H
–100 mV < VID < 100 mV
L
NA
Z
Z
?
VID ≤ -100 mV
L
NA
Z
Z
L
Open circuit
L
NA
Z
Z
H
NA
H
L
L
H
Z
NA
H
H
H
L
Z
H = high level, L= low level, Z= high impedance, ? = indeterminate
LVD Transceiver
A
Y
Z
TX/RX
2
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
A1A
A1Y
B1A
A1Z
A2A
A2Y
B1Z
B2A
A2Z
ATX/RX
A3A
BTX/RX
A3Y
B3A
A4Y
C1Y
B4A
C2Y
D1A
C3A
D2A
D2Y
D2Z
DTX/RX
C3Y
D3A
C3Z
C4A
D1Y
D1Z
C2Z
CTX/RX
B4Y
B4Z
C1Z
C2A
B3Y
B3Z
A4Z
C1A
B2Y
B2Z
A3Z
A4A
B1Y
C4Y
D3Y
D3Z
D4A
C4Z
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D4Y
D4Z
3
SN65LVDM1676
SN65LVDM1677
www.ti.com
SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
VCC
50 Ω
A, TX/RX Input
10 kΩ
5Ω
Y or Z
Output
7V
300 kΩ
7V
VCC
VCC
300 kΩ
300 kΩ
5Ω
A Output
Z Input
Y Input
7V
7V
110 Ω
’LVDM1677 Product Only
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SN65LVDM1676
SN65LVDM1677
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1) (2)
RATING
VCC
Supply voltage range
VI
Input voltage range
|VID|
Differential input voltage magnitude, (SN65LVDM1677 only)
IO
Receiver output current
PD
Continuous power dissipation
ESD
(1)
(2)
(3)
–0.5 V to 4 V
Electrostatic discharge
A, TX/RX
–0.5 V to 6 V
Y or Z
–0.5 V to 4 V
1V
±20 mA
(3)
See the Dissipation Rating Table
Y, Z, and GND
Class 3, A: 8 kV, B: 600 V
All Pins
Class 3, A: 7 kV, B: 500 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with MIL-STD-883C Method 3015.7.
DISSIPATION RATING TABLE
(1)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR (1)
ABOVE TA = 25°C
TA = 85°C
POWER RATING
DGG
2094 mW
16.7 mW/°C
1089 mW
This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air
flow.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
3.3
3.6
VCC
Supply voltage
3
VIH
High-level input voltage
2
VIL
Low-level input voltage
|VID|
Magnitude of differential input voltage
VIC
Common-mode input voltage
0.8
0.1
ŤV Ť
ID
2
0.6
Receiver low-level output current
IOH
Receiver high-level output current
TA
Operating free-air temperature
ID
2
(1)
8
–8 (1)
–40
V
ŤV Ť
2.4 –
VCC–0.8
IOL
UNIT
85
V
mA
°C
The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (
1)
MAX
140
175
45
60
340
454
UNIT
DRIVER
ICC
Driver enabled, receiver disabled
RL = 50 Ω ('LVDM1676) or RL = 100 Ω ('LVDM1677)
Supply current
Driver disabled, receiver enabled, no load
RL = 50 Ω ('LVDM1676) or
RL = 100 Ω ('LVDM1677),
See Figure 2 and Figure 1
|VOD|
Differential output voltage magnitude
∆|VOD|
Change in differential output voltage
magnitude between logic states
VOC(SS)
Steady-state common-mode output voltage
∆VOC(S
Change in steady-state common-mode
output voltage between logic states
S)
RL = 50 Ω ('LVDM1676) or
RL = 100 Ω ('LVDM1677), See Figure 3
247
mA
mV
–50
50
1.125
1.37
5
–50
50
mV
50
150
mV
V
VOC(PP)
Peak-to-peak common-mode output
voltage
IIH
High-level input current
VIH = 2 V
3
20
µA
IIL
Low-level input current
VIL = 0.8 V
2
10
µA
IOS
Short-circuit output current
VOY or VOZ = 0 V
10
mA
VOD = 0 V
10
mA
IO(OFF)
Power-off output current
VCC = 1.5 V,
10
µA
CIN
Input capacitance
VI = 0.4 sin (4E6πt) + 0.5 V
VO = 2.4 V
–10
5
pF
RECEIVER
Positive-going differential input voltage
threshold
VIT+
VIT–
Negative-going differential input voltage
threshold
VOH
High-level output voltage
IOH = -8 mA
VOL
Low-level output voltage
IOL = 8 mA
II
Input current (Y or Z inputs)
IID
(1)
Power-off input current (Y or Z inputs)
mV
–100
2.4
V
0.4
VIY = VIZ = 0 V
–40
VIY = VIZ = 2.4 V
'LVDM1676
VIY = 0 V and VIZ = 100 mV,
VIY = 2.4 V and VIZ = 2.3 V
'LVDM1677
VIY = 0.2 V and VIZ = 0 V,
VIY = 2.4 V and VIZ = 2.2 V
Differential input current |IIY– IIZ| (inputs)
II(OFF)
6
100
See Figure 6 and Table 1
VCC = 0 V, VI = 2.4 V
All typical values are at 25°C and with a 3.3-V supply.
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–24
V
µA
–8
–1.2
5
10
µA
1.5
2.2
mA
–25
25
µA
SN65LVDM1676
SN65LVDM1677
www.ti.com
SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP (1)
MAX
UNIT
DRIVER
tPLH
Propagation delay time, low-to-high-level output
1.3
2.5
3.6
tPHL
Propagation delay time, high-to-low-level output
1.3
2.5
3.6
tr
Differential output signal rise time
0.5
1.2
tf
Differential output signal fall time
0.5
1.2
tsk(p)
Pulse skew (|tPHL - tPLH|)
0.1
0.6
tsk(o)
Channel-to-channel output skew (2)
0.1
0.4
tsk(pp)
Part-to-part skew (3)
tPZH
Propagation delay time, high-impedance-to-high-level output
11
20
tPZL
Propagation delay time, high-impedance-to-low-level output
10
20
tPHZ
Propagation delay time, high-level-to-high-impedance output
3
10
tPLZ
Propagation delay time, low-level-to-high-impedance output
3
10
RL = 50 Ω ('LVDM1676) or
RL = 100 Ω ('LVDM1677),
CL = 10 pF, See Figure 4
ns
1
See Figure 5
RECEIVER
tPLH
Propagation delay time, low-to-high-level output
1.5
3
4.5
tPHL
Propagation delay time, high-to-low-level output
1.5
3
4.5
tr
Output signal rise time
0.6
1.6
tf
Output signal fall time
0.6
1.6
tsk(p)
Pulse skew (|tPHL– tPLH|)
0.2
0.8
0.7
1.2
CL = 10 pF,
See Figure 7
skew (4)
tsk(o)
Channel-to-channel output
tsk(pp)
Part-to-part skew (5)
tPZH
Propagation delay time, high-impedance-to-high-level output
9
15
tPZL
Propagation delay time, high-impedance-to-low-level output
8
15
tPHZ
Propagation delay time, high-level-to-high-impedance output
12
20
tPLZ
Propagation delay time, low-level-to-high-impedance output
11
20
(1)
(2)
(3)
(4)
(5)
ns
1
See Figure 8
All typical values are at 25°C and with a 3.3-V supply.
tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the
same direction while driving identical specified loads.
tsk(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
tsk(o) is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the
same direction while driving identical specified loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
PARAMETER MEASUREMENT INFORMATION
IOY
Y
II
IOZ
Z
VOD
VOY
VOC
VI
(VOY + VOZ)/2
VOZ
Figure 1. Driver Voltage and Current Definitions
3.75 kΩ
Y
VOD
Input
Z
RL
3.75 kΩ
±
0 V ≤ VTEST ≤ 2.4 V
Figure 2. Driver VOD Test Circuit
Y
RL/2 (2 Places)
3V
A
0V
Input
Z
VOC(PP)
VOC(SS)
VOC
CL = 10 pF
(2 Places)
VOC
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T. The measurement of VOC(PP) is made on test equipment with a –3 dB bandwidth of at least 300 MHz.
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3V
VCC/2
Input
tpLH
Y
Input
Z
VOD
0V
tpHL
100%
80%
RL
VOD(H)
Output
CL = 10 pF
(2 Places)
0V
VOD(L)
20%
0%
tf
tr
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T.
Figure 4. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
RL/2 (2 Places)
Y
0.8 V or 2 V
Z
CL = 10 pF
(2 Places)
TX/RX
VOY
VOZ
+
–
1.2 V
3V
VCC/2
0V
TX/RX
tpZH
tpHZ
@ 1.4 V
1.25 V
1.2 V
VOY or VOZ
tpZL
tpHZ
1.2 V
1.15 V
@1V
VOZ or VOY
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T.
Figure 5. Enable and Disable Time Circuit and Definitions
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
IIY
IIZ
(VIY + VIZ)/2
Y
VID
IO
A
Z
VIY
VIC
VO
VIZ
Figure 6. Voltage Definitions
Table 1. Receiver Minimum and Maximum Input Threshold Test Voltages
RESULTING DIFFERENTIAL
INPUT VOLTAGE
APPLIED VOLTAGES
RESULTING COMMONMODE INPUT VOLTAGE
VIY
VIZ
VID
VIC
1.25 V
1.15 V
100 mV
1.2 V
1.15 V
1.25 V
–100 mV
1.2 V
2.4 V
2.3 V
100 mV
2.35 V
2.3 V
2.4 V
–100 mV
2.35 V
0.1 V
0V
100 mV
0.05 V
0V
0.1 V
–100 mV
0.05 V
1.5 V
0.9 V
600 mV
1.2 V
0.9 V
1.5 V
–600 mV
1.2 V
2.4 V
1.8 V
600 mV
2.1 V
1.8 V
2.4 V
–600 mV
2.1 V
0.6 V
0V
600 mV
0.3 V
0V
0.6 V
–600 mV
0.3 V
VID
VIY
1.4 V
VIZ
1V
VID
0.4 V
0V
VIY
VIZ
CL = 10 pF
VO
–0.4 V
tpHL
VO
tpLH
~VCC
80%
VCC/2
~0V
20%
tf
tr
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T.
Figure 7. Timing Test Circuit and Waveforms
10
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
1.2 V
Z
500 Ω
A
Y
10 pF
VO
±
VTEST
TX/RX
NOTE: All input pulses are supplied by a generator having the following
characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps,
pulse width = 500 ± 10 ns. CL includes instrumentation and fixture
capacitance within 0,06 m of the D.U.T.
2.5 V
VTEST
Y
1V
3V
VCC/2
0V
TX/RX
tpLZ
tpZL
2.5 V
VCC/2
A
VOL + 0.5 V
VOL
0V
VTEST
Y
1.4 V
3V
VCC/2
0V
TX/RX
tpHZ
tpZH
A
VOH
VCC/2
VOH – 0.5 V
0V
Figure 8. Enable/Disable Time Test Circuit and Waveforms
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
TYPICAL CHARACTERISTICS
COMMON-MODE INPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE
2.5
VIC − Common-Mode Input Voltage − V
VCC > 3.15 V
VCC = 3 V
2
1.5
1
0.5
MIN
0
0
0.1
0.2
0.3
0.4
0.5
0.6
|VID|− Differential Input Voltage − V
Figure 9.
DRIVER
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
DRIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
4
3.5
VCC = 3.3 V
TA = 25°C
V OH− High-Level Output Voltage − V
V OL − Low-Level Output Voltage − V
VCC = 3.3 V
TA = 25°C
3
2
1
0
3
2.5
2
1.5
1
.5
0
0
2
4
6
8
10
12
0
IOL − Low-Level Output Current − mA
Figure 10.
12
−2
−4
Figure 11.
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−6
IOH − High-Level Output Current − mA
−8
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TYPICAL CHARACTERISTICS (continued)
RECEIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
RECEIVER
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
4
5
VCC = 3.3 V
TA = 25°C
VOL − Low-Level Output Votlage − V
VOH − High-Level Output Voltage − V
VCC = 3.3 V
TA = 25°C
3
2
1
0
4
3
2
1
0
0
−20
−40
−60
IOH − High-Level Output Current − mA
−80
0
Figure 12.
20
40
60
IOL − Low-Level Output Current − mA
80
Figure 13.
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
TYPICAL CHARACTERISTICS (continued)
DRIVER EYE PATTERN
TEST CONDITIONS
•
•
•
•
VCC = 3.6 V
TA = 25°C (ambient temperature)
All 16 channels switching simultaneously with NRZ data. Scope is triggered at the same frequency with pulse. Input
signal level = 0 V to 3 V single ended.
Resistive loading with no added capacitance
EQUIPMENT
•
•
•
Hewlett Packard HP6624A DC power supply
Tektronix TDS6604 Digital Storage Scope
Agilent ParBERT E4832A
Hewlett Packard HP6624A
DC Power Supply
Agilent ParBERT
(E4832A)
Bench Test Board
Figure 14. Equipment Setup
14
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Tektronix TDS6604
Digital Storage Scope
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
TYPICAL CHARACTERISTICS (continued)
(a) representative Transceiver configured as Rx @ 200 Mbps
(Ch1 = xyA)
(b) representative Transceiver configured as Tx @ 650 Mbps
(M1 = xyY-xyZ)
NOTE: x represents transceiver group A, B, C, or D, and y represents transceiver 1, 2, 3, or 4.
Figure 15. Typical Driver Eye Pattern for the SN65LVDM1676 With 12 Transceivers Configured as Rx and
4 Transceivers Configured as Tx all Switching Frequency Asynchronous Data
(TA = 25°C; VCC = 3.6 V; PRBS = 223-1)
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SLLS430D – NOVEMBER 2000 – REVISED JUNE 2007
APPLICATION INFORMATION
FAIL SAFE
One of the most common problems with differential signaling applications is how the system responds when no
differential voltage is present on the signal pair. The LVDS receiver is like most differential line receivers, in that
its output logic state can be indeterminate when the differential input voltage is between –50 mV and 50 mV and
within its recommended input common-mode voltage range. TI's LVDS receiver is different, however, in how it
handles the open-input circuit situation.
Open-circuit means that there is little or no input current to the receiver from the data line itself. This could be
when the driver is in a high-impedance state or the cable is disconnected. When this occurs, the LVDS receiver
will pull each line of the signal pair to near VCC through 300-kΩ resistors as shown in Figure 16. The fail-safe
feature uses an AND gate with input voltage thresholds at about 2.3 V to detect this condition and force the
output to a high-level, regardless of the differential input voltage.
VCC
300 kΩ
300 kΩ
A
Rt = 100 Ω (Typ)
Y
B
VIT ≈ 2.3 V
Figure 16. Open-Circuit Fail Safe of the LVDS Receiver
It is only under these conditions that the output of the receiver will be valid with less than a 50-mV differential
input voltage magnitude. The presence of the termination resistor, Rt, does not affect the fail-safe function as
long as it is connected as shown in the figure. Other termination circuits may allow a dc current to ground that
could defeat the pullup currents from the receiver and the fail-safe feature.
16
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVDM1676DGG
ACTIVE
TSSOP
DGG
64
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1676DGGG4
ACTIVE
TSSOP
DGG
64
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1676DGGR
ACTIVE
TSSOP
DGG
64
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1676DGGRG4
ACTIVE
TSSOP
DGG
64
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1677DGG
ACTIVE
TSSOP
DGG
64
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1677DGGG4
ACTIVE
TSSOP
DGG
64
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1677DGGR
ACTIVE
TSSOP
DGG
64
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN65LVDM1677DGGRG4
ACTIVE
TSSOP
DGG
64
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65LVDM1676DGGR
TSSOP
DGG
64
2000
330.0
24.4
8.4
17.3
1.7
12.0
24.0
Q1
SN65LVDM1677DGGR
TSSOP
DGG
64
2000
330.0
24.4
8.4
17.3
1.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65LVDM1676DGGR
TSSOP
DGG
64
2000
346.0
346.0
41.0
SN65LVDM1677DGGR
TSSOP
DGG
64
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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