2SK2610 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSIII) 2SK2610 Chopper Regulator, DC−DC Converter and Motor Drive Applications z Low drain−source ON resistance : RDS (ON) = 2.3 Ω (typ.) z High forward transfer admittance : |Yfs|= 4.4 S (typ.) z Low leakage current : IDSS = 100 μA (max) (VDS = 720 V) z Enhancement mode : Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Unit: mm Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain−source voltage VDSS 900 V Drain−gate voltage (RGS = 20 kΩ) VDGR 900 V Gate−source voltage VGSS ±30 V ID 5 Drain current DC (Note 1) A 1. GATE 2. DRAIN (HEAT SINK) IDP 15 Drain power dissipation (Tc = 25°C) PD 150 W Single pulse avalanche energy (Note 2) EAS 595 mJ Avalanche current IAR 5 A Repetitive avalanche energy (Note 3) EAR 15 mJ TOSHIBA Channel temperature Tch 150 °C Weight: 4.6 g (typ.) Storage temperature range Tstg −55~150 °C Pulse (Note 1) 3. SOURCE JEDEC ― JEITA SC-65 2-16C1B Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to case Rth (ch−c) 0.833 °C / W Thermal resistance, channel to ambient Rth (ch−a) 50 °C / W Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: VDD = 90 V, Tch = 25°C (initial), L = 43.6 mH, IAR = 5 A, RG = 25 Ω Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2006-11-10 2SK2610 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Gate−source breakdown voltage Drain cut−off current Drain−source breakdown voltage Symbol Test Condition Min Typ. Max Unit IGSS VGS = ±30 V, VDS = 0 V — — ±10 μA V (BR) GSS IG = ±10 μA, VDS = 0 V ±30 — — V IDSS VDS = 720 V, VGS = 0 V — — 100 μA V (BR) DSS ID = 10 mA, VGS = 0 V 900 — — V Vth VDS = 10 V, ID = 1 mA 2.0 — 4.0 V Drain−source ON resistance RDS (ON) VGS = 10 V, ID = 3.0 A — 2.3 2.5 Ω Forward transfer admittance |Yfs| VDS = 20 V, ID = 3.0 A 1.1 4.4 — S Input capacitance Ciss — 1200 — Reverse transfer capacitance Crss — 20 — Output capacitance Coss — 120 — tr — 40 — ton — 90 — Gate threshold voltage Rise time Turn−on time VDS = 25 V, VGS = 0 V, f = 1 MHz Switching time pF ns Fall time tf — 60 — Turn−off time toff — 200 — Total gate charge (gate−source plus gate−drain) Qg — 45 — Gate−source charge Qgs — 25 — Gate−drain (“miller”) Charge Qgd — 20 — VDD ≈ 400 V, VGS = 10 V, ID = 5 A nC Source−Drain Ratings and Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Continuous drain reverse current (Note 1) IDR — — — 5 A Pulse drain reverse current (Note 1) IDRP — — — 15 A Forward voltage (diode) VDSF — — −1.9 V Reverse recovery time trr — 1300 — ns Reverse recovery charge Qrr — 11 — μC IDR = 5 A, VGS = 0 V IDR = 5 A, VGS = 0 V, dIDR / dt = 100 A / μs Marking TOSHIBA K2610 Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. 2 2006-11-10 2SK2610 3 2006-11-10 2SK2610 4 2006-11-10 NORMALIZED TRANSIENT THERMAL IMPEDANCE rth (t)/Rth (ch-c) 2SK2610 RG = 25 Ω VDD = 90 V, L = 43.6 mH 5 EAS = B VDSS 1 ⎛ ⎞ ⋅ L ⋅ I2 ⋅ ⎜ ⎟ 2 ⎝ B VDSS − VDD ⎠ 2006-11-10 2SK2610 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2006-11-10