TI TPA152D

TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
D
D
D
D
D
D
D
D
D PACKAGE
(TOP VIEW)
High-Fidelity Line-Out/HP Driver
75-mW Stereo Output
PC Power Supply Compatible
Pop Reduction Circuitry
Internal Mid-Rail Generation
Thermal and Short-Circuit Protection
Surface-Mount Packaging
Pin Compatible With TPA302
VO 1
MUTE
BYPASS
IN2–
1
8
2
7
3
6
4
5
IN1–
GND
VDD
VO 2
description
The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering
75 mW per channel into a 32-Ω load. THD+N is less than 0.2% across the audio band of 20 to 20 kHz. For
10 kΩ loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio
band of 20 to 20 kHz.
The TPA152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use
where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce
transients during power up, power down, and mute mode.
Amplifier gain is externally configured by means of two resistors per input channel and does not require external
compensation for settings of 1 to 10. The TPA152 is packaged in the 8-pin SOIC (D) package that reduces board
space and facilitates automated assembly.
typical application circuit
RF
6
VDD
CB
Stereo Audio
Input
RI
8 IN1–
R
–
3 BYPASS
CI
CC
VO1
1
RC
+
CB
From System
Control
2
RI
L
RL
Depop
Circuitry
Mute
Control
RL
Stereo
4 IN2–
–
CI
VO2 5
CC
+
RC
RF
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
AVAILABLE OPTIONS
TA
PACKAGED DEVICE
SMALL OUTLINE
TPA152D†
– 40°C to 85°C
† The D packages are available taped and reeled. To
order a taped and reeled part, add the suffix R
(e.g., TPA152DR)
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
BYPASS
3
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF
to 1-µF capacitor.
GND
7
GND is the ground connection.
IN1–
8
I
IN1– is the inverting input for channel 1.
IN2–
4
I
IN2– is the inverting input for channel 2.
MUTE
2
I
A logic high puts the device into MUTE mode.
VDD
VO1
6
I
1
O
VDD is the supply voltage terminal.
VO1 is the audio output for channel 1.
VO2
5
O
VO2 is the audio output for channel 1.
2
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input voltage , VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (See Dissipation Rating Table)
Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150° C
Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125° C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
D
TA ≤ 25°C
724 mW
DERATING FACTOR
TA = 70°C
464 mW
5.8 mW/°C
TA = 85°C
376 mW
recommended operating conditions
Supply voltage, VDD
Operating free-air temperature, TA
MIN
MAX
4.5
5.5
UNIT
V
– 40
85
°C
TYP
MAX
dc electrical characteristics at TA = 25°C, VDD = 5 V
PARAMETER
VOO
TEST CONDITIONS
MIN
Output offset voltage
10
Supply ripple rejection ratio
VDD = 4.9 V to 5.1 V
See Figure 13
81
UNIT
mV
dB
IDD
IDD(MUTE)
Supply current
5.5
14
mA
Supply current in MUTE
5.5
14
mA
ZI
Input impedance
>1
MΩ
ac operating characteristics VDD = 5 V, TA = 25°C, RL = 32 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Output power (each channel)
THD ≤ 0.03%,
Gain = 1,
THD+N
Total harmonic distortion plus noise
PO = 75 mW,
See Figure 2
20 Hz–20 kHz, Gain = 1,
BOM
Maximum output power bandwidth
THD <0.6%,
Phase margin
AV = 5,
Open loop,
See Figure 16
Supply ripple rejection ratio
1 kHz,
CB = 1 µF,
Mute attenuation
See Figure 15
Ch/Ch output separation
See Figure 13
Signal-to-Noise ratio
VO = 1 V(rms),
See Figure 10
PO
Gain = 1
See Figure 1
See Figure 2
TYP
75†
MAX
UNIT
mW
0.2%
>20
kHz
80°
See Figure 12
See Figure 11
Vn
Noise output voltage
† Measured at 1 kHz.
NOTES: 1. The dc output voltage is approximately VDD/2.
2. Output power is measured at the output pins of the IC at 1 kHz.
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MIN
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65
dB
110
dB
102
dB
104
dB
6
µV(rms)
3
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
ac operating characteristics VDD = 5 V, TA = 25°C, RL = 10 kΩ
PARAMETER
THD+N
BOM
kSVR
TEST CONDITIONS
MIN
TYP
VI = 1 V(rms),
See Figure 6
20 Hz–20 kHz, Gain = 1,
VO(PP) = 4 V,
See Figure 8
20 Hz–20 kHz, Gain = 1,
Maximum output power bandwidth
G = 5,
THD <0.02%, See Figure 6
>20
Phase margin
Open loop,
See Figure 16
80°
Supply voltage rejection ratio
1 kHz,
CB = 1 µF,
Mute attenuation
See Figure 15
Ch/Ch output separation
See Figure 13
Signal-to-Noise ratio
VO = 1 V(rms),
See Figure 10
Total harmonic distortion plus noise
Vn
Noise output voltage
† Measured at 1 kHz.
Gain = 1,
See Figure 12
See Figure 11
MAX
UNIT
0.005%
0.005%
kHz
65
dB
110
dB
102
dB
104
dB
6
µV(rms)
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
THD+N
Total harmonic distortion plus noise
vs Output power
THD+N
Total harmonic distortion plus noise
vs Frequency
THD+N
Total harmonic distortion plus noise
vs Output voltage
5, 7
Vn
SNR
Output noise voltage
vs Frequency
10
Signal-to-noise ratio
vs Gain
11
Supply ripple rejection ratio
vs Frequency
12
Crosstalk
vs Frequency
13, 14
Mute Attenuation
vs Frequency
15
Open-loop gain and phase
vs Frequency
16, 17
Closed-loop gain and phase
vs Frequency
18
IDD
PO
Supply current
vs Supply voltage
19
Output power
vs Load resistance
20
PD
Power dissipation
vs Output power
21
4
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1, 4
2, 3, 6, 8, 9
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
2
THD+N –Total Harmonic Distortion + Noise – %
THD+N –Total Harmonic Distortion + Noise – %
2
f = 1 kHz
AV = –1 V/V
1
0.1
0.01
0.001
1
10
20
30
40
50
60
70
80
1
PO = 75 mW
RL = 32 Ω
AV = –5 V/V
AV =– 2 V/V
0.1
AV = –1 V/V
0.01
0.001
20
90
100
PO – Output Power – mW
Figure 2
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
2
AV = –1 V/V
RL = 32 Ω
THD+N –Total Harmonic Distortion + Noise – %
THD+N –Total Harmonic Distortion + Noise – %
0.3
PO = 75 mW
PO = 25 mW
0.01
PO = 50 mW
0.001
20
100
10k 20k
f – Frequency – Hz
Figure 1
0.1
1k
1k
10k 20k
1
RL = 32 Ω
20 kHz
0.1
1 kHz
0.01
20 Hz
0.001
0.1
f – Frequency – Hz
1
10
100
PO – Output Power – mW
Figure 3
Figure 4
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT VOLTAGE
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.1
THD+N –Total Harmonic Distortion + Noise – %
THD+N –Total Harmonic Distortion + Noise – %
2
f = 1 kHz
AV = –1 V/V
RL = 10 kΩ
1
0.1
0.01
0.001
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
VO = 1 V(rms)
RL = 10 kΩ
AV = –5 V/V
0.01
AV = –2 V/V
AV = –1 V/V
0.001
20
1.8
100
VO – Output Voltage – V(rms)
Figure 6
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT VOLTAGE
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.1
THD+N –Total Harmonic Distortion + Noise – %
THD+N –Total Harmonic Distortion + Noise – %
2
AV = –1 V/V
RL = 10 kΩ
f = 20 kHz
0.1
f = 20 Hz
0.01
f = 1 kHz
0.001
0.1
0.2
0.4
1
2
VO(PP) = 4 V
AV = –1 V/V
RL = 10 kΩ
0.01
0.001
20
VO – Output Voltage – V(rms)
100
1k
f – Frequency – Hz
Figure 7
6
10k 20k
f – Frequency – Hz
Figure 5
1
1k
Figure 8
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10k 20k
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
20
VI = 1 V(rms)
AV = –1 V/V
Vn – Output Noise Voltage – µV
THD+N –Total Harmonic Distortion + Noise – %
0.1
RL = 32 Ω
0.01
RL = 10,47, and 100 kΩ
0.001
20
100
1k
10
VDD = 5 V
BW = 10 Hz to 22 kHz
RL = 32 Ω to 10 kΩ
AV = –1 V/V
1
20
10k 20k
100
f – Frequency – Hz
Figure 9
10k 20k
Figure 10
SIGNAL-TO-NOISE RATIO
vs
GAIN
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
110
0
RI = 20 kΩ
VDD = 5 V
RL = 32 Ω to 10 kΩ
–10
Supply Ripple Rejection Ratio – dB
105
SNR – Signal-to-Noise Ratio – dB
1k
f – Frequency – Hz
100
95
RL = 10 kΩ
90
RL = 32 Ω
85
–20
CB = 0.1 µF
–30
–40
–50
–60
CB = 1 µF
–70
–80
CB = 2.5 V
–90
80
1
2
3
4
5
6
7
8
9
10
–100
20
Gain – V/V
100
1k
10k 20k
f – Frequency – Hz
Figure 11
Figure 12
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
CROSSTALK
vs
FREQUENCY
CROSSTALK
vs
FREQUENCY
–60
–70
VO = 1 V
VDD = 5 V
RL = 10 kΩ
CB = 1 µF
AV = –1 V/V
–70
–80
–80
Crosstalk – dB
Crosstalk – dB
–60
PO = 75 mW
VDD = 5 V
RL = 32 Ω
CB = 1 µF
AV = –1 V/V
–90
Right to Left
–90
–100
Right to Left
–100
–110
–110
–120
Left to Right
–120
20
Left to Right
100
1k
10k 20k
–130
20
100
1k
f – Frequency – Hz
f – Frequency – Hz
Figure 13
Figure 14
MUTE ATTENUATION
vs
FREQUENCY
–70
VDD = 5 V
RL = 32Ω
CB = 1 µF
Mute Attenuation – dB
–80
90
–100
–110
–120
–130
–140
20
100
1k
f – Frequency – Hz
Figure 15
8
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10k 20k
10k 20k
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
100
No Load
140
120
60
100
40
80
20
60
Phase – °
Open-Loop Gain – dB
80
160
40
0
20
–20
100
1k
100k
10k
1M
10M
0
100M
f – Frequency – Hz
Figure 16
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
1
185
0.8
180
0.4
175
0.2
0
170
–0.2
Phase – °
Closed-Loop Gain – dB
0.6
165
–0.4
RI = 20 kΩ
Rf = 20 kΩ
RL = 32 Ω
CI = 1 µF
AV = –1 V/V
–0.6
–0.8
–1
10
100
1k
10k
100k
160
155
1M
f – Frequency – Hz
Figure 17
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9
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
1
185
0.8
180
0.4
175
0.2
0
170
–0.2
Phase – °
Closed-Loop Gain – dB
0.6
165
–0.4
RI = 20 kΩ
Rf = 20 kΩ
RL = 10 kΩ
CI = 1 µF
AV = –1 V/V
–0.6
–0.8
160
–1
100
10
1k
10k
155
1M
100k
f – Frequency – Hz
Figure 18
OUTPUT POWER
vs
LOAD RESISTANCE
10
90
9
80
PO – Output Power – mW
I DD – Supply Current – mA
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
8
7
6
5
4
THD+N = 0.1%
AV = –1 V/V
70
60
50
40
30
20
3
4.5
5
5.5
10
30
50
Figure 19
10
70
90
110 130 150
Figure 20
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RL – Load Resistance – Ω
VDD – Supply Voltage – V
• DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
POWER DISSIPATION
vs
OUTPUT POWER
100
P D – Power Dissipation – mW
RL = 32 Ω
80
60
40
20
0
0
5
10
15
20
25
PO – Output Power – mW
Figure 21
APPLICATION INFORMATION
selection of components
Figure 22 is a schematic diagram of a typical application circuit.
CI
1 µF
RF
20 kΩ
RI
20 kΩ
CC
330 µF
Audio Input 1
1
Shutdown
(from System Control)
2
VO1
IN1–
MUTE
GND
RO †
20 kΩ
8
7
3
4
CI
1 µF
Audio Input 2
IN 2
VDD
IN2–
VO2
RI
20 kΩ
RF
20 kΩ
6
RL
32 Ω
RL
32 Ω
HP
Jack
1 µF
CB
1 µF
RC†
100 Ω
VDD
5
RO †
20 kΩ
CC
330 µF
RC†
100 Ω
† These resistors are optional. Adding these resistors improves the depop performance of the TPA152.
Figure 22. TPA152 Typical Application Circuit
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
ǒǓ
gain setting resistors, RF and RI
The gain for the TPA152 is set by resistors RF and RI according to equation 1.
Gain
+*
RF
(1)
RI
Given that the TPA152 is a MOS amplifier, the input impedance is very high, consequently input leakage
currents are not generally a concern although noise in the circuit increases as the value of RF increases. In
addition, a certain range of RF values are required for proper start-up operation of the amplifier. Taken together
it is recommended that the effective impedance seen by the inverting node of the amplifier be set between 5
kΩ and 20 kΩ. The effective impedance is calculated in equation 2.
Effective Impedance
+ RRF)RRI
F
(2)
I
As an example, consider an input resistance of 20 kΩ and a feedback resistor of 20 kΩ. The gain of the amplifier
would be – 1 and the effective impedance at the inverting terminal would be 10 kΩ, which is within the
recommended range.
For high performance applications, metal film resistors are recommended because they tend to have lower
noise levels than carbon resistors. For values of RF above 50 kΩ, the amplifier tends to become unstable due
to a pole formed from RF and the inherent input capacitance of the MOS input structure. For this reason, a small
compensation capacitor of approximately 5 pF should be placed in parallel with RF. This, in effect, creates a
low-pass filter network with the cutoff frequency defined in equation 3.
f c(lowpass)
+ 2 p R1 C
(3)
F F
For example if RF is 100 kΩ and CF is 5 pF then fco(lowpass) is 318 kHz, which is well outside the audio range.
input capacitor, CI
In the typical application, an input capacitor, CI, is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency
determined in equation 4.
f c(highpass)
+ 2 p R1 C
(4)
I I
The value of CI is important to consider as it directly affects the bass (low frequency) performance of the circuit.
Consider the example where RI is 20 kΩ and the specification calls for a flat bass response down to 20 Hz.
Equation 4 is reconfigured as equation 5.
CI
+ 2pR f
1
(5)
I c(highpass)
In this example, CI is 0.40 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. A further
consideration for this capacitor is the leakage path from the input source through the input network (RI, CI) and
the feedback resistor (RF) to the load. This leakage current creates a dc offset voltage at the input to the amplifier
that reduces useful headroom, especially in high-gain applications (> 10). For this reason a low-leakage
tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the
capacitor should face the amplifier input in most applications, as the dc level there is held at VDD/2, which is
likely higher that the source dc level. Please note that it is important to confirm the capacitor polarity in the
application.
12
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
power supply decoupling, CS
The TPA152 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1 µF, placed as close as possible to the device VDD lead, works best. For
filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near
the power amplifier is recommended.
midrail bypass capacitor, CB
The midrail bypass capacitor, CB, serves several important functions. During startup or recovery from shutdown
mode, CB determines the rate at which the amplifier starts up. This helps to push the start-up pop noise into
the subaudible range (so slow it can not be heard). The second function is to reduce noise produced by the
power supply caused by coupling into the output drive signal. This noise is from the midrail generation circuit
internal to the amplifier. The capacitor is fed from a 160-kΩ source inside the amplifier. To keep the start-up pop
as low as possible, the relationship shown in equation 6 should be maintained.
ǒ
1
160 kΩ
CB
1
v
Ǔ ǒC R Ǔ
(6)
I I
As an example, consider a circuit where CB is 1 µF, CI is 1 µF and RI is 20 kΩ. Inserting these values into the
equation 9 results in:
6.25
v 50
which satisfies the rule. Bypass capacitor, CB, values of 0.1 µF to 1 µF ceramic or tantalum low-ESR capacitors
are recommended for the best THD and noise performance.
output coupling capacitor, CC
In the typical single-supply single-ended (SE) configuration, an output coupling capacitor (CC) is required to
block the dc bias at the output of the amplifier thus preventing dc currents in the load. As with the input coupling
capacitor, the output coupling capacitor and impedance of the load form a high-pass filter governed by
equation 7.
f c(high)
+ 2 p R1 C
(7)
L C
The main disadvantage, from a performance standpoint, is that the load impedances are typically small, which
drive the low-frequency corner higher. Large values of CC are required to pass low frequencies into the load.
Consider the example where a CC of 68 µF is chosen and loads vary from 32 Ω to 47 kΩ. Table 1 summarizes
the frequency response characteristics of each configuration.
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TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
Table 1. Common Load Impedances vs Low Frequency Output Characteristics in SE Mode
RL
CC
68 µF
LOWEST FREQUENCY
32 Ω
10,000 Ω
68 µF
0.23 Hz
47,000 Ω
68 µF
0.05 Hz
73 Hz
As Table 1 indicates, headphone response is adequate and drive into line level inputs (a home stereo for
example) is very good.
The output coupling capacitor required in single-supply SE mode also places additional constraints on the
selection of other components in the amplifier circuit. With the rules described earlier still valid, add the following
relationship:
ǒ
CB
1
160 kΩ
Ǔvǒ ǓƠ
1
CI RI
1
R LC C
(8)
output pull-down resistor, RC + RO
Placing a 100-Ω resistor, RC, from the output side of the coupling capacitor to ground insures the coupling
capacitor, CC, is charged before a plug is inserted into the jack. Without this resistor, the coupling capacitor
would charge rapidly upon insertion of a plug, leading to an audible pop in the headphones.
Placing a 20-kΩ resistor, RO, from the output of the IC to ground insures that the coupling capacitor fully
discharges at power down. If the supply is rapidly cycled without this capacitor, a small pop may be audible in
10-kΩ loads.
using low-ESR capacitors
Low-ESR capacitors are recommended throughout this applications section. A real capacitor can be modeled
simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the
beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance, the more the
real capacitor behaves like an ideal capacitor.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
MECHANICAL DATA
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0.050 (1,27)
0.020 (0,51)
0.014 (0,35)
14
0.010 (0,25) M
8
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
0.010 (0,25)
1
7
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.069 (1,75) MAX
0.010 (0,25)
0.004 (0,10)
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047 / D 10/96
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
PACKAGE OPTION ADDENDUM
www.ti.com
20-Apr-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPA152D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA152DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA152DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPA152DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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