ZXFV201, ZXFV202, ZXFV203, ZXFV204 Quad, single, triple and dual video amplifiers Device description Features The ZXFV201, ZXFV202, ZXFV203 and ZXFV204 are quad, single, triple and dual, respectively, high speed amplifiers designed for video and other high speed applications. • High speed • Gain of 1 - 3dB bandwidth 210MHz • Slew rate 380V/µs • Good video • 25 MHz 0.1dB bandwidth • Differential gain 0.04% • Differential phase 0.04° • 40mA output current @ 3V Output • Characterized up to 300pF load • ±5 Volt supply operation • Supply current 7.5mA per amplifier Their low differential gain and phase performance make them ideal for video amplifier buffer applications. The quad allows one IC to drive RGBS format component video signals, while the triple provides RGB component video buffer/driver. The dual amplifier is a mainstay of the video market providing two channels in the space of 1 single in SO8. The small size of the ZXFV202 in SOT23 allows it to be placed where needed for position/size critical applications. Applications Together with high output drive and slew rate capability, they bring high performance to video applications. Ordering information Part number ZXFV202E5TA Descrip- Status tion Single Active • Industry standard pinouts • Video gain stages • CCTV buffer • Video distribution • RGB buffering Home theater Reel size (inches) Qty. Part mark • • High speed ADC signal input drive 7 3,000 V202 • Cable driving ZXFV202E5TD Single Obsolete 7 500 V202 ZXFV202N8TA Single Obsolete 7 500 ZXFV202 ZXFV204N8TA Dual Obsolete 7 500 ZXFV204 ZXFV204N8TC Dual Active 13 ZXFV203N14TA Triple Active 7 ZXFV203N14TC Triple Obsolete 13 ZXFV201N14TA Quad LTB 7 ZXFV201N14TC Quad Obsolete 13 2,500 ZXFV204 500 Application diagram Y ZXFV203 +2 2,500 ZXFV203 500 ZXFV201 75⍀ Co-ax 75⍀ Back termination C +2 75⍀ Co-ax 2,500 ZXFV201 Dual amplifier S - video driver Issue 5 - May 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Absolute maximum ratings over operating free-air temperature (unless otherwise stated (a)) Supply voltage (VS+ to VS-) -0.5V to +11V Input voltage (VIN-, VIN+) (b) VS- -0.5V to VS+ +0.5 V Differential input voltage (VID) ±3V Inverting input current (IIN-) (c) ±5mA Output current (continuous, TJ < 110°C) ±60mA Internal power dissipation See power dissipation derating table Storage temperature range -65°C to +150°C Operating ambient junction temperature (TJMAX) 150°C NOTES: (a) Stresses above those listed under Absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (b) During power-up and power-down, these voltage ratings require that signals be applied only when the power supply is connected. (c) At high closed loop gains and low gain setting resistors care must be taken if large input signals are applied to the device which cause the output stage to saturate for extended periods of time. Power derating table Package Theta-ja Power rating at 25'C SOT23-5 195°C/W 0.64W SO8 168°C/W 0.74W SO14 120°C/W 1.04W Recommended operating conditions Parameter Min. Max. Unit ±4.75 ±5.25 V VS± Dual supply voltage range VCMR Common mode input voltage range -3 +3 V TA Ambient temperature range -40 85 °C Recommended resistor values VS± = 5V, CL = 10pF GCL RF RG 680 1 820 2 dB n/c 1000 2 Peaking 0 -2dB 430 430 2dB 470 470 1.5dB 560 560 0 Issue 5 - May 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 DC electrical characteristics (±5V power supplies, Tamb= 25°C unless otherwise stated. Rf = 1k⍀, RL = 150⍀, CL⭐ = 10pF) Parameter Conditions Test Min. Typ. Max. Unit Supply voltage V+ operating range 4.75 5 5.25 V Supply voltage V- operating range -5.25 -5 -4.75 V 5.0 7.5 10 mA Supply current/per channel P Input common mode voltage range P ⫾3 Input offset voltage P 1 10 mV Output offset voltage P 2 20 mV Input bias current, non-inverting input P 5 10 A Input resistance P 2 6.5 M⍀ 1.5 V ⫾3 Output voltage swing IOUT = 40mA P Output drive current VIN = 3V P 40 Positive PSRR ⌬V+ = ±0.25 P 49 57 dB Negative PSRR ⌬V- = ±0.25 P 49 57 dB V mA Test - P = production tested. C = characterized AC electrical characteristics (±5V, Rf = 470⍀, G = 2, CL = 10pF, TA = 25°C, unless otherwise stated) Parameter Min 210 VOUT = 0.2VPP G = +1, RF = 820⍀ 210 Bandwidth, ±0.1dB VOUT = 0.2VPP 30 Slew Rate VOUT = 2VPP G = +2, RF = 470⍀ 600 VOUT = 2VPP G = +1, RF = 820⍀ 380 Bandwidth, -3dB BW0.1 SR Rise time tf Fall time tp Propagation delay VOUT = ±2V, 10% - 90% dG Differential phase, NTSC NTSC/PAL, 280mVPP, Differential phase, NTSC DC = -1.428V to +1.428 V Issue 5 - May 2007 © Zetex Semiconductors plc 2007 Max Unit MHz MHz V/s 5.8 VOUT = ±1V, 10% - 90% dP Typ VOUT = 0.2VPP G = +2, RF = 470⍀ BW-3 tr Conditions 3 4.6 2.6 ns 0.04 % 0.04° www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Applications information A typical circuit application is shown in Figure 1. This is suitable for 75⍀ transmission line connections at both the input and the output and is useful for distribution of wide-band signals such as video via cables. The 75⍀ reverse terminating resistor R4 gives the correct matching condition to a terminated video cable. The amplifier load is then 150⍀ in parallel with the local feedback network. 470 470 Figure 1 Typical video signal application circuit, gain = 2 (overall gain = 1 for 75⍀ load The wide bandwidth of this device necessitates some care in the layout of the printed circuit. A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane. For the power supply filtering, low inductance surface mount capacitors are normally required. It has been found that very good RF decoupling is provided on each supply using a 1000pF NPO size 0805 or smaller ceramic surface mount capacitor, closest to the device pin, with an adjacent 0.1F X7R capacitor. Other configurations are possible and it may be found that a single 0.01F X7R capacitor on each supply gives good results. However this should be supported by larger decoupling capacitors elsewhere on the printed circuit board. Values of 1 to 10F are recommended, particularly where the voltage regulators are located more than a few inches from the device. These larger capacitors are recommended to be solid tantalum electrolytic or ceramic types. Note particularly that the inverting input of this current feedback type of amplifier is sensitive to small amounts of capacitance to ground which occur as part of the practical circuit board layout. This capacitance affects bandwidth, frequency response peaking and pulse overshoot. Therefore to minimize this capacitance, the feedback components R2 and R3 of Figure 1 should be positioned as close as possible to the inverting input connection. Issue 5 - May 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 The frequency response and pulse response will vary according to particular values of resistors and layout capacitance. The response can be tailored for the application to some extent by choice of the value of feedback resistor. Figures 2 and 3 show the small signal unity gain and gain of 2 frequency responses. 3 RF = 680Ω Gain (dB) 0 RF = 820Ω RF = 1kΩ -3 VIN = 200mVPP TA = 25° VS± = ±5V G= 1 RL = 150Ω CL = 10pF -6 1 10 Figure 2 Frequency (MHz) 100 1000 Unity gain small signal bandwidth 9 RF = 430Ω 6 Gain (dB) RF = 470Ω RF = 560Ω 3 VIN = 200mVPP TA = 25° VS± = ±5V G= 2 RL = 150Ω CL = 10pF 0 1 10 Figure 3 Issue 5 - May 2007 © Zetex Semiconductors plc 2007 100 Frequency (MHz) 1000 Gain of 2 small signal bandwidth 5 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Figures 4 and 5 show the large signal unity gain of 2 frequency responses. Large signal G = 2 9 0 6 -3 3 -6 0 Gain (dB) Gain (dB) Large signal G = 1 3 -9 -6 -12 VIN = 1VPP VS± = ±5V RL = 150Ω RF = 820Ω -15 -18 -21 -3 1 VIN = 1VPP VS± = ±5V RL = 150Ω RF = 560Ω -9 TA = 25° G= 1 CL = 10pF -12 10 Frequency (MHz) Figures 4 and 5 100 1000 -15 TA = 25° G= 2 CL = 10pF 1 10 Frequency (MHz) 100 1000 Large signal unity gain of 2 frequency response The ZXFV20x family are primarily video amplifiers; Figures 6 and 7 show the NTSC/PAL differential gain and phase errors at a gain of 2. Diff gain error Diff phase error 0.05% 0.005° 0.04% 0° Differential Phase Error Differential Gain Error 0.04% 0.03% 0.03% 0.02% 0.02% 0.01% 0.01% 0.00% -0.01% VIN = 280mVPP TA = 25° VS± = ±5V G= 2 RL = 150Ω CL = 10pF RF = 560Ω -0.01% -0.72 -0.48 0 0.24 0.48 -0.015° -0.02° -0.03° 0.72 Figures 6 and 7 VIN = 280mVPP TA = 25° VS± = ±5V G= 2 RL = 150Ω CL = 10pF RF = 560Ω -0.72 -0.48 -0.24 0 0.24 0.48 0.72 VBIAS(VDC) VBIAS (VDC) © Zetex Semiconductors plc 2007 -0.01° -0.025° -0.24 Issue 5 - May 2007 -0.005° NTSC/PAL differential gain and phase errors at a gain of 2 6 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Pinout details V S+ OUT V S+IN -IN ZXFV202E5 Single NC IN- V S+ IN+ OUT VS- NC V S- IN3+ VS+ VS- ZXFV204 IN2+ IN1+ IN2 - OUT1 OUT2 OUT4 IN1- IN4 - IN1+ IN4+ OUT2 IN2+ IN2 - IN2- VS- ZXFV204 IN3+ IN3 - OUT2 ZXFV204 Dual © Zetex Semiconductors plc 2007 NC VS+ IN2+ Issue 5 - May 2007 IN3 - OUT1 V S+ IN1 - NC ZXFV203 Triple ZXFV202N8 Single IN1+ OUT3 IN1+ NC OUT1 NC OUT3 ZXFV201 Quad 7 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Package details - SO8, SO14 Dim. Inches Millimeters Dim. Inches Millimeters Min. Max. Min. Max. Min. Max. Min. Max. A 0.053 0.069 1.35 1.75 L 0.016 0.050 0.40 1.27 A1 0.004 0.010 0.10 0.25 e D (8 pin) 0.189 0.197 4.80 5.00 b 0.013 0.020 0.33 0.51 D (14 pin) 0.337 0.344 8.55 8.75 c 0.008 0.010 0.19 0.25 H 0.228 0.244 5.80 6.20 ⍜ 0° 8° 0° 8° E 0.150 0.157 3.80 4.00 h 0.010 0.020 0.25 0.50 0.050 BSC 1.27 BSC Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters Issue 5 - May 2007 © Zetex Semiconductors plc 2007 8 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Package outline - SOT23 E e e1 b 3 leads L1 D E1 A A1 Dim. L c Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A - 1.12 - 0.044 e1 A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055 C 0.085 0.120 0.003 0.008 L 0.25 0.62 0.018 0.024 D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024 - - - - - e 0.95 NOM Min. 0.0375 NOM Max. Inches 1.90 NOM Max. Max. 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 5 - May 2007 © Zetex Semiconductors plc 2007 9 www.zetex.com ZXFV201, ZXFV202, ZXFV203, ZXFV204 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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