ILSI ZTA

2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Product Features:
ZTT and ZTA Series
Applications:
Low Cost
Compatible with Leadfree Processing
Storage Media
Home Appliance
Microprocessors
Office Automation
5 .5 M a x
1 0 .0 M a x
7 .5 M a x
Frequency
1.8 MHz to 50 MHz
ESR (Equivalent Series Resistance)
See Table Below
5 .0 + /-1 .0
1
3
2
Frequency Tolerance @ 25 C
0.5%
Frequency Stability over Temperature
0.3%
0 .3 M a x .
0 .6 + /-0 .1
2 .5 + /-0 .3
2 .5 + /-0 .3
5 .5 M a x
1 0 .0 M a x
0.3% Max. for 10 Years
Aging
1 0 .0 M a x
Temperature
Operating
-40 C to +85 C
Storage
-40 C to +85 C Standard
Part
Frequency
ESR
C1
(MHz)
( Max.)
(pF)
5 .0 + /-1 .0
1
2
3
0 .6 + /-0 .1
2 .5 + /-0 .3
C2
0 .3 M a x .
2 .5 + /-0 .3
1 0 .0 M a x
5 .0 M a x
(pF)
ZTT-MG
1.8 to 4.9
80
30
30
ZTT-MT
5 to 12.9
50
22
22
ZTT-MX
13 to 19.9
40
22
22
ZTT-MX
20 to 25.9
40
15
15
5
7 .5 M a x
5 .0
0 .6 + /-0 .1
0 .3 M a x .
5 .0
+ /-0 .3
ZTT-MX
26 to 50
40
5
ZTA-MG
1.8 to 4.9
80
30*
30*
ZTA-MT
5 to 12.9
50
22*
22*
ZTA-MX
13 to 19.9
40
22*
22*
ZTA-MX
20 to 25.9
40
15*
15*
ZTA-MX
26 to 50
40
5*
5*
5 .0 M a x
1 0 .0 M a x
1 0 .0 M a x
* Recommended external capacitance, not internal to the device.
5 .0
The terminations of the ZTA and ZTT series ceramic resonator are Pb free. Pb
may be contained in the ceramic resonator element of this device and is
exempted via item 7 of the RoHS annex. This ceramic resonator series is
considered RoHS compliant.
Part Number Guide
Sample Part Number:
0 .6 + /-0 .1
0 .3 M a x .
5 .0
+ /-0 .3
D im e n sio n U n its : m m
ZTT - MX - 20.000
Part Series
ZTT - (internal capacitors)
ZTA -(must supply external capacitance for proper circuit operation)
Package Code
Frequency
MG
MT
MX
- 20.000 MHz
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/16/11_B
Specifications subject to change without notice
Page 1
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Pb Free Solder Reflow Profile:
ZTT and ZTA Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Frequency, Date code (Packaging Only)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/16/11_B
Specifications subject to change without notice
Page 2