MCC
TM
Micro Commercial Components
BZT52C2V4S
THRU
BZT52C39S
omponents
20736 Marilla Street Chatsworth
!"#
$
% !"#
Features
x
x
x
x
•
•
•
200 mW
Zener Diode
2.4 to 39 Volts
Planar Die Construction
200mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
SOD-323
A
Absolute Maximum Ratings
Symbol
Parameter
B
Rating
Unit
200
mW
PD
Power dissipation
TJ
Junction Temperature
-65 to +150
к
Storage Temperature Range
-65 to +150
к
TSTG
C
E
H
D
Absolute Maximum Ratings
Symbol
RthJA
Parameter
Thermal Resistance Junction to
Ambient*
Rating
Unit
DIM
625
к/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
Electrical Characteristics
Symbol
Parameter
J
G
Rating
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.063
.071
1.60
1.80
.045
.053
1.15
1.35
.031
.045
0.80
1.15
.010
.016
0.25
0.40
.004
.018
0.10
0.45
.004
.010
0.10
0.25
----.006
----0.15
NOTE
Unit
SUGGESTED SOLDER
PAD LAYOUT
VF
Maximum Forward Voltage
(IF=10mAdc)
0.9
0.074"
V
0.027”
0.022”
Revision: A
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MCC
BZT52C2V4S THRU BZT52C39S
TM
Micro Commercial Components
ELECTRICAL CHARACTERISTICS @25qC
ZENER VOLTAGE
Maximum Zener
Maximum Zener
VZ (1)
Impedance (2)
Impedance (2)
Type
VOLTS
ZZT(OHMS)
ZZK (OHMS)
Max.
Max.
IZK(mA)
Min.
Nom
Max.
IZT(mA)
BZT52C2V4S
2.28
2.4
2.56
5
100
1.0
600
BZT52C2V7S
2.5
2.7
2.9
5
100
1.0
600
BZT52C3V0S
2.8
3.0
3.2
5
95
1.0
600
BZT52C3V3S
3.1
3.3
3.5
5
95
1.0
600
BZT52C3V6S
3.4
3.6
3.8
5
90
1.0
600
BZT52C3V9S
3.7
3.9
4.1
5
90
1.0
600
BZT52C4V3S
4.0
4.3
4.6
5
90
1.0
600
BZT52C4V7S
4.4
4.7
5.0
5
80
1.0
500
BZT52C5V1S
4.8
5.1
5.4
5
60
1.0
480
BZT52C5V6S
5.2
5.6
6.0
5
40
1.0
400
BZT52C6V2S
5.8
6.2
6.6
5
10
1.0
150
BZT52C6V8S
6.4
6.8
7.2
5
15
1.0
80
BZT52C7V5S
7.0
7.5
7.9
5
15
1.0
80
BZT52C8V2S
7.7
8.2
8.7
5
15
1.0
80
BZT52C9V1S
8.5
9.1
9.6
5
15
1.0
100
BZT52C10S
9.4
10
10.6
5
20
1.0
150
BZT52C11S
10.4
11
11.6
5
20
1.0
150
BZT52C12S
11.4
12
12.7
5
25
1.0
150
BZT52C13S
12.4
13
14.1
5
30
1.0
170
BZT52C15S
13.8
15
15.6
5
30
1.0
200
BZT52C16S
15.3
16
17.1
5
40
1.0
200
BZT52C18S
16.8
18
19.1
5
45
1.0
225
BZT52C20S
18.8
20
21.2
5
55
1.0
225
BZT52C22S
20.8
22
23.3
5
55
1.0
250
BZT52C24S
22.8
24
25.6
5
70
1.0
250
BZT52C27S
25.1
27
28.9
2
80
0.5
300
BZT52C30S
28
30
32
2
80
0.5
300
BZT52C33S
31
33
35
2
80
0.5
325
BZT52C36S
34
36
38
2
90
0.5
350
BZT52C39S
37
39
41
2
130
0.5
350
(1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2
(2) f=1KHz
REVERSE
CURRENT
IR (Max) @ VR
uA
V
50
1.0
20
1.0
10
1.0
5
1.0
5
1.0
3
1.0
3
1.0
3
2.0
2
2.0
1
2.0
3
4.0
2
4.0
1
5.0
0.7
5.0
0.5
6.0
0.2
7.0
0.1
8.0
0.1
8.0
0.1
8.0
0.1
10.5
0.1
11.2
0.1
12.6
0.1
14.0
0.1
15.4
0.1
16.8
0.1
18.9
0.1
21.0
0.1
23.1
0.1
25.2
0.1
27.3
Typical
Temperature
Coefficent
@ IZTC
mV/ć
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0.2
-2.7
1.2
-2.0
2.5
0.4
3.7
1.2
4.5
2.5
5.3
3.2
6.2
3.8
7.0
4.5
8.0
5.4
9.0
6.0
10.0
7.0
11.0
9.2
13.0
10.4
14.0
12.4
16.0
14.4
18.0
16.4
20.0
18.4
22.0
21.4
25.3
24.4
29.4
27.4
33.4
30.4
37.4
33.4
41.2
Marking
WX
W1
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WI
WJ
WK
WL
WM
WN
WO
WP
WQ
WR
WS
WT
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Revision: A
2 of 3
2011/01/01
MCC
BZT52C2V4S-BZT52C39S
Typical characteristics
300
50
Tj = 25°C
C2V7
C3V9
C3V3
C5V6
C4V7
C6V8
40
IZ, ZENER CURRENT (mA)
PD, POWER DISSIPATION (mW)
TM
Micro Commercial Components
200
100
C8V2
30
20
Test Current IZ
5.0mA
10
0
100
0
200
0
0
1
3
4
5
6
8
9
7
VZ, ZENER VOLTAGE (V)
Fig. 2 Zener Breakdown Characteristics
TA, AMBIENT TEMPERATURE, °C
Fig. 1. Power Derating Curve
30
Tj = 25°C
2
10
1000
C10
Tj = 25 °C
CT, TOTAL CAPACITANCE (pF)
IZ, ZENER CURRENT (mA)
C12
C15
20
C18
Test current IZ
2mA
C22
10
Test current IZ
5mA
C27
C33
C39
C36
VR = 1V
VR = 2V
100
VR = 1V
VR = 2V
10
1
0
0
10
20
30
VZ, ZENER VOLTAGE (V)
Fig. 3. Zener Breakdown Characteristics
10
100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Total Capacitance vs Nominal Zener Voltage
40
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Revision: A
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2011/01/01
MCC
TM
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 3Kpcs/Reel
***IMPORTANT NOTICE***
Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to
make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
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problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
distributors.
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