Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead for High-GHz Noise Data Sheet EMIFILr (Inductor type) 1 Chip Ferrite Bead for High-GHz Noise BLM18G Series (0603 Size) ■ Dimensions ■ Equivalent Circuit 0.8±0.1 0.35±0.15 1.6±0.1 0.8±0.1 (Resistance element becomes dominant at high frequencies.) : Electrode (in mm) ■ Packaging Code Packaging Minimum Quantity D 180mm Paper Tape 4000 J 330mm Paper Tape 10000 B Bulk(Bag) 1000 ■ Rated Value (p: packaging code) Part Number BLM18GG471SN1p Impedance (at 100MHz/20°C) Impedance (at 1GHz/20°C) Rated Current DC Resistance Operating Temperature Range 470ohm±25% 1800ohm±30% 200mA 1.0ohm ±0.3ohm -55 to +125°C Number of Circuits: 1 ■ Impedance-Frequency Characteristics (Main Items) ■ Impedance-Frequency Characteristics BLM18GG471SN1 2000 2000 1500 Impedance (Ω) Impedance (Ω) 1500 1000 BLM18GG471SN1 1000 Z R 500 500 X 0 0 1 10 100 Frequency (MHz) 1000 1 10 100 Frequency (MHz) 1000 3000 3000 Continued on the following page. o This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design. ! Note: 1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2011.3.3 http://www.murata.com/ Noise Suppression Products/EMI Suppression Filters > EMIFILr (Inductor type) > Chip Ferrite Bead for High-GHz Noise Data Sheet 2 Continued from the preceding page. ■ !Caution/Notice !Caution (Rating) Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. o This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design. ! Note: 1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 2011.3.3 http://www.murata.com/