Thick Film Chip Resistor ( General )
Chip resistors, which are available for surface mounting, are general passive
component which is useful for voltage drop, current controlling in circuit and
surface mounting is available.
Samsung electro-mechanics also manufactures a wide range of chip resistors
such as general, precision, trimmable and low ohms and so on.Production is
increasing with demand for small size & light weight of set product. We provide
ultra-small, high-reliability, high-stability resistors. We have obtained ISO9002/QS-9000 and ISO-14001 certification.
General Features
- Very small, thin, and light weight.
- Both flow and reflow soldering are applicable.
- Owing to the reduced lead inductance, the high frequency characteristic is
excellent.
- Suitable size and packaging for surface mount assembly.
General
Applications
- General purpose.
- Home Appliances.
(DVD, Digital TV, Camcorder, VTR, Digital Camera, Audio, Tuner).
- For Computers & Communication Device.
(Notebook, Memory Module, Mobile, Network Equipment, etc)
Part Numbering
RC
1
●
1005 J
2
3
●
●
101
4
●
CS
5
●
1 CODE DESIGNATION
●
RC : This code expresses the Resistor that is produced by Samsung Electro-Mechanics CO.,LTD.
2 DIMENSION
●
The dimension is expressed as 4 digits number by SI unit (mm). <Table 1>
Left 2 digits are length of resistor, and the other 2 digits are width. <Fig 1>
<Fig 1>
l1
H
W
l2
L
<Table 1>
[ Unit : ㎜ ]
0603
1005
1608
2012
3216
3225
5025
6432
(0201)
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
0.60±0.03 1.00±0.05 1.60±0.10 2.00±0.20 3.20±0.20 3.20±0.20 5.00±0.20 6.30±0.20
W
0.20±0.02 0.30±0.03 0.50±0.05 0.80±0.15 1.25±0.15 1.60±0.15 2.55±0.20 2.50±0.20 3.20±0.20
H
0.12±0.02 0.23±0.03 0.35±0.05 0.45±0.10 0.50±0.10 0.55±0.10 0.55±0.10 0.55±0.10 0.55±0.10
l1
0.10±0.03 0.10±0.05 0.20±0.10 0.30±0.20 0.40±0.20 0.45±0.20 0.45±0.20 0.60±0.20 0.60±0.20
l2
0.10±0.03 0.15±0.05 0.25±0.10 0.35±0.10 0.35±0.20 0.40±0.20 0.40±0.20 0.60±0.20 0.60±0.20
※ New : under developing('07)
3 RESISTANCE TOLERANCE
●
The Resistance Tolerance is expressed as 1 digit alphabet by EIAJ standard. <Table 2>
<Table 2>
item
G
J
K
M
Tolerance (%)
± 2
± 5
± 10
± 20
Producing Series
E-48
E-24
E-12
E-6
General
Dimension ※0402
(01005)
(inch)
0.40±0.02
L
4 NOMINAL RESISTANCE VALUE
●
The Nominal Resistance Value is expressed as 3 or 4 digits based on EIAJ standard. <Table 3>
<Table 3>
item
Resistance
Tolerance
Only number
Number &
alphabet "R"
3 digits mark(E-24)
4 digits mark(E-48)
G, J, K, M
G
First 2 digits : Resistance value
First 3 digits : Resistance value
Last 1 digit : Exponential number of 10.
Last 1 digit : Exponential number of 10.
Read alphabet "R" as decimal point.
Read alphabet "R" as decimal point.
1) 101 : 10 × 101 = 10 × 10 = 100Ω
Example
1) 1001 : 100 × 10 1 = 100 × 10 = 1 ㏀
2) 7R5 : 7 . 5 = 7.5Ω
2) 9R09 : 9.09 = 9.09Ω
3) R75 : 0.75Ω
If resistance value in E-96 is same resistance value in E-24, we mark 3 or 4 digits..
In case of JUMPER(0 ohm), '000' is marked on that resistor.
※ 0603, 1005, 1608 (4 digits mark) : No Marking on the resistor.
General
5 PACKAGING CODE
●
The Packaging Code is expressed as 2 digits alphabet. <Table 4>
<Table 4>
Packaging
Code
C S
E S
A S
G S
Description
7" REEL PACKAGING
10" REEL PACKAGING
13" REEL PACKAGING
BULK CASE PACKAGING
Dimension
Packaging Q'ty
0603
15,000 PCS
1005
10,000 PCS
1608, 2012, 3216, 3225
5,000 PCS
5025, 6432
4,000 PCS
1608, 2012, 3216
10,000 PCS
1005
40,000 PCS
1608, 2012, 3216, 3225
20,000 PCS
5025, 6432
15,000 PCS
1608
25,000 PCS
2012
10,000 PCS
3216
5,000 PCS
CHARACTERISTIC LINE UP
● RESISTANCE RANGE
The Resistance Range that we produce depends on the Dimension and the Resistance
Tolerance of the resistor. <Table 16>
<Table 16>
Dim. *0402
0603
1005
1608
2012
3216
3225
5025
6432
(01005)
(0201)
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
G
10∼1M
1∼1M
1 ∼1M
1 ∼1M
1 ∼1M
1∼1M
1∼1M
1∼1M
1∼1M
G
J
10∼1M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
G
-
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
G
-
-
-
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
T
-
-
-
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
1∼10M
T
Tol.
Type
K
* New : under developing ( '07)
※ Type Representation : G(General), T(Trimmable)
General
M
● RATED POWER
The Rated Power is classified by the dimension of the resistor. <Table 17>
<Table 17>
Dimension
0603
1005
1608
2012
3216
3225
5025
6432
(0201)
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
Rated Power
1/20 W
(0.05 W)
1/16 W
(0.063 W)
1/10 W
(0.100 W)
1/8 W
(0.125 W)
1/4 W
(0.25 W)
1/3 W
(0.33 W)
2/3 W
(0.67W)
1.0 W
Working Volt.(Max.)
25 V
50 V
50 V
150 V
200 V
200 V
200 V
200 V
STOL, IOL Volt.(Max.)
50 V
100 V
100 V
300 V
400 V
400 V
400 V
400 V
item
※ STOL : Short Time OverLoad
IOL : Intermittent OverLoad
※ The rated power is specified as continuous full loading power at the ambient temperature of
70±2℃. In case of the temperature exceeding 70±2℃, the power should be derated
in accordance to <Fig 17>.
[0603, 1005, 3225, 5025, 6432]
100
General
<Fig 17>.
[1608, 2012, 3216]
Rated load percent (%)
100
Rated load percent (%)
Ambient temperature (℃)
Ambient temperature (℃)
80
80
60
60
40
40
20
20
-55
-40
125
70
0
0
40
-55
80
120
▶ Working Temperature
- 55℃ ∼ + 125 ℃ : 0603, 1005, 3225, 5025, 6432
- 55℃ ∼ + 155 ℃ : 1608, 2012, 3216
0
155
70
-30
0
30
60
90
120
150
RELIABILITY TEST CONDITION
Jumper's reliability test data are only applied to General type resistor.
● ELECTRICAL CHARACTERISTIC
The electrical characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Resistor
Test method
Jumper
묤 Standard : JIS C 5201-1 4.5
묤 Test voltage : <Table 8>
묤 Applying time : within 5 seconds.
묤 Test board : <Fig 11>
<Table 8>
DC resistance value
DC resistance
should be within the
specified resistance
Maximum
tolerance.
Voltage (V)
Range (Ω)
50mΩ
10
100
1K
10K
100K
1M
10M
0.1
0.3
1.0
3.0
10.0
25.0
30.0
묤 Standard : JIS C 5201-1 4.8
묤 Temp. : 20℃ → -55℃ → 20℃ → 125℃ →
20℃
Temperature
Coefficient
묤 Test board : <Fig 13>
묤 Calculation
<Table 9>
of
Range(Ω)
ppm/℃
1 ≤ R < 10
±500
Resistance
10 ≤ R < 1M
±200
0603:±250
1M ≤ R < 10M
±300
Short time
overload
(STOL)
-
2. ΔR should be
TCR(ppm/℃) =
R− R0
1
×
× 106
R0
T − T0
T0 : 20 ± 2℃
R0 : Resistance at T 0 (Ω)
T
: Test temperature ( -55, 125℃)
R
: Resistance at T (Ω)
묤 Standard : JIS C 5201-1 4.13
1. No mechanical
damage
:
50mΩ
Maximum
within ±(1%+0.1Ω)
묤 Test voltage : 2.5 times of rated voltage Max.
surge current at the Jumper.
묤 Applying time : 5 seconds
묤 Test board : <Fig 12>
묤 Standard : JIS C 5201-1 4.13
Intermittent
overload
(IOL)
묤 Test voltage : 2.5 times of rated voltage Max.
1. No mechanical
damage
2. ΔR should be
within ±(3%+0.1Ω)
50mΩ
Maximum
surge current at the Jumper.
묤 Test method : 1 sec ON, 25 sec OFF
10,000+ 40 0cycles
묤 Test board : <Fig 12>
General
1≤ R <
10 ≤ R <
100 ≤ R <
1K ≤ R <
10K ≤ R <
100K ≤ R <
1M ≤ R <
item
Withstanding
voltage
Insulation
resistance
Permissible deviation
Resistor
Test method
Jumper
묤 No mechanical
damage, short circuit,
Same as
left
or disconnection.
묤 Should have more
Same as
than 1,000MΩ
left
묤 Standard : JIS C 5201-1 4.7
묤 Test voltage : 0603,1005,1608 AC 100V,
others AC 500V
묤 Applying time : 60 +10/-0 seconds
묤 Test board : <Fig 13>
묤 Standard : JIS C 5201- 4.7
묤 Test voltage : 0603,1005,1608 DC 100V,
others DC 500V
묤 Applying time : 60 seconds
묤 Test pressure : 1.0±0.2 N
묤 Test board : <Fig 13>
묤 Noise standard
<Table 10>
Noise
Range ( Ω)
dB Max.
1 ≤ R < 100
100 ≤ R < 1K
1K ≤ R < 100K
100K ≤ R < 1M
1M ≤ R < 10M
-10
0
15
20
30
묤 Measure equipment : QUAN-TECH NOISE
-
METER
(MODEL 315C)
● MECHANICAL CHARACTERISTIC
If there is no special comment, each test is performed at standard conditions.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Resistor
묤 New solder
Solderability
coated more than
95% of termination
Test method
Jumper
Same as
left
묤 Standard : JIS C 5201-1 4.17
묤 Test temperature : 245 ± 5℃
묤 Test time : 3 ± 0.5 sec (dipping both side)
묤 Standard : JIS C 5201-1 4.33
묤 Test board : <Fig 12>
묤 Test speed : 100mm/min
묤 Test procedure : press until 3mm,
then keep 5 seconds <Fig 14>
1. No mechanical
Bending
strength
damage
2. Δ R should be
within ±(0.5%+0.05Ω)
0603:±(1.0%+0.1%)
Same as
<Fig 14>
left
20
R205
3
General
The mechanical characteristic test should satisfy the test method, procedure, and standard.
item
Termination
strength
Permissible deviation
Resistor
묤 No mechanical
damage, or sign of
묤 Standard : JIS C 5201-1 4.16
Same as
묤 Test time : applying pressure for 10 seconds
left
묤 Test tension : 0603,1005,1608 - 3N (300g묤f)
disconnection
Others (500g묤f)
묤 Standard : JIS C 5201-1 4.18
1. No mechanical
Withstanding
soldering heat
50mΩ
damage
2. Δ R should be
Maximum
within ±(1%+0.05Ω)
2. Δ R should be
묤 Test time : 10 ± 1second (both side dipping)
묤 Standard : JIS C 5201-1 4.22
50mΩ
damage
묤 Temperature : 260 ± 5℃
묤 Test procedure : measures after 24 hours
1. No mechanical
Vibration
Test method
Jumper
Maximum
within ±(1%+0.05Ω)
묤 Test amplitude : 1.5mm
묤 Test procedure : frequency 10Hz - 55Hz 10Hz each 2 hours in x, y, z direction.
● ENVIRONMENTAL CHARACTERISTIC
If there is no special comment, Each test performs in standard state.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Resistor
Test method
Jumper
묤 Standard : JIS C 5201-1 4.19
묤 Test procedure : <Table 11>
1. No mechanical
Temperature
cycle
묤 Measure : after 100 cycles of procedure
50mΩ
damage
2. Δ R should be
Maximum
within ±(1%+0.1Ω)
묤 Test board : <Fig 11>
<Table 11>
item
tem p(℃)
tim e(m in)
1
-55± 2
30
2
5~35
15
3
125± 2
30
4
5~35
15
1. No mechanical
묤 Standard : JIS C 5201-1 4.14
damage
묤 Test condition : temp 40 ± 3℃, humid 90 ~
2. Δ R should be
Moisture
resistance life
within <Table 12>
<Table 12>
R ange( Ω)
Δ R M AX
1 ≤ R < 10
± 5%
10 ≤ R < 1M
± (3 %+0.1Ω)
1M ≤ R < 10M
± 5%
50mΩ
Maximum
95%RH
묤 Test voltage : rated voltage
묤 Test time : repeat 90min ON, 30min OFF
during 1000 +4 8 hours
묤 Test board : <Fig 11>
General
The Environmental characteristic test should satisfy the test method, procedure, and standard.
Permissible deviation
item
Resistor
1. No mechanical
Low
temperature
exposure
50mΩ
Maximum
1. No mechanical
High
exposure
damage
2. ΔR should be
within ±(3%+0.1Ω)
temperature
50mΩ
damage
2. ΔR should be
Maximum
within ±(3%+0.1Ω)
1. No mechanical
damage
2. ΔR should be
within <Table 13>
Load life
Test method
Jumper
Range( Ω)
Δ R MAX
1 ≤ R < 10
±5 %
10 ≤ R < 1M
±(3% +0 .1Ω)
1M ≤ R < 10M
±5 %
Standard : JIS C 5201-1 4.23
Test temperature : -55 ± 2℃
Test time : 1000 +4 8 hours (without load)
Measure : after 1 hour
Test board : <Fig 11>
묤 Standard : JIS C 5201-1 4.23
묤 Test temperature : 1608,2012,3216 155±2℃,
Others 125 ± 2℃
묤 Test time : 1000 +4 8 hours (without load)
묤 Measure : after 1 hour
묤 Test board : <Fig 11>
묤 Standard : JIS C 5201-1 4.25
묤 Test temperature : 70 ± 2℃
50mΩ
<Table 13>
묤
묤
묤
묤
묤
Maximum
묤 Test voltage : rated voltage
묤 Test time : repeat 90min ON, 30min OFF
during 1000 +4 8 hours
묤 Test board : <Fig 11>.
▶ Soldering (for lead free type)
▷ The resistor should be fixed on PCB(printed circuit board) for testing.
- Soldering specification : JIS C 5201-1 4.18
* Soldering method
: Flow type (Dipping type)
* Solder : Sn -3.0 Ag -0.5 Cu
* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)
- Flow soldering condition
* FLUX dipping time : 5∼10 sec
* Pre-treatment : None
* Soldering temp : 260℃±5℃
* Soldering time : 10±1 sec
General
● TEST BOARD AND SPECIFICATION
▶ Test board
▷ Test board
<Table 14>
<Fig 11>
item
Dimension
Power
0603
1005
1608
2012
3216
3225
5025
6432
1/20W
1/16W
1/10W
1/8W
1/4W
1/3W
2/3W
1W
a
0.3
0.6
1.0
1.2
2.2
2.2
3.6
5.2
b
1.1
1.9
3.0
4.0
5.0
5.0
7.0
8.0
c
0.45
0.7
1.2
1.65
2.0
2.9
3.0
3.5
10 - φ1.0
c
Dimension (mm)
3
3.5
f
5.2
4.9
4.5
4.3
3.3
3.3
3.0
2.5
f
a
b
25
5.5
7.5
5.08
3
Connector
58.5
: COPPER PATTERN
: SOLDER - RESISTOR
<Table 14>, <Fig 11> are dimensions of test board.
* Board material : epoxy JIS C 6484
* pattern material : pure copper 99.5% or above JIS C 6484
▷ Bending Test Board
<Table 15>
<Fig 12>
a
f
d=4.
Dimensio n (mm)
Dimension
Power
0603
1005
1608
2012
3216
3225
5025
6432
1/20W
1/16W
1/10W
1/8W
1/4W
1/3W
2/3W
1W
a
0.3
0.6
1.0
1.2
2.2
2.2
3.6
5.2
b
1.1
1.9
3.0
4.0
5.0
5.0
7.0
8.0
c
0.45
0.7
1.2
1.65
2.0
2.9
3.0
3.5
5
f
5.2
4.9
4.5
4.3
3.3
3.3
3.0
2.5
b
100
: COPPER PATTERN
: SOLDER - RESISTOR
<Table 15>, <Fig 12> are dimensions of bending test board.
* Board material : epoxy JIS C 6484
* pattern material : pure copper 99.5% or above JIS C 6484
▶ Sketch of Withstanding voltage and Insulation resistance
<Fig 13>
Cu
Cu
Cu
P2
P1
P1
V
40
c
Substrate
General
item
PACKAGINGTEST CONDITION
RELIABILITY
● PACKAGING METHOD
Packaging protects the resistor from damage during the shipping or storage.
There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type.
● REEL TYPE PACKAGING SPECIFICATION
The packaging specification is based on the EIAJ RC-1009.
<Fig 2> is tape dimension For 0603 type. <Table 5> is for pocket sizes, A and B.
<Fig 2>
4.0±0.1
0.1
1.5±0
1.75±0.1
1.0
3.5±0.05
B
2.0±0.05
0.5 Max
A
0.5 Max
Carrier Tape
<Fig 2-1> is tape dimension For 1005 type. <Table 5> is for pocket sizes, A and B.
<Fig 2-1>
0.1
1.5±0
1.75±0.1
1.0
3.5±0.05
B
2.0±0.05
0.6 Max
Top Tape
8.0±0.1
A
Chip Resistor
0.6 Max
Carrier Tape
Bottom Tape
General
Chip Resistor
Top Tape
<Fig 3> is tape dimension For 1608, 2012, 3216, 3225 type. <Table 5> is for pocket sizes,
A and B.
<Fig 3>
4.0±0.1
0.1
0
1.5±
1.75±0.1
1.0
3.5±0.05
B
2.0±0.05
1.0 Max
4.0±0.1
Top Tape
8.0±0.1
A
Chip Resistor
1.0 Max
Carrier Tape
Bottom Tape
<Fig 4> is tape dimension For 5025, 6432 type. <Table 5> is for pocket sizes, A and B.
General
<Fig 4>
<Table 5>
Dimension
Symbol
A
B
0603
1005
1608
2012
3216
3225
5025
6432
(0201)
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
0.38±0.05
0.70±0.10 1.10±0.20
1.65±0.20 2.00±0.20
2.90±0.20 2.90±0.20
3.40±0.20
0.68±0.05
1.20±0.10 1.90±0.20
2.40±0.20 3.60±0.20
3.60±0.20 5.40±0.20
6.70±0.20
● TAPING METHOD
There are empty holes at both start part and end part of carrier tape. <Fig 5>
<Fig 5>
Reel
Packed Part
Empty Part
Lead Part
Adhesion Tape
Empty Portion
10 Pitches
or more
**
5,000 Pitches
or
20,000 Pitches
Empty Portion
Lead Part
Start
End
****
Chips
***
10 Pitches
200~250 mm
or more
Note
① The resistor should move in the pocket freely.
③ There should be no vacant pocket.
④ Peeling strength of the top tape should be within 5gf and 80gf. <Fig 6>
<Fig 6>
Peeling
Top Tape
Chip Resistor
Carrier Tape
0~10°
F
Bottom Tape
General
② The resistor should not adhere to the top or bottom tape.
● REEL DIMENSION
The Reel dimension is classified by the diameter of Reel. <Fig 7> <Table 6>
<Fig 7>
< Table 6 >
[ Unit : mm ]
Diameter
A
B
C
D
C S
7"
178
Φ 70
9.5(13.0) ± 0.1
1.2 ± 0.1
E S
10"
258
Φ 80
9.5 ± 0.1
2.0 ± 0.1
F S, A S
13"
330
Φ 80
9.5(13.0) ± 0.1
2.0 ± 0.1
● BULK TYPE PACKAGE
Bulk cassette specification is based on the EIAJ ET-7201. <Fig 8>
The standard packaging quantity depends on the dimension. <Table 7>
<Fig 8>
6.0 ± 0.05
4.4 ± 0.05
3.4 ± 0.05
12
36
110
<Table 7>
Dimension
Inch
Standard packaging quantity
Weight (g, avg.)
1608
0603
25,000 PCS
71
2012
0805
10,000 PCS
65
3216
1206
5,000 PCS
67
General
Packaging Code
● LABELING
▶ Reel type Label
The reel type label includes following contents as <Fig 9>.
① Resistance Value
<Fig 9>
①
②
② Tolerance, Marking
100
③ Part Number
④ Quantity
④
⑤
⑥ Bar - Code
⑦ Serial Number
007
Q-2
S or P
⑥
⑧ S : Pb Free
J101
P/N : RC1608J101CS
QTY : 5000PCS
L/N : ROJA50010
③
⑤ LOT Number
Ohm
P : Polymer & Pb Free
⑦
⑧
SAMSUNG ELECTRO-MECHANICS CO.,LTD.
▶ Bulk type Label
The bulk type label includes following contents as <Fig 10>.
① Part Number
<Fig 10>
①
②
③ LOT Number
④ Quantity
⑤ Bar - Code
⑥ Serial Number
③
RC3216J100GS
10 ohm
RC3216J100GS
ROGHN0040 5000pcs
④
10 ohm
007
V-2
⑤
SAMSUNG ELECTRO-MECHANICS CO.,LTD.
⑥
● BOX PACKAGING METHOD
① The bulk or reel type packaging is packaged twice by paper box, inner box and outer box.
② The packaging should protect the resistor from damaging during shipping by vehicle, ship,
airplane and etc.
③ The information of contents is marked on both inner and outer box.
※ For other packaging methods, please contact us.
General
② Resistance Value
● BOX DIMENSION FOR REEL TYPE
① Max 75,000 pcs ( 5 EA × 7" )
② Max 300,000 pcs ( 20 EA × 7" )
30±1.0
185±1.0
195±5.0
187±5.0
66±1.0
285±5.0
185±1.0
( Unit : mm )
③ Max 900,000 pcs ( 60 EA ×7" )
( Unit : mm )
④ Max 800,000 pcs ( 20 EA ×13" )
370±5.0
348±5.0
336±5.0
410±5.0
339±5.0
( Unit : mm )
( Unit : mm )
● BOX DIMENSION FOR BULK TYPE
① Inner box ( Cassette × 5 EA )
② Outer box ( Inner box × 20 EA )
215
41
135
65
116
( Unit : mm )
242
( Unit : mm )
General
215±5.0
APPLICATION MANUAL
● APPLICATIONS
Chip resistors are designed for general electronic devices such as home appliances, computer,
mobile communications, digital circuit, etc.
If you require our products with high reliability-performing at more than 125C or below -55C
for medical equipments, aircraft, high speed machines, military usage, and items that can
affect human life or if you need to use in specific conditions (corrosive gas atmosphere),
please contact us beforehand.
▶ Normal Operation temperature ranges(℃) as follows.
- 1608, 2012, 3216(general, precision) : -55℃ ~ + 155℃
- Others (rectangular, array, trimmable) : -55℃ ~ + 125℃
▶ Although resistor body is coated, sharp excessive impact should be avoided to prevent
damages and adverse effects on characteristics(resistor value, open circuited, T.C.R.).
To maintain proper quality of chip components, the following precautions are required for
storage environment, method and period.
▶ Storage Environment
- Chip components may be deformed, if the temperature of packaged components exceeds
40℃.
- Do not store where the soldering properties can be deteriorated by harmful gas such as
sulphurous gas, chlorine gas, etc.
- Bulk packed chip components should be used as soon as the seal is opened, thus
preventing the solderability from deteriorating.
- The remaining unused chips should be put in the original bag and sealed again or store in
a desiccator containing a desiccating agent.
▶ Storage Time Period
- Stored chip components should be used within 6 months after receiving the components.
If 6 months or more have elapsed, please check the solderability before actually using.
Chip Resistor
● STORAGE
● MOUNTING
Proper nozzle height must be given attention so as not to give excessive pressure on the
chip during mounting on the PCB.
(Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.)
● SOLDERING
Our products have Ag electrodes protected by double layer.
▶ 1st Ni Coating
- This prevents Ag electrode from leaching and enhance the bonding with Sn
▶ 2nd Sn Coating
- This is made of Sn 100% with melting point 232℃ to prevent it from melting when solder
cream melts, and to enhance the bonding.
- Commercial solder creams are made of Sn-3.0Ag-0.5Cu with melting point 217℃.
● CLEANING
flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors.
This means that the cleaning fluid must be carefully selected, and should always be new.
● CAUTION FOR CHIP RESISTOR SEPERATION FROM PCB
PCB can be prevented from a shock because it has flexibility, but Chip resistor cannot : it is made of
ceramic, solder and metal.
Therefore, when separating Chip resistor from PCB, it is important for a chip not to be cracked.
● OTHERS
▶ Manual work
Manual soldering can pose a great risk of creating thermal cracks in chip resistors.
The hot soldering iron tip comes into direct contact with the end terminations, an operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the
ceramic body of the resistor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
▶ Do not use more than rated voltage.(check the contents on the file)
Chip Resistor
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the
NOTICE
● RECOMMENDED USAGE OF THE RESISTOR
▶ Flow Soldering
After mounting the resistor to PCB with paste, dip the PCB into solder bath. <Fig 15>
<Fig 15>
Temp.
260±5℃
Δ T≤150℃
Pre-heating
Soldering
Cooling
10 sec. Max.
Time
▶ Reflow Soldering
After printing solder creams on PCB, place the resistor on the solder cream.
Chip Resistor
Then heat the PCB. <Fig 16>
<Fig 16>
Temp.
Peak temp.
10 sec. Max.
260±5℃
230℃
180℃
150℃
Pre-heating
Soldering
60 ~ 120 sec
30 ~ 40 sec
Cooling
● CAUTION
Time
▶ Storage condition
Please make sure to keep the storage conditions.
* Temperature : 5℃∼40℃, * Humidity : 20%RH ∼ 70%RH
▶ Damage control
Please handle with care to prevent damaging the resistor.
Specially, the excessive nozzle height of SMD or the extreme pressure with tweezers.
▶ Leaching prevention
It is important to keep the soldering conditions to prevent Ag leaching in Flow soldering.