F-212 USB3–B–S–F–TH USB3–A–S–S–TH USB3-A, USB3-B SERIES USB 3.0 INTERFACES USB3-A Mates with: USBC3-AM USB3-B Mates with: USBC3-BM USB3 A S PLATING TERMINATION SPECIFICATIONS –TH Insulator Material: Nylon 6T Blue Contact Material: Phosphor Copper Plating: Au or Sn over 50µ" (1,27µm) Ni Shield Plating: 50µ" (1,27µm) Ni Front Shield: Phosphor Copper Back Shield: Brass Operating Temp Range: -50°C to +85°C Current Rating: 1.8 A per power (VBUS) contact and ground contact, 0.25A per other contact Voltage Rating: 100 VAC Contact Resistance: 30 mΩ max power and ground, 50 mΩ max for other contact Minimum Cycles: 5000 RoHS Compliant: Yes = Through-hole –F For complete specifications and recommended PCB layouts see www.samtec.com?USB3-A or www.samtec.com?USB3-B = Gold Flash on Mating Area, Matte Tin on Tails –S = 30µ" (0,76µm) Gold on Mating Area, Matte Tin on Tails (15,60) .614 (12,50) .492 (13,10) .516 (11,10) .437 (5,12) .202 (6,99) .275 (16,50) .650 (1,00) .039 (3,50) .138 (1,00) .039 (6,00) .236 USB3 B (4,00) .157 (2,00) .079 (2,00) .079 S (2,83) .111 (1,50) .059 (11,78) .464 PLATING TERMINATION –TH = Through-hole –F = Gold Flash on Mating Area, Matte Tin on Tails –S = 30µ" (0,76µm) Gold on Mating Area, Matte Tin on Tails (14,30) .563 (12,00) .472 (12,90) .508 (18,25) .719 (10,30) .406 (2,50) .098 (1,75) .069 (1,25) .049 WWW.SAMTEC.COM (10,30) .406 (2,72) .107 (2,80) .110 (2,00) .079 (2,00) .079