SC630 Fixed 3.3V High Output Charge Pump Buck/Boost Regulator POWER MANAGEMENT Features Description The SC630 is a high-current voltage regulator using Semtech’s proprietary low-noise charge pump technology. Performance is optimized for use in single Li-Ion battery cell applications. The regulator provides the performance of a linear, low drop-out (LDO) voltage regulator when the battery is greater than 3.3V. Unlike an LDO, drop-out is avoided when the battery is less than 3.3V. Instead, a charge pump is activated to provide voltage boost — the head-room needed for voltage regulation. Input voltage range — 2.9V to 5.5V VOUT tolerance 3.3V ±3% VOUT regulation (line + load) ±2% Continuous output current — 400mA Peak output current — 500mA Three charge pump modes — 1x, 1.5x and 2x Output ripple ≤ 20mVpp for IOUT ≤ 400mA Short circuit, over-voltage, and over-temperature protection Soft-start functionality Shutdown current — 0.1μA, typical Ultra thin package — 2 x 2 x 0.6 (mm) Fully WEEE and RoHS compliant Applications Only two 2.2μF bucket capacitors are required to deliver the full output current. The charge pump provides a low EMI solution compared to inductive buck/boost regulators. The SC630’s charge pump has three modes of operation: 2x, 1.5x, and 1x modes. The 2x and 1.5x modes deliver current to the load in each of two phases. The 1x mode turns off the charge pump, delivering current through an LDO. When active, the charge pump provides low-ripple operation at 200kHz, which is typically less than 20mVpp at the output. The SC630 is capable of delivering 400mA continuous current, with peak current to 500mA. A 22μF output capacitor of is used for decoupling the load and for smoothing mode transitions. Hysteresis is provided to prevent chatter between charge pump modes. Mobile phones MP3 players Multi-LED backlit LCDs Compact flash/CF+ products PMPs Digital video cameras Digital still cameras PDAs The micro lead-frame package is both small and thermally efficient, measuring 2 x 2 x 0.6 (mm). Typical Application Circuit CIN 22μF VBAT IN OUT VOUT = 3.3V @ 400mA COUT 22μF SC630 Chip enable EN C1+ C1C2+ GND C2- C1 2.2μF C2 2.2μF Patents Pending May 28, 2008 © 2008 Semtech Corporation 1 SC630 Pin Configuration GND Ordering Information 1 8 C2- Device Package SC630ULTRT(1)(2) MLPD-UT-8 2x2 SC630EVB Evaluation Board Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Lead-free package only. Device is WEEE and RoHS compliant. TOP VIEW C1+ 2 7 C2+ C1- 3 6 OUT 5 EN T IN 4 MLPD-UT-8; 2x2, 8 LEAD θJA = 68°C/W Marking Information 630 yw yw = Datecode 2 SC630 Absolute Maximum Ratings Recommended Operating Conditions IN, OUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0 Ambient Temperature Range (°C) . . . . . . . . -40 < TA < +85 C1+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 to (VOUT + 0.3) IN (V) ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9 < VIN < 5.5 Pin Voltage - All Other Pins (V) . . . . . . . . . . . -0.3 to (VIN + 0.3) OUT Short Circuit Duration . . . . . . . . . . . . . . . . . Continuous ESD Protection Level(1) (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal Information Thermal Resistance, Junction to Ambient(2) (°C/W) . . . . . 68 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +150 Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +150 Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . +260 Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES (1) Tested according to JEDEC standard JESD22-A114-B. (2) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Electrical Characteristics Unless otherwise specified: TA = +25°C for Typ, -40°C to +85°C for Min and Max; C1 = C2 = 2.2μF (ESR < 0.03Ω); CIN = COUT = 22μF; VIN = 2.9V to 5.5V Parameter Symbol Condition Input Supply Voltage VIN Output Voltage VOUT VIN = 4.2V, IOUT = 1mA Output Voltage Ripple VPP IOUT ≤ 400mA Maximum Output Current IOUT Shutdown Current ISD Total Quiescent Current IQ Charge Pump Frequency Min Typ 2.9 3.2 3.3 Max Units 5.5 V 3.4 V 20 mV Peak Load - thermally limited(1), TJ <150°C, 2.85V ≤ VIN ≤ 5.5V 500 mA Continuous Load, 3.1V ≤ VIN ≤ 5.5V, 1x or 1.5x mode 400 mA Shutdown (EN = GND), VIN = 3.6V 0.1 2 μA EN high, 1x mode, IOUT = 1mA, VIN = 4.2V 1.5 2.0 mA EN high, 1.5x or 2x mode, IOUT = 1mA, VIN = 3.3V 1.5 2.5 mA 200 260 kHz fPUMP VIN = 3.2V tSU (EN transitions from low to high), 3.2V ≤ VOUT ≤ 3.4V, No load Line Regulation ΔVLINE IOUT = 1mA, 2.85V ≤ VIN ≤ 4.2V 21 mV Load Regulation ΔVLOAD VIN Fixed, 1mA ≤ IOUT ≤ 500mA 25 mV Start-Up Time 140 400 μs 3 SC630 Electrical Characteristics (continued) Parameter Symbol Condition Min EN Input High Threshold VIH VIN = 5.5V 1.6 EN Input Low Threshold VIL VIN = 2.7V 0.4 V EN Input High Current IIH VIN = 5.5V 2 μA EN Input Low Current IIL VIN = 5.5V 2 μA Open-Loop Output Resistance Typ Max Units V 1x mode 0.3 Ω 1.5x mode, VIN = 3.15V 3 Ω 2x mode, VIN = 2.93V 2.4 Ω V TRANS 1X IOUT = 300mA 3.3 V V TRANS 1.5X IOUT = 300mA 2.93 V ISC VOUT = 0V, IOUT = IIN 300 600 980 mA 1x mode 0.6 1.2 2.0 A 1.5x and 2x modes 1.2 2.0 2.8 A ROUT Mode Transition Voltage (2) Fault Protection Short-Circuit Current Input Current Limit ILIMIT VOUT ≤ 2V, IOUT = IIN 700 mA TOTP Rising Threshold 165 °C THYS Hysteresis 20 °C Over Temperature (3) Notes: (1) Thermal limitation is dependent upon the thermal performance of the printed circuit board in support of the package standard of 68° C/W. (2) Voltage at the IN pin where a mode transition takes place in the charge pump with VIN falling. (3) Guaranteed by design - not tested in production. 4 SC630 Typical Characteristics Line Regulation Load Regulation VOUT = 3.3V, VIN = 3.6V 20 Output Voltage Variation — ΔVLINE (mV) Output Voltage Variation — ΔVLOAD (mV) 25 20 TA=85°C 15 TA=25°C 10 TA=-40°C 5 0 0 90 180 270 Output Current (mA) 360 VOUT = 3.3V, IOUT = 1mA 15 85°C 10 5 -40°C 0 -5 -10 -15 -20 2.7 450 0 VIN = 3.4V 3.9 4.3 4.7 5.1 5.5 VIN = 4.2V, VOUT = 3.3V, IOUT = 50mA CIN=COUT=22μF (0805) -10 VIN = 3.6V C1=C2=2.2μF (0603) -20 VIN = 3.8V -30 VIN = 4.0V 80 Gain (dB) Efficiency (%) 3.5 PSRR — 1x Mode VOUT = 3.3V 90 3.1 Input Voltage (V) Efficiency versus Load Current 100 25°C 3.6V, 0mV 70 -40 -50 -60 -70 60 -80 50 -100 10 -90 0 90 180 270 360 450 100 1000 10000 Frequency (Hz) Load Current (mA) PSRR — 1.5x Mode VIN = 3.2V, VOUT = 3.3V, IOUT = 50mA 0 CIN=COUT=22μF (0805) -10 C1=C2=2.2μF (0603) -20 Gain (dB) -30 -40 -50 -60 -70 -80 -90 -100 10 100 Frequency (Hz) 1000 10000 5 SC630 Typical Characteristics (continued) Efficiency — 10mA 100 Efficiency — 50mA VOUT = 3.3V, IOUT = 10mA 100 90 VOUT = 3.3V, IOUT = 50mA 90 1x Mode Efficiency(%) Efficiency(%) 1x Mode 80 Mode Transition Hysteresis 70 80 Mode Transition Hysteresis 70 1.5x Mode 1.5x Mode 60 60 50 4.2 3.9 3.0 3.6 3.3 Input Voltage (V) 50 4.2 2.7 3.9 Efficiency — 100mA 100 90 2.7 VOUT = 3.3V, IOUT = 200mA 90 1x Mode Efficiency(%) 3.0 Efficiency — 200mA VOUT = 3.3V, IOUT = 100mA 100 3.6 3.3 Input Voltage (V) 1x Mode Efficiency(%) 80 Mode Transition Hysteresis 70 80 Mode Transition Hysteresis 70 1.5x Mode 1.5x Mode 60 60 50 50 4.2 2x Mode 4.2 3.9 3.6 3.3 Input Voltage (V) 3.0 2.7 Efficiency — 300mA 100 3.6 3.3 Input Voltage (V) 3.9 3.0 2.7 3.0 2.7 Efficiency — 400mA VOUT = 3.3V, IOUT = 300mA 100 VOUT = 3.3V, IOUT = 400mA 1x Mode 1x Mode 76 88 Mode Transition Hysteresis Efficiency(%) Efficiency(%) 88 1.5x Mode 64 52 76 1.5x Mode 64 52 Mode Transition Hysteresis 2x Mode 2x Mode 40 4.2 3.9 3.6 3.3 Input Voltage (V) 3.0 2.7 40 4.2 3.9 3.6 3.3 Input Voltage (V) 6 SC630 Typical Characteristics (continued) Ripple — 1.5x Mode Ripple — 1x Mode VIN=3.6V, VOUT=3.3V, IOUT=400mA VIN=3.2V, VOUT=3.3V, IOUT=400mA VIN -PP (20mV/div) VIN -PP (100mV/div) VOUT -PP (20mV/div) VOUT -PP (50mV/div) IOUT (200mA/div) 400mA IOUT (200mA/div) 400mA CIN=COUT=22μF (0805) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) 0mA 0mA C1=C2=2.2μF (0603) Time (10μs/div) Time (10μs/div) Startup (No Load) Ripple — 2x Mode VIN=2.85V, VOUT=3.3V, IOUT=400mA VIN=3.6V, IOUT=0mA VIN -PP (50mV/div) VEN (2V/div)– 0V— VOUT -PP (50mV/div) IOUT (200mA/div) VOUT (2V/div)– 400mA 0V— CIN=COUT=22μF (0805) CIN=COUT=22μF (0805) 0V— C1=C2=2.2μF (0603) 0mA C1=C2=2.2μF (0603) IOUT (200mA/div)– Time (200μs/div) Time (10μs/div) Quiescent Current Startup (400mA) VIN=3.6V, IOUT=400mA 2.25 VOUT = 3.3V, IOUT = 1mA 2.00 VEN (2V/div)– 1.75 IQ(mA) 0V — VOUT (2V/div)– 0V— IOUT (200mA/div)– 0V— 1.50 25°C 85°C 1.25 -45°C CIN=COUT=22μF (0805) 1.00 C1=C2=2.2μF (0603) Time (200μs/div) 0.75 5.50 4.98 4.46 VIN (V) 3.94 3.42 2.90 7 SC630 Pin Descriptions Pin Pin Name Pin Function 1 GND Ground — connect to ground plane with multiple vias 2 C1+ Positive terminal of bucket capacitor 1 3 C1- Negative terminal of bucket capacitor 1 4 IN Input supply voltage 5 EN Chip enable — active-high 6 OUT Output 7 C2+ Positive terminal of bucket capacitor 2 8 C2- Negative terminal of bucket capacitor 2 T Thermal Pad This pad is for heat sinking and is not connected internally. It must be connected to a ground plane using multiple vias. 8 SC630 Block Diagram IN 4 LDO 2 C1+ 200kHz 3 C17 C2+ EN 5 Logic Control Reference Voltage Generator CHARGE PUMP 8 C26 OUT 1 GND 9 SC630 Applications Information General Description The SC630 is a 3.3V output charge pump regulator designed to support up to 400mA (TA ≤ 85°C, 3.15V ≤ VIN ≤ 5.5V) of continuous current. It is used for powering Micro HDDs (Hard Disk Drives) and other 3.3V devices in portable handheld equipment including Compact Flash and CF+ products. page 6 to determine if 2x mode is required by the application. The data provided in the following derating curve for 2x mode is based on the peak power dissipation that could occur while in 2x mode. 1x and 1.5x modes do not require derating. 450 400 Mode Transition Hysteresis Hysteresis is provided to prevent chatter between charge pump modes for input steps of up to 120mV. Decouple the input to prevent steps greater than 120mV, for optimum transient performance, when the input voltage reaches the mode transition thresholds. Thermal Resistance The SC630 package is thermally efficient when the circuit board layout connects the thermal pad through multiple vias to the ground plane. The thermal resistance is dependent upon the connection between the thermal pad and the ground plane. A layout that is done correctly should keep the junction temperature below the over-temperature limit while operating the SC630 within the specified electrical conditions. A poor layout may allow the junction temperature to reach the over temperature limit, so it is important to maintain adequate ground plane around the device to maximize heat transfer to the PCB. Temperature Derating Derating for applications requiring only 1x and 1.5x modes 350 IOUT (mA) The SC630 has three operating modes — 1x, 1.5x, and 2x. The 1x mode is a linear series regulation mode with a low output resistance of only 300mΩ. The 1x mode functions as a low noise series linear regulator. The 1.5x and 2x modes are a low noise constant frequency, constant duty cycle switch mode, using two bucket capacitors. One bucket supports the full output current while the other bucket charges from the input. The two buckets exchange roles in the next phase, supplying continuous output current in both phases and reducing the need for a large output decoupling capacitor. The constant frequency, constant duty cycle operation also produces predictable constant frequency harmonics. 300 Derating for applications requiring 2x mode 250 200 150 100 35 45 55 65 75 85 Ambient Temperature (°C) 95 105 Maximum Continuous Output Protection Circuitry The SC630 also provides protection circuitry that prevents the device from operating in an unspecified state. These functions include: • • • Over-Current Protection (OCP) Short-Circuit Current Protection (SCCP) Over-Temperature Protection (OTP) Over-Current Protection Over-current protection is provided to limit the output current. When VOUT is greater than 2V, OCP limits the output to 1A typical. The threshold at 2V allows the device to recover from excessive voltage droop during an over current. Short-Circuit Current Protection Short-circuit current protection is provided to limit the current that can be sourced when the output is shorted to ground. When a short circuit forces VOUT to drop below 2V, the SCCP detects the condition and limits the output current to 250mA (typical). The load current and battery voltage range of the application should be compared with the efficiency plots on 10 SC630 Applications Information (continued) Over-Temperature Protection The over-temperature circuit helps prevent the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 165°C the device is disabled. It remains disabled until the junction temperature drops below this threshold. Hysteresis is included that prevents the device from re-enabling until the junction temperature is reduced by 20°C. Capacitor Selection The SC630 is designed to use low-ESR ceramic capacitors for the input and output bypass capacitors as well as the charge pump bucket capacitors. Ideal performance is achieved when the bucket capacitors are exactly equal. The value of input and output decoupling capacitors will vary with system requirements. CIN and COUT are normally 22μF and the bucket capacitors C1 and C2 are 2.2μF. For low profile designs, two parallel 10μF capacitors may be used in place of each 22μF. For applications with load currents below 100 mA, the bucket capacitors may be reduced to 1μF and the input and output capacitors may be reduced to 10μF. The following table lists recommended capacitor values. Note that the smallest available capacitor packages have very poor DC voltage characteristics. 0402 and 0603 size capacitors may be as low as 50% of rated value at 3.3V. The following capacitors are recommended for best performance. Use only X5R ceramic with a voltage rating of 6.3V or higher. Table 1 — Recommended Capacitors Capacitor Value μF Case Size Notes Typical output VPP ≤ 20mV in all charge pump modes CIN , COUT CIN , COUT 22 0805 Typical input ripple ≤ 100mV in all charge pump modes 10 0805 Typical performance is similar to the 22uF if 0805 capacitor size is used, due to the weaker DC voltage coefficient of the 22uF 0805. Typical output VPP as high as 75mV in boosting charge pump modes CIN , COUT 10 0603 Typical input ripple as high as 175mV in boosting charge pump modes For a lower profile design, two 10uF 0603’s may be substituted in place of one 10uF or 22uF 0805. Two are needed, due to the weaker DC voltage coefficient of the 0603 package size. CBUCKET 2.2 0603 Required for the full rated output current CBUCKET 2.2 0402 Useful for load current up to 300mA CBUCKET 1.0 0402 Useful for load current up to 100mA NOTE: Use only X5R type capacitors, with a 6.3V rating or higher The highest capacitance values in the smallest package sizes tend to have poor DC voltage characteristics. The highest value 0402 size capacitor retains as little as 35% of its rated value at 5VDC. The same value chosen in the next larger package size (0603) retains about 60% of its rated value at 5VDC. 11 SC630 Applications Information (continued) PCB Layout Considerations Poor layout can degrade the performance of the regulator and can be a contributory factor in EMI problems, ground bounce, thermal issues, and resistive voltage losses. Poor regulation and instability can result. The following design rules are recommended: 1. Place the bucket capacitors as close to the device as possible and on the same side of the board. Use short wide copper areas between the capacitor pins and the device pins. 2. Place the input and output decoupling capacitors as close as possible to the device and connect these capacitors’ ground pads together to the ground plane using multiple vias through a short wide copper area. 3. Connect pin 1 directly to the copper area under the thermal pad. 4. The thermal pad at the center of the device is not electrically connected. Connect this pad to the ground plane using multiple vias. 5. Use a ground plane to further reduce noise interference on sensitive circuit nodes. SC630 GND C1 C1+ C2- C2 C2+ GND C1- OUT IN EN COUT CIN EN 12 SC630 Outline Drawing — MLPD-UT-8 2x2 B D A DIMENSIONS DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 A1 C A A1 A2 b D D1 E E1 e L N aaa bbb INCHES MIN .020 .000 NOM - MILLIMETERS MAX .024 .002 (.006) .007 .075 .061 .075 .026 .010 .012 .079 .083 .067 .071 .079 .083 .031 .035 .020 BSC .012 .014 .016 8 .003 .004 MIN 0.50 0.00 NOM - (0.1524) 0.18 0.25 1.90 2.00 1.55 1.70 1.90 2.00 0.65 0.80 0.50 BSC 0.30 0.35 8 0.08 0.10 MAX 0.60 0.05 0.30 2.10 1.80 2.10 0.90 0.40 D1 1 2 LxN E/2 E1 N bxN bbb e C A B e/2 D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 13 SC630 Land Pattern — MLPD-UT-8 2x2 H DIMENSIONS R (C) K G Z Y P DIM INCHES MILLIMETERS C (.077) (1.95) G .047 1.20 H .067 1.70 K .031 0.80 P .020 0.50 R .006 0.15 X .012 0.30 Y .030 0.75 Z .106 2.70 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com 14