STMICROELECTRONICS ST10F272E_12

ST10F272B
ST10F272E
16-bit MCU with 256 Kbyte Flash memory and 12/20 Kbyte RAM
Datasheet − production data
Features
■
■
■
16-bit CPU with DSP functions
– 31.25ns instruction cycle time at 64MHz
max CPU clock
– Multiply/accumulate unit (MAC) 16 x 16-bit
multiplication, 40-bit accumulator
– Enhanced boolean bit manipulations
– Single-cycle context switching support
On-chip memories
– 256 Kbyte Flash memory (32-bit fetch)
– Single voltage Flash memories with
erase/program controller and 100K
erasing/programming cycles.
– Up to 16 Mbyte linear address space for
code and data (5 Mbytes with CAN or I2C)
– 2 Kbyte internal RAM (IRAM)
– 10/18 Kbyte extension RAM (XRAM)
– Programmable external bus configuration &
characteristics for different address ranges
– Five programmable chip-select signals
– Hold-acknowledge bus arbitration support
Interrupt
– 8-channel peripheral event controller for
single cycle interrupt driven data transfer
– 16-priority-level interrupt system with 56
sources, sampling rate down to 15.6ns
■
Timers
– Two multi-functional general purpose timer
units with 5 timers
■
Two 16-channel capture / compare units
■
4-channel PWM unit + 4-channel XPWM
June 2012
This is information on a product in full production.
'!0'2)
PQFP144 (28 x 28 x 3.4mm)
(Plastic Quad Flat Package)
LQFP144 (20 x 20 x 1.4mm)
(Thin Quad Flat Package)
■
A/D converter
– 24-channel 10-bit
– 3 μs minimum conversion time
■
Serial channels
– Two synch. / asynch. serial channels
– Two high-speed synchronous channels
– One I2C standard interface
■
2 CAN 2.0B interfaces operating on 1 or 2 CAN
busses (64 or 2x32 message, C-CAN version)
■
Fail-safe protection
– Programmable watchdog timer
– Oscillator watchdog
■
On-chip bootstrap loader
■
Clock generation
– On-chip PLL with 4 to 8 MHz oscillator
– Direct or prescaled clock input
■
Real time clock and 32 kHz on-chip oscillator
■
Up to 111 general purpose I/O lines
– Individually programmable as input, output
or special function
– Programmable threshold (hysteresis)
■
Idle, power down and stand-by modes
■
Single voltage supply: 5V ±10%
Doc ID 11917 Rev 3
1/188
www.st.com
1
Contents
ST10F272B/ST10F272E
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2
Special characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
Pin data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5
Internal Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.2
Modules structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.3
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3
Write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4
Registers description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.5
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5.2.1
5.4.1
Flash control register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4.2
Flash control register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4.3
Flash control register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.4.4
Flash control register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.4.5
Flash data register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.4.6
Flash data register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.4.7
Flash data register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.4.8
Flash data register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.4.9
Flash address register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.4.10
Flash address register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.4.11
Flash error register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Protection strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.5.1
Protection registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.5.2
Flash non volatile write protection I register . . . . . . . . . . . . . . . . . . . . . 39
5.5.3
Flash non volatile access protection register 0 . . . . . . . . . . . . . . . . . . . 40
5.5.4
Flash non volatile access protection register 1 low . . . . . . . . . . . . . . . . 40
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
6
7
Contents
5.5.5
Flash non volatile access protection register 1 high . . . . . . . . . . . . . . . 41
5.5.6
XBus flash volatile temporary access unprotection register (XFVTAUR0) .
41
5.5.7
Access protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.5.8
Write protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.5.9
Temporary unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.6
Write operation examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.7
Write operation summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.1
Selection among user-code, standard or selective bootstrap . . . . . . . . . . 48
6.2
Standard bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3
Alternate and selective boot mode (ABM and SBM) . . . . . . . . . . . . . . . . 49
6.3.1
Activation of the ABM and SBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.3.2
User mode signature integrity check . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
6.3.3
Selective boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Central processing unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.1
Multiplier-accumulator unit (MAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.2
Instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
7.3
MAC co-processor specific instructions . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8
External bus controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
9
Interrupt system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.1
X-Peripheral interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.2
Exception and error traps list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
10
Capture / compare (CAPCOM) units . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
11
General purpose timer unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
11.1
GPT1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
11.2
GPT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
12
PWM modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
13
Parallel ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Doc ID 11917 Rev 3
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Contents
ST10F272B/ST10F272E
13.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
13.2
I/O’s special features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
13.3
13.2.1
Open drain mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
13.2.2
Input threshold control
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Alternate port functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
14
A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
15
Serial channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
15.1
Asynchronous / synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . 74
15.2
ASCx in asynchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
15.3
ASCx in synchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
15.4
High speed synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . . . . 76
16
I2C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
17
CAN modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
17.1
Configuration support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
17.2
CAN bus configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
18
Real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
19
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
20
System reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
21
4/188
20.1
Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
20.2
Asynchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
20.3
Synchronous reset (warm reset) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
20.4
Software reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
20.5
Watchdog timer reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
20.6
Bidirectional reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
20.7
Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
20.8
Reset application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
20.9
Reset summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Power reduction modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Contents
21.1
Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
21.2
Power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
21.3
21.2.1
Protected power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
21.2.2
Interruptible power down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
21.3.1
Entering stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
21.3.2
Exiting stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
21.3.3
Real time clock and stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
21.3.4
Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
22
Programmable output clock divider . . . . . . . . . . . . . . . . . . . . . . . . . . 115
23
Register set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
24
23.1
Special function registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
23.2
X-registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
23.3
Flash registers ordered by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
23.4
Identification registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
24.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
24.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
24.3
Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
24.4
Parameter interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
24.5
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
24.6
Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
24.7
A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
24.8
24.7.1
Conversion timing control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
24.7.2
A/D conversion accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
24.7.3
Total unadjusted error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
24.7.4
Analog reference pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
24.8.1
Test waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
24.8.2
Definition of internal timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
24.8.3
Clock generation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
24.8.4
Prescaler operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
24.8.5
Direct drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
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Contents
ST10F272B/ST10F272E
24.8.6
Oscillator watchdog (OWD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
24.8.7
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
24.8.8
Voltage Controlled Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
24.8.9
PLL Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
24.8.10 PLL lock / unlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
24.8.11 Main oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
24.8.12 32 kHz oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
24.8.13 External clock drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
24.8.14 Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
24.8.15 External memory bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
24.8.16 Multiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
24.8.17 Demultiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
24.8.18 CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
24.8.19 External bus arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
24.8.20 High-speed synchronous serial interface (SSC) timing . . . . . . . . . . . . 180
25
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
26
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Summary of IFLASH address range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Address space reserved to the Flash module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Flash modules sectorization (Read operations) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Flash modules sectorization (Write operations or with ROMS1=’1’ or BootStrap mode) . . 29
Control register interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Flash control register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Flash control register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Flash control register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Flash control register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Banks (BxS) and sectors (BxFy) status bits meaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Flash data register 0 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash data register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash data register 1 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash data register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Flash address register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Flash address register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Flash error register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Flash non volatile write protection I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Flash non volatile access protection register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Flash non volatile access protection register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Flash non volatile access protection register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
XBus flash volatile temporary access unprotection register . . . . . . . . . . . . . . . . . . . . . . . . 41
Summary of access protection level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Flash write operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
ST10F272 boot mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Standard instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
MAC instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Interrupt sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
X-Interrupt detailed mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Trap priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Compare modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
CAPCOM timer input frequencies, resolutions and periods at 40 MHz . . . . . . . . . . . . . . . 62
CAPCOM timer input frequencies, resolutions and periods at 64 MHz . . . . . . . . . . . . . . . 62
GPT1 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 63
GPT1 timer input frequencies, resolutions and periods at 64 MHz. . . . . . . . . . . . . . . . . . . 64
GPT2 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 65
GPT2 timer input frequencies, resolutions and periods at 64 MHz. . . . . . . . . . . . . . . . . . . 65
PWM unit frequencies and resolutions at 40 MHz CPU clock . . . . . . . . . . . . . . . . . . . . . . 67
PWM unit frequencies and resolutions at 64 MHz CPU clock . . . . . . . . . . . . . . . . . . . . . . 68
ASC asynchronous baud rates by reload value and deviation errors (fCPU = 40 MHz) . . 74
ASC asynchronous baud rates by reload value and deviation errors (fCPU = 64 MHz) . . 75
ASC synchronous baud rates by reload value and deviation errors (fCPU = 40 MHz) . . . 75
ASC synchronous baud rates by reload value and deviation errors (fCPU = 64 MHz) . . . 76
Synchronous baud rate and reload values (fCPU = 40 MHz). . . . . . . . . . . . . . . . . . . . . . . 77
Synchronous baud rate and reload values (fCPU = 64 MHz). . . . . . . . . . . . . . . . . . . . . . . 77
WDTREL reload value (fCPU = 40 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
WDTREL reload value (fCPU = 64 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Doc ID 11917 Rev 3
7/188
List of tables
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
Table 83.
Table 84.
Table 85.
8/188
ST10F272B/ST10F272E
Reset event definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Reset event. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
PORT0 latched configuration for the different reset events . . . . . . . . . . . . . . . . . . . . . . . 108
Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
List of special function registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
List of XBus registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
List of flash registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
IDMANUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
IDCHIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
IDMEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
IDPROG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
Flash data retention characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
A/D converter programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
On-chip clock generator selections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Internal PLL divider mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
PLL characteristics (VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C) . . . . . . . . . . . . . . 159
Main oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
Main oscillator negative resistance (module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
32kHz oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Minimum values of negative resistance (module) for 32kHz oscillator . . . . . . . . . . . . . . . 161
External clock drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Multiplexed bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Demultiplexed bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
CLKOUT and READY timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
External bus arbitration timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
SSC master mode timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
SSC slave mode timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
ST10F272 on-chip memory mapping (ROMEN=1 / XADRS = 800Bh - Reset value). . . . . 27
Flash structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
CPU block diagram (MAC Unit not included) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
MAC unit architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
X-Interrupt basic structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Block diagram of GPT1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Block diagram of GPT2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Block diagram of PWM module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Connection to single CAN bus via separate CAN transceivers . . . . . . . . . . . . . . . . . . . . . 80
Connection to single CAN bus via common CAN transceivers. . . . . . . . . . . . . . . . . . . . . . 80
Connection to two different CAN buses (e.g. for gateway application). . . . . . . . . . . . . . . . 81
Connection to one CAN bus with internal Parallel Mode enabled . . . . . . . . . . . . . . . . . . . 81
Asynchronous power-on RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Asynchronous power-on RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Asynchronous hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Asynchronous hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Synchronous short / long hardware RESET (EA = 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Synchronous short / long hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Synchronous long hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Synchronous long hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
SW / WDT unidirectional RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
SW / WDT unidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
SW / WDT bidirectional RESET (EA=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
SW / WDT bidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
SW / WDT bidirectional RESET (EA=0) followed by a HW RESET . . . . . . . . . . . . . . . . . 102
Minimum external reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
System reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Internal (simplified) reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Example of software or watchdog bidirectional reset (EA = 1) . . . . . . . . . . . . . . . . . . . . . 105
Example of software or watchdog bidirectional reset (EA = 0) . . . . . . . . . . . . . . . . . . . . . 106
PORT0 bits latched into the different registers after reset . . . . . . . . . . . . . . . . . . . . . . . . 109
External RC circuitry on RPD pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Port2 test mode structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Supply current versus the operating frequency (RUN and IDLE modes) . . . . . . . . . . . . . 138
A/D conversion characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
A/D converter input pins scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Charge sharing timing diagram during sampling phase . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Anti-aliasing filter and conversion rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Input / output waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Float waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Generation mechanisms for the CPU clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
ST10F272 PLL jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Crystal oscillator and resonator connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
32kHz crystal oscillator connection diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
External clock drive XTAL1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Doc ID 11917 Rev 3
9/188
List of figures
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
10/188
ST10F272B/ST10F272E
External memory cycle: Multiplexed bus, with/without read/write delay, normal ALE. . . . 166
External memory cycle: Multiplexed bus, with/without read/write delay, extended ALE. . 167
External memory cycle: Multiplexed bus, with/without r/w delay, normal ALE, r/w CS. . . 168
External memory cycle: Multiplexed bus, with/without r/w delay, extended ALE, r/w CS . 169
External memory cycle: Demultiplexed bus, with/without r/w delay, normal ALE . . . . . . . 172
Exteral memory cycle: Demultiplexed bus, with/without r/w delay, extended ALE . . . . . . 173
External memory cycle: Demultipl. bus, with/without r/w delay, normal ALE, r/w CS . . . . 174
External memory cycle: Demultiplexed bus, without r/w delay, extended ALE, r/w CS . . 175
CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
External bus arbitration (releasing the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
External bus arbitration (regaining the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
SSC master timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
SSC slave timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
PQFP144 mechanical data and package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
LQFP144 mechanical data and package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
1
Introduction
1.1
Description
Introduction
The ST10F272B / E device is a STMicroelectronics ST10 family of 16-bit single-chip CMOS
microcontrollers.
The ST10F272B / E combines high CPU performance (up to 20 million instructions per
second) with high peripheral functionality and enhanced I/O capabilities. It also provides onchip high-speed single voltage Flash memory, on-chip high-speed RAM, and clock
generation via PLL.
The ST10F272B / E is processed in 0.18mm CMOS technology.The part is supplied with a
single 5 V supply and I/Os work at 5 V.
1.2
Special characteristics
The ST10F272B and ST10F272E devices are derivatives of the STMicroelectronics ST10
family of 16-bit single-chip CMOS microcontrollers.
These two derivatives slightly differ on the available RAM size and Analog Channel Input
number. These points will be highlighted in the corresponding chapters.
For all information that is common to the 2 derivatives, the generic ST10F272 name is used.
The ST10F272 combines high CPU performance (up to 32 million instructions per second)
with high peripheral functionality and enhanced I/O-capabilities. It also provides on-chip
high-speed single voltage Flash memory, on-chip high-speed RAM, and clock generation
via PLL.
ST10F272 is processed in 0.18mm CMOS technology. The MCU core and the logic is
supplied with a 5V to 1.8V on-chip voltage regulator. The part is supplied with a single 5V
supply and I/Os work at 5V.
The device is upward compatible with the ST10F269 device, with the following set of
differences:
Flash control interface is now based on STMicroelectronics third generation of stand-alone
Flash memories (M29F400 series), with an embedded Program/Erase Controller. This
completely frees up the CPU during programming or erasing the Flash.
Only one supply pin (ex DC1 in ST10F269, renamed into V18) on the QFP144 package is
used for decoupling the internally generated 1.8V core logic supply. Do not connect this pin
to 5.0V external supply. Instead, this pin should be connected to a decoupling capacitor
(ceramic type, typical value 10nF, maximum value 100nF).
The AC and DC parameters are modified due to a difference in the maximum CPU
frequency.
A new VDD pin replaces DC2 of ST10F269.
EA pin assumes a new alternate functionality: it is also used to provide a dedicated power
supply (see VSTBY) to maintain biased a portion of the XRAM (16Kbytes) when the main
Power Supply of the device (VDD and consequently the internally generated V18) is turned
off for low power mode, allowing data retention. VSTBY voltage shall be in the range 4.5-5.5
Volt, and a dedicated embedded low power voltage regulator is in charge to provide the 1.8V
Doc ID 11917 Rev 3
11/188
Introduction
ST10F272B/ST10F272E
for the RAM, the low-voltage section of the 32kHz oscillator and the Real Time Clock
module when not disabled. It is allowed to exceed the upper limit up to 6V for a very short
period of time during the global life of the device, and exceed the lower limit down to 4V
when RTC and 32kHz on-chip oscillator are not used.
A second SSC mapped on the XBUS is added (SSC of ST10F269 becomes here SSC0,
while the new one is referred as XSSC or simply SSC1). Note that some restrictions and
functional differences due to the XBUS peculiarities are present between the classic SSC,
and the new XSSC.
A second ASC mapped on the XBUS is added (ASC0 of ST10F269 remains ASC0, while
the new one is referred as XASC or simply as ASC1). Note that some restrictions and
functional differences due to the XBUS peculiarities are present between the classic ASC,
and the new XASC.
A second PWM mapped on the XBUS is added (PWM of ST10F269 becomes here PWM0,
while the new one is referred as XPWM or simply as PWM1). Note that some restrictions
and functional differences due to the XBUS peculiarities are present between the classic
PWM, and the new XPWM.
An I2C interface on the XBUS is added (see X-I2C or simply I2C interface).
CLKOUT function can output either the CPU clock (like in ST10F269) or a software
programmable prescaled value of the CPU clock.
On-chip RAM memory has been increased (Flash size remained the same).
PLL multiplication factors have been adapted to new frequency range.
A/D Converter is not fully compatible versus ST10F269 (timing and programming model).
Formula for the convertion time is still valid, while the sampling phase programming model is
different.
Besides, additional 8 channels are available on P1L pins as alternate function: the accuracy
reachable with these extra channels is reduced with respect to the standard Port5 channels.
External Memory bus is affected by limitations on maximum speed and maximum
capacitance load: ST10F272 is not able to address an external memory at 64MHz with 0
wait states.
XPERCON register bit mapping modified according to new peripherals implementation (not
fully compatible with ST10F269).
Bondout chip for emulation (ST10R201) cannot achieve more than 50MHz at room
temperature (so no real time emulation possible at maximum speed).
Input section characteristics are different. The threshold programmability is extended to all
port pins (additional XPICON register); it is possible to select standard TTL (with up to
400mV of hysteresis) and standard CMOS (with up to 750mV of hysteresis).
Output transition is not programmable.
CAN module is enhanced: ST10F272 implements two C-CAN modules, so the programming
model is slightly different. Besides, the possibility to map in parallel the two CAN modules is
added (on P4.5/P4.6).
On-chip main oscillator input frequency range has been reshaped, reducing it from 1-25MHz
down to 4-8MHz. This is a low power oscillator amplifier, that allows a power consumption
reduction when Real Time Clock is running in Power Down mode, using as reference the onchip main oscillator clock. When this on-chip amplifier is used as reference for Real Time
12/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Introduction
Clock module, the Power-down consumption is dominated by the consumption of the
oscillator amplifier itself.
A second on-chip oscillator amplifier circuit (32kHz) is implemented for low power modes: it
can be used to provide the reference to the Real Time Clock counter (either in Power Down
or Stand-by mode). Pin XTAL3 and XTAL4 replace a couple of VDD/VSS pins of ST10F269.
Possibility to re-program internal XBUS chip select window characteristics (XRAM2 window)
is added.
Doc ID 11917 Rev 3
13/188
Introduction
Figure 1.
ST10F272B/ST10F272E
Logic symbol
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0ORT
BIT
0ORT
BIT
0ORT
BIT
0ORT
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0ORT
BIT
0ORT
BIT
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14/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Pin data
Pin configuration (top view)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
ST10F272
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
P0H.0 / AD8
P0L.7 / AD7
P0L.6 / AD6
P0L.5 / AD5
P0L.4 / AD4
P0L.3 / AD3
P0L.2 / AD2
P0L.1 / AD1
P0L.0 / AD0
EA / VSTBY
ALE
READY
WR/WRL
RD
VSS
VDD
P4.7 / A23 / CAN2_TxD / SDA
P4.6 / A22 / CAN1_TxD / CAN2_TxD
P4.5 / A21 / CAN1_RxD / CAN2_RxD
P4.4 / A20 / CAN2_RxD / SCL
P4.3 / A19
P4.2 / A18
P4.1 / A17
P4.0 / A16
RPD
VSS
VDD
P3.15 / CLKOUT
P3.13 / SCLK0
P3.12 / BHE / WRH
P3.11 / RxD0
P3.10 / TxD0
P3.9 / MTSR0
P3.8 / MRST0
P3.7 / T2IN
P3.6 / T3IN
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
P6.0 / CS0
P6.1 / CS1
P6.2 / CS2
P6.3 / CS3
P6.4 / CS4
P6.5 / HOLD / SCLK1
P6.6 / HLDA / MTSR1
P6.7 / BREQ / MRST1
P8.0 / XPOUT0 / CC16IO
P8.1 / XPOUT1 / CC17IO
P8.2 / XPOUT2 / CC18IO
P8.3 / XPOUT3 / CC19IO
P8.4 / CC20IO
P8.5 / CC21IO
P8.6 / RxD1 / CC22IO
P8.7 / TxD1 / CC23IO
VDD
VSS
P7.0 / POUT0
P7.1 / POUT1
P7.2 / POUT2
P7.3 / POUT3
P7.4 / CC28IO
P7.5 / CC29IO
P7.6 / CC30IO
P7.7 / CC31IO
P5.0 / AN0
P5.1 / AN1
P5.2 / AN2
P5.3 / AN3
P5.4 / AN4
P5.5 / AN5
P5.6 / AN6
P5.7 / AN7
P5.8 / AN8
P5.9 / AN9
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
XTAL4
XTAL3
NMI
RSTOUT
RSTIN
VSS
XTAL1
XTAL2
VDD
P1H.7 / A15 / CC27I
P1H.6 / A14 / CC26I
P1H.5 / A13 / CC25I
P1H.4 / A12 / CC24I
P1H.3 / A11
P1H.2 / A10
P1H.1 / A9
P1H.0 / A8
VSS
VDD
P1L.7 / A7 / AN23* (*)
P1L.6 / A6 / AN22* *(*)
P1L.5 / A5 / AN21* (*)
P1L.4 / A4 / AN20* (*)
P1L.3 / A3 / AN19* *(*)
P1L.2 / A2 / AN18* *(*)
P1L.1 / A1 / AN17* (*)
P1L.0 / A0 / AN16* (*)
P0H.7 / AD15
P0H.6 / AD14
P0H.5 / AD13
P0H.4 / AD12
P0H.3 / AD11
P0H.2 / AD10
P0H.1 / AD9
VSS
VDD
Figure 2.
VAREF
VAGND
P5.10 / AN10 / T6EUD
P5.11 / AN11 / T5EUD
P5.12 / AN12 / T6IN
P5.13 / AN13 / T5IN
P5.14 / AN14 / T4EUD
P5.15 / AN15 / T2EUD
VSS
VDD
P2.0 / CC0IO
P2.1 / CC1IO
P2.2 / CC2IO
P2.3 / CC3IO
P2.4 / CC4IO
P2.5 / CC5IO
P2.6 / CC6IO
P2.7 / CC7IO
VSS
V18
P2.8 / CC8IO / EX0IN
P2.9 / CC9IO / EX1IN
P2.10 / CC10IO / EX2IN
P2.11 / CC11IO / EX3IN
P2.12 / CC12IO / EX4IN
P2.13 / CC13IO / EX5IN
P2.14 / CC14IO / EX6IN
P2.15 / CC15IO / EX7IN / T7IN
P3.0 / T0IN
P3.1 / T6OUT
P3.2 / CAPIN
P3.3 / T3OUT
P3.4 / T3EUD
P3.5 / T4IN
VSS
VDD
2
Pin data
*: AN16 to AN23 are only available for the ST10F272E
Doc ID 11917 Rev 3
15/188
Pin data
Table 1.
Symbol
ST10F272B/ST10F272E
Pin description
Pin
1-8
P6.0 - P6.7
Type
I/O
Function
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 6 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 6 is selectable (TTL or CMOS). The
following Port 6 pins have alternate functions:
1
O
P6.0
CS0
Chip select 0 output
...
...
...
...
...
5
O
P6.4
CS4
Chip select 4 output
I
P6.5
HOLD
External master hold request input
SCLK1
SSC1: master clock output / slave clock input
HLDA
Hold acknowledge output
MTSR1
SSC1: master-transmitter / slave-receiver O/I
BREQ
Bus request output
MRST1
SSC1: master-receiver / slave-transmitter I/O
6
I/O
O
P6.6
7
I/O
O
P6.7
8
I/O
9-16
I/O
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 8 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 8 is selectable (TTL or CMOS).
The following Port 8 pins have alternate functions:
I/O
P8.0
CC16IO
CAPCOM2: CC16 capture input / compare output
XPWM0
PWM1: channel 0 output
9
O
...
P8.0 - P8.7
...
...
...
...
I/O
P8.3
CC19IO
CAPCOM2: CC19 capture input / compare output
XPWM0
PWM1: channel 3 output
12
O
13
I/O
P8.4
CC20IO
CAPCOM2: CC20 capture input / compare output
14
I/O
P8.5
CC21IO
CAPCOM2: CC21 capture input / compare output
I/O
P8.6
CC22IO
CAPCOM2: CC22 capture input / compare output
RxD1
ASC1: Data input (Asynchronous) or I/O (Synchronous)
CC23IO
CAPCOM2: CC23 capture input / compare output
TxD1
ASC1: Clock / Data output
(Asynchronous/Synchronous)
15
I/O
I/O
P8.7
16
O
16/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 1.
Pin description (continued)
Symbol
P7.0 - P7.7
P5.0 - P5.9
P5.10 - P5.15
P2.0 - P2.7
P2.8 - P2.15
Pin data
Pin
Type
Function
19-26
I/O
8-bit bidirectional I/O port, bit-wise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 7 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 7 is selectable (TTL or CMOS).
The following Port 7 pins have alternate functions:
19
O
P7.0
POUT0
PWM0: channel 0 output
...
...
...
...
...
22
O
P7.3
POUT3
PWM0: channel 3 output
23
I/O
P7.4
CC28IO
CAPCOM2: CC28 capture input / compare output
...
...
...
...
...
26
I/O
P7.7
CC31IO
CAPCOM2: CC31 capture input / compare output
27-36
39-44
I
I
16-bit input-only port with Schmitt-Trigger characteristics. The pins of Port 5 can
be the analog input channels (up to 16) for the A/D converter, where P5.x equals
ANx (Analog input channel x), or they are timer inputs. The input threshold of
Port 5 is selectable (TTL or CMOS). The following Port 5 pins have alternate
functions:
39
I
P5.10
T6EUD
GPT2: timer T6 external up/down control input
40
I
P5.11
T5EUD
GPT2: timer T5 external up/down control input
41
I
P5.12
T6IN
GPT2: timer T6 count input
42
I
P5.13
T5IN
GPT2: timer T5 count input
43
I
P5.14
T4EUD
GPT1: timer T4 external up/down control input
44
I
P5.15
T2EUD
GPT1: timer T2 external up/down control input
47-54
57-64
I/O
16-bit bidirectional I/O port, bit-wise programmable for input or output via
direction bit. Programming an I/O pin as input forces the corresponding output
driver to high impedance state. Port 2 outputs can be configured as push-pull or
open drain drivers. The input threshold of Port 2 is selectable (TTL or CMOS).
The following Port 2 pins have alternate functions:
47
I/O
P2.0
CC0IO
CAPCOM: CC0 capture input/compare output
...
...
...
...
...
54
I/O
P2.7
CC7IO
CAPCOM: CC7 capture input/compare output
57
I/O
P2.8
CC8IO
CAPCOM: CC8 capture input/compare output
EX0IN
Fast external interrupt 0 input
I
...
...
...
...
...
64
I/O
P2.15
CC15IO
CAPCOM: CC15 capture input/compare output
I
EX7IN
Fast external interrupt 7 input
I
T7IN
CAPCOM2: timer T7 count input
Doc ID 11917 Rev 3
17/188
Pin data
Table 1.
ST10F272B/ST10F272E
Pin description (continued)
Symbol
P3.0 - P3.5
P3.6 - P3.13,
P3.15
18/188
Pin
Type
Function
65-70,
73-80,
81
I/O
I/O
I/O
15-bit (P3.14 is missing) bidirectional I/O port, bit-wise programmable for input or
output via direction bit. Programming an I/O pin as input forces the corresponding
output driver to high impedance state. Port 3 outputs can be configured as pushpull or open drain drivers. The input threshold of Port 3 is selectable (TTL or
CMOS). The following Port 3 pins have alternate functions:
65
I
P3.0
T0IN
CAPCOM1: timer T0 count input
66
O
P3.1
T6OUT
GPT2: timer T6 toggle latch output
67
I
P3.2
CAPIN
GPT2: register CAPREL capture input
68
O
P3.3
T3OUT
GPT1: timer T3 toggle latch output
69
I
P3.4
T3EUD
GPT1: timer T3 external up/down control input
70
I
P3.5
T4IN
GPT1; timer T4 input for count/gate/reload/capture
73
I
P3.6
T3IN
GPT1: timer T3 count/gate input
74
I
P3.7
T2IN
GPT1: timer T2 input for count/gate/reload / capture
75
I/O
P3.8
MRST0
SSC0: master-receiver/slave-transmitter I/O
76
I/O
P3.9
MTSR0
SSC0: master-transmitter/slave-receiver O/I
77
O
P3.10
TxD0
ASC0: clock / data output (asynchronous/synchronous)
78
I/O
P3.11
RxD0
ASC0: data input (asynchronous) or I/O (synchronous)
79
O
P3.12
BHE
External memory high byte enable signal
WRH
External memory high byte write strobe
80
I/O
P3.13
SCLK0
SSC0: master clock output / slave clock input
81
O
P3.15
CLKOUT
System clock output (programmable divider on CPU
clock)
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 1.
Symbol
Pin data
Pin description (continued)
Pin
Type
Function
85-92
I/O
Port 4 is an 8-bit bidirectional I/O port. It is bit-wise programmable for input or
output via direction bit. Programming an I/O pin as input forces the corresponding
output driver to high impedance state. The input threshold is selectable (TTL or
CMOS). Port 4.4, 4.5, 4.6 and 4.7 outputs can be configured as push-pull or open
drain drivers.
In case of an external bus configuration, Port 4 can be used to output the
segment address lines:
85
O
P4.0
A16
Segment address line
86
O
P4.1
A17
Segment address line
87
O
P4.2
A18
Segment address line
88
O
P4.3
A19
Segment address line
A20
Segment address line
CAN2_RxD
CAN2: receive data input
I/O
SCL
I2C Interface: serial clock
O
A21
Segment address line
CAN1_RxD
CAN1: receive data input
I
CAN2_RxD
CAN2: receive data input
O
A22
Segment address line
CAN1_TxD
CAN1: transmit data output
O
CAN2_TxD
CAN2: transmit data output
O
A23
Most significant segment address line
CAN2_TxD
CAN2: transmit data output
SDA
I2C Interface: serial data
O
P4.0 –P4.7
89
90
91
92
I
I
O
O
I/O
RD
WR/WRL
95
96
P4.4
P4.5
P4.6
P4.7
O
External memory read strobe. RD is activated for every external instruction or
data read access.
O
External memory write strobe. In WR-mode this pin is activated for every external
data write access. In WRL mode this pin is activated for low byte data write
accesses on a 16-bit bus, and for every data write access on an 8-bit bus. See
WRCFG in the SYSCON register for mode selection.
READY/
READY
97
I
Ready input. The active level is programmable. When the ready function is
enabled, the selected inactive level at this pin, during an external memory
access, will force the insertion of waitstate cycles until the pin returns to the
selected active level.
ALE
98
O
Address latch enable output. In case of use of external addressing or of
multiplexed mode, this signal is the latch command of the address lines.
Doc ID 11917 Rev 3
19/188
Pin data
Table 1.
Symbol
EA / VSTBY
ST10F272B/ST10F272E
Pin description (continued)
Pin
99
Type
Function
I
External access enable pin.
A low level applied to this pin during and after Reset forces the ST10F272 to start
the program from the external memory space. A high level forces ST10F272 to
start in the internal memory space. This pin is also used (when Stand-by mode is
entered, that is ST10F272 under reset and main VDD turned off) to bias the 32
kHz oscillator amplifier circuit and to provide a reference voltage for the lowpower embedded voltage regulator which generates the internal 1.8V supply for
the RTC module (when not disabled) and to retain data inside the Stand-by
portion of the XRAM (16Kbyte).
It can range from 4.5 to 5.5V (6V for a reduced amount of time during the device
life, 4.0V when RTC and 32 kHz on-chip oscillator amplifier are turned off). In
running mode, this pin can be tied low during reset without affecting 32 kHz
oscillator, RTC and XRAM activities, since the presence of a stable VDD
guarantees the proper biasing of all those modules.
Two 8-bit bidirectional I/O ports P0L and P0H, bit-wise programmable for input or
output via direction bit. Programming an I/O pin as input forces the corresponding
output driver to high impedance state. The input threshold of Port 0 is selectable
(TTL or CMOS).
In case of an external bus configuration, PORT0 serves as the address (A) and
as the address / data (AD) bus in multiplexed bus modes and as the data (D) bus
in demultiplexed bus modes.
Demultiplexed bus modes
P0L.0 -P0L.7,
100-107,
P0H.0
108,
P0H.1 111-117
P0H.7
I/O
Data path width
8-bit
16-bi
P0L.0 – P0L.7:
D0 – D7
D0 - D7
P0H.0 – P0H.7:
I/O
D8 - D15
Multiplexed bus modes
20/188
Data path width
8-bit
16-bi
P0L.0 – P0L.7:
AD0 – AD7
AD0 - AD7
P0H.0 – P0H.7:
A8 – A15
AD8 - AD15
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 1.
Pin data
Pin description (continued)
Symbol
Pin
Type
Function
118-125
128-135
I/O
Two 8-bit bidirectional I/O ports P1L and P1H, bit-wise programmable for input or
output via direction bit. Programming an I/O pin as input forces the corresponding
output driver to high impedance state. PORT1 is used as the 16-bit address bus
(A) in demultiplexed bus modes: if at least BUSCONx is configured such the
demultiplexed mode is selected, the pis of PORT1 are not available for general
purpose I/O function. The input threshold of Port 1 is selectable (TTL or CMOS).
Only for the ST10F272E
– The pins of P1L also serve as the additional (up to 8) analog input channels for
the A/D converter, where P1L.x equals ANy (Analog input channel y,
where y = x + 16). This additional function have higher priority on demultiplexed
bus function.
The following PORT1 pins have alternate functions:
132
I
P1H.4
CC24IO
CAPCOM2: CC24 capture input
133
I
P1H.5
CC25IO
CAPCOM2: CC25 capture input
134
I
P1H.6
CC26IO
CAPCOM2: CC26 capture input
135
I
P1H.7
CC27IO
CAPCOM2: CC27 capture input
XTAL1
138
I
XTAL1
Main oscillator amplifier circuit and/or external clock input.
XTAL2
137
O
XTAL2
Main oscillator amplifier circuit output.
P1L.0 - P1L.7
P1H.0 P1H.7
To clock the device from an external source, drive XTAL1 while leaving XTAL2
unconnected. Minimum and maximum high / low and rise / fall times specified in
the AC Characteristics must be observed.
XTAL3
143
I
XTAL3
32 kHz oscillator amplifier circuit input
XTAL4
144
O
XTAL4
32 kHz oscillator amplifier circuit output
When 32 kHz oscillator amplifier is not used, to avoid spurious consumption,
XTAL3 shall be tied to ground while XTAL4 shall be left open. Besides, bit OFF32
in RTCCON register shall be set. 32 kHz oscillator can only be driven by an
external crystal, and not by a different clock source.
RSTIN
140
I
Reset Input with CMOS Schmitt-Trigger characteristics. A low level at this pin for
a specified duration while the oscillator is running resets the ST10F272. An
internal pull-up resistor permits power-on reset using only a capacitor connected
to VSS. In bidirectional reset mode (enabled by setting bit BDRSTEN in SYSCON
register), the RSTIN line is pulled low for the duration of the internal reset
sequence.
RSTOUT
141
O
Internal Reset Indication Output. This pin is driven to a low level during hardware,
software or watchdog timer reset. RSTOUT remains low until the EINIT (end of
initialization) instruction is executed.
NMI
142
I
Non-Maskable Interrupt Input. A high to low transition at this pin causes the CPU
to vector to the NMI trap routine. If bit PWDCFG = ‘0’ in SYSCON register, when
the PWRDN (power down) instruction is executed, the NMI pin must be low in
order to force the ST10F272 to go into power down mode. If NMI is high and
PWDCFG =’0’, when PWRDN is executed, the part will continue to run in normal
mode.
If not used, pin NMI should be pulled high externally.
VAREF
37
-
A/D converter reference voltage and analog supply
VAGND
38
-
A/D converter reference and analog ground
Doc ID 11917 Rev 3
21/188
Pin data
Table 1.
ST10F272B/ST10F272E
Pin description (continued)
Symbol
Pin
Type
Function
RPD
84
-
Timing pin for the return from interruptible power down mode and synchronous /
asynchronous reset selection.
VDD
17, 46,
72,82,93
, 109,
126, 136
-
Digital supply voltage = + 5V during normal operation, idle and power down
modes.
It can be turned off when Stand-by RAM mode is selected.
VSS
18,45,
55,71,
83,94,
110,
127, 139
-
Digital ground
V18
56
-
1.8V decoupling pin: a decoupling capacitor (typical value of 10nF, max 100nF)
must be connected between this pin and nearest VSS pin.
22/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Functional description
The architecture of the ST10F272 combines advantages of both RISC and CISC processors
and an advanced peripheral subsystem. The block diagram gives an overview of the
different on-chip components and the high bandwidth internal bus structure of the
ST10F272.
Figure 3.
Block diagram
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Doc ID 11917 Rev 3
23/188
Memory organization
4
ST10F272B/ST10F272E
Memory organization
The memory space of the ST10F272 is configured in a unified memory architecture. Code
memory, data memory, registers and I/O ports are organized within the same linear address
space of 16M Bytes. The entire memory space can be accessed Byte wise or Word wise.
Particular portions of the on-chip memory have additionally been made directly bit
addressable.
IFLASH: 256K Bytes of on-chip Flash memory. It is divided in 8 blocks (B0F0...B0F7) that
constitute the Bank 0. When Bootstrap mode is selected, the Test-Flash Block B0TF
(8Kbyte) appears at address 00’0000h: refer to Section 5: Internal Flash memory for more
details on memory mapping in boot mode. The summary of address range for IFLASH is the
following:
Table 2.
Summary of IFLASH address range
Blocks
User Mode
Size
B0TF
Not visible
8K
B0F0
00’0000h - 00’1FFFh
8K
B0F1
00’2000h - 00’3FFFh
8K
B0F2
00’4000h - 00’5FFFh
8K
B0F3
00’6000h - 00’7FFFh
8K
B0F4
01’8000h - 01’FFFFh
32K
B0F5
02’0000h - 02’FFFFh
64K
B0F6
03’0000h - 03’FFFFh
64K
B0F7
04’0000h - 04’FFFFh
64K
IRAM: 2K Bytes of on-chip internal RAM (dual-port) is provided as a storage for data,
system stack, general purpose register banks and code. A register bank is 16 Wordwide (R0
to R15) and / or Bytewide (RL0, RH0, …, RL7, RH7) general purpose registers group.
XRAM: 8K/16K+2K Bytes of on-chip extension RAM (single port XRAM) is provided as a
storage for data, user stack and code.
The XRAM is divided into 2 areas, the first 2K Bytes named XRAM1 and the second 8K/16K
Bytes named XRAM2, connected to the internal XBUS and are accessed like an external
memory in 16-bit demultiplexed bus-mode without wait state or read/write delay (31.25ns
access at 64MHz CPU clock). Byte and Word accesses are allowed.
The XRAM1 address range is 00’E000h - 00’E7FFh if XPEN (bit 2 of SYSCON register),
and XRAM1EN (bit 2 of XPERCON register) are set. If XRAM1EN or XPEN is cleared, then
any access in the address range 00’E000h - 00’E7FFh will be directed to external memory
interface, using the BUSCONx register corresponding to address matching ADDRSELx
register.
The XRAM2 address range is the one selected programming XADRS3 register, if XPEN (bit
2 of SYSCON register), and XRAM2EN (bit 3 of XPERCON register) are set. If bit XPEN is
cleared, then any access in the address range programmed for XRAM2 will be directed to
24/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Memory organization
external memory interface, using the BUSCONx register corresponding to address
matching ADDRSELx register.
After reset the XRAM2 is mapped from address 09’0000h.
XRAM2 represents also the Stand-by RAM, which can be maintained biased through EA /
VSTBY pin when main supply VDD is turned off.
As the XRAM appears like external memory, it cannot be used as system stack or as
register banks. The XRAM is not provided for single bit storage and therefore is not bit
addressable.
ST10F272B XRAM: 8K+2K Bytes of XRAM.
The XRAM1 (2K Bytes) address range is 00’E000h - 00’E7FFh if enabled.
The XRAM2 (8K Bytes) address range is after reset 09’0000h - 09’1FFFh and is mirrored
every 16KByte boundary.
ST10F272E XRAM: 16K+2K Bytes of XRAM
The XRAM1 (2K Bytes) address range is 00’E000h - 00’E7FFh if enabled.
The XRAM2 (16K Bytes) address range is after reset 09’0000h - 09’3FFFh and is mirrored
every 16KByte boundary.
SFR/ESFR: 1024 Bytes (2 x 512 Bytes) of address space is reserved for the special
function register areas. SFRs are Wordwide registers which are used to control and to
monitor the function of the different on-chip units.
CAN1: Address range 00’EF00h - 00’EFFFh is reserved for the CAN1 Module access. The
CAN1 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN1EN bit
0 of the XPERCON register. Accesses to the CAN Module use demultiplexed addresses
and a 16-bit data bus (only word accesses are possible). Two wait states give an access
time of 62.5ns at 64MHz CPU clock. No tri-state wait states are used.
CAN2: Address range 00’EE00h - 00’EEFFh is reserved for the CAN2 Module access. The
CAN2 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN2EN bit
1 of the new XPERCON register. Accesses to the CAN Module use demultiplexed
addresses and a 16-bit data bus (only word accesses are possible). Two wait states give an
access time of 62.5ns at 64MHz CPU clock. No tri-state wait states are used.
If one or the two CAN modules are used, Port 4 cannot be programmed to output all 8
segment address lines. Thus, only 4 segment address lines can be used, reducing the
external memory space to 5M Bytes (1M Byte per CS line).
RTC: Address range 00’ED00h - 00’EDFFh is reserved for the RTC Module access. The
RTC is enabled by setting XPEN bit 2 of the SYSCON register and bit 4 of the XPERCON
register. Accesses to the RTC Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 62.5ns at 64MHz
CPU clock. No tristate waitstate is used.
PWM1: Address range 00’EC00h - 00’ECFFh is reserved for the PWM1 Module access.
The PWM1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 6 of the
XPERCON register. Accesses to the PWM1 Module use demultiplexed addresses and a 16bit data bus (only word accesses are possible). Two waitstates give an access time of
62.5ns at 64MHz CPU clock. No tristate waitstate is used. Only word access is allowed.
Doc ID 11917 Rev 3
25/188
Memory organization
ST10F272B/ST10F272E
ASC1: Address range 00’E900h - 00’E9FFh is reserved for the ASC1 Module access. The
ASC1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 7 of the XPERCON
register. Accesses to the ASC1 Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 62.5 ns at 64MHz
CPU clock. No tristate waitstate is used.
SSC1: Address range 00’E800h - 00’E8FFh is reserved for the SSC1 Module access. The
SSC1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 8 of the XPERCON
register. Accesses to the SSC1 Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 62.5ns at 64MHz
CPU clock. No tristate waitstate is used.
I2C: Address range 00’EA00h - 00’EAFFh is reserved for the I2C Module access. The I2C is
enabled by setting XPEN bit 2 of the SYSCON register and bit 9 of the XPERCON register.
Accesses to the I2C Module use demultiplexed addresses and a 16-bit data bus (only word
accesses are possible). Two waitstates give an access time of 62.5ns at 64MHz CPU clock.
No tristate waitstate is used.
X-Miscellaneous: Address range 00’EB00h - 00’EBFFh is reserved for the access to a set
of XBUS additional features. They are enabled by setting XPEN bit 2 of the SYSCON
register and bit 10 of the XPERCON register. Accesses to this additional features use
demultiplexed addresses and a 16-bit data bus (only word accesses are possible). Two
waitstates give an access time of 62.5ns at 64MHz CPU clock. No tristate waitstate is used.
The following set of features are provided:
●
CLKOUT programmable divider
●
XBUS interrupt management registers
●
ADC multiplexing on P1L register (only for ST10F272E)
●
Port1L digital disable register for extra ADC channels
●
CAN2 multiplexing on P4.5/P4.6
●
CAN1-2 main clock prescaler
●
Main Voltage Regulator disable for power-down mode
●
TTL / CMOS threshold selection for Port0, Port1, and Port5.
In order to meet the needs of designs where more memory is required than is provided on
chip, up to 16M Bytes of external memory can be connected to the microcontroller.
Visibility of XBUS peripherals
In order to keep the ST10F272 compatible with the ST10F168 / ST10F269, the XBUS
peripherals can be selected to be visible on the external address / data bus. Different bits for
X-peripheral enabling in XPERCON register must be set. If these bits are cleared before the
global enabling with XPEN bit in SYSCON register, the corresponding address space, port
pins and interrupts are not occupied by the peripherals, thus the peripheral is not visible and
not available. Refer to Chapter 23: Register set on page 116.
26/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
ST10F272 on-chip memory mapping (ROMEN=1 / XADRS = 800Bh - Reset value)
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Doc ID 11917 Rev 3
27/188
Internal Flash memory
ST10F272B/ST10F272E
5
Internal Flash memory
5.1
Overview
The on-chip Flash is composed by one matrix module, 256 KBytes wide.
This module is on ST10 Internal bus, so it is called IFLASH
Figure 5.
Flash structure
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The programming operations of the flash are managed by an embedded Flash
Program/Erase Controller (FPEC). The High Voltages needed for Program/Erase operations
are internally generated.
The Data bus is 32-bit wide for fetch accesses to IFLASH, while it is 16 bit wide for read
accesses to IFLASH. Read/write accesses to IFLASH Control Registers area are 16 bit
wide.
5.2
Functional description
5.2.1
Structure
Table 3 shows the Address space reserved to the Flash module.
Table 3.
Address space reserved to the Flash module
Description
28/188
Addresses
Size
IFLASH sectors
0x00 0000 to 0x04 FFFF
256 Kbyte
Reserved IBUS area
0x05 0000 to 0x07 FFFF
192 Kbyte
Registers and Flash internal reserved area
0x08 0000 to 0x08 FFFF
64 Kbyte
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.2.2
Internal Flash memory
Modules structure
The IFLASH module is composed by a bank (Bank 0) of 256 Kbyte of Program Memory
divided in 8 sectors (B0F0...B0F7). Bank 0 contains also a reserved sector named TestFlash. The Addresses from 0x08 0000 to 0x08 FFFF are reserved for the Control Register
Interface and other internal service memory space used by the Flash Program/Erase
controller.
The following tables show the memory mapping of the Flash when it is accessed in read
mode (Table 4: Flash modules sectorization (Read operations)), and when accessed in
write or erase mode (Table 5: Flash modules sectorization (Write operations or with
ROMS1=’1’ or BootStrap mode)): note that with this second mapping, the first four banks
are remapped into code segment 1 (same as obtained setting bit ROMS1 in SYSCON
register).
Table 4.
Bank
Flash modules sectorization (Read operations)
Description
Addresses
Size
Bank 0 Flash 0 (B0F0)
0x0000 0000 - 0x0000 1FFF
8 KB
Bank 0 Flash 1 (B0F1)
0x0000 2000 - 0x0000 3FFF
8 KB
Bank 0 Flash 2 (B0F2)
0x0000 4000 - 0x0000 5FFF
8 KB
Bank 0 Flash 3 (B0F3)
0x0000 6000 - 0x0000 7FFF
8 KB
Bank 0 Flash 4 (B0F4)
0x0001 8000 - 0x0001 FFFF
32 KB
Bank 0 Flash 5 (B0F5)
0x0002 0000 - 0x0002 FFFF
64 KB
Bank 0 Flash 6 (B0F6)
0x0003 0000 - 0x0003 FFFF
64 KB
Bank 0 Flash 7 (B0F7)
0x0004 0000 - 0x0004 FFFF
64 KB
B0
Table 5.
Bank
B0
ST10 Bus size
32-bit (I-BUS)
Flash modules sectorization
(Write operations or with ROMS1=’1’ or BootStrap mode)
Description
Addresses
Size
Bank 0 Test-Flash (B0TF)
0x0000 0000 - 0x0000 1FFF
8 KB
Bank 0 Flash 0 (B0F0)
0x0001 0000 - 0x0001 1FFF
8 KB
Bank 0 Flash 1 (B0F1)
0x0001 2000 - 0x0001 3FFF
8 KB
Bank 0 Flash 2 (B0F2)
0x0001 4000 - 0x0001 5FFF
8 KB
Bank 0 Flash 3 (B0F3)
0x0001 6000 - 0x0001 7FFF
8 KB
Bank 0 Flash 4 (B0F4)
0x0001 8000 - 0x0001 FFFF 32 KB
Bank 0 Flash 5 (B0F5)
0x0002 0000 - 0x0002 FFFF 64 KB
Bank 0 Flash 6 (B0F6)
0x0003 0000 - 0x0003 FFFF 64 KB
Bank 0 Flash 7 (B0F7)
0x0004 0000 - 0x0004 FFFF 64 KB
ST10 Bus size
32-bit (I-BUS)
Table 5 above refers to the configuration when bit ROMS1 of SYSCON register is set.
Doc ID 11917 Rev 3
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Internal Flash memory
ST10F272B/ST10F272E
When Bootstrap mode is entered:
●
Test-Flash is seen and available for code fetches (address 00’0000h)
●
User I-Flash is only available for read and write accesses
●
Write accesses must be made with addresses starting in segment 1 from 01'0000h,
whatever ROMS1 bit in SYSCON value
●
Read accesses are made in segment 0 or in segment 1 depending of ROMS1 value.
In Bootstrap mode, by default ROMS1 = 0, so the first 32KBytes of IFlash are mapped in
segment 0.
Example:
In default configuration, to program address 0, user must put the value 01'0000h in the
FARL and FARH registers, but to verify the content of the address 0 a read to 00'0000h must
be performed.
Next Table 6 shows the Control Register interface composition: this set of registers can be
addressed by the CPU.
Table 6.
Control register interface
Name
5.2.3
Description
Addresses
Size
FCR1-0
Flash Control Registers 1-0
0x0008 0000 - 0x0008 0007
8 byte
FDR1-0
Flash Data Registers 1-0
0x0008 0008 - 0x0008 000F
8 byte
FAR
Flash Address Registers
0x0008 0010 - 0x0008 0013
4 byte
FER
Flash Error Register
0x0008 0014 - 0x0008 0015
2 byte
FNVWPIR
Flash Non Volatile Protection I
Register
0x0008 DFB0 - 0x0008
DFB1
2 byte
FNVAPR0
Flash Non Volatile Access Protection
Register 0
0x0008 DFB8 - 0x0008
DFB9
2 byte
FNVAPR1
Flash Non Volatile Access Protection
Register 1
0x0008 DFBC - 0x0008
DFBF
4 byte
XFVTAUR0
XBus Flash Volatile Temporary
Access Unprotection Register 0
0x0000 EB50 - 0x0000 EB51 2 byte
Bus
size
16-bit
Low power mode
The Flash module is automatically switched off executing PWRDN instruction. The
consumption is drastically reduced, but exiting this state can require a long time (tPD).
Recovery time from Power Down mode for the Flash modules is anyway shorter than the
main oscillator start-up time. To avoid any problem in restarting to fetch code from the Flash,
it is important to size properly the external circuit on RPD pin.
Note:
30/188
PWRDN instruction must not be executed while a Flash program/erase operation is in
progress.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.3
Internal Flash memory
Write operation
The Flash module have one single register interface mapped in the memory space of the
IBUS (0x08 0000 to 0x08 0015). All the operations are enabled through four 16-bit control
registers: Flash Control Register 1-0 High/Low (FCR1H/L-FCR0H/L). Eight other 16-bit
registers are used to store Flash Address and Data for Program operations (FARH/L and
FDR1H/L-FDR0H/L) and Write Operation Error flags (FERH/L). All registers are accessible
with 8 and 16-bit instructions (since operates in 16-bit mode when in read/ write).
Before accessing the IFlash module (and consequently also the Flash register to be used for
program/erasing operations), bit ROMEN in SYSCON register shall be set.
During a Flash write operation any attempt to read the flash itself, that is under modification,
will output invalid data (software trap 009Bh). This means that the Flash is not fetchable
when a programming operation is active: the write operation commands must be executed
from another memory (internal RAM or external memory), as in ST10F269 device. In fact,
due to IBUS characteristics, it is not possible to perform a write operation on IFLASH, when
fetching code from IFLASH.
Direct addressing is not allowed for write accesses to IFLASH Control Registers.
During a Write operation, when bit LOCK of FCR0 is set, it is forbidden to write into the
Flash Control Registers.
Power supply drop
If during a write operation the internal low voltage supply drops below a certain internal
voltage threshold, any write operation running is suddenly interrupted and the module is
reset to Read mode. At following Power-on, the interrupted Flash write operation must be
repeated.
Doc ID 11917 Rev 3
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Internal Flash memory
ST10F272B/ST10F272E
5.4
Registers description
5.4.1
Flash control register 0 low
The Flash Control Register 0 Low (FCR0L) together with the Flash Control Register 0 High
(FCR0H) is used to enable and to monitor all the write operations on the IFLASH. The user
has no access in write mode to the Test-Flash (B0TF). Besides, Test-Flash block is seen by
the user in Bootstrap Mode only.
FCR
FCR0L (0x08 0000)
15
14
13
12
11
10
9
8
Reset Value: 0000h:
7
6
reserved
5
4
3
2
1
0
LOCK
res.
res.
BSY0
res.
R
Table 7.
Flash control register 0 low
Bit
32/188
R
Function
BSY0
Bank 0 Busy (IFLASH)
This bit indicates that a write operation is running on Bank 0 (IFLASH). It is
automatically set when bit WMS is set. Setting Protection operation sets bit BSY0
(since protection registers are in this Block). When this bit is set, every read
access to Bank 0 will output invalid data (software trap 009Bh), while every write
access to the Bank will be ignored. At the end of the write operation or during a
Program or Erase Suspend this bit is automatically reset and the Bank returns to
read mode. After a Program or Erase Resume this bit is automatically set again.
LOCK
Flash Registers Access Locked
When this bit is set, it means that the access to the Flash Control Registers
FCR0H/-FCR1H/L, FDR0H/L-FDR1H/L, FARH/L and FER is locked by the FPEC:
any read access to the registers will output invalid data (software trap 009Bh) and
any write access will be ineffective. LOCK bit is automatically set when the Flash
bit WMS is set.
This is the only bit the user can always access to detect the status of the Flash:
once it is found low, the rest of FCR0L and all the other Flash registers are
accessible by the user as well.
Note that FER content can be read when LOCK is low, but its content is updated
only when also BSY0 bit is reset.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.4.2
Internal Flash memory
Flash control register 0 high
The Flash Control Register 0 High (FCR0H) together with the Flash Control Register 0 Low
(FCR0L) is used to enable and to monitor all the write operations on the IFLASH. The user
has no access in write mode to the Test-Flash (B0TF). Besides, Test-Flash block is seen by
the user in Bootstrap Mode only.
FCR
FCR0H (0x08 0002)
15
14
WMS
SUSP
RW
RW
Table 8.
13
12
11
WPG DWPG
SER
RW
RW
RW
10
9
reserved
8
Reset value: 0000h
7
6
5
4
3
2
1
0
reserved
SPR
RW
Flash control register 0 high
Bit
Function
SPR
Set Protection
This bit must be set to select the Set Protection operation. The Set Protection
operation allows to program 0s in place of 1s in the Flash Non Volatile Protection
Registers. The Flash Address in which to program must be written in the FARH/L
registers, while the Flash Data to be programmed must be written in the FDR0H/L
before starting the execution by setting bit WMS. A sequence error is flagged by bit
SEQER of FER if the address written in FARH/L is not in the range 0x0E8FB00x08DFBF. SPR bit is automatically reset at the end of the Set Protection
operation.
SER
Sector Erase
This bit must be set to select the Sector Erase operation in the Flash modules. The
Sector Erase operation allows to erase all the Flash locations to value 0xFF. From
1 to all the sectors of the same Bank (excluded Test-Flash for Bank B0) can be
selected to be erased through bits BxFy of FCR1H/L registers before starting the
execution by setting bit WMS. It is not necessary to pre-program the sectors to
0x00, because this is done automatically. SER bit is automatically reset at the end
of the Sector Erase operation.
DWPG
Double Word Program
This bit must be set to select the Double Word (64 bits) Program operation in the
Flash module. The Double Word Program operation allows to program 0s in place
of 1s. The Flash Address in which to program (aligned with even words) must be
written in the FARH/L registers, while the 2 Flash Data to be programmed must be
written in the FDR0H/L registers (even word) and FDR1H/L registers (odd word)
before starting the execution by setting bit WMS. DWPG bit is automatically reset
at the end of the Double Word Program operation.
WPG
Word Program
This bit must be set to select the Word (32 bits) Program operation in the Flash
module. The Word Program operation allows to program 0s in place of 1s. The
Flash Address to be programmed must be written in the FARH/L registers, while
the Flash Data to be programmed must be written in the FDR0H/L registers before
starting the execution by setting bit WMS. WPG bit is automatically reset at the end
of the Word Program operation.
Doc ID 11917 Rev 3
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Internal Flash memory
Table 8.
ST10F272B/ST10F272E
Flash control register 0 high (continued)
Bit
5.4.3
Function
SUSP
Suspend
This bit must be set to suspend the current Program (Word or Double Word) or
Sector Erase operation in order to read data in one of the Sectors of the Bank
under modification or to program data in another Bank. The Suspend operation
resets the Flash Bank to normal read mode (automatically resetting bit BSY0).
When in Program Suspend, the Flash module accepts only the following
operations: Read and Program Resume. When in Erase Suspend the module
accepts only the following operations: Read, Erase Resume and Program (Word or
Double Word; Program operations cannot be suspended during Erase Suspend).
To resume a suspended operation, the WMS bit must be set again, together with
the selection bit corresponding to the operation to resume (WPG, DWPG, SER).
Note: It is forbidden to start a new Write operation with bit SUSP already set.
WMS
Write Mode Start
This bit must be set to start every write operation in the Flash module. At the end of
the write operation or during a Suspend, this bit is automatically reset. To resume a
suspended operation, this bit must be set again. It is forbidden to set this bit if bit
ERR of FER is high (the operation is not accepted). It is also forbidden to start a
new write (program or erase) operation (by setting WMS high) when bit SUSP of
FCR0 is high. Resetting this bit by software has no effect.
Flash control register 1 low
The Flash Control Register 1 Low (FCR1L), together with Flash Control Register 1 High
(FCR1H), is used to select the Sectors to Erase, or during any write operation to monitor the
status of each Sector and Bank.
15
14
13
12
Reset value: 0000h
FCR
FCR1L (0x08 0004)
11
10
9
reserved
8
7
6
34/188
3
2
1
0
RS
RS
RS
RS
RS
RS
RS
Flash control register 1 low
Bit
B0F(7:0)
4
B0F7 B0F6 B0F5 B0F4 B0F3 B0F2 B0F1 B0F0
RS
Table 9.
5
Function
Bank 0 IFLASH Sector 9:0 Status
These bits must be set during a Sector Erase operation to select the sectors to
erase in Bank 0. Besides, during any erase operation, these bits are automatically
set and give the status of the 8 sectors of Bank 0 (B0F7-B0F0). The meaning of
B0Fy bit for Sector y of Bank 0 is given by the next Table 4 Banks (BxS) and
Sectors (BxFy) Status bits meaning. These bits are automatically reset at the end
of a Write operation if no errors are detected.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.4.4
Internal Flash memory
Flash control register 1 high
The Flash Control Register 1 High (FCR1H), together with Flash Control Register 1 Low
(FCR1L), is used to select the Sectors to Erase, or during any write operation to monitor the
status of each Sector and Bank.
FCR
FCR1H (0x08 0006)
15
14
13
12
11
10
9
reserved
8
Reset value: 0000h
7
6
B0S
5
4
3
2
1
0
reserved
RS
Table 10.
Flash control register 1 high
Bit
Function
Bank 0 Status (IFLASH)
During any erase operation, this bit is automatically modified and gives the status
of the Bank 0. The meaning of B0S bit is given in the next Table 4 Banks (BxS) and
Sectors (BxFy) Status bits meaning. This bit is automatically reset at the end of a
erase operation if no errors are detected.
B0S
During any erase operation, this bit is automatically set and gives the status of the Bank 0.
The meaning of B0Fy bit for Sector y of Bank 0 is given by the next Table 4 Banks (BxS) and
Sectors (BxFy) Status bits meaning. These bits are automatically reset at the end of an
erase operation if no errors are detected.
Table 11.
5.4.5
Banks (BxS) and sectors (BxFy) status bits meaning
ERR
SUSP
B0S = 1 meaning
B0Fy = 1 meaning
1
-
Erase Error in Bank 0
Erase Error in Sector y of Bank 0
0
1
Erase Suspended in Bank 0
Erase Suspended in Sector y of Bank 0
0
0
Don’t care
Don’t care
Flash data register 0 low
The Flash Address Registers (FARH/L) and the Flash Data Registers (FDR1H/L-FDR0H/L)
are used during the program operations to store Flash Address in which to program and
Data to program.
FCR
FDR0L (0x08 0008)
15
14
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN15 DIN14 DIN13 DIN12 DIN11 DIN10 DIN9 DIN8 DIN7 DIN6 DIN5 DIN4 DIN3 DIN2 DIN1 DIN0
RW
RW
RW
RW
RW
RW
RW
RW
RW
Doc ID 11917 Rev 3
RW
RW
RW
RW
RW
RW
RW
35/188
Internal Flash memory
Table 12.
ST10F272B/ST10F272E
Flash data register 0 low
Bit
Function
Data Input 15:0
These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
DIN(15:0)
5.4.6
Flash data register 0 high
FCR
FDR0H (0x08 000A)
15
14
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN31 DIN30 DIN29 DIN28 DIN27 DIN26 DIN25 DIN24 DIN23 DIN22 DIN21 DIN20 DIN19 DIN18 DIN17 DIN16
RW
RW
Table 13.
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 0 high
Bit
Function
Data Input 31:16
These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
DIN(31:16)
5.4.7
RW
Flash data register 1 low
FCR
FDR1L (0x08 000C)
15
14
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN15 DIN14 DIN13 DIN12 DIN11 DIN10 DIN9 DIN8 DIN7 DIN6 DIN5 DIN4 DIN3 DIN2 DIN1 DIN0
RW
RW
Table 14.
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 1 low
Bit
Function
Data Input 15:0
These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
DIN(15:0)
5.4.8
RW
Flash data register 1 high
FCR
FDR1H (0x08 000E)
15
14
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN31 DIN30 DIN29 DIN28 DIN27 DIN26 DIN25 DIN24 DIN23 DIN22 DIN21 DIN20 DIN19 DIN18 DIN17 DIN16
RW
36/188
RW
RW
RW
RW
RW
RW
RW
RW
Doc ID 11917 Rev 3
RW
RW
RW
RW
RW
RW
RW
ST10F272B/ST10F272E
Table 15.
Internal Flash memory
Flash data register 1 high
Bit
Function
Data Input 31:16
These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
DIN(31:16)
5.4.9
Flash address register low
FCR
FARL (0x08 0010)
15
14
13
12
11
10
9
8
Reset value: 0000h
7
6
5
4
3
2
ADD15ADD14ADD13ADD12ADD11ADD10 ADD9 ADD8 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2
RW
RW
Table 16.
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
0
reserved
RW
Flash address register low
Bit
Function
Address 15:2
These bits must be written with the Address of the Flash location to program in the
following operations: Word Program (32-bit) and Double Word Program (64-bit). In
Double Word Program bit ADD2 must be written to ‘0’.
ADD(15:2)
5.4.10
RW
1
Flash address register high
FARH (0x08 0012)
15
14
13
Reset value: 0000h
FCR
12
11
10
9
8
7
6
reserved
5
4
1
0
RW
RW
RW
RW
Flash address register high
Bit
ADD(20:16)
2
ADD20 ADD19 ADD18 ADD17 ADD16
RW
Table 17.
3
Function
Address 20:16
These bits must be written with the Address of the Flash location to program in the
following operations: Word Program and Double Word Program.
Doc ID 11917 Rev 3
37/188
Internal Flash memory
5.4.11
ST10F272B/ST10F272E
Flash error register
Flash Error register, as well as all the other Flash registers, can be properly read only once
LOCK bit of register FCR0L is low. Nevertheless, its content is updated when also BSY0 bit
is reset as well; for this reason, it is definitively meaningful reading FER register content only
when LOCK bit and BSY0 bit are cleared.
FER (0x8 0014h)
15
14
13
12
11
10
reserved
9
8
7
RC
RC
5
4
reserved
3
2
1
10ER PGER ERER
RC
RC
RC
0
ERR
RC
Flash error register
Bit
38/188
6
WPF RESER SEQER
RC
Table 18.
Reset value: 0000h
FCR
Function
ERR
Write Error
This bit is automatically set when an error occurs during a Flash write operation or
when a bad write operation setup is done. Once the error has been discovered and
understood, ERR bit must be software reset.
ERER
Erase Error
This bit is automatically set when an Erase error occurs during a Flash write
operation. This error is due to a real failure of a Flash cell, that can no more be
erased. This kind of error is fatal and the sector where it occurred must be
discarded. This bit has to be software reset.
PGER
Program Error
This bit is automatically set when a Program error occurs during a Flash write
operation. This error is due to a real failure of a Flash cell, that can no more be
programmed. The word where this error occurred must be discarded. This bit has
to be software reset.
10ER
1 over 0 Error
This bit is automatically set when trying to program at 1 bits previously set at 0 (this
does not happen when programming the Protection bits). This error is not due to a
failure of the Flash cell, but only flags that the desired data has not been written.
This bit has to be software reset.
SEQER
Sequence Error
This bit is automatically set when the control registers (FCR1H/L-FCR0H/L,
FARH/L, FDR1H/L-FDR0H/L) are not correctly filled to execute a valid Write
Operation. In this case no Write Operation is executed. This bit has to be software
reset.
RESER
Resume Error
This bit is automatically set when a suspended Program or Erase operation is not
resumed correctly due to a protocol error. In this case the suspended operation is
aborted. This bit has to be software reset.
WPF
Write Protection Flag
This bit is automatically set when trying to program or erase in a sector write
protected. In case of multiple Sector Erase, the not protected sectors are erased,
while the protected sectors are not erased and bit WPF is set. This bit has to be
software reset.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.5
Internal Flash memory
Protection strategy
The protection bits are stored in Non Volatile Flash cells inside IFLASH module, that are
read once at reset and stored in 4 Volatile registers. Before they are read from the Non
Volatile cells, all the available protections are forced active during reset.
The protections can be programmed using the Set Protection operation (see Flash Control
Registers paragraph), that can be executed from all the internal or external memories
except from the Flash itself.
Two kind of protections are available: write protections to avoid unwanted writings and
access protections to avoid piracy. In next paragraphs all different level of protections are
shown, and architecture limitations are highlighted as well.
5.5.1
Protection registers
The 4 Non Volatile Protection Registers are one time programmable for the user.
One register (FNVWPIR) is used to store the Write Protection fuses respectively for each
sector IFLASH module. The other three Registers (FNVAPR0 and FNVAPR1L/H) are used
to store the Access Protection fuses.
5.5.2
Flash non volatile write protection I register
FNVWPIR (0x08 DFB0)
15
14
13
12
NVR
11
reserved
10
9
8
Reset value: FFFFh
7
6
3
2
1
0
RW
RW
RW
RW
RW
RW
RW
Flash non volatile write protection I register
Bit
W0P(9:0)
4
W0P7W0P6W0P5W0P4W0P3W0P2W0P1W0P0
RW
Table 19.
5
Function
Write Protection Bank 0 / Sectors 9-0 (IFLASH)
These bits, if programmed at 0, disable any write access to the sectors of Bank 0
(IFLASH)
Doc ID 11917 Rev 3
39/188
Internal Flash memory
5.5.3
ST10F272B/ST10F272E
Flash non volatile access protection register 0
FNVAPR0 (0x08 DFB8)
15
14
13
12
NVR
11
10
9
8
Reset value: ACFFh
7
6
5
4
3
2
reserved
1
DBGP ACCP
RW
Table 20.
RW
Flash non volatile access protection register 0
Bit
5.5.4
0
Function
ACCP
Access Protection
This bit, if programmed at 0, disables any access (read/write) to data mapped
inside IFlash Module address space, unless the current instruction is fetched from
IFlash.
DBGP
Debug Protection
This bit, if erased at 1, allows to by-pass all the protections using the Debug
features through the Test Interface. If programmed at 0, on the contrary, all the
debug features, the Test Interface and all the Flash Test Modes are disabled. Even
STMicroelectronics will not be able to access the device to run any eventual failure
analysis.
Flash non volatile access protection register 1 low
FNVAPR1L (0x08 DFBC)
15
14
13
12
NVR
11
10
9
8
Delivery value:: FFFFh
7
6
5
4
3
2
1
0
PDS15 PDS14 PDS13 PDS12 PDS11 PDS10 PDS9 PDS8 PDS7 PDS6 PDS5 PDS4 PDS3 PDS2 PDS1 PDS0
RW
RW
Table 21.
RW
RW
RW
RW
RW
RW
RW
40/188
RW
RW
RW
RW
RW
RW
Flash non volatile access protection register 1 low
Bit
PDS(15:0)
RW
Function
Protections Disable 15-0
If bit PDSx is programmed at 0 and bit PENx is erased at 1, the action of bit ACCP
is disabled. Bit PDS0 can be programmed at 0 only if both bits DBGP and ACCP
have already been programmed at 0. Bit PDSx can be programmed at 0 only if bit
PENx-1 has already been programmed at 0.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.5.5
Internal Flash memory
Flash non volatile access protection register 1 high
FNVAPR1H (0x08 DFBE)
15
14
13
12
NVR
11
10
9
8
Delivery value: FFFFh
7
6
5
4
3
2
1
0
PEN15PEN14PEN13PEN12PEN11PEN10 PEN9 PEN8 PEN7 PEN6 PEN5 PEN4 PEN3 PEN2 PEN1 PEN0
RW
RW
Table 22.
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash non volatile access protection register 1 high
Bit
Function
Protections Enable 15-0
If bit PENx is programmed at 0 and bit PDSx+1 is erased at 1, the action of bit
ACCP is enabled again. Bit PENx can be programmed at 0 only if bit PDSx has
already been programmed at 0.
PEN15-0
5.5.6
RW
XBus flash volatile temporary access unprotection register (XFVTAUR0)
XFVTAUR0 (0x00 EB50)
15
14
13
12
NVR
11
10
9
8
Reset value: 0000h
7
6
5
4
3
2
1
0
TAUB
reserved
Table 23.
XBus flash volatile temporary access unprotection register
Bit
TAUB
5.5.7
RW
Function
Temporary Access Unprotection bit
If this bit is set to 1, the Access Protection is temporary disabled.
This bit can be written only executing from IFlash.This fact guarantees that only a
code executed in IFlash, can unprotect the IFlash, when it is Access Protected.
Access protection
The I-Flash module has one level of access protection (access to data both in Reading and
Writing): if bit ACCP of FNVAPR0 is programmed at 0 and bit TAUB in XFVTAUR0 is set at
0, the I-Flash module becomes access protected: data in the I-Flash module can be read
only if the current execution is from the I-Flash module itself.
To enable Access Protection, the following sequence of operations is recommended:
●
execution from external memory or internal Rams
●
program TAUB bit at 1 in XFVTAUR0 register
●
program ACCP bit in FNVAPR0 to 0 using Set Protection operation
●
program TAUB bit at 0 in XFVTAUR0 register
●
Access Protection is active when both ACCP bit and TAUB bit are set to 0.
Protection can be permanently disabled by programming bit PDS0 of FNVAPR1H, in order
to analyze rejects. Protection can be permanently enabled again by programming bit PEN0
of FNVAPR1L. The action to disable and enable again Access Protections in a permanent
Doc ID 11917 Rev 3
41/188
Internal Flash memory
ST10F272B/ST10F272E
way can be executed a maximum of 16 times. To execute the above described operations,
the Flash has to be temporary unprotected (See Section 5.5.9: Temporary unprotection).
Trying to write into the access protected Flash from internal RAM or external memories is
unsuccessful. Trying to read into the access protected Flash from internal RAM or external
memories will output a dummy data (software trap 0x009Bh).
When the Flash module is protected in access, also the data access through PEC of a
peripheral is forbidden. To read/write data in PEC mode from/to a protected Bank, first it is
necessary to temporary unprotect the Flash module.
In Table 24 there is a summary of all levels of possible Access protection is reported: in
particular, supposing to enable all possible access protections, when fetching from a
memory as listed in the first column, what is possible and what is not possible to do (see
column headers) is shown in the table.
Table 24.
Summary of access protection level
Read XRAMS or
Read IFLASH /
Ext Mem / Jump to
Jump to IFLASH
XRAM or Ext Mem
Read FLASH
Registers
Write FLASH
Registers
Fetching from IFLASH
Yes / Yes
Yes / Yes
Yes
No
Fetching from IRAM
No / Yes
Yes / Yes
Yes
No
Fetching from XRAM
No / Yes
Yes / Yes
Yes
No
Fetching from External
Memory
No / Yes
Yes / Yes
Yes
No
When the Access Protection is enabled, Flash registers can not be written, so no
program/erase operation can be run on I-Flash. To enable the access to registers again, the
Temporary Access Unprotection procedure has to be followed (see Section 5.5.9).
5.5.8
Write protection
The Flash modules have one level of Write Protections: each Sector of each Bank of each
Flash Module can be Software Write Protected by programming at 0 the related bit W0Px in
FNVWPIRL register.
5.5.9
Temporary unprotection
Bits W0Px of FNVWPIRL can be temporary unprotected by executing the Set Protection
operation and by writing 1 into these bits.
To restore the write protection bits it is necessary to reset the microcontroller or to execute a
Set Protection operation and write 0 into the desired bits.
In reality, when a temporary write unprotection operation is executed, the corresponding
volatile register is written to 1, while the non volatile registers bits previously written to 0 (for
a protection set operation), will continue to maintain the 0. For this reason, the User
software must be in charge to track the current write protection status (for instance using a
specific RAM area), it is not possible to deduce it by reading the non volatile register content
(a temporary unprotection cannot be detected).
42/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Internal Flash memory
To temporary unprotect the Flash when the Access Protection is active, it is necessary to set
at 1 the bit TAUB in XFVTAUR0. This bit can be write at 1, only executing from Flash: in this
way only an instruction executed from Flash can unprotect the Flash itself.
To restore the Access Protection, it is necessary to reset the microcontroller or to write at 0
the bit TAUB in XFVTAUR0.
Doc ID 11917 Rev 3
43/188
Internal Flash memory
5.6
ST10F272B/ST10F272E
Write operation examples
In the following, examples for each kind of Flash write operation are presented.
Note:
The write operation commands must be executed from another memory (internal RAM or
external memory), as in ST10F269 device. In fact, due to IBus characteristics, it is not
possible to perform write operation in Flash while fetching code from Flash.
Moreover, direct addressing is not allowed for write accesses to IFlash control registers.
This means that both address and data for a writing operation must be loaded in one of
ST10 GPR register (R0...R15).
Write operation on IBus registers is 16 bit wide.
Example of indirect addressing mode
MOV
MOV
MOV
RWm, #ADDRESS;
RWn, #DATA;
[RWm], RWn;
/*Load Add in RWm*/
/*Load Data in RWn*/
/*Indirect addressing*/
Word program
Example: 32-bit Word Program of data 0xAAAAAAAA at address 0x025554
FCR0H|=
FARL =
FARH =
FDR0L =
FDR0H =
FCR0H|=
0x2000;
0x5554;
0x0002;
0xAAAA;
0xAAAA;
0x8000;
/*Set WPG in FCR0H*/
/*Load Add in FARL*/
/*Load Add in FARH*/
/*Load Data in FDR0L*/
/*Load Data in FDR0H*/
/*Operation start*/
Double word program
Example: Double Word Program (64-bit) of data 0x55AA55AA at address 0x035558 and
data 0xAA55AA55 at address 0x03555C in IFLASH Module.
FCR0H
FARL
FARH
FDR0L
FDR0H
FDR1L
FDR1H
FCR0H
|= 0x1000;
= 0x5558;
= 0x0003;
= 0x55AA;
= 0x55AA;
= 0xAA55;
= 0xAA55;
|= 0x8000;
/*Set DWPG/
/*Load Add in FARL*/
/*Load Add in FARH*/
/*Load Data in FDR0L*/
/*Load Data in FDR0H*/
/*Load Data in FDR1L*/
/*Load Data in FDR1H*/
/*Operation start*/
Double Word Program is always performed on the Double Word aligned on a even Word: bit
ADD2 of FARL is ignored.
Sector erase
Example: Sector Erase of sectors B0F1 and B0F0 of Bank 0 in IFLASH Module.
FCR0H
FCR1L
FCR0H
44/188
|= 0x0800;
|= 0x0003;
|= 0x8000;
/*Set SER in FCR0H*/
/*Set B0F1, B0F0*/
/*Operation start*/
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Internal Flash memory
Suspend and resume
Word Program, Double Word Program, and Sector Erase operations can be suspended in
the following way:
FCR0H
|= 0x4000;
/*Set SUSP in FCR0H*/
Then the operation can be resumed in the following way:
FCR0H
FCR0H
|= 0x0800;
|= 0x8000;
/*Set SER in FCR0H*/
/*Operation resume*/
Before resuming a suspended Erase, FCR1H/FCR1L must be read to check if the Erase is
already completed (FCR1H = FCR1L = 0x0000 if Erase is complete). Original setup of
Select Operation bits in FCR0H/L must be restored before the operation resume, otherwise
the operation is aborted and bit RESER of FER is set.
Erase suspend, program and resume
A Sector Erase operation can be suspended in order to program (Word or Double Word)
another Sector.
Example: Sector Erase of sector B0F1 of IFLASH Module.
FCR0H
FCR1L
FCR0H
|= 0x0800;
|= 0x0002;
|= 0x8000;
/*Set SER in FCR0H*/
/*Set B0F1*/
/*Operation start*/
Example: Sector Erase Suspend.
FCR0H |= 0x4000;
/*Set SUSP in FCR0H*/
do
/*Loop to wait for LOCK=0 and WMS=0*/
{tmp1 = FCR0L;
tmp2 = FCR0H;
} while ((tmp1 && 0x0010) || (tmp2 && 0x8000));
Example: Word Program of data 0x5555AAAA at address 0x045554 in IFLASH module.
FCR0H &= 0xBFFF;
/*Rst SUSP in FCR0H*/
FCR0H|= 0x2000;/*Set WPG in FCR0H*/
FARL
= 0x5554;
/*Load Add in FARL*/
FARH
= 0x0004;
/*Load Add in FARH*/
FDR0L
= 0xAAAA;
/*Load Data in FDR0L*/
FDR0H
= 0x5555;
/*Load Data in FDR0H*/
FCR0H |= 0x8000;
/*Operation start*/
Once the Program operation is finished, the Erase operation can be resumed in the
following way:
FCR0H|= 0x0800;/*Set SER in FCR0H*/
FCR0H|= 0x8000;/*Operation resume*/
Notice that during the Program Operation in Erase suspend, bits SER and SUSP are low. A
Word or Double Word Program during Erase Suspend cannot be suspended.
In summary:
Doc ID 11917 Rev 3
45/188
Internal Flash memory
ST10F272B/ST10F272E
A Sector Erase can be suspended by setting SUSP bit.
●
To perform a Word Program operation during Erase Suspend, firstly bits SUSP and
SER must be reset, then bit WPG and WMS can be set.
●
To resume the Sector Erase operation bit SER must be set again.
●
In any case it is forbidden to start any write operation with SUSP bit already set.
Set protection
Example 1: Enable Write Protection of sectors B0F3-0 of Bank 0 in IFLASH module.
FCR0H
FARL
FARH
FDR0L
FDR0H
FCR0H
|=
=
=
=
=
|=
0x0100;
0xDFB4;
0x0008;
0xFFF0;
0xFFFF;
0x8000;
/*Set SPR in FCR0H*/
/*Load Add of register FNVWPIR in FARL*/
/*Load Add of register FNVWPIR in FARH*/
/*Load Data in FDR0L*/
/*Load Data in FDR0H*/
/*Operation start*/
Example 2: Enable Access and Debug Protection.
FCR0H
FARL
FARH
FDR0L
FCR0H
|=
=
=
=
|=
0x0100;
0xDFB8;
0x0008;
0xFFFC;
0x8000;
/*Set SPR in FCR0H*/
/*Load Add of register FNVAPR0 in FARL*/
/*Load Add of register FNVAPR0 in FARH*/
/*Load Data in FDR0L*/
/*Operation start*/
Example 3: Disable in a permanent way Access and Debug Protection.
XFVTAUR0 = 0x0001;
FCR0H
|= 0x0100;
FARL
= 0xDFBC;
FARH
= 0x0008;
FDR0L
= 0xFFFE;
FCR0H
|= 0x8000;
/*Set TAUB in XFVTAUR0*/
/*Set SPR in FCR0H*/
/*Load Add of register FNVAPR1L in FARL*/
/*Load Add of register FNVAPR1L in FARH*/
/*Load Data in FDR0L for clearing PDS0*/
/*Operation start*/
Example 4: Enable again in a permanent way Access and Debug Protection, after having
disabled them.
XFVTAUR0 = 0x0001;
FCR0H
|= 0x0100;
FARL
= 0xDFBC;
FARH
= 0x0008;
FDR0H
= 0xFFFE;
PEN0*/
FCR0H
|= 0x8000;
XFVTAUR0 = 0x0000;
/*Set TAUB in XFVTAUR0*/
/*Set SPR in FCR0H*/
/*Load Add register FNVAPR1H in FARL*/
/*Load Add register FNVAPR1H in FARH*/
/*Load Data in FDR0H for clearing
/*Operation start*/
/*Reset TAUB in XFVTAUR0*/
Disable and re-enable of Access and Debug Protection in a permanent way (as shown by
examples 3 and 4) can be done for a maximum of 16 times.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
5.7
Internal Flash memory
Write operation summary
In general, each write operation is started through a sequence of 3 steps:
1.
The first instruction is used to select the desired operation by setting its corresponding
selection bit in the Flash Control Register 0.
2.
The second step is the definition of the Address and Data for programming or the
Sectors or Banks to erase.
3.
The last instruction is used to start the write operation, by setting the start bit WMS in
the FCR0.
Once selected, but not yet started, one operation can be canceled by resetting the operation
selection bit.
A summary of the available Flash Module Write Operations are shown in the following
Table 25.
Table 25.
Flash write operations
Operation
Select bit
Address and data
Start bit
WPG
FARL/FARH
FDR0L/FDR0H
WMS
DWPG
FARL/FARH
FDR0L/FDR0H
FDR1L/FDR1H
WMS
Sector Erase
SER
FCR1L/FCR1H
WMS
Set Protection
SPR
FDR0L/FDR0H
WMS
SUSP
None
None
Word Program (32-bit)
Double Word Program (64-bit)
Program/Erase Suspend
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Bootstrap loader
6
ST10F272B/ST10F272E
Bootstrap loader
ST10F272 implements Boot capabilities in order to:
6.1
●
Support bootstrap via UART or bootstrap via CAN for the standard bootstrap.
●
Support a Selective Bootstrap Loader, to manage the bootstrap sequence in a different
way.
Selection among user-code, standard or selective bootstrap
The boot modes are triggered with a special combination set on Port0L[5...4]. Those
signals, as other configuration signals, are latched on the rising edge of RSTIN pin.
●
Decoding of reset configuration (P0L.5 = 1, P0L.4 = 1) will select the normal mode
(also called User Mode) and select the user Flash to be mapped from address
00’0000h.
●
Decoding of reset configuration (P0L.5 = 1, P0L.4 = 0) will select ST10 standard
bootstrap mode (Test-Flash is active and overlaps user Flash for code fetches from
address 00'0000h; user Flash is active and available for read accesses).
●
Decoding of reset configuration (P0L.5 = 0, P0L.4 = 1) will activate new verifications to
select which bootstrap software to execute:
–
if the User mode signature in the User Flash is programmed correctly, then a
software reset sequence is selected and the User code is executed;
–
if the User mode signature is not programmed correctly in the user Flash, then the
User key location is read again. Its value will determine which communication
channel will be enabled for bootstraping
.
Table 26.
6.2
ST10F272 boot mode selection
P0.5
P0.4
ST10 decoding
1
1
User Mode: user Flash mapped at 00’0000h
1
0
Standard Bootstrap Loader: User Flash mapped from 00’0000h, code fetches
redirected to Test-Flash at 00’0000h
0
1
Selective Boot Mode: User Flash mapped from 00’0000h, code fetches
redirected to Test-Flash at 00’0000h (different sequence execution in respect of
Standard Bootstrap Loader)
0
0
Reserved
Standard bootstrap loader
After entering the standard BSL mode and the respective initialization, the ST10F272 scans
the RxD0 line and the CAN1_RxD line to receive either a valid dominant bit from CAN
interface, or a start condition from UART line.
Start condition on UART RxD: ST10F272 starts standard bootstrap loader. This bootstrap
loader is identical to other ST10 devices (example: ST10F269, ST10F168).
Valid dominant bit on CAN1 RxD: ST10F272 start bootstrapping via CAN1.
48/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Bootstrap loader
6.3
Alternate and selective boot mode (ABM and SBM)
6.3.1
Activation of the ABM and SBM
Alternate boot is activated with the combination ‘01’ on Port0L[5..4] at the rising edge of
RSTIN.
6.3.2
User mode signature integrity check
The behavior of the Selective Boot Mode is based on the computing of a signature between
the content of 2 memory locations and a comparison with a reference signature. This
requires that users who use Selective Boot have reserved and programmed the Flash
memory locations.
6.3.3
Selective boot mode
When the user signature is not correct, instead of executing the Standard Bootstrap Loader
(triggered by P0L.4 low at reset), additional check is made.
Depending on the value at the User key location, following behavior will occur:
●
A jump is performed to the Standard Bootstrap Loader
●
Only UART is enabled for bootstraping
●
Only CAN1 is enabled for bootstraping
●
The device enters an infinite loop.
Doc ID 11917 Rev 3
49/188
Central processing unit (CPU)
7
ST10F272B/ST10F272E
Central processing unit (CPU)
The CPU includes a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit (ALU) and
dedicated SFRs. Additional hardware has been added for a separate multiply and divide
unit, a bit-mask generator and a barrel shifter.
Most of the ST10F272’s instructions can be executed in one instruction cycle which requires
31.25ns at 64 MHz CPU clock. For example, shift and rotate instructions are processed in
one instruction cycle independent of the number of bits to be shifted.
Multiple-cycle instructions have been optimized: branches are carried out in 2 cycles, 16 x
16-bit multiplication in 5 cycles and a 32/16-bit division in 10 cycles.
The jump cache reduces the execution time of repeatedly performed jumps in a loop, from
2 cycles to 1 cycle.
The CPU uses a bank of 16 word registers to run the current context. This bank of General
Purpose Registers (GPR) is physically stored within the on-chip Internal RAM (IRAM) area.
A Context Pointer (CP) register determines the base address of the active register bank to
be accessed by the CPU.
The number of register banks is only restricted by the available Internal RAM space. For
easy parameter passing, a register bank may overlap others.
A system stack of up to 2048 bytes is provided as a storage for temporary data. The system
stack is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack
pointer (SP) register.
Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer
value upon each stack access for the detection of a stack overflow or underflow.
Figure 6.
CPU block diagram (MAC Unit not included)
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50/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
7.1
Central processing unit (CPU)
Multiplier-accumulator unit (MAC)
The MAC co-processor is a specialized co-processor added to the ST10 CPU Core in order
to improve the performances of the ST10 Family in signal processing algorithms.
The standard ST10 CPU has been modified to include new addressing capabilities which
enable the CPU to supply the new co-processor with up to 2 operands per instruction cycle.
This new co-processor (so-called MAC) contains a fast multiply-accumulate unit and a
repeat unit.
The co-processor instructions extend the ST10 CPU instruction set with multiply, multiplyaccumulate, 32-bit signed arithmetic operations.
Figure 7.
MAC unit architecture
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Doc ID 11917 Rev 3
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Central processing unit (CPU)
7.2
ST10F272B/ST10F272E
Instruction set summary
The Table 27 lists the instructions of the ST10F272. The detailed description of each
instruction can be found in the “ST10 Family Programming Manual”.
Table 27.
Standard instruction set summary
Mnemonic
52/188
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR (16-16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit)
2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit)
2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bit-wise AND, (word/byte operands)
2/4
OR(B)
Bit-wise OR, (word/byte operands)
2/4
XOR(B)
Bit-wise XOR, (word/byte operands)
2/4
BCLR
Clear direct bit
2
BSET
Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND, BOR, BXOR
AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/L
Bit-wise modify masked high/low byte of bit-addressable direct word
memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct word GPR and
store result in direct word GPR
2
SHL / SHR
Shift left/right direct word GPR
2
ROL / ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS
Move byte operand to word operand with sign extension
2/4
MOVBZ
Move byte operand to word operand with zero extension
2/4
JMPA, JMPI, JMPR
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 27.
Central processing unit (CPU)
Standard instruction set summary (continued)
Mnemonic
Description
Bytes
J(N)B
Jump relative if direct bit is (not) set
4
JBC
Jump relative and clear bit if direct bit is set
4
JNBS
Jump relative and set bit if direct bit is not set
4
CALLA, CALLI,
CALLR
Call absolute/indirect/relative subroutine if condition is met
4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call absolute
subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH, POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update register
with word operand
4
RET
Return from intra-segment subroutine
2
RETS
Return from inter-segment subroutine
2
RETP
Return from intra-segment subroutine and pop direct word register
from system stack
2
RETI
Return from interrupt service subroutine
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
Enter Power Down Mode (supposes NMI-pin being low)
4
SRVWDT
Service Watchdog Timer
4
DISWDT
Disable Watchdog Timer
4
EINIT
Signify End-of-Initialization on RSTOUT-pin
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
NOP
Null operation
Doc ID 11917 Rev 3
2
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Central processing unit (CPU)
7.3
ST10F272B/ST10F272E
MAC co-processor specific instructions
The Table 28 lists the MAC instructions of the ST10F272. The detailed description of each
instruction can be found in the “ST10 Family Programming Manual”. Note that all MAC
instructions are encoded on 4 Bytes.
Table 28.
MAC instruction set summary
Mnemonic
54/188
Description
CoABS
Absolute Value of the Accumulator
CoADD(2)
Addition
CoASHR(rnd)
Accumulator Arithmetic Shift Right & Optional Round
CoCMP
Compare Accumulator with Operands
CoLOAD(-,2)
Load Accumulator with Operands
CoMAC(R,u,s,-,rnd)
(Un)Signed/(Un)Signed Multiply-Accumulate & Optional Round
CoMACM(R)(u,s,-,rnd)
(Un)Signed/(Un)Signed Multiply-Accumulate with Parallel Data
Move & Optional Round
CoMAX / CoMIN
Maximum / Minimum of Operands and Accumulator
CoMOV
Memory to Memory Move
CoMUL(u,s,-,rnd)
(Un)Signed/(Un)Signed multiply & Optional Round
CoNEG(rnd)
Negate Accumulator & Optional Round
CoNOP
No-Operation
CoRND
Round Accumulator
CoSHL / CoSHR
Accumulator Logical Shift Left / Right
CoSTORE
Store a MAC Unit Register
CoSUB(2,R)
Substraction
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
8
External bus controller
External bus controller
All of the external memory accesses are performed by the on-chip external bus controller.
The EBC can be programmed to single chip mode when no external memory is required, or
to one of four different external memory access modes:
●
16- / 18- / 20- / 24-bit addresses and 16-bit data, demultiplexed
●
16- / 18- / 20- / 24-bit addresses and 16-bit data, multiplexed
●
16- / 18- / 20- / 24-bit addresses and 8-bit data, multiplexed
●
16- / 18- / 20- / 24-bit addresses and 8-bit data, demultiplexed
In demultiplexed bus modes addresses are output on PORT1 and data is input / output on
PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use
PORT0 for input / output.
Timing characteristics of the external bus interface (memory cycle time, memory tri-state
time, length of ALE and read / write delay) are programmable giving the choice of a wide
range of memories and external peripherals.
Up to four independent address windows may be defined (using register pairs ADDRSELx /
BUSCONx) to access different resources and bus characteristics.
These address windows are arranged hierarchically where BUSCON4 overrides BUSCON3
and BUSCON2 overrides BUSCON1.
All accesses to locations not covered by these four address windows are controlled by
BUSCON0. Up to five external CS signals (four windows plus default) can be generated in
order to save external glue logic. Access to very slow memories is supported by a ‘Ready’
function.
A HOLD / HLDA protocol is available for bus arbitration which shares external resources
with other bus masters.
The bus arbitration is enabled by setting bit HLDEN in register PSW. After setting HLDEN
once, pins P6.7...P6.5 (BREQ, HLDA, HOLD) are automatically controlled by the EBC. In
master mode (default after reset) the HLDA pin is an output. By setting bit DP6.7 to’1’ the
slave mode is selected where pin HLDA is switched to input. This directly connects the slave
controller to another master controller without glue logic.
For applications which require less external memory space, the address space can be
restricted to 1 Mbyte, 256 Kbytes or to 64 Kbytes. Port 4 outputs all eight address lines if an
address space of 16M Bytes is used, otherwise four, two or no address lines.
Chip select timing can be made programmable. By default (after reset), the CSx lines
change half a CPU clock cycle after the rising edge of ALE. With the CSCFG bit set in the
SYSCON register the CSx lines change with the rising edge of ALE.
The active level of the READY pin can be set by bit RDYPOL in the BUSCONx registers.
When the READY function is enabled for a specific address window, each bus cycle within
the window must be terminated with the active level defined by bit RDYPOL in the
associated BUSCON register.
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Interrupt system
9
ST10F272B/ST10F272E
Interrupt system
The interrupt response time for internal program execution is from 78ns to 187.5ns at
64 MHz CPU clock.
The ST10F272 architecture supports several mechanisms for fast and flexible response to
service requests that can be generated from various sources (internal or external) to the
microcontroller. Any of these interrupt requests can be serviced by the Interrupt Controller or
by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is
suspended and a branch to the interrupt vector table is performed, just one cycle is ‘stolen’
from the current CPU activity to perform a PEC service. A PEC service implies a single Byte
or Word data transfer between any two memory locations with an additional increment of
either the PEC source or destination pointer. An individual PEC transfer counter is implicitly
decremented for each PEC service except when performing in the continuous transfer
mode. When this counter reaches zero, a standard interrupt is performed to the
corresponding source related vector location. PEC services are very well suited to perform
the transmission or the reception of blocks of data. The ST10F272 has 8 PEC channels,
each of them offers such fast interrupt-driven data transfer capabilities.
An interrupt control register which contains an interrupt request flag, an interrupt enable flag
and an interrupt priority bit-field is dedicated to each existing interrupt source. Thanks to its
related register, each source can be programmed to one of sixteen interrupt priority levels.
Once starting to be processed by the CPU, an interrupt service can only be interrupted by a
higher prioritized service request. For the standard interrupt processing, each of the
possible interrupt sources has a dedicated vector location.
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number.
Fast external interrupt inputs are provided to service external interrupts with high precision
requirements. These fast interrupt inputs feature programmable edge detection (rising edge,
falling edge or both edges).
Fast external interrupts may also have interrupt sources selected from other peripherals; for
example the CANx controller receive signals (CANx_RxD) and I2C serial clock signal can be
used to interrupt the system.
Table 29 shows all the available ST10F272 interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers:
Table 29.
Interrupt sources
Source of Interrupt or
PEC Service Request
56/188
Request
Flag
Enable
Flag
Interrupt
Vector
Vector
Location
Trap
Number
CAPCOM Register 0
CC0IR
CC0IE
CC0INT
00’0040h
10h
CAPCOM Register 1
CC1IR
CC1IE
CC1INT
00’0044h
11h
CAPCOM Register 2
CC2IR
CC2IE
CC2INT
00’0048h
12h
CAPCOM Register 3
CC3IR
CC3IE
CC3INT
00’004Ch
13h
CAPCOM Register 4
CC4IR
CC4IE
CC4INT
00’0050h
14h
CAPCOM Register 5
CC5IR
CC5IE
CC5INT
00’0054h
15h
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 29.
Interrupt system
Interrupt sources (continued)
Source of Interrupt or
PEC Service Request
Request
Flag
Enable
Flag
Interrupt
Vector
Vector
Location
Trap
Number
CAPCOM Register 6
CC6IR
CC6IE
CC6INT
00’0058h
16h
CAPCOM Register 7
CC7IR
CC7IE
CC7INT
00’005Ch
17h
CAPCOM Register 8
CC8IR
CC8IE
CC8INT
00’0060h
18h
CAPCOM Register 9
CC9IR
CC9IE
CC9INT
00’0064h
19h
CAPCOM Register 10
CC10IR
CC10IE
CC10INT
00’0068h
1Ah
CAPCOM Register 11
CC11IR
CC11IE
CC11INT
00’006Ch
1Bh
CAPCOM Register 12
CC12IR
CC12IE
CC12INT
00’0070h
1Ch
CAPCOM Register 13
CC13IR
CC13IE
CC13INT
00’0074h
1Dh
CAPCOM Register 14
CC14IR
CC14IE
CC14INT
00’0078h
1Eh
CAPCOM Register 15
CC15IR
CC15IE
CC15INT
00’007Ch
1Fh
CAPCOM Register 16
CC16IR
CC16IE
CC16INT
00’00C0h
30h
CAPCOM Register 17
CC17IR
CC17IE
CC17INT
00’00C4h
31h
CAPCOM Register 18
CC18IR
CC18IE
CC18INT
00’00C8h
32h
CAPCOM Register 19
CC19IR
CC19IE
CC19INT
00’00CCh
33h
CAPCOM Register 20
CC20IR
CC20IE
CC20INT
00’00D0h
34h
CAPCOM Register 21
CC21IR
CC21IE
CC21INT
00’00D4h
35h
CAPCOM Register 22
CC22IR
CC22IE
CC22INT
00’00D8h
36h
CAPCOM Register 23
CC23IR
CC23IE
CC23INT
00’00DCh
37h
CAPCOM Register 24
CC24IR
CC24IE
CC24INT
00’00E0h
38h
CAPCOM Register 25
CC25IR
CC25IE
CC25INT
00’00E4h
39h
CAPCOM Register 26
CC26IR
CC26IE
CC26INT
00’00E8h
3Ah
CAPCOM Register 27
CC27IR
CC27IE
CC27INT
00’00ECh
3Bh
CAPCOM Register 28
CC28IR
CC28IE
CC28INT
00’00F0h
3Ch
CAPCOM Register 29
CC29IR
CC29IE
CC29INT
00’0110h
44h
CAPCOM Register 30
CC30IR
CC30IE
CC30INT
00’0114h
45h
CAPCOM Register 31
CC31IR
CC31IE
CC31INT
00’0118h
46h
CAPCOM Timer 0
T0IR
T0IE
T0INT
00’0080h
20h
CAPCOM Timer 1
T1IR
T1IE
T1INT
00’0084h
21h
CAPCOM Timer 7
T7IR
T7IE
T7INT
00’00F4h
3Dh
CAPCOM Timer 8
T8IR
T8IE
T8INT
00’00F8h
3Eh
GPT1 Timer 2
T2IR
T2IE
T2INT
00’0088h
22h
GPT1 Timer 3
T3IR
T3IE
T3INT
00’008Ch
23h
GPT1 Timer 4
T4IR
T4IE
T4INT
00’0090h
24h
GPT2 Timer 5
T5IR
T5IE
T5INT
00’0094h
25h
Doc ID 11917 Rev 3
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Interrupt system
Table 29.
ST10F272B/ST10F272E
Interrupt sources (continued)
Source of Interrupt or
PEC Service Request
Request
Flag
Enable
Flag
Interrupt
Vector
Vector
Location
Trap
Number
GPT2 Timer 6
T6IR
T6IE
T6INT
00’0098h
26h
GPT2 CAPREL Register
CRIR
CRIE
CRINT
00’009Ch
27h
A/D Conversion Complete
ADCIR
ADCIE
ADCINT
00’00A0h
28h
A/D Overrun Error
ADEIR
ADEIE
ADEINT
00’00A4h
29h
ASC0 Transmit
S0TIR
S0TIE
S0TINT
00’00A8h
2Ah
ASC0 Transmit Buffer
S0TBIR
S0TBIE
S0TBINT
00’011Ch
47h
ASC0 Receive
S0RIR
S0RIE
S0RINT
00’00ACh
2Bh
ASC0 Error
S0EIR
S0EIE
S0EINT
00’00B0h
2Ch
SSC Transmit
SCTIR
SCTIE
SCTINT
00’00B4h
2Dh
SSC Receive
SCRIR
SCRIE
SCRINT
00’00B8h
2Eh
SSC Error
SCEIR
SCEIE
SCEINT
00’00BCh
2Fh
PWM Channel 0...3
PWMIR
PWMIE
PWMINT
00’00FCh
3Fh
See Section 9.1
XP0IR
XP0IE
XP0INT
00’0100h
40h
See Section 9.1
XP1IR
XP1IE
XP1INT
00’0104h
41h
See Section 9.1
XP2IR
XP2IE
XP2INT
00’0108h
42h
See Section 9.1
XP3IR
XP3IE
XP3INT
00’010Ch
43h
Hardware traps are exceptions or error conditions that arise during run-time. They cause
immediate non-maskable system reaction similar to a standard interrupt service (branching
to a dedicated vector table location).
The occurrence of a hardware trap is additionally signified by an individual bit in the trap flag
register (TFR). Except when another higher prioritized trap service is in progress, a
hardware trap will interrupt any other program execution. Hardware trap services cannot not
be interrupted by standard interrupt or by PEC interrupts.
9.1
X-Peripheral interrupt
The limited number of X-Bus interrupt lines of the present ST10 architecture, imposes some
constraints on the implementation of the new functionality. In particular, the additional XPeripherals SSC1, ASC1, I2C, PWM1 and RTC need some resources to implement interrupt
and PEC transfer capabilities. For this reason, a multiplexed structure for the interrupt
management is proposed. In the next Figure 8, the principle is explained through a simple
diagram, which shows the basic structure replicated for each of the four X-interrupt available
vectors (XP0INT, XP1INT, XP2INT and XP3INT).
It is based on a set of 16-bit registers XIRxSEL (x=0,1,2,3), divided in two portions each:
58/188
●
Byte High
XIRxSEL[15:8]
Interrupt Enable bits
●
Byte Low
XIRxSEL[7:0]
Interrupt Flag bits
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Interrupt system
When different sources submit an interrupt request, the enable bits (Byte High of XIRxSEL
register) define a mask which controls which sources will be associated with the unique
available vector. If more than one source is enabled to issue the request, the service routine
will have to take care to identify the real event to be serviced. This can easily be done by
checking the flag bits (Byte Low of XIRxSEL register). Note that the flag bits can also
provide information about events which are not currently serviced by the interrupt controller
(since masked through the enable bits), allowing an effective software management also in
absence of the possibility to serve the related interrupt request: a periodic polling of the flag
bits may be implemented inside the user application.
Figure 8.
X-Interrupt basic structure
8)2 X3%,;= X
&LAG;=
)43OURCE
)43OURCE
)43OURCE
)43OURCE
80X)#80X)2X
)43OURCE
)43OURCE
)43OURCE
)43OURCE
8)2 X3%,;= X
%NABLE;=
'!0'2)
The Table 30 summarizes the mapping of the different interrupt sources which shares the
four X-interrupt vectors.
Table 30.
X-Interrupt detailed mapping
XP0INT
CAN1 Interrupt
XP1INT
XP2INT
x
CAN2 Interrupt
x
x
x
I2C Receive
x
x
x
I2C Transmit
x
x
x
I2C Error
x
SSC1 Receive
x
x
x
SSC1 Transmit
x
x
x
SSC1 Error
ASC1 Receive
XP3INT
x
x
Doc ID 11917 Rev 3
x
x
59/188
Interrupt system
Table 30.
ST10F272B/ST10F272E
X-Interrupt detailed mapping (continued)
XP0INT
XP1INT
XP2INT
ASC1 Transmit
x
x
x
ASC1 Transmit Buffer
x
x
x
ASC1 Error
x
PLL Unlock / OWD
x
PWM1 Channel 3...0
9.2
XP3INT
x
x
Exception and error traps list
Table 31 shows all of the possible exceptions or error conditions that can arise during runtime.
Table 31.
Trap priorities
Trap
vector
Vector
location
Trap
number
Trap*
priority
RESET
RESET
RESET
00’0000h
00’0000h
00’0000h
00h
00h
00h
III
III
III
NMI
STKOF
STKUF
NMITRAP
STOTRAP
STUTRAP
00’0008h
00’0010h
00’0018h
02h
04h
06h
II
II
II
UNDOPC
MACTRP
PRTFLT
ILLOPA
ILLINA
ILLBUS
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
00’0028h
00’0028h
00’0028h
00’0028h
00’0028h
00’0028h
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
I
I
I
I
I
I
Reserved
[002Ch - 003Ch]
[0Bh - 0Fh]
Software Traps
TRAP Instruction
Any
0000h – 01FCh
in steps of 4h
Any
[00h - 7Fh]
Exception condition
Trap
flag
Reset Functions:
Hardware Reset
Software Reset
Watchdog Timer Overflow
Class A Hardware Traps:
Non-Maskable Interrupt
Stack Overflow
Stack Underflow
Class B Hardware Traps:
Undefined Opcode
MAC Interruption
Protected Instruction Fault
Illegal word Operand Access
Illegal Instruction Access
Illegal External Bus Access
Note:
Current
CPU
Priority
* - All the class B traps have the same trap number (and vector) and the same lower priority
compare to the class A traps and to the resets.
- Each class A traps has a dedicated trap number (and vector). They are prioritized in the
second priority level.
- The resets have the highest priority level and the same trap number.
- The PSW.ILVL CPU priority is forced to the highest level (15) when these exceptions are
serviced.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
10
Capture / compare (CAPCOM) units
Capture / compare (CAPCOM) units
The ST10F272 has two 16-channel CAPCOM units which support generation and control of
timing sequences on up to 32 channels with a maximum resolution of 125ns at 64 MHz CPU
clock.
The CAPCOM units are typically used to handle high speed I/O tasks such as pulse and
waveform generation, pulse width modulation (PMW), Digital to Analog (D/A) conversion,
software timing, or time recording relative to external events.
Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time bases
for the capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution and allows precise
adjustments to application specific requirements. In addition, external count inputs for
CAPCOM timers T0 and T7 allow event scheduling for the capture/compare registers
relative to external events.
Each of the two capture/compare register arrays contain 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer T0 or T1 (T7
or T8, respectively), and programmed for capture or compare functions. Each of the 32
registers has one associated port pin which serves as an input pin for triggering the capture
function, or as an output pin to indicate the occurrence of a compare event.
When a capture/compare register has been selected for capture mode, the current contents
of the allocated timer will be latched (captured) into the capture/compare register in
response to an external event at the port pin which is associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition at
the pin can be selected as the triggering event. The contents of all registers which have
been selected for one of the five compare modes are continuously compared with the
contents of the allocated timers.
When a match occurs between the timer value and the value in a capture / compare
register, specific actions will be taken based on the selected compare mode.
The input frequencies fTx, for the timer input selector Tx, are determined as a function of the
CPU clocks. The timer input frequencies, resolution and periods which result from the
selected pre-scaler option in TxI when using a 40 MHz and 64 MHz CPU clock are listed in
the Table 33 and Table 34 respectively.
The numbers for the timer periods are based on a reload value of 0000h. Note that some
numbers may be rounded to 3 significant figures.
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Capture / compare (CAPCOM) units
Table 32.
ST10F272B/ST10F272E
Compare modes
Compare
modes
Function
Mode 0
Interrupt-only compare mode; several compare interrupts per timer period are
possible
Mode 1
Pin toggles on each compare match; several compare events per timer period are
possible
Mode 2
Interrupt-only compare mode; only one compare interrupt per timer period is
generated
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare time overflow; only one compare
event per timer period is generated
Double Register Two registers operate on one pin; pin toggles on each compare match; several
Mode
compare events per timer period are possible.
Table 33.
CAPCOM timer input frequencies, resolutions and periods at 40 MHz
Timer input selection txI
fCPU = 40 MHz
Pre-scaler for
fCPU
000b
001b
010b
011b
100b
101b
110b
111b
8
16
32
64
128
256
512
1024
312.5
kHz
156.25
kHz
78.125
kHz
39.1
kHz
3.2µs
6.4µs
12.8µs
25.6µs
Input Frequency
5MHz
Resolution
200ns
400ns
0.8µs
1.6µs
Period
13.1ms
26.2ms
52.4ms
104.8
ms
Table 34.
2.5MHz 1.25MHz 625 kHz
209.7ms 419.4ms 838.9ms
1.678s
CAPCOM timer input frequencies, resolutions and periods at 64 MHz
Timer input selection txI
fCPU = 64 MHz
000b
001b
010b
011b
100b
101b
110b
111b
8
16
32
64
128
256
512
1024
Input Frequency
8MHz
4MHz
2MHz
1 kHz
500 kHz
250 kHz
128 kHz
64 kHz
Resolution
125ns
250ns
0.5µs
1.0µs
2.0µs
4.0µs
8.0µs
16.0µs
Period
8.2ms
16.4ms 32.8ms
524.3ms
1.049s
Pre-scaler for
fCPU
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65.5ms 131.1ms 262.1ms
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
11
General purpose timer unit
General purpose timer unit
The GPT unit is a flexible multifunctional timer/counter structure which is used for time
related tasks such as event timing and counting, pulse width and duty cycle measurements,
pulse generation, or pulse multiplication. The GPT unit contains five 16-bit timers organized
into two separate modules GPT1 and GPT2. Each timer in each module may operate
independently in several different modes, or may be concatenated with another timer of the
same module.
11.1
GPT1
Each of the three timers T2, T3, T4 of the GPT1 module can be configured individually for
one of four basic modes of operation: timer, gated timer, counter mode and incremental
interface mode.
In timer mode, the input clock for a timer is derived from the CPU clock, divided by a
programmable prescaler.
In counter mode, the timer is clocked in reference to external events.
Pulse width or duty cycle measurement is supported in gated timer mode where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes, each timer has one associated port pin (TxIN) which serves as gate or clock
input.
Table 35 and Table 36 list the timer input frequencies, resolution and periods for each prescaler option at 40MHz and 64MHz CPU clock respectively.
In Incremental Interface Mode, the GPT1 timers (T2, T3, T4) can be directly connected to
the incremental position sensor signals A and B by their respective inputs TxIN and TxEUD.
Direction and count signals are internally derived from these two input signals so that the
contents of the respective timer Tx corresponds to the sensor position. The third position
sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has output toggle latches (TxOTL) which changes state on each timer over flow /
underflow. The state of this latch may be output on port pins (TxOUT) for time out monitoring
of external hardware components, or may be used internally to clock timers T2 and T4 for
high resolution of long duration measurements.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload or
capture registers for timer T3.
Table 35.
GPT1 timer input frequencies, resolutions and periods at 40 MHz
Timer Input Selection T2I / T3I / T4I
fCPU = 40 MHz
Pre-scaler
factor
Input frequency
000b
001b
010b
011b
100b
101b
110b
111b
8
16
32
64
128
256
512
1024
5MHz
2.5MHz
1.25
MHz
625 kHz
312.5
kHz
156.25
kHz
78.125
kHz
39.1 kHz
Doc ID 11917 Rev 3
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General purpose timer unit
Table 35.
ST10F272B/ST10F272E
GPT1 timer input frequencies, resolutions and periods at 40 MHz
Timer Input Selection T2I / T3I / T4I
fCPU = 40 MHz
000b
001b
010b
011b
100b
101b
110b
111b
Resolution
200ns
400ns
0.8µs
1.6µs
3.2µs
6.4µs
12.8µs
25.6µs
Period
maximum
13.1ms
26.2ms
52.4ms
104.8
ms
838.9ms
1.678s
Table 36.
209.7ms 419.4ms
GPT1 timer input frequencies, resolutions and periods at 64 MHz
Timer Input Selection T2I / T3I / T4I
fCPU = 64 MHz
000b
001b
010b
011b
100b
101b
110b
111b
Pre-scaler
factor
8
16
32
64
128
256
512
1024
Input Freq
8MHz
4MHz
2MHz
1 kHz
500 kHz
250 kHz
128 kHz
64 kHz
Resolution
125ns
250ns
0.5µs
1.0µs
2.0µs
4.0µs
8.0µs
16.0µs
Period
maximum
8.2ms
16.4ms
32.8ms
524.3ms
1.049s
Figure 9.
65.5ms 131.1ms 262.1ms
Block diagram of GPT1
4%5$
#05#LOCK
5$
NN
4).
#05#LOCK
NN
4).
4
-ODE
#ONTROL
'044IMER4
)NTERRUPT
2EQUEST
2ELOAD
#APTURE
4/54
4
-ODE
#ONTROL
'044IMER4
4/4,
5$
4%5$
#APTURE
4).
#05#LOCK
NN
4
-ODE
#ONTROL
)NTERRUPT
2EQUEST
2ELOAD
'044IMER4
4%5$
)NTERRUPT
2EQUEST
5$
'!0'2)
64/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
11.2
General purpose timer unit
GPT2
The GPT2 module provides precise event control and time measurement. It includes two
timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an
input clock which is derived from the CPU clock via a programmable prescaler or with
external signals. The count direction (up/down) for each timer is programmable by software
or may additionally be altered dynamically by an external signal on a port pin (TxEUD).
Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6
which changes its state on each timer overflow/underflow.
The state of this latch may be used to clock timer T5, or it may be output on a port pin
(T6OUT). The overflow / underflow of timer T6 can additionally be used to clock the
CAPCOM timers T0 or T1, and to cause a reload from the CAPREL register. The CAPREL
register may capture the contents of timer T5 based on an external signal transition on the
corresponding port pin (CAPIN), and timer T5 may optionally be cleared after the capture
procedure. This allows absolute time differences to be measured or pulse multiplication to
be performed without software overhead.
The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1
timer T3 inputs T3IN and/or T3EUD. This is advantageous when T3 operates in Incremental
Interface Mode.
Table 37 and Table 38 list the timer input frequencies, resolution and periods for each prescaler option at 40MHz and 64MHz CPU clock respectively.
Table 37.
GPT2 timer input frequencies, resolutions and periods at 40 MHz
Timer Input Selection T5I / T6I
fCPU = 40MHz
000b
001b
010b
011b
100b
101b
110b
111b
Pre-scaler
factor
4
8
16
32
64
128
256
512
Input Freq
10MHz
5MHz
2.5MHz
1.25
MHz
625 kHz
312.5
kHz
156.25
kHz
78.125
kHz
Resolution
100ns
200ns
400ns
0.8µs
1.6µs
3.2µs
6.4µs
12.8µs
Period
maximum
6.55ms
13.1ms
26.2ms
52.4ms
Table 38.
104.8ms 209.7ms 419.4ms
838.9ms
GPT2 timer input frequencies, resolutions and periods at 64 MHz
Timer Input Selection T5I / T6I
fCPU = 64MHz
000b
001b
010b
011b
100b
101b
110b
111b
Pre-scaler
factor
4
8
16
32
64
128
256
512
Input Freq
16MHz
8MHz
4MHz
2MHz
1 kHz
500 kHz
250 kHz
128 kHz
Resolution
62.5ns
125ns
250ns
0.5µs
1.0µs
2.0µs
4.0µs
8.0µs
Period
maximum
4.1ms
8.2ms
16.4ms
32.8ms
65.5ms
Doc ID 11917 Rev 3
131.1ms 262.1ms
524.3ms
65/188
General purpose timer unit
ST10F272B/ST10F272E
Figure 10. Block diagram of GPT2
4%5$
#05#LOCK
5$
NN
4).
4
-ODE
#ONTROL
)NTERRUPT
2EQUEST
'044IMER4
#LEAR
#APTURE
)NTERRUPT
2EQUEST
#!0).
'04#!02%,
2ELOAD
4).
#05#LOCK
NN
4
-ODE
#ONTROL
)NTERRUPT
2EQUEST
4OGGLE&&
44,
'044IMER4
TO#!0#/4IMERS
5$
4%5$
66/188
4/54
Doc ID 11917 Rev 3
'!0'2)
ST10F272B/ST10F272E
12
PWM modules
PWM modules
Two pulse width modulation modules are available on ST10F272: standard PWM0 and
XBUS PWM1. They can generate up to four PWM output signals each, using edge-aligned
or centre-aligned PWM. In addition, the PWM modules can generate PWM burst signals and
single shot outputs. The Table 39 and Table 40 show the PWM frequencies for different
resolutions. The level of the output signals is selectable and the PWM modules can
generate interrupt requests.
Figure 11.
Block diagram of PWM module
00X0ERIOD2EGISTER -ATCH
#OMPARATOR
#LOCK
#LOCK
)NPUT
#ONTROL
04X
BIT5P$OWN#OUNTER
2UN
#OMPARATOR
5P$OWN
#LEAR#ONTROL
-ATCH
0/54X
/UTPUT#ONTROL
%NABLE
3HADOW2EGISTER
5SERREADABLEWRITEABLEREGISTER
7RITE#ONTROL
07X0ULSE7IDTH2EGISTER '!0'2)
Table 39.
PWM unit frequencies and resolutions at 40 MHz CPU clock
Mode 0
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
25ns
156.25 kHz
39.1 kHz
9.77 kHz
2.44Hz
610Hz
CPU
Clock/64
1.6μs
2.44 kHz
610Hz
152.6Hz
38.15Hz
9.54Hz
Mode 1
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
25ns
78.12 kHz
19.53 kHz
4.88 kHz
1.22 kHz
305.2Hz
CPU
Clock/64
1.6μs
1.22 kHz
305.17Hz
76.29Hz
19.07Hz
4.77Hz
Doc ID 11917 Rev 3
67/188
PWM modules
ST10F272B/ST10F272E
Table 40.
68/188
PWM unit frequencies and resolutions at 64 MHz CPU clock
Mode 0
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
15.6ns
250 kHz
62.5 kHz
15.63 kHz
3.91Hz
977Hz
CPU
Clock/64
1.0μs
3.91 kHz
976.6Hz
244.1Hz
61.01Hz
15.26Hz
Mode 1
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
15.6ns
125 kHz
31.25 kHz
7.81 kHz
1.95 kHz
488.3Hz
CPU
Clock/64
1.0μs
1.95 kHz
488.28Hz
122.07Hz
30.52Hz
7.63Hz
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
13
Parallel ports
13.1
Introduction
Parallel ports
The ST10F272 MCU provides up to 111 I/O lines with programmable features. These
capabilities bring very flexible adaptation of this MCU to wide range of applications.
ST10F272 has nine groups of I/O lines gathered as follows:
●
Port 0 is a two time 8-bit port named P0L (Low as less significant byte) and P0H (high
as most significant byte)
●
Port 1 is a two time 8-bit port named P1L and P1H
●
Port 2 is a 16-bit port
●
Port 3 is a 15-bit port (P3.14 line is not implemented)
●
Port 4 is a 8-bit port
●
Port 5 is a 16-bit port input only
●
Port 6, Port 7 and Port 8 are 8-bit ports
These ports may be used as general purpose bidirectional input or output, software
controlled with dedicated registers.
For example, the output drivers of six of the ports (2, 3, 4, 6, 7, 8) can be configured (bitwise) for push-pull or open drain operation using ODPx registers.
The input threshold levels are programmable (TTL/CMOS) for all the ports. The logic level of
a pin is clocked into the input latch once per state time, regardless whether the port is
configured for input or output. The threshold is selected with PICON and XPICON registers
control bits.
A write operation to a port pin configured as an input causes the value to be written into the
port output latch, while a read operation returns the latched state of the pin itself. A readmodify-write operation reads the value of the pin, modifies it, and writes it back to the output
latch.
Writing to a pin configured as an output (DPx.y=‘1’) causes the output latch and the pin to
have the written value, since the output buffer is enabled. Reading this pin returns the value
of the output latch. A read-modify-write operation reads the value of the output latch,
modifies it, and writes it back to the output latch, thus also modifying the level at the pin.
I/O lines support an alternate function which is detailed in the following description of each
port.
13.2
I/O’s special features
13.2.1
Open drain mode
Some of the I/O ports of ST10F272 support the open drain capability. This programmable
feature may be used with an external pull-up resistor, in order to get an AND wired logical
function.
This feature is implemented for ports P2, P3, P4, P6, P7 and P8 (see respective sections),
and is controlled through the respective Open Drain Control Registers ODPx.
Doc ID 11917 Rev 3
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Parallel ports
13.2.2
ST10F272B/ST10F272E
Input threshold control
The standard inputs of the ST10F272 determine the status of input signals according to TTL
levels. In order to accept and recognize noisy signals, CMOS input thresholds can be
selected instead of the standard TTL thresholds for all the pins. These CMOS thresholds
are defined above the TTL thresholds and feature a higher hysteresis to prevent the inputs
from toggling while the respective input signal level is near the thresholds.
The Port Input Control registers PICON and XPICON are used to select these thresholds for
each Byte of the indicated ports, this means the 8-bit ports P0L, P0H, P1L, P1H, P4, P7 and
P8 are controlled by one bit each while ports P2, P3 and P5 are controlled by two bits each.
All options for individual direction and output mode control are available for each pin,
independent of the selected input threshold.
13.3
Alternate port functions
Each port line has one associated programmable alternate input or output function.
●
PORT0 and PORT1 may be used as address and data lines when accessing external
memory. Besides, PORT1 provides also:
–
Input capture lines
–
8 additional analog input channels to the A/D converter
●
Port 2, Port 7 and Port 8 are associated with the capture inputs or compare outputs of
the CAPCOM units and/or with the outputs of the PWM0 module, of the PWM1 module
and of the ASC1.
Port 2 is also used for fast external interrupt inputs and for timer 7 input.
●
Port 3 includes the alternate functions of timers, serial interfaces, the optional bus
control signal BHE and the system clock output (CLKOUT).
●
Port 4 outputs the additional segment address bit A23...A16 in systems where more
than 64 Kbytes of memory are to be access directly. In addition, CAN1, CAN2 and I2C
lines are provided.
●
Port 5 is used as analog input channels of the A/D converter or as timer control signals.
●
Port 6 provides optional bus arbitration signals (BREQ, HLDA, HOLD) and chip select
signals and the SSC1 lines.
If the alternate output function of a pin is to be used, the direction of this pin must be
programmed for output (DPx.y=‘1’), except for some signals that are used directly after reset
and are configured automatically. Otherwise the pin remains in the high-impedance state
and is not effected by the alternate output function. The respective port latch should hold a
‘1’, because its output is ANDed with the alternate output data (except for PWM output
signals).
If the alternate input function of a pin is used, the direction of the pin must be programmed
for input (DPx.y=‘0’) if an external device is driving the pin. The input direction is the default
after reset. If no external device is connected to the pin, however, one can also set the
direction for this pin to output. In this case, the pin reflects the state of the port output latch.
Thus, the alternate input function reads the value stored in the port output latch. This can be
used for testing purposes to allow a software trigger of an alternate input function by writing
to the port output latch.
On most of the port lines, the user software is responsible for setting the proper direction
when using an alternate input or output function of a pin.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Parallel ports
This is done by setting or clearing the direction control bit DPx.y of the pin before enabling
the alternate function.
There are port lines, however, where the direction of the port line is switched automatically.
For instance, in the multiplexed external bus modes of PORT0, the direction must be
switched several times for an instruction fetch in order to output the addresses and to input
the data.
Obviously, this cannot be done through instructions. In these cases, the direction of the port
line is switched automatically by hardware if the alternate function of such a pin is enabled.
To determine the appropriate level of the port output latches check how the alternate data
output is combined with the respective port latch output.
There is one basic structure for all port lines with only an alternate input function. Port lines
with only an alternate output function, however, have different structures due to the way the
direction of the pin is switched and depending on whether the pin is accessible by the user
software or not in the alternate function mode.
All port lines that are not used for these alternate functions may be used as general purpose
I/O lines.
Doc ID 11917 Rev 3
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A/D converter
14
ST10F272B/ST10F272E
A/D converter
A 10-bit A/D converter with 16+8 multiplexed input channels and a sample and hold circuit is
integrated on-chip. An automatic self-calibration adjusts the A/D converter module to
process parameter variations at each reset event. The sample time (for loading the
capacitors) and the conversion time is programmable and can be adjusted to the external
circuitry.
The ST10F272E has 16+8 multiplexed input channels on Port 5 and Port 1. The selection
between Port 5 and Port 1 is made via a bit in a XBus register. Refer to the User Manual for
a detailed description.
A different accuracy is guaranteed (Total Unadjusted Error) on Port 5 and Port 1 analog
channels (with higher restrictions when overload conditions occur); in particular, Port 5
channels are more accurate than the Port 1 ones. Refer to Section 24: Electrical
characteristics.
The A/D converter input bandwidth is limited by the achievable accuracy: supposing a
maximum error of 0.5LSB (2mV) impacting the global TUE (TUE depends also on other
causes), in worst case of temperature and process, the maximum frequency for a sine wave
analog signal is around 7.5 kHz. Of course, to reduce the effect of the input signal variation
on the accuracy down to 0.05LSB, the maximum input frequency of the sine wave shall be
reduced to 800 Hz.
If static signal is applied during sampling phase, series resistance shall not be greater than
20kΩ (this taking into account eventual input leakage). It is suggested to not connect any
capacitance on analog input pins, in order to reduce the effect of charge partitioning (and
consequent voltage drop error) between the external and the internal capacitance: in case
an RC filter is necessary the external capacitance must be greater than 10nF to minimize
the accuracy impact.
Overrun error detection / protection is controlled by the ADDAT register. Either an interrupt
request is generated when the result of a previous conversion has not been read from the
result register at the time the next conversion is complete, or the next conversion is
suspended until the previous result has been read. For applications which require less than
16+8 analog input channels, the remaining channel inputs can be used as digital input port
pins.
The A/D converter of the ST10F272 supports different conversion modes:
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●
Single channel single conversion: The analog level of the selected channel is
sampled once and converted. The result of the conversion is stored in the ADDAT
register.
●
Single channel continuous conversion: The analog level of the selected channel is
repeatedly sampled and converted. The result of the conversion is stored in the ADDAT
register.
●
Auto scan single conversion: The analog level of the selected channels are sampled
once and converted. After each conversion the result is stored in the ADDAT register.
The data can be transferred to the RAM by interrupt software management or using the
powerful Peripheral Event Controller (PEC) data transfer.
●
Auto scan continuous conversion: The analog level of the selected channels are
repeatedly sampled and converted. The result of the conversion is stored in the ADDAT
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
A/D converter
register. The data can be transferred to the RAM by interrupt software management or
using the PEC data transfer.
●
Wait for ADDAT read mode: When using continuous modes, in order to avoid to
overwrite the result of the current conversion by the next one, the ADWR bit of ADCON
control register must be activated. Then, until the ADDAT register is read, the new
result is stored in a temporary buffer and the conversion is on hold.
●
Channel injection mode: When using continuous modes, a selected channel can be
converted in between without changing the current operating mode. The 10-bit data of
the conversion are stored in ADRES field of ADDAT2. The current continuous mode
remains active after the single conversion is completed.
A full calibration sequence is performed after a reset. This full calibration lasts up to 40.630
CPU clock cycles. During this time, the busy flag ADBSY is set to indicate the operation. It
compensates the capacitance mismatch, so the calibration procedure does not need any
update during normal operation.
No conversion can be performed during this time: the bit ADBSY shall be polled to verify
when the calibration is over, and the module is able to start a convertion.
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Serial channels
15
ST10F272B/ST10F272E
Serial channels
Serial communication with other microcontrollers, microprocessors, terminals or external
peripheral components is provided by up to four serial interfaces: two asynchronous /
synchronous serial channels (ASC0 and ASC1) and two high-speed synchronous serial
channel (SSC0 and SSC1). Dedicated Baud rate generators set up all standard Baud rates
without the requirement of oscillator tuning. For transmission, reception and erroneous
reception, separate interrupt vectors are provided for ASC0 and SSC0 serial channel. A
more complex mechanism of interrupt sources multiplexing is implemented for ASC1 and
SSC1 (XBUS mapped).
15.1
Asynchronous / synchronous serial interfaces
The asynchronous / synchronous serial interfaces (ASC0 and ASC1) provides serial
communication between the ST10F272 and other microcontrollers, microprocessors or
external peripherals.
15.2
ASCx in asynchronous mode
In asynchronous mode, 8- or 9-bit data transfer, parity generation and the number of stop
bits can be selected. Parity framing and overrun error detection is provided to increase the
reliability of data transfers. Transmission and reception of data is double-buffered. Fullduplex communication up to 2M Bauds (at 64 MHz of fCPU) is supported in this mode.
Table 41.
ASC asynchronous baud rates by reload value and deviation errors (fCPU = 40 MHz)
S0BRS = ‘0’, fCPU = 40 MHz
Baud rate (Baud)
Deviation error
1 250 000
0.0% / 0.0%
112 000
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S0BRS = ‘1’, fCPU = 40 MHz
Reload value
Reload value
Baud rate (Baud)
Deviation error
0000 / 0000
833 333
0.0% / 0.0%
0000 / 0000
+1.5% / -7.0%
000A / 000B
112 000
+6.3% / -7.0%
0006 / 0007
56 000
+1.5% / -3.0%
0015 / 0016
56 000
+6.3% / -0.8%
000D / 000E
38 400
+1.7% / -1.4%
001F / 0020
38 400
+3.3% / -1.4%
0014 / 0015
19 200
+0.2% / -1.4%
0040 / 0041
19 200
+0.9% / -1.4%
002A / 002B
9 600
+0.2% / -0.6%
0081 / 0082
9 600
+0.9% / -0.2%
0055 / 0056
4 800
+0.2% / -0.2%
0103 / 0104
4 800
+0.4% / -0.2%
00AC / 00AD
2 400
+0.2% / 0.0%
0207 / 0208
2 400
+0.1% / -0.2%
015A / 015B
1 200
0.1% / 0.0%
0410 / 0411
1 200
+0.1% / -0.1%
02B5 / 02B6
600
0.0% / 0.0%
0822 / 0823
600
+0.1% / 0.0%
056B / 056C
300
0.0% / 0.0%
1045 / 1046
300
0.0% / 0.0%
0AD8 / 0AD9
153
0.0% / 0.0%
1FE8 / 1FE9
102
0.0% / 0.0%
1FE8 / 1FE9
(hex)
Doc ID 11917 Rev 3
(hex)
ST10F272B/ST10F272E
Table 42.
Serial channels
ASC asynchronous baud rates by reload value and deviation errors (fCPU = 64 MHz)
S0BRS = ‘0’, fCPU = 64 MHz
S0BRS = ‘1’, fCPU = 64 MHz
Baud rate (baud)
Deviation error
Reload value
(hex)
Baud rate (baud)
Deviation error
Reload value
(hex)
2 000 000
0.0% / 0.0%
0000 / 0000
1 333 333
0.0% / 0.0%
0000 / 0000
112 000
+1.5% / -7.0%
0010 / 0011
112 000
+6.3% / -7.0%
000A / 000B
56 000
+1.5% / -3.0%
0022 / 0023
56 000
+6.3% / -0.8%
0016 / 0017
38 400
+1.7% / -1.4%
0033 / 0034
38 400
+3.3% / -1.4%
0021 / 0022
19 200
+0.2% / -1.4%
0067 / 0068
19 200
+0.9% / -1.4%
0044 / 0045
9 600
+0.2% / -0.6%
00CF / 00D0
9 600
+0.9% / -0.2%
0089 / 008A
4 800
+0.2% / -0.2%
019F / 01A0
4 800
+0.4% / -0.2%
0114 / 0115
2 400
+0.2% / 0.0%
0340 / 0341
2 400
+0.1% / -0.2%
022A / 015B
1 200
0.1% / 0.0%
0681 / 0682
1 200
+0.1% / -0.1%
0456 / 0457
600
0.0% / 0.0%
0D04 / 0D05
600
+0.1% / 0.0%
08AD / 08AE
300
0.0% / 0.0%
1A09 / 1A0A
300
0.0% / 0.0%
115B / 115C
245
0.0% / 0.0%
1FE2 / 1FE3
163
0.0% / 0.0%
1FF2 / 1FF3
Note:
The deviation errors given in the Table 41 and Table 42 are rounded. To avoid deviation
errors use a Baud rate crystal (providing a multiple of the ASC0 sampling frequency).
15.3
ASCx in synchronous mode
In synchronous mode, data is transmitted or received synchronously to a shift clock which is
generated by the ST10F272. Half-duplex communication up to 8M Baud (at 40 MHz of fCPU)
is possible in this mode.
Table 43.
ASC synchronous baud rates by reload value and deviation errors (fCPU = 40 MHz)
S0BRS = ‘0’, fCPU = 40 MHz
S0BRS = ‘1’, fCPU = 40 MHz
Baud rate (baud)
Deviation error
Reload value
(hex)
Baud rate (baud)
Deviation error
Reload value
(hex)
5 000 000
0.0% / 0.0%
0000 / 0000
3 333 333
0.0% / 0.0%
0000 / 0000
112 000
+1.5% / -0.8%
002B / 002C
112 000
+2.6% / -0.8%
001C / 001D
56 000
+0.3% / -0.8%
0058 / 0059
56 000
+0.9% / -0.8%
003A / 003B
38 400
+0.2% / -0.6%
0081 / 0082
38 400
+0.9% / -0.2%
0055 / 0056
19 200
+0.2% / -0.2%
0103 / 0104
19 200
+0.4% / -0.2%
00AC / 00AD
9 600
+0.2% / 0.0%
0207 / 0208
9 600
+0.1% / -0.2%
015A / 015B
4 800
+0.1% / 0.0%
0410 / 0411
4 800
+0.1% / -0.1%
02B5 / 02B6
2 400
0.0% / 0.0%
0822 / 0823
2 400
+0.1% / 0.0%
056B / 056C
1 200
0.0% / 0.0%
1045 / 1046
1 200
0.0% / 0.0%
0AD8 / 0AD9
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Serial channels
Table 43.
ST10F272B/ST10F272E
ASC synchronous baud rates by reload value and deviation errors (fCPU = 40 MHz)
S0BRS = ‘0’, fCPU = 40 MHz
S0BRS = ‘1’, fCPU = 40 MHz
Baud rate (baud)
Deviation error
Reload value
(hex)
Baud rate (baud)
Deviation error
Reload value
(hex)
900
0.0% / 0.0%
15B2 / 15B3
600
0.0% / 0.0%
15B2 / 15B3
612
0.0% / 0.0%
1FE8 / 1FE9
407
0.0% / 0.0%
1FFD / 1FFE
Table 44.
ASC synchronous baud rates by reload value and deviation errors (fCPU = 64 MHz)
S0BRS = ‘0’, fCPU = 64 MHz
S0BRS = ‘1’, fCPU = 64 MHz
Baud rate (baud)
Deviation error
Reload value
(hex)
Baud rate (baud)
Deviation error
Reload value
(hex)
8 000 000
0.0% / 0.0%
0000 / 0000
5 333 333
0.0% / 0.0%
0000 / 0000
112 000
+0.6% / -0.8%
0046 / 0047
112 000
+1.3% / -0.8%
002E / 002F
56 000
+0.6% / -0.1%
008D / 008E
56 000
+0.3% / -0.8%
005E / 005F
38 400
+0.2% / -0.3%
00CF / 00D0
38 400
+0.6% / -0.1%
0089 / 008A
19 200
+0.2% / -0.1%
019F / 01A0
19 200
+0.3% / -0.1%
0114 / 0115
9 600
+0.0% / -0.1%
0340 / 0341
9 600
+0.1% / -0.1%
022A / 022B
4 800
0.0% / 0.0%
0681 / 0682
4 800
0.0% / -0.1%
0456 / 0457
2 400
0.0% / 0.0%
0D04 / 0D05
2 400
0.0% / 0.0%
08AD / 08AE
1 200
0.0% / 0.0%
1A09 / 1A0A
1 200
0.0% / 0.0%
115B / 115C
977
0.0% / 0.0%
1FFB / 1FFC
900
0.0% / 0.0%
1724 / 1725
652
0.0% / 0.0%
1FF2 / 1FF3
Note:
The deviation errors given in the Table 43 and Table 44 are rounded. To avoid deviation
errors use a Baud rate crystal (providing a multiple of the ASC0 sampling frequency)
15.4
High speed synchronous serial interfaces
The High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) provides flexible highspeed serial communication between the ST10F272 and other microcontrollers,
microprocessors or external peripherals.
The SSCx supports full-duplex and half-duplex synchronous communication. The serial
clock signal can be generated by the SSCx itself (master mode) or be received from an
external master (slave mode). Data width, shift direction, clock polarity and phase are
programmable.
This allows communication with SPI-compatible devices. Transmission and reception of data
is double-buffered. A 16-bit Baud rate generator provides the SSCx with a separate serial
clock signal. The serial channel SSCx has its own dedicated 16-bit Baud rate generator with
16-bit reload capability, allowing Baud rate generation independent from the timers.
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ST10F272B/ST10F272E
Serial channels
Table 45 and Table 46 list some possible Baud rates against the required reload values and
the resulting bit times for 40 MHz and 64 MHz CPU clock respectively. The maximum is
anyway limited to 8Mbaud.
Table 45.
Synchronous baud rate and reload values (fCPU = 40 MHz)
Baud rate
Bit time
Reload value
Reserved
---
0000h
Can be used only with fCPU = 32 MHz (or
lower)
---
0001h
6.6M Baud
150ns
0002h
5M Baud
200ns
0003h
2.5M Baud
400ns
0007h
1M Baud
1μs
0013h
100K Baud
10μs
00C7h
10K Baud
100μs
07CFh
1K Baud
1ms
4E1Fh
306 Baud
3.26ms
FF4Eh
Table 46.
Synchronous baud rate and reload values (fCPU = 64 MHz)
Baud rate
Bit time
Reload value
Reserved
---
0000h
Can be used only with fCPU = 32 MHz (or
lower)
---
0001h
Can be used only with fCPU = 48 MHz (or
lower)
---
0002h
8M Baud
125ns
0003h
4M Baud
250ns
0007h
1M Baud
1μs
001Fh
100K Baud
10μs
013Fh
10K Baud
100μs
0C7Fh
1K Baud
1ms
7CFFh
489 Baud
2.04ms
FF9Eh
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I2C interface
16
ST10F272B/ST10F272E
I2C interface
The integrated I2C Bus Module handles the transmission and reception of frames over the
two-line SDA/SCL in accordance with the I2C Bus specification. The I2C Module can
operate in slave mode, in master mode or in multi-master mode. It can receive and transmit
data using 7-bit or 10-bit addressing. Data can be transferred at speeds up to 400 Kbit/s
(both Standard and Fast I2C bus modes are supported).
The module can generate three different types of interrupt:
●
Requests related to bus events, like start or stop events, arbitration lost, etc.
●
Requests related to data transmission
●
Requests related to data reception
These requests are issued to the interrupt controller by three different lines, and identified as
Error, Transmit, and Receive interrupt lines.
When the I2C module is enabled by setting bit XI2CEN in XPERCON register, pins P4.4 and
P4.7 (where SCL and SDA are respectively mapped as alternate functions) are
automatically configured as bidirectional open-drain: the value of the external pull-up
resistor depends on the application. P4, DP4 and ODP4 cannot influence the pin
configuration.
When the I2C cell is disabled (clearing bit XI2CEN), P4.4 and P4.7 pins are standard I/ O
controlled by P4, DP4 and ODP4.
The speed of the I2C interface may be selected between Standard mode (0 to 100 kHz) and
Fast I2C mode (100 to 400 kHz).
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ST10F272B/ST10F272E
17
CAN modules
CAN modules
The two integrated CAN modules (CAN1 and CAN2) are identical and handle the
completely autonomous transmission and reception of CAN frames according to the CAN
specification V2.0 part B (active). It is based on the C-CAN specification.
Each on-chip CAN module can receive and transmit standard frames with 11-bit identifiers
as well as extended frames with 29-bit identifiers.
Because of duplication of the CAN controllers, the following adjustments are to be
considered:
●
Same internal register addresses of both CAN controllers, but with base addresses
differing in address bit A8; separate chip select for each CAN module. Refer to
Section 4: Memory organization.
●
The CAN1 transmit line (CAN1_TxD) is the alternate function of the Port P4.6 pin and
the receive line (CAN1_RxD) is the alternate function of the Port P4.5 pin.
●
The CAN2 transmit line (CAN2_TxD) is the alternate function of the Port P4.7 pin and
the receive line (CAN2_RxD) is the alternate function of the Port P4.4 pin.
●
Interrupt request lines of the CAN1 and CAN2 modules are connected to the XBUS
interrupt lines together with other X-Peripherals sharing the four vectors.
●
The CAN modules must be selected with corresponding CANxEN bit of XPERCON
register before the bit XPEN of SYSCON register is set.
●
The reset default configuration is: CAN1 enabled, CAN2 disabled.
Note:
If one or both CAN modules is used, Port 4 cannot be programmed to output all 8 segment
address lines. Thus, only four segment address lines can be used, reducing the external
memory space to 5 Mbytes (1 Mbyte per CS line).
17.1
Configuration support
It is possible that both CAN controllers are working on the same CAN bus, supporting
together up to 64 message objects. In this configuration, both receive signals and both
transmit signals are linked together when using the same CAN transceiver. This
configuration is especially supported by providing open drain outputs for the CAN1_Txd and
CAN2_TxD signals. The open drain function is controlled with the ODP4 register for port P4:
in this way it is possible to connect together P4.4 with P4.5 (receive lines) and P4.6 with
P4.7 (transmit lines configured to be configured as Open-Drain).
The user is also allowed to map internally both CAN modules on the same pins P4.5 and
P4.6. In this way, P4.4 and P4.7 may be used either as general purpose I/O lines, or used
for I2C interface. This is possible by setting bit CANPAR of XMISC register. To access this
register it is necessary to set bit XMISCEN of XPERCON register and bit XPEN of SYSCON
register.
17.2
CAN bus configurations
Depending on application, CAN bus configuration may be one single bus with a single or
multiple interfaces or a multiple bus with a single or multiple interfaces. The ST10F272 is
able to support these two cases.
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CAN modules
ST10F272B/ST10F272E
Single CAN bus
The single CAN Bus multiple interfaces configuration may be implemented using two CAN
transceivers as shown in Figure 12.
Figure 12. Connection to single CAN bus via separate CAN transceivers
8-)3##!.0!2
#!.
28
48
0 #!.
28
48
0 0 #!.
4RANSCEIVER
0 #!.
4RANSCEIVER
#!.?(
#!.?,
#!.?(
#!.BUS
#!.BUS
#!.?,
'!0'2)
The ST10F272 also supports single CAN Bus multiple (dual) interfaces using the open drain
option of the CANx_TxD output as shown in Figure 13. Thanks to the OR-Wired
Connection, only one transceiver is required. In this case the design of the application must
take in account the wire length and the noise environment.
Figure 13. Connection to single CAN bus via common CAN transceivers
8-)3##!.0!2
#!.
28
48
#!.
28
48
6
K7
0
0 0
0
/$
/$
#!.
4RANSCEIVER
#!.?(
#!.?,
#!.BUS
/$/PEN$RAIN/UTPUT
'!0'2)
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
CAN modules
Multiple CAN bus
The ST10F272 provides two CAN interfaces to support such kind of bus configuration as
shown in Figure 14.
Figure 14. Connection to two different CAN buses (e.g. for gateway application)
8-)3##!.0!2
#!.
28
48
0
#!.
28
48
0 0
#!.
4RANSCEIVER
0
#!.
4RANSCEIVER
#!.?(
#!.?,
#!.?(
#!.BUS
#!.BUS
#!.?,
'!0'2)
Parallel Mode
In addition to previous configurations, a parallel mode is supported. This is shown in
Figure 15.
Figure 15. Connection to one CAN bus with internal Parallel Mode enabled
#!.
28
48
0
8-)3##!.0!2
"OTH#!.ENABLED
#!.
28
48
0 0
0
#!.
4RANSCEIVER
#!.?(
#!.BUS
#!.?,
0AND0WHENNOTUSEDAS#!.FUNCTIONSCANBEUSEDASGENERALPURPOSE)/
WHILETHEYCANNOTBEUSEDASEXTERNALBUSADDRESSLINES
'!0'2)
Doc ID 11917 Rev 3
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Real time clock
18
ST10F272B/ST10F272E
Real time clock
The Real Time Clock is an independent timer, in which the clock is derived directly from the
clock oscillator on XTAL1 (main oscillator) input or XTAL3 input (32 kHz low-power oscillator)
so that it can be kept on running even in Idle or Power down mode (if enabled to). Registers
access is implemented onto the XBUS. This module is designed with the following
characteristics:
●
Generation of the current time and date for the system
●
Cyclic time based interrupt, on Port2 external interrupts every ’RTC basic clock tick’
and after n ’RTC basic clock ticks’ (n is programmable) if enabled
●
58-bit timer for long term measurement
●
Capability to exit the ST10 chip from Power down mode (if PWDCFG of SYSCON set)
after a programmed delay
The real time clock is based on two main blocks of counters. The first block is a prescaler
which generates a basic reference clock (for example a 1 second period). This basic
reference clock is coming out of a 20-bit DIVIDER. This 20-bit counter is driven by an input
clock derived from the on-chip CPU clock, pre-divided by a 1/64 fixed counter. This 20-bit
counter is loaded at each basic reference clock period with the value of the 20-bit
PRESCALER register. The value of the 20-bit RTCP register determines the period of the
basic reference clock.
A timed interrupt request (RTCSI) may be sent on each basic reference clock period. The
second block of the RTC is a 32-bit counter that may be initialized with the current system
time. This counter is driven with the basic reference clock signal. In order to provide an
alarm function the contents of the counter is compared with a 32-bit alarm register. The
alarm register may be loaded with a reference date. An alarm interrupt request (RTCAI),
may be generated when the value of the counter matches the alarm register.
The timed RTCSI and the alarm RTCAI interrupt requests can trigger a fast external
interrupt via EXISEL register of port 2 and wake-up the ST10 chip when running power
down mode. Using the RTCOFF bit of RTCCON register, the user may switch off the clock
oscillator when entering the power down mode.
The last function implemented in the RTC is to switch off the main on-chip oscillator and the
32 kHz on chip oscillator if the ST10 enters the Power Down mode, so that the chip can be
fully switched off (if RTC is disabled).
At power on, and after Reset phase, if the presence of a 32 kHz oscillation on XTAL3 /
XTAL4 pins is detected, then the RTC counter is driven by this low frequency reference
clock: when Power Down mode is entered, the RTC can either be stopped or left running,
and in both the cases the main oscillator is turned off, reducing the power consumption of
the device to the minimum required to keep on running the RTC counter and relative
reference oscillator. This is valid also if Stand-by mode is entered (switching off the main
supply VDD), since both the RTC and the low power oscillator (32 kHz) are biased by the
VSTBY. Vice versa, when at power on and after Reset, the 32 kHz is not present, the main
oscillator drives the RTC counter, and since it is powered by the main power supply, it
cannot be maintained running in Stand-by mode, while in Power Down mode the main
oscillator is maintained running to provide the reference to the RTC module (if not disabled).
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ST10F272B/ST10F272E
19
Watchdog timer
Watchdog timer
The Watchdog Timer is a fail-safe mechanism which prevents the microcontroller from
malfunctioning for long periods of time.
The Watchdog Timer is always enabled after a reset of the chip and can only be disabled in
the time interval until the EINIT (end of initialization) instruction has been executed.
Therefore, the chip start-up procedure is always monitored. The software must be designed
to service the watchdog timer before it overflows. If, due to hardware or software related
failures, the software fails to do so, the watchdog timer overflows and generates an internal
hardware reset. It pulls the RSTOUT pin low in order to allow external hardware components
to be reset.
Each of the different reset sources is indicated in the WDTCON register:
●
Watchdog Timer Reset in case of an overflow
●
Software Reset in case of execution of the SRST instruction
●
Short, Long and Power-On Reset in case of hardware reset (and depending of reset
pulse duration and RPD pin configuration)
The indicated bits are cleared with the EINIT instruction. The source of the reset can be
identified during the initialization phase.
The Watchdog Timer is 16-bit, clocked with the system clock divided by 2 or 128. The high
Byte of the watchdog timer register can be set to a pre-specified reload value (stored in
WDTREL).
Each time it is serviced by the application software, the high byte of the watchdog timer is
reloaded. For security, rewrite WDTCON each time before the watchdog timer is serviced
The Table 47 and Table 48 show the watchdog time range for 40 MHz and 64 MHz CPU
clock respectively.
Table 47.
WDTREL reload value (fCPU = 40 MHz)
Prescaler for fCPU = 40 MHz
Reload value in WDTREL
Table 48.
2 (WDTIN = ‘0’)
128 (WDTIN = ‘1’)
FFh
12.8μs
819.2μs
00h
3.277ms
209.7ms
WDTREL reload value (fCPU = 64 MHz)
Prescaler for fCPU = 64 MHz
Reload value in WDTREL
2 (WDTIN = ‘0’)
128 (WDTIN = ‘1’)
FFh
8μs
512μs
00h
2.048ms
131.1ms
Doc ID 11917 Rev 3
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System reset
20
ST10F272B/ST10F272E
System reset
System reset initializes the MCU in a predefined state. There are six ways to activate a reset
state. The system start-up configuration is different for each case as shown in Table 49.
Table 49.
Reset event definition
Reset source
Power-on reset
Flag
RPD
status
PONR
Low
Power-on
Low
tRSTIN > 1)
High
tRSTIN > (1032 + 12) TCL + max(4 TCL,
500ns)
tRSTIN > max(4 TCL, 500ns)
tRSTIN ≤ (1032 + 12) TCL + max(4 TCL,
500ns)
Asynchronous Hardware reset
Synchronous Long Hardware
reset
Synchronous Short Hardware
reset
SHWR
High
Watchdog Timer reset
WDTR
3)
WDT overflow
SWR
3)
SRST instruction execution
Software reset
20.1
LHWR
Conditions
1)
RSTIN pulse should be longer than 500ns (Filter) and than settling time for configuration of Port0.
2)
See next Section 20.1 for more details on minimum reset pulse duration.
3)
The RPD status has no influence unless Bidirectional Reset is activated (bit BDRSTEN in SYSCON): RPD
low inhibits the Bidirectional reset on SW and WDT reset events, that is RSTIN is not activated (refer to
Section 20.4, Section 20.5 and Section 20.6).
Input filter
On RSTIN input pin an on-chip RC filter is implemented. It is sized to filter all the spikes
shorter than 50ns. On the other side, a valid pulse shall be longer than 500ns to grant that
ST10 recognizes a reset command. In between 50ns and 500ns a pulse can either be
filtered or recognized as valid, depending on the operating conditions and process
variations.
For this reason all minimum durations mentioned in this Chapter for the different kind of
reset events shall be carefully evaluated taking into account of the above requirements.
In particular, for Short Hardware Reset, where only 4 TCL is specified as minimum input
reset pulse duration, the operating frequency is a key factor. Examples:
84/188
●
For a CPU clock of 64 MHz, 4 TCL is 31.25ns, so it would be filtered. In this case the
minimum becomes the one imposed by the filter (that is 500ns).
●
For a CPU clock of 4 MHz, 4 TCL is 500ns. In this case the minimum from the formula
is coherent with the limit imposed by the filter.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
20.2
System reset
Asynchronous reset
An asynchronous reset is triggered when RSTIN pin is pulled low while RPD pin is at low
level. Then the ST10F272 is immediately (after the input filter delay) forced in reset default
state. It pulls low RSTOUT pin, it cancels pending internal hold states if any, it aborts all
internal/external bus cycles, it switches buses (data, address and control signals) and I/O
pin drivers to high-impedance, it pulls high Port0 pins.
Note:
If an asynchronous reset occurs during a read or write phase in internal memories, the
content of the memory itself could be corrupted: to avoid this, synchronous reset usage is
strongly recommended.
Power-on reset
The asynchronous reset must be used during the power-on of the device. Depending
on crystal or resonator frequency, the on-chip oscillator needs about 1ms to 10ms to
stabilize (Refer to Electrical Characteristics Section), with an already stable VDD. The logic
of the ST10F272 does not need a stabilized clock signal to detect an asynchronous reset,
so it is suitable for power-on conditions. To ensure a proper reset sequence, the RSTIN pin
and the RPD pin must be held at low level until the device clock signal is stabilized and the
system configuration value on Port0 is settled.
At Power-on it is important to respect some additional constraints introduced by the start-up
phase of the different embedded modules.
In particular the on-chip voltage regulator needs at least 1ms to stabilize the internal 1.8V
for the core logic: this time is computed from when the external reference (VDD) becomes
stable (inside specification range, that is at least 4.5V). This is a constraint for the
application hardware (external voltage regulator): the RSTIN pin assertion shall be extended
to guarantee the voltage regulator stabilization.
A second constraint is imposed by the embedded FLASH. When booting from internal
memory, starting from RSTIN releasing, it needs a maximum of 1ms for its initialization:
before that, the internal reset (RST signal) is not released, so the CPU does not start code
execution in internal memory.
Note:
This is not true if external memory is used (pin EA held low during reset phase). In this case,
once RSTIN pin is released, and after few CPU clock (Filter delay plus 3...8 TCL), the
internal reset signal RST is released as well, so the code execution can start immediately
after. Obviously, an eventual access to the data in internal Flash is forbidden before its
initialization phase is completed: an eventual access during starting phase will return FFFFh
(just at the beginning), while later 009Bh (an illegal opcode trap can be generated).
At Power-on, the RSTIN pin shall be tied low for a minimum time that includes also the startup time of the main oscillator (tSTUP = 1ms for resonator, 10ms for crystal) and PLL
synchronization time (tPSUP = 200μs): this means that if the internal FLASH is used, the
RSTIN pin could be released before the main oscillator and PLL are stable to recover some
time in the start-up phase (FLASH initialization only needs stable V18, but does not need
stable system clock since an internal dedicated oscillator is used).
Doc ID 11917 Rev 3
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System reset
ST10F272B/ST10F272E
Warning:
It is recommended to provide the external hardware with a
current limitation circuitry. This is necessary to avoid
permanent damages of the device during the power-on
transient, when the capacitance on V18 pin is charged. For
the on-chip voltage regulator functionality 10nF are
sufficient: anyway, a maximum of 100nF on V18 pin should
not generate problems of over-current (higher value is
allowed if current is limited by the external hardware).
External current limitation is anyway recommended also to
avoid risks of damage in case of temporary short between
V18 and ground: the internal 1.8V drivers are sized to drive
currents of several tens of Ampere, so the current shall be
limited by the external hardware. The limit of current is
imposed by power dissipation considerations (Refer to
Electrical Characteristics Section).
In Figure 16 and Figure 17 Asynchronous Power-on timing diagrams are reported,
respectively with boot from internal or external memory, highlighting the reset phase
extension introduced by the embedded FLASH module when selected.
Note:
86/188
Never power the device without keeping RSTIN pin grounded: the device could enter in
unpredictable states, risking also permanent damages.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Figure 16. Asynchronous power-on RESET (EA = 1)
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Doc ID 11917 Rev 3
87/188
System reset
ST10F272B/ST10F272E
Figure 17. Asynchronous power-on RESET (EA = 0)
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1. 3 to 8 TLC depending on clock source selection.
Hardware reset
The asynchronous reset must be used to recover from catastrophic situations of the
application. It may be triggered by the hardware of the application. Internal hardware logic
and application circuitry are described in Section 20.7: Reset circuitry and Figure 29,
Figure 30 and Figure 31. It occurs when RSTIN is low and RPD is detected (or becomes)
low as well.
88/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Figure 18. Asynchronous hardware RESET (EA = 1)
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2. Longer than 500ns to take into account of Input Filter on RSTIN pin.
Doc ID 11917 Rev 3
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System reset
ST10F272B/ST10F272E
Figure 19. Asynchronous hardware RESET (EA = 0)
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1. Longer than Port0 settling time + PLL synchronization (if needed, that is P0(15:13) changed)
Longer than 500ns to take into account of Input Filter on RSTIN pin
2. 3 to 8 TCL depending on clock source selection.
Exit from asynchronous reset state
When the RSTIN pin is pulled high, the device restarts: as already mentioned, if internal
FLASH is used, the restarting occurs after the embedded FLASH initialization routine is
completed. The system configuration is latched from Port0: ALE, RD and WR/WRL pins are
driven to their inactive level. The ST10F272 starts program execution from memory location
00'0000h in code segment 0. This starting location will typically point to the general
initialization routine. Timing of asynchronous Hardware Reset sequence are summarized in
Figure 18 and Figure 19.
20.3
Synchronous reset (warm reset)
A synchronous reset is triggered when RSTIN pin is pulled low while RPD pin is at high
level. In order to properly activate the internal reset logic of the device, the RSTIN pin must
be held low, at least, during 4 TCL (2 periods of CPU clock): refer also to Section 20.1 for
details on minimum reset pulse duration. The I/O pins are set to high impedance and
RSTOUT pin is driven low. After RSTIN level is detected, a short duration of a maximum of
12 TCL (six periods of CPU clock) elapses, during which pending internal hold states are
cancelled and the current internal access cycle if any is completed. External bus cycle is
aborted. The internal pull-down of RSTIN pin is activated if bit BDRSTEN of SYSCON
register was previously set by software. Note that this bit is always cleared on power-on or
after a reset sequence.
90/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Short and long synchronous reset
Once the first maximum 16 TCL are elapsed (4+12TCL), the internal reset sequence starts.
It is 1024 TCL cycles long: at the end of it, and after other 8TCL the level of RSTIN is
sampled (after the filter, see RSTF in the drawings): if it is already at high level, only Short
Reset is flagged (Refer to Section 19 for details on reset flags); if it is recognized still low, the
Long reset is flagged as well. The major difference between Long and Short reset is that
during the Long reset, also P0(15:13) become transparent, so it is possible to change the
clock options.
Warning:
In case of a short pulse on RSTIN pin, and when Bidirectional
reset is enabled, the RSTIN pin is held low by the internal
circuitry. At the end of the 1024 TCL cycles, the RTSIN pin is
released, but due to the presence of the input analog filter the
internal input reset signal (RSTF in the drawings) is released
later (from 50 to 500ns). This delay is in parallel with the
additional 8 TCL, at the end of which the internal input reset
line (RSTF) is sampled, to decide if the reset event is Short or
Long. In particular:
●
If 8 TCL > 500ns (FCPU < 8 MHz), the reset event is always recognized as Short
●
If 8 TCL < 500ns (FCPU > 8 MHz), the reset event could be recognized either as Short
or Long, depending on the real filter delay (between 50 and 500ns) and the CPU
frequency (RSTF sampled High means Short reset, RSTF sampled Low means Long
reset). Note that in case a Long Reset is recognized, once the 8 TCL are elapsed, the
P0 (15:13) pins becomes transparent, so the system clock can be re-configured. The
port returns not transparent 3-4TCL after the internal RSTF signal becomes high.
The same behavior just described, occurs also when unidirectional reset is selected and
RSTIN pin is held low till the end of the internal sequence (exactly 1024TCL + max 16 TCL)
and released exactly at that time.
Note:
When running with CPU frequency lower than 40 MHz, the minimum valid reset pulse to be
recognized by the CPU (4 TCL) could be longer than the minimum analog filter delay (50ns);
so it might happen that a short reset pulse is not filtered by the analog input filter, but on the
other hand it is not long enough to trigger a CPU reset (shorter than 4 TCL): this would
generate a FLASH reset but not a system reset. In this condition, the FLASH answers
always with FFFFh, which leads to an illegal opcode and consequently a trap event is
generated.
Exit from synchronous reset state
The reset sequence is extended until RSTIN level becomes high. Besides, it is internally
prolonged by the FLASH initialization when EA=1 (internal memory selected). Then, the
code execution restarts. The system configuration is latched from Port0, and ALE, RD and
WR/WRL pins are driven to their inactive level. The ST10F272 starts program execution
from memory location 00'0000h in code segment 0. This starting location will typically point
to the general initialization routine. Timing of synchronous reset sequence are summarized
in Figure 20 and Figure 21 where a Short Reset event is shown, with particular highlighting
on the fact that it can degenerate into Long Reset: the two figures show the behavior when
booting from internal or external memory respectively. Figure 22 and Figure 23 reports the
Doc ID 11917 Rev 3
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System reset
ST10F272B/ST10F272E
timing of a typical synchronous Long Reset, again when booting from internal or external
memory.
Synchronous reset and RPD pin
Whenever the RSTIN pin is pulled low (by external hardware or as a consequence of a
Bidirectional reset), the RPD internal weak pull-down is activated. The external capacitance
(if any) on RPD pin is slowly discharged through the internal weak pull-down. If the voltage
level on RPD pin reaches the input low threshold (around 2.5V), the reset event becomes
immediately asynchronous. In case of hardware reset (short or long) the situation goes
immediately to the one illustrated in Figure 18. There is no effect if RPD comes again above
the input threshold: the asynchronous reset is completed coherently. To grant the normal
completion of a synchronous reset, the value of the capacitance shall be big enough to
maintain the voltage on RPD pin sufficient high along the duration of the internal reset
sequence.
For a Software or Watchdog reset events, an active synchronous reset is completed
regardless of the RPD status.
It is important to highlight that the signal that makes RPD status transparent under reset is
the internal RSTF (after the noise filter).
92/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Figure 20. Synchronous short / long hardware RESET (EA = 1)
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1. RSTIN assertion can be released there. Refer also to Section 21.1 for details on minimum pulse duration.
2. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5 V for
5 V operation), the asynchronous reset is then immediately entered.
3. 3. RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit
BDRSTEN is cleared after reset.
4. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by the internal filter (refer to Section 21.1).
Doc ID 11917 Rev 3
93/188
System reset
ST10F272B/ST10F272E
Figure 21. Synchronous short / long hardware RESET (EA = 0)
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1.
RSTIN assertion can be released there. Refer also to Section 21.1 for details on minimum pulse duration.
2.
If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5 V for 5 V operation),
the asynchronous reset is then immediately entered.
3.
3 to 8 TCL depending on clock source selection.
4.
RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit BDRSTEN is
cleared after reset.
5. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked by the internal
filter (refer to Section 21.1).
94/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Figure 22. Synchronous long hardware RESET (EA = 1)
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1. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation),the asynchronous reset is then immediately entered. Even if RPD returns above the
threshold, the reset is defnitively taken as asynchronous.
2. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by the nternal filter (refer to Section 21.1).
Doc ID 11917 Rev 3
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System reset
ST10F272B/ST10F272E
Figure 23. Synchronous long hardware RESET (EA = 0)
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1. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation), the asynchronous reset is then immediately entered.
2. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by the internal filter (refer to Section 21.1).
3. 3 to 8 TCL depending on clock source selection.
20.4
Software reset
A software reset sequence can be triggered at any time by the protected SRST (software
reset) instruction. This instruction can be deliberately executed within a program, e.g. to
leave bootstrap loader mode, or on a hardware trap that reveals system failure.
On execution of the SRST instruction, the internal reset sequence is started. The
microcontroller behavior is the same as for a synchronous short reset, except that only bits
P0.12...P0.8 are latched at the end of the reset sequence, while previously latched, bits
P0.7...P0.2 are cleared (that is written at ‘1’).
A Software reset is always taken as synchronous: there is no influence on Software Reset
behavior with RPD status. In case Bidirectional Reset is selected, a Software Reset event
pulls RSTIN pin low: this occurs only if RPD is high; if RPD is low, RSTIN pin is not pulled
low even though Bidirectional Reset is selected.
Refer to Figure 24 and Figure 25 for unidirectional SW reset timing, and to Figure 26,
Figure 27 and Figure 28 for bidirectional.
96/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
20.5
System reset
Watchdog timer reset
When the watchdog timer is not disabled during the initialization, or serviced regularly
during program execution, it overflows and trigger the reset sequence.
Unlike hardware and software resets, the watchdog reset completes a running external bus
cycle if this bus cycle either does not use READY, or if READY is sampled active (low) after
the programmed wait states.
When READY is sampled inactive (high) after the programmed wait states the running
external bus cycle is aborted. Then the internal reset sequence is started.
Bit P0.12...P0.8 are latched at the end of the reset sequence and bit P0.7...P0.2 are cleared
(that is written at ‘1’).
A Watchdog reset is always taken as synchronous: there is no influence on Watchdog Reset
behavior with RPD status. In case Bidirectional Reset is selected, a Watchdog Reset event
pulls RSTIN pin low: this occurs only if RPD is high; if RPD is low, RSTIN pin is not pulled
low even though Bidirectional Reset is selected.
Refer to Figure 24 and Figure 25 for unidirectional SW reset timing, and to Figure 26,
Figure 27 and Figure 28 for bidirectional.
Figure 24. SW / WDT unidirectional RESET (EA = 1)
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System reset
ST10F272B/ST10F272E
Figure 25. SW / WDT unidirectional RESET (EA = 0)
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20.6
Bidirectional reset
As shown in the previous sections, the RSTOUT pin is driven active (low level) at the
beginning of any reset sequence (synchronous/asynchronous hardware, software and
watchdog timer resets). RSTOUT pin stays active low beyond the end of the initialization
routine, until the protected EINIT instruction (End of Initialization) is completed.
The Bidirectional Reset function is useful when external devices require a reset signal but
cannot be connected to RSTOUT pin, because RSTOUT signal lasts during initialization. It
is, for instance, the case of external memory running initialization routine before the
execution of EINIT instruction.
Bidirectional reset function is enabled by setting bit 3 (BDRSTEN) in SYSCON register. It
only can be enabled during the initialization routine, before EINIT instruction is completed.
When enabled, the open drain of the RSTIN pin is activated, pulling down the reset signal,
for the duration of the internal reset sequence (synchronous/asynchronous hardware,
synchronous software and synchronous watchdog timer resets). At the end of the internal
reset sequence the pull down is released and:
98/188
●
After a Short Synchronous Bidirectional Hardware Reset, if RSTF is sampled low 8
TCL periods after the internal reset sequence completion (refer to Figure 20 and
Figure 21), the Short Reset becomes a Long Reset. On the contrary, if RSTF is
sampled high the device simply exits reset state.
●
After a Software or Watchdog Bidirectional Reset, the device exits from reset. If RSTF
remains still low for at least 4 TCL periods (minimum time to recognize a Short
Hardware reset) after the reset exiting (refer to Figure 26 and Figure 27), the Software
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
or Watchdog Reset become a Short Hardware Reset. On the contrary, if RSTF remains
low for less than 4 TCL, the device simply exits reset state.
The Bidirectional reset is not effective in case RPD is held low, when a Software or
Watchdog reset event occurs. On the contrary, if a Software or Watchdog Bidirectional reset
event is active and RPD becomes low, the RSTIN pin is immediately released, while the
internal reset sequence is completed regardless of RPD status change (1024 TCL).
Note:
The bidirectional reset function is disabled by any reset sequence (bit BDRSTEN of
SYSCON is cleared). To be activated again it must be enabled during the initialization
routine.
WDTCON flags
Similarly to what already highlighted in the previous section when discussing about Short
reset and the degeneration into Long reset, similar situations may occur when Bidirectional
reset is enabled. The presence of the internal filter on RSTIN pin introduces a delay: when
RSTIN is released, the internal signal after the filter (see RSTF in the drawings) is delayed,
so it remains still active (low) for a while. It means that depending on the internal clock
speed, a short reset may be recognized as a long reset: the WDTCON flags are set
accordingly.
Besides, when either Software or Watchdog bidirectional reset events occur, again when the
RSTIN pin is released (at the end of the internal reset sequence), the RSTF internal signal
(after the filter) remains low for a while, and depending on the clock frequency it is
recognized high or low: 8TCL after the completion of the internal sequence, the level of
RSTF signal is sampled, and if recognized still low a Hardware reset sequence starts, and
WDTCON will flag this last event, masking the previous one (Software or Watchdog reset).
Typically, a Short Hardware reset is recognized, unless the RSTIN pin (and consequently
internal signal RSTF) is sufficiently held low by the external hardware to inject a Long
Hardware reset. After this occurrence, the initialization routine is not able to recognize a
Software or Watchdog bidirectional reset event, since a different source is flagged inside
WDTCON register. This phenomenon does not occur when internal FLASH is selected
during reset (EA = 1), since the initialization of the FLASH itself extend the internal reset
duration well beyond the filter delay.
Figure 26, Figure 27 and Figure 28 summarize the timing for Software and Watchdog Timer
Bidirectional reset events: in particular Figure 28 shows the degeneration into Hardware
reset.
Doc ID 11917 Rev 3
99/188
System reset
ST10F272B/ST10F272E
Figure 26. SW / WDT bidirectional RESET (EA=1)
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100/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
Figure 27. SW / WDT bidirectional RESET (EA = 0)
567,1
tNS
dNS
tNS
dNS
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Doc ID 11917 Rev 3
101/188
System reset
ST10F272B/ST10F272E
Figure 28. SW / WDT bidirectional RESET (EA=0) followed by a HW RESET
567,1
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dNS
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20.7
Reset circuitry
Internal reset circuitry is described in Figure 31. The RSTIN pin provides an internal pull-up
resistor of 50kΩ to 250kΩ (The minimum reset time must be calculated using the lowest
value).
It also provides a programmable (BDRSTEN bit of SYSCON register) pull-down to output
internal reset state signal (synchronous reset, watchdog timer reset or software reset).
This bidirectional reset function is useful in applications where external devices require a
reset signal but cannot be connected to RSTOUT pin.
This is the case of an external memory running codes before EINIT (end of initialization)
instruction is executed. RSTOUT pin is pulled high only when EINIT is executed.
The RPD pin provides an internal weak pull-down resistor which discharges external
capacitor at a typical rate of 200μA. If bit PWDCFG of SYSCON register is set, an internal
pull-up resistor is activated at the end of the reset sequence. This pull-up will charge any
capacitor connected on RPD pin.
The simplest way to reset the ST10F272 is to insert a capacitor C1 between RSTIN pin and
VSS, and a capacitor between RPD pin and VSS (C0) with a pull-up resistor R0 between
RPD pin and VDD. The input RSTIN provides an internal pull-up device equalling a resistor of
50kΩ to 250kΩ (the minimum reset time must be determined by the lowest value). Select C1
that produce a sufficient discharge time to permit the internal or external oscillator and / or
internal PLL and the on-chip voltage regulator to stabilize.
102/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
System reset
To ensure correct power-up reset with controlled supply current consumption, specially if
clock signal requires a long period of time to stabilize, an asynchronous hardware reset is
required during power-up. For this reason, it is recommended to connect the external R0-C0
circuit shown in Figure 29 to the RPD pin. On power-up, the logical low level on RPD pin
forces an asynchronous hardware reset when RSTIN is asserted low. The external pull-up
R0 will then charge the capacitor C0. Note that an internal pull-down device on RPD pin is
turned on when RSTIN pin is low, and causes the external capacitor (C0) to begin
discharging at a typical rate of 100-200μA. With this mechanism, after power-up reset, short
low pulses applied on RSTIN produce synchronous hardware reset. If RSTIN is asserted
longer than the time needed for C0 to be discharged by the internal pull-down device, then
the device is forced in an asynchronous reset. This mechanism insures recovery from very
catastrophic failure.
Figure 29. Minimum external reset circuitry
234/54
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The minimum reset circuit of Figure 29 is not adequate when the RSTIN pin is driven from
the ST10F272 itself during software or watchdog triggered resets, because of the capacitor
C1 that will keep the voltage on RSTIN pin above VIL after the end of the internal reset
sequence, and thus will trigger an asynchronous reset sequence.
Figure 30 shows an example of a reset circuit. In this example, R1-C1 external circuit is only
used to generate power-up or manual reset, and R0-C0 circuit on RPD is used for power-up
reset and to exit from Power Down mode. Diode D1 creates a wired-OR gate connection to
the reset pin and may be replaced by open-collector Schmitt trigger buffer. Diode D2
provides a faster cycle time for repetitive power-on resets.
R2 is an optional pull-up for faster recovery and correct biasing of TTL Open Collector
drivers.
Doc ID 11917 Rev 3
103/188
System reset
ST10F272B/ST10F272E
Figure 30. System reset circuit
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Figure 31. Internal (simplified) reset circuitry
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104/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Reset application examples
Next two timing diagrams (Figure 32 and Figure 33) provides additional examples of
bidirectional internal reset events (Software and Watchdog) including in particular the
external capacitances charge and discharge transients (refer also to Figure 30 for the
external circuit scheme).
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H
Figure 32. Example of software or watchdog bidirectional reset (EA = 1)
4#,US
20.8
System reset
'!0'2)
Doc ID 11917 Rev 3
105/188
106/188
6),
6),
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Doc ID 11917 Rev 3
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System reset
ST10F272B/ST10F272E
Figure 33. Example of software or watchdog bidirectional reset (EA = 0)
'!0'2)
ST10F272B/ST10F272E
20.9
System reset
Reset summary
A summary of the different reset events is reported in Table 50.
Short Hardware
Reset
(Synchronous) (1)
min
max
LHWR
SHWR
SWR
WDTR
WDTCON Flags
-
1
1
1
1
0
-
1
1
1
1
0
0
0
N Asynch.
1 ms (VREG)
1.2 ms
(Reson. + PLL)
10.2 ms
(Crystal + PLL)
0
1
N Asynch.
1ms (VREG)
1
x
x
FORBIDDEN
x
x
Y
NOT APPLICABLE
0
0
N Asynch.
500ns
-
0
1
1
1
0
0
1
N Asynch.
500ns
-
0
1
1
1
0
0
0
Y
Asynch.
500ns
-
0
1
1
1
0
0
1
Y
Asynch.
500ns
-
0
1
1
1
0
1
0
N Synch.
max (4 TCL, 500ns)
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
1
1
N Synch.
max (4 TCL, 500ns)
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
max (4 TCL, 500ns)
1
0
Y
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
0
0
1
1
0
Power-on Reset
Hardware Reset
(Asynchronous)
RSTIN
PONR
Synch.
Asynch.
Bidir
Event
EA
Reset event
RPD
Table 50.
Synch.
Activated by internal logic for 1024 TCL
max (4 TCL, 500ns)
1
1
Y
Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
Activated by internal logic for 1024 TCL
Long Hardware
Reset
(Synchronous)
1
0
N Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
0
1
1
1
0
1
1
N Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
0
1
1
1
0
1032 + 12 TCL +
max(4 TCL, 500ns)
0
1
1
1
0
0
1
1
1
0
1
0
Y
Synch.
Activated by internal logic only for 1024 TCL
1
1
Y
Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
Activated by internal logic only for 1024 TCL
Doc ID 11917 Rev 3
107/188
System reset
Reset event (continued)
Synch.
Asynch.
SHWR
SWR
WDTR
Bidir
LHWR
Watchdog Reset (2)
PONR
Software Reset (2)
WDTCON Flags
EA
Event
RSTIN
RPD
Table 50.
ST10F272B/ST10F272E
x
0
N Synch.
Not activated
0
0
0
1
0
x
0
N Synch.
Not activated
0
0
0
1
0
0
1
Y
Synch.
Not activated
0
0
0
1
0
1
1
Y
Synch.
Activated by internal logic for 1024 TCL
0
0
0
1
0
x
0
N Synch.
Not activated
0
0
0
1
1
x
0
N Synch.
Not activated
0
0
0
1
1
0
1
Y
Synch.
Not activated
0
0
0
1
1
1
1
Y
Synch.
Activated by internal logic for 1024 TCL
0
0
0
1
1
min
max
1. It can degenerate into a Long Hardware Reset and consequently differently flagged (see Section 20.3 for details).
2. When Bidirectional is active (and with RPD=0), it can be followed by a Short Hardware Reset and consequently differently
flagged (see Section 20.6 for details).
The start-up configurations and some system features are selected on reset sequences as
described in Table 51 and Figure 34.
Table 51 describes what is the system configuration latched on PORT0 in the six different
reset modes. Figure 34 summarizes the state of bits of PORT0 latched in RP0H, SYSCON,
BUSCON0 registers.
Table 51.
PORT0 latched configuration for the different reset events
Reserved
BSL
Reserved
Reserved
Adapt Mode
Emu Mode
P0H.5
P0H.4
P0H.3
P0H.2
P0H.1
P0H.0
P0L.7
P0L.6
P0L.5
P0L.4
P0L.3
P0L.2
P0L.1
P0L.0
Software Reset
-
-
-
X
X
X
X
X
X
X
-
-
-
-
-
-
Watchdog Reset
-
-
-
X
X
X
X
X
X
X
-
-
-
-
-
-
Synchronous Short Hardware Reset
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
Synchronous Long Hardware Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Asynchronous Hardware Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Asynchronous Power-On Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Sample event
108/188
Doc ID 11917 Rev 3
Bus Type
X: Pin is sampled
-: Pin is not sampled
WR config.
P0H.6
Chip Selects
P0H.7
Clock Options
Segm. Addr. Lines
PORT0
ST10F272B/ST10F272E
System reset
Figure 34. PORT0 bits latched into the different registers after reset
PORT0
H.7
H.6
H.5
H.4
CLKCFG
H.3
H.2
H.1
H.0
SALSEL
CSSEL
WRC
CLKCFG
SALSEL
CSSEL
WRC
Clock
Generator
Port 4
Logic
Port 6
Logic
L.7
L.6
L.5
BUSTYP
L.4
L.3
BSL
L.2
Res.
L.1
L.0
ADP
EMU
RP0H
Bootstrap Loader
Internal Control Logic
2
EA / VSTBY
P0L.7
P0L.7
SYSCON
ROMEN BYTDIS
10
9
8
BUSCON0
BUS ALE
ACT0 CTL0
WRCFG
7
10
Doc ID 11917 Rev 3
9
BTYP
7
6
109/188
Power reduction modes
21
ST10F272B/ST10F272E
Power reduction modes
Three different power reduction modes with different levels of power reduction have been
implemented in the ST10F272. In Idle mode only CPU is stopped, while peripheral still
operate. In Power Down mode both CPU and peripherals are stopped. In Stand-by mode
the main power supply (VDD) can be turned off while a portion of the internal RAM remains
powered via VSTBY dedicated power pin.
Idle and Power Down modes are software activated by a protected instruction and are
terminated in different ways as described in the following sections.
Stand-by mode is entered simply removing VDD, holding the MCU under reset state.
Note:
All external bus actions are completed before Idle or Power Down mode is entered.
However, Idle or Power Down mode is not entered if READY is enabled, but has not been
activated (driven low for negative polarity, or driven high for positive polarity) during the last
bus access.
21.1
Idle mode
Idle mode is entered by running IDLE protected instruction. The CPU operation is stopped
and the peripherals still run.
Idle mode is terminate by any interrupt request. Whatever the interrupt is serviced or not,
the instruction following the IDLE instruction will be executed after return from interrupt
(RETI) instruction, then the CPU resumes the normal program.
21.2
Power down mode
Power Down mode starts by running PWRDN protected instruction. Internal clock is
stopped, all MCU parts are on hold including the watchdog timer. The only exception could
be the Real Time Clock if opportunely programmed and one of the two oscillator circuits as
a consequence (either the main or the 32 kHz on-chip oscillator).
When Real Time Clock module is used, when the device is in Power Down mode a
reference clock is needed. In this case, two possible configurations may be selected by the
user application according to the desired level of power reduction:
●
A 32 kHz crystal is connected to the on-chip low-power oscillator (pins XTAL3 / XTAL4)
and running. In this case the main oscillator is stopped when Power Down mode is
entered, while the Real Time Clock continue counting using 32 kHz clock signal as
reference. The presence of a running low-power oscillator is detected after the Poweron: this clock is immediately assumed (if present, or as soon as it is detected) as
reference for the Real Time Clock counter and it will be maintained forever (unless
specifically disabled via software).
●
Only the main oscillator is running (XTAL1 / XTAL2 pins). In this case the main
oscillator is not stopped when Power Down is entered, and the Real Time Clock
continue counting using the main oscillator clock signal as reference.
There are two different operating Power Down modes: protected mode and interruptible
mode.
110/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Power reduction modes
Before entering Power Down mode (by executing the instruction PWRDN), bit VREGOFF in
XMISC register must be set.
Note:
Leaving the main voltage regulator active during Power Down may lead to unexpected
behavior (ex: CPU wake-up) and power consumption higher than what specified.
21.2.1
Protected power down mode
This mode is selected when PWDCFG (bit 5) of SYSCON register is cleared. The Protected
Power Down mode is only activated if the NMI pin is pulled low when executing PWRDN
instruction (this means that the PWRD instruction belongs to the NMI software routine). This
mode is only deactivated with an external hardware reset on RSTIN pin.
21.2.2
Interruptible power down mode
This mode is selected when PWDCFG (bit 5) of SYSCON register is set.
The Interruptible Power Down mode is only activated if all the enabled Fast External
Interrupt pins are in their inactive level.
This mode is deactivated with an external reset applied to RSTIN pin or with an interrupt
request applied to one of the Fast External Interrupt pins, or with an interrupt generated by
the Real Time Clock, or with an interrupt generated by the activity on CAN’s and I2C module
interfaces. To allow the internal PLL and clock to stabilize, the RSTIN pin must be held low
according the recommendations described in Section 20.
An external RC circuit must be connected to RPD pin, as shown in the Figure 35.
Figure 35. External RC circuitry on RPD pin
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To exit Power Down mode with an external interrupt, an EXxIN (x = 7...0) pin has to be
asserted for at least 40ns.
21.3
Stand-by mode
In Stand-by mode, it is possible to turn off the main VDD provided that VSTBY is available
through the dedicated pin of the ST10F272.
To enter Stand-by mode it is mandatory to held the device under reset: once the device is
under reset, the RAM is disabled (see XRAM2EN bit of XPERCON register), and its digital
interface is frozen in order to avoid any kind of data corruption.
A dedicated embedded low-power voltage regulator is implemented to generate the internal
low voltage supply (about 1.65V in Stand-by mode) to bias all those circuits that shall remain
Doc ID 11917 Rev 3
111/188
Power reduction modes
ST10F272B/ST10F272E
active: the portion of XRAM (16Kbytes for ST10F272E), the RTC counters and 32 kHz onchip oscillator amplifier.
In normal running mode (that is when main VDD is on) the VSTBY pin can be tied to VSS
during reset to exercise the EA functionality associated with the same pin: the voltage
supply for the circuitries which are usually biased with VSTBY (see in particular the 32 kHz
oscillator used in conjunction with Real Time Clock module), is granted by the active main
VDD.
It must be noted that Stand-by Mode can generate problems associated with the usage of
different power supplies in CMOS systems; particular attention must be paid when the
ST10F272 I/O lines are interfaced with other external CMOS integrated circuits: if VDD of
ST10F272 becomes (for example in Stand-by Mode) lower than the output level forced by
the I/O lines of these external integrated circuits, the ST10F272 could be directly powered
through the inherent diode existing on ST10F272 output driver circuitry. The same is valid
for ST10F272 interfaced to active/inactive communication buses during Stand-by mode:
current injection can be generated through the inherent diode.
Furthermore, the sequence of turning on/off of the different voltage could be critical for the
system (not only for the ST10F272 device). The device Stand-by mode current (ISTBY) may
vary while VDD to VSTBY (and vice versa) transition occurs: some current flows between VDD
and VSTBY pins. System noise on both VDD and VSTBY can contribute to increase this
phenomenon.
21.3.1
Entering stand-by mode
As already said, to enter Stand-by Mode XRAM2EN bit in the XPERCON Register must be
cleared: this allows to freeze immediately the RAM interface, avoiding any data corruption.
As a consequence of a RESET event, the RAM Power Supply is switched to the internal
low-voltage supply V18SB (derived from VSTBY through the low-power voltage regulator).
The RAM interface will remain frozen until the bit XRAM2EN is set again by software
initialization routine (at next exit from main VDD power-on reset sequence).
Since V18 is falling down (as a consequence of VDD turning off), it can happen that the
XRAM2EN bit is no longer able to guarantee its content (logic “0”), being the XPERCON
Register powered by internal V18. This does not generate any problem, because the Standby Mode switching dedicated circuit continues to confirm the RAM interface freezing,
irrespective the XRAM2EN bit content; XRAM2EN bit status is considered again when
internal V18 comes back over internal stand-by reference V18SB.
If internal V18 becomes lower than internal stand-by reference (V18SB) of about 0.3 to 0.45V
with bit XRAM2EN set, the RAM Supply switching circuit is not active: in case of a
temporary drop on internal V18 voltage versus internal V18SB during normal code execution,
no spurious Stand-by Mode switching can occur (the RAM is not frozen and can still be
accessed).
The ST10F272 Core module, generating the RAM control signals, is powered by internal
V18 supply; during turning off transient these control signals follow the V18, while RAM is
switched to V18SB internal reference. It could happen that a high level of RAM write strobe
from ST10F272 Core (active low signal) is low enough to be recognized as a logic “0” by the
RAM interface (due to V18 lower than V18SB): The bus status could contain a valid address
for the RAM and an unwanted data corruption could occur. For this reason, an extra
interface, powered by the switched supply, is used to prevent the RAM from this kind of
potential corruption mechanism.
112/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Warning:
21.3.2
Power reduction modes
During power-off phase, it is important that the external
hardware maintains a stable ground level on RSTIN pin,
without any glitch, in order to avoid spurious exiting from
reset status with unstable power supply.
Exiting stand-by mode
After the system has entered the Stand-by Mode, the procedure to exit this mode consists of
a standard power-on sequence, with the only difference that the RAM is already powered
through V18SB internal reference (derived from VSTBY pin external voltage).
It is recommended to held the device under RESET (RSTIN pin forced low) until external
VDD voltage pin is stable. Even though, at the very beginning of the power-on phase, the
device is maintained under reset by the internal low voltage detector circuit (implemented
inside the main voltage regulator) till the internal V18 becomes higher than about 1.0V, there
is no warranty that the device stays under reset status if RSTIN is at high level during power
ramp up. So, it is important the external hardware is able to guarantee a stable ground level
on RSTIN along the power-on phase, without any temporary glitch.
The external hardware shall be responsible to drive low the RSTIN pin until the VDD is
stable, even though the internal LVD is active.
Once the internal reset signal goes low, the RAM (still frozen) power supply is switched to
the main V18.
At this time, everything becomes stable, and the execution of the initialization routines can
start: XRAM2EN bit can be set, enabling the RAM.
21.3.3
Real time clock and stand-by mode
When stand-by mode is entered (turning off the main supply VDD), the Real Time Clock
counting can be maintained running in case the on-chip 32 kHz oscillator is used to provide
the reference to the counter. This is not possible if the main oscillator is used as reference
for the counter: Being the main oscillator powered by VDD, once this is switched off, the
oscillator is stopped.
Doc ID 11917 Rev 3
113/188
Power reduction modes
21.3.4
ST10F272B/ST10F272E
Power reduction modes summary
In Table 52, a summary of the different power reduction modes is reported.
CPU
Peripherals
RTC
Main OSC
32 kHz OSC
STBY XRAM
XRAM
Mode
VSTBY
Power reduction modes summary
VDD
Table 52.
on
on
off
on
off
run
off
biased
biased
on
on
off
on
on
run
on
biased
biased
on
on
off
off
off
off
off
biased
biased
on
on
off
off
on
on
off
biased
biased
on
on
off
off
on
off
on
biased
biased
off
on
off
off
off
off
off
biased
off
off
on
off
off
on
off
on
biased
off
Idle
Power down
Stand-by
114/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
22
Programmable output clock divider
Programmable output clock divider
A specific register mapped on the XBUS allows to choose the division factor on the
CLKOUT signal (P3.15). This register is mapped on X-Miscellaneous memory address
range.
When CLKOUT function is enabled by setting bit CLKEN of register SYSCON, by default the
CPU clock is output on P3.15. Setting bit XMISCEN of register XPERCON and bit XPEN of
register SYSCON, it is possible to program the clock prescaling factor: in this way on P3.15
a prescaled value of the CPU clock can be output.
When CLKOUT function is not enabled (bit CLKEN of register SYSCON cleared), P3.15
does not output any clock signal, even though XCLKOUTDIV register is programmed.
Doc ID 11917 Rev 3
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Register set
23
ST10F272B/ST10F272E
Register set
This section summarizes all registers implemented in the ST10F272, ordered by name.
23.1
Special function registers
Table 25 lists all SFRs which are implemented in the ST10F272 in alphabetical order.
Bit-addressable SFRs are marked with the letter “b” in column “Name”.
SFRs within the Extended SFR-Space (ESFRs) are marked with the letter “E” in column
“Physical Address”.
Table 53.
Name
List of special function registers
Physical
address
8-bit
address
Description
Reset
value
ADCICb
FF98h
CCh
A/D converter end of conversion interrupt control
register
- - 00h
ADCONb
FFA0h
D0h
A/D converter control register
0000h
ADDAT
FEA0h
50h
A/D converter result register
0000h
ADDAT2
F0A0hE
50h
A/D converter 2 result register
0000h
ADDRSEL1
FE18h
0Ch
Address select register 1
0000h
ADDRSEL2
FE1Ah
0Dh
Address select register 2
0000h
ADDRSEL3
FE1Ch
0Eh
Address select register 3
0000h
ADDRSEL4
FE1Eh
0Fh
Address select register 4
0000h
ADEICb
FF9Ah
CDh
A/D converter overrun error interrupt control register
- - 00h
BUSCON0b
FF0Ch
86h
Bus configuration register 0
0xx0h
BUSCON1b
FF14h
8Ah
Bus configuration register 1
0000h
BUSCON2b
FF16h
8Bh
Bus configuration register 2
0000h
BUSCON3b
FF18h
8Ch
Bus configuration register 3
0000h
BUSCON4b
FF1Ah
8Dh
Bus configuration register 4
0000h
CAPREL
FE4Ah
25h
GPT2 capture/reload register
0000h
CC0
FE80h
40h
CAPCOM register 0
0000h
CC0ICb
FF78h
BCh
CAPCOM register 0 interrupt control register
- - 00h
CC1
FE82h
41h
CAPCOM register 1
0000h
CC1ICb
FF7Ah
BDh
CAPCOM register 1 interrupt control register
- - 00h
CC2
FE84h
42h
CAPCOM register 2
0000h
CC2ICb
FF7Ch
BEh
CAPCOM register 2 interrupt control register
- - 00h
CC3
FE86h
43h
CAPCOM register 3
0000h
CC3ICb
FF7Eh
BFh
CAPCOM register 3 interrupt control register
- - 00h
116/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 53.
Name
Register set
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
CC4
FE88h
44h
CAPCOM register 4
0000h
CC4ICb
FF80h
C0h
CAPCOM register 4 interrupt control register
- - 00h
CC5
FE8Ah
45h
CAPCOM register 5
0000h
CC5ICb
FF82h
C1h
CAPCOM register 5 interrupt control register
- - 00h
CC6
FE8Ch
46h
CAPCOM register 6
0000h
CC6ICb
FF84h
C2h
CAPCOM register 6 interrupt control register
- - 00h
CC7
FE8Eh
47h
CAPCOM register 7
0000h
CC7ICb
FF86h
C3h
CAPCOM register 7 interrupt control register
- - 00h
CC8
FE90h
48h
CAPCOM register 8
0000h
CC8ICb
FF88h
C4h
CAPCOM register 8 interrupt control register
- - 00h
CC9
FE92h
49h
CAPCOM register 9
0000h
CC9ICb
FF8Ah
C5h
CAPCOM register 9 interrupt control register
- - 00h
CC10
FE94h
4Ah
CAPCOM register 10
0000h
CC10ICb
FF8Ch
C6h
CAPCOM register 10 interrupt control register
- - 00h
CC11
FE96h
4Bh
CAPCOM register 11
0000h
CC11ICb
FF8Eh
C7h
CAPCOM register 11 interrupt control register
- - 00h
CC12
FE98h
4Ch
CAPCOM register 12
0000h
CC12ICb
FF90h
C8h
CAPCOM register 12 interrupt control register
- - 00h
CC13
FE9Ah
4Dh
CAPCOM register 13
0000h
CC13ICb
FF92h
C9h
CAPCOM register 13 interrupt control register
- - 00h
CC14
FE9Ch
4Eh
CAPCOM register 14
0000h
CC14ICb
FF94h
CAh
CAPCOM register 14 interrupt control register
- - 00h
CC15
FE9Eh
4Fh
CAPCOM register 15
0000h
CC15ICb
FF96h
CBh
CAPCOM register 15 interrupt control register
- - 00h
CC16
FE60h
30h
CAPCOM register 16
0000h
CC16ICb
F160hE
B0h
CAPCOM register 16 interrupt control register
- - 00h
CC17
FE62h
31h
CAPCOM register 17
0000h
CC17ICb
F162hE
B1h
CAPCOM register 17 interrupt control register
- - 00h
CC18
FE64h
32h
CAPCOM register 18
0000h
CC18ICb
F164hE
B2h
CAPCOM register 18 interrupt control register
- - 00h
CC19
FE66h
33h
CAPCOM register 19
0000h
CC19ICb
F166hE
B3h
CAPCOM register 19 interrupt control register
- - 00h
CC20
FE68h
34h
CAPCOM register 20
0000h
CC20ICb
F168hE
B4h
CAPCOM register 20 interrupt control register
- - 00h
Doc ID 11917 Rev 3
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Register set
Table 53.
Name
ST10F272B/ST10F272E
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
CC21
FE6Ah
35h
CAPCOM register 21
0000h
CC21ICb
F16AhE
B5h
CAPCOM register 21 interrupt control register
- - 00h
CC22
FE6Ch
36h
CAPCOM register 22
0000h
CC22ICb
F16ChE
B6h
CAPCOM register 22 interrupt control register
- - 00h
CC23
FE6Eh
37h
CAPCOM register 23
0000h
CC23ICb
F16EhE
B7h
CAPCOM register 23 interrupt control register
- - 00h
CC24
FE70h
38h
CAPCOM register 24
0000h
CC24ICb
F170hE
B8h
CAPCOM register 24 interrupt control register
- - 00h
CC25
FE72h
39h
CAPCOM register 25
0000h
CC25ICb
F172hE
B9h
CAPCOM register 25 interrupt control register
- - 00h
CC26
FE74h
3Ah
CAPCOM register 26
0000h
CC26ICb
F174hE
BAh
CAPCOM register 26 interrupt control register
- - 00h
CC27
FE76h
3Bh
CAPCOM register 27
0000h
CC27ICb
F176hE
BBh
CAPCOM register 27 interrupt control register
- - 00h
CC28
FE78h
3Ch
CAPCOM register 28
0000h
CC28ICb
F178hE
BCh
CAPCOM register 28 interrupt control register
- - 00h
CC29
FE7Ah
3Dh
CAPCOM register 29
0000h
CC29ICb
F184hE
C2h
CAPCOM register 29 interrupt control register
- - 00h
CC30
FE7Ch
3Eh
CAPCOM register 30
0000h
CC30ICb
F18ChE
C6h
CAPCOM register 30 interrupt control register
- - 00h
CC31
FE7Eh
3Fh
CAPCOM register 31
0000h
CC31ICb
F194hE
CAh
CAPCOM register 31 interrupt control register
- - 00h
CCM0b
FF52h
A9h
CAPCOM Mode Control register 0
0000h
CCM1b
FF54h
AAh
CAPCOM Mode Control register 1
0000h
CCM2b
FF56h
ABh
CAPCOM Mode Control register 2
0000h
CCM3b
FF58h
ACh
CAPCOM mode Control register 3
0000h
CCM4b
FF22h
91h
CAPCOM Mode Control register 4
0000h
CCM5b
FF24h
92h
CAPCOM Mode Control register 5
0000h
CCM6b
FF26h
93h
CAPCOM Mode Control register 6
0000h
CCM7b
FF28h
94h
CAPCOM Mode Control register 7
0000h
CP
FE10h
08h
CPU Context Pointer register
FC00h
CRICb
FF6Ah
B5h
GPT2 CAPREL interrupt control register
- - 00h
CSP
FE08h
04h
CPU Code Segment Pointer register (read only)
0000h
DP0Lb
F100hE
80h
P0L direction control register
- - 00h
118/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 53.
Name
Register set
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
DP0Hb
F102hE
81h
P0h direction control register
- - 00h
DP1Lb
F104hE
82h
P1L direction control register
- - 00h
DP1Hb
F106hE
83h
P1h direction control register
- - 00h
DP2 b
FFC2h
E1h
Port 2 direction control register
0000h
DP3 b
FFC6h
E3h
Port 3 direction control register
0000h
DP4 b
FFCAh
E5h
Port 4 direction control register
- - 00h
DP6 b
FFCEh
E7h
Port 6 direction control register
- - 00h
DP7 b
FFD2h
E9h
Port 7 direction control register
- - 00h
DP8 b
FFD6h
EBh
Port 8 direction control register
- - 00h
DPP0
FE00h
00h
CPU data page pointer 0 register (10-bit)
0000h
DPP1
FE02h
01h
CPU data page pointer 1 register (10-bit)
0001h
DPP2
FE04h
02h
CPU data page pointer 2 register (10-bit)
0002h
DPP3
FE06h
03h
CPU data page pointer 3 register (10-bit)
0003h
EMUCON
FE0Ah
05h
Emulation control register
EXICONb
F1C0hE
E0h
External interrupt control register
0000h
EXISELb
F1DAhE
EDh
External interrupt source selection register
0000h
IDCHIP
F07ChE
3Eh
Device identifier register (n is the device revision)
110nh
IDMANUF
F07EhE
3Fh
Manufacturer identifier register
0403h
IDMEM
F07AhE
3Dh
On-chip memory identifier register
3040h
IDPROG
F078hE
3Ch
Programming voltage identifier register
0040h
IDX0b
FF08h
84h
MAC unit address pointer 0
0000h
IDX1b
FF0Ah
85h
MAC unit address pointer 1
0000h
MAH
FE5Eh
2Fh
MAC unit accumulator - high word
0000h
MAL
FE5Ch
2Eh
MAC unit accumulator - low word
0000h
MCWb
FFDCh
EEh
MAC unit control word
0000h
MDCb
FF0Eh
87h
CPU multiply divide control register
0000h
MDH
FE0Ch
06h
CPU multiply divide register – high word
0000h
MDL
FE0Eh
07h
CPU multiply divide register – low word
0000h
MRWb
FFDAh
EDh
MAC unit repeat word
0000h
MSWb
FFDEh
EFh
MAC unit status word
0200h
ODP2b
F1C2hE
E1h
Port 2 open drain control register
0000h
ODP3b
F1C6hE
E3h
Port 3 open drain control register
0000h
ODP4b
F1CAhE
E5h
Port 4 open drain control register
- - 00h
ODP6b
F1CEhE
E7h
Port 6 open drain control register
- - 00h
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- - XXh
119/188
Register set
Table 53.
Name
ST10F272B/ST10F272E
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
ODP7b
F1D2hE
E9h
Port 7 open drain control register
- - 00h
ODP8b
F1D6hE
EBh
Port 8 open drain control register
- - 00h
ONESb
FF1Eh
8Fh
Constant value 1’s register (read only)
FFFFh
P0L b
FF00h
80h
PORT0 low register (lower half of PORT0)
- - 00h
P0H b
FF02h
81h
PORT0 high register (upper half of PORT0)
- - 00h
P1L b
FF04h
82h
PORT1 low register (lower half of PORT1)
- - 00h
P1H b
FF06h
83h
PORT1 high register (upper half of PORT1)
- - 00h
P2 b
FFC0h
E0h
Port 2 register
0000h
P3 b
FFC4h
E2h
Port 3 register
0000h
P4 b
FFC8h
E4h
Port 4 register (8-bit)
- - 00h
P5 b
FFA2h
D1h
Port 5 register (read only)
P6 b
FFCCh
E6h
Port 6 register (8-bit)
- - 00h
P7 b
FFD0h
E8h
Port 7 register (8-bit)
- - 00h
P8 b
FFD4h
EAh
Port 8 register (8-bit)
- - 00h
P5DIDISb
FFA4h
D2h
Port 5 digital disable register
0000h
PECC0
FEC0h
60h
PEC channel 0 control register
0000h
PECC1
FEC2h
61h
PEC channel 1 control register
0000h
PECC2
FEC4h
62h
PEC channel 2 control register
0000h
PECC3
FEC6h
63h
PEC channel 3 control register
0000h
PECC4
FEC8h
64h
PEC channel 4 control register
0000h
PECC5
FECAh
65h
PEC channel 5 control register
0000h
PECC6
FECCh
66h
PEC channel 6 control register
0000h
PECC7
FECEh
67h
PEC channel 7 control register
0000h
PICONb
F1C4hE
E2h
Port input threshold control register
- - 00h
PP0
F038hE
1Ch
PWM module period register 0
0000h
PP1
F03AhE
1Dh
PWM module period register 1
0000h
PP2
F03ChE
1Eh
PWM module period register 2
0000h
PP3
F03EhE
1Fh
PWM module period register 3
0000h
PSWb
FF10h
88h
CPU program status word
0000h
PT0
F030hE
18h
PWM module up/down counter 0
0000h
PT1
F032hE
19h
PWM module up/down counter 1
0000h
PT2
F034hE
1Ah
PWM module up/down counter 2
0000h
PT3
F036hE
1Bh
PWM module up/down counter 3
0000h
PW0
FE30h
18h
PWM module pulse width register 0
0000h
120/188
Doc ID 11917 Rev 3
XXXXh
ST10F272B/ST10F272E
Table 53.
Name
Register set
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
PW1
FE32h
19h
PWM module pulse width register 1
0000h
PW2
FE34h
1Ah
PWM module pulse width register 2
0000h
PW3
FE36h
1Bh
PWM module pulse width register 3
0000h
PWMCON0b
FF30h
98h
PWM module control register 0
0000h
PWMCON1b
FF32h
99h
PWM module control register 1
0000h
PWMICb
F17EhE
BFh
PWM module interrupt control register
- - 00h
QR0
F004hE
02h
MAC unit offset register r0
0000h
QR1
F006hE
03h
MAC unit offset register R1
0000h
QX0
F000hE
00h
MAC unit offset register X0
0000h
QX1
F002hE
01h
MAC unit offset register X1
0000h
RP0Hb
F108hE
84h
System start-up configuration register (read only)
S0BG
FEB4h
5Ah
Serial channel 0 baud rate generator reload register
0000h
S0CONb
FFB0h
D8h
Serial channel 0 control register
0000h
S0EICb
FF70h
B8h
Serial channel 0 error interrupt control register
- - 00h
S0RBUF
FEB2h
59h
Serial channel 0 receive buffer register (read only)
- - XXh
S0RICb
FF6Eh
B7h
Serial channel 0 receive interrupt control register
- - 00h
S0TBICb
F19ChE
CEh
Serial channel 0 transmit buffer interrupt control reg.
- - 00h
S0TBUF
FEB0h
58h
Serial channel 0 transmit buffer register (write only)
0000h
S0TICb
FF6Ch
B6h
Serial channel 0 transmit interrupt control register
- - 00h
SP
FE12h
09h
CPU system stack pointer register
FC00h
SSCBR
F0B4hE
5Ah
SSC Baud rate register
0000h
SSCCONb
FFB2h
D9h
SSC control register
0000h
SSCEICb
FF76h
BBh
SSC error interrupt control register
- - 00h
SSCRB
F0B2hE
59h
SSC receive buffer (read only)
SSCRICb
FF74h
BAh
SSC receive interrupt control register
- - 00h
SSCTB
F0B0hE
58h
SSC transmit buffer (write only)
0000h
SSCTICb
FF72h
B9h
SSC transmit interrupt control register
- - 00h
STKOV
FE14h
0Ah
CPU stack overflow pointer register
FA00h
STKUN
FE16h
0Bh
CPU stack underflow pointer register
FC00h
SYSCONb
FF12h
89h
CPU system configuration register
T0
FE50h
28h
CAPCOM timer 0 register
0000h
T01CONb
FF50h
A8h
CAPCOM timer 0 and timer 1 control register
0000h
T0ICb
FF9Ch
CEh
CAPCOM timer 0 interrupt control register
- - 00h
T0REL
FE54h
2Ah
CAPCOM timer 0 reload register
0000h
Doc ID 11917 Rev 3
- - XXh
XXXXh
0xx0h 1)
121/188
Register set
Table 53.
Name
ST10F272B/ST10F272E
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
T1
FE52h
29h
CAPCOM timer 1 register
0000h
T1ICb
FF9Eh
CFh
CAPCOM timer 1 interrupt control register
- - 00h
T1REL
FE56h
2Bh
CAPCOM timer 1 reload register
0000h
T2
FE40h
20h
GPT1 timer 2 register
0000h
T2CONb
FF40h
A0h
GPT1 timer 2 control register
0000h
T2ICb
FF60h
B0h
GPT1 timer 2 interrupt control register
- - 00h
T3
FE42h
21h
GPT1 timer 3 register
0000h
T3CONb
FF42h
A1h
GPT1 timer 3 control register
0000h
T3ICb
FF62h
B1h
GPT1 timer 3 interrupt control register
- - 00h
T4
FE44h
22h
GPT1 timer 4 register
0000h
T4CONb
FF44h
A2h
GPT1 timer 4 control register
0000h
T4ICb
FF64h
B2h
GPT1 timer 4 interrupt control register
- - 00h
T5
FE46h
23h
GPT2 timer 5 register
0000h
T5CONb
FF46h
A3h
GPT2 timer 5 control register
0000h
T5ICb
FF66h
B3h
GPT2 timer 5 interrupt control register
- - 00h
T6
FE48h
24h
GPT2 timer 6 register
0000h
T6CONb
FF48h
A4h
GPT2 timer 6 control register
0000h
T6ICb
FF68h
B4h
GPT2 timer 6 interrupt control register
- - 00h
T7
F050hE
28h
CAPCOM timer 7 register
0000h
T78CONb
FF20h
90h
CAPCOM timer 7 and 8 control register
0000h
T7ICb
F17AhE
BDh
CAPCOM timer 7 interrupt control register
- - 00h
T7REL
F054hE
2Ah
CAPCOM timer 7 reload register
0000h
T8
F052hE
29h
CAPCOM timer 8 register
0000h
T8ICb
F17ChE
BEh
CAPCOM timer 8 interrupt control register
- - 00h
T8REL
F056hE
2Bh
CAPCOM timer 8 reload register
0000h
TFR b
FFACh
D6h
Trap Flag register
0000h
WDT
FEAEh
57h
Watchdog timer register (read only)
0000h
WDTCONb
FFAEh
D7h
Watchdog timer control register
00xxh 2)
XADRS3
F01ChE
0Eh
XPER address select register 3
800Bh
XP0ICb
F186hE
C3h
See Section 9.1
- - 00h 3)
XP1ICb
F18EhE
C7h
See Section 9.1
- - 00h 3)
XP2ICb
F196hE
CBh
See Section 9.1
- - 00h 3)
XP3ICb
F19EhE
CFh
See Section 9.1
- - 00h 3)
122/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 53.
Name
Register set
List of special function registers (continued)
Physical
address
8-bit
address
Description
Reset
value
XPERCONb
F024hE
12h
XPER configuration register
- - 05h
ZEROSb
FF1Ch
8Eh
Constant value 0’s register (read only)
0000h
Note:
1. The system configuration is selected during reset. SYSCON reset value is 0000 0xx0
x000 0000b.
2. Reset Value depends on different triggered reset event.
3. The XPnIC Interrupt Control Registers control interrupt requests from integrated X-Bus
peripherals. Some software controlled interrupt requests may be generated by setting the
XPnIR bits (of XPnIC register) of the unused X-Peripheral nodes.
23.2
X-registers
Table 54 lists all X-Bus registers which are implemented in the ST10F272 ordered by their
name. The FLASH control registers are listed in a separate section, in spite of they also are
physically mapped on X-Bus memory space.
Note:
The X-Registers are not bit-addressable.
Table 54.
List of XBus registers
Name
Physical
address
Description
Reset
value
CAN1BRPER
EF0Ch
CAN1: BRP extension register
0000h
CAN1BTR
EF06h
CAN1: Bit timing register
2301h
CAN1CR
EF00h
CAN1: CAN control register
0001h
CAN1EC
EF04h
CAN1: error counter
0000h
CAN1IF1A1
EF18h
CAN1: IF1 arbitration 1
0000h
CAN1IF1A2
EF1Ah
CAN1: IF1 arbitration 2
0000h
CAN1IF1CM
EF12h
CAN1: IF1 command mask
0000h
CAN1IF1CR
EF10h
CAN1: IF1 command request
0001h
CAN1IF1DA1
EF1Eh
CAN1: IF1 data A 1
0000h
CAN1IF1DA2
EF20h
CAN1: IF1 data A 2
0000h
CAN1IF1DB1
EF22h
CAN1: IF1 data B 1
0000h
CAN1IF1DB2
EF24h
CAN1: IF1 data B 2
0000h
CAN1IF1M1
EF14h
CAN1: IF1 mask 1
FFFFh
CAN1IF1M2
EF16h
CAN1: IF1 mask 2
FFFFh
CAN1IF1MC
EF1Ch
CAN1: IF1 message control
0000h
CAN1IF2A1
EF48h
CAN1: IF2 arbitration 1
0000h
CAN1IF2A2
EF4Ah
CAN1: IF2 arbitration 2
0000h
Doc ID 11917 Rev 3
123/188
Register set
ST10F272B/ST10F272E
Table 54.
List of XBus registers (continued)
Name
124/188
Physical
address
Description
Reset
value
CAN1IF2CM
EF42h
CAN1: IF2 command mask
0000h
CAN1IF2CR
EF40h
CAN1: IF2 command request
0001h
CAN1IF2DA1
EF4Eh
CAN1: IF2 data A 1
0000h
CAN1IF2DA2
EF50h
CAN1: IF2 data A 2
0000h
CAN1IF2DB1
EF52h
CAN1: IF2 data B 1
0000h
CAN1IF2DB2
EF54h
CAN1: IF2 data B 2
0000h
CAN1IF2M1
EF44h
CAN1: IF2 Mask 1
FFFFh
CAN1IF2M2
EF46h
CAN1: IF2 mask 2
FFFFh
CAN1IF2MC
EF4Ch
CAN1: IF2 message control
0000h
CAN1IP1
EFA0h
CAN1: interrupt pending 1
0000h
CAN1IP2
EFA2h
CAN1: interrupt pending 2
0000h
CAN1IR
EF08h
CAN1: interrupt register
0000h
CAN1MV1
EFB0h
CAN1: message valid 1
0000h
CAN1MV2
EFB2h
CAN1: message valid 2
0000h
CAN1ND1
EF90h
CAN1: new data 1
0000h
CAN1ND2
EF92h
CAN1: new data 2
0000h
CAN1SR
EF02h
CAN1: status register
0000h
CAN1TR
EF0Ah
CAN1: test register
00x0h
CAN1TR1
EF80h
CAN1: transmission request 1
0000h
CAN1TR2
EF82h
CAN1: transmission request 2
0000h
CAN2BRPER
EE0Ch
CAN2: BRP extension register
0000h
CAN2BTR
EE06h
CAN2: bit timing register
2301h
CAN2CR
EE00h
CAN2: CAN control register
0001h
CAN2EC
EE04h
CAN2: error counter
0000h
CAN2IF1A1
EE18h
CAN2: IF1 arbitration 1
0000h
CAN2IF1A2
EE1Ah
CAN2: IF1 arbitration 2
0000h
CAN2IF1CM
EE12h
CAN2: IF1 command mask
0000h
CAN2IF1CR
EE10h
CAN2: IF1 command request
0001h
CAN2IF1DA1
EE1Eh
CAN2: IF1 data A 1
0000h
CAN2IF1DA2
EE20h
CAN2: IF1 data A 2
0000h
CAN2IF1DB1
EE22h
CAN2: IF1 data B 1
0000h
CAN2IF1DB2
EE24h
CAN2: IF1 data B 2
0000h
CAN2IF1M1
EE14h
CAN2: IF1 mask 1
FFFFh
CAN2IF1M2
EE16h
CAN2: IF1 mask 2
FFFFh
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 54.
Register set
List of XBus registers (continued)
Name
Physical
address
Description
Reset
value
CAN2IF1MC
EE1Ch
CAN2: IF1 message control
0000h
CAN2IF2A1
EE48h
CAN2: IF2 arbitration 1
0000h
CAN2IF2A2
EE4Ah
CAN2: IF2 arbitration 2
0000h
CAN2IF2CM
EE42h
CAN2: IF2 command mask
0000h
CAN2IF2CR
EE40h
CAN2: IF2 command request
0001h
CAN2IF2DA1
EE4Eh
CAN2: IF2 data A 1
0000h
CAN2IF2DA2
EE50h
CAN2: IF2 data A 2
0000h
CAN2IF2DB1
EE52h
CAN2: IF2 data B 1
0000h
CAN2IF2DB2
EE54h
CAN2: IF2 data B 2
0000h
CAN2IF2M1
EE44h
CAN2: IF2 mask 1
FFFFh
CAN2IF2M2
EE46h
CAN2: IF2 mask 2
FFFFh
CAN2IF2MC
EE4Ch
CAN2: IF2 message control
0000h
CAN2IP1
EEA0h
CAN2: interrupt pending 1
0000h
CAN2IP2
EEA2h
CAN2: interrupt pending 2
0000h
CAN2IR
EE08h
CAN2: interrupt register
0000h
CAN2MV1
EEB0h
CAN2: message valid 1
0000h
CAN2MV2
EEB2h
CAN2: message valid 2
0000h
CAN2ND1
EE90h
CAN2: new data 1
0000h
CAN2ND2
EE92h
CAN2: new data 2
0000h
CAN2SR
EE02h
CAN2: status register
0000h
CAN2TR
EE0Ah
CAN2: test register
00x0h
CAN2TR1
EE80h
CAN2: transmission request 1
0000h
CAN2TR2
EE82h
CAN2: Transmission request 2
0000h
I2CCCR1
EA06h
I2C clock control register 1
0000h
I2CCCR2
EA0Eh
I2C clock control register 2
0000h
I2CCR
EA00h
I2C control register
0000h
I2CDR
EA0Ch
I2C data register
0000h
I2COAR1
EA08h
I2C own address register 1
0000h
I2COAR2
EA0Ah
I2C own address register 2
0000h
I2CSR1
EA02h
I2C status register 1
0000h
I2CSR2
EA04h
I2C status register 2
0000h
RTCAH
ED14h
RTC alarm register high byte
XXXXh
RTCAL
ED12h
RTC alarm register low byte
XXXXh
RTCCON
ED00H
RTC control register
000Xh
Doc ID 11917 Rev 3
125/188
Register set
ST10F272B/ST10F272E
Table 54.
List of XBus registers (continued)
Name
126/188
Physical
address
Description
Reset
value
RTCDH
ED0Ch
RTC divider counter high byte
XXXXh
RTCDL
ED0Ah
RTC divider counter low byte
XXXXh
RTCH
ED10h
RTC programmable counter high byte
XXXXh
RTCL
ED0Eh
RTC programmable counter low byte
XXXXh
RTCPH
ED08h
RTC prescaler register high byte
XXXXh
RTCPL
ED06h
RTC prescaler register low byte
XXXXh
XCLKOUTDIV
EB02h
CLKOUT divider control register
- - 00h
XEMU0
EB76h
XBUS emulation register 0 (write only)
XXXXh
XEMU1
EB78h
XBUS emulation register 1 (write only)
XXXXh
XEMU2
EB7Ah
XBUS emulation register 2 (write only)
XXXXh
XEMU3
EB7Ch
XBUS emulation register 3 (write only)
XXXXh
XIR0CLR
EB14h
X-Interrupt 0 clear register (write only)
0000h
XIR0SEL
EB10h
X-Interrupt 0 selection register
0000h
XIR0SET
EB12h
X-Interrupt 0 set register (write only)
0000h
XIR1CLR
EB24h
X-Interrupt 1 clear register (write only)
0000h
XIR1SEL
EB20h
X-Interrupt 1 selection register
0000h
XIR1SET
EB22h
X-Interrupt 1 set register (write only)
0000h
XIR2CLR
EB34h
X-Interrupt 2 clear register (write only)
0000h
XIR2SEL
EB30h
X-Interrupt 2 selection register
0000h
XIR2SET
EB32h
X-Interrupt 2 set register (write only)
0000h
XIR3CLR
EB44h
X-Interrupt 3 clear selection register (write only)
0000h
XIR3SEL
EB40h
X-Interrupt 3 selection register
0000h
XIR3SET
EB42h
X-Interrupt 3 set selection register (write only)
0000h
XMISC
EB46h
XBUS miscellaneous features register
0000h
XP1DIDIS
EB36h
Port 1 digital disable register
0000h
XPEREMU
EB7Eh
XPERCON copy for emulation (write only)
XXXXh
XPICON
EB26h
Extended port input threshold control register
- - 00h
XPOLAR
EC04h
XPWM module channel polarity register
0000h
XPP0
EC20h
XPWM module period register 0
0000h
XPP1
EC22h
XPWM module period register 1
0000h
XPP2
EC24h
XPWM module period register 2
0000h
XPP3
EC26h
XPWM module period register 3
0000h
XPT0
EC10h
XPWM module up/down counter 0
0000h
XPT1
EC12h
XPWM module up/down counter 1
0000h
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 54.
Register set
List of XBus registers (continued)
Name
Physical
address
Description
Reset
value
XPT2
EC14h
XPWM module up/down counter 2
0000h
XPT3
EC16h
XPWM module up/down counter 3
0000h
XPW0
EC30h
XPWM module pulse width register 0
0000h
XPW1
EC32h
XPWM module pulse width register 1
0000h
XPW2
EC34h
XPWM module pulse width register 2
0000h
XPW3
EC36h
XPWM module pulse width register 3
0000h
XPWMCON0
EC00h
XPWM module control register 0
0000h
XPWMCON0CLR
EC08h
XPWM module clear control reg. 0 (write only)
0000h
XPWMCON0SET
EC06h
XPWM module set control register 0 (write only)
0000h
XPWMCON1
EC02h
XPWM module control register 1
0000h
XPWMCON1CLR
EC0Ch
XPWM module clear control reg. 0 (write only)
0000h
XPWMCON1SET
EC0Ah
XPWM module set control register 0 (write only)
0000h
XPWMPORT
EC80h
XPWM module port control register
0000h
XS1BG
E906h
XASC Baud rate generator reload register
0000h
XS1CON
E900h
XASC control register
0000h
XS1CONCLR
E904h
XASC clear control register (write only)
0000h
XS1CONSET
E902h
XASC set control register (write only)
0000h
XS1PORT
E980h
XASC port control register
0000h
XS1RBUF
E90Ah
XASC receive buffer register
0000h
XS1TBUF
E908h
XASC transmit buffer register
0000h
XSSCBR
E80Ah
XSSC Baud rate register
0000h
XSSCCON
E800h
XSSC control register
0000h
XSSCCONCLR
E804h
XSSC clear control register (write only)
0000h
XSSCCONSET
E802h
XSSC set control register (write only)
0000h
XSSCPORT
E880h
XSSC port control register
0000h
XSSCRB
E808h
XSSC receive buffer
XXXXh
XSSCTB
E806h
XSSC transmit buffer
0000h
Doc ID 11917 Rev 3
127/188
Register set
23.3
ST10F272B/ST10F272E
Flash registers ordered by name
Table 55 lists all Flash Control Registers which are implemented in the ST10F272 ordered
by their name. These registers are physically mapped on the IBus, except for XFVTAUR0,
which is mapped on XBus. Note that these registers are not bit-addressable.
Table 55.
Name
23.4
List of flash registers
Physical
address
Description
Reset value
FARH
0x0008 0012
Flash address register - high
0000h
FARL
0x0008 0010
Flash address register - low
0000h
FCR0H
0x0008 0002
Flash control register 0 - high
0000h
FCR0L
0x0008 0000
Flash control register 0 - low
0000h
FCR1H
0x0008 0006
Flash control register 1 - high
0000h
FCR1L
0x0008 0004
Flash control register 1 - low
0000h
FDR0H
0x0008 000A
Flash data register 0 - high
FFFFh
FDR0L
0x0008 0008
Flash data register 0 - low
FFFFh
FDR1H
0x0008 000E
Flash data register 1 - high
FFFFh
FDR1L
0x0008 000C
Flash data register 1 - low
FFFFh
FER
0x0008 0014
Flash error register
0000h
FNVAPR0
0x0008 DFB8
Flash non volatile access protection reg.0
ACFFh
FNVAPR1H
0x0008 DFBE
Flash non volatile access protection reg.1 - high
FFFFh
FNVAPR1L
0x0008 DFBC
Flash non volatile access protection reg.1 - low
FFFFh
FNVWPIR
0x0008 DFB0
Flash non volatile protection I register
FFFFh
XFVTAUR0
0x0000 EB50
XBus Flash volatile temporary access
unprotection register 0
0000h
Identification registers
The ST10F272 have four Identification registers, mapped in ESFR space. These registers
contain:
128/188
●
A manufacturer identifier
●
A chip identifier with its revision
●
A internal Flash and size identifier
●
Programming voltage description
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Register set
IDMANUF (F07Eh / 3Fh)
15
14
13
12
11
ESFR
10
9
8
Reset Value: 0403h
7
6
5
MANUF
4
3
2
1
0
0
0
0
1
1
R
Table 56.
R
IDMANUF
Bit
Function
Manufacturer identifier
020h: STMicroelectronics manufacturer (JTAG worldwide normalization).
MANUF
IDCHIP (F07Ch / 3Eh)
15
14
13
Table 57.
12
ESFR
11
10
9
8
6
5
3
2
1
REVID
R
R
0
IDCHIP
Function
IDCHIP
Device identifier
110h: ST10F272 identifier (272).
REVID
Device revision identifier
Xh: According to revision number.
IDMEM (F07Ah / 3Dh)
14
13
12
ESFR
11
10
9
8
Reset Value: 3040h
7
6
5
MEMTYP
MEMSIZE
R
R
Table 58.
4
IDCHIP
Bit
15
Reset Value: 110Xh
7
4
3
2
1
0
IDMEM
Bit
Function
Internal memory size
MEMSIZE
Internal memory size is 4 x (MEMSIZE) (in Kbyte)
040h for 256 Kbytes (ST10F272)
Internal memory type
MEMTYP
‘0h’: ROM-Less
‘1h’: (M) ROM memory
‘2h’: (S) Standard Flash memory
‘3h’: (H) High performance Flash memory (ST10F272)
‘4h...Fh’: Reserved
Doc ID 11917 Rev 3
129/188
Register set
ST10F272B/ST10F272E
IDPROG (F078h / 3Ch)
15
14
Table 59.
13
12
ESFR
11
10
9
8
Reset Value: 0040h
7
5
4
3
PROGVPP
PROGVDD
R
R
2
1
0
IDPROG
Bit
Note:
6
Function
PROGVDD
Programming VDD voltage
VDD voltage when programming EPROM or FLASH devices is calculated using the
following formula: VDD = 20 x [PROGVDD] / 256 (volts) - 40h for ST10F272 (5V).
PROGVPP
Programming VPP voltage (no need of external VPP) - 00h
All identification words are read only registers.
The values written inside different Identification Register bits are valid only after the Flash
initialization phase is completed. When code execution is started from internal memory (pin
EA held high during reset), the Flash has certainly completed its initialization, so the bits of
Identification Registers are immediately ready to be read out. On the contrary, when code
execution is started from external memory (pin EA held low during reset), the Flash
initialization is not yet completed, so the bits of Identification Registers are not ready. The
user can poll bits 15 and 14 of IDMEM register: when both bits are read low, the Flash
initialization is complete, so all Identification Register bits are correct.
Before Flash initialization completion, the default setting of the different Identification
Registers are the following:
130/188
●
IDMANUF
0403h
●
IDCHIP
110xh (x = silicon revision)
●
IDMEM
F040h
●
IDPROG
0040h
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
24
Electrical characteristics
24.1
Absolute maximum ratings
Stressing the device above the rating listed in Table 60 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not
implied. Exposure to the conditions in Table 60 for extended periods may affect device
reliability. During overload conditions (VIN > VDD or VIN < VSS) the voltage on pins with respect
to ground (VSS) must not exceed the values defined by the Absolute Maximum Ratings.
During Power-on and Power-off transients (including Standby entering/exiting phases), the
relationships between voltages applied to the device and the main VDD shall be always
respected. In particular power-on and power-off of VAREF shall be coherent with VDD
transient, in order to avoid undesired current injection through the on-chip protection diodes.
Table 60.
Absolute maximum ratings
Symbol
Parameter
Values
Unit
VDD
Voltage on VDD pins with respect to ground (VSS)
-0.5 to +6.5
V
VSTBY
Voltage on VSTBY pin with respect to ground (VSS)
-0.5 to +6.5
V
VAREF
Voltage on VAREF pins with respect to ground (VSS)
-0.3 to VDD
V
VAGND
Voltage on VAGND pins with respect to ground (VSS)
VSS
V
-0.5 to VDD + 0.5
V
VIO
Voltage on any pin with respect to ground (VSS)
IOV
Input current on any pin during overload condition
± 10
mA
ITOV
Absolute sum of all input currents during overload condition
| 75 |
mA
TST
Storage temperature
-65 to +150
°C
ESD
ESD Susceptibility (Human Body Model)
2000
V
Doc ID 11917 Rev 3
131/188
Electrical characteristics
ST10F272B/ST10F272E
24.2
Recommended operating conditions
Table 61.
Recommended operating conditions
Value
Symbol
VDD
VSTBY
VAREF
Parameter
Operating supply voltage
Operationg stand-by supply voltage
(1)
Operating analog reference voltage
(2)
Unit
Min
Max
4.5
5.5
V
4.5
5.5
V
TA
Ambient temperature under bias
-40
+125
°C
TJ
Junction temperature under bias
-40
+150
°C
1. The value of the VSTBY voltage is specified in the range 4.5 - 5.5 Volt. Nevertheless, it is acceptable to exceed the upper
limit (up to 6.0 Volt) for a maximum of 100 hours over the global 300000 hours, representing the lifetime of the device
(about 30 years). On the other hand, it is possible to exceed the lower limit (down to 4.0 Volt) whenever RTC and 32kHz
on-chip oscillator amplifier are turned off (only Stand-by RAM powered through VSTBY pin in Stand-by mode). When
VSTBY voltage is lower than main VDD, the input section of VSTBY/EA pin can generate a spurious static consumption on
VDD power supply (in the range of tenth of μA).
2. For details on operating conditions concerning the usage of A/D Converter refer to Section 24.7.
24.3
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA) (1)
Where:
TA is the Ambient Temperature in °C,
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
PINT is the product of IDD and VDD, expressed in Watt. This is the Chip Internal Power,
PI/O represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications PI/O < PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C) (2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD2 (3)
Where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ
may be obtained by solving equations (1) and (2) iteratively for any value of TA.
132/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 62.
Electrical characteristics
Thermal characteristics
Symbol
Description
Value (typical)
Unit
ΘJA
Thermal Resistance Junction-Ambient
PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch on four layer
FR4 board (2 layers signals / 2 layers power)
30
40
35
°C/W
Based on thermal characteristics of the package and with reference to the power
consumption figures provided in next tables and diagrams, the following product
classification can be proposed. Anyhow, the exact power consumption of the device inside
the application must be computed according to different working conditions, thermal profiles,
real thermal resistance of the system (including printed circuit board or other substrata), I/O
activity, and so on.
Table 63.
24.4
Package characteristics
Package
Ambient temperature range
CPU frequency range
PQFP 144
–40 / +125°C
1 – 64MHz
LQFP 144
°C
1 – 40MHz
–40 / +125
Parameter interpretation
The parameters listed in the following tables represent the characteristics of the ST10F272
and its demands on the system.
Where the ST10F272 logic provides signals with their respective timing characteristics, the
symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where the
external system must provide signals with their respective timing characteristics to the
ST10F272, the symbol “SR” for System Requirement, is included in the “Symbol” column.
Doc ID 11917 Rev 3
133/188
Electrical characteristics
24.5
ST10F272B/ST10F272E
DC characteristics
VDD = 5 V ± 10%, VSS = 0 V, TA = –40 to +125°C
Table 64.
DC characteristics
Limit values
Parameter
Symbol
min.
max.
Unit
Test Condition
Input low voltage (TTL mode)
(except RSTIN, EA, NMI, RPD, XTAL1,
READY)
VIL
SR
– 0.3
0.8
V
–
Input low voltage (CMOS mode)
(except RSTIN, EA, NMI, RPD, XTAL1,
READY)
VILS SR
– 0.3
0.3 VDD
V
–
Input low voltage RSTIN, EA, NMI, RPD
VIL1 SR
– 0.3
0.3 VDD
V
–
Input low voltage XTAL1 (CMOS only)
VIL2 SR
– 0.3
0.3 VDD
V
Direct Drive mode
Input low voltage READY (TTL only)
VIL3 SR
– 0.3
0.8
V
–
Input high voltage (TTL mode)
(except RSTIN, EA, NMI, RPD, XTAL1)
VIH
2.0
VDD + 0.3
V
–
Input high voltage (CMOS mode)
(except RSTIN, EA, NMI, RPD, XTAL1)
VIHS SR
0.7 VDD
VDD + 0.3
V
–
Input high voltage RSTIN, EA, NMI, RPD VIH1 SR
0.7 VDD
VDD + 0.3
V
–
Input high voltage XTAL1 (CMOS only)
VIH2 SR
0.7 VDD
VDD + 0.3
V
Direct Drive mode
Input high voltage READY (TTL only)
VIH3 SR
2.0
VDD + 0.3
V
–
Input Hysteresis (TTL mode)
(except RSTIN, EA, NMI, XTAL1, RPD)
VHYS CC
400
700
mV
(1)
Input Hysteresis (CMOS mode)
(except RSTIN, EA, NMI, XTAL1, RPD)
VHYSSCC
750
1400
mV
(1)
Input Hysteresis RSTIN, EA, NMI
VHYS1CC
750
1400
mV
(1)
Input Hysteresis XTAL1
VHYS2CC
0
50
mV
(1)
Input Hysteresis READY (TTL only)
VHYS3CC
400
700
mV
(1)
Input Hysteresis RPD
VHYS4CC
500
1500
mV
(1)
Output low voltage
(P6[7:0], ALE, RD, WR/WRL,
BHE/WRH, CLKOUT, RSTIN,
RSTOUT)
VOL CC
–
0.4
0.05
V
IOL = 8 mA
IOL = 1 mA
Output low voltage
(P0[15:0], P1[15:0], P2[15:0],
P3[15,13:0], P4[7:0], P7[7:0],
P8[7:0])
VOL1 CC
–
0.4
0.05
V
IOL1 = 4 mA
IOL1 = 0.5 mA
Output low voltage RPD
VOL2 CC
–
VDD
0.5 VDD
0.3 VDD
V
IOL2 = 85 μA
IOL2 = 80 μA
IOL2 = 60 μA
134/188
SR
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 64.
Electrical characteristics
DC characteristics (continued)
Limit values
Parameter
Symbol
min.
max.
Unit
Test Condition
Output high voltage
(P6[7:0], ALE, RD, WR/WRL,
BHE/WRH, CLKOUT, RSTOUT)
VOH CC
VDD – 0.8
VDD – 0.08
–
V
IOH = – 8 mA
IOH = – 1 mA
Output high voltage (2)
(P0[15:0], P1[15:0], P2[15:0],
P3[15,13:0], P4[7:0], P7[7:0],
P8[7:0])
VOH1 CC
VDD – 0.8
VDD – 0.08
–
V
IOH1 = – 4 mA
IOH1 = – 0.5 mA
Output high voltage RPD
VOH2 CC
0
0.3 VDD
0.5 VDD
–
V
IOH2 = – 2 mA
IOH2 = – 750 μA
IOH2 = – 150 μA
Input leakage current (P5[15:0]) (3)
|IOZ1 | CC
–
±0.2
μA
–
Input leakage current
(all except P5[15:0], P2[0], RPD, P3[12],
P3[15])
|IOZ2 | CC
–
±0.5
μA
–
Input leakage current (P2[0]) (4)
|IOZ3 | CC
–
+1.0
–0.5
μA
–
Input leakage current (RPD)
|IOZ4 | CC
–
±3.0
μA
–
Input leakage current ( P3[12], P3[15])
|IOZ5 | CC
–
±1.0
μA
–
Overload current (all except P2[0])
|IOV1 | SR
–
±5
mA
(1) (5)
Overload current (P2[0]) (4)
|IOV2 | SR
–
+5
–1
mA
(1) (5)
RSTIN pull-up resistor
RRST CC
50
250
kΩ
100 kΩ nominal
IRWH
–
–40
μA
VOUT = 2.4 V
IRWL
–500
–
μA
VOUT = 0.4V
IALEL
20
–
μA
VOUT = 0.4V
IALEH
–
300
μA
VOUT = 2.4 V
IP6H
–
–40
μA
VOUT = 2.4 V
Read/Write inactive current (6) (7)
Read/Write active current
ALE inactive current
ALE active current
(6) (8)
(6) (7)
(6) (8)
Port 6 inactive current (P6[4:0]) (6) (7)
(6) (8)
–500
–
μA
VOUT = 0.4V
IP0H
6)
–
–10
μA
VIN = 2.0V
IP0L
7)
–100
–
μA
VIN = 0.8V
Pin Capacitance (Digital inputs / outputs) CIO CC
–
10
pF
(1) (6)
Run Mode Power supply current (9)
(Execution from Internal RAM)
ICC1
–
15 + 1.5
fCPU
mA
–
Run Mode Power supply current (1) (10)
(Execution from Internal Flash)
ICC2
–
15 + 1.5
fCPU
mA
–
Idle mode supply current (11)
IID
–
15 + 0.6
fCPU
mA
–
Port 6 active current (P6[4:0])
PORT0 configuration current (6)
IP6L
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Electrical characteristics
Table 64.
ST10F272B/ST10F272E
DC characteristics (continued)
Limit values
Parameter
Symbol
min.
max.
Unit
Test Condition
Power Down supply current (12)
(RTC off, Oscillators off,
Main Voltage Regulator off)
IPD1
–
200
μA
TA = 25°C
Power Down supply current (12)
(RTC on, Main Oscillator on,
Main Voltage Regulator off)
IPD2
–
400
Typical
Value
μA
TA = 25°C
Power Down supply current (12)
(RTC on, 32kHz Oscillator on,
Main Voltage Regulator off)
IPD3
–
200
μA
TA = 25°C
–
120
μA
VSTBY = 5.5 V
TA = TJ = 25°C
–
500
μA
VSTBY = 5.5 V
TA = TJ = 125°C
–
120
μA
VSTBY = 5.5 V
TA = TJ = 25°C
–
500
μA
VSTBY = 5.5 V
TA = TJ = 125°C
–
2.5
mA
–
Stand-by supply current (12)
(RTC off, Oscillators off, VDD off, VSTBY
on)
ISB1
Stand-by supply current (12)
(RTC on, 32kHz Oscillator on,
main VDD off, VSTBY on)
ISB2
Stand-by supply current (1) (12)
(VDD transient condition)
ISB3
1. Not 100% tested, guaranteed by design characterization.
2. This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float
and the voltage is imposed by the external circuitry.
3. Port 5 leakage values are granted for not selected A/D Converter channel. One channels is always selected (by default,
after reset, P5.0 is selected). For the selected channel the leakage value is similar to that of other port pins.
4. The leakage of P2.0 is higher than other pins due to the additional logic (pass gates active only in specific test modes)
implemented on input path. Pay attention to not stress P2.0 input pin with negative overload beyond the specified limits:
failures in Flash reading may occur (sense amplifier perturbation). Refer to next Figure 36 for a scheme of the input
circuitry.
5. Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the
specified range (i.e. VOV > VDD + 0.3 V or VOV < –0.3 V). The absolute sum of input overload currents on all port pins may
not exceed 50mA. The supply voltage must remain within the specified limits.
6. This specification is only valid during Reset, or during Hold- or Adapt-mode. Port 6 pins are only affected, if they are used
for CS output and the open drain function is not enabled.
7. The maximum current may be drawn while the respective signal line remains inactive.
8. The minimum current must be drawn in order to drive the respective signal line active.
9. The power supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in the Figure 37 below. This parameter is tested at VDDmax and at maximum CPU clock frequency with all
outputs disconnected and all inputs at VIL or VIH, RSTIN pin at VIH1min: this implies I/O current is not considered. The
device is doing the following:
Fetching code from IRAM and XRAM1, accessing in read and write to both XRAM modules
Watchdog Timer is enabled and regularly serviced
RTC is running with main oscillator clock as reference, generating a tick interrupts every 192 clock cycles
Four channel of XPWM are running (waves period: 2, 2.5, 3 and 4 CPU clock cycles): no output toggling
Five General Purpose Timers are running in timer mode with prescaler equal to 8 (T2, T3, T4, T5, T6)
ADC is in Auto Scan Continuous Conversion mode on all 16 channels of Port5
All interrupts generated by XPWM, RTC, Timers and ADC are not serviced
136/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
10. The power supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in the Figure 37 below. This parameter is tested at VDDmax and at maximum CPU clock frequency with all
outputs disconnected and all inputs at VIL or VIH, RSTIN pin at VIH1min: this implies I/O current is not considered. The
device is doing the following:
- Fetching code from all sectors of IFlash, accessing in read (few fetches) and write to XRAM
- Watchdog Timer is enabled and regularly serviced
- RTC is running with main oscillator clock as reference, generating a tick interrupts every 192 clock cycles
- Four channel of XPWM are running (waves period: 2, 2.5, 3 and 4 CPU clock cycles): no output toggling
- Five General Purpose Timers are running in timer mode with prescaler equal to 8 (T2, T3, T4, T5, T6)
- ADC is in Auto Scan Continuous Conversion mode on all 16 channels of Port5
- All interrupts generated by XPWM, RTC, Timers and ADC are not serviced
11. The Idle mode supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in the Figure 36. These parameters are tested and at maximum CPU clock with all outputs disconnected and all
inputs at VIL or VIH, RSTIN pin at VIH1min.
12. This parameter is tested including leakage currents. All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VDD
– 0.1 V to VDD, VAREF = 0 V, all outputs (including pins configured as outputs) disconnected. Besides, the Main Voltage
Regulator is assumed off: in case it is not, additional 1mA shall be assumed.
Figure 36. Port2 test mode structure
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Doc ID 11917 Rev 3
137/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 37. Supply current versus the operating frequency (RUN and IDLE modes)
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
24.6
Electrical characteristics
Flash characteristics
VDD = 5 V ± 10%, VSS = 0 V
Table 65.
Flash characteristics
Parameter
Typical
Maximum
TA = 25°C
TA = 125°C
Unit
Notes
0 cycles(1)
0 cycles(1)
100k cycles
35
80
290
μs
–
60
150
570
μs
–
Bank 0 Program (256K)
(Double Word Program)
1.6
2.0
3.9
s
–
Sector Erase (8K)
0.6
0.5
0.9
0.8
1.0
0.9
s
not preprogrammed
preprogrammed
Sector Erase (32K)
1.1
0.8
2.0
1.8
2.7
2.5
s
not preprogrammed
preprogrammed
Sector Erase (64K)
1.7
1.3
3.7
3.3
5.1
4.7
s
not preprogrammed
preprogrammed
Bank 0 Erase (256K) (3)
5.6
4.0
13.6
11.9
19.2
17.5
s
not preprogrammed
preprogrammed
Recovery from Power-Down (tPD)
–
40
40
μs
Program Suspend Latency (4)
–
10
10
μs
–
30
30
μs
Erase Suspend Request Rate (4)
20
20
20
ms
Set Protection (4)
40
90
300
μs
Word Program (32-bit) (2)
Double Word Program
(64-bit)(2))
Erase Suspend Latency
(4)
(4)
Min delay between 2
requests
1. The figures are given after about 100 cycles due to testing routines (0 cycles at the final customer).
2. Word and Double Word Programming times are provided as average values derived from a full sector programming time:
absolute value of a Word or Double Word Programming time could be longer than the average value.
3. Bank Erase is obtained through a multiple Sector Erase operation (setting bits related to all sectors of the Bank). As
ST10F272 implements only one bank, the Bank Erase operation is equivalent to Module and Chip Erase operations.
4. Not 100% tested, guaranteed by Design Characterization.
Doc ID 11917 Rev 3
139/188
Electrical characteristics
Table 66.
ST10F272B/ST10F272E
Flash data retention characteristics
Data retention time
Number of program / erase cycles
(average ambient temperature 60°C)
(-40°C ≤ TA ≤ 125°C)
256Kbyte (code store)
64Kbyte (EEPROM emulation) (1)
0 - 100
> 20 years
> 20 years
1,000
-
> 20 years
10,000
-
10 years
100,000
-
1 year
1. Two 64Kbyte Flash Sectors may be typically used to emulate up to 4, 8 or 16Kbyte of EEPROM. Therefore, in case of an
emulation of a 16Kbyte EEPROM, 100,000 Flash Program / Erase cycles are equivalent to 800,000 EEPROM
Program/Erase cycles. For an efficient use of the EEPROM Emulation please refer to dedicated Application Note document
(AN2061 - “EEPROM Emulation with ST10F2xx”). Contact your local field service, local sales person or STMicroelectronics
representative to get copy of such a guideline document.
24.7
A/D converter characteristics
VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C, 4.5V ≤ VAREF ≤ VDD,
VSS ≤ VAGND ≤ VSS + 0.2V
Table 67.
A/D converter characteristics
Limit Values
Parameter
Symbol
Unit
min.
Test Condition
max.
Analog Reference voltage 1)
VAREF SR
4.5
VDD
V
Analog Ground voltage
VAGND SR
VSS
VSS + 0.2
V
Analog Input voltage 2)
VAIN SR
VAGND
VAREF
V
Reference supply current
IAREF CC
–
–
5
1
mA
μA
Running mode 3)
Power Down mode
Sample time
tS
CC
1
–
μs
4)
Conversion time
tC
CC
3
–
μs
5)
DNL CC
–1
+1
LSB
No overload
INL CC
–1.5
+1.5
LSB
No overload
OFS CC
–1.5
+1.5
LSB
No overload
Total unadjusted error 6)
TUE CC
–2.0
–5.0
–7.0
+2.0
+5.0
+7.0
LSB
Port5
Port1 - No overload 3)
Port1 - Overload 3)
Coupling Factor between inputs 3) 7)
K
CC
–
10–6
–
On both Port5 and Port1
CP1 CC
–
3
pF
CP2 CC
–
4
6
pF
CS
–
3.5
pF
Differential Non Linearity 6)
Integral Non Linearity
Offset Error
6)
6)
Input Pin Capacitance 3) 8)
Sampling Capacitance 3) 8)
140/188
CC
Doc ID 11917 Rev 3
Port5
Port1
ST10F272B/ST10F272E
Table 67.
Electrical characteristics
A/D converter characteristics
Limit Values
Parameter
Symbol
Unit
min.
Analog Switch Resistance 3) 8)
Test Condition
max.
RSW CC
–
–
600
1600
W
RAD CC
–
1300
W
Port5
Port1
1. VAREF can be tied to ground when A/D Converter is not in use: an extra consumption (around 200μA) on
main VDD is added due to internal analogue circuitry not completely turned off: so, it is suggested to
maintain the VAREF at VDD level even when not in use, and eventually switch off the A/D Converter circuitry
setting bit ADOFF in ADCON register.
2. VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in
these cases will be 0x000H or 0x3FFH, respectively.
3. Not 100% tested, guaranteed by design characterization.
4. During the sample time the input capacitance CAIN can be charged/discharged by the external source. The
internal resistance of the analog source must allow the capacitance to reach its final voltage level within tS.
After the end of the sample time tS, changes of the analog input voltage have no effect on the conversion
result.
Values for the sample clock tS depends on programming and can be taken from Table 68: A/D converter
programming.
5. This parameter includes the sample time tS, the time for determining the digital result and the time to load
the result register with the conversion result. Values for the conversion clock tCC depend on programming
and can be taken from next Table 68.
6. DNL, INL, OFS and TUE are tested at VAREF = 5.0 V, VAGND = 0V, VDD = 5.0 V. It is guaranteed by design
characterization for all other voltages within the defined voltage range.
‘LSB’ has a value of VAREF/1024.
For Port5 channels, the specified TUE (± 2LSB) is guaranteed also with an overload condition (see IOV
specification) occurring on maximum 2 not selected analog input pins of Port5 and the absolute sum of
input overload currents on all Port5 analog input pins does not exceed 10 mA.
For Port1 channels, the specified TUE is guaranteed when no overload condition is applied to Port1 pins:
when an overload condition occurs on maximum 2 not selected analog input pins of Port1 and the input
positive overload current on all analog input pins does not exceed 10 mA (either dynamic or static
injection), the specified TUE is degraded (± 7LSB). To get the same accuracy, the negative injection
current on Port1 pins shall not exceed -1mA in case of both dynamic and static injection.
7. The coupling factor is measured on a channel while an overload condition occurs on the adjacent not
selected channels with the overload current within the different specified ranges (for both positive and
negative injection current).
8. Refer to scheme reported in Figure 39.
24.7.1
Conversion timing control
When a conversion is started, first the capacitances of the converter are loaded via the
respective analog input pin to the current analog input voltage. The time to load the
capacitances is referred to as sample time. Next the sampled voltage is converted to a
digital value several successive steps, which correspond to the 10-bit resolution of the ADC.
During these steps the internal capacitances are repeatedly charged and discharged via the
VAREF pin.
The current that has to be drawn from the sources for sampling and changing charges
depends on the time that each respective step takes, because the capacitors must reach
their final voltage level within the given time, at least with a certain approximation. The
maximum current, however, that a source can deliver, depends on its internal resistance.
The time that the two different actions during conversion take (sampling, and converting)
can be programmed within a certain range in the ST10F272 relative to the CPU clock. The
absolute time that is consumed by the different conversion steps therefore is independent
from the general speed of the controller. This allows adjusting the A/D converter of the
ST10F272 to the properties of the system:
Doc ID 11917 Rev 3
141/188
Electrical characteristics
ST10F272B/ST10F272E
Fast conversion can be achieved by programming the respective times to their absolute
possible minimum. This is preferable for scanning high frequency signals. The internal
resistance of analog source and analog supply must be sufficiently low, however.
High internal resistance can be achieved by programming the respective times to a higher
value, or the possible maximum. This is preferable when using analog sources and supply
with a high internal resistance in order to keep the current as low as possible. The
conversion rate in this case may be considerably lower, however.
The conversion times are programmed via the upper four bits of register ADCON. Bit fields
ADCTC and ADSTC are used to define the basic conversion time and in particular the
partition between sample phase and comparison phases. Table 68 lists the possible
combinations. The timings refer to the unit TCL, where fCPU = 1/2TCL. A complete
conversion time includes the conversion itself, the sample time and the time required to
transfer the digital value to the result register.
Table 68.
A/D converter programming
ADCTC
ADSTC
Sample
Comparison
Extra
Total conversion
00
00
TCL * 120
TCL * 240
TCL * 28
TCL * 388
00
01
TCL * 140
TCL * 280
TCL * 16
TCL * 436
00
10
TCL * 200
TCL * 280
TCL * 52
TCL * 532
00
11
TCL * 400
TCL * 280
TCL * 44
TCL * 724
11
00
TCL * 240
TCL * 480
TCL * 52
TCL * 772
11
01
TCL * 280
TCL * 560
TCL * 28
TCL * 868
11
10
TCL * 400
TCL * 560
TCL * 100
TCL * 1060
11
11
TCL * 800
TCL * 560
TCL * 52
TCL * 1444
10
00
TCL * 480
TCL * 960
TCL * 100
TCL * 1540
10
01
TCL * 560
TCL * 1120
TCL * 52
TCL * 1732
10
10
TCL * 800
TCL * 1120
TCL * 196
TCL * 2116
10
11
TCL * 1600
TCL * 1120
TCL * 164
TCL * 2884
Note:
The total conversion time is compatible with the formula valid for ST10F269, while the
meaning of the bit fields ADCTC and ADSTC is no longer compatible: the minimum
conversion time is 388 TCL, which at 40MHz CPU frequency corresponds to 4.85μs (see
ST10F269).
24.7.2
A/D conversion accuracy
The A/D Converter compares the analog voltage sampled on the selected analog input
channel to its analog reference voltage (VAREF) and converts it into 10-bit digital data. The
absolute accuracy of the A/D conversion is the deviation between the input analog value and
the output digital value. It includes the following errors:
142/188
●
Offset error (OFS)
●
Gain Error (GE)
●
Quantization error
●
Non-Linearity error (Differential and Integral)
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
These four error quantities are explained below using Figure 38.
Offset error
Offset error is the deviation between actual and ideal A/D conversion characteristics when
the digital output value changes from the minimum (zero voltage) 00 to 01 (Figure 38, see
OFS).
Gain error
Gain error is the deviation between the actual and ideal A/D conversion characteristics when
the digital output value changes from the 3FE to the maximum 3FF, once offset error is
subtracted. Gain error combined with offset error represents the so-called full-scale error
(Figure 38, OFS + GE).
Quantization error
Quantization error is the intrinsic error of the A/D converter and is expressed as 1/2 LSB.
Non-linearity error
Non-Linearity error is the deviation between actual and the best-fitting A/D conversion
characteristics (see Figure 38):
●
Differential Non-Linearity error is the actual step dimension versus the ideal one (1
LSBIDEAL).
●
Integral Non-Linearity error is the distance between the center of the actual step and
the center of the bisector line, in the actual characteristics. Note that for Integral NonLinearity error, the effect of offset, gain and quantization errors is not included.
Note:
Bisector characteristic is obtained drawing a line from 1/2 LSB before the first step of the
real characteristic, and 1/2 LSB after the last step again of the real characteristic.
24.7.3
Total unadjusted error
The Total Unadjusted Error specifies the maximum deviation from the ideal characteristic:
the number provided in the Data Sheet represents the maximum error with respect to the
entire characteristic. It is a combination of the Offset, Gain and Integral Linearity errors. The
different errors may compensate each other depending on the relative sign of the Offset and
Gain errors. Refer to Figure 38, see TUE.
Doc ID 11917 Rev 3
143/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 38. A/D conversion characteristic
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24.7.4
Analog reference pins
The accuracy of the A/D converter depends on how accurate is its analog reference: a noise
in the reference results in at least that much error in a conversion. A low pass filter on the
A/D converter reference source (supplied through pins VAREF and VAGND), is recommended
in order to clean the signal, minimizing the noise. A simple capacitive bypassing may be
sufficient in most of the cases; in presence of high RF noise energy, inductors or ferrite
beads may be necessary.
In this architecture, VAREF and VAGND pins represents also the power supply of the analog
circuitry of the A/D converter: there is an effective DC current requirement from the
reference voltage by the internal resistor string in the R-C DAC array and by the rest of the
analog circuitry.
An external resistance on VAREF could introduce error under certain conditions: for this
reasons, series resistance are not advisable, and more in general any series devices in the
filter network should be designed to minimize the DC resistance.
Analog Input pins
To improve the accuracy of the A/D converter, it is definitively necessary that analog input
pins have low AC impedance. Placing a capacitor with good high frequency characteristics
at the input pin of the device, can be effective: the capacitor should be as large as possible,
ideally infinite. This capacitor contributes to attenuating the noise present on the input pin;
144/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
besides, it sources charge during the sampling phase, when the analog signal source is a
high-impedance source.
A real filter, can typically be obtained by using a series resistance with a capacitor on the
input pin (simple RC Filter). The RC filtering may be limited according to the value of source
impedance of the transducer or circuit supplying the analog signal to be measured. The filter
at the input pins must be designed taking into account the dynamic characteristics of the
input signal (bandwidth).
Figure 39. A/D converter input pins scheme
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Input Leakage and external circuit
The series resistor utilized to limit the current to a pin (see RL in Figure 39), in combination
with a large source impedance can lead to a degradation of A/D converter accuracy when
input leakage is present.
Data about maximum input leakage current at each pin are provided in the Data Sheet (see
Section 24: Electrical characteristics). Input leakage is greatest at high operating
temperatures, and in general it decreases by one half for each 10° C decrease in
temperature.
Considering that, for a 10-bit A/D converter one count is about 5mV (assuming VAREF = 5V),
an input leakage of 100nA acting though an RL = 50kΩ of external resistance leads to an
error of exactly one count (5mV); if the resistance were 100kΩ the error would become two
counts.
Eventual additional leakage due to external clamping diodes must also be taken into
account in computing the total leakage affecting the A/D converter measurements. Another
contribution to the total leakage is represented by the charge sharing effects with the
sampling capacitance: being CS substantially a switched capacitance, with a frequency
equal to the conversion rate of a single channel (maximum when fixed channel continuous
conversion mode is selected), it can be seen as a resistive path to ground. For instance,
assuming a conversion rate of 250kHz, with CS equal to 4pF, a resistance of 1MΩ is
obtained (REQ = 1 / fCCS, where fC represents the conversion rate at the considered
channel). To minimize the error induced by the voltage partitioning between this resistance
Doc ID 11917 Rev 3
145/188
Electrical characteristics
ST10F272B/ST10F272E
(sampled voltage on CS) and the sum of RS + RF + RL + RSW + RAD, the external circuit
must be designed to respect the following relation:
Equation 1
R S + R F + R L + R SW + R AD
1
V A ⋅ ------------------------------------------------------------------------------ < --- LSB
R EQ
2
The formula above provides a constraints for external network design, in particular on
resistive path.
A second aspect involving the capacitance network shall be considered. Assuming the three
capacitances CF, CP1 and CP2 initially charged at the source voltage VA (refer to the
equivalent circuit reported in Figure 39), when the sampling phase is started (A/D switch
close), a charge sharing phenomena is installed.
Figure 40. Charge sharing timing diagram during sampling phase
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In particular two different transient periods can be distinguished (see Figure 40):
●
A first and quick charge transfer from the internal capacitance CP1 and CP2 to the
sampling capacitance CS occurs (CS is supposed initially completely discharged):
considering a worst case (since the time constant in reality would be faster) in which
CP2 is reported in parallel to CP1 (call CP = CP1 + CP2), the two capacitance CP and CS
are in series, and the time constant is:
Equation 2
C P ⋅ CS
τ1 = ( R SW + R AD ) ⋅ ----------------------CP + CS
●
This relation can again be simplified considering only CS as an additional worst
condition. In reality, the transient is faster, but the A/D Converter circuitry has been
designed to be robust also in the very worst case: the sampling time TS is always much
longer than the internal time constant:
Equation 3
τ 1 < ( RSW + R AD ) ⋅ CS < < T S
146/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
The charge of CP1 and CP2 is redistributed also on CS, determining a new value of the
voltage VA1 on the capacitance according to the following equation:
Equation 4
V A1 ⋅ ( C S + C P1 + C P2 ) = V A ⋅ ( C P1 + C P2 )
●
A second charge transfer involves also CF (that is typically bigger than the on-chip
capacitance) through the resistance RL: again considering the worst case in which CP2
and CS were in parallel to CP1 (since the time constant in reality would be faster), the
time constant is:
Equation 5
τ 2 < R L ⋅ ( C S + C P1 + C P2 )
In this case, the time constant depends on the external circuit: in particular imposing that the
transient is completed well before the end of sampling time TS, a constraints on RL sizing is
obtained:
Equation 6
10 ⋅ τ2 = 10 ⋅ RL ⋅ ( C S + CP1 + C P2 ) ≤ TS
Of course, RL shall be sized also according to the current limitation constraints, in
combination with RS (source impedance) and RF (filter resistance). Being CF definitively
bigger than CP1, CP2 and CS, then the final voltage VA2 (at the end of the charge transfer
transient) will be much higher than VA1. The following equation must be respected (charge
balance assuming now CS already charged at VA1):
Equation 7
VA2 ⋅( C S + C P1 + C P2 + C F ) = V A ⋅C F + V A1 ⋅( C P1 + C P2 + C S )
The two transients above are not influenced by the voltage source that, due to the presence
of the RFCF filter, is not able to provide the extra charge to compensate the voltage drop on
CS with respect to the ideal source VA; the time constant RFCF of the filter is very high with
respect to the sampling time (TS). The filter is typically designed to act as anti-aliasing (see
Figure 41).
Calling f0 the bandwidth of the source signal (and as a consequence the cut-off frequency of
the anti-aliasing filter, fF), according to Nyquist theorem the conversion rate fC must be at
least 2f0; it means that the constant time of the filter is greater than or at least equal to twice
the conversion period (TC). Again the conversion period TC is longer than the sampling time
TS, which is just a portion of it, even when fixed channel continuous conversion mode is
selected (fastest conversion rate at a specific channel): in conclusion it is evident that the
time constant of the filter RFCF is definitively much higher than the sampling time TS, so the
charge level on CS cannot be modified by the analog signal source during the time in which
the sampling switch is closed.
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Electrical characteristics
ST10F272B/ST10F272E
Figure 41. Anti-aliasing filter and conversion rate
!NALOG3OURCE"ANDWIDTH6!
.OISE
4#d2&#&#ONVERSION2ATEVS&ILTER0OLE
F& F!NTIALIASING&ILTERING#ONDITION
FdF#.YQUIST
F
F
!NTI!LIASING&ILTERF&2#&ILTERPOLE 3AMPLED3IGNAL3PECTRUMF#CONVERSION2ATE
F&
F
F
F#
F
'!0'2)
The considerations above lead to impose new constraints to the external circuit, to reduce
the accuracy error due to the voltage drop on CS; from the two charge balance equations
above, it is simple to derive the following relation between the ideal and real sampled
voltage on CS:
Equation 8
VA
C P1 + C P2 + C F
----------- = -----------------------------------------------------------V A2
C P1 + C P2 + C F + C S
From this formula, in the worst case (when VA is maximum, that is for instance 5V),
assuming to accept a maximum error of half a count (~2.44mV), it is immediately evident a
constraints on CF value:
Equation 9
C F > 2048 ⋅C S
In the next section an example of how to design the external network is provided, assuming
some reasonable values for the internal parameters and making hypothesis on the
characteristics of the analog signal to be sampled.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Example of external network sizing
The following hypothesis are formulated in order to proceed in designing the external
network on A/D Converter input pins:
●
Analog Signal Source Bandwidth (f0):10kHz
●
conversion Rate (fC):25kHz
●
Sampling Time (TS):1μs
●
Pin Input Capacitance (CP1):5pF
●
Pin Input Routing Capacitance (CP2):1pF
●
Sampling Capacitance (CS):4pF
●
Maximum Input Current Injection (IINJ):3mA
●
Maximum Analog Source Voltage (VAM):12V
●
Analog Source Impedance (RS):100Ω
●
Channel Switch Resistance (RSW):500Ω
●
Sampling Switch Resistance (RAD):200Ω
1.
Supposing to design the filter with the pole exactly at the maximum frequency of the
signal, the time constant of the filter is:
Equation 10
1
R C C F = ------------ = 15.9μs
2πf0
2.
Using the relation between CF and CS and taking some margin (4000 instead of 2048),
it is possible to define CF:
Equation 11
C F = 4000 C
⋅ S = 16nF
3.
As a consequence of step 1 and 2, RC can be chosen:
Equation 12
1
RF = --------------------- = 995Ω ≅ 1kΩ
2πf 0 C F
4.
Considering the current injection limitation and supposing that the source can go up to
12V, the total series resistance can be defined as:
Equation 13
V AM
R S + R F + R L = ------------- = 4kΩ
I INJ
from which is now simple to define the value of RL:
Doc ID 11917 Rev 3
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Electrical characteristics
ST10F272B/ST10F272E
Equation 14
V AM
R L = ------------- – R F – R S = 2.9kΩ
I INJ
5.
Now the three element of the external circuit RF, CF and RL are defined. Some
conditions discussed in the previous paragraphs have been used to size the
component, the other must now be verified. The relation which allow to minimize the
accuracy error introduced by the switched capacitance equivalent resistance is in this
case:
Equation 15
1
R EQ = --------------- = 10MΩ
fC CS
So the error due to the voltage partitioning between the real resistive path and CS is less
then half a count (considering the worst case when VA = 5V):
Equation 16
R S + R F + R L + R SW + R AD
1
V A ⋅ --------------------------------------------------------------------------- = 2.35mV < --- LSB
R EQ
2
The other conditions to be verified is the time constants of the transients are really and
significantly shorter than the sampling period duration TS:
Equation 17
τ 1 = ( R SW + R AD ) ⋅ C S = 2.8ns
<< TS = 1μs
10 ⋅τ 2 = 10 ⋅R L⋅( C S + C P1 + C P2 ) = 290ns
< TS = 1μs
For complete set of parameters characterizing the ST10F272 A/D Converter equivalent
circuit, refer to Section 24.7: A/D converter characteristics.
150/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
24.8
AC characteristics
24.8.1
Test waveforms
Figure 42. Input / output waveforms
6
6
9
4E ST0OINTS
6
6
9
'!0'2)
Note:
AC inputs during testing are driven at 2.4V for a logic ‘1’ and 0.4V for a logic ‘0’.
Timing measurements are made at VIH min. for a logic ‘1’ and VIL max for a logic ‘0’.
Figure 43. Float waveforms
9/(
9/(9
9,/!$9
4IMING
2EFERENCE
0OINTS
9,/!$
9,/!$9
9/,9
9/,
'!0'2)
Note:
For timing purposes a port pin is no longer floating when VLOAD changes of ±100mV.
It begins to float when a 100mV change from the loaded VOH/VOL level occurs (IOH/IOL =
20mA).
24.8.2
Definition of internal timing
The internal operation of the ST10F272 is controlled by the internal CPU clock fCPU. Both
edges of the CPU clock can trigger internal (for example pipeline) or external (for example
bus cycles) operations.
The specification of the external timing (AC Characteristics) therefore depends on the time
between two consecutive edges of the CPU clock, called “TCL”.
The CPU clock signal can be generated by different mechanisms. The duration of TCL and
its variation (and also the derived external timing) depends on the mechanism used to
generate fCPU.
This influence must be regarded when calculating the timings for the ST10F272.
The example for PLL operation shown in Figure 44 refers to a PLL factor of 4.
Doc ID 11917 Rev 3
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Electrical characteristics
ST10F272B/ST10F272E
The mechanism used to generate the CPU clock is selected during reset by the logic levels
on pins P0.15-13 (P0H.7-5).
Figure 44. Generation mechanisms for the CPU clock
0HASELOCKEDLOOPOPERATION
F84!,
F#05
4#,4#,
$IRECT#LOCK$RIVE
F84!,
F#05
4#,4#,
0RESCALER/PERATION
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F#05
4#,
4#,
'!0'2)
24.8.3
Clock generation modes
Table 69 associates the combinations of these three bits with the respective clock generation
mode.
Table 69.
On-chip clock generator selections
P0.15-13
CPU Frequency
(P0H.7-5)
fCPU = fXTAL x F
External Clock Input
Range 1) 3)
1
1
1
FXTAL x 4
4 to 8MHz
1
1
0
FXTAL x 3
5.3 to 8MHz
1
0
1
FXTAL x 8
4 to 8MHz
1
0
0
FXTAL x 5
6.4 to 8MHz
0
1
1
FXTAL x 1
1 to 64MHz
0
1
0
FXTAL x 10
4 to 6.4MHz
0
0
1
FXTAL / 2
4 to 8MHz
0
0
0
FXTAL x 16
4MHz
Notes
Default configuration
Direct Drive (oscillator
bypassed) 2)
CPU clock via prescaler 3)
1. The external clock input range refers to a CPU clock range of 1...64 MHz. Besides, the PLL usage is limited
to 4-8MHz. All configurations need a crystal (or ceramic resonator) to generate the CPU clock through the
internal oscillator amplifier (apart from Direct Drive): vice versa, the clock can be forced through an external
clock source only in Direct Drive mode (on-chip oscillator amplifier disabled, so no crystal or resonator can
be used).
2. The maximum depends on the duty cycle of the external clock signal: when 64MHz is used, 50% duty cycle
shall be granted (low phase = high phase = 7.8ns); when 32MHz is selected a 25% duty cycle can be
152/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
accepted (minimum phase, high or low, again equal to 7.8ns).
3. The limits on input frequency are 4-8MHz since the usage of the internal oscillator amplifier is required.
Also when the PLL is not used and the CPU clock corresponds to FXTAL/2, an external crystal or resonator
shall be used: it is not possible to force any clock though an external clock source.
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Electrical characteristics
24.8.4
ST10F272B/ST10F272E
Prescaler operation
When pins P0.15-13 (P0H.7-5) equal ’001’ during reset, the CPU clock is derived from the
internal oscillator (input clock signal) by a 2:1 prescaler.
The frequency of fCPU is half the frequency of fXTAL and the high and low time of fCPU (i.e.
the duration of an individual TCL) is defined by the period of the input clock fXTAL.
The timings listed in the AC Characteristics that refer to TCL therefore can be calculated
using the period of fXTAL for any TCL.
Note that if the bit OWDDIS in SYSCON register is cleared, the PLL runs on its free-running
frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set,
then the PLL is switched off.
24.8.5
Direct drive
When pins P0.15-13 (P0H.7-5) equal ’011’ during reset the on-chip phase locked loop is
disabled, the on-chip oscillator amplifier is bypassed and the CPU clock is directly driven by
the input clock signal on XTAL1 pin.
The frequency of CPU clock (fCPU) directly follows the frequency of fXTAL so the high and
low time of fCPU (i.e. the duration of an individual TCL) is defined by the duty cycle of the
input clock fXTAL.
Therefore, the timings given in this chapter refer to the minimum TCL. This minimum value
can be calculated by the following formula:
Equation 18
TCL min = 1 ⁄ f XTALl xlDC min
DC = duty cycle
For two consecutive TCLs, the deviation caused by the duty cycle of fXTAL is compensated,
so the duration of 2TCL is always 1/fXTAL.
The minimum value TCLmin has to be used only once for timings that require an odd number
of TCLs (1,3,...). Timings that require an even number of TCLs (2,4,...) may use the formula:
Equation 19
2TCL = 1 ⁄ fXTAL
The address float timings in Multiplexed bus mode (t11 and t45) use the maximum duration of
TCL (TCLmax = 1/fXTAL x DCmax) instead of TCLmin.
Similarly to what happen for Prescaler Operation, if the bit OWDDIS in SYSCON register is
cleared, the PLL runs on its free-running frequency and delivers the clock signal for the
Oscillator Watchdog. If bit OWDDIS is set, then the PLL is switched off.
24.8.6
Oscillator watchdog (OWD)
An on-chip watchdog oscillator is implemented in the ST10F272. This feature is used for
safety operation with external crystal oscillator (available only when using direct drive mode
with or without prescaler, so the PLL is not used to generate the CPU clock multiplying the
frequency of the external crystal oscillator). This watchdog oscillator operates as following.
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ST10F272B/ST10F272E
Electrical characteristics
The reset default configuration enables the watchdog oscillator. It can be disabled by setting
the OWDDIS (bit 4) of SYSCON register.
When the OWD is enabled, the PLL runs at its free-running frequency, and it increments the
watchdog counter. On each transition of external clock, the watchdog counter is cleared. If
an external clock failure occurs, then the watchdog counter overflows (after 16 PLL clock
cycles).
The CPU clock signal will be switched to the PLL free-running clock signal, and the oscillator
watchdog Interrupt Request is flagged. The CPU clock will not switch back to the external
clock even if a valid external clock exits on XTAL1 pin. Only a hardware reset (or
bidirectional Software / Watchdog reset) can switch the CPU clock source back to direct
clock input.
When the OWD is disabled, the CPU clock is always the external oscillator clock (in Direct
Drive or Prescaler Operation) and the PLL is switched off to decrease consumption supply
current.
24.8.7
Phase Locked Loop (PLL)
For all other combinations of pins P0.15-13 (P0H.7-5) during reset the on-chip phase locked
loop is enabled and it provides the CPU clock (see Table 69). The PLL multiplies the input
frequency by the factor F which is selected via the combination of pins P0.15-13 (fCPU =
fXTAL x F). With every F’th transition of fXTAL the PLL circuit synchronizes the CPU clock to
the input clock. This synchronization is done smoothly, so the CPU clock frequency does not
change abruptly.
Due to this adaptation to the input clock the frequency of fCPU is constantly adjusted so it is
locked to fXTAL. The slight variation causes a jitter of fCPU which also effects the duration of
individual TCLs.
The timings listed in the AC Characteristics that refer to TCLs therefore must be calculated
using the minimum TCL that is possible under the respective circumstances.
The real minimum value for TCL depends on the jitter of the PLL. The PLL tunes fCPU to
keep it locked on fXTAL. The relative deviation of TCL is the maximum when it is referred to
one TCL period.
This is especially important for bus cycles using wait states and e.g. for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower Baud rates, etc.) the deviation caused by the PLL jitter is
negligible. Refer to next Section 24.8.9: PLL Jitter for more details.
24.8.8
Voltage Controlled Oscillator
The ST10F272 implements a PLL which combines different levels of frequency dividers with
a Voltage Controlled Oscillator (VCO) working as frequency multiplier. In Table 70, a
detailed summary of the internal settings and VCO frequency is reported.
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Electrical characteristics
Table 70.
Internal PLL divider mechanism
P0.15-13
(P0H.7-5)
XTAL
Frequency
1
4 to 8MHz
1
ST10F272B/ST10F272E
1
1
1
0
1
0
1
Input
Prescaler
5.3 to 10.6MHz
1)
4 to 8MHz
1)
PLL
Output
Prescaler
CPU Frequency
fCPU = fXTAL x F
Multiply by
Divide by
FXTAL / 4
64
4
–
FXTAL x 4
FXTAL / 4
48
4
–
FXTAL x 3
FXTAL / 4
64
2
–
FXTAL x 8
FXTAL / 4
40
2
–
FXTAL x 5
–
FXTAL x 1
–
FXTAL x 10
FPLL / 2
FXTAL / 2
–
FXTAL x 16
1
0
0
6.4 to 12MHz
0
1
1
1 to 64MHz
–
0
1
0
4 to 6.4MHz
FXTAL / 2
0
0
1
4 to 12MHz 1)
–
0
0
0
4MHz
FXTAL / 2
PLL bypassed
40
2
PLL bypassed
64
2
The PLL input frequency range is limited to 1 to 3.5MHz, while the VCO oscillation range is
64 to 128MHz. The CPU clock frequency range when PLL is used is 16 to 64MHz.
Example 1
●
FXTAL = 4MHz
●
P0(15:13) = ‘110’ (Multiplication by 3)
●
PLL Input Frequency = 1MHz
●
VCO frequency = 48MHz
●
PLL Output Frequency = 12MHz
(VCO frequency divided by 4)
●
FCPU = 12MHz (no effect of Output Prescaler)
Example 2
24.8.9
●
FXTAL = 8MHz
●
P0(15:13) = ‘100’ (Multiplication by 5)
●
PLL Input Frequency = 2MHz
●
VCO frequency = 80MHz
●
PLL Output Frequency = 40MHz (VCO frequency divided by 2)
●
FCPU = 40MHz (no effect of Output Prescaler)
PLL Jitter
The following terminology is hereafter defined:
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●
Self referred single period jitter
Also called “Period Jitter”, it can be defined as the difference of the Tmax and Tmin,
where Tmax is maximum time period of the PLL output clock and Tmin is the minimum
time period of the PLL output clock.
●
Self referred long term jitter
Also called “N period jitter”, it can be defined as the difference of Tmax and Tmin, where
Tmax is the maximum time difference between N+1 clock rising edges and Tmin is the
minimum time difference between N+1 clock rising edges. Here N should be kept
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
sufficiently large to have the long term jitter. For N=1, this becomes the single period
jitter.
Jitter at the PLL output can be due to the following reasons:
●
Jitter in the input clock
●
Noise in the PLL loop.
Jitter in the input clock
PLL acts like a low pass filter for any jitter in the input clock. Input Clock jitter with the
frequencies within the PLL loop bandwidth is passed to the PLL output and higher frequency
jitter (frequency > PLL bandwidth) is attenuated @20dB/decade.
Noise in the PLL loop
This contribution again can be caused by the following sources:
●
Device noise of the circuit in the PLL
●
Noise in supply and substrate.
Device noise of the circuit in the PLL
The long term jitter is inversely proportional to the bandwidth of the PLL: the wider is the
loop bandwidth, the lower is the jitter due to noise in the loop. Besides, the long term jitter is
practically independent on the multiplication factor.
The most noise sensitive circuit in the PLL circuit is definitively the VCO (Voltage Controlled
Oscillator). There are two main sources of noise: thermal (random noise, frequency
independent so practically white noise) and flicker (low frequency noise, 1/f). For the
frequency characteristics of the VCO circuitry, the effect of the thermal noise results in a 1/f2
region in the output noise spectrum, while the flicker noise in a 1/f3. Assuming a noiseless
PLL input and supposing that the VCO is dominated by its 1/f2 noise, the R.M.S. value of the
accumulated jitter is proportional to the square root of N, where N is the number of clock
periods within the considered time interval.
On the contrary, assuming again a noiseless PLL input and supposing that the VCO is
dominated by its 1/f3 noise, the R.M.S. value of the accumulated jitter is proportional to N,
where N is the number of clock periods within the considered time interval.
The jitter in the PLL loop can be modelized as dominated by the i1/f2 noise for N smaller
than a certain value depending on the PLL output frequency and on the bandwidth
characteristics of loop. Above this first value, the jitter becomes dominated by the i1/f3 noise
component. Lastly, for N greater than a second value of N, a saturation effect is evident, so
the jitter does not grow anymore when considering a longer time interval (jitter stable
increasing the number of clock periods N). The PLL loop acts as a high pass filter for any
noise in the loop, with cutoff frequency equal to the bandwidth of the PLL. The saturation
value corresponds to what has been called self referred long term jitter of the PLL. In
Figure 45 the maximum jitter trend versus the number of clock periods N (for some typical
CPU frequencies) is reported: the curves represent the very worst case, computed taking
into account all corners of temperature, power supply and process variations: the real jitter
is always measured well below the given worst case values.
Noise in supply and substrate
Digital supply noise adds deterministic components to the PLL output jitter, independent on
multiplication factor. Its effects is strongly reduced thanks to particular care used in the
physical implementation and integration of the PLL module inside the device. Anyhow, the
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Electrical characteristics
ST10F272B/ST10F272E
contribution of the digital noise to the global jitter is widely taken into account in the curves
provided in Figure 45.
*ITTER;NS=
Figure 45. ST10F272 PLL jitter
r
r
r
4*)4
.#05CLOCKPERIODS
'!0'2)
24.8.10
PLL lock / unlock
During normal operation, if the PLL gets unlocked for any reason, an interrupt request to the
CPU is generated, and the reference clock (oscillator) is automatically disconnected from
the PLL input: in this way, the PLL goes into free-running mode, providing the system with a
backup clock signal (free running frequency Ffree). This feature allows to recover from a
crystal failure occurrence without risking to go in an undefined configuration: the system is
provided with a clock allowing the execution of the PLL unlock interrupt routine in a safe
mode.
The path between reference clock and PLL input can be restored only by a hardware reset,
or by a bidirectional software or watchdog reset event that forces the RSTIN pin low.
Note:
158/188
The external RC circuit on RSTIN pin shall be properly sized in order to extend the duration
of the low pulse to grant the PLL gets locked before the level at RSTIN pin is recognized
high: bidirectional reset internally drives RSTIN pin low for just 1024 TCL (definitively not
sufficient to get the PLL locked starting from free-running mode).
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Table 71.
Electrical characteristics
PLL characteristics (VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C)
Value
Symbol
Parameter
Conditions
Unit
min.
max.
TPSUP
PLL Start-up time 1)
Stable VDD and reference clock
–
300
μs
TLOCK
PLL Lock-in time
Stable VDD and reference clock,
starting from free-running mode
–
250
μs
TJIT
Single Period Jitter 1)
(cycle to cycle = 2 TCL)
6 sigma time period variation
(peak to peak)
–500
+500
ps
Ffree
PLL free running frequency
Multiplication Factors: 3, 4
Multiplication Factors: 5, 8, 10, 16
250
500
2000
4000
kHz
1. Not 100% tested, guaranteed by design characterization.
Main oscillator specifications
VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C
Table 72.
Main oscillator characteristics
Value
Symbol
Parameter
Conditions
Unit
min.
typ.
max.
1.4
2.6
4.2
mA/V
–
1.5
–
V
–
0.8
–
V
Stable VDD - Crystal
–
6
10
ms
Stable VDD - Resonator
–
1
2
ms
gm
Oscillator
Transconductance
VOSC
Oscillation Amplitude 1)
VAV
Oscillation Voltage level 1) Sine wave middle
tSTUP
Oscillator Start-up Time 1)
Peak to Peak
1. Not 100% tested, guaranteed by design characterization.
Figure 46. Crystal oscillator and resonator connection diagram
84!,
84!,
CRYSTAL
#!
84!,
34&
34&
84!,
24.8.11
2ESONATOR
#!
'!0'2)
Doc ID 11917 Rev 3
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Electrical characteristics
Table 73.
ST10F272B/ST10F272E
Main oscillator negative resistance (module)
CA = 15pF
CA = 25pF
CA = 35pF
min.
typ.
max.
min.
typ.
max.
min.
typ.
max.
4 MHz
545 Ω
1035 Ω
–
550 Ω
1050 Ω
–
430 Ω
850 Ω
–
8 MHz
240 Ω
450 Ω
–
170 Ω
350 Ω
–
120 Ω
250 Ω
–
The given values of CA do not include the stray capacitance of the package and of the
printed circuit board: the negative resistance values are calculated assuming additional 5pF
to the values in the table. The crystal shunt capacitance (C0) and the package capacitance
between XTAL1 and XTAL2 pins is globally assumed equal to 10pF.
The external resistance between XTAL1 and XTAL2 is not necessary, since already present
on the silicon.
24.8.12
32 kHz oscillator specifications
VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C
Table 74.
32kHz oscillator characteristics
Value
Symbol
gm32
Parameter
Conditions
Oscillator Transconductance 1)
VOSC32 Oscillation Amplitude 2)
VAV32
Oscillation Voltage level 2)
tSTUP32 Oscillator Start-up Time 2)
Unit
min.
typ.
max.
Start-up
20
31
50
μA/V
Normal run
8
17
30
μA/V
Peak to Peak
0.5
1.0
2.4
V
Sine wave middle
0.7
0.9
1.2
V
–
1
5
s
Stable VDD
1. At power-on a high current biasing is applied for faster oscillation start-up. Once the oscillation is started,
the current biasing is reduced to lower the power consumption of the system.
2. Not 100% tested, guaranteed by design characterization.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 47. 32kHz crystal oscillator connection diagram
84!,
84!,
34&
CRYSTAL
#!
#!
'!0'2)
Table 75.
Minimum values of negative resistance (module) for 32kHz oscillator
CA = 6pF
32kHz
-
CA = 12pF CA = 15pF CA = 18pF
-
-
-
CA = 22pF CA = 27pF
150 kΩ
CA = 33pF
120 kΩ
90 kW
The given values of CA do not include the stray capacitance of the package and of the
printed circuit board: the negative resistance values are calculated assuming additional 5pF
to the values in the table. The crystal shunt capacitance (C0) and the package capacitance
between XTAL3 and XTAL4 pins is globally assumed equal to 4pF. The external resistance
between XTAL3 and XTAL4 is not necessary, since already present on the silicon.
Warning:
24.8.13
Direct driving on XTAL3 pin is not supported. Always use a
32kHz crystal oscillator.
External clock drive XTAL1
When Direct Drive configuration is selected during reset, it is possible to drive the CPU clock
directly from the XTAL1 pin, without particular restrictions on the maximum frequency, since
the on-chip oscillator amplifier is bypassed. The speed limit is imposed by internal logic that
targets a maximum CPU frequency of 64MHz.
In all other clock configurations (Direct Drive with Prescaler or PLL usage) the on-chip
oscillator amplifier is not bypassed, so it determines the input clock speed limit. Then, when
the on-chip oscillator is enabled it is forbidden to use any external clock source different
from crystal or ceramic resonator.
Doc ID 11917 Rev 3
161/188
Electrical characteristics
Table 76.
External clock drive
Parameter
Symbol
XTAL1 period 1, 2 tOSC SR
Direct drive
fCPU = fXTAL
Direct drive with
prescaler
fCPU = fXTAL / 2
PLL usage
fCPU = fXTAL x F
Unit
min.
max.
min.
max.
min.
max.
15.625
–
83.3
250
83.3
250
ns
time 3
t1
SR
6
–
3
–
6
–
ns
3
t2
SR
6
–
3
–
6
–
ns
time 3
t3
SR
–
2
–
2
–
2
ns
t4
SR
–
2
–
2
–
2
ns
High
Low time
Rise
ST10F272B/ST10F272E
Fall time 3
1. The minimum value for the XTAL1 signal period shall be considered as the theoretical minimum. The real
minimum value depends on the duty cycle of the input clock signal.
2. 4-8 MHz is the input frequency range when using an external clock source. 64 MHz can be applied with an
external clock source only when Direct Drive mode is selected: in this case, the oscillator amplifier is
bypassed so it does not limit the input frequency.
3. The input clock signal must reach the defined levels VIL2 and VIH2.
Figure 48. External clock drive XTAL1
T
T
T
6)(
6),
T
T/3#
'!0'2)
Note:
When Direct Drive is selected, an external clock source can be used to drive XTAL1. The
maximum frequency of the external clock source depends on the duty cycle: when 64MHz is
used, 50% duty cycle shall be granted (low phase = high phase = 7.8ns); when for instance
32MHz is used, a 25% duty cycle can be accepted (minimum phase, high or low, again
equal to 7.8ns).
24.8.14
Memory cycle variables
The tables below use three variables which are derived from the BUSCONx registers and
represent the special characteristics of the programmed memory cycle. Table 77 describes,
how these variables are to be computed.
Table 77.
Memory cycle variables
Description
162/188
Symbol
Values
ALE Extension
tA
TCL x [ALECTL]
Memory Cycle Time wait states
tC
2TCL x (15 - [MCTC])
Memory Tri-state Time
tF
2TCL x (1 - [MTTC])
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
24.8.15
Electrical characteristics
External memory bus timing
The following sections include the External Memory Bus timings. The given values are
computed for a maximum CPU clock of 40MHz.
Obviously, when higher CPU clock frequency is used (up to 64MHz), some numbers in the
timing formulas become zero or negative which, in most cases is not acceptable or not
meaningless at all. In these cases, it is necessary to relax the speed of the bus setting
properly tA, tC and tF.
Note:
All External Memory Bus Timings and SSC Timings reported in the following tables are
granted by Design Characterization and not fully tested in production.
Doc ID 11917 Rev 3
163/188
Electrical characteristics
24.8.16
ST10F272B/ST10F272E
Multiplexed bus
VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C, CL = 50pF,
ALE cycle time = 6 TCL + 2tA + tC + tF (75ns at 40MHz CPU clock without wait states)
Symbol
Multiplexed bus timings
Parameter
FCPU = 40 MHz
TCL = 12.5 ns
Variable CPU Clock
1/2 TCL = 1 to 64MHz
Unit
Table 78.
min.
max.
min.
max.
4 + tA
–
TCL – 8.5 + tA
–
ns
1.5 + tA
–
TCL – 11 + tA
–
ns
t5
CC
ALE high time
t6
CC
Address setup to ALE
t7
CC
Address hold after ALE
4 + tA
–
TCL – 8.5 + tA
–
ns
t8
CC
ALE falling edge to RD, WR
(with RW-delay)
4 + tA
–
TCL – 8.5 + tA
–
ns
t9
CC
ALE falling edge to RD, WR
(no RW-delay)
– 8.5 + tA
–
– 8.5 + tA
–
ns
t10
CC
Address float after RD, WR
(with RW-delay)1
–
6
–
6
ns
t11
CC
Address float after RD, WR
(no RW-delay)1
–
18.5
–
TCL + 6
ns
t12
CC
RD, WR low time
(with RW-delay)
15.5 + tC
–
2TCL – 9.5 + tC
–
ns
t13
CC
RD, WR low time
(no RW-delay)
28 + tC
–
3TCL – 9.5 + tC
–
ns
t14
SR
RD to valid data in
(with RW-delay)
–
6 + tC
–
2TCL – 19 + tC
ns
t15
SR
RD to valid data in
(no RW-delay)
–
18.5 + tC
–
3TCL – 19 + tC
ns
t16
SR
ALE low to valid data in
–
17.5 +
+ tA + tC
–
3TCL – 20 +
+ tA + tC
ns
t17
SR
Address/Unlatched CS to valid
data in
–
20 + 2tA +
+ tC
–
4TCL – 30 +
+ 2tA + tC
ns
t18
SR
Data hold after RD
rising edge
0
–
0
–
ns
t19
SR
Data float after RD1
–
16.5 + tF
–
2TCL – 8.5 + tF
ns
t22
CC
Data valid to WR
10 + tC
–
2TCL – 15 + tC
–
ns
t23
CC
Data hold after WR
4 + tF
–
2TCL – 8.5 + tF
–
ns
t25
CC
ALE rising edge after RD, WR
15 + tF
–
2TCL – 10 + tF
–
ns
t27
CC
Address/Unlatched CS hold
after RD, WR
10 + tF
–
2TCL – 15 + tF
–
ns
t38
CC
ALE falling edge to Latched CS
– 4 – tA
10 – tA
– 4 – tA
10 – tA
ns
164/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Symbol
Multiplexed bus timings (continued)
Parameter
FCPU = 40 MHz
TCL = 12.5 ns
Variable CPU Clock
1/2 TCL = 1 to 64MHz
Unit
Table 78.
Electrical characteristics
min.
max.
min.
max.
–
16.5 + tC +
+ 2tA
–
3TCL – 21 +
+ tC + 2tA
ns
t39
SR
Latched CS low to Valid Data
In
t40
CC
Latched CS hold after RD, WR
27 + tF
–
3TCL – 10.5 + tF
–
ns
t42
CC
ALE fall. edge to RdCS, WrCS
(with RW delay)
7 + tA
–
TCL – 5.5 + tA
–
ns
t43
CC
ALE fall. edge to RdCS, WrCS
(no RW delay)
– 5.5 + tA
–
– 5.5 + tA
–
ns
t44
CC
Address float after RdCS,
WrCS (with RW delay)1
–
1.5
–
1.5
ns
t45
CC
Address float after RdCS,
WrCS (no RW delay)1
–
14
–
TCL + 1.5
ns
t46
SR
RdCS to Valid Data In
(with RW delay)
–
4 + tC
–
2TCL – 21 + tC
ns
t47
SR
RdCS to Valid Data In
(no RW delay)
–
16.5 + tC
–
3TCL – 21 + tC
ns
t48
CC
RdCS, WrCS Low Time
(with RW delay)
15.5 + tC
–
2TCL – 9.5 + tC
–
ns
t49
CC
RdCS, WrCS Low Time
(no RW delay)
28 + tC
–
3TCL – 9.5 + tC
–
ns
t50
CC
Data valid to WrCS
10 + tC
–
2TCL – 15 + tC
–
ns
t51
SR
Data hold after RdCS
0
–
0
–
ns
t52
SR
Data float after RdCS1
–
16.5 + tF
–
2TCL – 8.5 + tF
ns
t54
CC
Address hold after
RdCS, WrCS
6 + tF
–
2TCL – 19 + tF
–
ns
t56
CC
Data hold after WrCS
6 + tF
–
2TCL – 19 + tF
–
ns
Doc ID 11917 Rev 3
165/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 49. External memory cycle: Multiplexed bus, with/without read/write delay, normal ALE
T
T
T
!,%
T
T
T
T
T
T
#3X
T
T
T
!!
!!
"(%
!DDRESS
T
5HDGF\FOH
!DDRESSDATA
BUS0
T
T
T
!DDRESS
$ATAIN
T
T
!DDRESS
T
T
2$
T
T
T
T
:ULWHF\FOH
!DDRESSDATA
BUS0
T
T
$ATAOUT
!DDRESS
T
72
72,
72(
T
T
T
T
'!0'2)
166/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 50. External memory cycle: Multiplexed bus, with/without read/write delay, extended ALE
T
T
T
!,%
T
T
T
T
T
T
#3X
T
T
!!
!!
"(%
!DDRESS
T
5HDGF\FOH
!DDRESS$ATA
"US0
T
T
$ATAIN
!DDRESS
T
T
T
T
T
T
T
2$
T
T
T
:ULWHF\FOH
!DDRESS$ATA
"US0
!DDRESS
$ATAOUT
T
T
72
72,
72(
T
T
T
T
T
T
'!0'2)
Doc ID 11917 Rev 3
167/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 51. External memory cycle: Multiplexed bus, with/without r/w delay, normal ALE, r/w CS
#,+/54
T
T
T
!,%
T
T
T
!!
!!
"(%
!DDRESS
T
T
5HDG&\FOH
!DDRESS$ATA
"US0
T
T
!DDRESS
!DDRESS
$ATA)N
T
T
T
T
2D#3X
T
T
T
T
T
:ULWH&\FOH
!DDRESS$ATA
"US0
T
$ATA/UT
!DDRESS
T
7R#3X
T
T
T
T
168/188
Doc ID 11917 Rev 3
'!0'2)
ST10F272B/ST10F272E
Electrical characteristics
Figure 52. External memory cycle: Multiplexed bus, with/without r/w delay, extended ALE, r/w
CS
#,+/54
T
T
T
!,%
T
T
!!
!!
"(%
!DDRESS
T
5HDGF\FOH
!DDRESS$ATA
"US0
T
T
$ATAIN
!DDRESS
T
T
T
T
T
T
T
2D#3X
T
T
T
:ULWHF\FOH
!DDRESSDATA
BUS0
!DDRESS
$ATAOUT
T
T
T
T
T
T
7R#3X
T
T
'!0'2)
Doc ID 11917 Rev 3
169/188
Electrical characteristics
24.8.17
ST10F272B/ST10F272E
Demultiplexed bus
VDD = 5V ± 10%, VSS = 0V, TA = –40 to +125°C, CL = 50pF,
ALE cycle time = 4 TCL + 2tA + tC + tF (50ns at 40MHz CPU clock without wait states).
Symbol
Demultiplexed bus timings
Parameter
FCPU = 40 MHz
TCL = 12.5 ns
Variable CPU Clock
1/2 TCL = 1 to 64MHz
Unit
Table 79.
min.
max.
min.
max.
4 + tA
–
TCL – 8.5 + tA
–
ns
1.5 + tA
–
TCL – 11 + tA
–
ns
t5
CC
ALE high time
t6
CC
Address setup to ALE
t80
CC
Address/Unlatched CS setup
to RD, WR
(with RW-delay)
12.5 + 2tA
–
2TCL – 12.5 +
+ 2tA
–
ns
t81
CC
Address/Unlatched CS setup
to RD, WR
(no RW-delay)
0.5 + 2tA
–
TCL – 12 + 2tA
–
ns
t12
CC
RD, WR low time
(with RW-delay)
15.5 + tC
–
2TCL – 9.5 + tC
–
ns
t13
CC
RD, WR low time
(no RW-delay)
28 + tC
–
3TCL – 9.5 + tC
–
ns
t14
SR
RD to valid data in
(with RW-delay)
–
6 + tC
–
2TCL – 19 + tC
ns
t15
SR
RD to valid data in
(no RW-delay)
–
18.5 + tC
–
3TCL – 19 + tC
ns
t16
SR
ALE low to valid data in
–
17.5 + tA +
+ tC
–
3TCL – 20 +
+ tA + tC
ns
t17
SR
Address/Unlatched CS to
valid data in
–
20 + 2tA +
+ tC
–
4TCL – 30 +
+ 2tA + tC
ns
t18
SR
Data hold after RD
rising edge
0
–
0
–
ns
t20
SR
Data float after RD rising
edge (with RW-delay)31
–
16.5 + tF
–
2TCL – 8.5 +
+ tF + 2tA
ns
t21
SR
Data float after RD rising
edge (no RW-delay) 1
–
4 + tF
–
TCL – 8.5 +
+ tF + 2tA
ns
t22
CC
Data valid to WR
10 + tC
–
2TCL – 15 + tC
–
ns
t24
CC
Data hold after WR
4 + tF
–
TCL – 8.5 + tF
–
ns
t26
CC
ALE rising edge after RD,
WR
–10 + tF
–
–10 + tF
–
ns
t28
CC
Address/Unlatched CS hold
after RD, WR 2
0 + tF
–
0 + tF
–
ns
t28h
CC
Address/Unlatched CS hold
after WRH
– 5 + tF
–
– 5 + tF
–
ns
170/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Symbol
Demultiplexed bus timings (continued)
Parameter
FCPU = 40 MHz
TCL = 12.5 ns
Variable CPU Clock
1/2 TCL = 1 to 64MHz
min.
max.
min.
max.
Unit
Table 79.
Electrical characteristics
t38
CC
ALE falling edge to Latched
CS
– 4 – tA
6 – tA
– 4 – tA
6 – tA
ns
t39
SR
Latched CS low to Valid Data
In
–
16.5 +
+ tC + 2tA
–
3TCL – 21 +
+ tC + 2tA
ns
t41
CC
Latched CS hold after RD,
WR
2 + tF
–
TCL – 10.5 + tF
–
ns
t82
CC
Address setup to RdCS,
WrCS
(with RW-delay)
14 + 2tA
–
2TCL – 11 + 2tA
–
ns
t83
CC
Address setup to RdCS,
WrCS
(no RW-delay)
2 + 2tA
–
TCL –10.5 + 2tA
–
ns
t46
SR
RdCS to Valid Data In
(with RW-delay)
–
4 + tC
–
2TCL – 21 + tC
ns
t47
SR
RdCS to Valid Data In
(no RW-delay)
–
16.5 + tC
–
3TCL – 21 + tC
ns
t48
CC
RdCS, WrCS Low Time
(with RW-delay)
15.5 + tC
–
2TCL – 9.5 + tC
–
ns
t49
CC
RdCS, WrCS Low Time
(no RW-delay)
28 + tC
–
3TCL – 9.5 + tC
–
ns
t50
CC
Data valid to WrCS
10 + tC
–
2TCL – 15 + tC
–
ns
t51
SR
Data hold after RdCS
0
–
0
–
ns
t53
SR
Data float after RdCS
(with RW-delay) 3
–
16.5 + tF
–
2TCL – 8.5 + tF
ns
t68
SR
Data float after RdCS
(no RW-delay) 3
–
4 + tF
–
TCL – 8.5 + tF
ns
t55
CC
Address hold after
RdCS, WrCS
– 8.5 + tF
–
– 8.5 + tF
–
ns
t57
CC
Data hold after WrCS
2 + tF
–
TCL – 10.5 + tF
–
ns
1. RW-delay and tA refer to the next following bus cycle.
2. Read data are latched with the same clock edge that triggers the address change and the rising RD edge.
Therefore address changes before the end of RD have no impact on read cycles.
3. Partially tested, guaranteed by design characterization.
Doc ID 11917 Rev 3
171/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 53. External memory cycle: Demultiplexed bus, with/without r/w delay, normal ALE
#,+/54
T
T
T
!,%
T
T
T
T
TU
T
#3X
T
!!
!!0
"(%
TORTH
T
!DDRESS
T
5HDGF\FOH
$ATABUS0
$$$$
$ATAIN
T
T
T
T
T
T
2$
T
T
:ULWHF\FOH
$ATABUS0
$$$$
$ATAOUT
T
T
T
72
72,
72(
T
T
T
'!0'2)
172/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 54. Exteral memory cycle: Demultiplexed bus, with/without r/w delay, extended ALE
#,+/54
T
T
T
!,%
T
T
T
T
T
T
#3X
T
T
!!
!!0
"(%
T
!DDRESS
T
5HDGF\FOH
$ATABUS0
$$$$
$ATAIN
T
T
T
T
T
T
2$
T
T
:ULWHF\FOH
$ATABUS0
$$$$
$ATAOUT
T
T
T
72
72,
72(
T
T
T
'!0'2)
Doc ID 11917 Rev 3
173/188
Electrical characteristics
ST10F272B/ST10F272E
Figure 55. External memory cycle: Demultipl. bus, with/without r/w delay, normal ALE, r/w CS
#,+/54
T
T
T
!,%
T
!!
!!0
"(%
T
T
!DDRESS
T
5HDGF\FOH
$ATABUS0
$$$$
$ATAIN
T
T
T
T
T
T
2D#3X
T
T
:ULWHF\FOH
$ATABUS0
$$$$
$ATAOUT
T
T
T
T
7R#3X
T
T
'!0'2)
174/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 56. External memory cycle: Demultiplexed bus, without r/w delay, extended ALE, r/w CS
#,+/54
T
T
T
!,%
T
T
T
!!
!!0
"(%
!DDRESS
T
5HDGF\FOH
$ATABUS0
$$$$
$ATAIN
T
T
T
T
T
T
2D#3X
T
T
:ULWHF\FOH
$ATABUS0
$$$$
$ATAOUT
T
T
T
T
7R#3X
T
T
'!0'2)
Doc ID 11917 Rev 3
175/188
Electrical characteristics
24.8.18
ST10F272B/ST10F272E
CLKOUT and READY
VDD = 5V ± 10%, VSS = 0V, TA = -40 to + 125°C, CL = 50pF
Symbol
CLKOUT and READY timings
FCPU = 40 MHz
TCL = 12.5 ns
Parameter
Variable CPU Clock
1/2 TCL = 1 to 64MHz
min.
max.
min.
max.
Unit
Table 80.
t29
CC
CLKOUT cycle time
25
25
2TCL
2TCL
ns
t30
CC
CLKOUT high time
9
–
TCL – 3.5
–
ns
t31
CC
CLKOUT low time
10
–
TCL – 2.5
–
ns
t32
CC
CLKOUT rise time
–
4
–
4
ns
t33
CC
CLKOUT fall time
–
4
–
4
ns
t34
CC
CLKOUT rising edge to
ALE falling edge
– 2 + tA
8 + tA
– 2 + tA
8 + tA
ns
t35
SR
Synchronous READY
setup time to CLKOUT
17
–
17
–
ns
t36
SR
Synchronous READY
hold time after CLKOUT
2
–
2
–
ns
t37
SR
Asynchronous READY
low time
35
–
2TCL + 10
–
ns
t58
SR
Asynchronous READY
setup time 1
17
–
17
–
ns
t59
SR
Asynchronous READY
hold time 1
2
–
2
–
ns
t60
SR
Async. READY hold time after
RD, WR high (Demultiplexed
Bus) 2
0
2tA + tC + tF
0
2tA + tC + tF
ns
1. These timings are given for characterization purposes only, in order to assure recognition at a specific
clock edge.
2. Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values.
This adds even more time for deactivating READY. 2tA and tC refer to the next following bus cycle, tF refers
to the current bus cycle.
176/188
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 57. CLKOUT and READY
2%!$9
WAITSTATE
2UNNINGCYCLE
#,+/54
T
-584RISTATE
T
T
T
T
T
!,%
2$72
T
3YNCHRONOUS
2%!$9
!SYNCHRONOUS
2%!$9
T
T
T
T
T
T
T
T
T
'!0'2)
1. Cycle as programmed, including MCTC wait states (Example shows 0 MCTC WS).
2. The leading edge of the respective command depends on RW-delay.
3. READY sampled HIGH at this sampling point generates a READY controlled wait state, READY sampled
LOW at this sampling point terminates the currently running bus cycle.
4. READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or
WR).
5. If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to
CLKOUT (e.g. because CLKOUT is not enabled), it must fulfill t37 in order to be safely synchronized. This is
guaranteed, if READY is removed in response to the command (see Note 4).
6. Multiplexed bus modes have a MUX wait state added after a bus cycle, and an additional MTTC wait state
may be inserted here.
For a multiplexed bus with MTTC wait state this delay is two CLKOUT cycles, for a demultiplexed bus
without MTTC wait state this delay is zero.
7. The next external bus cycle may start here.
Doc ID 11917 Rev 3
177/188
Electrical characteristics
24.8.19
ST10F272B/ST10F272E
External bus arbitration
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
External bus arbitration timings
Symbol
FCPU = 40 MHz
TCL = 12.5 ns
Parameter
Variable CPU Clock
1/2 TCL = 1 to 64MHz
min.
max.
min.
max.
t61
SR
HOLD input setup time
to CLKOUT
18.5
–
18.5
–
ns
t62
CC
CLKOUT to HLDA high
or BREQ low delay
–
12.5
–
12.5
ns
t63
CC
CLKOUT to HLDA low
or BREQ high delay
–
12.5
–
12.5
ns
t64
CC
CSx release 1)
–
20
–
20
ns
t65
CC
CSx drive
–4
15
–4
15
ns
–
20
–
20
ns
–4
15
–4
15
ns
t66
CC
Other signals release
t67
CC
Other signals drive
1)
1. Partially tested, guaranteed by design characterization.
Figure 58. External bus arbitration (releasing the bus)
#,+/54
T
(/,$
T
(,$!
T
"2%1
T
#3X
0X
T
/THERS
'!0'2)
1. The ST10F272 will complete the currently running bus cycle before granting bus access.
2. This is the first possibility for BREQ to become active.
3. The CS outputs will be resistive high (pull-up) after t64.
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Unit
Table 81.
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 59. External bus arbitration (regaining the bus)
#,+/54
T
(/,$
T
(,$!
T
"2%1
T
T
T
#3X
/N0X
T
/THER
SIGNALS
'!0'2)
1. This is the last chance for BREQ to trigger the indicated regain-sequence. Even if BREQ is activated
earlier, the regain-sequence is initiated by HOLD going high. Please note that HOLD may also be
deactivated without the ST10F272 requesting the bus.
2. The next ST10F272 driven bus cycle may start here.
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Electrical characteristics
24.8.20
ST10F272B/ST10F272E
High-speed synchronous serial interface (SSC) timing
24.8.20.1 Master mode
VDD = 5V ±10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
Table 82.
Symbol
SSC master mode timings
Max. Baudrate 6.6MBd
(1)
@FCPU = 40MHz
(<SSCBR> = 0002h)
Parameter
Variable Baudrate
(<SSCBR> = 0001h FFFFh)
min.
max.
min.
max.
Unit
t300
CC SSC clock cycle time(2))
150
150
8TCL
262144 TCL
ns
t301
CC SSC clock high time
63
–
t300 / 2 – 12
–
ns
t302
CC SSC clock low time
63
–
t300 / 2 – 12
–
ns
t303
CC SSC clock rise time
–
10
–
10
ns
t304
CC SSC clock fall time
–
10
–
10
ns
t305
CC Write data valid after shift edge
–
15
–
15
ns
t306
CC Write data hold after shift
edge(3)
–2
–
–2
–
ns
t307p
Read data setup time before latch
SR edge, phase error detection on
(SSCPEN = 1)
37.5
–
2TCL + 12.5
–
ns
t308p
Read data hold time after latch
SR edge, phase error detection on
(SSCPEN = 1)
50
–
4TCL
–
ns
t307
Read data setup time before latch
SR edge, phase error detection off
(SSCPEN = 0)
25
–
2TCL
–
ns
t308
Read data hold time after latch
SR edge, phase error detection off
(SSCPEN = 0)
0
–
0
–
ns
1. Maximum Baudrate is in reality 8Mbaud, that can be reached with 64MHz CPU clock and <SSCBR> set to ‘3h’, or with
48MHz CPU clock and <SSCBR> set to ‘2h’. When 40MHz CPU clock is used the maximum baudrate cannot be higher
than 6.6Mbaud (<SSCBR> = ‘2h’) due to the limited granularity of <SSCBR>. Value ‘1h’ for <SSCBR> can be used only
with CPU clock equal to (or lower than) 32MHz.
2. Formula for SSC Clock Cycle time: t300 = 4 TCL x (<SSCBR> + 1) Where <SSCBR> represents the content of the SSC
Baudrate register, taken as unsigned 16-bit integer. Minimum limit allowed for t300 is 125ns (corresponding to 8Mbaud).
3. Partially tested, guaranteed by design characterization.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Electrical characteristics
Figure 60. SSC master timing
T
T
T
3#,+
T
T
T
STOUTBIT
-432
T
T
NDOUTBIT
,ASTOUTBIT
T T
-234
T
T T
ND)NBIT
STINBIT
,ASTINBIT
'!0'2)
1. The phase and polarity of shift and latch edge of SCLK is programmable. Figure 60 uses the leading clock
edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading
clock edge is low-to-high transition (SSCPO = 0b).
2. The bit timing is repeated for all bits to be transmitted or received.
24.8.20.2 Slave mode
VDD = 5V ±10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
Table 83.
SSC slave mode timings
Symbol
Max. Baudrate
6.6 MBd (1))
@FCPU = 40MHz
(<SSCBR> = 0002h)
Parameter
Variable Baudrate
(<SSCBR> = 0001h FFFFh)
min.
max.
min.
max.
Unit
t310
SR SSC clock cycle time(2)
150
150
8TCL
262144 TCL
ns
t311
SR SSC clock high time
63
–
t310 / 2 – 12
–
ns
t312
SR SSC clock low time
63
–
t310 / 2 – 12
–
ns
t313
SR SSC clock rise time
–
10
–
10
ns
t314
SR SSC clock fall time
–
10
–
10
ns
t315
CC Write data valid after shift edge
–
55
–
2TCL + 30
ns
t316
CC Write data hold after shift edge
0
–
0
–
ns
t317p
Read data setup time before latch
SR edge, phase error detection on
(SSCPEN = 1)
62
–
4TCL + 12
–
ns
t318p
Read data hold time after latch
SR edge, phase error detection on
(SSCPEN = 1)
87
–
6TCL + 12
–
ns
Doc ID 11917 Rev 3
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Electrical characteristics
Table 83.
ST10F272B/ST10F272E
SSC slave mode timings (continued)
Symbol
Max. Baudrate
6.6 MBd (1))
@FCPU = 40MHz
(<SSCBR> = 0002h)
Parameter
Variable Baudrate
(<SSCBR> = 0001h FFFFh)
min.
max.
min.
max.
Unit
t317
Read data setup time before latch
SR edge, phase error detection off
(SSCPEN = 0)
6
–
6
–
ns
t318
Read data hold time after latch
SR edge, phase error detection off
(SSCPEN = 0)
31
–
2TCL + 6
–
ns
1. Maximum Baudrate is in reality 8Mbaud, that can be reached with 64MHz CPU clock and <SSCBR> set to ‘3h’, or with
48MHz CPU clock and <SSCBR> set to ‘2h’. When 40MHz CPU clock is used the maximum baudrate cannot be higher
than 6.6Mbaud (<SSCBR> = ‘2h’) due to the limited granularity of <SSCBR>. Value ‘1h’ for <SSCBR> may be used only
with CPU clock lower than 32MHz (after checking that resulting timings are suitable for the master).
2. Formula for SSC Clock Cycle time: t310 = 4 TCL * (<SSCBR> + 1)
Where <SSCBR> represents the content of the SSC Baudrate register, taken as unsigned 16-bit integer.
Minimum limit allowed for t310 is 125ns (corresponding to 8Mbaud).
Figure 61. SSC slave timing
T
T
T
3#,+
T
-234
T
T
T
T
STOUTBIT
NDOUTBIT
T T
-432
STINBIT
T
,ASTOUTBIT
T T
NDINBIT
,ASTINBIT
'!0'2)
1. The phase and polarity of shift and latch edge of SCLK is programmable. Figure 61 uses the leading clock
edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading
clock edge is low-to-high transition (SSCPO = 0b).
2. The bit timing is repeated for all bits to be transmitted or received.
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
25
Package information
Package information
To meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions, and product status are available at www.st.com.
ECOPACK® is an ST trademark.
Doc ID 11917 Rev 3
183/188
Package information
ST10F272B/ST10F272E
Figure 62. PQFP144 mechanical data and package dimension
mm
DIM.
MIN.
inch
TYP.
MAX.
A
MIN.
TYP.
4.07
A1
0.25
A2
3.17
0.160
0.010
3.42
3.67
0.125
0.135
0.144
B
0.22
0.38
0.009
0.015
C
0.13
0.23
0.005
0.009
D
30.95
31.20
31.45
1.219
1.228
1.238
D1
27.90
28.00
28.10
1.098
1.102
1.106
D3
22.75
0.896
e
0.65
0.026
E
30.95
31.20
31.45
1.219
1.228
1.238
E1
27.90
28.00
28.10
1.098
1.102
1.106
E3
22.75
L
OUTLINE AND
MECHANICAL DATA
MAX.
0.65
0.896
0.80
L1
0.95
0.026
1.60
0.031
0.037
0.063
PQFP144
0°(min.), 7°(max.)
K
D
D1
A
D3
A2
A1
108
109
73
72
0.10mm
.004
E
E1
E3
B
B
Seating Plane
37
144
1
36
C
L
L1
e
K
PQFP144
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Doc ID 11917 Rev 3
ST10F272B/ST10F272E
Package information
Figure 63. LQFP144 mechanical data and package dimension
mm
inch
DIM.
MIN.
TYP.
A
MAX.
MIN.
TYP.
1.60
A1
0.05
A2
1.35
B
0.17
C
0.09
0.15
0.002
0.006
1.40
1.45
0.053
0.055
0.057
0.22
0.27
0.007
0.009
0.011
0.20
0.003
0.008
22.00
0.866
D1
20.00
0.787
D3
17.50
0.689
e
0.50
0.020
E
22.00
0.866
E1
20.00
0.787
E3
17.50
0.689
L1
K
0.45
0.60
1.00
0.75
OUTLINE AND
MECHANICAL DATA
0.063
D
L
MAX.
0.018
0.024
0.030
0.0393
3.5˚ (min.), 7˚(max.)
LQFP144Q
(20x20x1.40mm)
Note 1: Exact shape of each corner is optional.
0099183 B
Doc ID 11917 Rev 3
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Ordering information
26
ST10F272B/ST10F272E
Ordering information
Table 84.
Order codes
Part number
Package
F272-BAR-P
Packing
F272-BAR-P-TX
CPU frequency
range (MHz)
E
-40 to +125°C
1 to 64
B
-40 to +125°C
1 to 40
Tape and reel
F272-BAR-T
Tray
LQFP144
186/188
Temperature
range (°C)
Tray
PQFP144
F272-BAR-T-TX
B/E
Type
Tape and reel
Doc ID 11917 Rev 3
ST10F272B/ST10F272E
27
Revision history
Revision history
Table 85.
Document revision history
Date
Revision
Changes
02-November-2004
0.7
Initial release.
24-January-2005
0.8
Chapter 4: CAN1 and CAN2 note about register access possibility
updated (Page 19).
Section 6.1: Decoding of P0L.5 = 1, P0L.4 = 0 description updated
(Page 40).
Chapter 18: Introduction updated clarifying the behaviour of “cyclic
time based interrupt” bullet (Page 147).
Chapter 18: Description of bit RTCAEN of RTCCON register
updated (Page 149).
Chapter 18: Notes referring to RTCCON register description
updated (Page 149).
Chapter 20: Some occurrences of EA corrected in EA.
Section 20.2: Note in “Power-On Reset” paragraph updated,
adding a missing word (Page 157).
Chapter 23: Reset value of IDCHIP, IDMEM and IDPROG registers
corrected (Pages 190 and 194).
Chapter 23: Name of all I2C registers corrected adding prefix “I2C”
(Pages 201 - 202 and 204).
Section 24.5: Note numbering and content in DC Characteristics
table updated (Pages 222 to 225).
29-August-2005
0.9
Updated document to support both ST10F272B and ST10F272E
products.
20-Jul-2006
1
Updated Chapter 24: Electrical characteristics with final
characteristics.
Initial release on www.st.com
12-Dec-2008
2
Added ECOPACK® information.
Replaced TQFP 144 with LQFP 144 throughout document.
Removed -40/+105 °C temperature range and 1-48 CPU
frequency range from Table 63: Package characteristics.
Removed the following order codes from Table 84: F272-BAG5-T,
F272-BAG5-T-TR, and F272-BAGE-T-TR.
01-06-2012
3
Update Table 84.
Reformatted entire document.
Doc ID 11917 Rev 3
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ST10F272B/ST10F272E
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