TI SN74AHCT04PW

SN54AHCT04, SN74AHCT04
HEX INVERTERS
SCLS232N – OCTOBER 1995 – REVISED JULY 2003
D
Inputs Are TTL-Voltage Compatible
Latch-Up Performance Exceeds 250 mA Per
JESD 17
SN54AHCT04 . . . J OR W PACKAGE
SN74AHCT04 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
13
3
12
4
5
6
7
11
10
9
8
1Y
2A
2Y
3A
3Y
14
1Y
1A
NC
VCC
6A
1
2
13 6A
3
12 6Y
4
11 5A
5
10 5Y
9 4A
6
7
8
2A
NC
2Y
NC
3A
4
3
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
2
VCC
6A
6Y
5A
5Y
4A
4Y
VCC
14
4Y
1
SN54AHCT04 . . . FK PACKAGE
(TOP VIEW)
SN74AHCT04 . . . RGY PACKAGE
(TOP VIEW)
1A
1A
1Y
2A
2Y
3A
3Y
GND
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
D
D
NC – No internal connection
description/ordering information
The ’AHCT04 devices contain six independent inverters. These devices perform the Boolean function Y = A.
ORDERING INFORMATION
Tape and reel
SN74AHCT04RGYR
HB04
PDIP – N
Tube
SN74AHCT04N
SN74AHCT04N
Tube
SN74AHCT04D
Tape and reel
SN74AHCT04DR
SOP – NS
Tape and reel
SN74AHCT04NSR
AHCT04
SSOP – DB
Tape and reel
SN74AHCT04DBR
HB04
Tube
SN74AHCT04PW
Tape and reel
SN74AHCT04PWR
TVSOP – DGV
Tape and reel
SN74AHCT04DGVR
HB04
CDIP – J
Tube
SNJ54AHCT04J
SNJ54AHCT04J
CFP – W
Tube
SNJ54AHCT04W
SNJ54AHCT04W
LCCC – FK
Tube
SNJ54AHCT04FK
SNJ54AHCT04FK
TSSOP – PW
–55°C to 125°C
TOP-SIDE
MARKING
QFN – RGY
SOIC – D
–40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
AHCT04
HB04
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AHCT04, SN74AHCT04
HEX INVERTERS
SCLS232N – OCTOBER 1995 – REVISED JULY 2003
logic diagram, each inverter (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54AHCT04
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
5.5
VO
IOH
Output voltage
0
VCC
–8
IOL
∆t/∆v
Low-level output current
High-level input voltage
SN74AHCT04
MIN
2
2
0.8
High-level output current
Input transition rise or fall rate
UNIT
V
V
0.8
V
0
5.5
V
0
VCC
–8
V
mA
8
8
mA
20
20
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SN54AHCT04, SN74AHCT04
HEX INVERTERS
SCLS232N – OCTOBER 1995 – REVISED JULY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
IOH = –50 mA
IOH = –8 mA
45V
4.5
VOL
IOL = 50 mA
IOL = 8 mA
45V
4.5
II
ICC
VI = 5.5 V or GND
VI = VCC or GND,
∆ICC†
One input at 3.4 V,
Other inputs at VCC or GND
MIN
TA = 25°C
TYP
MAX
4.4
4.5
3.94
MIN
MAX
SN74AHCT04
MIN
4.4
4.4
3.8
3.8
MAX
UNIT
V
0.1
0.1
0.1
0.36
0.44
0.44
V
±0.1
±1*
±1
mA
5.5 V
2
20
20
mA
5.5 V
1.35
1.5
1.5
mA
10
pF
0 V to 5.5 V
IO = 0
SN54AHCT04
Ci
VI = VCC or GND
5V
4
10
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
† This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A
Y
CL = 15 pF
tPLH
tPHL
A
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
SN54AHCT04
MIN
MAX
SN74AHCT04
MIN
MAX
4.7**
6.7**
1**
7.5**
1
7.5
4.7**
6.7**
1**
7.5**
1
7.5
5.5
7.7
1
8.5
1
8.5
5.5
7.7
1
8.5
1
8.5
UNIT
ns
ns
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74AHCT04
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.8
V
Quiet output, minimum dynamic VOL
–0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
4.7
V
High-level dynamic input voltage
2
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
V
0.8
V
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
14
UNIT
pF
3
SN54AHCT04, SN74AHCT04
HEX INVERTERS
SCLS232N – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
1.5 V
tPLZ
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPZH
tPLH
50% VCC
3V
Output
Control
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9680401Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-9680401QCA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
5962-9680401QDA
ACTIVE
CFP
W
14
1
TBD
Call TI
Level-NC-NC-NC
SN74AHCT04D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
SN74AHCT04DBLE
OBSOLETE
SSOP
DB
14
SN74AHCT04DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DG4
ACTIVE
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AHCT04NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AHCT04NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PWLE
OBSOLETE
TSSOP
PW
14
SN74AHCT04PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHCT04RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SNJ54AHCT04FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AHCT04J
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AHCT04W
ACTIVE
CFP
W
14
1
TBD
Call TI
Level-NC-NC-NC
TBD
50
TBD
The marketing status values are defined as follows:
Addendum-Page 1
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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