SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination Series/Type: Ordering code: B57620C5103*062 Date: Version: 2009-01-12 3 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left header bar): SMD NTC Thermistor Identification/Classification 2 (header 2 + bottom left header bar): SMD NTC Thermistor with Ni-Barrier Termination Ordering code: (top right header bar) B57620C5103*062 Series/Type: (top right header bar) Preliminary data (optional): (if necessary) Department: SEN NTC PD Date: 2009-01-12 Version: 3 Prepared by: Schwingenschuh Martin Release signed by: Schwingenschuh Martin Release signed QS: Gruber Gerald Modifications/Remarks: Customer, PN: Filename: B57620C5103x062_3. Specification No.: Issue of specification: Date of specification: Date of confirmation of specification by EPCOS: PPAP issue: Flextronics Reliability PPAP date: 12.01.2009 Extended reliability (more than standard) © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Applications - Temperature measurement and compensation for mobile phone applications (e.g. battery pack, TCXO, LCD display) and data systems Features - - Standard EIA chip size 0805 SMD NTC with Ni - Barrier termination (Ag/Ni/Sn) The component is compliant with ROHS (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment) Suitable for lead-free soldering process Electrical Specifications Part Number B57620C5103*062 * = Resistance Tolerance: Zero-Power Resistance (at 25°C) B25/100 B25/85 B25/50 10 kΩ 3730 K ± 3% (3730 K) (3660 K) J for ΔR/R25 = ± 5% K for ΔR/R25 = ± 10% 1) Climatic Category (IEC 60068-1) 55/125/21 Lower category temperature Higher category temperature Power rating at 25°C Dissipation factor (on PCB) Thermal cooling time constant (on PCB) Heat capacity Weigth of component -55°C 125°C 210mW 1) approx. 3.5 mW/K 1) approx. 10 s 1) approx. 35 mJ/K 1) approx. 13 mg P25 Gth Tth Cth Depends on mounting situation Part Dimensions W Type L W T k 0805 2.0±0.20 1.25±0.15 1.30 max. 0.50±0.25 Dimensions in mm L k Term ination Ag/Ni/Sn SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. T Dim ensions in [m m] 2009-01-12 Page 2 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Resistance - Temperature Characteristic R/T-Curve R at 25°C B(25/100) Rn at 25°C 1011 / A01 10000 [Ohm] 3730[K] ± 3 [%] 10000 [Ohm] ± 5 [%] T [°C] -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 R_Nom [Ω] 700 137 499 057 360 153 262 956 194 112 144 787 109 030 82 923 63 591 49 204 38 279 30 029 23 773 18 959 15 207 12 280 10 000 8 178 6 734 5 575 4 636 3 874 3 237 2 720 2 304 1 960 1 674 1 434 1 235 1 067 927,3 809.0 706.2 618.3 542.8 477.9 422.5 R_Min [Ω] R_Max [Ω] ΔR/R25 [±%] ΔT [±°C] 568 416 410 902 300 493 222 162 165 954 125 184 95 279 73 203 56 682 44 263 34 738 27 481 21 931 17 625 14 241 11 581 9 500 7 714 6 312 5 193 4 292 3 566 2 962 2 475 2 085 1 765 1 499 1 278 1 095 941,3 814,3 707.1 614.4 535.6 468.2 410.4 361.3 831 857 587 211 419 813 303 749 222 269 164 391 122 782 92 643 70 500 54 145 41 819 32 577 25 615 20 293 16 173 12 979 10 500 8 642 7 156 5 956 4 979 4 182 3 511 2 965 2 523 2 156 1 848 1 590 1 375 1 192 1 040 910.9 797.9 701.0 617.5 545.4 483.6 18.8 17.7 16.6 15.5 14.5 13.5 12.6 11.7 10.9 10.0 9.2 8.5 7.7 7.0 6.4 5.7 5.0 5.7 6.3 6.8 7.4 8.0 8.5 9.0 9.5 10.0 10.4 10.9 11.3 11.8 12.2 12.6 13.0 13.4 13.8 14.1 14.5 2.7 2.7 2.6 2.5 2.4 2.3 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.2 1.4 1.6 1.8 2.0 2.2 2.5 2.7 2.9 3.1 3.3 3.6 3.8 4.1 4.3 4.6 4.8 5.1 5.4 5.6 5.9 SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 3 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Resistance - Temperature Characteristic R/T-Curve R at 25°C B(25/100) Rn at 25°C 1011 / A01 10000 [Ohm] 3730[K] ± 3 [%] 10000 [Ohm] ± 10 [%] T [°C] -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 R_Nom [Ω] 700 137 499 057 360 153 262 956 194 112 144 787 109 030 82 923 63 591 49 204 38 279 30 029 23 773 18 959 15 207 12 280 10 000 8 178 6 734 5 575 4 636 3 874 3 237 2 720 2 304 1 960 1 674 1 434 1 235 1 067 927.3 809.0 706.2 618.3 542.8 477.9 422.5 R_Min [Ω] R_Max [Ω] ΔR/R25 [±%] ΔT [±°C] 533 410 385 950 282 485 209 015 156 249 117 944 89 828 69 057 53 502 41 803 32 824 25 980 20 742 16 677 13 480 10 967 9 000 7 305 5 975 4 914 4 060 3 372 2 800 2 339 1 970 1 667 1 415 1 206 1 033 888,0 768.0 666.7 579.1 504.6 441.0 386.6 340.2 866 864 612 164 437 820 316 897 231 975 171 630 128 233 967 89 73 680 56 605 43 733 34 079 26 804 21 241 16 933 13 593 11 000 9 050 7 493 6 235 5 211 4 376 3 673 3 101 2 638 2 254 1 932 1 662 1 436 1 246 1 087 951.4 833.2 731.9 644.6 569.3 504.8 23.8 22.7 21.6 20.5 19.5 18.5 17.6 16.7 15.9 15.0 14.2 13.5 12.7 12.0 11.4 10.7 10.0 10.7 11.3 11.8 12.4 13.0 13.5 14.0 14.5 15.0 15.4 15.9 16.3 16.8 17.2 17.6 18.0 18.4 18.8 19.1 19.5 3.5 3.4 3.4 3.3 3.3 3.2 3.2 3.1 3.0 3.0 2.9 2.8 2.8 2.7 2.6 2.5 2.4 2.7 2.9 3.2 3.4 3.6 3.9 4.2 4.4 4.7 5.0 5.2 5.5 5.8 6.1 6.4 6.7 7.0 7.3 7.6 7.9 SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 4 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Reliability Tests of SMD NTC thermistors are made according to IEC 60068. The parts are mounted on standardized PCB in accordance with IEC 60539-1. Test Standard Test conditions IEC 60068-2-2 (=JIS C 0021) Storage at upper category temperature T: 125°C t: 1000h Storage in damp heat, steady state IEC 60068-2-3 (=JIS C 0022) Temperature of air: 40°C relative humidity of air: 93% Duration: 21days Rapid temperature cycling IEC 60068-2-14 (=JIS C 0025) Lower test temperature: -55°C Upper test temperature: 125°C Number of cycles: 10 Endurance at Pmax - Storage in dry heat Solderability Resistance drift after soldering IEC 60068-2-58 (=JIS C 0054) Pmax=210mW Duration: 1000h ΔR25 / R25 (typical) Remarks < 3% < 3% No visible damage < 3% < 5% Solderability: 215°C/3s 235°C/2s Resistance to soldering heat: 260°C/10s 95% of termination wetted reflow soldering profile - < 5% wave soldering profile SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 5 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Mounting Instructions 1. Termination Ni-barrier termination (Ag/Ni/Sn) Inner electrode Base layer - silver Diffusion barrier - nickel Outer layer - tin 2. Recommended geometry of solder pads Size A [mm] 1.3 0805 B B [mm] 1.2 C C [mm] 1.0 D [mm] 3.4 B A A D 3. Requirements for Solderability - Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) : Preconditioning: Immersion into flux F-SW 32. Evaluation criteria: Wetting of soldering areas ≥ 95%. Pb-containing solder: Sn(60)Pb(40) Bath temperature (°C): 215 ± 3 Dwell time (s): 3 ± 0.3 Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9) Bath temperature (°C): 245 ± 5 Dwell time (s): 3 ± 0.3 SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 6 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 - Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) : Preconditioning: Immersion into flux F-SW 32. Evaluation criteria: Leaching of side edges ≤ 1/3. Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9) Bath temperature (°C): 260 ± 5 Dwell time (s): 10 ± 1 4. Recommended soldering profiles Reflow soldering profile: (according to CECC 00802) Temperature characteristics at component terminals during reflow soldering (two cycles are permitted). Wave soldering profile: Temperature characteristics at component terminals during wave soldering can be recommended once in general. SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 7 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 5. Storage conditions Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier termination, provided that the components are stored in the original packages. Storage temperature: -25 ... +45°C Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible. SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 8 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Taping and Packing Taping: Tape and reel packing comply with specifications of IEC 60286-3 Blister tape A D 0 Section A-A P 2 P 0 E F W B0 K0 T A G D1 A 0 P 1 2 D irection of unreeling Dimensions and tolerances: Definition Symbol Dimension (mm) Tol. (mm) Size 0805 Compartment width x Compartments length A 0 x B0 1.6 x 2.4 ± 0.2 Compartment height K0 1.4 max. Overall thickness T2 2.5 max. T 0.3 max. Sprocket hole diameter D0 1.5 +0.1/-0 Compartment hole diameter D1 1.0 min. Sprocket hole pitch P0 4.0 ± 0.1 Distance centre hole to centre compartment P2 2.0 ± 0.05 Pitch of the component compartments P1 4.0 ± 0.1 Tape width W 8.0 ± 0.3 Distance edge to centre of hole E 1.75 ± 0.1 Distance centre hole to centre compartment F 3.5 ± 0.05 Distance edge to centre compartment G 0.75 min. 1) 1) ≤ 0.2 mm over 10 sprocket holes. Part orientation in tape pocket equivalent terminations because of unipolar component SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 9 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Reel Packing: Reel material: PS. Tape material: Blister Tape break force: min. 10N Top cover tape peel force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle between top cover tape and the direction of feed during peel off: 165 -180°. Top cover tape strength: min. 10N Length of tape: Leader section: additional top cover tape, length min 400 mm, before component section (including carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities). Trailer section: length min. 40 mm. Empty part cavities at leader and trailer section on tape are sealed with top cover tape. Cavity play: Each part rests in the cavity so that the angle between the part centreline and the cavity centreline is no more than 20°. Weight of loaded reel: max. 1500 g Packing units: 3000pcs. Package 8 mm tape Definition Symbol Dim. (mm) Tol. (mm) A 180 -3/+0 Reel width (inside) W1 8.4 +1.5/-0 Reel width (outside) W2 14.4 max. Reel diameter SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 10 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Cautions and warnings Storage Store thermistors only in original packaging. Do not open the package before storage. Storage conditions in original packaging: storage temperature -25°C …+45°C, relative humidity ≤ 75% annual mean, maximum 95%, dew precipitation is inadmissible. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. Avoid contamination of thermistors surface during storage, handling and processing. Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc.) After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. Solder thermistors after shipment from EPCOS within the time specified: SMD with nickel barrier termination: 12 months SMD with AgPd termination: 6 months Handling NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs. Components must not be touched with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Soldering Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended. SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 11 of 13 SMD NTC Thermistor SMD NTC Thermistor with Ni-Barrier Termination B57620C5103*062 Mounting When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there must be no mechanical stress caused by thermal expansion during the production process (curing / over molding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing compound and plastic material) are chemically neutral. Electrode must not be scratched before/during/after the mounting process. Contacts and housing used for assembly with thermistor have to be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. Avoid contamination of thermistor surface during processing. Operation Use thermistors only within the specified operating temperature range. Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). Avoid dewing and condensation. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use VDR for limitation of overvoltage condition). SEN NTC PD Please read Cautions and warnings and Important notes at the end of this document. 2009-01-12 Page 12 of 13 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 13 of 13