SDAS002B − MARCH 1984 − REVISED DECEMBER 1994 SN54ALS10A, SN54AS10 . . . J PACKAGE SN74ALS10A, SN74AS10 . . . D OR N PACKAGE (TOP VIEW) Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs 1A 1B 2A 2B 2C 2Y GND description These devices contain three independent 3-input positive-NAND gates. They perform the Boolean functions Y = A • B • C or Y = A + B + C in positive logic. FUNCTION TABLE (each gate) INPUTS B C OUTPUT Y H H H L L X X H X L X H X X L H 2 13 3 12 4 11 5 10 6 9 7 8 VCC 1C 1Y 3C 3B 3A 3Y SN54ALS10A, SN54AS10 . . . FK PACKAGE (TOP VIEW) 2A NC 2B NC 2C 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y NC 3C NC 3B 2Y GND NC 3Y 3A A 14 1B 1A NC VCC The SN54ALS10A and SN54AS10 are characterized for operation over the full military temperature range of − 55°C to 125°C. The SN74ALS10A and SN74AS10 are characterized for operation from 0°C to 70°C. 1 1C • NC − No internal connection logic symbol† 1A 1B 1C 2A 2B 2C 3A 3B 3C 1 logic diagram (positive logic) 1A & 2 12 13 1B 1Y 1C 3 4 6 5 2A 2Y 2B 2C 9 10 8 11 3A 3Y 3B 3C 1 2 12 1Y 13 3 6 4 2Y 5 9 10 8 3Y 11 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the D, J, and N packages. Copyright 1994, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* • DALLAS, TEXAS 75265 • HOUSTON, TEXAS 77251−1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 1 SDAS002B − MARCH 1984 − REVISED DECEMBER 1994 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Operating free-air temperature range, TA: SN54ALS10A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C SN74ALS10A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions SN54ALS10A VCC VIH Supply voltage High-level input voltage SN74ALS10A MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 2 2 UNIT V V VIL Low-level input voltage 0.8‡ 0.7§ IOH IOL High-level output current −0.4 −0.4 mA Low-level output current 4 8 mA 70 °C TA Operating free-air temperature ‡ Applies over temperature range − 55°C to 70°C § Applies over temperature range 70°C to 125°C −55 125 0.8 V 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V to 5.5 V, II = −18 mA IOH = − 0.4 mA VOL VCC = 4.5 V IOL = 4 mA IOL = 8 mA II IIH VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V IIL IO# VCC = 5.5 V, VCC = 5.5 V, VI = 0.4 V VO = 2.25 V ICCH ICCL VCC = 5.5 V, VCC = 5.5 V, VI = 0 VI = 4.5 V SN54ALS10A MIN TYP¶ MAX SN74ALS10A MIN TYP¶ MAX −1.5 −1.5 VCC − 2 VCC − 2 0.25 −20 0.4 V V 0.25 0.4 0.35 0.5 V 0.1 0.1 20 20 µA −0.1 −0.1 mA −112 mA 0.6 mA −112 0.32 UNIT 0.6 −30 0.32 mA 1.2 2.2 1.2 2.2 mA ¶ All typical values are at VCC = 5 V, TA = 25°C. # The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS. 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SDAS002B − MARCH 1984 − REVISED DECEMBER 1994 switching characteristics (see Figure 1) FROM (INPUT) PARAMETER VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† TO (OUTPUT) SN54ALS10A tPLH tPHL A, B, or C Y UNIT SN74ALS10A MIN MAX MIN MAX 2 12 2 11 2 12 2 10 ns † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Operating free-air temperature range, TA: SN54AS10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C SN74AS10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions SN54AS10 SN74AS10 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current −2 −2 mA IOL TA Low-level output current 20 20 mA 70 °C High-level input voltage 2 Operating free-air temperature 2 −55 125 V V 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER SN54AS10 MIN TYP§ MAX TEST CONDITIONS VIK VOH VCC = 4.5 V, VCC = 4.5 V to 5.5 V, II = −18 mA IOH = − 2 mA VOL II VCC = 4.5 V, VCC = 5.5 V, IOL = 20 mA VI = 7 V IIH IIL IO¶ VCC = 5.5 V, VCC = 5.5 V, VI = 2.7 V VI = 0.4 V VCC = 5.5 V, VCC = 5.5 V, VO = 2.25 V VI = 0 ICCH ICCL SN74AS10 MIN TYP§ MAX −1.2 VCC − 2 −1.2 VCC − 2 0.35 0.5 0.35 0.5 V 0.1 mA 20 20 µA −0.5 −0.5 mA −112 mA 2.4 mA −112 1.5 V V 0.1 −30 UNIT 2.4 −30 1.5 VCC = 5.5 V, VI = 4.5 V 8.1 13 8.1 13 mA § All typical values are at VCC = 5 V, TA = 25°C. ¶ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 3 SDAS002B − MARCH 1984 − REVISED DECEMBER 1994 switching characteristics (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A, B, or C Y VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† SN54AS10 SN74AS10 MIN MAX MIN MAX 1 5 1 4.5 1 5 1 4.5 † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. 4 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • UNIT ns SDAS002B − MARCH 1984 − REVISED DECEMBER 1994 PARAMETER MEASUREMENT INFORMATION SERIES 54ALS/74ALS AND 54AS/74AS DEVICES 7V RL = R1 = R2 VCC S1 RL R1 Test Point From Output Under Test CL (see Note A) From Output Under Test RL Test Point CL (see Note A) CL (see Note A) LOAD CIRCUIT FOR BI-STATE TOTEM-POLE OUTPUTS LOAD CIRCUIT FOR OPEN-COLLECTOR OUTPUTS 3.5 V Timing Input Test Point From Output Under Test LOAD CIRCUIT FOR 3-STATE OUTPUTS 3.5 V High-Level Pulse 1.3 V R2 1.3 V 1.3 V 0.3 V 0.3 V tsu Data Input tw th 3.5 V 1.3 V 3.5 V Low-Level Pulse 1.3 V 0.3 V 1.3 V 0.3 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATIONS 3.5 V Output Control (low-level enabling) 1.3 V 1.3 V 0.3 V tPZL Waveform 1 S1 Closed (see Note B) tPLZ 3.5 V Input tPHZ 1.3 V 0.3 V tPHL tPLH VOH In-Phase Output VOL 0.3 V 1.3 V 1.3 V VOL tPLH tPHL VOH 1.3 V 1.3 V [3.5 V 1.3 V tPZH Waveform 2 S1 Open (see Note B) 1.3 V VOH Out-of-Phase Output (see Note C) 0.3 V [0 V 1.3 V 1.3 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. When measuring propagation delay items of 3-state outputs, switch S1 is open. D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%. E. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuits and Voltage Waveforms • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86865012A ACTIVE LCCC FK 20 1 TBD 5962-8686501CA ACTIVE CDIP J 14 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 N / A for Pkg Type 5962-8686501DA ACTIVE CFP W 14 1 TBD JM38510/37002B2A ACTIVE LCCC FK 20 1 TBD JM38510/37002BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54ALS10AJ ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54AS10J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN74ALS10AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ADE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10AN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS10ANE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS10ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS10ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10N ACTIVE PDIP N 14 CU NIPDAU N / A for Pkg Type SN74AS10N3 OBSOLETE PDIP N 14 SN74AS10NE4 ACTIVE PDIP N 14 SN74AS10NSR ACTIVE SO NS 14 POST-PLATE N / A for Pkg Type 25 Pb-Free (RoHS) TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AS10NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AS10NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ALS10AFK ACTIVE LCCC FK 20 1 TBD SNJ54ALS10AJ ACTIVE CDIP J 14 1 TBD SNJ54ALS10AW ACTIVE CFP W 14 1 TBD SNJ54AS10FK ACTIVE LCCC FK 20 1 TBD SNJ54AS10J ACTIVE CDIP J 14 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74ALS10ADR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74ALS10ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74AS10DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AS10NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALS10ADR SOIC D 14 2500 346.0 346.0 33.0 SN74ALS10ANSR SO NS 14 2000 346.0 346.0 33.0 SN74AS10DR SOIC D 14 2500 346.0 346.0 33.0 SN74AS10NSR SO NS 14 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated