SCLS401G − APRIL 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 8.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
D
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
CLR
1Q
1D
2D
2Q
3D
3Q
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
6Q
6D
5D
5Q
4D
4Q
CLK
SN54LV174A . . . FK PACKAGE
(TOP VIEW)
1Q
CLR
NC
VCC
6Q
D
SN54LV174A . . . J OR W PACKAGE
SN74LV174A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
3
The ’LV174A devices are hex D-type flip-flops
designed for 2-V to 5.5-V VCC operation.
1D
2D
NC
2Q
3D
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6D
5D
NC
5Q
4D
3Q
GND
NC
CLK
4Q
These devices are positive-edge-triggered
flip-flops with a direct clear (CLR) input.
Information at the data (D) inputs meeting the
setup time requirements is transferred to the
outputs on the positive-going edge of the clock
pulse. Clock triggering occurs at a particular
voltage level and is not directly related to the
transition time of the positive-going edge of the
clock pulse. When the clock (CLK) input is at
either the high or low level, the D-input signal has
no effect at the output.
4
NC − No internal connection
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube of 40
SN74LV174AD
Reel of 2500
SN74LV174ADR
SOP − NS
Reel of 2000
SN74LV174ANSR
74LV174A
SSOP − DB
Reel of 2000
SN74LV174ADBR
LV174A
Tube of 90
SN74LV174APW
Reel of 2000
SN74LV174APWR
Reel of 250
SN74LV174APWT
TVSOP − DGV
Reel of 2000
SN74LV174ADGVR
LV174A
CDIP − J
Tube of 25
SNJ54LV174AJ
SNJ54LV174AJ
CFP − W
Tube of 150
SNJ54LV174AW
SNJ54LV174AW
SOIC − D
−40°C to 85°C
TSSOP − PW
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV174A
LV174A
LCCC − FK
Tube of 55
SNJ54LV174AFK
SNJ54LV174AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$% !%&% %'(#&% !"(($% & ' )"*+!&% &$, ("! !%'(# )$!'!&% )$( $ $(# ' $-& %("#$% &%&( .&((&%/,
("!% )(!$%0 $ % %$!$&(+/ %!+"$ $%0 ' &++
)&(&#$$(,
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1
SCLS401G − APRIL 1998 − REVISED APRIL 2005
FUNCTION TABLE
INPUTS
CLR
CLK
OUTPUT
Q
D
L
X
X
L
H
↑
H
H
H
↑
L
L
H
L
X
Q0
logic diagram (positive logic)
1
CLR
CLK
1D
9
3
1D
C1
2
1Q
R
To Five Other Channels
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCLS401G − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 4)
SN54LV174A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
Output voltage
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
0
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC × 0.3
0
V
VCC
−50
µA
0
V
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
200
200
100
100
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
V
VCC × 0.3
5.5
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
MAX
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV174A
mA
µA
mA
ns/V
VCC = 4.5 V to 5.5 V
20
20
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV174A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
IOL = 50 µA
IOL = 2 mA
IOL = 6 mA
IOL = 12 mA
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
Ci
VI or VO = 0 to 5.5 V
VI = VCC or GND
MIN
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
II
ICC
VCC
IO = 0
TYP
SN74LV174A
MAX
MIN
2.3 V
VCC−0.1
2
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
1.7
1.7
pF
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3
SCLS401G − APRIL 1998 − REVISED APRIL 2005
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
MIN
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
TA = 25°C
TYP
MAX
SN54LV174A
MIN
MAX
SN74LV174A
MIN
CLR low
6
6.5
6.5
CLK high or low
7
7
7
8.5
9.5
9.5
4
4
4
−0.5
0
0
Data
CLR inactive
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
MIN
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
TA = 25°C
TYP
MAX
SN54LV174A
MIN
MAX
SN74LV174A
MIN
CLR low
5
5
5
CLK high or low
5
5
5
Data
5
6
6
CLR inactive
3
3
3
0
0
0
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
MIN
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
TA = 25°C
TYP
MAX
FROM
(INPUT)
TO
(OUTPUT)
fmax
CLK
Q
CLK
MIN
5
5
5
5
5
Data
4.5
4.5
4.5
CLR inactive
2.5
2.5
2.5
0.5
0.5
0.5
free-air
TA = 25°C
TYP
MAX
SN54LV174A
CL = 15 pF
55*
115*
50*
50
CL = 50 pF
45
90
40
40
CL = 15 pF
Q
CL = 50 pF
ns
ns
ns
range,
MIN
MAX
17.3*
1*
19.5*
1
19.5
8.4*
17.1*
1*
19*
1
19
8.2
21.9
1
23.5
1
23.5
10.8
20.6
1
23
1
23
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
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)$!'!&% &($ $0% 0&+, $-& %("#$% ($$(1$ $ (0 !&%0$ ( !%%"$ $$ )("! ." %!$,
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UNIT
MHz
6.3*
2
POST OFFICE BOX 655303
MAX
UNIT
SN74LV174A
MIN
MIN
MAX
temperature
LOAD
CAPACITANCE
tsk(o)
4
SN74LV174A
5
CLR
tpd
MAX
CLK high or low
CLR
tpd
MIN
CLR low
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
SN54LV174A
2
ns
ns
SCLS401G − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
TYP
MAX
Q
CLK
95*
170*
80*
80
CL = 50 pF
55
130
50
50
CL = 15 pF
CL = 50 pF
MIN
MAX
range,
SN74LV174A
CL = 15 pF
Q
CLK
SN54LV174A
MIN
CLR
tpd
temperature
LOAD
CAPACITANCE
CLR
tpd
free-air
MIN
MAX
MHz
4.5*
11.4*
1*
13.5*
1
13.5
5.8*
11*
1*
13*
1
13
6
14.9
1
17
1
17
7.5
14.5
1
16.5
1
16.5
tsk(o)
UNIT
1.5
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
Q
CLK
MIN
MAX
MIN
240*
110*
110
90
180
80
80
CL = 15 pF
CL = 50 pF
range,
SN74LV174A
130*
Q
CLK
SN54LV174A
CL = 50 pF
CLR
tpd
temperature
CL = 15 pF
CLR
tpd
free-air
MAX
MHz
3*
7.6*
1*
9*
1
9
4.1*
7.2*
1*
8.5*
1
8.5
4.2
9.6
1
11
1
11
5.5
9.2
1
10.5
1
10.5
tsk(o)
UNIT
1
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74LV174A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.34
0.8
V
Quiet output, minimum dynamic VOL
−0.3
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.02
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
15.1
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
14
pF
%'(#&% !%!$(% )("! % $ '(#&1$ (
$0% )&$ ' $1$+)#$%, &(&!$(! && &% $(
)$!'!&% &($ $0% 0&+, $-& %("#$% ($$(1$ $ (0 !&%0$ ( !%%"$ $$ )("! ." %!$,
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5
SCLS401G − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
VOH
50% VCC
VOL
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
Output
Control
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV174AD
ACTIVE
SOIC
D
16
SN74LV174ADBR
ACTIVE
SSOP
DB
SN74LV174ADBRE4
ACTIVE
SSOP
SN74LV174ADBRG4
ACTIVE
SN74LV174ADE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174ANSRG4
ACTIVE
SO
NS
16
2000
TBD
Call TI
SN74LV174APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV174APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2007
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV174ADBR
DB
16
MLA
330
16
8.2
6.6
2.5
12
16
Q1
SN74LV174ADGVR
DGV
16
MLA
330
12
6.8
4.0
1.6
8
16
Q1
SN74LV174ADR
D
16
FMX
0
16
6.5
10.3
12.1
2
16
Q1
SN74LV174ANSR
NS
16
MLA
330
16
8.2
10.5
2.5
12
16
Q1
SN74LV174APWR
PW
16
MLA
330
12
7.0
5.6
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV174ADBR
DB
16
MLA
342.9
336.6
28.58
SN74LV174ADGVR
DGV
16
MLA
338.1
340.5
20.64
SN74LV174ADR
D
16
FMX
342.9
336.6
28.58
SN74LV174ANSR
NS
16
MLA
342.9
336.6
28.58
SN74LV174APWR
PW
16
MLA
338.1
340.5
20.64
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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