PANJIT ES1BF

ES1AF SERIES
SURFACE MOUNT SUPERFAST RECTIFIER
VOLTAGE
50-600 Volts
CURRENT
1 Ampere
FEATURES
•
•
•
•
•
•
•
•
•
For surface mounted applications
Low profile package
Built-in strain relief
Easy pick and place
Plastic package has Underwriters Laboratory Flammability Classification
94V-O
Superfast recovery times for high efficiency
Glass Passivated Chip Junction
Lead free in comply with EU RoHS 2002/95/EC directives.
Green molding compound as per IEC61249 Std. . (Halogen Free)
MECHANICAL DATA
• Case: SMAF molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
• Polarity : Color band denotes cathode end
• Approx. Weight : 0.00116 ounces, 0.0328 grams
1
2
Cathode
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25oC unless otherwise noted)
PAR AME T E R
S YM B OL
ES 1 AF E S 1 B F
ES1CF
E S 1 D F E S 1 E F E S 1 GF
E S 1J F
U N IT S
Re curre nt Pe a k Re ve rse Vo lta g e
V RRM
50
100
150
20 0
300
400
600
V
RMS Volta g e
V RM S
35
70
105
140
210
280
420
V
VR
50
100
150
20 0
300
400
600
V
D C B lo cki ng Vo lta g e
A ve ra g e F o rwa rd C urre nt
IF (AV )
1. 0
A
P e a k F o rwa rd S urg e C urre nt : 8. 3ms si ng le ha lf si ne-wa ve
sup e ri mp o se d o n ra te d lo a d (J E D E C me tho d )
I FS M
30
A
F orwa rd Vo lta ge a t 1 .0 A
VF
0 .9 5
1 .2 5
1 .7
V
D C Re ve rs e C urre nt a t Ra te d
D C B lo cki ng Vo lta g e
T J =2 5 O C
IR
1. 0
A
Typ i ca l Juncti o n ca p a ci ta nc e
V R =4 V,1 MH Z
CJ
15
pF
Typ i ca l The rmal Re si sta nce ,Juncti o n to L e a d (No te 1 )
Juncti o n to A mb i e nt (No te 2 )
R J L
R J A
24
1 50
Re verse Rec o ve ry Ti me a t IF =0 .5 A, IR =1 .0 A ,IRR =0 .2 5 A
trr
35
T J ,T STG
-5 5 to +1 5 0
Op e rat i ng J unct i o n Te mp e ra ture a nd S to ra ge Te mp e ra ture Ra ng e
NOT ES :
O
C / W
nS
O
C
1. Mounted on an FR4 PCB, single-sided copper, with 48cm 2 copper pad area
2. Mounted on an FR4 PCB, single-sided copper, mini pad.
April 10,2012-REV.00
PAGE . 1
ES1AF SERIES
IF, Forward Current (A)
1.2
1
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
CJ, Junction Capacitance (pF)
RATING AND CHARACTERISTIC CURVES
100
10
1
0.1
1
100
ES1AF ~ ES1DF
TA = 125°C
1
0.1
0.01
TA = 75°C
TA = 25°C
0.001
50
100
150
Fig.2 Typical Junction Capacitance
IR,Reverse Current (uA)
IR,Reverse Current (uA)
Fig.1 Forward Current Derating Curve
TA = 150°C
200
100
ES1EF ~ ES1GF
TA = 150°C
10
0.1
0.01
0.001
100
TA = 125°C
10
1
TA = 75°C
0.1
TA = 25°C
0.01
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig.5 Typical Reverse Characteristics
April 10,2012-REV.00
150
200
250
TA = 25°C
300
350
400
Fig.4 Typical Reverse Characteristics
IF, Forward Current (A)
IR,Reverse Current (uA)
TA = 150°C
TA = 75°C
VR , Peak Reverse Voltage (V)
Fig.3 Typical Reverse Characteristics
ES1JF
TA = 125°C
1
VR , Peak Reverse Voltage (V)
100
100
VR, Reverse Bias Voltage (V)
TC, Case Temperature (°C)
10
10
10
ES1AF ~ ES1DF
1
TA = 150°C
TA = 125°C
0.1
TA = 75°C
TA = 25°C
0.01
0
0.2
0.4
0.6
0.8
VF, Forward Voltage (V)
1
Fig.6 Typical Forward Characteristics
PAGE . 2
ES1AF SERIES
10
IF, Forward Current (A)
IF, Forward Current (A)
RATING AND CHARACTERISTIC CURVES
ES1EF ~ ES1GF
TA = 150°C
1
TA = 125°C
TA = 75°C
0.1
TA = 25°C
0.01
0
0.5
1
1.5
VF, Forward Voltage (V)
Fig.7 Typical Forward Characteristics
April 10,2012-REV.00
10
ES1JF
TA = 150°C
1
TA = 125°C
TA = 75°C
0.1
TA = 25°C
0.01
0
0.5
1
1.5
2
VF, Forward Voltage (V)
Fig.8 Typical Forward Characteristics
PAGE . 3
ES1AF SERIES
MOUNTING PAD LAYOUT
SMAF
Unit:inch(mm)
0.232
(5.9)
0.063
(1.6)
0.075
(1.9)
0.106
(2.7)
ORDER INFORMATION
• Packing information
T/R - 10K per 13" plastic Reel
T/R - 3K per 7" plastic Reel
LEGAL STATEMENT
Copyright PanJit International, Inc 2012
The information presented in this document is believed to be accurate and reliable. The specifications and information herein
are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit
does not convey any license under its patent rights or rights of others.
April 10,2012-REV.00
PAGE . 4