深圳市南天星电子科技有限公司 专业代理飞思卡尔 (Freescale) 飞思卡尔主要产品 8 位微控制器 16 位微控制器 数字信号处理器与控制器 i.MX 应用处理器 基于 ARM®技术的 Kinetis MCU 32/64 位微控制器与处理器 模拟与电源管理器件 射频器件（LDMOS，收发器） 传感器（压力，加速度，磁场， 触摸，电池） 飞思卡尔产品主要应用 汽车电子 数据连接 消费电子 工业控制 医疗保健 电机控制 网络 智能能源 深圳市南天星电子科技有限公司 电话：0755－83040796 传真：0755－83040790 邮箱：[email protected] 网址：www.soustar.com.cn 地址：深圳市福田区福明路雷圳大厦 2306 室 MC9S08LC60 MC9S08LC36 Data Sheet: Technical Data HCS08 Microcontrollers MC9S08LC60 Rev. 4 07/2007 freescale.com MC9S08LC60 Series Features 8-Bit HCS08 Central Processor Unit (CPU) • • • • • • 40-MHz HCS08 CPU HC08 instruction set with added BGND instruction Background debugging system Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus two more breakpoints in on-chip debug module) In-Circuit Emulator (ICE) debug module containing two comparators and nine trigger modes. Eight deep FIFO for storing change-of-flow addresses and event-only data. ICE debug module supports both tag and force breakpoints. Support for up to 32 interrupt/reset sources Peripherals • – – • • Memory Options • • • Dual on-chip in-circuit programmable FLASH memories with block protection and security options; 60K and 36K options available Program/erase of one FLASH array while executing from another On-chip random-access memory (RAM); 4K and 2.5K options available • • • • Power-Saving Features • • • Wait plus three stops Software disable of clock monitor and low-voltage interrupt (LVI) for lowest stop current Software-generated real-time clock (RTC) functions using real-time interrupt (RTI) Configurable Clock Source • • Clock source options include crystal, resonator, external clock, or internally generated clock with precision nonvolatile memory (NVM) trimming Automatic clock monitor function • • • • Optional computer operating properly (COP) reset Low-voltage detection with reset or interrupt Illegal opcode detection with reset • Package Options • • • 64-pin low-profile quad flat package (LQFP) 80-pin LQFP 4 x 40 or 3 x 41 (80-pin package) 4 x 32 or 3 x 33 (64-pin package) ACMP (analog comparator) — option to compare to internal reference voltage; output is software selectable to be driven to the input capture of TPM1 channel 0. ADC (analog-to-digital converter) — 8-channel, 12-bit with automatic compare function, asynchronous clock source, temperature sensor and internal bandgap reference channel. ADC is hardware triggerable using the RTI counter. SCI (serial communications interface) — available single-wire mode SPI1 and SPI2 — Two serial peripheral interface modules KBI — Two 8-pin keyboard interrupt modules with software selectable rising or falling edge detect IIC — Inter-integrated circuit bus module capable of operation up to 100 kbps with maximum bus loading; capable of higher baudrates with reduced loading TPM1 and TPM2 — Two timer/pulse-width modulators with selectable input capture, output compare, and edge-aligned PWM capability on each channel. Each timer module may be configured for buffered, centered PWM (CPWM) on all channels. Input/Output System Protection • • • LCD (liquid crystal display driver) — Compatible with 5-V or 3-V LCD glass displays; functional in wait and stop3 low-power modes; selectable frontplane and backplane configurations: Up to 24 general-purpose input/output (I/O) pins; includes two output-only pins and one input-only pin Software selectable pullups on ports when used as input. Selection is on an individual port bit basis. Software selectable slew rate control on ports when used as outputs (selection is on an individual port bit basis) Software selectable drive strength control on ports when used as outputs (selection is on an individual port bit basis) Internal pullup on RESET and IRQ pin to reduce customer system cost MC9S08LC60 Series Data Sheet Covers MC9S08LC60 MC9S08LC36 MC9S08LC60 Rev. 4 07/2007 This document contains information on a new product. Specifications and information herein are subject to change without notice. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2007. All rights reserved. Revision History To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://freescale.com The following revision history table summarizes changes contained in this document. Revision Number Revision Date 1 02/2007 Initial advance information release. 2 05/2007 Incorporated changes to the LCDSupply Field Descriptions for the CPCADJ field, added a Run Idd chart, performed some minor formatting edits and fixed a couple of typos. 3 06/2007 Updated the Appendix with ESD tables, package info, and mechanical drawings. 4 07/2007 Updated the Appendix with ESD tables, package info, and mechanical drawings for the 80-pin LQFP package. Description of Changes This product incorporates SuperFlash® technology licensed from SST. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2007. All rights reserved. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 6 Freescale Semiconductor List of Chapters Chapter Title Page Chapter 1 Device Overview .............................................................................. 21 Chapter 2 Pins and Connections ..................................................................... 25 Chapter 3 Modes of Operation ......................................................................... 33 Chapter 4 Memory ............................................................................................. 39 Chapter 5 Resets, Interrupts, and System Configuration ............................. 63 Chapter 6 Parallel Input/Output ....................................................................... 81 Chapter 7 Keyboard Interrupt (S08KBIV2) ...................................................... 95 Chapter 8 Central Processor Unit (S08CPUV2) ............................................ 103 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) .................................. 123 Chapter 10 Internal Clock Generator (S08ICGV4) .......................................... 169 Chapter 11 Timer Pulse-Width Modulator (S08TPMV2) ................................. 197 Chapter 12 Serial Communications Interface (S08SCIV3)............................. 213 Chapter 13 Serial Peripheral Interface (S08SPIV3) ........................................ 233 Chapter 14 Inter-Integrated Circuit (S08IICV1) ............................................... 249 Chapter 15 Analog-to-Digital Converter (S08ADC12V1)................................ 267 Chapter 16 Analog Comparator (S08ACMPV2) .............................................. 293 Chapter 17 Development Support ................................................................... 301 Appendix A Electrical Characteristics.............................................................. 323 Appendix B Ordering Information and Mechanical Drawings........................ 351 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 7 Table of Contents Section Number Title Page Chapter 1 Device Overview 1.1 1.2 1.3 1.4 Introduction .....................................................................................................................................21 Devices in the MC9S08LC60 Series ...............................................................................................21 MCU Block Diagram ......................................................................................................................22 System Clock Distribution ..............................................................................................................23 Chapter 2 Pins and Connections 2.1 2.2 2.3 Introduction .....................................................................................................................................25 Device Pin Assignment ...................................................................................................................25 Recommended System Connections ...............................................................................................27 2.3.1 Power (VDD, VSS, VDDAD, VSSAD) ...............................................................................29 2.3.2 ADC Reference Pins (VREFH, VREFL) ...........................................................................29 2.3.3 Oscillator (XTAL, EXTAL) ............................................................................................29 RESET Pin ......................................................................................................................30 2.3.4 2.3.5 Background / Mode Select (BKGD/MS) .......................................................................30 2.3.6 LCD Pins ........................................................................................................................31 2.3.6.1 LCD Power Pins .............................................................................................31 2.3.6.2 LCD Frontplane and Backplane Driver Pins ..................................................31 2.3.7 General-Purpose I/O and Peripheral Ports .....................................................................31 Chapter 3 Modes of Operation 3.1 3.2 3.3 3.4 3.5 3.6 Introduction .....................................................................................................................................33 Features ...........................................................................................................................................33 Run Mode ........................................................................................................................................33 Active Background Mode ................................................................................................................33 Wait Mode .......................................................................................................................................34 Stop Modes ......................................................................................................................................35 3.6.1 Stop3 Mode ....................................................................................................................35 3.6.1.1 LVD Enabled in Stop Mode ............................................................................36 3.6.1.2 Active BDM Enabled in Stop Mode ...............................................................36 3.6.2 Stop2 Mode ....................................................................................................................36 3.6.3 Stop1 Mode ....................................................................................................................37 3.6.4 On-Chip Peripheral Modules in Stop Modes .................................................................37 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 9 Section Number Title Page Chapter 4 Memory 4.1 4.2 4.3 4.4 4.5 4.6 MC9S08LC60 Series Memory Map ...............................................................................................39 4.1.1 Reset and Interrupt Vector Assignments ........................................................................40 Register Addresses and Bit Assignments ........................................................................................42 RAM ................................................................................................................................................47 FLASH ............................................................................................................................................48 4.4.1 Features ...........................................................................................................................49 4.4.2 Program and Erase Times ...............................................................................................49 4.4.3 Program and Erase Command Execution .......................................................................50 4.4.4 Burst Program Execution ...............................................................................................51 4.4.5 Access Errors ..................................................................................................................53 4.4.6 FLASH Block Protection ...............................................................................................53 4.4.7 Vector Redirection ..........................................................................................................54 Security ............................................................................................................................................54 FLASH Registers and Control Bits .................................................................................................56 4.6.1 FLASH Clock Divider Register (FCDIV) ......................................................................56 4.6.2 FLASH Options Register (FOPT and NVOPT) .............................................................57 4.6.3 FLASH Configuration Register (FCNFG) .....................................................................58 4.6.4 FLASH Protection Register (FPROT and NVPROT) ....................................................58 4.6.5 FLASH Status Register (FSTAT) ...................................................................................60 4.6.6 FLASH Command Register (FCMD) ............................................................................61 Chapter 5 Resets, Interrupts, and System Configuration 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 Introduction .....................................................................................................................................63 Features ...........................................................................................................................................63 MCU Reset ......................................................................................................................................63 Computer Operating Properly (COP) Watchdog .............................................................................64 Interrupts .........................................................................................................................................65 5.5.1 Interrupt Stack Frame .....................................................................................................66 5.5.2 External Interrupt Request (IRQ) Pin .............................................................................67 5.5.2.1 Pin Configuration Options ..............................................................................67 5.5.2.2 Edge and Level Sensitivity ..............................................................................67 5.5.3 Interrupt Vectors, Sources, and Local Masks .................................................................67 Low-Voltage Detect (LVD) System ................................................................................................69 5.6.1 Power-On Reset Operation .............................................................................................69 5.6.2 LVD Reset Operation .....................................................................................................69 5.6.3 LVD Interrupt Operation ................................................................................................69 5.6.4 Low-Voltage Warning (LVW) ........................................................................................69 Real-Time Interrupt (RTI) ...............................................................................................................69 Reset, Interrupt, and System Control Registers and Control Bits ...................................................70 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC) .........................................70 5.8.2 System Reset Status Register (SRS) ...............................................................................72 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 10 Freescale Semiconductor Section Number 5.8.3 5.8.4 5.8.5 5.8.6 5.8.7 5.8.8 5.8.9 5.8.10 Title Page System Background Debug Force Reset Register (SBDFR) ..........................................73 System Options Register (SOPT1) .................................................................................73 System Options Register (SOPT2) .................................................................................74 System Device Identification Register (SDIDH, SDIDL) ..............................................75 System Real-Time Interrupt Status and Control Register (SRTISC) .............................76 System Power Management Status and Control 1 Register (SPMSC1) .........................77 System Power Management Status and Control 2 Register (SPMSC2) .........................78 System Power Management Status and Control 3 Register (SPMSC3) .........................79 Chapter 6 Parallel Input/Output 6.1 6.2 Pin Behavior in Stop Modes ............................................................................................................83 Parallel I/O Registers .......................................................................................................................83 6.2.1 Port A Registers ..............................................................................................................83 6.2.1.1 Port A Data Registers (PTAD) ........................................................................84 6.2.1.2 Port A Data Direction Registers (PTADD) .....................................................84 6.2.2 Port A Control Registers ................................................................................................85 6.2.2.1 Internal Pullup Enable (PTAPE) .....................................................................85 6.2.2.2 Output Slew Rate Control Enable (PTASE) ...................................................86 6.2.2.3 Output Drive Strength Select (PTADS) ..........................................................86 6.2.3 Port B Registers ..............................................................................................................87 6.2.3.1 Port B Data Registers (PTBD) ........................................................................87 6.2.3.2 Port B Data Direction Registers (PTBDD) .....................................................88 6.2.4 Port B Control Registers .................................................................................................88 6.2.4.1 Internal Pullup Enable (PTBPE) .....................................................................88 6.2.4.2 Output Slew Rate Control Enable (PTBSE) ...................................................89 6.2.4.3 Output Drive Strength Select (PTBDS) ..........................................................90 6.2.5 Port C Registers ..............................................................................................................90 6.2.5.1 Port C Data Registers (PTCD) ........................................................................91 6.2.5.2 Port C Data Direction Registers (PTCDD) .....................................................91 6.2.6 Port C Control Registers .................................................................................................91 6.2.6.1 Internal Pullup Enable (PTCPE) .....................................................................92 6.2.6.2 Output Slew Rate Control Enable (PTCSE) ...................................................93 6.2.6.3 Output Drive Strength Select (PTCDS) ..........................................................93 Chapter 7 Keyboard Interrupt (S08KBIV2) 7.1 Introduction .....................................................................................................................................95 7.1.1 Features ...........................................................................................................................97 7.1.2 Modes of Operation ........................................................................................................97 7.1.2.1 KBI in Wait Mode ...........................................................................................97 7.1.2.2 KBI in Stop Modes .........................................................................................97 7.1.2.3 KBI in Active Background Mode ...................................................................97 7.1.3 Block Diagram ................................................................................................................97 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 11 Section Number 7.2 7.3 7.4 Title Page External Signal Description ............................................................................................................98 Register Definition ..........................................................................................................................99 7.3.1 KBIx Status and Control Register (KBIxSC) .................................................................99 7.3.2 KBIx Pin Enable Register (KBIxPE) .............................................................................99 7.3.3 KBIx Edge Select Register (KBIxES) ..........................................................................100 Functional Description ..................................................................................................................100 7.4.1 Edge Only Sensitivity ...................................................................................................101 7.4.2 Edge and Level Sensitivity ...........................................................................................101 7.4.3 KBI Pullup/Pulldown Resistors ....................................................................................101 7.4.4 KBI Initialization ..........................................................................................................101 Chapter 8 Central Processor Unit (S08CPUV2) 8.1 8.2 8.3 8.4 8.5 Introduction ...................................................................................................................................103 8.1.1 Features .........................................................................................................................103 Programmer’s Model and CPU Registers .....................................................................................104 8.2.1 Accumulator (A) ...........................................................................................................104 8.2.2 Index Register (H:X) ....................................................................................................104 8.2.3 Stack Pointer (SP) .........................................................................................................105 8.2.4 Program Counter (PC) ..................................................................................................105 8.2.5 Condition Code Register (CCR) ...................................................................................105 Addressing Modes .........................................................................................................................107 8.3.1 Inherent Addressing Mode (INH) ................................................................................107 8.3.2 Relative Addressing Mode (REL) ................................................................................107 8.3.3 Immediate Addressing Mode (IMM) ...........................................................................107 8.3.4 Direct Addressing Mode (DIR) ....................................................................................107 8.3.5 Extended Addressing Mode (EXT) ..............................................................................108 8.3.6 Indexed Addressing Mode ............................................................................................108 8.3.6.1 Indexed, No Offset (IX) ................................................................................108 8.3.6.2 Indexed, No Offset with Post Increment (IX+) .............................................108 8.3.6.3 Indexed, 8-Bit Offset (IX1) ...........................................................................108 8.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+) .......................................108 8.3.6.5 Indexed, 16-Bit Offset (IX2) .........................................................................108 8.3.6.6 SP-Relative, 8-Bit Offset (SP1) ....................................................................108 8.3.6.7 SP-Relative, 16-Bit Offset (SP2) ..................................................................109 Special Operations .........................................................................................................................109 8.4.1 Reset Sequence .............................................................................................................109 8.4.2 Interrupt Sequence ........................................................................................................109 8.4.3 Wait Mode Operation ...................................................................................................110 8.4.4 Stop Mode Operation ...................................................................................................110 8.4.5 BGND Instruction ........................................................................................................111 HCS08 Instruction Set Summary ..................................................................................................112 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 12 Freescale Semiconductor Section Number Title Page Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.1 9.2 9.3 9.4 9.5 Introduction ...................................................................................................................................123 9.1.1 Features .........................................................................................................................125 9.1.2 Modes of Operation ......................................................................................................125 9.1.3 Block Diagram ..............................................................................................................126 External Signal Description ..........................................................................................................127 9.2.1 BP[2:0] .........................................................................................................................127 9.2.2 FP[39:0] ........................................................................................................................127 9.2.3 BP3/FP40 ......................................................................................................................127 9.2.4 VLCD .............................................................................................................................127 9.2.5 VLL1, VLL2, VLL3 ........................................................................................................127 9.2.6 Vcap1, Vcap2 ...............................................................................................................128 Register Definition ........................................................................................................................128 9.3.1 LCD Control Register 0 (LCDCR0) .............................................................................128 9.3.2 LCD Control Register 1 (LCDCR1) .............................................................................129 9.3.3 LCD Frontplane Enable Registers 0–5 (FPENR0–FPENR5) ......................................130 9.3.4 LCDRAM Registers (LCDRAM) ................................................................................131 9.3.4.1 LCDRAM Registers as On/Off Selector (LCDDRMS = 0) .........................133 9.3.4.2 LCDRAM Registers as Blink Enable/Disable (LCDDRMS = 1) .................133 9.3.5 LCD Clock Source Register (LCDCLKS) ...................................................................133 9.3.6 LCD Voltage Supply Register (LCDSUPPLY) ............................................................134 9.3.7 LCD Blink Control Register (LCDBCTL) ...................................................................135 9.3.8 LCD Command and Status Register (LCDCMD) ........................................................136 Functional Description ..................................................................................................................137 9.4.1 LCD Driver Description ...............................................................................................138 9.4.1.1 LCD Duty Cycle ...........................................................................................138 9.4.1.2 LCD Bias ......................................................................................................139 9.4.1.3 LCD Module Waveform Base Clock and Frame Frequency ........................139 9.4.1.4 LCD Waveform Examples ............................................................................141 9.4.2 LCDRAM Registers .....................................................................................................149 9.4.2.1 LCDRAM Data Clear Command ..................................................................149 9.4.2.2 LCDRAM Data Blank Command .................................................................149 9.4.3 LCD Blinking ...............................................................................................................149 9.4.3.1 LCD Segment Blinking .................................................................................150 9.4.3.2 Blink Frequency ............................................................................................150 9.4.4 LCD Charge Pump, Voltage Divider, and Power Supply Operation ............................150 9.4.4.1 LCD Charge Pump and Voltage Divider .......................................................152 9.4.4.2 LCD Power Supply and Voltage Buffer Configuration .................................153 9.4.5 Resets ............................................................................................................................155 9.4.6 Interrupts .......................................................................................................................155 Initialization Section .....................................................................................................................155 9.5.1 Initialization Sequence .................................................................................................156 9.5.2 Initialization Examples .................................................................................................157 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 13 Section Number 9.6 Title Page 9.5.2.1 Initialization Example 1 ................................................................................158 9.5.2.2 Initialization Example 2 ................................................................................159 9.5.2.3 Initialization Example 3 ................................................................................161 9.5.2.4 Initialization Example 4 ................................................................................162 Application Information ................................................................................................................163 9.6.1 LCD Seven Segment Example Description ..................................................................163 9.6.1.1 LCD Module Waveforms ..............................................................................165 9.6.1.2 Segment On Driving Waveform ....................................................................166 9.6.1.3 Segment Off Driving Waveform ...................................................................166 9.6.2 LCD Contrast Control ..................................................................................................166 9.6.3 LCD Power Consumption ............................................................................................167 Chapter 10 Internal Clock Generator (S08ICGV4) 10.1 Introduction ...................................................................................................................................169 10.2 Introduction ...................................................................................................................................171 10.2.1 Features .........................................................................................................................171 10.2.2 Modes of Operation ......................................................................................................172 10.2.3 Block Diagram ..............................................................................................................173 10.3 External Signal Description ..........................................................................................................173 10.3.1 EXTAL — External Reference Clock / Oscillator Input ..............................................173 10.3.2 XTAL — Oscillator Output ..........................................................................................173 10.3.3 External Clock Connections .........................................................................................174 10.3.4 External Crystal/Resonator Connections ......................................................................174 10.4 Register Definition ........................................................................................................................175 10.4.1 ICG Control Register 1 (ICGC1) .................................................................................175 10.4.2 ICG Control Register 2 (ICGC2) .................................................................................177 10.4.3 ICG Status Register 1 (ICGS1) ....................................................................................178 10.4.4 ICG Status Register 2 (ICGS2) ....................................................................................179 10.4.5 ICG Filter Registers (ICGFLTU, ICGFLTL) ...............................................................179 10.4.6 ICG Trim Register (ICGTRM) .....................................................................................180 10.5 Functional Description ..................................................................................................................180 10.5.1 Off Mode (Off) .............................................................................................................181 10.5.1.1 BDM Active ..................................................................................................181 10.5.1.2 OSCSTEN Bit Set .........................................................................................181 10.5.1.3 Stop/Off Mode Recovery ..............................................................................181 10.5.2 Self-Clocked Mode (SCM) ...........................................................................................181 10.5.3 FLL Engaged, Internal Clock (FEI) Mode ...................................................................182 10.5.4 FLL Engaged Internal Unlocked ..................................................................................183 10.5.5 FLL Engaged Internal Locked ......................................................................................183 10.5.6 FLL Bypassed, External Clock (FBE) Mode ...............................................................183 10.5.7 FLL Engaged, External Clock (FEE) Mode .................................................................183 10.5.7.1 FLL Engaged External Unlocked .................................................................184 10.5.7.2 FLL Engaged External Locked .....................................................................184 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 14 Freescale Semiconductor Section Number Title Page 10.5.8 FLL Lock and Loss-of-Lock Detection ........................................................................184 10.5.9 FLL Loss-of-Clock Detection ......................................................................................185 10.5.10 Clock Mode Requirements ...........................................................................................186 10.5.11 Fixed Frequency Clock .................................................................................................187 10.5.12 High Gain Oscillator .....................................................................................................187 10.6 Initialization/Application Information ..........................................................................................187 10.6.1 Introduction ..................................................................................................................187 10.6.2 Example #1: External Crystal = 32 kHz, Bus Frequency = 4.19 MHz ........................189 10.6.3 Example #2: External Crystal = 4 MHz, Bus Frequency = 20 MHz ............................191 10.6.4 Example #3: No External Crystal Connection, 5.4 MHz Bus Frequency ....................193 10.6.5 Example #4: Internal Clock Generator Trim ................................................................195 Chapter 11 Timer Pulse-Width Modulator (S08TPMV2) 11.1 Introduction ...................................................................................................................................197 11.1.1 Features .........................................................................................................................199 11.1.2 Block Diagram ..............................................................................................................199 11.2 External Signal Description ..........................................................................................................201 11.2.1 External TPM Clock Sources .......................................................................................201 11.2.2 TPMxCHn — TPMx Channel n I/O Pins .....................................................................201 11.3 Register Definition ........................................................................................................................201 11.3.1 Timer x Status and Control Register (TPMxSC) ..........................................................202 11.3.2 Timer x Counter Registers (TPMxCNTH:TPMxCNTL) .............................................203 11.3.3 Timer x Counter Modulo Registers (TPMxMODH:TPMxMODL) .............................204 11.3.4 Timer x Channel n Status and Control Register (TPMxCnSC) ....................................205 11.3.5 Timer x Channel Value Registers (TPMxCnVH:TPMxCnVL) ....................................206 11.4 Functional Description ..................................................................................................................207 11.4.1 Counter .........................................................................................................................207 11.4.2 Channel Mode Selection ...............................................................................................208 11.4.2.1 Input Capture Mode ......................................................................................208 11.4.2.2 Output Compare Mode .................................................................................209 11.4.2.3 Edge-Aligned PWM Mode ...........................................................................209 11.4.3 Center-Aligned PWM Mode ........................................................................................210 11.5 TPM Interrupts ..............................................................................................................................211 11.5.1 Clearing Timer Interrupt Flags .....................................................................................211 11.5.2 Timer Overflow Interrupt Description ..........................................................................211 11.5.3 Channel Event Interrupt Description ............................................................................212 11.5.4 PWM End-of-Duty-Cycle Events .................................................................................212 Chapter 12 Serial Communications Interface (S08SCIV3) 12.1 Introduction ...................................................................................................................................213 12.1.1 Features .........................................................................................................................216 12.1.2 Modes of Operation ......................................................................................................216 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 15 Section Number Title Page 12.1.3 Block Diagram ..............................................................................................................217 12.2 Register Definition ........................................................................................................................219 12.2.1 SCI Baud Rate Registers (SCIBDH, SCIBHL) ............................................................219 12.2.2 SCI Control Register 1 (SCIC1) ...................................................................................220 12.2.3 SCI Control Register 2 (SCIC2) ...................................................................................221 12.2.4 SCI Status Register 1 (SCIS1) ......................................................................................222 12.2.5 SCI Status Register 2 (SCIS2) ......................................................................................224 12.2.6 SCI Control Register 3 (SCIC3) ...................................................................................224 12.2.7 SCI Data Register (SCID) ............................................................................................225 12.3 Functional Description ..................................................................................................................226 12.3.1 Baud Rate Generation ...................................................................................................226 12.3.2 Transmitter Functional Description ..............................................................................226 12.3.2.1 Send Break and Queued Idle .........................................................................227 12.3.3 Receiver Functional Description ..................................................................................228 12.3.3.1 Data Sampling Technique .............................................................................228 12.3.3.2 Receiver Wakeup Operation .........................................................................229 12.3.4 Interrupts and Status Flags ...........................................................................................229 12.4 Additional SCI Functions ..............................................................................................................230 12.4.1 8- and 9-Bit Data Modes ..............................................................................................230 12.4.2 Stop Mode Operation ...................................................................................................231 12.4.3 Loop Mode ...................................................................................................................231 12.4.4 Single-Wire Operation ..................................................................................................231 Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.1 Introduction ...................................................................................................................................233 13.1.1 Features .........................................................................................................................235 13.1.2 Block Diagrams ............................................................................................................235 13.1.2.1 SPI System Block Diagram ..........................................................................235 13.1.2.2 SPI Module Block Diagram ..........................................................................236 13.1.3 SPI Baud Rate Generation ............................................................................................237 13.2 External Signal Description ..........................................................................................................238 13.2.1 SPSCK — SPI Serial Clock .........................................................................................238 13.2.2 MOSI — Master Data Out, Slave Data In ....................................................................238 13.2.3 MISO — Master Data In, Slave Data Out ....................................................................238 13.2.4 SS — Slave Select ........................................................................................................238 13.3 Modes of Operation .......................................................................................................................239 13.3.1 SPI in Stop Modes ........................................................................................................239 13.4 Register Definition ........................................................................................................................239 13.4.1 SPI Control Register 1 (SPIxC1) ..................................................................................239 13.4.2 SPI Control Register 2 (SPIxC2) ..................................................................................240 13.4.3 SPI Baud Rate Register (SPIxBR) ...............................................................................241 13.4.4 SPI Status Register (SPIxS) ..........................................................................................242 13.4.5 SPI Data Register (SPIxD) ...........................................................................................243 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 16 Freescale Semiconductor Section Number Title Page 13.5 Functional Description ..................................................................................................................244 13.5.1 SPI Clock Formats ........................................................................................................244 13.5.2 SPI Interrupts ................................................................................................................247 13.5.3 Mode Fault Detection ...................................................................................................247 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.1 Introduction ...................................................................................................................................249 14.1.1 Features .........................................................................................................................251 14.1.2 Modes of Operation ......................................................................................................251 14.1.3 Block Diagram ..............................................................................................................252 14.2 External Signal Description ..........................................................................................................252 14.2.1 SCL — Serial Clock Line .............................................................................................252 14.2.2 SDA — Serial Data Line ..............................................................................................252 14.3 Register Definition ........................................................................................................................252 14.3.1 IIC Address Register (IICA) .........................................................................................253 14.3.2 IIC Frequency Divider Register (IICF) ........................................................................253 14.3.3 IIC Control Register (IICC) ..........................................................................................256 14.3.4 IIC Status Register (IICS) ............................................................................................257 14.3.5 IIC Data I/O Register (IICD) ........................................................................................258 14.4 Functional Description ..................................................................................................................259 14.4.1 IIC Protocol ..................................................................................................................259 14.4.1.1 START Signal ...............................................................................................260 14.4.1.2 Slave Address Transmission .........................................................................260 14.4.1.3 Data Transfer .................................................................................................260 14.4.1.4 STOP Signal ..................................................................................................261 14.4.1.5 Repeated START Signal ...............................................................................261 14.4.1.6 Arbitration Procedure ....................................................................................261 14.4.1.7 Clock Synchronization ..................................................................................261 14.4.1.8 Handshaking .................................................................................................262 14.4.1.9 Clock Stretching ............................................................................................262 14.5 Resets ............................................................................................................................................262 14.6 Interrupts .......................................................................................................................................262 14.6.1 Byte Transfer Interrupt .................................................................................................263 14.6.2 Address Detect Interrupt ...............................................................................................263 14.6.3 Arbitration Lost Interrupt .............................................................................................263 14.7 Initialization/Application Information ..........................................................................................264 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.1 Introduction ...................................................................................................................................267 15.1.1 ADC Configuration Information ..................................................................................267 15.1.1.1 Channel Assignments ....................................................................................267 15.1.1.2 Alternate Clock .............................................................................................268 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 17 Section Number 15.2 15.3 15.4 15.5 15.6 Title Page 15.1.1.3 Hardware Trigger ..........................................................................................268 15.1.1.4 Analog Pin Enables .......................................................................................268 15.1.1.5 Temperature Sensor ......................................................................................268 15.1.1.6 Low-Power Mode Operation ........................................................................269 15.1.2 Features .........................................................................................................................270 15.1.3 Block Diagram ..............................................................................................................270 External Signal Description ..........................................................................................................271 15.2.1 Analog Power (VDDAD) ................................................................................................272 15.2.2 Analog Ground (VSSAD) ..............................................................................................272 15.2.3 Voltage Reference High (VREFH) .................................................................................272 15.2.4 Voltage Reference Low (VREFL) ..................................................................................272 15.2.5 Analog Channel Inputs (ADx) ......................................................................................272 Register Definition ........................................................................................................................272 15.3.1 Status and Control Register 1 (ADCSC1) ....................................................................272 15.3.2 Status and Control Register 2 (ADCSC2) ....................................................................274 15.3.3 Data Result High Register (ADCRH) ..........................................................................275 15.3.4 Data Result Low Register (ADCRL) ............................................................................275 15.3.5 Compare Value High Register (ADCCVH) ..................................................................276 15.3.6 Compare Value Low Register (ADCCVL) ...................................................................276 15.3.7 Configuration Register (ADCCFG) ..............................................................................276 15.3.8 Pin Control 1 Register (APCTL1) ................................................................................278 15.3.9 Pin Control 2 Register (APCTL2) ................................................................................279 15.3.10 Pin Control 3 Register (APCTL3) ................................................................................280 Functional Description ..................................................................................................................281 15.4.1 Clock Select and Divide Control ..................................................................................281 15.4.2 Input Select and Pin Control .........................................................................................282 15.4.3 Hardware Trigger ..........................................................................................................282 15.4.4 Conversion Control .......................................................................................................282 15.4.4.1 Initiating Conversions ...................................................................................282 15.4.4.2 Completing Conversions ...............................................................................283 15.4.4.3 Aborting Conversions ...................................................................................283 15.4.4.4 Power Control ...............................................................................................283 15.4.4.5 Sample Time and Total Conversion Time .....................................................283 15.4.5 Automatic Compare Function ......................................................................................285 15.4.6 MCU Wait Mode Operation .........................................................................................285 15.4.7 MCU Stop3 Mode Operation .......................................................................................285 15.4.7.1 Stop3 Mode With ADACK Disabled ............................................................285 15.4.7.2 Stop3 Mode With ADACK Enabled .............................................................286 15.4.8 MCU Stop1 and Stop2 Mode Operation ......................................................................286 Initialization Information ..............................................................................................................286 15.5.1 ADC Module Initialization Example ...........................................................................286 15.5.1.1 Initialization Sequence ..................................................................................286 15.5.1.2 Pseudo — Code Example .............................................................................287 Application Information ................................................................................................................288 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 18 Freescale Semiconductor Section Number 15.6.1 15.6.2 Title Page External Pins and Routing ............................................................................................288 15.6.1.1 Analog Supply Pins ......................................................................................288 15.6.1.2 Analog Reference Pins ..................................................................................289 15.6.1.3 Analog Input Pins .........................................................................................289 Sources of Error ............................................................................................................290 15.6.2.1 Sampling Error ..............................................................................................290 15.6.2.2 Pin Leakage Error .........................................................................................290 15.6.2.3 Noise-Induced Errors ....................................................................................290 15.6.2.4 Code Width and Quantization Error .............................................................291 15.6.2.5 Linearity Errors .............................................................................................291 15.6.2.6 Code Jitter, Non-Monotonicity and Missing Codes ......................................292 Chapter 16 Analog Comparator (S08ACMPV2) 16.1 Introduction ...................................................................................................................................293 16.1.1 ACMP/TPM1 Configuration Information ....................................................................293 16.1.2 AMCPO Availability ....................................................................................................293 16.1.3 Features .........................................................................................................................295 16.1.4 Modes of Operation ......................................................................................................295 16.1.4.1 ACMP in Wait Mode ....................................................................................295 16.1.4.2 ACMP in Stop Modes ...................................................................................295 16.1.4.3 ACMP in Active Background Mode .............................................................295 16.1.5 Block Diagram ..............................................................................................................295 16.2 External Signal Description ..........................................................................................................297 16.3 Register Definition ........................................................................................................................297 16.3.1 ACMP Status and Control Register (ACMPSC) ..........................................................298 16.4 Functional Description ..................................................................................................................299 Chapter 17 Development Support 17.1 Introduction ...................................................................................................................................301 17.1.1 Features .........................................................................................................................301 17.2 Background Debug Controller (BDC) ..........................................................................................302 17.2.1 BKGD Pin Description .................................................................................................302 17.2.2 Communication Details ................................................................................................303 17.2.3 BDC Commands ...........................................................................................................307 17.2.4 BDC Hardware Breakpoint ..........................................................................................309 17.3 On-Chip Debug System (DBG) ....................................................................................................310 17.3.1 Comparators A and B ...................................................................................................310 17.3.2 Bus Capture Information and FIFO Operation .............................................................310 17.3.3 Change-of-Flow Information ........................................................................................311 17.3.4 Tag vs. Force Breakpoints and Triggers .......................................................................311 17.3.5 Trigger Modes ..............................................................................................................312 17.3.6 Hardware Breakpoints ..................................................................................................314 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 19 Section Number Title Page 17.4 Register Definition ........................................................................................................................314 17.4.1 BDC Registers and Control Bits ...................................................................................314 17.4.1.1 BDC Status and Control Register (BDCSCR) ..............................................315 17.4.1.2 BDC Breakpoint Match Register (BDCBKPT) ............................................316 17.4.2 System Background Debug Force Reset Register (SBDFR) ........................................316 17.4.3 DBG Registers and Control Bits ..................................................................................317 17.4.3.1 Debug Comparator A High Register (DBGCAH) ........................................317 17.4.3.2 Debug Comparator A Low Register (DBGCAL) .........................................317 17.4.3.3 Debug Comparator B High Register (DBGCBH) .........................................317 17.4.3.4 Debug Comparator B Low Register (DBGCBL) ..........................................317 17.4.3.5 Debug FIFO High Register (DBGFH) ..........................................................318 17.4.3.6 Debug FIFO Low Register (DBGFL) ...........................................................318 17.4.3.7 Debug Control Register (DBGC) ..................................................................319 17.4.3.8 Debug Trigger Register (DBGT) ..................................................................320 17.4.3.9 Debug Status Register (DBGS) .....................................................................321 Appendix A Electrical Characteristics A.1 A.2 A.3 A.4 A.5 A.6 A.7 A.8 A.9 Introduction ...................................................................................................................................323 Absolute Maximum Ratings ..........................................................................................................323 Thermal Characteristics .................................................................................................................324 Electrostatic Discharge (ESD) Protection Characteristics ............................................................325 DC Characteristics .........................................................................................................................326 Supply Current Characteristics ......................................................................................................330 ADC Characteristics ......................................................................................................................333 LCD Characteristics ......................................................................................................................336 Internal Clock Generation Module Characteristics .......................................................................339 A.9.1 ICG Frequency Specifications ........................................................................................339 A.10 AC Characteristics .........................................................................................................................341 A.10.1 Control Timing ...............................................................................................................342 A.10.2 Timer/PWM (TPM) Module Timing ..............................................................................343 A.10.3 SPI Timing ......................................................................................................................344 A.11 FLASH Specifications ...................................................................................................................347 A.12 EMC Performance .........................................................................................................................348 A.12.1 Radiated Emissions .........................................................................................................348 A.12.2 Conducted Transient Susceptibility ................................................................................349 Appendix B Ordering Information and Mechanical Drawings B.1 Ordering Information ....................................................................................................................351 B.2 Mechanical Drawings ....................................................................................................................351 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 20 Freescale Semiconductor Chapter 1 Device Overview 1.1 Introduction MC9S08LC60 Series MCUs are members of the low-cost, high-performance HCS08 Family of 8-bit microcontroller units (MCUs). All MCUs in the family use the enhanced HCS08 core and are available with a variety of modules, memory sizes, memory types, and package types. 1.2 Devices in the MC9S08LC60 Series Table 1-1 lists the devices available in the MC9S08LC60 Series and summarizes the differences among them. Table 1-1. Devices in the MC9S08LC60 Series Device FLASH A FLASH B RAM Package MC9S08LC60 32K MC9S08LC36 24K 28K 4K 12K 2.5K 80 LQFP 64 LQFP Table 1-2. Package Options by Feature Package Feature 80-Pin 64-Pin ACMP yes yes ADC 8-ch 2-ch IIC yes yes IRQ yes yes KBI1 KBI2 8 8 2 8 SCI yes yes SPI1 SPI2 yes yes yes yes TPM1 TPM2 2-ch 2-ch 2-ch 2-ch Shared I/O pins (max) 24 - I/O 2 - Output only 1- Input only 18 - I/O 2 - Output only 1- Input only LCD 4x40 3x41 4x32 3x33 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 21 Chapter 1 Device Overview 1.3 MCU Block Diagram Figure 1-1 shows the structure of the MC9S08LC60 Series MCUs. HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT COP IRQ LVD 8-BIT KEYBOARD INTERRUPT (KBI1) SERIAL PERIPHERAL INTERFACE (SPI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) ACMP– PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) PORT B RTI ANALOG COMPARATOR (ACMP) PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM2) 2-CHANNEL TIMER/PWM (TPM1) VLL1 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 RxD PORT C INTERNAL CLOCK GENERATOR (ICG) VLL2 PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) VLCD PTB5/MOSI1/SCL PTB4/MISO1/SDA PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 1-1. MC9S08LC60 Series Block Diagram MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 22 Freescale Semiconductor Chapter 1 Device Overview Table 1-3 lists the functional versions of the on-chip modules. Table 1-3. Module Versions Module 1.4 Version Analog Comparator (ACMP) 2 Analog-to-Digital Converter (ADC) 1 Internal Clock Generator (ICG) 4 Inter-Integrated Circuit (IIC) 1 Keyboard Interrupt (KBI) 2 Serial Communications Interface (SCI) 3 Serial Peripheral Interface (SPI) 3 Timer Pulse-Width Modulator (TPM) 2 Liquid Crystal Display Module (LCD) 1 Central Processing Unit (CPU) 2 System Clock Distribution TPMCLK 1-kHz SYSTEM CONTROL LOGIC ICGERCLK TPM1 TPM2 IIC SCI SPI1 SPI2 ADC RAM FLASH ACMP RTI FFE ÷2 ICG FIXED FREQ CLOCK (XCLK) ICGOUT ÷2 BUSCLK ICGLCLK* CPU BDC LCD * ICGLCLK is the alternate BDC clock source for the MC9S08LC60 Series. COP ADC has min and max frequency requirements. See Chapter 1, “Introduction” and the Electricals Appendix. FLASH has frequency requirements for program and erase operation. See the Electricals Appendix. Figure 1-2. System Clock Distribution Diagram Some of the modules inside the MCU have clock source choices. Figure 1-2 shows a simplified clock connection diagram. The ICG supplies the clock sources: • ICGOUT is an output of the ICG module. It is one of the following: — The external crystal oscillator — An external clock source — The output of the digitally-controlled oscillator (DCO) in the frequency-locked loop sub-module MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 23 Chapter 1 Device Overview Control bits inside the ICG determine which source is connected. • FFE is a control signal generated inside the ICG. If the frequency of ICGOUT > 4 × the frequency of ICGERCLK, this signal is a logic 1 and the fixed-frequency clock will be the ICGERCLK. Otherwise the fixed-frequency clock will be BUSCLK. • ICGLCLK — Development tools can select this internal self-clocked source (~ 8 MHz) to speed up BDC communications in systems where the bus clock is slow. • ICGERCLK — External reference clock can be selected as the real-time interrupt clock source. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 24 Freescale Semiconductor Chapter 2 Pins and Connections 2.1 Introduction This section describes signals that connect to package pins. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. 2.2 Device Pin Assignment Figure 2-1 and Figure 2-2 show the pin assignments for the MC9S08LC60 Series devices in its available packages. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 25 MC9S08LC60 Series 80-Pin LQFP 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 FP27 FP28 FP29 FP30 FP31 FP32 FP33 FP34 FP35 FP36 FP37 FP38 FP39 PTC7/KBI2P7/IRQ/TPMCLK PTC6/ BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PTA3/KBI1P3/ADP3/ACMP– PTA4/KBI1P4/ADP4 PTA5/KBI1P5/ADP5 PTA6/KBI1P6/ADP6 PTA7/KBI1P7/ADP7 VSSAD VREFL VREFH VDDAD PTB0/KBI2P0/EXTAL PTB1/KBI2P1/XTAL VDD VSS PTB2/RESET PTB3/KBI2P2 PTB4/MISO1/SDA PTB5/MOSI1/SCL PTB6/KBI2P3/SPSCK1 PTB7/KBI2P4/SS1 PTC0/MISO2/RxD FP6 FP5 FP4 FP3 FP2 FP1 FP0 BP0 BP1 BP2 BP3/FP40 Vcap1 Vcap2 VLL1 VLL2 VLL3 VLCD PTA0/KBI1P0/ADP0 PTA1/KBI1P1/ADP1 PTA2/KBI1P2/ADP2/ACMP + 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 FP7 FP8 FP9 FP10 FP11 FP12 FP13 FP14 FP15 FP16 FP17 FP18 FP19 FP20 FP21 FP22 FP23 FP24 FP25 FP26 Chapter 2 Pins and Connections Figure 2-1. MC9S08LC60 Series in 80-Pin LQFP Package MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 26 Freescale Semiconductor MC9S08LC60 Series 64-Pin LQFP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 FP22 FP23 FP24 FP25 FP26 FP27 FP28 FP29 FP30 FP31 PTC7/KBI2P7/IRQ/TPMCLK PTC6 /BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PTA2/KBI1P2/ADP2/ACMP+ PTA3/KBI1P3/ADP3/ACMP– VSSAD/VREFL VDDAD/VREFH PTB0/KBI2P0/EXTAL PTB1/KBI2P1/XTAL VDD VSS PTB2/RESET PTB3/KBI2P2 PTB4/MISO1/SDA PTB5/MOSI1/SCL PTB6/KBI2P3/SPSCK1 PTB7/KBI2P4/SS1 PTC0/MISO2/RxD PTC1/MOSI2/TxD FP5 FP4 FP3 FP2 FP1 FP0 BP0 BP1 BP2 BP3/FP40 VCAP1 VCAP2 VLL1 VLL2 VLL3 VLCD 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 FP6 FP7 FP8 FP9 FP10 FP11 FP12 FP13 FP14 FP15 FP16 FP17 FP18 FP19 FP20 FP21 Chapter 2 Pins and Connections Note: VREFH/VREFL are internally connected to VDDAD/VSSAD in the 64-pin package. Figure 2-2. MC9S08LC60 Series in 64-Pin LQFP Package 2.3 Recommended System Connections Figure 2-3 shows pin connections that are common to most MC9S08LC60 Series application systems in the 80-pin package. Connections will be similar to the 64-pin package except for the number of I/O pins available. A more detailed discussion of system connections follows. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 27 Chapter 2 Pins and Connections CBYAD 0.1 μF CBLK + 10 μF CBY 0.1 μF VSS NOTE 1 RF C1 X1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 PTB5/MOSI1/SCL PTB4/MISO1/SDA PTB3/KBI2P2 PTB2/RESET PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL RS INTERFACE TO I/O AND PTB1/KBI2P1/XTAL C2 PTB0/KBI2P0/EXTAL BACKGROUND HEADER PORT C + 3V PTA[7:4]/KBI1P[7:4]/ADP[7:4] PTA3/KBI1P3/ADP3/ACMP– PTA2/KBI1P2/ADP2/ACMP+ PTA[1:0]/KBI1P[1:0]/ADP[1:0] VSSAD VREFL VDD VDD SYSTEM POWER MC9S08LC60 PORT A VDDAD PORT B VREFH NOTE 2 PTC6/BKGD/MS VDD PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD PERIPHERAL APPLICATION SYSTEM VDD 4.7 kΩ to 10 kΩ BP[2:0] 0.1 μF LCD BP3/FP40 PTB2/RESET NOTE6 NOTE 6 FP[39:0] OPTIONAL MANUAL RESET NOTE 5 X VLCD VLL1 VLL2 CBYLCD VLL3 CBYLCD CBYLCD VCAP1 CLCD NOTE 4 NOTES: 1. Not required if using the internal oscillator option. 2. BKGD/MS is the same pin as PTC6. 3. The 64-pin LQFP combines (VSSAD to VREFL) and combines (VDDAD to VREFH) 4. VLCD, VLL1, VLL2, and VLL3 can be powered internally using VDD or externally based on software configuration of the LCD module. (Shown as internally powered). 5. VLCD is a “no connect” when the LCD module is being powered via VDD. 6. An RC filter on RESET is recommended for EMC-sensitive applications. VCAP2 Figure 2-3. Basic System Connections MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 28 Freescale Semiconductor Chapter 2 Pins and Connections 2.3.1 Power (VDD, VSS, VDDAD, VSSAD) VDD and VSS are the primary power supply pins for the MCU. This voltage source supplies power to all I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated lower-voltage source to the CPU and other internal circuitry of the MCU. Typically, application systems have two separate capacitors across the power pins. In this case, there should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage for the overall system and a 0.1-μF ceramic bypass capacitor located as close to the MCU power pins as practical to suppress high-frequency noise. VDDAD and VSSAD are the analog power supply pins for the MCU. This voltage source supplies power to the ADC. A 0.1-μF ceramic bypass capacitor should be located as close to the MCU power pins as practical to suppress high-frequency noise. 2.3.2 ADC Reference Pins (VREFH, VREFL ) VREFH and VREFL are the voltage reference high and voltage reference low pins, respectively, for the ADC module. In the 64-pin package, VREFH and VREFL are shared with VDDAD and VSSAD, respectively. 2.3.3 Oscillator (XTAL, EXTAL) Out of reset, the MCU uses an internally generated clock (self-clocked mode — fSelf_reset), that is approximately equivalent to an 8-MHz crystal rate. This frequency source is used during reset startup and can be enabled as the clock source for stop recovery to avoid the need for a long crystal startup delay. This MCU also contains a trimmable internal clock generator (ICG) module that can be used to run the MCU. For more information on the ICG, see Chapter 10, “Internal Clock Generator (S08ICGV4).” The oscillator in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic resonator in either of two frequency ranges selected by the RANGE bit in the ICGC1 register. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL input pin, and the XTAL output pin can be used as general I/O. Refer to Figure 2-3 for the following discussion. RS (when used) and RF should be low-inductance resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically designed for high-frequency applications. RF is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its value is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and lower values reduce gain and (in extreme cases) could prevent startup. C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance which is the series combination of C1 and C2 which are usually the same size. As a first-order approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and XTAL). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 29 Chapter 2 Pins and Connections 2.3.4 RESET Pin After POR, the configuration of the PTB2/RESET pin defaults to RESET. Clearing the RSTPE bit in SOPT1 register configures the pin to be the PTB2 general-purpose, output only pin. After configured as PTB2, the pin will remain PTB2 until the next reset. The RESET pin can be used to reset the MCU from an external source when the pin is driven low. When enabled as the RESET pin (RSTPE = 1), an internal pullup device is automatically enabled. It has input hysteresis, a high current output driver, and no output slew rate control. Internal power-on reset and low-voltage reset circuitry typically make external reset circuitry unnecessary. The PTB2/RESET pin will default to the RESET pin when a POR enters active background mode. This pin is normally connected to the standard 6-pin background debug connector so a development system can directly reset the MCU system. If desired, when the pin is configured as the RESET pin, a manual external reset can be added by supplying a simple switch to ground (pull reset pin low to force a reset). Whenever any reset is initiated (whether from an external signal or from an internal system), the reset pin is driven low for approximately 34 cycles of fSelf_reset, released, and sampled again approximately 38 cycles of fSelf_reset later. If reset was caused by an internal source such as low-voltage reset or watchdog timeout, the circuitry expects the reset pin sample to return a logic 1. The reset circuitry decodes the cause of reset and records it by setting a corresponding bit in the system control reset status register (SRS). In EMC-sensitive applications, an external RC filter is recommended on the reset pin. See Figure 2-3 for an example. 2.3.5 Background / Mode Select (BKGD/MS) The background / mode select (BKGD/MS) shares its function with an output-only port pin, PTC6. While in reset, the pin functions as a mode select pin. Immediately after reset rises the pin functions as the background pin and can be used for background debug communication. While functioning as a background/mode select pin (BKGDPE = 1), the pin includes an internal pullup device, input hysteresis, a standard output driver, and no output slew rate control. When used as an I/O port, the pin is limited to output only. If nothing is connected to this pin, the MCU will enter normal operating mode at the rising edge of reset. If a debug system is connected to the 6-pin standard background debug header, it can hold BKGD/MS low during the rising edge of reset which forces the MCU to active background mode. The BKGD pin is used primarily for background debug controller (BDC) communications using a custom protocol that uses 16 clock cycles of the target MCU’s BDC clock per bit time. The target MCU’s BDC clock could be as fast as the bus clock rate, so there should never be any significant capacitance connected to the BKGD/MS pin that could interfere with background serial communications. Although the BKGD pin is a pseudo open-drain pin, the background debug communication protocol provides brief, actively driven, high speedup pulses to ensure fast rise times. Small capacitances from cables and the absolute value of the internal pullup device play almost no role in determining rise and fall times on the BKGD pin. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 30 Freescale Semiconductor Chapter 2 Pins and Connections 2.3.6 2.3.6.1 LCD Pins LCD Power Pins The VLCD, VLL1, VLL2, VLL3, Vcap1, and Vcap2 pins are dedicated to providing power to the LCD module. For detailed information about these pins see the LCD chapter. 2.3.6.2 LCD Frontplane and Backplane Driver Pins 44 pins are dedicated to frontplane and backplane drivers; on the 64-pin package, 36 pins are dedicated. Immediately after reset, the LCD driver pins are high-impedance. For detailed information about LCD frontplane and backplane driver pins, see the LCD chapter. 2.3.7 General-Purpose I/O and Peripheral Ports MC9S08LC60 Series MCUs support up to 24 general-purpose I/O pins which are shared with on-chip peripheral functions (timers, serial I/O, ADC, keyboard interrupts, etc.). On each MC9S08LC60 Series device, there is one input-only and two output-only port pins. When a port pin is configured as a general-purpose output or a peripheral uses the port pin as an output, software can select one of two drive strengths and enable or disable slew rate control. When a port pin is configured as a general-purpose input or a peripheral uses the port pin as an input, software can enable a pullup device. For information about controlling these pins as general-purpose I/O pins, see Chapter 6, “Parallel Input/Output.” Immediately after reset, all pins that are not output-only are configured as high-impedance general-purpose inputs with internal pullup devices disabled. After reset, the output-only port function is not enabled but is configured for low output drive strength with slew rate control enabled. The PTC6 pin defaults to BKGD/MS on any reset. NOTE To avoid extra current drain from floating input pins, the reset initialization routine in the application program should either enable on-chip pullup devices or change the direction of unused pins to outputs so the pins do not float. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 31 Chapter 2 Pins and Connections Table 2-1. Pin Availability by Package Pin-Count Pin Number 80 64 1 64 2 1 <-- Lowest Port Pin Priority --> Highest Pin Number <-- Lowest 64 FP6 41 32 PTC1 MOSI2 TxD FP5 42 33 PTC2 SPSCK2 TPM1CH0 34 PTC3 SS2 TPM1CH1 Alt 2 Alt3 Alt 1 --> Highest 80 Alt 1 Port Pin Priority Alt 2 3 2 FP4 43 4 3 FP3 44 35 PTC4 KBI2P5 TPM2CH0 36 PTC5 KBI2P6 TPM2CH1 5 4 FP2 45 6 5 FP1 46 37 PTC6 BKGD MS 38 PTC7 KBI2P7 IRQ 7 6 FP0 47 8 7 BP0 48 — FP39 — FP38 9 8 BP1 49 10 9 BP2 50 — FP37 51 — FP36 11 10 BP3 FP40 12 11 Vcap1 52 — FP35 — FP34 13 12 Vcap2 53 14 13 VLL1 54 — FP33 — FP32 15 14 VLL2 55 16 15 VLL3 56 39 FP31 VLCD 57 40 FP30 ADP0 58 41 FP29 59 42 FP28 ACMP+ 60 43 FP27 ACMP– 61 44 FP26 17 16 18 — PTA0 KBI1P0 19 — PTA1 KBI1P1 ADP1 20 17 PTA2 KBI1P2 ADP2 21 18 PTA3 KBI1P3 ADP3 22 — PTA4 KBI1P4 ADP4 62 45 FP25 46 FP24 23 — PTA5 KBI1P5 ADP5 63 24 — PTA6 KBI1P6 ADP6 64 47 FP23 ADP7 65 48 FP22 VSSAD 66 49 FP21 VREFL 67 50 FP20 VREFH 68 51 FP19 VDDAD 69 52 FP18 EXTAL 70 53 FP17 XTAL 71 54 FP16 VDD 72 55 FP15 VSS 73 56 FP14 RESET 74 57 FP13 75 58 FP12 SDA 76 59 FP11 60 FP10 25 26 27 28 29 30 — PTA7 KBI1P7 19 20 — 31 — 32 23 33 24 34 25 PTB0 PTB1 PTB2 KBI2P0 KBI2P1 35 26 PTB3 KBI2P2 36 27 PTB4 MISO1 37 28 PTB5 MOSI1 SCL 77 38 29 PTB6 KBI2P3 SPSCK1 78 61 FP9 62 FP8 63 FP7 39 30 PTB7 KBI2P4 SS1 78 40 31 PTC0 MISO2 RxD 80 Alt3 TPMCLK MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 32 Freescale Semiconductor Chapter 3 Modes of Operation 3.1 Introduction The operating modes of the MC9S08LC60 Series are described in this section. Entry into each mode, exit from each mode, and functionality while in each of the modes are described. 3.2 • • • 3.3 Features Active background mode for code development Wait mode: — CPU halts operation to conserve power — System clocks running — Full voltage regulation is maintained Stop modes: — CPU and bus clocks stopped — Stop1: Full power-down of internal circuits for maximum power savings — Stop2: Partial power-down of internal circuits, RAM contents retained — Stop3: All internal circuits powered for fast recovery; RAM and register contents are retained; LCD module can be configured to remain operational Run Mode Run is the normal operating mode for the MC9S08LC60 Series. This mode is selected upon the MCU exiting reset if the BKGD/MS pin is high. In this mode, the CPU executes code from internal memory with execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset. 3.4 Active Background Mode The active background mode functions are managed through the background debug controller (BDC) in the HCS08 core. The BDC, together with the on-chip debug module (DBG), provides the means for analyzing MCU operation during software development. Active background mode is entered in any of five ways: • When the BKGD/MS pin is low at the time the MCU exits reset • When a BACKGROUND command is received through the BKGD pin • When a BGND instruction is executed • When encountering a BDC breakpoint • When encountering a DBG breakpoint MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 33 Chapter 3 Modes of Operation After entering active background mode, the CPU is held in a suspended state waiting for serial background commands rather than executing instructions from the user’s application program. Background commands are of two types: • Non-intrusive commands, defined as commands that can be issued while the user program is running. Non-intrusive commands can be issued through the BKGD pin while the MCU is in run mode; non-intrusive commands can also be executed when the MCU is in the active background mode. Non-intrusive commands include: — Memory access commands — Memory-access-with-status commands — BDC register access commands — The BACKGROUND command • Active background commands, which can only be executed while the MCU is in active background mode. Active background commands include commands to: — Read or write CPU registers — Trace one user program instruction at a time — Leave active background mode to return to the user’s application program (GO) The active background mode is used to program a bootloader or user application program into the FLASH program memory before the MCU is operated in run mode for the first time. When MC9S08LC60 Series MCUs are shipped from the Freescale factory, the FLASH program memory is erased by default unless specifically noted, so there is no program that could be executed in run mode until the FLASH memory is initially programmed. The active background mode can also be used to erase and reprogram the FLASH memory after it has been previously programmed. For additional information about the active background mode, refer to the Development Support chapter. 3.5 Wait Mode Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU enters a low-power state in which it is not clocked. The I bit in the condition code register (CCR) is cleared when the CPU enters wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits wait mode and resumes processing, beginning with the stacking operations leading to the interrupt service routine. While the MCU is in wait mode, there are some restrictions on which background debug commands can be used. Only the BACKGROUND command and memory-access-with-status commands are available while the MCU is in wait mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND command can be used to wake the MCU from wait mode and enter active background mode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 34 Freescale Semiconductor Chapter 3 Modes of Operation 3.6 Stop Modes One of three stop modes is entered upon execution of a STOP instruction when STOPE in SOPT1 is set. In any stop mode, the bus and CPU clocks are halted. The ICG module can be configured to leave the reference clocks running. see Chapter 10, “Internal Clock Generator (S08ICGV4)” for more information. Table 3-1 shows all of the control bits that affect stop mode selection and the mode selected under various conditions. The stop mode behavior of the MCU is configured by setting the appropriate bits in the SPMSC1 and SPMSC2 registers The selected mode is entered following the execution of a STOP instruction. Table 3-1. Stop Mode Selection STOPE ENBDM 1 LVDE and LVDSE PDC PPDC 0 x x x x Stop modes disabled; illegal opcode reset if STOP instruction executed 1 1 x x x Stop3 with BDM enabled 2 1 0 1 x x Stop3 with voltage regulator active 1 0 0 0 x Stop33 1 0 0 1 1 Stop2 1 0 0 1 0 Stop1 Stop Mode 1 ENBDM is located in the BDCSCR which is only accessible through BDC commands, see the Development Support section. 2 When in Stop3 mode with BDM enabled, The SIDD will be near RIDD levels because internal clocks are enabled. 3 The LCD module can operate in stop3 if LCDSTP3 in LCDCR1 is asserted. 3.6.1 Stop3 Mode Stop3 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. The states of all of the internal registers and logic, RAM contents, and I/O pin states are maintained. Stop3 can be exited by asserting RESET, or by an interrupt from one of the following sources: the real-time interrupt (RTI), LVD, ADC, IRQ or the KBI. If stop3 is exited by means of the RESET pin, then the MCU is reset and operation will resume after taking the reset vector. Exit by means of one of the internal interrupt sources results in the MCU taking the appropriate interrupt vector. A separate self-clocked source (≈1 kHz) for the real-time interrupt allows a wakeup from stop2 or stop3 mode with no external components. When RTIS2:RTIS1:RTIS0 = 0:0:0, the real-time interrupt function and this 1-kHz source are disabled. Power consumption is lower when the 1-kHz source is disabled, but in that case the real-time interrupt cannot wake the MCU from stop. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 35 Chapter 3 Modes of Operation 3.6.1.1 LVD Enabled in Stop Mode The LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below the LVD voltage. If the LVD is enabled in stop (LVDE and LVDSE bits in SPMSC1 both set) at the time the CPU executes a STOP instruction, then the voltage regulator remains active during stop mode. For the ADC to operate the LVD must be left enabled when entering stop3. 3.6.1.2 Active BDM Enabled in Stop Mode Entry into the active background mode from run mode is enabled if ENBDM in BDCSCR is set. This register is described in the Development Support chapter of this data sheet. If ENBDM is set when the CPU executes a STOP instruction, the system clocks to the background debug logic remain active when the MCU enters stop mode. Because of this, background debug communication remains possible. In addition, the voltage regulator does not enter its low-power standby state but maintains full internal regulation. Most background commands are not available in stop mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND command can be used to wake the MCU from stop and enter active background mode if the ENBDM bit is set. After entering background debug mode, all background commands are available. 3.6.2 Stop2 Mode Stop2 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most of the internal circuitry of the MCU is powered off in stop2 as in stop1 with the exception of the RAM. Upon entering stop2, all I/O pin control signals are latched so that the pins retain their states during stop2. Exit from stop2 is performed by asserting the wake-up pins or RESET or IRQ. NOTE IRQ always functions as an active-low wakeup input when the MCU is in stop2, regardless of how the pin is configured before entering stop2. In addition, the real-time interrupt (RTI) can wake the MCU from stop2 if enabled. Upon wake-up from stop2 mode, the MCU starts up as from a power-on reset (POR): • All module control and status registers are reset • The LVD reset function is enabled and the MCU remains in the reset state if VDD is below the LVD trip point (low trip point selected due to POR) • The CPU takes the reset vector In addition to the above, upon waking up from stop2, the PPDF bit in SPMSC2 is set. This flag is used to direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched until a 1 is written to PPDACK in SPMSC2. To maintain I/O states for pins that were configured as general-purpose I/O before entering stop2, the user must restore the contents of the I/O port registers, which have been saved in RAM, to the port registers MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 36 Freescale Semiconductor Chapter 3 Modes of Operation before writing to the PPDACK bit. If the port registers are not restored from RAM before writing to PPDACK, then the pins will switch to their reset states when PPDACK is written. For pins that were configured as peripheral I/O, the user must reconfigure the peripheral module that interfaces to the pin before writing to the PPDACK bit. If the peripheral module is not enabled before writing to PPDACK, the pins will be controlled by their associated port control registers when the I/O latches are opened. 3.6.3 Stop1 Mode Stop1 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most of the internal circuitry of the MCU is powered off in stop1, providing the lowest possible standby current. Upon entering stop1, all I/O pins automatically transition to their default reset states. Exit from stop1 is performed by asserting the wake-up pins or RESET or IRQ. NOTE IRQ always functions as an active-low wakeup input when the MCU is in stop1, regardless of how the pin is configured before entering stop1. In addition, the real-time interrupt (RTI) can wake the MCU from stop1 if enabled. Upon wake-up from stop1 mode, the MCU starts up as from a power-on reset (POR): • All module control and status registers are reset • The LVD reset function is enabled and the MCU remains in the reset state if VDD is below the LVD trip point (low trip point selected due to POR) • The CPU takes the reset vector In addition to the above, upon waking up from stop1, the PDF bit in SPMSC2 is set. This flag is used to direct user code to go to a stop1 recovery routine. PDF remains set until a 1 is written to PPDACK in SPMSC2. 3.6.4 On-Chip Peripheral Modules in Stop Modes When the MCU enters any stop mode, system clocks to the internal peripheral modules are stopped. Even in the exception case (ENBDM = 1), where clocks to the background debug logic continue to operate, clocks to the peripheral systems are halted to reduce power consumption. Refer to Section 3.6.3, “Stop1 Mode,” Section 3.6.2, “Stop2 Mode,” and Section 3.6.1, “Stop3 Mode,” for specific information on system behavior in stop modes. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 37 Chapter 3 Modes of Operation Table 3-2. Stop Mode Behavior Mode Peripheral Stop1 Stop2 Stop3 CPU Off Off Standby RAM Off Standby Standby FLASH Off Off Standby Parallel Port Registers Off Off Standby ADC Off Off Optionally On1 ACMP Off Off Standby ICG Off Off Optionally On2 IIC Off Off Standby LCD Off Off Optionally On3 SCI Off Off Standby SPI Off Off Standby TPM Off Off Standby Voltage Regulator Off Standby Standby I/O Pins Hi-Z States Held States Held 1 Requires the asynchronous ADC clock and LVD to be enabled, else in standby. OSCSPEN set in ICGC1, else in standby. 3 LCDSTP3 = 1 in the LCDCR1 register. 2 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 38 Freescale Semiconductor Chapter 4 Memory 4.1 MC9S08LC60 Series Memory Map As shown in Figure 4-1, on-chip memory in the MC9S08LC60 Series consists of RAM, FLASH program memory for nonvolatile data storage, plus I/O and control/status registers. The registers are divided into three groups: • Direct-page registers (0x0000 through 0x005F) • High-page registers (0x1800 through 0x186F) • Nonvolatile registers (0xFFB0 through 0xFFBF) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 39 Chapter 4 Memory 0x0000 0x0000 DIRECT PAGE REGISTERS DIRECT PAGE REGISTERS 0x005F 0x0060 0x005F 0x0060 RAM 2560 BYTES RAM 4096 BYTES 0x0A5F 0x0A60 0x105F 0x1060 UNIMPLEMENTED FLASH B 1952 BYTES 0x17FF 0x1800 0x17FF 0x1800 HIGH PAGE REGISTERS HIGH PAGE REGISTERS 0x186F 0x1870 0x186F 0x1870 FLASH B 26,512 BYTES FLASH B 12,288 BYTES 0x486F 0x4870 UNIMPLEMENTED 0x7FFF 0x8000 0x9FFF 0xA000 FLASH A 32,768 BYTES FLASH A 24,576 BYTES 0xFFFF 0xFFFF MC9S08LC36 MC9S08LC60 Figure 4-1. MC9S08LC60 Series Memory Map 4.1.1 Reset and Interrupt Vector Assignments Table 4-1 shows address assignments for reset and interrupt vectors. The vector names shown in this table are the labels used in the Freescale-provided equate file for the MC9S08LC60 Series. For more details about resets, interrupts, interrupt priority, and local interrupt mask controls, refer to Chapter 5, “Resets, Interrupts, and System Configuration.” Table 4-1. Reset and Interrupt Vectors Address (High/Low) 0xFFC0–0xFFC1 Vector Vector Name Unused Vector Space (available for user program) 0xFFD0–0xFFD1 0xFFD2–0xFFD3 LCD Vlcd MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 40 Freescale Semiconductor Chapter 4 Memory Table 4-1. Reset and Interrupt Vectors Address (High/Low) Vector Vector Name 0xFFD4–0xFFD5 RTI Vrti 0xFFD6–0xFFD7 IIC Viic 0xFFD8–0xFFD9 ACMP Vacmp 0xFFDA–0xFFDB ADC Conversion Vadc 0xFFDC–0xFFDD Keyboard 2 Vkeyboard2 0xFFDE–0xFFDF Keyboard 1 Vkeyboard1 0xFFE0–0xFFE1 SCI Transmit Vscitx 0xFFE2–0xFFE3 SCI Receive Vscirx 0xFFE4–0xFFE5 SCI Error Vscierr 0xFFE6–0xFFE7 SPI 2 Vspi2 0xFFE8–0xFFE9 SPI 1 Vspi1 0xFFEA–0xFFEB TPM2 Overflow Vtpm2ovf 0xFFEC–0xFFED TPM2 Channel 1 Vtpm2ch1 0xFFEE–0xFFEF TPM2 Channel 0 Vtpm2ch0 0xFFF0–0xFFF1 TPM1 Overflow Vtpm1ovf 0xFFF2–0xFFF3 TPM1 Channel 1 Vtpm1ch1 0xFFF4–0xFFF5 TPM1 Channel 0 Vtpm1ch0 0xFFF6–0xFFF7 ICG Vicg 0xFFF8–0xFFF9 Low Voltage Detect Vlvd 0xFFFA–0xFFFB IRQ Virq 0xFFFC–0xFFFD SWI Vswi 0xFFFE–0xFFFF Reset Vreset MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 41 Chapter 4 Memory 4.2 Register Addresses and Bit Assignments The registers in the MC9S08LC60 Series are divided into these three groups: • Direct-page registers are located in the first 128 locations in the memory map, so they are accessible with efficient direct addressing mode instructions. • High-page registers are used much less often, so they are located above 0x1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables. • The nonvolatile register area consists of a block of 16 locations in FLASH memory at 0xFFB0–0xFFBF. Nonvolatile register locations include: — NVPROT and NVOPT are loaded into working registers at reset — An 8-byte backdoor comparison key which optionally allows a user to gain controlled access to secure memory Because the nonvolatile register locations are FLASH memory, they must be erased and programmed like other FLASH memory locations. Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation instructions can be used to access any bit in any direct-page register. Table 4-2 is a summary of all user-accessible direct-page registers and control bits. The direct page registers in Table 4-2 can use the more efficient direct addressing mode which only requires the lower byte of the address. Because of this, the lower byte of the address in column one is shown in bold text. In Table 4-3 and Table 4-4 the whole address in column one is shown in bold. In Table 4-2, Table 4-3, and Table 4-4, the register names in column two are shown in bold to set them apart from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit locations that could read as 1s or 0s. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 42 Freescale Semiconductor Chapter 4 Memory Table 4-2. Direct-Page Register Summary (Sheet 1 of 3) Address Register Name 0x0000 PTAD 0x0001 PTADD 0x0002 PTBD 0x0003 PTBDD 0x0004 PTCD 0x0005 PTCDD Bit 7 6 5 4 3 2 1 Bit 0 PTAD7 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0 PTADD7 PTADD6 PTADD5 PTADD4 PTADD3 PTADD2 PTADD1 PTADD0 PTBD7 PTBD6 PTBD5 PTBD4 PTBD3 PTBD2 PTBD1 PTBD0 PTBDD7 PTBDD6 PTBDD5 PTBDD4 PTBDD3 PTBDD2 PTBDD1 PTBDD0 PTCD7 PTCD6 PTCD5 PTCD4 PTCD3 PTCD2 PTCD1 PTCD0 PTCDD7 PTCDD6 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0 0x0006 IRQSC 0 IRQPDD IRQEDG IRQPE IRQF IRQACK IRQIE IRQMOD 0x0007 Reserved — — — — — — — — 0x0008 KBI1SC 0 0 0 0 KBF KBACK KBIE KBIMOD 0x0009 KBI1PE KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0 0x000A KBI1ES KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0 0x000B Reserved — — — — — — — — 0x000C KBI2SC 0 0 0 0 KBF KBACK KBIE KBIMOD 0x000D KBI2PE KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0 0x000E KBI2ES KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0 0x000F ACMPSC ACME ACBGS ACF ACIE ACO R1 0x0010 ADCSC1 COCO AIEN ADCO 0x0011 ADCSC2 ADACT ADTRG ACFE ACFGT — — — — ACMOD ADCH 0x0012 ADCRH 0 0 0 0 ADR11 ADR10 ADR9 ADR8 0x0013 ADCRL ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 0x0014 ADCCVH 0 0 0 0 ADCV11 ADCV10 ADCV9 ADCV8 0x0015 ADCCVL ADCV7 ADCV6 ADCV5 ADCV4 ADCV3 ADCV2 ADCV1 ADCV0 0x0016 ADCCFG ADLPC 0x0017 APCTL1 ADPC7 0x0018 IICA 0x0019 IICF 0x001A IICC IICEN IICIE MST TX TXAK RSTA 0 0 0x001B IICS TCF IAAS BUSY ARBL 0 SRW IICIF RXAK ADIV ADPC6 ADLSMP ADPC5 ADPC4 MODE ADPC3 ADICLK ADPC2 ADPC1 ADPC0 0 ADDR MULT ICR 0x001C IICD 0x001D Reserved — — — — DATA — — — — 0x001E Reserved — — — — — — — — 0x001F Reserved — — — — — — — — 0x0020 SCIBDH 0 0 0 SBR12 SBR11 SBR10 SBR9 SBR8 0x0021 SCIBDL SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0x0022 SCIC1 LOOPS SCISWAI RSRC M WAKE ILT PE PT 0x0023 SCIC2 TIE TCIE RIE ILIE TE RE RWU SBK 0x0024 SCIS1 TDRE TC RDRF IDLE OR NF FE PF 0x0025 SCIS2 0 0 0 0 0 BRK13 0 RAF 0x0026 SCIC3 R8 T8 TXDIR TXINV ORIE NEIE FEIE PEIE 0x0027 SCID Bit 7 6 5 4 3 2 1 Bit 0 0x0028 SPI1C1 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE 0x0029 SPI1C2 0 0 0 MODFEN BIDIROE 0 SPISWAI SPC0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 43 Chapter 4 Memory Table 4-2. Direct-Page Register Summary (Sheet 2 of 3) Address Register Name 0x002A SPI1BR 0x002B SPI1S Bit 7 6 5 4 3 2 1 Bit 0 0 SPPR2 SPPR1 SPPR0 0 SPR2 SPR1 SPR0 SPRF 0 SPTEF MODF 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Reserved 0 0 0 0 0 0 0 0 Reserved 0 0 0 0 0 0 0 0 SPI2C1 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE SPI2C2 0 0 0 MODFEN BIDIROE 0 SPISWAI SPC0 0x002C Reserved 0x002D SPI1D 0x002E 0x002F 0x0030 0x0031 0x0032 SPI2BR 0x0033 SPI2S 0 SPPR2 SPPR1 SPPR0 0 SPR2 SPR1 SPR0 SPRF 0 SPTEF MODF 0 0 0 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Reserved 0 0 0 0 0 0 0 0 Reserved 0 0 0 0 0 0 0 0 ICGC1 HGO RANGE REFS OSCSTEN LOCD 0 ICGC2 LOLRE 0x0034 Reserved 0x0035 SPI2D 0x0036 0x0037 0x0038 0x0039 0x003A ICGS1 REFST LOLS LOCK LOCS ERCS ICGIF 0x003B ICGS2 0 0 0 0 0 0 0 DCOS 0x003C ICGFLTU 0 0 0 0 0x003D ICGFLTL 0 CLKS MFD CLKST LOCRE RFD FLT FLT 0x003E ICGTRM 0x003F Reserved TRIM 0x0040 0x0041 0x0042 TPM1CNTL Bit 7 6 5 4 3 2 1 Bit 0 0x0043 TPM1MODH Bit 15 14 13 12 11 10 9 Bit 8 0x0044 TPM1MODL Bit 7 6 5 4 3 2 1 Bit 0 0x0045 TPM1C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0 0x0046 TPM1C0VH Bit 15 14 13 12 11 10 9 Bit 8 0x0047 TPM1C0VL Bit 7 6 5 4 3 2 1 Bit 0 0x0048 TPM1C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0 0x0049 TPM1C1VH Bit 15 14 13 12 11 10 9 Bit 8 0x004A TPM1C1VL Bit 7 6 5 4 3 2 1 Bit 0 0x004B Reserved — — — — — — — — 0x004C Reserved — — — — — — — — 0x004D Reserved — — — — — — — — 0x004E Reserved — — — — — — — — 0x004F Reserved — — — — — — — — 0x0050 TPM2SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0 0x0051 TPM2CNTH Bit 15 14 13 12 11 10 9 Bit 8 0x0052 TPM2CNTL Bit 7 6 5 4 3 2 1 Bit 0 0x0053 TPM2MODH Bit 15 14 13 12 11 10 9 Bit 8 0 0 0 0 0 0 0 TPM1SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0 TPM1CNTH Bit 15 14 13 12 11 10 9 Bit 8 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 44 Freescale Semiconductor Chapter 4 Memory Table 4-2. Direct-Page Register Summary (Sheet 3 of 3) Address Register Name Bit 7 6 5 4 3 2 1 Bit 0 0x0054 TPM2MODL Bit 7 6 5 4 3 2 1 Bit 0 0x0055 TPM2C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0 0x0056 TPM2C0VH Bit 15 14 13 12 11 10 9 Bit 8 0x0057 TPM2C0VL Bit 7 6 5 4 3 2 1 Bit 0 0x0058 TPM2C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0 0x0059 TPM2C1VH Bit 15 14 13 12 11 10 9 Bit 8 0x005A TPM2C1VL Bit 7 6 5 4 3 2 1 Bit 0 0x005B– 0x005F Reserved — — — — — — — — 1 For the MC9S08LC60 Series, the AMCPO pin is not available, so the ACOPE bit in the ACMPSC register is reserved and does not have any effect. High-page registers, shown in Table 4-3, are accessed much less often than other I/O and control registers so they have been located outside the direct addressable memory space, starting at 0x1800. Table 4-3. High-Page Register Summary Address Register Name 0x1800 0x1801 0x1802 0x1803 0x1804 0x1805 0x1806 0x1807 0x1808 0x1809 0x180A 0x180B 0x180C 0x180D– 0x180F 0x1810 0x1811 0x1812 0x1813 0x1814 0x1815 0x1816 0x1817 0x1818 0x1819– 0x181F 0x1820 0x1821 0x1822 0x1823 Bit 7 6 5 4 3 2 1 Bit 0 SRS SBDFR SOPT1 SOPT2 Reserved Reserved SDIDH SDIDL SRTISC SPMSC1 SPMSC2 Reserved SPMSC3 Reserved POR 0 COPE COPCLKS — — REV3 ID7 RTIF LVDF 0 — LVWF PIN 0 COPT 0 — — REV2 ID6 RTIACK LVDACK 0 — LVWACK COP 0 STOPE 0 — — REV1 ID5 RTICLKS LVDIE 0 — LVDV ILOP 0 — 0 — — REV0 ID4 RTIE LVDRE PDF — LVWV 0 0 0 0 — — ID11 ID3 0 LVDSE PPDF — 0 ICG 0 0 0 — — ID10 ID2 RTIS2 LVDE PPDACK — 0 LVD 0 BKGDPE 0 — — ID9 ID1 RTIS1 0 PDC — 0 0 BDFR RSTPE ACIC — — ID8 ID0 RTIS0 BGBE PPDC — 0 — — — — — — — — DBGCAH DBGCAL DBGCBH DBGCBL DBGFH DBGFL DBGC DBGT DBGS Reserved Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 DBGEN TRGSEL AF 14 6 14 6 14 6 ARM BEGIN BF 13 5 13 5 13 5 TAG 0 ARMF 12 4 12 4 12 4 BRKEN 0 0 11 3 11 3 11 3 RWA TRG3 CNT3 10 2 10 2 10 2 RWAEN TRG2 CNT2 9 1 9 1 9 1 RWB TRG1 CNT1 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 RWBEN TRG0 CNT0 — — — — — — — — FCDIV FOPT Reserved FCNFG DIVLD KEYEN — 0 PRDIV8 FNORED — 0 DIV5 0 — KEYACC DIV4 0 — 0 DIV3 0 — 0 DIV2 0 — 0 DIV1 SEC01 — 0 DIV0 SEC00 — 0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 45 Chapter 4 Memory Table 4-3. High-Page Register Summary (continued) Address Register Name 0x1824 0x1825 0x1826 0x1827– 0x182F 0x1830 0x1831 0x1832 0x1833 0x1834 0x1835 0x1836 0x1837 0x1838 0x1839 0x183A 0x183B0x187F 0x1840 0x1841 0x1842 0x1843 0x1844 0x1845 0x1846 0x1847 0x1848 0x1849 0x184A 0x184B 0x184C 0x184D 0x184E 0x184F 0x1850 0x1851 0x1852 0x1853 0x1854 0x1855 0x1856 0x1857 0x1858 0x1859 0x185A 0x185B 0x185C FPROT FSTAT FCMD Reserved PTAPE PTASE PTADS Reserved PTBPE PTBSE PTBDS Reserved PTCPE PTCSE PTCDS Reserved LCDCR0 LCDCR1 FPENR0 FPENR1 FPENR2 FPENR3 FPENR4 FPENR5 LCDRAM0 LCDRAM1 LCDRAM2 LCDRAM3 LCDRAM4 LCDRAM5 LCDRAM6 LCDRAM7 LCDRAM8 LCDRAM9 LCDRAM10 LCDRAM11 LCDRAM12 LCDRAM13 LCDRAM14 LCDRAM15 LCDRAM16 LCDRAM17 LCDRAM18 LCDRAM19 LCDRAM20 Bit 7 6 5 4 3 2 1 Bit 0 FPS7 FCBEF FCMD7 — — PTAPE7 PTASE7 PTADS7 0 PTBPE7 PTBSE7 PTBDS7 0 PTCPE7 PTCSE7 PTCDS7 FPS6 FCCF FCMD6 — — PTAPE6 PTASE6 PTADS6 0 PTBPE6 PTBSE6 PTBDS6 0 PTCPE6 PTCSE6 PTCDS6 FPS5 FPVIOL FCMD5 — — PTAPE5 PTASE5 PTADS5 0 PTBPE5 PTBSE5 PTBDS5 0 PTCPE5 PTCSE5 PTCDS5 FPS4 FACCERR FCMD4 — — PTAPE4 PTASE4 PTADS4 0 PTBPE4 PTBSE4 PTBDS4 0 PTCPE4 PTCSE4 PTCDS4 FPS3 0 FCMD3 — — PTAPE3 PTASE3 PTADS3 0 PTBPE3 PTBSE3 PTBDS3 0 PTCPE3 PTCSE3 PTCDS3 FPS2 FBLANK FCMD2 — — PTAPE2 PTASE2 PTADS2 0 PTBPE2 PTBSE2 PTBDS2 0 PTCPE2 PTCSE2 PTCDS2 FPS1 0 FCMD1 — — PTAPE1 PTASE1 PTADS1 0 PTBPE1 PTBSE1 PTBDS1 0 PTCPE1 PTCSE1 PTCDS1 FPDIS 0 FCMD0 — — PTAPE0 PTASE0 PTADS0 0 PTBPE0 PTBSE0 PTBDS0 0 PTCPE0 PTCSE0 PTCDS0 — — — — — — — — LCDEN LCDIEN FP7EN FP15EN FP23EN FP31EN FP39EN 0 FP1BP3 FP3BP3 FP5BP3 FP7BP3 FP9BP3 FP11BP3 FP13BP3 FP15BP3 FP17BP3 FP19BP3 FP21BP3 FP23BP3 FP25BP3 FP27BP3 FP29BP3 FP31BP3 FP33BP3 FP35BP3 FP37BP3 FP39BP3 0 LPWAVE 0 FP6EN FP14EN FP22EN FP30EN FP38EN 0 FP1BP2 FP3BP2 FP5BP2 FP7BP2 FP9BP2 FP11BP2 FP13BP2 FP15BP2 FP17BP2 FP19BP2 FP21BP2 FP23BP2 FP25BP2 FP27BP2 FP29BP2 FP31BP2 FP33BP2 FP35BP2 FP37BP2 FP39BP2 0 LCLK2 0 FP5EN FP13EN FP21EN FP29EN FP37EN 0 FP1BP1 FP3BP1 FP5BP1 FP7BP1 FP9BP1 FP11BP1 FP13BP1 FP15BP1 FP17BP1 FP19BP1 FP21BP1 FP23BP1 FP25BP1 FP27BP1 FP29BP1 FP31BP1 FP33BP1 FP35BP1 FP37BP1 FP39BP1 0 LCLK1 0 FP4EN FP12EN FP20EN FP28EN FP36EN 0 FP1BP0 FP3BP0 FP5BP0 FP7BP0 FP9BP0 FP11BP0 FP13BP0 FP15BP0 FP17BP0 FP19BP0 FP21BP0 FP23BP0 FP25BP0 FP27BP0 FP29BP0 FP31BP0 FP33BP0 FP35BP0 FP37BP0 FP39BP0 0 LCLK0 0 FP3EN FP11EN FP19EN FP27EN FP35EN 0 FP0BP3 FP2BP3 FP4BP3 FP6BP3 FP8BP3 FP10BP3 FP12BP3 FP14BP3 FP16BP3 FP18BP3 FP20BP3 FP22BP3 FP24BP3 FP26BP3 FP28BP3 FP30BP3 FP32BP3 FP34BP3 FP36BP3 FP38BP3 FP40BP3 0 0 FP2EN FP10EN FP18EN FP26EN FP34EN 0 FP0BP2 FP2BP2 FP4BP2 FP6BP2 FP8BP2 FP10BP2 FP12BP2 FP14BP2 FP16BP2 FP18BP2 FP20BP2 FP22BP2 FP24BP2 FP26BP2 FP28BP2 FP30BP2 FP32BP2 FP34BP2 FP36BP2 FP38BP2 FP40BP2 DUTY1 LCDWAI FP1EN FP9EN FP17EN FP25EN FP33EN 0 FP0BP1 FP2BP1 FP4BP1 FP6BP1 FP8BP1 FP10BP1 FP12BP1 FP14BP1 FP16BP1 FP18BP1 FP20BP1 FP22BP1 FP24BP1 FP26BP1 FP28BP1 FP30BP1 FP32BP1 FP34BP1 FP36BP1 FP38BP1 FP40BP1 DUTY0 LCDSTP3 FP0EN FP8EN FP16EN FP24EN FP32EN FP40EN FP0BP0 FP2BP0 FP4BP0 FP6BP0 FP8BP0 FP10BP0 FP12BP0 FP14BP0 FP16BP0 FP18BP0 FP20BP0 FP22BP0 FP24BP0 FP26BP0 FP28BP0 FP30BP0 FP32BP0 FP34BP0 FP36BP0 FP38BP0 FP40BP0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 46 Freescale Semiconductor Chapter 4 Memory Table 4-3. High-Page Register Summary (continued) Address Register Name 0x185D– 0x1861 0x1862 0x1863 0x1864 0x1865 0x1866– 0x186F Reserved LCDCLKS LCDSUPPLY LCDBCTL LCDCMD Reserved Bit 7 6 5 4 3 2 1 Bit 0 — — — — — — — — SOURCE DIV16 LCDCPEN LCDCPMS BLINK 0 LCDIF 0 — — CLKADJ5 CPCADJ1 0 0 — CLKADJ4 CLKADJ3 CLKADJ2 CLKADJ1 CLKADJ0 CPCADJ0 HDRVBUF BBYPASS VSUPPLY1 VSUPPLY0 0 BLKMODE BRATE2 BRATE1 BRATE0 0 LCDDRMS 0 LCDCLR BLANK — — — — — Nonvolatile FLASH registers, shown in Table 4-4, are located in the FLASH memory. These registers include an 8-byte backdoor key which optionally can be used to gain access to secure memory resources. During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the FLASH memory are transferred into corresponding FPROT and FOPT working registers in the high-page registers to control security and block protection options. Table 4-4. Nonvolatile Register Summary Address Register Name 0xFFB0– 0xFFB7 NVBACKKEY 0xFFB8– 0xFFBC Reserved 0xFFBD NVPROT 0xFFBE NVICGTRM1 0xFFBF NVOPT 1 Bit 7 6 5 4 3 2 1 Bit 0 — — — — FPS3 FPS2 FPS1 FPDIS 0 SEC01 SEC00 8-Byte Comparison Key — — — — FPS7 FPS6 FPS5 FPS4 NVTRIM KEYEN FNORED 0 0 0 Freescale Semiconductor provides a factory trim to set the FIRG to 243 kHz. If user code changes the value of the NVICGTRM register, the factory trim value will be lost. User code should save the content of NVICGTRM before any mass erase operation. Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily disengage memory security. This key mechanism can be accessed only through user code running in secure memory. (A security key cannot be entered directly through background debug commands.) This security key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the only way to disengage security is by mass erasing the FLASH if needed (normally through the background debug interface) and verifying that FLASH is blank. To avoid returning to secure mode after the next reset, program the security bits (SEC01:SEC00) to the unsecured state (1:0). 4.3 RAM The MC9S08LC60 Series includes static RAM. The locations in RAM below 0x0100 can be accessed using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program variables in this area of RAM is preferred. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 47 Chapter 4 Memory The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on or after wakeup from stop1, the contents of RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage does not drop below the minimum value for RAM retention. For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the MC9S08LC60 Series, it is usually best to re-initialize the stack pointer to the top of the RAM so the direct page RAM can be used for frequently accessed RAM variables and bit-addressable program variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated to the highest address of the RAM in the Freescale-provided equate file). LDHX TXS #RamLast+1 ;point one past RAM ;SP<-(H:X-1) When security is enabled, the RAM is considered a secure memory resource and is not accessible through BDM or through code executing from non-secure memory. See Section 4.5, “Security” for a detailed description of the security feature. 4.4 FLASH The FLASH memory is intended primarily for program storage. In-circuit programming allows the operating program to be loaded into the FLASH memory after final assembly of the application product. It is possible to program the entire array through the single-wire background debug interface. Because no special voltages are needed for FLASH erase and programming operations, in-application programming is also possible through other software-controlled communication paths. For a more detailed discussion of in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale Semiconductor document order number HCS08RMv1/D. Because the MC9S08LC60 Series contains two FLASH arrays, program and erase operations can be conducted on one array while executing code from the other. The security and protection features treat the two arrays as a single memory entity. Programming and erasing of each FLASH array is conducted through the same command interface detailed in the following sections. It is not possible to page erase or program both arrays at the same time. The mass erase command will erase both arrays, and the blank check command will check both arrays. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 48 Freescale Semiconductor Chapter 4 Memory 4.4.1 Features Features of the FLASH memory include: • FLASH Size — MC9S08LC60 — 63,232 bytes (28,464 bytes in Flash B, 32,768 bytes in Flash A) — MC9S08LC36 — 36,864 bytes (12,288 bytes in Flash B, 24,576 bytes in Flash A) • Single power supply program and erase • Command interface for fast program and erase operation • Up to 100,000 program/erase cycles at typical voltage and temperature • Flexible block protection • Security feature for FLASH and RAM • Auto power-down for low-frequency read accesses to minimize run IDD • FLASH read/program/erase over full operating voltage or temperature 4.4.2 Program and Erase Times Before any program or erase command can be accepted, the FLASH clock divider register (FCDIV) must be written to set the internal clock for the FLASH module to a frequency (fFCLK) between 150 kHz and 200 kHz (see Section 4.6.1, “FLASH Clock Divider Register (FCDIV)). This register can be written only once, so normally this write is done during reset initialization. FCDIV cannot be written if the access error flag, FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the FCDIV register. One period of the resulting clock (1/fFCLK) is used by the command processor to time program and erase pulses. An integer number of these timing pulses is used by the command processor to complete a program or erase command. Table 4-5 shows program and erase times. The bus clock frequency and FCDIV determine the frequency of FCLK (fFCLK). The time for one cycle of FCLK is tFCLK = 1/fFCLK. The times are shown as a number of cycles of FCLK and as an absolute time for the case where tFCLK = 5 μs. Program and erase times shown include overhead for the command state machine and enabling and disabling of program and erase voltages. Table 4-5. Program and Erase Times Parameter 1 Cycles of FCLK Time if FCLK = 200 kHz Byte program 9 45 μs Byte program (burst) 4 20 μs1 Page erase 4000 20 ms Mass erase 20,000 100 ms Excluding start/end overhead MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 49 Chapter 4 Memory 4.4.3 Program and Erase Command Execution The steps for executing any of the commands are listed below. The FCDIV register must be initialized and any error flags cleared before beginning command execution. The command execution steps are: 1. Write a data value to an address in the FLASH array. The address and data information from this write is latched into the FLASH interface. This write is a required first step in any command sequence. For erase and blank check commands, the value of the data is not important. For page erase commands, the address may be any address in the 512-byte page of FLASH to be erased. For mass erase and blank check commands, the address can be any address in the FLASH memory. Whole pages of 512 bytes are the smallest block of FLASH that may be erased. In some boundary conditions with RAM or high page registers, the size of a block that is accessible to the user is less than 512 bytes. NOTE Do not program any byte in the FLASH more than once after a successful erase operation. Reprogramming bits in a byte which is already programmed is not allowed without first erasing the page in which the byte resides or mass erasing the entire FLASH memory. Programming without first erasing may disturb data stored in the FLASH. 2. Write the command code for the desired command to FCMD. The five valid commands are blank check (0x05), byte program (0x20), burst program (0x25), page erase (0x40), and mass erase (0x41). The command code is latched into the command buffer. 3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its address and data information). A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the write to the memory array and before writing the 1 that clears FCBEF and launches the complete command. Aborting a command in this way sets the FACCERR access error flag which must be cleared before starting a new command. A strictly monitored procedure must be obeyed or the command will not be accepted. This minimizes the possibility of any unintended changes to the FLASH memory contents. The command complete flag (FCCF) indicates when a command is complete. The command sequence must be completed by clearing FCBEF to launch the command. Figure 4-2 is a flowchart for executing all of the commands except for burst programming. The FCDIV register must be initialized before using any FLASH commands. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 50 Freescale Semiconductor Chapter 4 Memory WRITE TO FCDIV (Note 1) FLASH PROGRAM AND ERASE FLOW Note 1: Required only once after reset. START FACCERR ? 0 1 CLEAR ERROR WRITE TO FLASH TO BUFFER ADDRESS AND DATA WRITE COMMAND TO FCMD WRITE 1 TO FCBEF TO LAUNCH COMMAND AND CLEAR FCBEF (Note 2) FPVIOL OR FACCERR ? Note 2: Wait at least four bus cycles before checking FCBEF or FCCF. YES ERROR EXIT NO 0 FCCF ? 1 DONE Figure 4-2. FLASH Program and Erase Flowchart 4.4.4 Burst Program Execution The burst program command is used to program sequential bytes of data in less time than would be required using the standard program command. For the MC9S08LC60 Series, it is possible to burst across FLASH array boundaries as long as the addresses are consecutive. This is possible because the high voltage to the FLASH array does not need to be disabled between program operations. Ordinarily, when a program or erase command is issued, an internal charge pump associated with the FLASH memory must be enabled to supply high voltage to the array. Upon completion of the command, the charge pump is turned off. When a burst program command is issued, the charge pump is enabled and then remains enabled after completion of the burst program operation if these two conditions are met: • The next burst program command has been queued before the current program operation has completed. • The next sequential address selects a byte on the same physical row as the current byte being programmed. A row of FLASH memory consists of 64 bytes. A byte within a row is selected by addresses A5 through A0. A new row begins when addresses A5 through A0 are all zero. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 51 Chapter 4 Memory The first byte of a series of sequential bytes being programmed in burst mode will take the same amount of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst program time provided that the conditions above are met. In the case the next sequential address is the beginning of a new row, the program time for that byte will be the standard time instead of the burst time. This is because the high voltage to the array must be disabled and then enabled again. If a new burst command has not been queued before the current command completes, then the charge pump will be disabled and high voltage removed from the array. Note 1: Required only once after reset. WRITE TO FCDIV (Note 1) FLASH BURST PROGRAM FLOW START FACCERR ? 1 0 CLEAR ERROR FCBEF ? 1 0 WRITE TO FLASH TO BUFFER ADDRESS AND DATA WRITE COMMAND (0x25) TO FCMD WRITE 1 TO FCBEF TO LAUNCH COMMAND AND CLEAR FCBEF (Note 2) FPVIO OR FACCERR ? NO YES Note 2: Wait at least four bus cycles before checking FCBEF or FCCF. YES ERROR EXIT NEW BURST COMMAND ? NO 0 FCCF ? 1 DONE Figure 4-3. FLASH Burst Program Flowchart MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 52 Freescale Semiconductor Chapter 4 Memory 4.4.5 Access Errors An access error occurs whenever the command execution protocol is violated. Any of the following specific actions will cause the access error flag (FACCERR) in FSTAT to be set. FACCERR must be cleared by writing a 1 to FACCERR in FSTAT before any command can be processed. • Writing to a FLASH address before the internal FLASH clock frequency has been set by writing to the FCDIV register • Writing to a FLASH address while FCBEF is not set (A new command cannot be started until the command buffer is empty.) • Writing a second time to a FLASH address before launching the previous command (There is only one write to FLASH for every command.) • Writing a second time to FCMD before launching the previous command (There is only one write to FCMD for every command.) • Writing to any FLASH control register other than FCMD after writing to a FLASH address • Writing any command code other than the five allowed codes (0x05, 0x20, 0x25, 0x40, or 0x41) to FCMD • Accessing (read or write) any FLASH control register other than the write to FSTAT (to clear FCBEF and launch the command) after writing the command to FCMD • The MCU enters stop mode while a program or erase command is in progress (The command is aborted.) • Writing the byte program, burst program, or page erase command code (0x20, 0x25, or 0x40) with a background debug command while the MCU is secured (The background debug controller can do blank check and mass erase commands only while the MCU is secure.) • Writing 0 to FCBEF to cancel a partial command 4.4.6 FLASH Block Protection The block protection feature prevents the protected region of FLASH from program or erase changes. Block protection is controlled through the FLASH Protection Register (FPROT). When enabled, block protection begins at any 512 byte boundary below the last address of FLASH, 0xFFFF. (see Section 4.6.4, “FLASH Protection Register (FPROT and NVPROT)”). After exit from reset, FPROT is loaded with the contents of the NVPROT location which is in the nonvolatile register block of the FLASH memory. In user mode, if FPDIS is set, all FPROT bits are writeable. In user mode, if FPDIS is clear, the FPS bits are writeable as long as the size of the protected region is being increased. Because NVPROT is within the last sector of FLASH, if any amount of memory is protected, NVPROT is itself protected and cannot be altered (intentionally or unintentionally) by the application software. FPROT can be written through background debug commands, which provide a way to erase and reprogram protected FLASH memory. The block protection mechanism is illustrated in Figure 4-4. The FPS bits are used as the upper bits of the last address of unprotected memory. This address is formed by concatenating FPS7:FPS1 with logic 1 bits as shown. For example, in order to protect the last 8192 bytes of memory (addresses 0xE000 through 0xFFFF), the FPS bits must be set to 1101 111 which results in the value 0xDFFF as the last address of unprotected memory. In addition to programming the FPS bits to the appropriate value, FPDIS (bit 0 of MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 53 Chapter 4 Memory NVPROT) must be programmed to logic 0 to enable block protection. Therefore the value 0xDE must be programmed into NVPROT to protect addresses 0xE000 through 0xFFFF. FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 A15 A14 A13 A12 A11 A10 A9 1 1 1 1 1 1 1 1 1 A8 A7 A6 A5 A4 A3 A2 A1 A0 Figure 4-4. Block Protection Mechanism One use for block protection is to block protect an area of FLASH memory for a bootloader program. This bootloader program can call a routine outside of FLASH that can be used to sector erase and re-program the rest of the FLASH memory. The bootloader is protected even if MCU power is lost during an erase and reprogram operation. 4.4.7 Vector Redirection Whenever any block protection is enabled, the reset and interrupt vectors will be protected. Vector redirection allows users to modify interrupt vector information without unprotecting bootloader and reset vector space. Vector redirection is enabled by programming the FNORED bit in the NVOPT register located at address 0xFFBF to zero. For redirection to occur, at least some portion but not all of the FLASH memory must be block protected by programming the NVPROT register located at address 0xFFBD. All of the interrupt vectors (memory locations 0xFFC0–0xFFFD) are redirected, while the reset vector (0xFFFE–0xFFFF) is not. When more than 32K is protected, vector redirection must not be enabled. For example, if 512 bytes of FLASH are protected, the protected address region is from 0xFE00 through 0xFFFF. The interrupt vectors (0xFFC0–0xFFFD) are redirected to the locations 0xFDC0–0xFDFD. Now, if an SPI interrupt is taken for instance, the values in the locations 0xFDE0–0xFDE1 are used for the vector instead of the values in the locations 0xFFE0–0xFFE1. This allows the user to reprogram the unprotected portion of the FLASH with new program code including new interrupt vector values while leaving the protected area, which includes the default vector locations, unchanged. 4.5 Security The MC9S08LC60 Series includes circuitry to prevent unauthorized access to the contents of FLASH and RAM memory. When security is engaged, FLASH and RAM are considered secure resources. Direct-page registers, high-page registers, and the background debug controller are considered unsecured resources. Programs executing within secure memory have normal access to any MCU memory locations and resources. Attempts to access a secure memory location with a program executing from an unsecured memory space or through the background debug interface are blocked (writes are ignored and reads return all 0s). Security is engaged or disengaged based on the state of two nonvolatile register bits (SEC01:SEC00) in the FOPT register. During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into the working FOPT register in high-page register space. A user engages security by programming the NVOPT location which can be done at the same time the FLASH memory is programmed. The 1:0 state disengages security while the other three combinations engage security. Notice the erased state (1:1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 54 Freescale Semiconductor Chapter 4 Memory makes the MCU secure. During development, whenever the FLASH is erased, it is good practice to immediately program the SEC00 bit to 0 in NVOPT so SEC01:SEC00 = 1:0. This would allow the MCU to remain unsecured after a subsequent reset. The on-chip debug module cannot be enabled while the MCU is secure. The separate background debug controller can still be used for background memory access commands, but the MCU cannot enter active background mode except by holding BKGD/MS low at the rising edge of reset. A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there is no way to disengage security without completely erasing all FLASH locations. If KEYEN is 1, a secure user program can temporarily disengage security by: 1. Writing 1 to KEYACC in the FCNFG register. This makes the FLASH module interpret writes to the backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to be compared against the key rather than as the first step in a FLASH program or erase command. 2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations. These writes must be done in order, starting with the value for NVBACKKEY and ending with NVBACKKEY+7. STHX should not be used for these writes because these writes cannot be done on adjacent bus cycles. User software normally would get the key codes from outside the MCU system through a communication interface such as a serial I/O. 3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was just written matches the key stored in the FLASH locations, SEC01:SEC00 are automatically changed to 1:0 and security will be disengaged until the next reset. The security key can be written only from secure memory (either RAM or FLASH), so it cannot be entered through background commands without the cooperation of a secure user program. The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in FLASH memory locations in the nonvolatile register space so users can program these locations just as they would program any other FLASH memory location. The nonvolatile registers are in the same 512-byte block of FLASH as the reset and interrupt vectors, so block protecting that space also block protects the backdoor comparison key. Block protects cannot be changed from user application programs, so if the vector space is block protected, the backdoor security key mechanism cannot permanently change the block protect, security settings, or the backdoor key. Security can always be disengaged through the background debug interface by performing these steps: 1. Disable any block protections by writing FPROT. FPROT can be written only with background debug commands, not from application software. 2. Mass erase FLASH, if necessary. 3. Blank check FLASH. Provided FLASH is completely erased, security is disengaged until the next reset. To avoid returning to secure mode after the next reset, program NVOPT so SEC01:SEC00 = 1:0. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 55 Chapter 4 Memory 4.6 FLASH Registers and Control Bits The FLASH module consists of high-page including nonvolatile registers that are copied into corresponding high-page control registers at reset. There is also an 8-byte comparison key in FLASH memory. Refer to Table 4-3 and Table 4-4 for the absolute address assignments for all FLASH registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file normally is used to translate these names into the appropriate absolute addresses. 4.6.1 FLASH Clock Divider Register (FCDIV) Bit 7 of this register is a read-only status flag. Bits 6 through 0 may be read at any time but can be written only one time. Before any erase or programming operations are possible, write to this register to set the frequency of the clock for the nonvolatile memory system within acceptable limits. 7 R 6 5 4 3 2 1 0 PRDIV8 DIV5 DIV4 DIV3 DIV2 DIV1 DIV0 0 0 0 0 0 0 0 DIVLD W Reset 0 = Unimplemented or Reserved Figure 4-5. FLASH Clock Divider Register (FCDIV) Table 4-6. FCDIV Field Descriptions Field Description 7 DIVLD Divisor Loaded Status Flag — When set, this read-only status flag indicates that the FCDIV register has been written since reset. Reset clears this bit and the first write to this register causes this bit to become set regardless of the data written. 0 FCDIV has not been written since reset; erase and program operations disabled for FLASH. 1 FCDIV has been written since reset; erase and program operations enabled for FLASH. 6 PRDIV8 Prescale (Divide) FLASH Clock by 8 0 Clock input to the FLASH clock divider is the bus rate clock. 1 Clock input to the FLASH clock divider is the bus rate clock divided by 8. 5 DIV[5:0] Divisor for FLASH Clock Divider — The FLASH clock divider divides the bus rate clock (or the bus rate clock divided by 8 if PRDIV8 = 1) by the value in the 6-bit DIV5:DIV0 field plus one. The resulting frequency of the internal FLASH clock must fall within the range of 200 kHz to 150 kHz for proper FLASH operations. Program/erase timing pulses are one cycle of this internal FLASH clock, which corresponds to a range of 5 μs to 6.7 μs. The automated programming logic uses an integer number of these pulses to complete an erase or program operation. See Equation 4-1 and Equation 4-2. Table 4-7 shows the appropriate values for PRDIV8 and DIV5:DIV0 for selected bus frequencies. if PRDIV8 = 0 — fFCLK = fBus ÷ ([DIV5:DIV0] + 1) Eqn. 4-1 if PRDIV8 = 1 — fFCLK = fBus ÷ (8 × ([DIV5:DIV0] + 1)) Eqn. 4-2 Table 4-7 shows the appropriate values for PRDIV8 and DIV5:DIV0 for selected bus frequencies. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 56 Freescale Semiconductor Chapter 4 Memory Table 4-7. FLASH Clock Divider Settings fBus PRDIV8 (Binary) DIV5:DIV0 (Decimal) fFCLK Program/Erase Timing Pulse (5 μs Min, 6.7 μs Max) 20 MHz 1 12 192.3 kHz 5.2 μs 10 MHz 0 49 200 kHz 5 μs 8 MHz 0 39 200 kHz 5 μs 4 MHz 0 19 200 kHz 5 μs 2 MHz 0 9 200 kHz 5 μs 1 MHz 0 4 200 kHz 5 μs 200 kHz 0 0 200 kHz 5 μs 150 kHz 0 0 150 kHz 6.7 μs 4.6.2 FLASH Options Register (FOPT and NVOPT) During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into FOPT. Bits 5 through 2 are not used and always read 0. This register may be read at any time, but writes have no meaning or effect. To change the value in this register, erase and reprogram the NVOPT location in FLASH memory as usual and then issue a new MCU reset. R 7 6 5 4 3 2 1 0 KEYEN FNORED 0 0 0 0 SEC01 SEC00 W Reset This register is loaded from nonvolatile location NVOPT during reset. = Unimplemented or Reserved Figure 4-6. FLASH Options Register (FOPT) Table 4-8. FOPT Field Descriptions Field Description 7 KEYEN Backdoor Key Mechanism Enable — When this bit is 0, the backdoor key mechanism cannot be used to disengage security. The backdoor key mechanism is accessible only from user (secured) firmware. BDM commands cannot be used to write key comparison values that would unlock the backdoor key. For more detailed information about the backdoor key mechanism, refer to Section 4.5, “Security.” 0 No backdoor key access allowed. 1 If user firmware writes an 8-byte value that matches the nonvolatile backdoor key (NVBACKKEY through NVBACKKEY+7, in that order), security is temporarily disengaged until the next MCU reset. 6 FNORED Flash No Redirect (Vector Redirection Disable) — When this bit is 1, then vector redirection is disabled. 0 Vector redirection enabled. 1 Vector redirection disabled. 1:0 SEC0[1:0] Security State Code — This 2-bit field determines the security state of the MCU as shown in Table 4-9. When the MCU is secure, the contents of RAM and FLASH memory cannot be accessed by instructions from any unsecured source including the background debug interface. For more detailed information about security, refer to Section 4.5, “Security.” MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 57 Chapter 4 Memory Table 4-9. Security States 1 4.6.3 SEC01:SEC00 Description 0:0 secure 1 0:1 secure 1:0 unsecured 1:1 secure The 0:1 bit pattern is the recommended value to be used since it requires two bit changes before going to the unsecured state. FLASH Configuration Register (FCNFG) Bits 7 through 5 may be read or written at any time. Bits 4 through 0 always read 0 and cannot be written. R 7 6 0 0 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 KEYACC W Reset 0 0 0 = Unimplemented or Reserved Figure 4-7. FLASH Configuration Register (FCNFG) Table 4-10. FCNFG Field Descriptions Field Description 5 KEYACC Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed information about the backdoor key mechanism, refer to Section 4.5, “Security.” 0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a FLASH programming or erase command. 1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes. 4.6.4 FLASH Protection Register (FPROT and NVPROT) The FPROT register defines which FLASH sectors are protected against program and erase operations. The FPROT register is also used to determine whether FLASH protection is disabled. During the reset sequence, the FPROT register is loaded from the nonvolatile location NVPROT. To change the protection that will be loaded during the reset sequence, the sector containing NVPROT must be unprotected and erased, then NVPROT can be reprogrammed. With FPDIS set all FPROT bits are writable, but with FPDIS clear the FPS bits are writable as long as the size of the protected region is being increased. Any write to FPROT that attempts to decrease the size of the protected memory will be ignored. Trying to alter data in any protected area will result in a protection violation error and the FPVIOL flag will be set in the FSTAT register. Mass erase is not possible if any one of the sectors is protected. In order to change the data flash block protection on a temporary basis, the FPROT register EPS bits can be written to. To change the data flash block protection that will be loaded during the reset sequence, the MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 58 Freescale Semiconductor Chapter 4 Memory FLASH block must first be unprotected, then 0xFFBD in the flash configuration field must be reprogrammed. 7 6 5 4 3 2 1 0 R FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 FPDIS W (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) Reset This register is loaded from nonvolatile location NVPROT during reset. = Unimplemented or Reserved Figure 4-8. FLASH Protection Register (FPROT) 1 If FPDIS is set, these bits are writeable in user mode. Background commands can be used to change the contents of these bits in FPROT in any mode. Table 4-11. FPROT Field Descriptions Field Description 7:1 FPS[7:1] FLASH Protect Select Bits — When FPDIS = 0, this 7-bit field determines the ending address of unprotected FLASH locations at the high address end of the FLASH. Protected FLASH locations cannot be erased or programmed. 0 FPDIS FLASH Protection Disable 0 FLASH block specified by FPS[7:1] is block protected (program and erase not allowed). 1 No FLASH block is protected. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 59 Chapter 4 Memory 4.6.5 FLASH Status Register (FSTAT) Bits 3, 1, and 0 always read 0 and writes have no meaning or effect. The remaining five bits are status bits that can be read at any time. Writes to these bits have special meanings that are discussed in the bit descriptions. 7 R 6 5 4 FPVIOL FACCERR 0 0 FCCF FCBEF 3 2 1 0 0 FBLANK 0 0 0 0 0 0 W Reset 1 1 = Unimplemented or Reserved Figure 4-9. FLASH Status Register (FSTAT) Table 4-12. FSTAT Field Descriptions Field Description 7 FCBEF FLASH Command Buffer Empty Flag — The FCBEF bit is used to launch commands. It also indicates that the command buffer is empty so that a new command sequence can be executed when performing burst programming. The FCBEF bit is cleared by writing a 1 to it or when a burst program command is transferred to the array for programming. Only burst program commands can be buffered. 0 Command buffer is full (not ready for additional commands). 1 A new burst program command may be written to the command buffer. 6 FCCF FLASH Command Complete Flag — FCCF is set automatically when the command buffer is empty and no command is being processed. FCCF is cleared automatically when a new command is started (by writing 1 to FCBEF to register a command). Writing to FCCF has no meaning or effect. 0 Command in progress 1 All commands complete 5 FPVIOL FLASH Protection Violation Flag — FPVIOL is set automatically when a command attempts to erase or program a location in a protected block (the erroneous command is ignored). FPVIOL is cleared by writing a 1 to FPVIOL. 0 No protection violation. 1 An attempt was made to erase or program a protected location. 4 FACCERR FLASH Access Error Flag — FACCERR is set automatically when the proper command sequence is not followed exactly (the erroneous command is ignored), if a program or erase operation is attempted before the FCDIV register has been initialized, or if the MCU enters stop while a command was in progress. For a more detailed discussion of the exact actions that are considered access errors, see Section 4.4.5, “Access Errors.” FACCERR is cleared by writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect. 0 No access error has occurred. 1 An access error has occurred. 2 FBLANK FLASH Verified as All Blank (Erased) Flag — FBLANK is set automatically at the conclusion of a blank check command if the entire FLASH array was verified to be erased. FBLANK is cleared by clearing FCBEF to write a new valid command. Writing to FBLANK has no meaning or effect. 0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the FLASH array is not completely erased. 1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the FLASH array is completely erased (all 0x00FF). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 60 Freescale Semiconductor Chapter 4 Memory 4.6.6 FLASH Command Register (FCMD) Only five command codes are recognized in normal user modes as shown in Table 4-14. Refer to Section 4.4.3, “Program and Erase Command Execution” for a detailed discussion of FLASH programming and erase operations. 7 6 5 4 3 2 1 0 R 0 0 0 0 0 0 0 0 W FCMD7 FCMD6 FCMD5 FCMD4 FCMD3 FCMD2 FCMD1 FCMD0 0 0 0 0 0 0 0 0 Reset Figure 4-10. FLASH Command Register (FCMD) Table 4-13. FCMD Field Descriptions Field 7:0 FCMD[7:0] Description See Table 4-14 for a description of FCMD[7:0]. Table 4-14. FLASH Commands1 Command 1 FCMD Equate File Label Blank check 0x05 mBlank Byte program 0x20 mByteProg Byte program — burst mode 0x25 mBurstProg Page erase (512 bytes/page) 0x40 mPageErase Mass erase (all FLASH) 0x41 mMassErase All other command codes are illegal and generate an access error. It is not necessary to perform a blank check command after a mass erase operation. Blank check is required only as part of the security unlocking mechanism. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 61 Chapter 4 Memory MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 62 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.1 Introduction This section discusses basic reset and interrupt mechanisms and the various sources of reset and interrupts in the MC9S08LC60 Series. Some interrupt sources from peripheral modules are discussed in greater detail within other sections of this data manual. This section gathers basic information about all reset and interrupt sources in one place for easy reference. A few reset and interrupt sources, including the computer operating properly (COP) watchdog and real-time interrupt (RTI), are not part of on-chip peripheral systems with their own sections but are part of the system control logic. 5.2 Features Reset and interrupt features include: • Multiple sources of reset for flexible system configuration and reliable operation: — Power-on detection (POR) — Low voltage detection (LVD) with enable — External RESET pin with enable — COP watchdog with enable and two timeout choices — Illegal opcode — Serial command from a background debug host • Reset status register (SRS) to indicate source of most recent reset • Separate interrupt vectors for each module (reduces polling overhead) (see Table 5-2) 5.3 MCU Reset Resetting the MCU provides a way to start processing from a known set of initial conditions. During reset, most control and status registers are forced to initial values and the program counter is loaded from the reset vector (0xFFFE:0xFFFF). On-chip peripheral modules are disabled and I/O pins are initially configured as general-purpose high-impedance inputs with pullup devices disabled. The I bit in the condition code register (CCR) is set to block maskable interrupts so the user program has a chance to initialize the stack pointer (SP) and system control settings. SP is forced to 0x00FF at reset. The MC9S08LC60 Series has seven sources for reset: • Power-on reset (POR) • Low-voltage detect (LVD) • Computer operating properly (COP) timer MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 63 Chapter 5 Resets, Interrupts, and System Configuration • • • • Illegal opcode detect Background debug forced reset External pin reset (PIN) — can be disabled using RSTPE in SOPT2 Clock generator loss of lock and loss of clock reset Each of these sources, with the exception of the background debug forced reset, has an associated bit in the system reset status register. Whenever the MCU enters reset, the internal clock generator (ICG) module switches to self-clocked mode with the frequency of fSelf_reset selected. The reset pin is driven low for 34 internal bus cycles where the internal bus frequency is half the ICG frequency. After the 34 cycles are completed, the pin is released and will be pulled up by the internal pullup resistor, unless it is held low externally. After the pin is released, it is sampled after another 38 cycles to determine whether the reset pin is the cause of the MCU reset. 5.4 Computer Operating Properly (COP) Watchdog The COP watchdog is intended to force a system reset when the application software fails to execute as expected. To prevent a system reset from the COP timer (when it is enabled), application software must reset the COP timer periodically. If the application program gets lost and fails to reset the COP before it times out, a system reset is generated to force the system back to a known starting point. After any reset, the COPE becomes set in SOPT1 enabling the COP watchdog (see Section 5.8.4, “System Options Register (SOPT1),” for additional information). If the COP watchdog is not used in an application, it can be disabled by clearing COPE. The COP counter is reset by writing any value to the address of SRS. This write does not affect the data in the read-only SRS. Instead, the act of writing to this address is decoded and sends a reset signal to the COP counter. The COPCLKS bit in SOPT2 (see Section 5.8.5, “System Options Register (SOPT2),” for additional information) selects the clock source used for the COP timer. The clock source options are either the bus clock or an internal 1kHz clock source. With each clock source, there is an associated short and long time-out controlled by COPT in SOPT1. Table 5-1 summaries the control functions of the COPCLKS and COPT bits. The COP watchdog defaults to operation from the 1kHz clock source and the associated long time-out (28 cycles). Table 5-1. COP Configuration Options Control Bits 1 Clock Source COP Overflow Count 0 ~1 kHz 25 cycles (32 ms)1 0 1 ~1 kHz 28 cycles (256 ms)1 1 0 Bus 213 cycles 1 1 Bus 218 cycles COPCLKS COPT 0 Values are shown in this column based on tRTI = 1 ms. See tRTI in the appendix Section A.10.1, “Control Timing,” for the tolerance of this value. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 64 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration Even if the application will use the reset default settings of COPE, COPCLKS and COPT, the user must write to the write-once SOPT1 and SOPT2 registers during reset initialization to lock in the settings. That way, they cannot be changed accidentally if the application program gets lost. The initial writes to SOPT1 and SOPT2 will reset the COP counter. The write to SRS that services (clears) the COP counter must not be placed in an interrupt service routine (ISR) because the ISR could continue to be executed periodically even if the main application program fails. When the bus clock source is selected, the COP counter does not increment while the MCU is in background debug mode or while the system is in stop mode. The COP counter resumes once the MCU exits background debug mode. When the 1-kHz clock source is selected, the COP counter is re-initialized to zero upon entry to either background debug mode or stop mode. The COP counter begins from zero once the MCU exits background debug mode or stop mode. 5.5 Interrupts Interrupts provide a way to save the current CPU status and registers, execute an interrupt service routine (ISR), and then restore the CPU status so processing resumes where it left off before the interrupt. Other than the software interrupt (SWI), which is a program instruction, interrupts are caused by hardware events such as an edge on the IRQ pin or a timer-overflow event. The debug module can also generate an SWI under certain circumstances. If an event occurs in an enabled interrupt source, an associated read-only status flag will become set. The CPU will not respond until and unless the local interrupt enable is set to 1 to enable the interrupt. The I bit in the CCR is 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is initially set after reset which masks (prevents) all maskable interrupt sources. The user program initializes the stack pointer and performs other system setup before clearing the I bit to allow the CPU to respond to interrupts. When the CPU receives a qualified interrupt request, it completes the current instruction before responding to the interrupt. The interrupt sequence follows the same cycle-by-cycle sequence as the SWI instruction and consists of: • • • • Saving the CPU registers on the stack Setting the I bit in the CCR to mask further interrupts Fetching the interrupt vector for the highest-priority interrupt that is currently pending Filling the instruction queue with the first three bytes of program information starting from the address fetched from the interrupt vector locations While the CPU is responding to the interrupt, the I bit is automatically set to avoid the possibility of another interrupt interrupting the ISR itself (this is called nesting of interrupts). Normally, the I bit is restored to 0 when the CCR is restored from the value stacked on entry to the ISR. In rare cases, the I bit may be cleared inside an ISR (after clearing the status flag that generated the interrupt) so that other interrupts can be serviced without waiting for the first service routine to finish. This practice is not recommended for anyone other than the most experienced programmers because it can lead to subtle program errors that are difficult to debug. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 65 Chapter 5 Resets, Interrupts, and System Configuration The interrupt service routine ends with a return-from-interrupt (RTI) instruction which restores the CCR, A, X, and PC registers to their pre-interrupt values by reading the previously saved information off the stack. NOTE For compatibility with the M68HC08, the H register is not automatically saved and restored. It is good programming practice to push H onto the stack at the start of the interrupt service routine (ISR) and restore it just before the RTI that is used to return from the ISR. When two or more interrupts are pending when the I bit is cleared, the highest priority source is serviced first (see Table 5-2). 5.5.1 Interrupt Stack Frame Figure 5-1 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer (SP) points at the next available byte location on the stack. The current values of CPU registers are stored on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After stacking, the SP points at the next available location on the stack which is the address that is one less than the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the main program that would have executed next if the interrupt had not occurred. UNSTACKING ORDER TOWARD LOWER ADDRESSES 7 0 SP AFTER INTERRUPT STACKING 5 1 4 2 ACCUMULATOR 3 3 INDEX REGISTER (LOW BYTE X)* 2 4 PROGRAM COUNTER HIGH 1 5 PROGRAM COUNTER LOW STACKING ORDER CONDITION CODE REGISTER SP BEFORE THE INTERRUPT TOWARD HIGHER ADDRESSES * High byte (H) of index register is not automatically stacked. Figure 5-1. Interrupt Stack Frame When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part of the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information, starting from the PC address just recovered from the stack. The status flag causing the interrupt must be acknowledged (cleared) before returning from the ISR. Typically, the flag should be cleared at the beginning of the ISR so that if another interrupt is generated by this same source, it will be registered so it can be serviced after completion of the current ISR. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 66 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.5.2 External Interrupt Request (IRQ) Pin External interrupts are managed by the IRQSC status and control register. When the IRQ function is enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled) can wake the MCU. 5.5.2.1 Pin Configuration Options The IRQ pin enable (IRQPE) control bit in the IRQSC register must be 1 for the IRQ pin to act as the interrupt request (IRQ) input. When the pin is configured as an IRQ input, the user can choose the polarity of edges or levels detected (IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD), and whether an event causes an interrupt or only sets the IRQF flag (which can be polled by software). When the IRQ pin is configured to detect rising edges, an optional pulldown resistor is available rather than a pullup resistor. BIH and BIL instructions may be used to detect the level on the IRQ pin when the pin is configured to act as the IRQ input. NOTE The voltage measured on the pulled up IRQ pin may be as low as VDD – 0.7 V. The internal gates connected to this pin are pulled all the way to VDD. All other pins with enabled pullup resistors will have an unloaded measurement of VDD. 5.5.2.2 Edge and Level Sensitivity The IRQMOD control bit re-configures the detection logic so it detects edge events and pin levels. In this edge detection mode, the IRQF status flag becomes set when an edge is detected (when the IRQ pin changes from the deasserted to the asserted level), but the flag is continuously set (and cannot be cleared) as long as the IRQ pin remains at the asserted level. 5.5.3 Interrupt Vectors, Sources, and Local Masks Table 5-2 provides a summary of all interrupt sources. Higher-priority sources are located toward the bottom of the table. The high-order byte of the address for the interrupt service routine is located at the first address in the vector address column, and the low-order byte of the address for the interrupt service routine is located at the next higher address. When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt enable is 1, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in the CCR) is 0, the CPU will finish the current instruction, stack the PCL, PCH, X, A, and CCR CPU registers, set the I bit, and then fetch the interrupt vector for the highest priority pending interrupt. Processing then continues in the interrupt service routine. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 67 Chapter 5 Resets, Interrupts, and System Configuration Table 5-2. Vector Summary Vector Priority Lower Higher Vector Number 23 through 31 22 21 Address (High/Low) 0xFFC0/0xFFC1 through 0xFFD0/0xFFD1 0xFFD2/0xFFD3 0xFFD4/0xFFD5 20 19 18 0xFFD6/0xFFD7 0xFFD8/0xFFD9 0xFFDA/0xFFDB Viic Vacmp Vadc LCD System control IIC ACMP ADC 17 16 15 0xFFDC/0xFFDD 0xFFDE/0xFFDF 0xFFE0/0xFFE1 Vkeyboard2 Vkeyboard1 Vscitx KBI2 KBI1 SCI 14 0xFFE2/0xFFE3 Vscirx SCI 13 0xFFE4/0xFFE5 Vscierr SCI 12 0xFFE6/0xFFE7 Vspi2 SPI2 11 0xFFE8/0xFFE9 Vspi1 SPI1 10 9 8 7 6 5 4 0xFFEA/0xFFEB 0xFFEC/0xFFED 0xFFEE/0xFFEF 0xFFF0/0xFFF1 0xFFF2/0xFFF3 0xFFF4/0xFFF5 0xFFF6/0xFFF7 Vtpm2ovf Vtpm2ch1 Vtpm2ch0 Vtpm1ovf Vtpm1ch1 Vtpm1ch0 Vicg TPM2 TPM2 TPM2 TPM1 TPM1 TPM1 ICG 3 0xFFF8/0xFFF9 Vlvd 2 1 0xFFFA/0xFFFB 0xFFFC/0xFFFD Virq Vswi System control IRQ Core 0 0xFFFE/0xFFFF Vreset Vector Name Module Source Enable Description Unused Vector Space (available for user program) Vlcd Vrti System control LCDIF RTIF LCDIEN RTIE LCD interrupt Real-time interrupt IICIS ACF COCO IICIE ACIE AIEN KBF KBF TDRE TC IDLE RDRF OR NF FE PF SPIF MODF SPTEF SPIF MODF SPTEF TOF CH1F CH0F TOF CH1F CH0F ICGIF (LOLS/LOCS) LVDF KBIE KBIE TIE TCIE ILIE RIE ORIE NFIE FEIE PFIE SPIE SPIE SPTIE SPIE SPIE SPTIE TOIE CH1IE CH0IE TOIE CH1IE CH0IE LOLRE/LOCRE IIC control ACMP AD conversion complete Keyboard 2 pins Keyboard 1 pins SCI transmit TPM2 overflow TPM2 channel 1 TPM2 channel 0 TPM1 overflow TPM1 channel 1 TPM1 channel 0 ICG LVDIE Low-voltage detect IRQF SWI Instruction COP ICG LVD POR RESET pin Illegal opcode IRQIE — IRQ pin Software interrupt COPE LVDRE — — Watchdog timer Low-voltage detect External pin Illegal opcode SCI receive SCI error SPI 2 SPI 1 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 68 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.6 Low-Voltage Detect (LVD) System The MC9S08LC60 Series includes a system to protect against low voltage conditions to protect memory contents and control MCU system states during supply voltage variations. The system comprises a power-on reset (POR) circuit and an LVD circuit with a user selectable trip voltage, either high (VLVDH) or low (VLVDL). The LVD circuit is enabled when LVDE in SPMSC1 is high and the trip voltage is selected by LVDV in SPMSC2. The LVD is disabled upon entering any of the stop modes unless the LVDSE bit is set. If LVDSE and LVDE are both set, then the MCU cannot enter stop1 or stop2, and the current consumption in stop3 with the LVD enabled will be greater. 5.6.1 Power-On Reset Operation When power is initially applied to the MCU, or when the supply voltage drops below the VPOR level, the POR circuit will cause a reset condition. As the supply voltage rises, the LVD circuit will hold the chip in reset until the supply has risen above the VLVDL level. Both the POR bit and the LVD bit in SRS are set following a POR. 5.6.2 LVD Reset Operation The LVD can be configured to generate a reset upon detection of a low voltage condition by setting LVDRE to 1. After an LVD reset has occurred, the LVD system will hold the MCU in reset until the supply voltage has risen above the level determined by LVDV. The LVD bit in the SRS register is set following either an LVD reset or POR. 5.6.3 LVD Interrupt Operation When a low voltage condition is detected and the LVD circuit is configured for interrupt operation (LVDE set, LVDIE set, and LVDRE clear), then LVDF will be set and an LVD interrupt will occur. 5.6.4 Low-Voltage Warning (LVW) The LVD system has a low voltage warning flag to indicate to the user that the supply voltage is approaching, but is still above, the LVD voltage. The LVW does not have an interrupt associated with it. There are two user selectable trip voltages for the LVW, one high (VLVWH) and one low (VLVWL). The trip voltage is selected by LVWV in SPMSC3. 5.7 Real-Time Interrupt (RTI) The real-time interrupt function can be used to generate periodic interrupts. The RTI can accept two sources of clocks, the 1-kHz internal clock or an external clock if available. The RTICLKS bit in SRTISC is used to select the RTI clock source. Either clock source can be used when the MCU is in run, wait or stop3 mode. When using the external oscillator in stop3, it must be enabled in stop (EREFSTEN = 1) and configured for low frequency operation (RANGE = 0). Only the internal 1-kHz clock source can be selected to wake the MCU from stop1 or stop2 modes. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 69 Chapter 5 Resets, Interrupts, and System Configuration The SRTISC register includes a read-only status flag, a write-only acknowledge bit, and a 3-bit control value (RTIS) used to select one of seven wakeup periods. The RTI has a local interrupt enable, RTIE, to allow masking of the real-time interrupt. The RTI can be disabled by writing each bit of RTIS to zeroes, and no interrupts will be generated. See Section 5.8.7, “System Real-Time Interrupt Status and Control Register (SRTISC)” for detailed information about this register. 5.8 Reset, Interrupt, and System Control Registers and Control Bits One 8-bit register in the direct page register space and eight 8-bit registers in the high-page register space are related to reset and interrupt systems. Refer to the direct-page register summary in Chapter 4, “Memory” of this data sheet for the absolute address assignments for all registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. Some control bits in the SOPT1, SOPT2, and SPMSC2 registers are related to modes of operation. Although brief descriptions of these bits are provided here, the related functions are discussed in greater detail in Chapter 3, “Modes of Operation.” 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC) These bits are used to configure the IRQ function, report status, and acknowledge IRQ events. 7 R 6 5 4 IRQPDD IRQEDG IRQPE 0 3 2 IRQF 0 W Reset 1 0 IRQIE IRQMOD 0 0 IRQACK 0 0 0 0 0 0 = Unimplemented or Reserved Figure 5-2. Interrupt Request Status and Control Register (IRQSC) Table 5-3. IRQSC Field Descriptions Field Description 6 IRQPDD Interrupt Request (IRQ) Pull Device Disable— This read/write control bit is used to disable the internal pullup/pulldown device when the IRQ pin is enabled (IRQPE = 1) allowing for an external device to be used. 0 IRQ pull device enabled if IRQPE = 1. 1 IRQ pull device disabled if IRQPE = 1. 5 IRQEDG Interrupt Request (IRQ) Edge Select — This read/write control bit is used to select the polarity of edges or levels on the IRQ pin that cause IRQF to be set. The IRQMOD control bit determines whether the IRQ pin is sensitive to both edges and levels or only edges. When the IRQ pin is enabled as the IRQ input and is configured to detect rising edges, the optional pullup resistor is re-configured as an optional pulldown resistor. 0 IRQ is falling edge or falling edge/low-level sensitive. 1 IRQ is rising edge or rising edge/high-level sensitive. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 70 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration Table 5-3. IRQSC Field Descriptions (continued) Field Description 4 IRQPE IRQ Pin Enable — This read/write control bit enables the IRQ pin function. When this bit is set, the IRQ pin can be used as an interrupt request. Also, when this bit is set, either an internal pull-up or an internal pull-down resistor is enabled depending on the state of the IRQMOD bit. 0 IRQ pin function is disabled. 1 IRQ pin function is enabled. 3 IRQF 2 IRQACK 1 IRQIE 0 IRQMOD IRQ Flag — This read-only status bit indicates when an interrupt request event has occurred. 0 No IRQ request. 1 IRQ event detected. IRQ Acknowledge — This write-only bit is used to acknowledge interrupt request events (write 1 to clear IRQF). Writing 0 has no meaning or effect. Reads always return 0. If edge-and-level detection is selected (IRQMOD = 1), IRQF cannot be cleared while the IRQ pin remains at its asserted level. IRQ Interrupt Enable — This read/write control bit determines whether IRQ events generate a hardware interrupt request. 0 Hardware interrupt requests from IRQF disabled (use polling). 1 Hardware interrupt requested whenever IRQF = 1. IRQ Detection Mode — This read/write control bit selects either edge-only detection or edge-and-level detection. The IRQEDG control bit determines the polarity of edges and levels that are detected as interrupt request events. See Section 5.5.2.2, “Edge and Level Sensitivity” for more details. 0 IRQ event on falling edges or rising edges only. 1 IRQ event on falling edges and low levels or on rising edges and high levels. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 71 Chapter 5 Resets, Interrupts, and System Configuration 5.8.2 System Reset Status Register (SRS) This register includes six read-only status flags to indicate the source of the most recent reset. When a debug host forces reset by writing 1 to BDFR in the SBDFR register, none of the status bits in SRS will be set. Writing any value to this register address clears the COP watchdog timer without affecting the contents of this register. The reset state of these bits depends on what caused the MCU to reset. R 7 6 5 4 3 2 1 0 POR PIN COP ILOP 0 ICG LVD 0 1 0 1 0 0 0 W Writing any value to SRS address clears COP watchdog timer. POR: 1 0 LVR: u 0 Any other reset: 0 (1) Note 0 0 0 0 Note(1) Note (1) 0 0 0 0 0 Note (1) u = Unaffected by reset 1 Any of these reset sources that are active at the time of reset will cause the corresponding bit(s) to be set; bits corresponding to sources that are not active at the time of reset will be cleared. Figure 5-3. System Reset Status (SRS) Table 5-4. SRS Field Descriptions Field Description 7 POR Power-On Reset — Reset was caused by the power-on detection logic. Because the internal supply voltage was ramping up at the time, the low-voltage reset (LVD) status bit is also set to indicate that the reset occurred while the internal supply was below the LVD threshold. 0 Reset not caused by POR. 1 POR caused reset. 6 PIN External Reset Pin — Reset was caused by an active-low level on the external reset pin. 0 Reset not caused by external reset pin. 1 Reset came from external reset pin. 5 COP Computer Operating Properly (COP) Watchdog — Reset was caused by the COP watchdog timer timing out. This reset source may be blocked by COPE = 0. 0 Reset not caused by COP timeout. 1 Reset caused by COP timeout. 4 ILOP Illegal Opcode — Reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP instruction is considered illegal if stop is disabled by STOPE = 0 in the SOPT register. The BGND instruction is considered illegal if active background mode is disabled by ENBDM = 0 in the BDCSC register. 0 Reset not caused by an illegal opcode. 1 Reset caused by an illegal opcode. 2 ICG Internal Clock Generation Module Reset — Reset was caused by an ICG module reset. 0 Reset not caused by ICG module. 1 Reset caused by ICG module. 1 LVD Low Voltage Detect — If the LVD reset is enabled (LVDE = LVDRE = 1) and the supply drops below the LVD trip voltage, an LVD reset occurs. The LVD function is disabled when the MCU enters stop. To maintain LVD operation in stop, the LVDSE bit must be set. 0 Reset not caused by LVD trip or POR. 1 Reset caused by LVD trip or POR. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 72 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.8.3 System Background Debug Force Reset Register (SBDFR) This register contains a single write-only control bit. A serial background command such as WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are ignored. Reads always return 0x0000. R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 BDFR1 W Reset 0 0 0 0 0 0 0 0 = Unimplemented or Reserved 1 BDFR is writable only through serial background debug commands, not from user programs. Figure 5-4. System Background Debug Force Reset Register (SBDFR) Table 5-5. SBDFR Field Descriptions Field Description 0 BDFR Background Debug Force Reset — A serial background mode command such as WRITE_BYTE allows an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot be written from a user program. 5.8.4 System Options Register (SOPT1) This register may be read at any time. Bits 3 and 2 are unimplemented and always read 0. This is a write-once register so only the first write after reset is honored. Any subsequent attempt to write to SOPT1 (intentionally or unintentionally) is ignored to avoid accidental changes to these sensitive settings. SOPT1 should be written during the user’s reset initialization program to set the desired controls even if the desired settings are the same as the reset settings. 7 6 5 COPE COPT STOPE 1 1 0 4 R 3 2 0 0 1 0 BKGDPE RSTPE 1 1 W Reset 1 0 0 = Unimplemented or Reserved Figure 5-5. System Options Register (SOPT1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 73 Chapter 5 Resets, Interrupts, and System Configuration Table 5-6. SOPT1 Field Descriptions Field Description 7 COPE COP Watchdog Enable — This write-once bit defaults to 1 after reset. 0 COP watchdog timer disabled. 1 COP watchdog timer enabled (force reset on timeout). 6 COPT COP Watchdog Timeout — This write-once bit selects the timeout period of the COP. COPT along with COPCLKS in SOPT2 defines the COP timeout period. 0 Short timeout period selected. 1 Long timeout period selected. 5 STOPE Stop Mode Enable — This write-once bit defaults to 0 after reset, which disables stop mode. If stop mode is disabled and a user program attempts to execute a STOP instruction, an illegal opcode reset is forced. 0 Stop mode disabled. 1 Stop mode enabled. 1 BKGDPE 0 RSTPE Background Debug Mode Pin Enable — The BKGDPE bit enables the PTG0/BKGD/MS pin to function as BKGD/MS. When the bit is clear, the pin will function as PTG0, which is an output-only general-purpose I/O. This pin always defaults to BKGD/MS function after any reset. 0 BKGD pin disabled. 1 BKGD pin enabled. Reset Pin Enable — This write-once bit when set enables the PTB2/RESET/ pin to function as RESET. When clear, the pin functions as one of its input only alternative functions. This pin defaults to its input-only port function following an MCU POR. Once configured for RESET pin, only POR can disable the RESET pin function. When RSTPE is set, an internal pullup device is enabled on RESET. 0 PTB2/RESET/ pin functions as PTB2. 1 PTB2/RESET/ pin functions as RESET. 5.8.5 System Options Register (SOPT2) This register may be read at any time. 7 R COPCLKS1 6 5 4 3 2 1 0 0 0 0 0 0 0 ACIC W Reset 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 5-6. System Options Register (SOPT2) 1 This bit can be written only one time after reset. Additional writes are ignored. Table 5-7. SOPT2 Field Descriptions Field 7 COPCLKS 0 ACIC Description COP Watchdog Clock Select — This write-once bit selects the clock source of the COP watchdog. 0 Internal 1-kHz clock is source to COP. 1 Bus clock is source to COP. Analog Comparator to Input Capture Enable— This bit connects the output of ACMP to TPM1 input channel 0. 0 ACMP output not connected to TPM1 input channel 0 1 ACMP output connected to TPM1 input channel 0. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 74 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.8.6 System Device Identification Register (SDIDH, SDIDL) This read-only register is included so host development systems can identify the HCS08 derivative and revision number. This allows the development software to recognize where specific memory blocks, registers, and control bits are located in a target MCU. R 7 6 5 4 3 2 1 0 REV3 REV2 REV1 REV0 ID11 ID10 ID9 ID8 01 0(1) 0(1) 0(1) 0 0 0 0 W Reset = Unimplemented or Reserved 1 The revision number that is hard coded into these bits reflects the current silicon revision level. Figure 5-7. System Device Identification Register High (SDIDH) Table 5-8. SDIDH Field Descriptions Field Description 7:4 REV[3:0] Revision Number — The high-order 4 bits of SDIDH are hard-coded to reflect the current mask set revision number (0–F). 3:0 ID[11:8] Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The MC9S08LC60 Series is hard-coded to the value 0x0. See also ID bits in Table 5-9. R 7 6 5 4 3 2 1 0 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 0 0 0 0 1 1 0 0 W Reset = Unimplemented or Reserved Figure 5-8. System Device Identification Register Low (SDIDL) Table 5-9. SDIDL Field Descriptions Field 7:0 ID[7:0] Description Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The MC9S08LC60 Series is hard coded to the value 0x0C. See also ID bits in Table 5-8. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 75 Chapter 5 Resets, Interrupts, and System Configuration 5.8.7 System Real-Time Interrupt Status and Control Register (SRTISC) This register contains one read-only status flag, one write-only acknowledge bit, three read/write delay selects, and one unimplemented bit, which always reads 0. R 7 6 RTIF 0 W 5 4 RTICLKS RTIE 0 0 3 2 1 0 RTIS2 RTIS1 RTIS0 0 0 0 0 RTIACK Reset 0 0 0 = Unimplemented or Reserved Figure 5-9. System RTI Status and Control Register (SRTISC) Table 5-10. SRTISC Field Descriptions Field Description 7 RTIF Real-Time Interrupt Flag — This read-only status bit indicates the periodic wakeup timer has timed out. 0 Periodic wakeup timer not timed out. 1 Periodic wakeup timer timed out. 6 RTIACK Real-Time Interrupt Acknowledge — This write-only bit is used to acknowledge real-time interrupt request (write 1 to clear RTIF). Writing 0 has no meaning or effect. Reads always return 0. 5 RTICLKS Real-Time Interrupt Clock Select — This read/write bit selects the clock source for the real-time interrupt. 0 Real-time interrupt request clock source is internal 1-kHz oscillator. 1 Real-time interrupt request clock source is external clock. 4 RTIE Real-Time Interrupt Enable — This read/write bit enables real-time interrupts. 0 Real-time interrupts disabled. 1 Real-time interrupts enabled. 2:0 RTIS[2:0] Real-Time Interrupt Period Selects — These read/write bits select the wakeup period for the RTI. See Table 5-11. Table 5-11. Real-Time Interrupt Period 1 2 RTIS2:RTIS1:RTIS0 Internal 1 kHz Clock Source 1 (tRTI = 1 ms, Nominal) External Clock Source 2 Period = text 0:0:0 Disable RTI Disable RTI 0:0:1 8 ms text x 256 0:1:0 32 ms text x 1024 0:1:1 64 ms text x 2048 1:0:0 128 ms text x 4096 1:0:1 256 ms text x 8192 1:1:0 512 ms text x 16384 1:1:1 1.024 s text x 32768 See Table A-13 tRTI in Appendix A, “Electrical Characteristics,” for the tolerance on these values. text is based on the external clock source, resonator, or crystal selected by the ICG configuration. See Table A-12 for details. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 76 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.8.8 System Power Management Status and Control 1 Register (SPMSC1) This high page register contains status and control bits to support the low voltage detect function, and to enable the bandgap voltage reference for use by the ADC module. To configure the low voltage detect trip voltage, see Table 5-14 for the LVDV bit description in SPMSC3. R 7 6 LVDF 0 W Reset 5 4 3 2 LVDIE LVDRE2 LVDSE LVDE(2) 0 1 1 1 (1) 1 0 0 BGBE LVDACK 0 0 0 0 = Unimplemented or Reserved 1 Bit 1 is a reserved bit that must always be written to 0. 2 This bit can be written only one time after reset. Additional writes are ignored. Figure 5-10. System Power Management Status and Control 1 Register (SPMSC1) Table 5-12. SPMSC1 Field Descriptions Field Description 7 LVDF Low-Voltage Detect Flag — Provided LVDE = 1, this read-only status bit indicates a low-voltage detect event. 6 LVDACK Low-Voltage Detect Acknowledge — This write-only bit is used to acknowledge low voltage detection errors (write 1 to clear LVDF). Reads always return 0. 5 LVDIE Low-Voltage Detect Interrupt Enable — This read/write bit enables hardware interrupt requests for LVDF. 0 Hardware interrupt disabled (use polling). 1 Request a hardware interrupt when LVDF = 1. 4 LVDRE Low-Voltage Detect Reset Enable — This read/write bit enables LVDF events to generate a hardware reset (provided LVDE = 1). 0 LVDF does not generate hardware resets. 1 Force an MCU reset when LVDF = 1. 3 LVDSE Low-Voltage Detect Stop Enable — Provided LVDE = 1, this read/write bit determines whether the low-voltage detect function operates when the MCU is in stop mode. 0 Low-voltage detect disabled during stop mode. 1 Low-voltage detect enabled during stop mode. 2 LVDE Low-Voltage Detect Enable — This read/write bit enables low-voltage detect logic and qualifies the operation of other bits in this register. 0 LVD logic disabled. 1 LVD logic enabled. 0 BGBE Bandgap Buffer Enable — This bit enables an internal buffer for the bandgap voltage reference for use by the ADC module on one of its internal channels or the ACMP. 0 Bandgap buffer disabled. 1 Bandgap buffer enabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 77 Chapter 5 Resets, Interrupts, and System Configuration 5.8.9 System Power Management Status and Control 2 Register (SPMSC2) This register is used to configure the stop mode behavior of the MCU. For more information concerning partial power down mode, see Section 3.6, “Stop Modes.” R 7 6 5 4 3 2 0 0 0 PDF PPDF 0 W Reset 1 0 PDC1 PPDC1 0 0 PPDACK 0 0 0 0 0 0 = Unimplemented or Reserved 1 This bit can be written only one time after reset. Additional writes are ignored. Figure 5-11. System Power Management Status and Control 2 Register (SPMSC2) Table 5-13. SPMSC2 Field Descriptions Field 4 PDF 3 PPDF 2 PPDACK Description Power Down Flag — This read-only status bit indicates the MCU has recovered from stop1 mode. 0 MCU has not recovered from stop1 mode. 1 MCU recovered from stop1 mode. Partial Power Down Flag — The PPDF bit indicates that the MCU has exited the stop2 mode. 0 Not stop2 mode recovery. 1 Stop2 mode recovery. Partial Power Down Acknowledge — Writing a 1 to PPDACK clears the PPDF bit. 1 PDC Power Down Control — The write-once PDC bit controls entry into the power down (stop2 and stop1) modes. 0 Power down modes are disabled. 1 Power down modes are enabled. 0 PPDC Partial Power Down Control — The write-once PPDC bit controls which power down mode, stop1 or stop2, is selected. 0 Stop1, full power down, mode enabled if PDC set. 1 Stop2, partial power down, mode enabled if PDC set. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 78 Freescale Semiconductor Chapter 5 Resets, Interrupts, and System Configuration 5.8.10 System Power Management Status and Control 3 Register (SPMSC3) This register is used to report the status of the low voltage warning function behavior of the MCU. R 7 6 LVWF 0 5 4 LVDV LVWV 3 2 1 0 0 0 0 0 LVWACK W Power-on reset (POR): 0(1) 0 0 0 0 0 0 0 LVD reset (LVR): 0(1) 0 u u 0 0 0 0 Any other reset: 0(1) 0 u u 0 0 0 0 = Unimplemented or Reserved 1 u = Unaffected by reset LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply is already below VLVW. Figure 5-12. System Power Management Status and Control 3 Register (SPMSC3) Table 5-14. SPMSC3 Field Descriptions Field 7 LVWF 6 LVWACK Description Low-Voltage Warning Flag — The LVWF bit indicates the low voltage warning status. 0 Low voltage warning not present. 1 Low voltage warning is present or was present. Low-Voltage Warning Acknowledge — The LVWACK bit is the low-voltage warning acknowledge. Writing a 1 to LVWACK clears LVWF to 0 if a low voltage warning is not present. 5 LVDV Low-Voltage Detect Voltage Select — The LVDV bit selects the LVD trip point voltage (VLVD). 0 Low trip point selected (VLVD = VLVDL). 1 High trip point selected (VLVD = VLVDH). 4 LVWV Low-Voltage Warning Voltage Select — The LVWV bit selects the LVW trip point voltage (VLVW). 0 Low trip point selected (VLVW = VLVWL). 1 High trip point selected (VLVW = VLVWH). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 79 Chapter 5 Resets, Interrupts, and System Configuration MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 80 Freescale Semiconductor Chapter 6 Parallel Input/Output This section explains software controls related to parallel input/output (I/O). The MC9S08LC60 Series has three I/O ports which include a total of up to 24 general-purpose I/O pins (pin availability depends on device and package option, see Table 1-2 for details). See Chapter 2, “Pins and Connections,” for more information about the logic and hardware aspects of these pins. Many of these pins are shared with on-chip peripherals such as timer systems, SPI, SCI, IIC, external interrupts, or keyboard interrupts as shown in Table 2-1. The peripheral modules have priority over the I/Os so that when a peripheral is enabled, the I/O functions associated with the shared pins are disabled. After reset, the shared peripheral functions are disabled so that the pins are controlled by the I/O. All of the I/Os are configured as inputs (PTxDDn = 0) with pullup devices disabled (PTxPEn = 0), except for output-only pin PTC6 which defaults to BKGD/MS pin and PTB2 which defaults to the RESET function. When these other modules are not controlling the port pins, they revert to general-purpose I/O control. As a general-purpose I/O control, a port data bit provides access to input (read) and output (write) data, a data direction bit controls the direction of the pin, and a pullup enable bit enables an internal pullup device (provided the pin is configured as an input), and a slew rate control bit controls the rise and fall times of the pins. NOTE Not all general-purpose I/O pins are available on all packages. To avoid extra current drain from floating input pins, the user’s reset initialization routine in the application program should either enable on-chip pullup devices or change the direction of unconnected pins to outputs so the pins do not float. Reading and writing of parallel I/Os is performed through the port data registers. The direction, either input or output, is controlled through the port data direction registers. The parallel I/O port function for an individual pin is illustrated in the block diagram shown in Figure 6-1. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 81 Chapter 6 Parallel Input/Output PTxDDn D OUTPUT ENABLE Q PTxDn D Q OUTPUT DATA 1 PORT READ DATA 0 SYNCHRONIZER INPUT DATA BUSCLK Figure 6-1. Parallel I/O Block Diagram The data direction control bit (PTxDDn) determines whether the output buffer for the associated pin is enabled, and also controls the source for port data register reads. The input buffer for the associated pin is always enabled unless the pin is enabled as an analog function or is an output-only pin. When a shared digital function is enabled for a pin, the output buffer is controlled by the shared function. However, the data direction register bit will continue to control the source for reads of the port data register. When a shared analog function is enabled for a pin, both the input and output buffers are disabled. A value of 0 is read for any port data bit where the bit is an input (PTxDDn = 0) and the input buffer is disabled. In general, whenever a pin is shared with both an alternate digital function and an analog function, the analog function has priority such that if both the digital and analog functions are enabled, the analog function controls the pin. It is a good programming practice to write to the port data register before changing the direction of a port pin to become an output. This ensures that the pin will not be driven momentarily with an old data value that happened to be in the port data register. Associated with the parallel I/O ports is a set of registers located in the high page register space that operate independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive strength for the pins. See Section 6.2.1, “Port A Registers for more information. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 82 Freescale Semiconductor Chapter 6 Parallel Input/Output 6.1 Pin Behavior in Stop Modes Pin behavior following execution of a STOP instruction depends on the stop mode that is entered. An explanation of pin behavior for the various stop modes follows: • In stop1 mode, all internal registers including parallel I/O control and data registers are powered off. Each of the pins assumes its default reset state (output buffer and internal pullup disabled). Upon exit from stop1, all pins must be reconfigured the same as if the MCU had been reset. • Stop2 mode is a partial power-down mode, whereby latches maintain the pin state as before the STOP instruction was executed. CPU register status and the state of I/O registers must be saved in RAM before the STOP instruction is executed to place the MCU in stop2 mode. Upon recovery from stop2 mode, before accessing any I/O, the user must examine the state of the PPDF bit in the SPMSC2 register. If the PPDF bit is 0, I/O must be initialized as if a power on reset had occurred. If the PPDF bit is 1, I/O data previously stored in RAM, before the STOP instruction was executed, peripherals previously enabled will require being initialized and restored to their pre-stop condition. The user must then write a 1 to the PPDACK bit in the SPMSC2 register. Access of pins is now permitted again in the user’s application program. • In stop3 mode, all pin states are maintained because internal logic stays powered up. Upon recovery, all pin functions are the same as before entering stop3. 6.2 6.2.1 Parallel I/O Registers Port A Registers This section provides information about all registers and control bits associated with the parallel I/O ports. The parallel I/O registers are located in page zero of the memory map. Refer to tables in Chapter 3, “Modes of Operation” for the absolute address assignments for all parallel I/O registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file normally is used to translate these names into the appropriate absolute addresses. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 83 Chapter 6 Parallel Input/Output 6.2.1.1 Port A Data Registers (PTAD) Port A parallel I/O function is controlled by the data and data direction registers in this section. 7 6 5 4 3 2 1 0 PTAD7 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0 0 0 0 0 0 0 0 0 R W Reset Figure 6-2. Port A Data Register (PTAD) Table 6-1. PTAD Field Descriptions Field Description 7:0 PTAD[7:0] Port A Data Register Bits — For port A pins that are inputs, reads return the logic level on the pin. For port A pins that are configured as outputs, reads return the last value written to this register. Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level is driven out the corresponding MCU pin. Reset forces PTAD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures all port pins as high-impedance inputs with pullups disabled. 6.2.1.2 Port A Data Direction Registers (PTADD) 7 6 5 4 3 2 1 0 PTADD7 PTADD6 PTADD5 PTADD4 PTADD3 PTADD2 PTADD1 PTADD0 0 0 0 0 0 0 0 0 R W Reset Figure 6-5. Data Direction for Port A (PTADD) Table 6-2. PTADD Field Descriptions Field Description 7:0 Data Direction for Port A Bits — These read/write bits control the direction of port A pins and what is read for PTADD[7:0] PTAD reads. 0 Input (output driver disabled) and reads return the pin value. 1 Output driver enabled for port A bit n and PTAD reads return the contents of PTADn. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 84 Freescale Semiconductor Chapter 6 Parallel Input/Output 6.2.2 Port A Control Registers Associated with the parallel I/O ports is a set of registers located in the high page register space that operate independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive strength for the associated pins and may be used in conjunction with the peripheral functions on these pins for most modules. The pins associated with port A are controlled by the registers in this section. These registers control the pin pullup, slew rate and drive strength of the port A pins independent of the parallel I/O registers. 6.2.2.1 Internal Pullup Enable (PTAPE) An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup enable register (PTAPEn). The pullup device is disabled if the pin is configured as an output by the parallel I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup enable register bit. The pullup device is also disabled if the pin is controlled by an analog function. 7 6 5 4 3 2 1 0 PTAPE7 PTAPE6 PTAPE5 PTAPE4 PTAPE3 PTAPE2 PTAPE1 PTAPE0 0 0 0 0 0 0 0 0 R W Reset Figure 6-7. Pullup Enable for Port A (PTAPE) Table 6-3. PTAPE Field Descriptions Field Description 7:0 Pullup Enable for Port A Bits — For port A pins that are inputs, these read/write control bits determine whether PTAPE[7:0] internal pullup devices are enabled provided the corresponding PTADDn is 0. For port A pins that are configured as outputs, these bits are ignored and the internal pullup devices are disabled. When any of bits 7 through 0 of port A are enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits enable pulldown rather than pullup devices. 0 Internal pullup device disabled. 1 Internal pullup device enabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 85 Chapter 6 Parallel Input/Output 6.2.2.2 Output Slew Rate Control Enable (PTASE) Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control register (PTASEn). When enabled, slew control limits the rate at which an output can transition in order to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs. 7 6 5 4 3 2 1 0 PTASE7 PTASE6 PTASE5 PTASE4 PTASE3 PTASE2 PTASE1 PTASE0 1 1 1 1 1 1 1 1 R W Reset Figure 6-8. Slew Rate Control Enable for Port A (PTASE) Table 6-4. PTASE Field Descriptions Field Description 7:0 Slew Rate Control Enable for Port A Bits — For port A pins that are outputs, these read/write control bits PTASE[7:0] determine whether the slew rate controlled outputs are enabled. For port A pins that are configured as inputs, these bits are ignored. 0 Slew rate control disabled. 1 Slew rate control enabled. 6.2.2.3 Output Drive Strength Select (PTADS) An output pin can be selected to have high output drive strength by setting the corresponding bit in the drive strength select register (PTADSn). When high drive is selected a pin is capable of sourcing and sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load. Because of this the EMC emissions may be affected by enabling pins as high drive. 7 6 5 4 3 2 1 0 PTADS7 PTADS6 PTADS5 PTADS4 PTADS3 PTADS2 PTADS1 PTADS0 0 0 0 0 0 0 0 0 R W Reset Figure 6-9. Drive Strength Selection for Port A (PTADS) Table 6-5. PTADS Field Descriptions Field Description 7:0 Output Drive Strength Selection for Port A Bits—Each of these control bits selects between low and high output PTADS[7:0] drive for the associated PTA pin. For port A pins that are configured as inputs, these bits have no effect. 0 Low output drive strength selected for port A bit n. 1 High output drive strength selected for port A bit n. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 86 Freescale Semiconductor Chapter 6 Parallel Input/Output 6.2.3 Port B Registers This section provides information about all registers and control bits associated with the parallel I/O ports. The parallel I/O registers are located in page zero of the memory map. Refer to tables in Chapter 4, “Memory” for the absolute address assignments for all parallel I/O registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file normally is used to translate these names into the appropriate absolute addresses. 6.2.3.1 Port B Data Registers (PTBD) Port B parallel I/O function is controlled by the data and data direction registers in this section. 7 6 5 4 3 2 1 0 PTBD7 PTBD6 PTBD5 PTBD4 PTBD3 PTBD21 PTBD1 PTBD0 0 0 0 0 0 0 0 0 R W Reset Figure 6-10. Port B Data Register (PTBD) 1 Reads of PTBD2 always return the contents of PTBD2, regardless of the value stored in the bit PTBDD2 Table 6-6. PTBD Field Descriptions Field Description 7:0 PTBD[7:0] Port B Data Register Bits — For port B pins that are inputs, reads return the logic level on the pin. For port B pins that are configured as outputs, reads return the last value written to this register. Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level is driven out the corresponding MCU pin. Reset forces PTBD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures all port pins as high-impedance inputs with pullups disabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 87 Chapter 6 Parallel Input/Output 6.2.3.2 Port B Data Direction Registers (PTBDD) 7 6 5 4 3 2 1 0 PTBDD7 PTBDD6 PTBDD5 PTBDD4 PTBDD3 PTBDD21 PTBDD1 PTBDD0 0 0 0 0 0 0 0 0 R W Reset Figure 6-13. Data Direction for Port B (PTBDD) 1 PTBDD2 has no effect on the output-only PTB2 pin. Table 6-7. PTBDD Field Descriptions Field Description 7:0 Data Direction for Port B Bits — These read/write bits control the direction of port B pins and what is read for PTBDD[7:0] PTBD reads. 0 Input (output driver disabled) and reads return the pin value. 1 Output driver enabled for port B bit n and PTBD reads return the contents of PTBDn. 6.2.4 Port B Control Registers Associated with the parallel I/O ports is a set of registers located in the high page register space that operate independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive strength for the associated pins and may be used in conjunction with the peripheral functions on these pins for most modules. The pins associated with Port B are controlled by the registers in this section. These registers control the pin pullup, slew rate and drive strength of the Port B pins independent of the parallel I/O registers. 6.2.4.1 Internal Pullup Enable (PTBPE) An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup enable register (PTBPEn). The pullup device is disabled if the pin is configured as an output by the parallel I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup enable register bit. The pullup device is also disabled if the pin is controlled by an analog function. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 88 Freescale Semiconductor Chapter 6 Parallel Input/Output 7 6 5 4 3 2 1 0 PTBPE7 PTBPE6 PTBPE5 PTBPE4 PTBPE3 PTBPE2 PTBPE1 PTBPE0 0 0 0 0 0 0 0 0 R W Reset Figure 6-15. Pullup Enable for Port B (PTBPE) Table 6-8. PTBPE Field Descriptions Field Description 7:0 Pullup Enable for Port B Bits — For port B pins that are inputs, these read/write control bits determine whether PTBPE[7:0] internal pullup devices are enabled provided the corresponding PTBDDn is 0. For port B pins that are configured as outputs, these bits are ignored and the internal pullup devices are disabled. When bit 0, 1, 3, 6, or 7 of port B is enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits enable pulldown rather than pullup devices. 0 Internal pullup device disabled. 1 Internal pullup device enabled. 6.2.4.2 Output Slew Rate Control Enable (PTBSE) Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control register (PTBSEn). When enabled, slew control limits the rate at which an output can transition in order to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs. 7 6 5 4 3 2 1 0 PTBSE7 PTBSE6 PTBSE5 PTBSE4 PTBSE3 PTBSE2 PTBSE1 PTBSE0 1 1 1 1 1 1 1 1 R W Reset Figure 6-16. Slew Rate Control Enable for Port B (PTBSE) Table 6-9. PTBSE Field Descriptions Field Description 7:0 Slew Rate Control Enable for Port B Bits — For port B pins that are outputs, these read/write control bits PTBSE[7:0] determine whether the slew rate controlled outputs are enabled. For port B pins that are configured as inputs, these bits are ignored. 0 Slew rate control disabled. 1 Slew rate control enabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 89 Chapter 6 Parallel Input/Output 6.2.4.3 Output Drive Strength Select (PTBDS) An output pin can be selected to have high output drive strength by setting the corresponding bit in the drive strength select register (PTBDSn). When high drive is selected a pin is capable of sourcing and sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load. Because of this the EMC emissions may be affected by enabling pins as high drive. 7 6 5 4 3 2 1 0 PTBDS7 PTBDS6 PTBDS5 PTBDS4 PTBDS3 PTBDS2 PTBDS1 PTBDS0 0 0 0 0 0 0 0 0 R W Reset Figure 6-17. Drive Strength Selection for Port B (PTBDS) Table 6-10. PTBDS Field Descriptions Field Description 7:0 Output Drive Strength Selection for Port B Bits—Each of these control bits selects between low and high output PTBDS[7:0] drive for the associated PTB pin. For port B pins that are configured as inputs, these bits have no effect. 0 Low output drive strength selected for port B bit n. 1 High output drive strength selected for port B bit n. 6.2.5 Port C Registers This section provides information about all registers and control bits associated with the parallel I/O ports. The parallel I/O registers are located in page zero of the memory map. Refer to tables in Chapter 4, “Memory” for the absolute address assignments for all parallel I/O registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file normally is used to translate these names into the appropriate absolute addresses. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 90 Freescale Semiconductor Chapter 6 Parallel Input/Output 6.2.5.1 Port C Data Registers (PTCD) Port C parallel I/O function is controlled by the data and data direction registers in this section. R 7 6 5 4 3 2 1 0 PTCD71 PTCD62 PTCD5 PTCD4 PTCD3 PTCD2 PTCD1 PTCD0 0 0 0 0 0 0 0 0 W Reset Figure 6-18. Port C Data Register (PTCD) 1 2 Reads of PTCD7 always return the pin value of PTC7, regardless of the value stored in the bit PTCDD7 Reads of PTCD6 always return the contents of PTCD6, regardless of the value stored in the bit PTCDD6. Table 6-11. PTCD Field Descriptions Field Description 7:0 PTCD[7:0] Port C Data Register Bits — For port C pins that are inputs, reads return the logic level on the pin. For port C pins that are configured as outputs, reads return the last value written to this register. Writes are latched into all bits of this register. For port C pins that are configured as outputs, the logic level is driven out the corresponding MCU pin. Reset forces PTCD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures all port pins as high-impedance inputs with pullups disabled. 6.2.5.2 R Port C Data Direction Registers (PTCDD) 7 6 5 4 3 2 1 0 PTCDD71 PTCDD62 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0 0 0 0 0 0 0 0 0 W Reset Figure 6-21. Data Direction for Port C (PTCDD) 1 PTCDD7 has no effect on the input-only PTC7 pin. 2 PTCDD6 has no effect on the output-only PTC6 pin Table 6-12. PTCDD Field Descriptions Field Description 7:0 Data Direction for Port C Bits — These read/write bits control the direction of port C pins and what is read for PTCDD[7:0] PTCD reads. 0 Input (output driver disabled) and reads return the pin value. 1 Output driver enabled for port C bit n and PTCD reads return the contents of PTCDn. 6.2.6 Port C Control Registers Associated with the parallel I/O ports is a set of registers located in the high page register space that operate independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 91 Chapter 6 Parallel Input/Output strength for the associated pins and may be used in conjunction with the peripheral functions on these pins for most modules. The pins associated with Port C are controlled by the registers in this section. These registers control the pin pullup, slew rate and drive strength of the Port C pins independent of the parallel I/O registers. 6.2.6.1 Internal Pullup Enable (PTCPE) An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup enable register (PTCPEn). The pullup device is disabled if the pin is configured as an output by the parallel I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup enable register bit. The pullup device is also disabled if the pin is controlled by an analog function. R 7 6 5 4 3 2 1 0 PTCPE71 PTCPE62 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0 0 0 0 0 0 0 0 0 W Reset Figure 6-23. Pullup Enable for Port C (PTCPE) 1 2 PTCPE7 has no effect on the output-only PTC7 pin. PTCPE6 has no effect on the output-only PTC6 pin. Table 6-13. PTCPE Field Descriptions Field Description 7:0 Pullup Enable for Port C Bits — For port C pins that are inputs, these read/write control bits determine whether PTCPE[7:0] internal pullup devices are enabled provided the corresponding PTCDDn is 0. For port C pins that are configured as outputs, these bits are ignored and the internal pullup devices are disabled. When bits 4, 5, or 7 of port C are enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits enable pulldown rather than pullup devices. 0 Internal pullup device disabled. 1 Internal pullup device enabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 92 Freescale Semiconductor Chapter 6 Parallel Input/Output 6.2.6.2 Output Slew Rate Control Enable (PTCSE) Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control register (PTCSEn). When enabled, slew control limits the rate at which an output can transition in order to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs. R 7 6 5 4 3 2 1 0 PTCSE71 PTCSE62 PTCSE5 PTCSE4 PTCSE3 PTCSE2 PTCSE1 PTCSE0 1 1 1 1 1 1 1 1 W Reset Figure 6-24. Slew Rate Control Enable for Port C (PTCSE) 1 2 PTCSE7 has no effect on the input-only PTC7 pin. Reads of PTCD6 always return the contents of PTCD6, regardless of the value stored in the bit PTCDD6. Table 6-14. PTCSE Field Descriptions Field Description 7:0 Slew Rate Control Enable for Port C Bits — For port C pins that are outputs, these read/write control bits PTCSE[7:0] determine whether the slew rate controlled outputs are enabled. For port C pins that are configured as inputs, these bits are ignored. 0 Slew rate control disabled. 1 Slew rate control enabled. 6.2.6.3 Output Drive Strength Select (PTCDS) An output pin can be selected to have high output drive strength by setting the corresponding bit in the drive strength select register (PTCDSn). When high drive is selected a pin is capable of sourcing and sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load. Because of this the EMC emissions may be affected by enabling pins as high drive. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 93 Chapter 6 Parallel Input/Output R 7 6 5 4 3 2 1 0 PTCDS71 PTCDS62 PTCDS5 PTCDS4 PTCDS3 PTCDS2 PTCDS1 PTCDS0 0 0 0 0 0 0 0 0 W Reset Figure 6-25. Drive Strength Selection for Port C (PTCDS) 1 2 PTCDS7 has no effect on the input-only PTC7 pin. PTCDD6 has no effect on the output-only PTC6 pin. Table 6-15. PTCDS Field Descriptions Field Description 7:0 Output Drive Strength Selection for Port C Bits—Each of these control bits selects between low and high output PTCDS[7:0] drive for the associated PTC pin. For port C pins that are configured as inputs, these bits have no effect. 0 Low output drive strength selected for port C bit n. 1 High output drive strength selected for port C bit n. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 94 Freescale Semiconductor Chapter 7 Keyboard Interrupt (S08KBIV2) 7.1 Introduction This on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was designed to simplify the connection and use of row-column matrices of keyboard switches. However, these inputs are also useful as extra external interrupt inputs and as an external means of waking up the MCU from stop or wait low-power modes. The KBI module allows up to eight pins to act as additional interrupt sources. These pins can be configured for either rising-edge sensing or falling-edge sensing. The sensing mode for all eight pins can also be modified to detect edges and levels instead of only edges. MC9S08LC60 Series MCUs have two KBIs. When they are described individually, they are called KBI1 and/or KBI2. When referring to the module in general or both KBIs collectively, they are called KBIx. Figure 7-1 Shows the MC9S08LC60 Series block guide with the KBIs highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 95 Chapter 7 Keyboard Interrupt (S08KBIV2) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 7-1. MC9S08LC60 Series Block Diagram Highlighting KBI Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 96 Freescale Semiconductor Chapter 7 Keyboard Interrupt (S08KBIV2) 7.1.1 Features The KBI features include: • Up to eight keyboard interrupt pins with individual pin enable bits. • Each keyboard interrupt pin is programmable as falling edge (or rising edge) only, or both falling edge and low level (or both rising edge and high level) interrupt sensitivity. • One software enabled keyboard interrupt. • Exit from low-power modes. 7.1.2 Modes of Operation This section defines the KBI operation in wait, stop, and background debug modes. 7.1.2.1 KBI in Wait Mode The KBI continues to operate in wait mode if enabled before executing the WAIT instruction. Therefore, an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of wait mode if the KBI interrupt is enabled (KBIE = 1). 7.1.2.2 KBI in Stop Modes The KBI operates asynchronously in stop3 mode if enabled before executing the STOP instruction. Therefore, an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of stop3 mode if the KBI interrupt is enabled (KBIE = 1). During either stop1 or stop2 mode, the KBI is disabled. In some systems, the pins associated with the KBI may be sources of wakeup from stop1 or stop2, see the stop modes section in the Modes of Operation chapter. Upon wake-up from stop1 or stop2 mode, the KBI module will be in the reset state. 7.1.2.3 KBI in Active Background Mode When the microcontroller is in active background mode, the KBI will continue to operate normally. 7.1.3 Block Diagram The block diagram for the keyboard interrupt module is shown Figure 7-2. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 97 Chapter 7 Keyboard Interrupt (S08KBIV2) BUSCLK KBACK VDD 1 KBIxP0 0 S RESET KBF D CLR Q KBIPE0 SYNCHRONIZER CK KBEDG0 KEYBOARD INTERRUPT FF 1 KBIxPn 0 S STOP STOP BYPASS KBIx INTERRUPT REQUEST KBMOD KBIPEn KBIE KBEDGn Figure 7-2. Keyboard Interrupt (KBI) Block Diagram 7.2 External Signal Description The KBI input pins can be used to detect either falling edges, or both falling edge and low level interrupt requests. The KBI input pins can also be used to detect either rising edges, or both rising edge and high level interrupt requests. The signal properties of KBI are shown in Table 7-1. Table 7-1. Signal Properties Signal KBIxPn Function Keyboard interrupt pins I/O I MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 98 Freescale Semiconductor Chapter 7 Keyboard Interrupt (S08KBIV2) 7.3 Register Definition The KBI includes three registers: • An 8-bit pin status and control register. • An 8-bit pin enable register. • An 8-bit edge select register. Refer to the direct-page register summary in the Memory chapter for the absolute address assignments for all KBI registers. This section refers to registers and control bits only by their names and relative address offsets. Some MCUs may have more than one KBI, so register names include placeholder characters to identify which KBI is being referenced. 7.3.1 KBIx Status and Control Register (KBIxSC) KBIxSC contains the status flag and control bits, which are used to configure the KBI. R 7 6 5 4 3 2 0 0 0 0 KBF 0 W Reset: 1 0 KBIE KBMOD 0 0 KBACK 0 0 0 0 0 0 = Unimplemented Figure 7-3. KBIx Status and Control Register Table 7-2. KBIxSC Register Field Descriptions Field Description 7:4 Unused register bits, always read 0. 3 KBF Keyboard Interrupt Flag — KBF indicates when a keyboard interrupt is detected. Writes have no effect on KBF. 0 No keyboard interrupt detected. 1 Keyboard interrupt detected. 2 KBACK Keyboard Acknowledge — Writing a 1 to KBACK is part of the flag clearing mechanism. KBACK always reads as 0. 1 KBIE 0 KBMOD 7.3.2 Keyboard Interrupt Enable — KBIE determines whether a keyboard interrupt is requested. 0 Keyboard interrupt request not enabled. 1 Keyboard interrupt request enabled. Keyboard Detection Mode — KBMOD (along with the KBEDG bits) controls the detection mode of the keyboard interrupt pins.0Keyboard detects edges only. 1 Keyboard detects both edges and levels. KBIx Pin Enable Register (KBIxPE) KBIxPE contains the pin enable control bits. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 99 Chapter 7 Keyboard Interrupt (S08KBIV2) 7 6 5 4 3 2 1 0 KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0 0 0 0 0 0 0 0 0 R W Reset: Figure 7-4. KBIx Pin Enable Register Table 7-3. KBIxPE Register Field Descriptions Field Description 7:0 KBIPEn 7.3.3 Keyboard Pin Enables — Each of the KBIPEn bits enable the corresponding keyboard interrupt pin. 0 Pin not enabled as keyboard interrupt. 1 Pin enabled as keyboard interrupt. KBIx Edge Select Register (KBIxES) KBIxES contains the edge select control bits. 7 6 5 4 3 2 1 0 KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0 0 0 0 0 0 0 0 0 R W Reset: Figure 7-5. KBIx Edge Select Register Table 7-4. KBIxES Register Field Descriptions Field 7:0 KBEDGn 7.4 Description Keyboard Edge Selects — Each of the KBEDGn bits selects the falling edge/low level or rising edge/high level function of the corresponding pin). 0 Falling edge/low level. 1 Rising edge/high level. Functional Description This on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was designed to simplify the connection and use of row-column matrices of keyboard switches. However, these inputs are also useful as extra external interrupt inputs and as an external means of waking the MCU from stop or wait low-power modes. The KBI module allows up to eight pins to act as additional interrupt sources. Writing to the KBIPEn bits in the keyboard interrupt pin enable register (KBIxPE) independently enables or disables each KBI pin. Each KBI pin can be configured as edge sensitive or edge and level sensitive based on the KBMOD bit in the keyboard interrupt status and control register (KBIxSC). Edge sensitive can be software programmed to be either falling or rising; the level can be either low or high. The polarity of the edge or edge and level sensitivity is selected using the KBEDGn bits in the keyboard interrupt edge select register (KBIxES). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 100 Freescale Semiconductor Chapter 7 Keyboard Interrupt (S08KBIV2) Synchronous logic is used to detect edges. Prior to detecting an edge, enabled keyboard inputs must be at the deasserted logic level. A falling edge is detected when an enabled keyboard input signal is seen as a logic 1 (the deasserted level) during one bus cycle and then a logic 0 (the asserted level) during the next cycle. A rising edge is detected when the input signal is seen as a logic 0 during one bus cycle and then a logic 1 during the next cycle. 7.4.1 Edge Only Sensitivity A valid edge on an enabled KBI pin will set KBF in KBIxSC. If KBIE in KBIxSC is set, an interrupt request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in KBIxSC. 7.4.2 Edge and Level Sensitivity A valid edge or level on an enabled KBI pin will set KBF in KBIxSC. If KBIE in KBIxSC is set, an interrupt request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in KBIxSC provided all enabled keyboard inputs are at their deasserted levels. KBF will remain set if any enabled KBI pin is asserted while attempting to clear by writing a 1 to KBACK. 7.4.3 KBI Pullup/Pulldown Resistors The KBI pins can be configured to use an internal pullup/pulldown resistor using the associated I/O port pullup enable register. If an internal resistor is enabled, the KBIxES register is used to select whether the resistor is a pullup (KBEDGn = 0) or a pulldown (KBEDGn = 1). 7.4.4 KBI Initialization When a keyboard interrupt pin is first enabled it is possible to get a false keyboard interrupt flag. To prevent a false interrupt request during keyboard initialization, the user should do the following: 1. Mask keyboard interrupts by clearing KBIE in KBIxSC. 2. Enable the KBI polarity by setting the appropriate KBEDGn bits in KBIxES. 3. If using internal pullup/pulldown device, configure the associated pullup enable bits in PTxPE. 4. Enable the KBI pins by setting the appropriate KBIPEn bits in KBIxPE. 5. Write to KBACK in KBIxSC to clear any false interrupts. 6. Set KBIE in KBIxSC to enable interrupts. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 101 Chapter 7 Keyboard Interrupt (S08KBIV2) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 102 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 8.1 Introduction This section provides summary information about the registers, addressing modes, and instruction set of the CPU of the HCS08 Family. For a more detailed discussion, refer to the HCS08 Family Reference Manual, volume 1, Freescale Semiconductor document order number HCS08RMV1/D. The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU. Several instructions and enhanced addressing modes were added to improve C compiler efficiency and to support a new background debug system which replaces the monitor mode of earlier M68HC08 microcontrollers (MCU). 8.1.1 Features Features of the HCS08 CPU include: • Object code fully upward-compatible with M68HC05 and M68HC08 Families • All registers and memory are mapped to a single 64-Kbyte address space • 16-bit stack pointer (any size stack anywhere in 64-Kbyte address space) • 16-bit index register (H:X) with powerful indexed addressing modes • 8-bit accumulator (A) • Many instructions treat X as a second general-purpose 8-bit register • Seven addressing modes: — Inherent — Operands in internal registers — Relative — 8-bit signed offset to branch destination — Immediate — Operand in next object code byte(s) — Direct — Operand in memory at 0x0000–0x00FF — Extended — Operand anywhere in 64-Kbyte address space — Indexed relative to H:X — Five submodes including auto increment — Indexed relative to SP — Improves C efficiency dramatically • Memory-to-memory data move instructions with four address mode combinations • Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on the results of signed, unsigned, and binary-coded decimal (BCD) operations • Efficient bit manipulation instructions • Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions • STOP and WAIT instructions to invoke low-power operating modes MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 103 Chapter 8 Central Processor Unit (S08CPUV2) 8.2 Programmer’s Model and CPU Registers Figure 8-1 shows the five CPU registers. CPU registers are not part of the memory map. 7 0 ACCUMULATOR A 16-BIT INDEX REGISTER H:X H INDEX REGISTER (HIGH) 8 15 INDEX REGISTER (LOW) 7 X 0 SP STACK POINTER 0 15 PROGRAM COUNTER 7 0 CONDITION CODE REGISTER V 1 1 H I N Z C PC CCR CARRY ZERO NEGATIVE INTERRUPT MASK HALF-CARRY (FROM BIT 3) TWO’S COMPLEMENT OVERFLOW Figure 8-1. CPU Registers 8.2.1 Accumulator (A) The A accumulator is a general-purpose 8-bit register. One operand input to the arithmetic logic unit (ALU) is connected to the accumulator and the ALU results are often stored into the A accumulator after arithmetic and logical operations. The accumulator can be loaded from memory using various addressing modes to specify the address where the loaded data comes from, or the contents of A can be stored to memory using various addressing modes to specify the address where data from A will be stored. Reset has no effect on the contents of the A accumulator. 8.2.2 Index Register (H:X) This 16-bit register is actually two separate 8-bit registers (H and X), which often work together as a 16-bit address pointer where H holds the upper byte of an address and X holds the lower byte of the address. All indexed addressing mode instructions use the full 16-bit value in H:X as an index reference pointer; however, for compatibility with the earlier M68HC05 Family, some instructions operate only on the low-order 8-bit half (X). Many instructions treat X as a second general-purpose 8-bit register that can be used to hold 8-bit data values. X can be cleared, incremented, decremented, complemented, negated, shifted, or rotated. Transfer instructions allow data to be transferred from A or transferred to A where arithmetic and logical operations can then be performed. For compatibility with the earlier M68HC05 Family, H is forced to 0x00 during reset. Reset has no effect on the contents of X. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 104 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 8.2.3 Stack Pointer (SP) This 16-bit address pointer register points at the next available location on the automatic last-in-first-out (LIFO) stack. The stack may be located anywhere in the 64-Kbyte address space that has RAM and can be any size up to the amount of available RAM. The stack is used to automatically save the return address for subroutine calls, the return address and CPU registers during interrupts, and for local variables. The AIS (add immediate to stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most often used to allocate or deallocate space for local variables on the stack. SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 Family. HCS08 programs normally change the value in SP to the address of the last location (highest address) in on-chip RAM during reset initialization to free up direct page RAM (from the end of the on-chip registers to 0x00FF). The RSP (reset stack pointer) instruction was included for compatibility with the M68HC05 Family and is seldom used in new HCS08 programs because it only affects the low-order half of the stack pointer. 8.2.4 Program Counter (PC) The program counter is a 16-bit register that contains the address of the next instruction or operand to be fetched. During normal program execution, the program counter automatically increments to the next sequential memory location every time an instruction or operand is fetched. Jump, branch, interrupt, and return operations load the program counter with an address other than that of the next sequential location. This is called a change-of-flow. During reset, the program counter is loaded with the reset vector that is located at 0xFFFE and 0xFFFF. The vector stored there is the address of the first instruction that will be executed after exiting the reset state. 8.2.5 Condition Code Register (CCR) The 8-bit condition code register contains the interrupt mask (I) and five flags that indicate the results of the instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the functions of the condition code bits in general terms. For a more detailed explanation of how each instruction sets the CCR bits, refer to the HCS08 Family Reference Manual, volume 1, Freescale Semiconductor document order number HCS08RMv1. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 105 Chapter 8 Central Processor Unit (S08CPUV2) 7 0 CONDITION CODE REGISTER V 1 1 H I N Z C CCR CARRY ZERO NEGATIVE INTERRUPT MASK HALF-CARRY (FROM BIT 3) TWO’S COMPLEMENT OVERFLOW Figure 8-2. Condition Code Register Table 8-1. CCR Register Field Descriptions Field Description 7 V Two’s Complement Overflow Flag — The CPU sets the overflow flag when a two’s complement overflow occurs. The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag. 0 No overflow 1 Overflow 4 H Half-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for binary-coded decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and C condition code bits to automatically add a correction value to the result from a previous ADD or ADC on BCD operands to correct the result to a valid BCD value. 0 No carry between bits 3 and 4 1 Carry between bits 3 and 4 3 I Interrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set automatically after the CPU registers are saved on the stack, but before the first instruction of the interrupt service routine is executed. Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or TAP). This ensures that the next instruction after a CLI or TAP will always be executed without the possibility of an intervening interrupt, provided I was set. 0 Interrupts enabled 1 Interrupts disabled 2 N Negative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or data manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an 8-bit or 16-bit value causes N to be set if the most significant bit of the loaded or stored value was 1. 0 Non-negative result 1 Negative result 1 Z Zero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value causes Z to be set if the loaded or stored value was all 0s. 0 Non-zero result 1 Zero result 0 C Carry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit 7 of the accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test and branch, shift, and rotate — also clear or set the carry/borrow flag. 0 No carry out of bit 7 1 Carry out of bit 7 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 106 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 8.3 Addressing Modes Addressing modes define the way the CPU accesses operands and data. In the HCS08, all memory, status and control registers, and input/output (I/O) ports share a single 64-Kbyte linear address space so a 16-bit binary address can uniquely identify any memory location. This arrangement means that the same instructions that access variables in RAM can also be used to access I/O and control registers or nonvolatile program space. Some instructions use more than one addressing mode. For instance, move instructions use one addressing mode to specify the source operand and a second addressing mode to specify the destination address. Instructions such as BRCLR, BRSET, CBEQ, and DBNZ use one addressing mode to specify the location of an operand for a test and then use relative addressing mode to specify the branch destination address when the tested condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in the instruction set tables is the addressing mode needed to access the operand to be tested, and relative addressing mode is implied for the branch destination. 8.3.1 Inherent Addressing Mode (INH) In this addressing mode, operands needed to complete the instruction (if any) are located within CPU registers so the CPU does not need to access memory to get any operands. 8.3.2 Relative Addressing Mode (REL) Relative addressing mode is used to specify the destination location for branch instructions. A signed 8-bit offset value is located in the memory location immediately following the opcode. During execution, if the branch condition is true, the signed offset is sign-extended to a 16-bit value and is added to the current contents of the program counter, which causes program execution to continue at the branch destination address. 8.3.3 Immediate Addressing Mode (IMM) In immediate addressing mode, the operand needed to complete the instruction is included in the object code immediately following the instruction opcode in memory. In the case of a 16-bit immediate operand, the high-order byte is located in the next memory location after the opcode, and the low-order byte is located in the next memory location after that. 8.3.4 Direct Addressing Mode (DIR) In direct addressing mode, the instruction includes the low-order eight bits of an address in the direct page (0x0000–0x00FF). During execution a 16-bit address is formed by concatenating an implied 0x00 for the high-order half of the address and the direct address from the instruction to get the 16-bit address where the desired operand is located. This is faster and more memory efficient than specifying a complete 16-bit address for the operand. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 107 Chapter 8 Central Processor Unit (S08CPUV2) 8.3.5 Extended Addressing Mode (EXT) In extended addressing mode, the full 16-bit address of the operand is located in the next two bytes of program memory after the opcode (high byte first). 8.3.6 Indexed Addressing Mode Indexed addressing mode has seven variations including five that use the 16-bit H:X index register pair and two that use the stack pointer as the base reference. 8.3.6.1 Indexed, No Offset (IX) This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of the operand needed to complete the instruction. 8.3.6.2 Indexed, No Offset with Post Increment (IX+) This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of the operand needed to complete the instruction. The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is only used for MOV and CBEQ instructions. 8.3.6.3 Indexed, 8-Bit Offset (IX1) This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction. 8.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+) This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction. The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is used only for the CBEQ instruction. 8.3.6.5 Indexed, 16-Bit Offset (IX2) This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus a 16-bit offset included in the instruction as the address of the operand needed to complete the instruction. 8.3.6.6 SP-Relative, 8-Bit Offset (SP1) This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 108 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 8.3.6.7 SP-Relative, 16-Bit Offset (SP2) This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus a 16-bit offset included in the instruction as the address of the operand needed to complete the instruction. 8.4 Special Operations The CPU performs a few special operations that are similar to instructions but do not have opcodes like other CPU instructions. In addition, a few instructions such as STOP and WAIT directly affect other MCU circuitry. This section provides additional information about these operations. 8.4.1 Reset Sequence Reset can be caused by a power-on-reset (POR) event, internal conditions such as the COP (computer operating properly) watchdog, or by assertion of an external active-low reset pin. When a reset event occurs, the CPU immediately stops whatever it is doing (the MCU does not wait for an instruction boundary before responding to a reset event). For a more detailed discussion about how the MCU recognizes resets and determines the source, refer to the Resets, Interrupts, and System Configuration chapter. The reset event is considered concluded when the sequence to determine whether the reset came from an internal source is done and when the reset pin is no longer asserted. At the conclusion of a reset event, the CPU performs a 6-cycle sequence to fetch the reset vector from 0xFFFE and 0xFFFF and to fill the instruction queue in preparation for execution of the first program instruction. 8.4.2 Interrupt Sequence When an interrupt is requested, the CPU completes the current instruction before responding to the interrupt. At this point, the program counter is pointing at the start of the next instruction, which is where the CPU should return after servicing the interrupt. The CPU responds to an interrupt by performing the same sequence of operations as for a software interrupt (SWI) instruction, except the address used for the vector fetch is determined by the highest priority interrupt that is pending when the interrupt sequence started. The CPU sequence for an interrupt is: 1. Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order. 2. Set the I bit in the CCR. 3. Fetch the high-order half of the interrupt vector. 4. Fetch the low-order half of the interrupt vector. 5. Delay for one free bus cycle. 6. Fetch three bytes of program information starting at the address indicated by the interrupt vector to fill the instruction queue in preparation for execution of the first instruction in the interrupt service routine. After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent other interrupts while in the interrupt service routine. Although it is possible to clear the I bit with an instruction in the MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 109 Chapter 8 Central Processor Unit (S08CPUV2) interrupt service routine, this would allow nesting of interrupts (which is not recommended because it leads to programs that are difficult to debug and maintain). For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index register pair (H) is not saved on the stack as part of the interrupt sequence. The user must use a PSHH instruction at the beginning of the service routine to save H and then use a PULH instruction just before the RTI that ends the interrupt service routine. It is not necessary to save H if you are certain that the interrupt service routine does not use any instructions or auto-increment addressing modes that might change the value of H. The software interrupt (SWI) instruction is like a hardware interrupt except that it is not masked by the global I bit in the CCR and it is associated with an instruction opcode within the program so it is not asynchronous to program execution. 8.4.3 Wait Mode Operation The WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the clocks to the CPU to reduce overall power consumption while the CPU is waiting for the interrupt or reset event that will wake the CPU from wait mode. When an interrupt or reset event occurs, the CPU clocks will resume and the interrupt or reset event will be processed normally. If a serial BACKGROUND command is issued to the MCU through the background debug interface while the CPU is in wait mode, CPU clocks will resume and the CPU will enter active background mode where other serial background commands can be processed. This ensures that a host development system can still gain access to a target MCU even if it is in wait mode. 8.4.4 Stop Mode Operation Usually, all system clocks, including the crystal oscillator (when used), are halted during stop mode to minimize power consumption. In such systems, external circuitry is needed to control the time spent in stop mode and to issue a signal to wake up the target MCU when it is time to resume processing. Unlike the earlier M68HC05 and M68HC08 MCUs, the HCS08 can be configured to keep a minimum set of clocks running in stop mode. This optionally allows an internal periodic signal to wake the target MCU from stop mode. When a host debug system is connected to the background debug pin (BKGD) and the ENBDM control bit has been set by a serial command through the background interface (or because the MCU was reset into active background mode), the oscillator is forced to remain active when the MCU enters stop mode. In this case, if a serial BACKGROUND command is issued to the MCU through the background debug interface while the CPU is in stop mode, CPU clocks will resume and the CPU will enter active background mode where other serial background commands can be processed. This ensures that a host development system can still gain access to a target MCU even if it is in stop mode. Recovery from stop mode depends on the particular HCS08 and whether the oscillator was stopped in stop mode. Refer to the Modes of Operation chapter for more details. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 110 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 8.4.5 BGND Instruction The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in normal user programs because it forces the CPU to stop processing user instructions and enter the active background mode. The only way to resume execution of the user program is through reset or by a host debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug interface. Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background mode rather than continuing the user program. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 111 Chapter 8 Central Processor Unit (S08CPUV2) 8.5 HCS08 Instruction Set Summary Instruction Set Summary Nomenclature The nomenclature listed here is used in the instruction descriptions in Table 8-2. Operators () ← & | ⊕ × ÷ : + – = = = = = = = = = = CPU registers A = CCR = H = X = PC = PCH = PCL = SP = Contents of register or memory location shown inside parentheses Is loaded with (read: “gets”) Boolean AND Boolean OR Boolean exclusive-OR Multiply Divide Concatenate Add Negate (two’s complement) Accumulator Condition code register Index register, higher order (most significant) 8 bits Index register, lower order (least significant) 8 bits Program counter Program counter, higher order (most significant) 8 bits Program counter, lower order (least significant) 8 bits Stack pointer Memory and addressing M = A memory location or absolute data, depending on addressing mode M:M + 0x0001= A 16-bit value in two consecutive memory locations. The higher-order (most significant) 8 bits are located at the address of M, and the lower-order (least significant) 8 bits are located at the next higher sequential address. Condition code register (CCR) bits V = Two’s complement overflow indicator, bit 7 H = Half carry, bit 4 I = Interrupt mask, bit 3 N = Negative indicator, bit 2 Z = Zero indicator, bit 1 C = Carry/borrow, bit 0 (carry out of bit 7) CCR activity notation – = Bit not affected MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 112 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) 0 1 U = = = = Bit forced to 0 Bit forced to 1 Bit set or cleared according to results of operation Undefined after the operation Machine coding notation dd = Low-order 8 bits of a direct address 0x0000–0x00FF (high byte assumed to be 0x00) ee = Upper 8 bits of 16-bit offset ff = Lower 8 bits of 16-bit offset or 8-bit offset ii = One byte of immediate data jj = High-order byte of a 16-bit immediate data value kk = Low-order byte of a 16-bit immediate data value hh = High-order byte of 16-bit extended address ll = Low-order byte of 16-bit extended address rr = Relative offset Source form Everything in the source forms columns, except expressions in italic characters, is literal information that must appear in the assembly source file exactly as shown. The initial 3- to 5-letter mnemonic is always a literal expression. All commas, pound signs (#), parentheses, and plus signs (+) are literal characters. n — Any label or expression that evaluates to a single integer in the range 0–7 opr8i — Any label or expression that evaluates to an 8-bit immediate value opr16i — Any label or expression that evaluates to a 16-bit immediate value opr8a — Any label or expression that evaluates to an 8-bit value. The instruction treats this 8-bit value as the low order 8 bits of an address in the direct page of the 64-Kbyte address space (0x00xx). opr16a — Any label or expression that evaluates to a 16-bit value. The instruction treats this value as an address in the 64-Kbyte address space. oprx8 — Any label or expression that evaluates to an unsigned 8-bit value, used for indexed addressing oprx16 — Any label or expression that evaluates to a 16-bit value. Because the HCS08 has a 16-bit address bus, this can be either a signed or an unsigned value. rel — Any label or expression that refers to an address that is within –128 to +127 locations from the next address after the last byte of object code for the current instruction. The assembler will calculate the 8-bit signed offset and include it in the object code for this instruction. Address modes INH = IMM = DIR = EXT = Inherent (no operands) 8-bit or 16-bit immediate 8-bit direct 16-bit extended MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 113 Chapter 8 Central Processor Unit (S08CPUV2) IX IX+ IX1 IX1+ = = = = IX2 REL SP1 SP2 = = = = 16-bit indexed no offset 16-bit indexed no offset, post increment (CBEQ and MOV only) 16-bit indexed with 8-bit offset from H:X 16-bit indexed with 8-bit offset, post increment (CBEQ only) 16-bit indexed with 16-bit offset from H:X 8-bit relative offset Stack pointer with 8-bit offset Stack pointer with 16-bit offset Description V H I N Z C ADC ADC ADC ADC ADC ADC ADC ADC ADD ADD ADD ADD ADD ADD ADD ADD #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP AIS #opr8i AIX #opr8i AND #opr8i AND opr8a AND opr16a AND oprx16,X AND oprx8,X AND ,X AND oprx16,SP AND oprx8,SP ASL opr8a ASLA ASLX ASL oprx8,X ASL ,X ASL oprx8,SP ASR opr8a ASRA ASRX ASR oprx8,X ASR ,X ASR oprx8,SP BCC rel A ← (A) + (M) + (C) Add with Carry A ← (A) + (M) Add without Carry Add Immediate Value (Signed) to Stack Pointer Add Immediate Value (Signed) to Index Register (H:X) ↕ ↕ ↕ ii dd hh ll ee ff ff ee ff ff ii dd hh ll ee ff ff ee ff ff 2 3 4 4 3 3 5 4 2 3 4 4 3 3 5 4 – – – – – – IMM A7 ii 2 H:X ← (H:X) + (M) M is sign extended to a 16-bit value – – – – – – IMM AF ii 2 A ← (A) & (M) C 0 – – ↕ 0 b7 C b7 ↕ – – ↕ ↕ – ↕ ↕ b0 Arithmetic Shift Right Branch if Carry Bit Clear ↕ – ↕ ↕ A9 B9 C9 D9 E9 F9 9ED9 9EE9 AB BB CB DB EB FB 9EDB 9EEB SP ← (SP) + (M) M is sign extended to a 16-bit value Logical AND Arithmetic Shift Left (Same as LSL) ↕ – ↕ IMM DIR EXT ↕ IX2 IX1 IX SP2 SP1 IMM DIR EXT ↕ IX2 IX1 IX SP2 SP1 Bus Cycles1 Operation Operand Effect on CCR Opcode Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 1 of 7) b0 Branch if (C) = 0 ↕ – – ↕ ↕ ↕ – – – – – – IMM DIR EXT IX2 IX1 IX SP2 SP1 DIR INH INH IX1 IX SP1 DIR INH INH IX1 IX SP1 REL A4 B4 C4 D4 E4 F4 9ED4 9EE4 38 48 58 68 78 9E68 37 47 57 67 77 9E67 24 ii dd hh ll ee ff ff ee ff ff dd ff ff dd ff ff rr 2 3 4 4 3 3 5 4 5 1 1 5 4 6 5 1 1 5 4 6 3 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 114 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) V H I N Z C DIR (b0) DIR (b1) DIR (b2) (b3) – – – – – – DIR DIR (b4) DIR (b5) DIR (b6) DIR (b7) 11 13 15 17 19 1B 1D 1F dd dd dd dd dd dd dd dd Bus Cycles1 Description Operand Operation Opcode Effect on CCR Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 2 of 7) 5 5 5 5 5 5 5 5 BCLR n,opr8a Clear Bit n in Memory Mn ← 0 BCS rel Branch if Carry Bit Set (Same as BLO) Branch if (C) = 1 – – – – – – REL 25 rr 3 BEQ rel Branch if Equal Branch if (Z) = 1 – – – – – – REL 27 rr 3 BGE rel Branch if Greater Than or Equal To (Signed Operands) Branch if (N ⊕ V) = 0 – – – – – – REL 90 rr 3 BGND Enter Active Background if ENBDM = 1 Waits For and Processes BDM Commands Until GO, TRACE1, or TAGGO – – – – – – INH 82 5+ BGT rel Branch if Greater Than (Signed Operands) Branch if Half Carry Bit Clear Branch if Half Carry Bit Set Branch if (Z) | (N ⊕ V) = 0 – – – – – – REL 92 rr 3 Branch if (H) = 0 – – – – – – REL 28 rr 3 Branch if (H) = 1 – – – – – – REL 29 rr 3 Branch if (C) | (Z) = 0 – – – – – – REL 22 rr 3 Branch if (C) = 0 – – – – – – REL 24 rr 3 – – – – – – REL – – – – – – REL 2F rr 3 2E rr BHCC rel BHCS rel BHI rel Branch if Higher BHS rel Branch if Higher or Same (Same as BCC) BIH rel Branch if IRQ Pin High Branch if IRQ pin = 1 BIL rel Branch if IRQ Pin Low Branch if IRQ pin = 0 BIT BIT BIT BIT BIT BIT BIT BIT #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP (A) & (M) (CCR Updated but Operands Not Changed) Bit Test 0 – – ↕ IMM DIR EXT ↕ – IX2 IX1 IX SP2 SP1 A5 B5 C5 D5 E5 F5 9ED5 9EE5 ii dd hh ll ee ff ff ee ff ff 3 2 3 4 4 3 3 5 4 BLO rel Branch if Less Than or Equal To (Signed Operands) Branch if Lower (Same as BCS) BLS rel Branch if Lower or Same Branch if (C) | (Z) = 1 – – – – – – REL 23 rr 3 BLT rel Branch if (N ⊕ V ) = 1 – – – – – – REL 91 rr 3 BMC rel Branch if Less Than (Signed Operands) Branch if Interrupt Mask Clear Branch if (I) = 0 – – – – – – REL 2C rr 3 BMI rel Branch if Minus Branch if (N) = 1 – – – – – – REL 2B rr 3 BMS rel Branch if Interrupt Mask Set Branch if (I) = 1 – – – – – – REL 2D rr 3 BNE rel Branch if Not Equal Branch if (Z) = 0 3 Branch if Plus Branch if (N) = 0 2A rr 3 BRA rel Branch Always No Test – – – – – – REL – – – – – – REL – – – – – – REL 26 rr BPL rel 20 rr 3 BLE rel Branch if (Z) | (N ⊕ V) = 1 – – – – – – REL 93 rr 3 Branch if (C) = 1 – – – – – – REL 25 rr 3 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 115 Chapter 8 Central Processor Unit (S08CPUV2) V H I N Z C BRCLR n,opr8a,rel Branch if Bit n in Memory Clear Branch if (Mn) = 0 DIR (b0) DIR (b1) DIR (b2) (b3) – – – – – ↕ DIR DIR (b4) DIR (b5) DIR (b6) DIR (b7) BRN rel Branch Never Uses 3 Bus Cycles – – – – – – REL 21 rr Branch if (Mn) = 1 DIR (b0) DIR (b1) DIR (b2) (b3) – – – – – ↕ DIR DIR (b4) DIR (b5) DIR (b6) DIR (b7) 00 02 04 06 08 0A 0C 0E dd dd dd dd dd dd dd dd Mn ← 1 DIR (b0) DIR (b1) DIR (b2) (b3) – – – – – – DIR DIR (b4) DIR (b5) DIR (b6) DIR (b7) 10 12 14 16 18 1A 1C 1E dd dd dd dd dd dd dd dd – – – – – – REL AD rr BRSET n,opr8a,rel Branch if Bit n in Memory Set BSET n,opr8a Set Bit n in Memory BSR rel Branch to Subroutine PC ← (PC) + 0x0002 push (PCL); SP ← (SP) – 0x0001 push (PCH); SP ← (SP) – 0x0001 PC ← (PC) + rel Branch if (A) = (M) Branch if (A) = (M) Branch if (X) = (M) Branch if (A) = (M) Branch if (A) = (M) Branch if (A) = (M) CBEQ opr8a,rel CBEQA #opr8i,rel CBEQX #opr8i,rel CBEQ oprx8,X+,rel CBEQ ,X+,rel CBEQ oprx8,SP,rel Compare and Branch if Equal CLC Clear Carry Bit C←0 CLI Clear Interrupt Mask Bit CLR opr8a CLRA CLRX CLRH CLR oprx8,X CLR ,X CLR oprx8,SP CMP CMP CMP CMP CMP CMP CMP CMP #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP COM opr8a COMA COMX COM oprx8,X COM ,X COM oprx8,SP CPHX opr16a CPHX #opr16i CPHX opr8a CPHX oprx8,SP Clear Compare Accumulator with Memory Complement (One’s Complement) Compare Index Register (H:X) with Memory DIR IMM – – – – – – IMM IX1+ IX+ SP1 01 03 05 07 09 0B 0D 0F 31 41 51 61 71 9E61 dd dd dd dd dd dd dd dd dd ii ii ff rr ff rr rr rr rr rr rr rr rr Bus Cycles1 Description Operand Operation Opcode Effect on CCR Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 3 of 7) 5 5 5 5 5 5 5 5 3 rr rr rr rr rr rr rr rr 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 rr rr rr rr rr 5 4 4 5 5 6 98 1 I←0 – – – – – 0 INH – – 0 – – – INH 9A 1 M ← 0x00 A ← 0x00 X ← 0x00 H ← 0x00 M ← 0x00 M ← 0x00 M ← 0x00 DIR INH INH 0 – – 0 1 – INH IX1 IX SP1 3F dd 4F 5F 8C 6F ff 7F 9E6F ff 5 1 1 1 5 4 6 A1 B1 C1 D1 E1 F1 9ED1 9EE1 33 43 53 63 73 9E63 3E 65 75 9EF3 2 3 4 4 3 3 5 4 5 1 1 5 4 6 6 3 5 6 (A) – (M) (CCR Updated But Operands Not Changed) ↕ – – ↕ M ← (M)= 0xFF – (M) A ← (A) = 0xFF – (A) X ← (X) = 0xFF – (X) M ← (M) = 0xFF – (M) M ← (M) = 0xFF – (M) M ← (M) = 0xFF – (M) 0 – – ↕ (H:X) – (M:M + 0x0001) (CCR Updated But Operands Not Changed) ↕ – – ↕ IMM DIR EXT IX2 ↕ ↕ IX1 IX SP2 SP1 DIR INH ↕ 1 INH IX1 IX SP1 EXT ↕ ↕ IMM DIR SP1 ii dd hh ll ee ff ff ee ff ff dd ff ff hh ll jj kk dd ff MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 116 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) V H I N Z C CPX CPX CPX CPX CPX CPX CPX CPX #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP DAA DBNZ opr8a,rel DBNZA rel DBNZX rel DBNZ oprx8,X,rel DBNZ ,X,rel DBNZ oprx8,SP,rel DEC opr8a DECA DECX DEC oprx8,X DEC ,X DEC oprx8,SP DIV EOR #opr8i EOR opr8a EOR opr16a EOR oprx16,X EOR oprx8,X EOR ,X EOR oprx16,SP EOR oprx8,SP INC opr8a INCA INCX INC oprx8,X INC ,X INC oprx8,SP JMP opr8a JMP opr16a JMP oprx16,X JMP oprx8,X JMP ,X JSR opr8a JSR opr16a JSR oprx16,X JSR oprx8,X JSR ,X LDA #opr8i LDA opr8a LDA opr16a LDA oprx16,X LDA oprx8,X LDA ,X LDA oprx16,SP LDA oprx8,SP LDHX #opr16i LDHX opr8a LDHX opr16a LDHX ,X LDHX oprx16,X LDHX oprx8,X LDHX oprx8,SP Compare X (Index Register Low) with Memory (X) – (M) (CCR Updated But Operands Not Changed) ↕ – – ↕ ↕ IMM DIR EXT ↕ IX2 IX1 IX SP2 SP1 A3 B3 C3 D3 E3 F3 9ED3 9EE3 Decimal Adjust Accumulator After ADD or ADC of BCD Values (A)10 U – – ↕ ↕ ↕ INH 72 Decrement and Branch if Not Zero Decrement A, X, or M Branch if (result) ≠ 0 DBNZX Affects X Not H DIR INH – – – – – – INH IX1 IX SP1 3B 4B 5B 6B 7B 9E6B Decrement M ← (M) – 0x01 A ← (A) – 0x01 X ← (X) – 0x01 M ← (M) – 0x01 M ← (M) – 0x01 M ← (M) – 0x01 ↕ – – ↕ Divide A ← (H:A)÷(X) H ← Remainder Exclusive OR Memory with Accumulator A ← (A ⊕ M) M ← (M) + 0x01 A ← (A) + 0x01 X ← (X) + 0x01 M ← (M) + 0x01 M ← (M) + 0x01 M ← (M) + 0x01 Increment PC ← Jump Address Jump Jump to Subroutine Load Accumulator from Memory Load Index Register (H:X) from Memory PC ← (PC) + n (n = 1, 2, or 3) Push (PCL); SP ← (SP) – 0x0001 Push (PCH); SP ← (SP) – 0x0001 PC ← Unconditional Address A ← (M) H:X ← (M:M + 0x0001) DIR INH ↕ – INH IX1 IX SP1 ii dd hh ll ee ff ff ee ff ff Bus Cycles1 Description Operand Operation Opcode Effect on CCR Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 4 of 7) 2 3 4 4 3 3 5 4 1 dd rr rr rr ff rr rr ff rr 7 4 4 7 6 8 3A dd 4A 5A 6A ff 7A 9E6A ff 5 1 1 5 4 6 – – – – ↕ ↕ INH 52 6 IMM DIR EXT IX2 IX1 IX SP2 SP1 DIR INH INH IX1 IX SP1 DIR EXT IX2 IX1 IX DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX SP2 SP1 IMM DIR EXT IX IX2 IX1 SP1 A8 B8 C8 D8 E8 F8 9ED8 9EE8 3C 4C 5C 6C 7C 9E6C BC CC DC EC FC BD CD DD ED FD A6 B6 C6 D6 E6 F6 9ED6 9EE6 45 55 32 9EAE 9EBE 9ECE 9EFE 0 – – ↕ ↕ – ↕ – – ↕ ↕ – – – – – – – – – – – – – 0 – – ↕ ↕ – 0 – – ↕ ↕ – ii dd hh ll ee ff ff ee ff ff dd ff ff dd hh ll ee ff ff dd hh ll ee ff ff ii dd hh ll ee ff ff ee ff ff jj kk dd hh ll ee ff ff ff 2 3 4 4 3 3 5 4 5 1 1 5 4 6 3 4 4 3 3 5 6 6 5 5 2 3 4 4 3 3 5 4 3 4 5 5 6 5 5 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 117 Chapter 8 Central Processor Unit (S08CPUV2) V H I N Z C LDX #opr8i LDX opr8a LDX opr16a LDX oprx16,X LDX oprx8,X LDX ,X LDX oprx16,SP LDX oprx8,SP LSL opr8a LSLA LSLX LSL oprx8,X LSL ,X LSL oprx8,SP LSR opr8a LSRA LSRX LSR oprx8,X LSR ,X LSR oprx8,SP Load X (Index Register Low) from Memory Logical Shift Left (Same as ASL) Logical Shift Right X ← (M) 0 – – ↕ C 0 b7 0 C b7 b0 (M)destination ← (M)source MOV opr8a,opr8a MOV opr8a,X+ MOV #opr8i,opr8a MOV ,X+,opr8a Move MUL Unsigned multiply ↕ – – ↕ b0 H:X ← (H:X) + 0x0001 in IX+/DIR and DIR/IX+ Modes X:A ← (X) × (A) M ← – (M) = 0x00 – (M) A ← – (A) = 0x00 – (A) X ← – (X) = 0x00 – (X) M ← – (M) = 0x00 – (M) M ← – (M) = 0x00 – (M) M ← – (M) = 0x00 – (M) IMM DIR EXT ↕ – IX2 IX1 IX SP2 SP1 DIR INH ↕ ↕ INH IX1 IX SP1 DIR INH ↕ – – 0 ↕ ↕ INH IX1 IX SP1 DIR/DIR 0 – – ↕ ↕ – DIR/IX+ IMM/DIR IX+/DIR – 0 – – – 0 INH AE BE CE DE EE FE 9EDE 9EEE 38 48 58 68 78 9E68 ii dd hh ll ee ff ff 34 44 54 64 74 9E64 4E 5E 6E 7E ee ff ff dd ff ff dd ff ff dd dd dd ii dd dd Bus Cycles1 Description Operand Operation Opcode Effect on CCR Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 5 of 7) 2 3 4 4 3 3 5 4 5 1 1 5 4 6 5 1 1 5 4 6 5 5 4 5 42 5 30 dd 40 50 60 ff 70 9E60 ff 5 1 1 5 4 6 NEG opr8a NEGA NEGX NEG oprx8,X NEG ,X NEG oprx8,SP Negate (Two’s Complement) NOP No Operation Uses 1 Bus Cycle – – – – – – INH 9D 1 NSA Nibble Swap Accumulator A ← (A[3:0]:A[7:4]) – – – – – – INH 62 1 IMM DIR EXT ↕ – IX2 IX1 IX SP2 SP1 AA BA CA DA EA FA 9EDA 9EEA Push (A); SP ← (SP) – 0x0001 – – – – – – INH 87 2 Push (H); SP ← (SP) – 0x0001 – – – – – – INH 8B 2 Push (X); SP ← (SP) – 0x0001 – – – – – – INH 89 2 SP ← (SP + 0x0001); Pull (A) – – – – – – INH 86 3 SP ← (SP + 0x0001); Pull (H) – – – – – – INH 8A 3 SP ← (SP + 0x0001); Pull (X) – – – – – – INH 88 3 39 dd 49 59 69 ff 79 9E69 ff 5 1 1 5 4 6 ORA ORA ORA ORA ORA ORA ORA ORA #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP PSHA PSHH PSHX PULA PULH PULX ROL opr8a ROLA ROLX ROL oprx8,X ROL ,X ROL oprx8,SP Inclusive OR Accumulator and Memory Push Accumulator onto Stack Push H (Index Register High) onto Stack Push X (Index Register Low) onto Stack Pull Accumulator from Stack Pull H (Index Register High) from Stack Pull X (Index Register Low) from Stack Rotate Left through Carry A ← (A) | (M) – – ↕ ↕ 0 – – ↕ ↕ – – ↕ C b7 ↕ b0 DIR INH ↕ INH IX1 IX SP1 DIR INH ↕ INH IX1 IX SP1 ii dd hh ll ee ff ff ee ff ff 2 3 4 4 3 3 5 4 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 118 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) V H I N Z C ROR opr8a RORA RORX ROR oprx8,X ROR ,X ROR oprx8,SP Rotate Right through Carry RSP Reset Stack Pointer RTI Return from Interrupt RTS Return from Subroutine SBC SBC SBC SBC SBC SBC SBC SBC #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP SEC SEI STA STA STA STA STA STA STA opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP Subtract with Carry I←1 STOP Enable Interrupts: Stop Processing Refer to MCU Documentation SWI A ← (A) – (M) – (C) Set Interrupt Mask Bit Store H:X (Index Reg.) opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP #opr8i opr8a opr16a oprx16,X oprx8,X ,X oprx16,SP oprx8,SP SP ← 0xFF (High Byte Not Affected) SP ← (SP) + 0x0001; Pull (CCR) SP ← (SP) + 0x0001; Pull (A) SP ← (SP) + 0x0001; Pull (X) SP ← (SP) + 0x0001; Pull (PCH) SP ← (SP) + 0x0001; Pull (PCL) SP ← SP + 0x0001; Pull (PCH) SP ← SP + 0x0001; Pull (PCL) C←1 Store Accumulator in Memory Store X (Low 8 Bits of Index Register) in Memory M ← (A) (M:M + 0x0001) ← (H:X) I bit ← 0; Stop Processing M ← (X) A ← (A) – (M) Subtract Software Interrupt 36 dd 46 56 66 ff 76 9E66 ff 5 1 1 5 4 6 – – – – – – INH 9C 1 ↕ ↕ INH 80 9 – – – – – – INH 81 6 IMM DIR EXT ↕ IX2 IX1 IX SP2 SP1 A2 B2 C2 D2 E2 F2 9ED2 9EE2 – – – – – 1 INH – – 1 – – – INH 99 9B DIR EXT IX2 ↕ – IX1 IX SP2 SP1 DIR ↕ – EXT SP1 B7 C7 D7 E7 F7 9ED7 9EE7 35 96 9EFF – – 0 – – – INH 8E DIR EXT IX2 ↕ – IX1 IX SP2 SP1 IMM DIR EXT ↕ ↕ IX2 IX1 IX SP2 SP1 BF CF DF EF FF 9EDF 9EEF A0 B0 C0 D0 E0 F0 9ED0 9EE0 – – 1 – – – INH 83 ↕ – – ↕ ↕ b0 Set Carry Bit STHX opr8a STHX opr16a STHX oprx8,SP STX STX STX STX STX STX STX SUB SUB SUB SUB SUB SUB SUB SUB C b7 PC ← (PC) + 0x0001 Push (PCL); SP ← (SP) – 0x0001 Push (PCH); SP ← (SP) – 0x0001 Push (X); SP ← (SP) – 0x0001 Push (A); SP ← (SP) – 0x0001 Push (CCR); SP ← (SP) – 0x0001 I ← 1; PCH ← Interrupt Vector High Byte PCL ← Interrupt Vector Low Byte ↕ ↕ ↕ ↕ – – ↕ 0 – – ↕ 0 – – ↕ 0 – – ↕ ↕ – – ↕ ↕ ↕ DIR INH ↕ INH IX1 IX SP1 Bus Cycles1 Description Operand Operation Opcode Effect on CCR Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 6 of 7) ii dd hh ll ee ff ff ee ff ff 2 3 4 4 3 3 5 4 1 1 dd hh ll ee ff ff ee ff ff dd hh ll ff 3 4 4 3 2 5 4 4 5 5 2+ dd hh ll ee ff ff ee ff ff ii dd hh ll ee ff ff ee ff ff 3 4 4 3 2 5 4 2 3 4 4 3 3 5 4 11 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 119 Chapter 8 Central Processor Unit (S08CPUV2) Description V H I N Z C TAP TAX TPA Transfer Accumulator to CCR Transfer Accumulator to X (Index Register Low) Transfer CCR to Accumulator CCR ← (A) ↕ ↕ ↕ ↕ ↕ Bus Cycles1 Operation Operand Effect on CCR Opcode Source Form Address Mode Table 8-2. HCS08 Instruction Set Summary (Sheet 7 of 7) ↕ INH 84 1 X ← (A) – – – – – – INH 97 1 A ← (CCR) – – – – – – INH 85 1 DIR INH ↕ – INH IX1 IX SP1 3D dd 4D 5D 6D ff 7D 9E6D ff 4 1 1 4 3 5 TST opr8a TSTA TSTX TST oprx8,X TST ,X TST oprx8,SP Test for Negative or Zero (M) – 0x00 (A) – 0x00 (X) – 0x00 (M) – 0x00 (M) – 0x00 (M) – 0x00 TSX Transfer SP to Index Reg. H:X ← (SP) + 0x0001 – – – – – – INH 95 2 TXA Transfer X (Index Reg. Low) to Accumulator A ← (X) – – – – – – INH 9F 1 SP ← (H:X) – 0x0001 – – – – – – INH 94 2 I bit ← 0; Halt CPU – – 0 – – – INH 8F 2+ TXS Transfer Index Reg. to SP WAIT Enable Interrupts; Wait for Interrupt 1 0 – – ↕ Bus clock frequency is one-half of the CPU clock frequency. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 120 Freescale Semiconductor Chapter 8 Central Processor Unit (S08CPUV2) Table 8-3. Opcode Map (Sheet 1 of 2) Bit-Manipulation 00 5 10 5 BRSET0 3 01 BRCLR1 3 04 BRSET2 3 05 3 07 BRSET4 3 09 BRSET5 3 0B BRSET6 3 0D BRCLR6 3 0E BRSET7 3 0F BRCLR7 3 INH IMM DIR EXT DD IX+D INC DIR 2 5 2F TST REL 2 3 3E CPHX REL 3 3 3F BIH CLR DIR 1 ASR INH 2 1 68 INH 1 Relative Indexed, No Offset Indexed, 8-Bit Offset Indexed, 16-Bit Offset IMM to DIR DIR to IX+ ROL DEC ROL DEC DBNZ INH 3 1 6C DBNZ INC INH 2 1 6D INC IX1 1 4 7D TST INH 2 5 6E MOV CLRX IX1 1 CLR ADD INH 2 1 Stack Pointer, 8-Bit Offset Stack Pointer, 16-Bit Offset Indexed, No Offset with Post Increment Indexed, 1-Byte Offset with Post Increment INH 1 2 BD BSR Page 2 WAIT 5 1 JSR REL 2 2 BE LDX 2 AF TXA INH 2 JMP DIR 3 5 CD JSR DIR 3 3 CE LDX IMM 2 2 BF AIX LDX DIR 3 3 CF STX IMM 2 EXT 3 4 DF STX DIR 3 EXT 3 Opcode in Hexadecimal F0 EOR ADC IX2 2 IX 2 STA IX 3 EOR IX 3 ADC IX1 1 3 FA ORA IX 3 ORA IX1 1 3 FB ADD JSR LDX IX1 1 3 FF IX 5 JSR IX1 1 3 FE IX1 1 IX 3 JMP IX1 1 5 FD STX IX 3 ADD IX1 1 3 FC JMP IX2 2 4 EF STX IX 3 LDA IX1 1 3 F9 IX2 2 4 EE LDX BIT IX1 1 3 F8 IX2 2 6 ED JSR EXT 3 4 DE IX 3 STA IX2 2 4 EC JMP EXT 3 6 DD AND IX1 1 3 F7 IX2 2 4 EB ADD EXT 3 4 DC IX 3 LDA IX2 2 4 EA ORA EXT 3 4 DB ADD JMP INH 2 AE INH 2+ 9F ORA CPX IX1 1 3 F6 IX2 2 4 E9 ADC EXT 3 4 DA IX 3 BIT IX2 2 4 E8 EOR IX 3 SBC IX1 1 3 F5 STA ADC DIR 3 3 CC AND IX2 2 4 E7 EXT 3 4 D9 CMP IX1 1 3 F4 IX2 2 4 E6 EXT 3 4 D8 EOR DIR 3 3 CB ADD IMM 2 BC INH 1 AD NOP IX 1 IMM 2 2 BB CPX LDA STA IX 3 IX1 1 3 F3 IX2 2 4 E5 EXT 3 4 D7 DIR 3 3 CA ORA RSP 1 2+ 9E STOP ADC SBC BIT LDA DIR 3 3 C9 IMM 2 2 BA ORA SEI INH 1 9D IX 5 8E MOV ADC INH 2 1 AB INH 1 1 9C CLRH IX 1 3 IMD 2 IX+D 1 5 7F 4 8F CLR INH 2 INH 1 2 9B EOR AND 3 SUB IX1 1 3 F2 IX2 2 4 E4 EXT 3 4 D6 DIR 3 3 C8 IMM 2 2 B9 INH 2 1 AA CLI TST IX1 1 4 7E MOV SEC INH 1 3 9A PSHH IX 1 4 8C EOR CPX BIT STA CMP IX2 2 4 E3 EXT 3 4 D5 DIR 3 3 C7 IMM 2 2 B8 INH 2 1 A9 PULH IX 1 6 8B IX1 2 5 7C CLC INH 1 2 99 AND LDA AIS INH 2 1 A8 SBC F0 IX1 1 3 F1 IX2 2 4 E2 EXT 3 4 D4 DIR 3 3 C6 IMM 2 2 B7 TAX CPX BIT LDA CMP EXT 3 4 D3 DIR 3 3 C5 IMM 2 2 B6 EXT 2 1 A7 INH 1 3 98 PSHX IX 1 4 8A IX1 1 7 7B INH 3 2 97 PULX IX 1 4 89 IX1 1 5 7A INH 2 4 6B IX1+ LSL STHX PSHA IX 1 4 88 IX1 1 5 79 INH 2 1 6A SP1 SP2 IX+ ASR LSL INH 2 1 69 PULA IX 1 4 87 IX1 1 5 78 DD 2 DIX+ 3 1 5F 1 6F CLRA ROR AND BIT INH 2 5 A6 SBC 3 SUB IX2 2 4 E1 EXT 3 4 D2 DIR 3 3 C4 IMM 2 2 B5 TSX INH 1 3 96 CPX AND CMP E0 SUB EXT 3 4 D1 DIR 3 3 C3 IMM 2 2 B4 INH 2 2 A5 TPA DIR 1 4 86 IX1 1 5 77 TSTX INH 1 5 5E MOV EXT 3 5 4F REL 2 REL IX IX1 IX2 IMD DIX+ TSTA DIR 1 6 4E INH 2 1 67 INCX INH 1 1 5D CPHX TXS INH 1 1 95 SBC CPX SUB DIR 3 3 C2 IMM 2 2 B3 REL 2 2 A4 TAP IX 1 5 85 IMM 2 5 76 ROR DBNZX INH 2 1 5C INCA DIR 1 4 4D CPHX DIR 3 1 66 DECX INH 1 4 5B DBNZA DIR 2 5 4C REL 2 3 3D BIL DECA DIR 1 7 4B DBNZ BMS DIR 2 5 2E Inherent Immediate Direct Extended DIR to DIR IX+ to DIR DEC LSR CMP SBC BLE Register/Memory C0 4 D0 4 DIR 3 3 C1 IMM 2 2 B2 REL 2 3 A3 INH 2 1 94 3 SUB CMP BGT SWI B0 IMM 2 2 B1 REL 2 3 A2 INH 2 11 93 IX 1 4 84 2 SUB BLT INH 2 5+ 92 BGND COM A0 REL 2 3 A1 RTS INH 1 4 83 IX1 1 3 75 ROLX INH 1 1 5A DAA 3 BGE INH 2 6 91 IX+ 1 1 82 LSR LSLX INH 1 1 59 CBEQ IX1 1 5 74 INH 2 4 65 ASRX INH 1 1 58 ROLA DIR 1 5 4A BMC DIR 2 5 2D DIR 2 ROL REL 3 3 3C INH 1 1 57 LSLA DIR 1 5 49 REL 2 3 3B BMI DIR 2 5 2C BCLR7 DIR 2 LSL COM RTI IX 1 5 81 INH 1 5 73 INH 2 1 64 RORX ASRA DIR 1 5 48 REL 2 3 3A DIR 2 5 2B BSET7 DIR 2 5 1F ASR BHCS BPL RORA DIR 1 5 47 REL 2 3 39 DIR 2 5 2A BCLR6 DIR 2 5 1E ROR INH 1 1 63 Control 9 90 80 NEG NSA LDHX IMM 2 1 56 4 IX1+ 2 1 72 LSRX INH 1 3 55 LDHX DIR 3 5 46 BHCC DIR 2 5 29 BSET6 DIR 2 5 1D STHX CBEQ COMX INH 1 1 54 LSRA DIR 1 4 45 REL 2 3 38 BCLR5 DIR 2 5 1C LSR BEQ INH 1 1 53 70 IX1 1 5 71 IMM 3 6 62 DIV COMA DIR 1 5 44 REL 2 3 37 BSET5 DIR 2 5 1B BRCLR5 3 0C BNE DIR 2 5 28 BCLR4 DIR 2 5 1A COM REL 2 3 36 DIR 2 5 27 BSET4 DIR 2 5 19 BRCLR4 3 0A BCS MUL 5 NEG INH 2 4 61 CBEQX IMM 3 5 52 EXT 1 5 43 REL 2 3 35 DIR 2 5 26 CBEQA LDHX NEGX INH 1 4 51 DIR 3 5 42 BCC BCLR3 DIR 2 5 18 CBEQ REL 2 3 34 DIR 2 5 25 BSET3 DIR 2 5 17 BRCLR3 3 08 BLS NEGA DIR 1 5 41 REL 3 3 33 DIR 2 5 24 BCLR2 DIR 2 5 16 BRSET3 DIR 2 5 23 Read-Modify-Write 1 50 1 60 40 NEG REL 3 3 32 BHI BSET2 DIR 2 5 15 BRCLR2 3 06 BRN DIR 2 5 22 BCLR1 DIR 2 5 14 5 REL 2 3 31 BSET1 DIR 2 5 13 30 BRA DIR 2 5 21 BCLR0 DIR 2 5 12 BRSET1 3 03 BSET0 DIR 2 5 11 BRCLR0 3 02 Branch 20 3 IX 3 LDX IX 2 STX IX 3 HCS08 Cycles Instruction Mnemonic IX Addressing Mode SUB Number of Bytes 1 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 121 Chapter 8 Central Processor Unit (S08CPUV2) Table 8-3. Opcode Map (Sheet 2 of 2) Bit-Manipulation Branch Read-Modify-Write 9E60 Control Register/Memory 9ED0 5 6 NEG CMP SP1 CMP 4 SP2 3 SP1 9ED2 5 9EE2 4 SBC 9E63 SBC 4 SP2 3 SP1 9ED3 5 9EE3 4 9EF3 6 COM CPX 3 SP1 9E64 6 CPX AND SP1 SP1 AND 4 SP2 3 SP1 9ED5 5 9EE5 4 BIT BIT 6 4 SP2 3 SP1 9ED6 5 9EE6 4 3 SP1 9E67 6 4 SP2 3 SP1 9ED7 5 9EE7 4 9E66 6 CPHX 4 SP2 3 SP1 3 9ED4 5 9EE4 4 LSR 3 4 SUB 4 SP2 3 SP1 9ED1 5 9EE1 4 CBEQ 4 9EE0 SUB 3 SP1 9E61 6 ROR LDA ASR LDA STA 3 SP1 9E68 6 STA 4 SP2 3 SP1 9ED8 5 9EE8 4 LSL EOR 3 SP1 9E69 6 EOR 4 SP2 3 SP1 9ED9 5 9EE9 4 ROL ADC 3 SP1 9E6A 6 ADC 4 SP2 3 SP1 9EDA 5 9EEA 4 DEC ORA 3 SP1 9E6B 8 ORA 4 SP2 3 SP1 9EDB 5 9EEB 4 DBNZ ADD 4 SP1 9E6C 6 4 ADD SP2 3 SP1 INC 3 SP1 9E6D 5 TST 3 SP1 9EAE 5 9EBE LDHX 2 9E6F IX 4 6 9ECE LDHX 5 9EDE LDHX IX2 3 6 CLR 3 INH IMM DIR EXT DD IX+D Inherent Immediate Direct Extended DIR to DIR IX+ to DIR REL IX IX1 IX2 IMD DIX+ Relative Indexed, No Offset Indexed, 8-Bit Offset Indexed, 16-Bit Offset IMM to DIR DIR to IX+ SP1 SP2 IX+ IX1+ Note: All Sheet 2 Opcodes are Preceded by the Page 2 Prebyte (9E) 5 9EEE LDX 4 9EFE LDX 5 LDHX IX1 4 SP2 3 SP1 3 SP1 9EDF 5 9EEF 4 9EFF 5 STX SP1 4 SP2 3 STX SP1 3 STHX SP1 Stack Pointer, 8-Bit Offset Stack Pointer, 16-Bit Offset Indexed, No Offset with Post Increment Indexed, 1-Byte Offset with Post Increment Prebyte (9E) and Opcode in Hexadecimal 9E60 6 HCS08 Cycles Instruction Mnemonic SP1 Addressing Mode NEG Number of Bytes 3 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 122 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.1 Introduction The LCD driver module is a CMOS charge pump voltage inverter that is designed for low-voltage, low-power operation. The LCD driver module is designed to generate the appropriate waveforms to drive multiplexed numeric, alpha-numeric, or custom LCD panels. Depending on LCD module hardware and software configuration, the LCD panels can be either 3 V or 5 V and be driven by different waveform modes. The LCD module also has several timing and control settings that can be software configured depending on the applications requirements. Timing and control consists of registers and control logic for: • LCD frame frequency • Duty cycle select • Frontplane/backplane select and enable • Blink modes and frequency • Operation in low-power modes In a 64-pin package, the LCD module can be configured to drive 4 backplanes/32 frontplanes (128 segments) or 3 backplanes/33 frontplanes (99 segments). In a 80-pin package, the LCD module can be configured to drive a maximum of 4 backplanes/40 frontplanes (160 segments) or 3 backplanes/41 frontplanes (123 segments). These configurations are summarized in Table 9-1. Table 9-1. Configuration Options by Package Type Package Type No. of Backplanes No. of Frontplanes No. of Segments 4 32 128 3 33 99 4 40 160 3 41 123 64-pin 80-pin Figure 9-1 shows the MC9S08LC60 Series block diagram with the LCD highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 123 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 9-1. MC9S08LC60 Series Block Diagram Highlighting LCD Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 124 Freescale Semiconductor Chapter 9 Liquid Crystal Display (S08LCDV1) 9.1.1 Features The LCD module driver module features include: • Low-power LCD waveform mode • LCD waveforms functional in wait and stop3 low-power modes • Selectable frontplane/backplane configuration — Up to 41 frontplanes — Up to 4 backplanes • Programmable LCD frame frequency • Programmable blink modes and frequency — Independent blink control for each LCD segment — Blink function remains active in stop3 mode • Programmable LCD power supply switch making it an ideal solution for battery powered and board level applications — Requires only four external capacitors — Internal LCD power using VDD (1.8 to 3.6 V) — External VLCD power supply option (0.9 to 1.8 V) • Integrated charge pump for LCD — Hardware configurable to drive 3-V or 5-V LCD panels — On-chip generation of bias voltages, adjustable charge pump frequency • Dedicated LCD RAM • LCD frame frequency interrupt event • Internal ADC channels are connected to VLL1 and VLCD to monitor their magnitudes.This feature makes it possible to adjust the contrast by software. • Low-power, low-voltage CMOS technology 9.1.2 Modes of Operation The LCD module supports the following operation modes: Table 9-2. Modes of Operation Mode Operation Stop1 all LCD operation is suspended. It is recommended to blank the display before entering stop1 Stop2 all LCD operation is suspended. It is recommended to blank the display before entering stop2. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 125 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-2. Modes of Operation (continued) Mode Operation Stop3 Depending on the state of the LCDSTP3 bit, the LCD module can operate an LCD panel in stop3 mode. If LCDSTP3 = 1, LCD module clock generation is turned off and the LCD module enters a power conservation state.If LCDSTP3 = 0, the LCD module can operate an LCD panel in stop3, and the LCD module continues to display the current LCD panel contents base on the LCDRAM registers. If the LCD is enabled in stop3, the ICGERCLK must be selected as the clock source since the bus clock is not available in stop3. Wait Depending on the configuration, the LCD module can operate an LCD panel in wait mode. If LCDWAI = 1, the LCD module clock generation is turned off and the LCD module enters a power conservation state.If LCDWAI = 0, the LCD module can operate an LCD panel in wait, and the LCD module continues to display the current LCD panel contents base on the LCDRAM registers. Blinking functionality remains active in wait or stop3 mode. If the MCU is in wait or stop3, the LCDRAM registers cannot be changed. Stop3 provides the lowest power consumption state where the LCD module is functional. 9.1.3 Block Diagram Figure 9-2 is a block diagram of the LCD module. LCD DIGITAL lcd_regs LCD RAM LCD FP/BP DRIVER lcd_ipbus_interface IP BUS lcd_vgen lcd_control lcd_clkgen CONTROL BASE CLOCK CLOCK INPUT LCD CHARGE PUMP VLL1 VLL2 VLL3 Figure 9-2. LCD Driver Block Diagram MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 126 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.2 External Signal Description The LCD module has several external pins dedicated to power supply and also LCD frontplane/backplane signaling. Table 9-3 itemizes all the LCD external pins. See the Pins and Connections chapter for device-specific pin configurations. Table 9-3. Signal Properties Name Port Function Reset State 3 backplanes BP[2:0], Backplane waveform signals that connect directly to the pads High impedance 40 frontplanes FP[39:0] Frontplane waveform signals that connect directly to the pads High impedance BP3/FP40 Switchable frontplane/backplane signal that connects directly to the pads High impedance Frontplane/backplane LCD voltage VLCD LCD supply voltage — LCD bias voltages VLL1, VLL2, VLL3 LCD bias voltages — LCD charge pump capacitance Vcap1, Vcap2 Charge pump capacitor pins — 9.2.1 BP[2:0] This output signal vector represents the analog backplane waveforms of the LCD module. These signals are connected to the back plane of the LCD panel. 9.2.2 FP[39:0] This output signal vector represents the analog frontplane waveforms of the LCD module. These signals are connected to the front plane of the LCD panel. 9.2.3 BP3/FP40 This signal vector represents either an analog frontplane or backplane waveform of the LCD module depending on the configuration of the DUTY[1:0] bit field. 9.2.4 VLCD VLCD is the positive supply voltage for the LCD module waveform generation. VLCD can internally derive from VDD or externally derive from voltage source range from 0.9 to 1.8 Volts. VLCD is connected to a switch capacitor charge pump DC/DC converter (voltage doubler and voltage tripler) which is able to generate double or triple VLCD in order to support either 3-V or 5-V LCD glass. VLCD is also connected internally to an internal ADC channel in order to monitor the VLCD magnitude. 9.2.5 VLL1, VLL2, VLL3 VLL1, VLL2, and VLL3 are bias voltages for the LCD module driver waveforms. Internally generated using the internal charge pump when it is enabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 127 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.2.6 Vcap1, Vcap2 The charge pump capacitor is used to transfer charge from the input supply to the regulated output. It is recommended that a low equivalent series resistance (ESR) capacitor be used. Proper orientation is imperative when using a polarized capacitor. 9.3 Register Definition This section consists of register descriptions. Each description includes a standard register diagram. Details of register bit and field function follow the register diagrams, in bit order. 9.3.1 LCD Control Register 0 (LCDCR0) 7 6 5 4 3 LCDEN LPWAVE LCLK2 LCLK1 LCLK0 0 1 0 0 0 R 2 1 0 DUTY1 DUTY0 1 1 0 W Reset 0 = Unimplemented or Reserved Figure 9-3. LCD Control Register 0 (LCDCR0) Read: anytime Write: LCDEN anytime. To avoid segment flicker the clock prescaler bits (LCLK[2:0]) and the duty select bits (DUTY[1:0]) must not be changed when the LCD module is enabled. Table 9-4. LCDCR0 Field Descriptions Field Description 7 LCDEN LCD Driver Enable — The LCDEN bit starts the LCD module waveform generator. 0 All frontplane and backplane pins are disabled. In addition, the LCD module system is disabled and all LCD waveform generation clocks are stopped. 1 LCD module driver system is enabled. All frontplanes pins enabled using the frontplane enable register will output an LCD module driver waveform.The backplane pins will output an LCD module driver waveform based on the settings of DUTY0 and DUTY1. 6 LPWAVE LCD Waveform — The LPWAVE bit allows selection of two types of LCD waveforms. 0 Normal waveforms selected. 1 Low-power waveforms selected. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 128 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-4. LCDCR0 Field Descriptions (continued) Field Description 5:3 LCLK[2:0] LCD Clock Prescaler — The LCD module clock prescaler bits are used as a clock divider to generate the LCD waveform base clock as shown in Equation 9-1. The waveform base clock is used, with the LCD module duty cycle configuration to determine the LCD module frame frequency.LCD module frame frequency calculations are provided in 9.4.1.3/p.139. Eqn. 9-1 LCD Waveform Base Clock LCDCLK = 16 x 2 LCLK[2:0] 1:0 DUTY[1:0] 9.3.2 where LCDCLK ≅ 32.768 kHz LCD Duty Select — DUTY[1:0] bits select the duty cycle of the LCD module driver. 00 Reserved. 01 Use BP[1:0] (1/2 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as FP40 10 Use BP[2:0] (1/3 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as FP40 11 Use BP[3:0] (1/4 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as BP3 (default) LCD Control Register 1 (LCDCR1) 7 R 6 5 4 3 2 0 0 0 0 0 LCDIEN 1 0 LCDWAI LCDSTP3 0 0 W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 9-4. LCD Control Register 1 (LCDCR1) Read: anytime Table 9-5. LCDCR1 Field Descriptions Field Description 7 LCDIEN LCD Module Frame Frequency Interrupt Enable — Enables an LCD interrupt.event that coincides with the LCD module frame frequency (LPWAVE=0) or sub-frame frequency (LPWAVE=1). 0 The start of the LCD module frame causes a LCD module interrupt request. 1 No Interrupt request is generated by this event. 1 LCDWAI LCD Module Driver and Charge Pump Stop While in Wait Mode 0 Allows the LCD driver and charge pump to continue running during wait mode. 1 Disables the LCD driver and charge pump whenever the MCU goes into wait mode. 0 LCDSTP3 LCD Module Driver and Charge Pump Stop While in Stop3 Mode 0 Allows the LCD module driver and charge pump to continue running during stop3. 1 Disables the LCD module driver and charge pump whenever the MCU goes into stop3. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 129 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.3.3 LCD Frontplane Enable Registers 0–5 (FPENR0–FPENR5) When LCDEN = 1, these bits enable the frontplane output waveform on the corresponding frontplane pin. 7 6 5 4 3 2 1 0 FP7EN FP6EN FP5EN FP4EN FP3EN FP2EN FP1EN FP0EN 0 0 0 0 0 0 0 0 FP15EN FP14EN FP13EN FP12EN FP11EN FP10EN FP9EN FP8EN 0 0 0 0 0 0 0 0 FP23EN FP22EN FP21EN FP20EN FP19EN FP18EN FP17EN FP16EN 0 0 0 0 0 0 0 0 FP31EN FP30EN FP29EN FP28EN FP27EN FP26EN FP25EN FP24EN 0 0 0 0 0 0 0 0 FP39EN FP38EN FP37EN FP36EN FP35EN FP34EN FP33EN FP32EN Reset 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R FPENR0 W Reset R FPENR1 W Reset R FPENR2 W Reset R FPENR3 W Reset R FPENR4 W FPENR5 W Reset FP40EN 0 Unimplemented or Reserved Read: anytime Write: anytime Table 9-6. FPENR0–FPENR5 Field Descriptions Field Description 40:0 Frontplane Output Enable — The FP[40:0]EN bit enables the frontplane driver outputs. If LCDEN = 0, these FP[40:0]EN bits have no effect on the state of the I/O pins.It is recommended to set FP[40:0]EN bits before LCDEN is set. 0 Frontplane driver output disabled on FPnn. 1 Frontplane driver output enabled on FPnn. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 130 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.3.4 LCDRAM Registers (LCDRAM) The LCDRAM registers control the on/off state for frontplane drivers or the blink enables/disables for each individual LCD segment depending on the state of the LCDDRMS bit in the LCDCMD register. After reset the LCDRAM contents will be indeterminate (I), as indicated by Figure 9-5. R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset 7 6 5 4 3 2 1 0 FP1BP3 FP1BP2 FP1BP1 FP1BP0 FP0BP3 FP0BP2 FP0BP1 FP0BP0 I I I I I I I I FP3BP3 FP3BP2 FP3BP1 FP3BP0 FP2BP3 FP2BP2 FP2BP1 FP2BP0 I I I I I I I I FP5BP3 FP5BP2 FP5BP1 FP5BP0 FP4BP3 FP4BP2 FP4BP1 FP4BP0 I I I I I I I I FP7BP3 FP7BP2 FP7BP1 FP7BP0 FP6BP3 FP6BP2 FP6BP1 FP6BP0 I I I I I I I I FP9BP3 FP9BP2 FP9BP1 FP9BP0 FP8BP3 FP8BP2 FP8BP1 FP8BP0 I I I I I I I I FP11BP3 FP11BP2 FP11BP1 FP11BP0 FP10BP3 FP10BP2 FP10BP1 FP10BP0 I I I I I I I I FP13BP3 FP13BP2 FP13BP1 FP13BP0 FP12BP3 FP12BP2 FP12BP1 FP12BP0 I I I I I I I I FP15BP3 FP15BP2 FP15BP1 FP15BP0 FP14BP3 FP14BP2 FP14BP1 FP14BP0 I I I I I I I I FP17BP3 FP17BP2 FP17BP1 FP17BP0 FP16BP3 FP16BP2 FP16BP1 FP16BP0 I I I I I I I I FP19BP3 FP19BP2 FP19BP1 FP19BP0 FP18BP3 FP18BP2 FP18BP1 FP18BP0 I I I I I I I I FP21BP3 FP21BP2 FP21BP1 FP21BP0 FP20BP3 FP20BP2 FP20BP1 FP20BP0 I I I I I I I I I = Value is indeterminate Figure 9-5. LCD Data Registers (LCDRAM) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 131 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) R FP23BP3 FP23BP2 FP23BP1 FP23BP0 FP22BP3 FP22BP2 FP22BP1 FP22BP0 I I I I I I I I FP25BP3 FP25BP2 FP25BP1 FP25BP0 FP24BP3 FP24BP2 FP24BP1 FP24BP0 I I I I I I I I FP27BP3 FP27BP2 FP27BP1 FP27BP0 FP26BP3 FP26BP2 FP26BP1 FP26BP0 I I I I I I I I FP29BP3 FP29BP2 FP29BP1 FP29BP0 FP28BP3 FP28BP2 FP28BP1 FP28BP0 I I I I I I I I FP31BP3 FP31BP2 FP31BP1 FP31BP0 FP30BP3 FP30BP2 FP30BP1 FP30BP0 I I I I I I I I FP33BP3 FP33BP2 FP33BP1 FP33BP0 FP32BP3 FP32BP2 FP32BP1 FP32BP0 I I I I I I I I FP35BP3 FP35BP2 FP35BP1 FP35BP0 FP34BP3 FP34BP2 FP34BP1 FP34BP0 I I I I I I I I FP37BP3 FP37BP2 FP37BP1 FP37BP0 FP36BP3 FP36BP2 FP36BP1 FP36BP0 I I I I I I I I FP39BP3 FP39BP2 FP39BP1 FP39BP0 FP38BP3 FP38BP2 FP38BP1 FP38BP0 Reset I I I I I I I I R 0 0 0 0 FP40BP3 FP40BP2 FP40BP1 FP40BP0 I I I I I I I I W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W Reset R W W Reset I = Value is indeterminate Figure 9-5. LCD Data Registers (LCDRAM) (continued) Read: anytime Write: anytime The LCDRAM registers provide access to two different register groups. Access to each register group is controlled by the state of the LCDDRMS bit in the LCDCMD register. Each LCDRAM register location provides the waveforms for up to two frontplane drivers. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 132 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.3.4.1 LCDRAM Registers as On/Off Selector (LCDDRMS = 0) If LCDDRMS bit in the LCDCMD register is deasserted, the LCDRAM register accesses a register bank that controls the on/off state for frontplane drivers. Table 9-7. LCDRAM Field Descriptions (when LCDDRMS = 0) Field Description FP[n]BP[x] Segment On — If LCDDRMS in the LCDCMD is deasserted (LCDDRMS=0), the FP[n]BP[x] bit in the LCDRAM registers controls on/off state for the LCD segment connected between FP[n] and BP[x].Asserting the FP[n]BP[x] bit displays (turns on) the LCD segment connected between FP[n] and BP[x]. 0 LCD segment off. 1 LCD segment on. 9.3.4.2 LCDRAM Registers as Blink Enable/Disable (LCDDRMS = 1) If LCDDRMS in the LCDCMD register is asserted, the LCDRAM register accesses a register bank that controls the blink enables/disables for each individual LCD segment. Table 9-8. LCDRAM Field Descriptions (when LCCDRMS = 1) Field Description FP[n]BP[x] LCD Segment Blink Enable — If LCDDRMS bit in the LCDCMD is asserted (LCDDRMS=1), the FP[n]BP[x] bit in the LCDRAM registers controls blink mode enable/disable state for the LCD segment connected between FP[n] and BP[x].Asserting the FP[n]BP[x] bit enable the blink mode for the LCD segment connected between FP[n] and BP[x] if the associated bit when LCDDRMS = 0 is also set. 0 Disables blink enable for LCD segment. 1 Enables blink enable for LCD segment. 9.3.5 LCD Clock Source Register (LCDCLKS) 7 6 5 4 3 2 1 0 SOURCE DIV16 CLKADJ5 CLKADJ4 CLKADJ3 CLKADJ2 CLKADJ1 CLKADJ0 0 0 0 0 0 1 0 1 R W Reset Figure 9-6. LCD Clock Source Register (LCDCLKS) Read: anytime Write: anytime.It is recommended that CLKADJ[5:0], DIV16, and SOURCE not be modified while the LCDEN bit is asserted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 133 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-9. LCDCLKS Field Descriptions Field Description 7 SOURCE LCD Clock Source Select — The LCD module has two possible clock sources. This bit is used to select which clock source is the basis for LCDCLK. 0 Selects the ICGERCLK (external clock reference) as the LCD clock source. 1 Selects the ICGOUT/2 (bus clock) as the LCD clock source. 6 DIV16 LCD Clock Prescaler Enable— Enable prescaler by 16. 0 LCD clock prescaler is disabled. 1 LCD clock prescaler is enabled. 5:0 LCD Clock Source Divider— The LCD module is designed to operate using a 32.768 kHz clock source for CLKADJ[5:0 reduced power consumption (LCDCLK = 32.768 kHz). This bit field is used as a clock divider to adjust the LCD ] clock source to be approximately 32.768 kHz. LCDCLK = LCD clock source / (16DIV16 × (CLKADJ[5:0] +1) ) 9.3.6 Eqn. 9-2 LCD Voltage Supply Register (LCDSUPPLY) 7 6 5 4 3 2 1 0 LCDCPEN LCDCPMS CPCADJ1 CPCADJ0 HDRVBUF BBYPASS VSUPPLY1 VSUPPLY0 0 0 1 1 0 1 0 1 R W Reset Unimplemented or Reserved Figure 9-7. LCD Voltage Supply Register (LCDSUPPLY) Read: anytime Write: anytime. It is recommended that VSUPPLY[1:0] must not be modified while the LCDEN bit is asserted. In addition, VSUPPLY[1:0] must be configured according to the external hardware power supply configuration. Table 9-10. LCDSUPPLY Field Descriptions Field Description 7 LCDCPEN LCD Module Charge Pump Enable— Enables LCD module charge pump for 1/3 bias. 0 LCD charge pump is disabled. (An external bias is required.) 1 LCD charge pump is enabled. (The internal 1/3-bias is forced.) 6 LCDCPMS LCD Module Charge Pump Mode Select— This configuration depends on whether the LCD panel operating voltage is specified as 3 V or 5 V. LCDCPMS configures the internal charge pump to be a voltage doubler (recommended for use with 3-V LCD glass) or a voltage tripler (recommended for use with 5-V LCD glass). 0 Selects voltage doubler. 1 Selects voltage tripler. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 134 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-10. LCDSUPPLY Field Descriptions (continued) Field Description 5:4 CPCADJ[1:0] LCD Module Charge Pump Clock Adjust- Adjust the clock source for the charge pump Charge Pump Clock Rate = LCDCLK / (6 × 2(CPADJ[1:0] +1) ) 00 01 10 11 Eqn. 9-3 Configures for 2728 Hz charge pump frequency (LCDCLK = 32.768khz) Configures for 1364 Hz charge pump frequency (LCDCLK = 32.768khz) Configures for 682 Hz charge pump frequency (LCDCLK = 32.768khz) Configures for 341 Hz charge pump frequency (LCDCLK = 32.768khz) 3 HDRVBUF High Drive Buffer Mode Select — This bit enhances the VLCD buffer drive active high buffer drive for larger capacitance LCD glass. (See Figure 9-17 for details.) 0 Normal buffer drive. (Ideal for 2000 pF LCD glass.) 1 High buffer drive. (Ideal for 4000 pF LCD glass.) 2 BBYPASS Op Amp Control— Determines whether the internal LCD op amp buffer is bypassed. (See Figure 9-17 for details) 0 Buffered mode 1 Unbuffered mode 1:0 VSUPPLY[1:0] 9.3.7 Voltage Supply Control— Configures whether the LCD module power supply is external or internal. It is recommended that this bit field not be modified while the LCD module is enabled (e.g., LCDEN = 1). See Figure 9-17 for more detail. LCD Blink Control Register (LCDBCTL) 7 R 6 5 4 0 0 0 BLINK 3 2 1 0 BLKMODE BRATE2 BRATE1 BRATE0 0 0 0 0 W Reset 0 0 0 0 Unimplemented or Reserved Figure 9-8. LCD Blink Control Register (LCDBCTL) Read: anytime Write: anytime. It is recommended that BRATE[1:0] and BLKMODE, must not be modified while BLINK is asserted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 135 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-11. LCDBCTL Field Descriptions Field Description 7 BLINK Blink Command — Starts or stops LCD module blinking.The blink command takes effect at the beginning of the next LCD frame cycle. 0 Disables blinking. 1 Starts blinking at blinking frequency specified by LCD blink rate calculation (see Equation 9-4). 3 BLKMODE Blink Mode Select — Configures whether to blink either individual LCD segments or the entire LCD panel depending on the state of the BLKMODE bit.BLINK must be enabled; if BLINK = 0, this bit has no effect. 0 Blink only individual LCD segments as specified by the LCDRAM register banks. 1 Blink all LCD segments regardless of contents of the LCDRAM register banks. 2:0 Blink Rate Configuration— Selects the frequency at which the LCD display blinks when the BLINK is asserted. BRATE[2:0] Equation 9-4 shows how BRATE[2:0] bit field is used in the LCD blink rate calculation. Equation 9-4 provides an expression for the LCD waveform base clock Eqn. 9-4 LCD module blink rate = LCD waveform base clock 2 (5+ BRATE[2:0]) LCD module blink rate calculations are provided in 9.4.3.2/p.150. 9.3.8 LCD Command and Status Register (LCDCMD) 7 R 6 5 4 0 0 0 LCDIF 0 2 1 0 0 0 0 0 0 0 BLANK LCDDRMS W Reset 3 LCDCLR 0 0 0 Unimplemented or Reserved Figure 9-9. LCD Command Register (LCDCMD) Read: anytime. The LCDCLR bit always reads zero. Write: anytime. Table 9-12. LCDCMD Field Descriptions Field Description 7 LCDIF LCD Interrupt Flag — LCDIF indicates that an interrupt condition has occurred. To clear the interrupt, read LCDCMD register and then write a 1 to LCDIF. 0 interrupt condition has not occurred. 1 interrupt condition has occurred. 3 LCDDRMS LCD Module Data Register Mode Select — The LCDRAM registers provide access to two different register groups. Access to each register group is controlled by the state of the LCDDRMS bit. 0 Selects the LCDRAM registers to access registers that control the on/off state for LCD segments. 1 Selects the LCDRAM registers to access registers that control the blink enable/disable state for LCD segments. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 136 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-12. LCDCMD Field Descriptions Field Description 1 LCDCLR LCD Data Register Clear Command — Deasserts all accessible bits in the LCDRAM registers. To clear all LCD segment blink enables in the LCDRAM registers, the LCDCLR bit must be asserted only while LCDDRMS = 1.To clear the entire LCD display, the LCDCLR bit must be asserted only while LCDDRMS = 0. 0 Contents of LCD data register are not deasserted by hardware. 1 Deasserts all accessible bits in the LCDRAM registers. The LCDDLR bit clears after all accessible bits in the LCDRAM registers are set to 0. 0 BLANK LCD Display Blank Command — Asserting this bit clears all segments in the LCD display regardless of the contents of the LCDRAM registers or the state of the LCDDRMS bit. BLANK does not disable the LCD timing generator. 0 LCD segments are displayed or cleared depending on the contents of the LCDRAM registers when the LCDDRMS bit is clear. 1 LCD segments are cleared regardless of the contents of the LCDRAM registers or the state of the LCDDRMS bit. The content of the LCDRAM registers is unchanged by the BLANK bit. 9.4 Functional Description This section provides a complete functional description of the LCD block, detailing the operation of the design from the end-user perspective. Before enabling the LCD module by asserting the LCDEN bit in the LCDCR0 register, it is recommended that the LCD module be configured based on the end application requirements. Out of reset, the LCD module is configured with default settings, but these settings are not optimal for every application. The LCD module provides several versatile configuration settings and options to support varied implementation requirements including: • Frame frequency • Duty cycle • Frame frequency interrupt enable • Blinking frequency and options The LCD module also provides a frontplane enable control. Setting the frontplane enable bit, FP[n]EN, for a particular pin enables the LCD module functionality of that pin when the LCDEN bit is set. When both the LCDEN and required FP[n]EN bits are set, the LCDRAM can then be used to activate (display) the corresponding LCD segments on an LCD panel. The LCDRAM registers control the on/off state for the FP and BP segments of the LCD when the LCDDRMS bit in the LCDCMD is cleared.If LCDDRMS = 0 when a 1 is written to the FP[n]BP[x] bit, the corresponding connected segment turns on.When a 0 is written, the segment is turned off. For a detailed description of LCD module operation for a basic seven-segment LCD display, see Section 9.6.1, “LCD Seven Segment Example Description”. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 137 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1 LCD Driver Description The LCD module driver has three modes of operation: • 1/2 duty (2 backplanes), 1/3 bias (4 voltage levels) • 1/3 duty (3 backplanes), 1/3 bias (4 voltage levels) • 1/4 duty (4 backplanes), 1/3 bias (4 voltage levels) Note all modes are 1/3 bias. These modes of operation are described in more detail in the following sections. 9.4.1.1 LCD Duty Cycle The duty cycle indicates the number of LCD panel segments capable of being driven by each individual frontplane output driver. Depending on the duty cycle, the LCD waveform drive can be categorized as either static or multiplex. In static driving method, the LCD is driven with two square waveforms. The static driving method is the most basic method to drive an LCD panel, but, because each frontplace driver can drive only one LCD segment, static driving limits the number of LCD segments that can be driven. In static mode, only one backplane is required. In multiplex mode, the LCD waveforms are multi-level and depend on the bias mode. Multiplex mode, depending on the number of backplanes, can drive multiple LCD segments with a single frontplane driver. Multiplex mode is effective in reducing the number of driver circuits and the number of connections to LCD segments. For multiplex mode operation, at least two backplane drivers are needed. The LCD module is optimized for multiplex mode. The duty cycle indicates the amount of time the LCD panel segment is energized during each LCD module frame cycle. The denominator of the duty cycle indicates the number of backplanes that are being used to drive an LCD panel. Therefore, the available duty cycle options for the LCD module are 1/2, 1/3, and 1/4. The duty cycle is configured using the DUTY[1:0] bit field in the LCDCR0 register as shown in Table 9-13. Table 9-13. LCD Module Duty Cycle Modes LCDCR0 Register Backplanes Duty DUTY1 DUTY0 BP3 BP2 BP1 BP0 1/2 0 1 OFF OFF BP1 BP0 1/3 1 0 OFF BP2 BP1 BP0 1/4 1 1 BP3 BP2 BP1 BP0 Reserved 0 0 N/A N/A N/A N/A MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 138 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.2 LCD Bias Because a single frontplane driver is configured to drive more and more individual LCD segments, more voltage levels are required to generate the appropriate waveforms to drive the segment. The LCD module is designed to operate using the 1/3 bias mode. Defined by Equation 9-5, the bias indicates the number of voltage levels used to power the LCD display. 1 / (voltage level – 1) 9.4.1.3 Eqn. 9-5 LCD Module Waveform Base Clock and Frame Frequency The LCD module is designed to operate using a 32.768-kHz clock input. Two possible clock sources are available to the LCD module has which are selectable by configuration of the SOURCE bit in the LCDCLKS register. The two clock sources include: • External crystal (SOURCE = 0) • Internal ICG (SOURCE = 1) Figure 9-10 shows the LCD clock tree. The clock tree shows the two possible clock sources and shows the LCD frame frequency and blink frequency clock source. The LCD blink frequency is discussed in Section 9.4.3.2, “Blink Frequency.” DIV16 SOURCE CLKADJ[5:0] BRATE[2:0] LCLK[2:0] LCDCLK Internal Clock ÷16 ÷(1+CLKADJ[5:0]) ÷8 ÷(2LCLK[2:0]) ÷(25+BRATE[2:0]) External Clock = 32.768 kHz ÷2(1+CPCADJ[1:0]) ÷2 ÷6 LCD Charge Pump Clock Source CPCADJ[1:0] ÷2 Blink Rate Source LCD Base Frequency Source Figure 9-10. LCD Clock Tree Because the clock sources may not be approximately 32.768 kHz, the DIV16 bit and CLKADJ[5:0] bit field are provided as a clock divider mechanism that can be used to make LCD module clock source adjustments in order to achieve the required 32.768-kHz LCD module clock input, LCDCLK. Table 9-14 provides calculations of LCDCLK using different values of DIV16 and CLKADJ[5:0] for a range of clock inputs frequencies. Using an external 32.768-kHz clock input is required for reduced power consumption applications. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 139 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-14. LCDCLK Calculations (only bold/unshaded values are valid) Selected Clock Frequencies in kHz (NOTE: DIV16 = 0) CLKADJ[5:0] +1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 Selected Clock Frequencies in kHz (NOTE: DIV16 = 1) 32.8 100 200 300 400 500 2000 4000 9980 16000 18886 20000 32.8 16.4 10.9 8.2 6.6 5.5 4.7 4.1 3.6 3.3 3.0 2.7 2.5 2.3 2.2 2.0 1.9 1.8 1.7 1.6 1.6 1.5 1.4 1.4 1.3 1.3 1.2 1.2 1.1 1.1 1.1 1.0 1.0 1.0 0.9 0.9 0.9 0.9 0.8 0.8 0.8 0.8 100.0 50.0 33.3 25.0 20.0 16.7 14.3 12.5 11.1 10.0 9.1 8.3 7.7 7.1 6.7 6.3 5.9 5.6 5.3 5.0 4.8 4.5 4.3 4.2 4.0 3.8 3.7 3.6 3.4 3.3 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.6 2.6 2.5 2.4 2.4 200.0 100.0 66.7 50.0 40.0 33.3 28.6 25.0 22.2 20.0 18.2 16.7 15.4 14.3 13.3 12.5 11.8 11.1 10.5 10.0 9.5 9.1 8.7 8.3 8.0 7.7 7.4 7.1 6.9 6.7 6.5 6.3 6.1 5.9 5.7 5.6 5.4 5.3 5.1 5.0 4.9 4.8 300.0 150.0 100.0 75.0 60.0 50.0 42.9 37.5 33.3 30.0 27.3 25.0 23.1 21.4 20.0 18.8 17.6 16.7 15.8 15.0 14.3 13.6 13.0 12.5 12.0 11.5 11.1 10.7 10.3 10.0 9.7 9.4 9.1 8.8 8.6 8.3 8.1 7.9 7.7 7.5 7.3 7.1 400.0 200.0 133.3 100.0 80.0 66.7 57.1 50.0 44.4 40.0 36.4 33.3 30.8 28.6 26.7 25.0 23.5 22.2 21.1 20.0 19.0 18.2 17.4 16.7 16.0 15.4 14.8 14.3 13.8 13.3 12.9 12.5 12.1 11.8 11.4 11.1 10.8 10.5 10.3 10.0 9.8 9.5 500.0 250.0 166.7 125.0 100.0 83.3 71.4 62.5 55.6 50.0 45.5 41.7 38.5 35.7 33.3 31.3 29.4 27.8 26.3 25.0 23.8 22.7 21.7 20.8 20.0 19.2 18.5 17.9 17.2 16.7 16.1 15.6 15.2 14.7 14.3 13.9 13.5 13.2 12.8 12.5 12.2 11.9 62.5 62.5 41.7 31.3 25.0 20.8 17.9 15.6 13.9 12.5 11.4 10.4 9.6 8.9 8.3 7.8 7.4 6.9 6.6 6.3 6.0 5.7 5.4 5.2 5.0 4.8 4.6 4.5 4.3 4.2 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 3.0 250.0 125.0 83.3 62.5 50.0 41.7 35.7 31.3 27.8 25.0 22.7 20.8 19.2 17.9 16.7 15.6 14.7 13.9 13.2 12.5 11.9 11.4 10.9 10.4 10.0 9.6 9.3 8.9 8.6 8.3 8.1 7.8 7.6 7.4 7.1 6.9 6.8 6.6 6.4 6.3 6.1 6.0 624 312 207.9 155.9 124.8 104.0 89.1 78.0 69.3 62.4 56.7 52.0 48.0 44.6 41.6 39.0 36.7 34.7 32.8 31.2 29.7 28.4 27.1 26.0 25.0 24.0 23.1 22.3 21.5 20.8 20.1 19.5 18.9 18.3 17.8 17.3 16.9 16.4 16.0 15.6 15.2 14.9 1000 500 333.3 250.0 200.0 166.7 142.9 125.0 111.1 100.0 90.9 83.3 76.9 71.4 66.7 62.5 58.8 55.6 52.6 50.0 47.6 45.5 43.5 41.7 40.0 38.5 37.0 35.7 34.5 33.3 32.3 31.3 30.3 29.4 28.6 27.8 27.0 26.3 25.6 25.0 24.4 23.8 1180 590 393.5 295.1 236.1 196.7 168.6 147.5 131.2 118.0 107.3 98.4 90.8 84.3 78.7 73.8 69.4 65.6 62.1 59.0 56.2 53.7 51.3 49.2 47.2 45.4 43.7 42.2 40.7 39.3 38.1 36.9 35.8 34.7 33.7 32.8 31.9 31.1 30.3 29.5 28.8 28.1 1250 625 416.7 312.5 250.0 208.3 178.6 156.3 138.9 125.0 113.6 104.2 96.2 89.3 83.3 78.1 73.5 69.4 65.8 62.5 59.5 56.8 54.3 52.1 50.0 48.1 46.3 44.6 43.1 41.7 40.3 39.1 37.9 36.8 35.7 34.7 33.8 32.9 32.1 31.3 30.5 29.8 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 140 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) The value of LCDCLK is important because it is used to generate the LCD module waveform base clock frequency. Equation 9-1 provides an expression for the LCD module waveform base clock frequency calculation. Equation 9-1 illustrates that the LCD module waveform base clock frequency also depends on the LCLK[2:0] bit field. The LCD module waveform base clock is the basis for the calculation of the LCD module frame frequency. The LCD module frame frequency is a function of LCD module duty cycle as shown in Equation 9-6. Table 9-15 shows LCD module frame frequency calculations considering several possible LCD module configurations of LCLK[2:0] and DUTY[1:0]. The using LCD module frame frequency calculations a based on LCD module clock input value approximately 32 kHz. LCD module frame frequency = (LCD module waveform base clock) × (duty cycle) Eqn. 9-6 The LCD module frame frequency is defined as the number of times the LCD segments are energized per second. The LCD module frame frequency must be selected to prevent the LCD display from flickering (LCD module frame frequency is too low) or ghosting (LCD module frame frequency is too high). To avoid these issues a LCD module frame frequency in the range of 30 to 100 Hz is required. LCD module frame frequency less that 30 Hz or greater that 100 Hz are out of specification and invalid. Selecting lower values for the LCD base and frame frequency results in lower current consumption for the LCD module. Table 9-15. LCD Module Frame Frequency Calculations1, 2 LCLK[2:0] LCD Clock Input Divider (16 × 2LCLK[2:0]) LCD Base Frequency (Hz) 0 16 2049.3 1024 683 512.32 1 32 1024.7 512.32 341.55 256.16 2 64 512.3 256.16 170.77 128.08 LCD Frame Frequency (Hz) 3 128 256.2 128.08 85.38 64.04 4 256 128.1 64.04 42.69 32.02 5 512 64.0 32.02 21.34 16.01 6 1024 32.0 16.01 10.67 8.00 7 2048 16.0 8.00 5.33 4.00 Duty Cycle 1/2/ 1 LCD clock input ~ 32.768 kHz 2 Shaded table entries are out of specification and are invalid. 9.4.1.4 1/3 1/4 LCD Waveform Examples This section shows the timing examples of the LCD output waveforms for the available modes of operation. As shown in Table 9-16, all examples use 1/3 bias mode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 141 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-16. Configurations for Example LCD Waveforms Bias Mode DUTY[1:0] Duty Cycle LPWAVE bit Example 1 01 1/2 0 Example 2 01 1/2 1 10 1/3 0 Example 4 10 1/3 1 Example 5 11 1/4 0 Example 6 11 1/4 1 Example 3 1/3 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 142 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.1 Example 1: 1/2 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform) Duty=1/2: DUTY[1:0] = 01 (BP2 and BP3 are not used) Normal Waveform selected: LPWAVE = 0 LCDRAM = XX10 1 Frame Base_Clk BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (xx10) VLCD VLCD × 2/3 VLCD × 1/3 VSSX +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP0-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (ON) Figure 9-11. 1/2 Duty and 1/3 Bias (Normal Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 143 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.2 Example 2: 1/2 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform) Duty=1/2: DUTY[1:0] = 01 (BP2 and BP3 are not used) Low-Power Waveform selected: LPWAVE = 1 LCDRAM = XX10 1 Frame Base_Clk Sub_Frame BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (xx10) VLCD VLCD × 2/3 VLCD × 1/3 VSSX +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP0-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (ON) Figure 9-12. 1/2 Duty and 1/3 Bias (Low-power Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 144 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.3 Example 3: 1/3 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform) Duty=1/3: DUTY[1:0] = 10 (BP3 are not used) Normal Waveform selected: LPWAVE = 0 LCDRAM = X010 1 Frame Base_Clk BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP2 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (x010) VLCD VLCD × 2/3 VLCD × 1/3 VSSX +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP0-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (ON) Figure 9-13. 1/3 Duty and 1/3 Bias (Normal Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 145 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.4 Example 4: 1/3 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform) Duty=1/3: DUTY[1:0] = 10 (BP3 are not used) Low-power Waveform selected: LPWAVE = 1 LCDRAM = X010 1 Frame Base_Clk Sub_Frame BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP2 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (x010) VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP0-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (ON) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD Figure 9-14. 1/3 Duty and 1/3 Bias (Low-power Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 146 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.5 Example 5: 1/4 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform) Duty=1/4: DUTY[1:0] = 11 (All available backplanes used) Normal Waveform selected: LPWAVE = 0 LCDRAM = 1001 1 Frame Base_Clk BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP2 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP3 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (1001) VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP0-FPx (ON) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD Figure 9-15. 1/4 Duty and 1/3 Bias (Normal Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 147 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.1.4.6 Example 6: 1/4 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform) Duty=1/4: DUTY[1:0] = 11 (All available backplanes used) Low-power Waveform selected: LPWAVE = 1 LCDRAM = 1001 1 Frame Base_Clk Sub_Frame BP0 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP1 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP2 VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP3 VLCD VLCD × 2/3 VLCD × 1/3 VSSX FPx (1001) VLCD VLCD × 2/3 VLCD × 1/3 VSSX BP0-FPx (ON) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD BP1-FPx (OFF) +VLCD +VLCD × 2/3 +VLCD × 1/3 0 -VLCD × 1/3 -VLCD × 2/3 -VLCD Figure 9-16. 1/4 Duty and 1/3 Bias (Low-power Waveform) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 148 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.2 LCDRAM Registers For a segment on the LCD panel to be displayed, data must be written to the LCDRAM registers. Each bit in the LCDRAM registers correspond to a segment on the LCD panel. The LCDRAM registers provide access to two different register groups depending on the state of the LCDDRMS bit in the LCDCMD register. If LCDDRMS = 0, the LCDRAM register accesses a register bank that controls the on/off state for frontplane drivers. If LCDDRMS = 1, the LCDRAM register bank accesses a register bank that enables the blink mode for each individual LCD segment. If LCDDRMS = 0, when the LCDEN bit is set and the corresponding FP[31:0]EN bit is set, writing a 1 to a given LCDRAM location will result in the corresponding display segment being driven with a differential root mean square (RMS) voltage necessary to turn the segment on.Writing a 0 to a given location will result in the corresponding display segment being driven with a differential RMS voltage necessary to turn the segment off. The LCDRAM is a dual port RAM that interfaces with the internal address and data buses of the MCU. When LCDEN = 0, the LCDRAM registers can be used as on-chip RAM. Writing or reading of the LCDEN bit does not change the contents of the LCDRAM registers.After a reset, the LCDRAM contents will be indeterminate. 9.4.2.1 LCDRAM Data Clear Command The LCD module data register clear command deasserts all accessible bits in the LCDRAM registers. LCDDRMS bit in the LCDCMD register determines which LCDRAM registers bits are accessible.To clear all LCD segment blink enables in the LCDRAM registers, the LCDCLR bit must be asserted only when the LCDDRMS bit is asserted. To clear the entire LCD display, the LCDCLR bit must be asserted only when the LCDDRMS bit is deasserted. 9.4.2.2 LCDRAM Data Blank Command The LCD module display blank command clears all segments in the LCD display regardless of the contents of the LCDRAM registers or the state of the LCDDRMS bit. This bit does not disable the LCD module timing generator. Writing or reading of the BLANK bit does not change the contents of the LCDRAM registers. 9.4.3 LCD Blinking The LCD module LCD panel blink capabilities are very flexible. The LCD module can be configured to blink either individual LCD segments or the entire LCD panel. The blink rate frequency is configured using the BRATE[2:0] bit field. The LCD will blink at the configured frequency while the BLINK bit in the LCDBCTL register is set to 1. When the BLINK bit is modified to start or stop the LCD display blinking, the BLINK command change takes place at the beginning of the next LCD frame cycle. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 149 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.3.1 LCD Segment Blinking To configure all LCD segments to blink regardless of the contents of the LCDRAM bits while LCDDRMS = 1, the BLKMODE bit in the LCDBCTL control register must to set to 1. To configure individual LCD segments to blink, the BLKMODE bit in the LCDBCTL control register must be deasserted. If BLKMODE = 0, asserting the LCDRAM FP[n]BP[x] bits while LCDDRMS = 0 and LCDDRMS = 1 enables the LCD segment connected between FP[n] and BP[x] to blink when BLINK = 1. Each LCDRAM register controls two frontplane drivers. 9.4.3.2 Blink Frequency The LCD module waveform base clock is the basis for the calculation of the LCD module blink frequency. The LCD module blink frequency is equal to the LCD module waveform base clock divided by the BRATE[2:0] divider. Table 9-17 shows LCD module blink frequency calculations for all values of BRATE[2:0] and LCLK[2:0]. Table 9-17. Blink Frequency Calculations (Blink Rate = LCD Base (Hz) ÷ Blink Divider) LCLK[2:0] LCD Base Frequency (Hz) 0 2049.3 64.0 32.0 16.0 8.00 4.00 2.00 1.00 0.50 1 1024.7 32.0 16.0 8.00 4.00 2.00 1.00 0.50 0.25 Blink Frequency 2 512.3 16.0 8.00 4.00 2.00 1.00 0.50 0.25 0.13 3 256.2 8.00 4.00 2.00 1.00 0.50 0.25 0.13 0.06 4 128.1 4.00 2.00 1.00 0.50 0.25 0.13 0.06 0.03 5 64.0 2.00 1.00 0.50 0.25 0.13 0.06 0.03 0.02 6 32.0 1.00 0.50 0.25 0.13 0.06 0.03 0.02 0.01 7 16.0 0.50 0.25 0.13 0.06 0.03 0.02 0.01 0.00 2048 4096 Blink Divider = 2 (5+ BRATE[2:0]) 32 64 128 256 512 1024 1 Shaded table entries are out of specification and are not valid 9.4.4 LCD Charge Pump, Voltage Divider, and Power Supply Operation This section describes the LCD charge pump, voltage divider, and LCD power supply configuration options. Figure 9-17 provides a block diagram for the LCD charge pump and a VLCD voltage divider. The VSUPPLY[1:0] bit field in the LCDSUPPLY register is used to configure the LCD module power supply source. VSUPPLY[1:0] indicates the state of internal signals used to configure power switches as shown in the Table in Figure 9-17. The block diagram in Figure 9-17 illustrates several potential operational modes for the LCD module including configuration of the LCD module power supply source using internal VDD or an external supply. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 150 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) VDD powersw1 VLCD powersw2 LCDCPMS (BBYPASS & powersw3) R1 + ~(LCDCPMS) R1 VLL1 – (~(BBYPASS) & powersw3) R1 (~(LCDCPMS) & powersw3) VOLTAGE DIVIDER BLOCK VSUPPLY[1:0] powersw1 powersw2 powersw3 00 1 0 0 01 0 1 0 10 0 0 1 11 0 0 0 VLL1 CHARGE PUMP VLL2 VLL3 Figure 9-17. LCD Charge Pump and VLCD Voltage Divider Block Diagram Figure 9-17 also illustrates a buffer, a voltage follower with an ideal op amp. The buffer, if enabled, gives VIn = VOut, and, because the input impedance of the op amp is very high, VIn is isolated from VOut This isolation can protect VIn from things like current draw from VOut; however, if the buffer is disabled ((~BBYPASS & powersw3) = 0), the output and input will be configured in a tri-state condition; that is, floating. NOTE: The charge pump is optimized for 1/3 bias mode operation only. During the first 16 timebase clock cycles after the LCDCPEN bit is set, all the LCD frontplane and backplane outputs are disabled regardless of state of the LCDEN bit. The charge pump requires external capacitance for is operation. To provide this external capacitance, the Vcap1 and Vcap2 external pins are provided. It is recommended that a low equivalent series resistance (ESR) capacitor be used. Proper orientation is imperative when using a polarized capacitor. The recommended value for the external capacitor is 0.1 μF. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 151 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.4.1 LCD Charge Pump and Voltage Divider The LCD charge pump is a voltage tripler. Using the voltage divider and the charge pump, the LCD module can effectively double or triple VLCD. This LCD module configurability makes the LCD module compatible with both 3-V or 5-V LCD glass. The LCD module charge pump mode select bit (LCDCPMS) in the LCDSUPPLY register configures the LCD module operational mode as a voltage doubler or a voltage tripler. In Figure 9-17, LCDCPMS bit signal is used to control switches within the voltage divider block to enable or disable the two-thirds (2/3 * VLCD) voltage divider. If LCDCPMS = 0, the LCD module is configured as a voltage doubler (recommended to VLCD be used with 3-V LCD glass) by enabling the voltage divider. If LCDCPMS = 1, the LCD module is configured as a voltage tripler (recommended to be used with 5-V LCD glass) by shorting the voltage divider. The LCDCPMS configuration depends on the LCD panel operating voltage specification in the design application. 9.4.4.1.1 LCD Charge Pump Enabled The LCDCPEN bit in the LCDSUPPLY register enables the charge pump. When charge pump is enabled (LCDCPEN = 1), VLL1, VLL2, and VLL3 are will be generated internally. 9.4.4.1.2 LCD Charge Pump Disabled When charge pump is disabled (LCDCPEN = 0), VLL1, VLL2, and VLL3 are not generated internally. Instead, VLL1, VLL2, and VLL3 must be provided by external hardware. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 152 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.4.4.2 LCD Power Supply and Voltage Buffer Configuration The LCD power supply can be internally derived from VDD or it can be externally derived from a voltage source in the range between 0.9 to 1.8 Volts that is applied to the VLCD pin. The Table below provides a more detailed description of the power state of the LCD module which depends on the configuration of the VSUPPLY[1:0], LCDCPMS, BBYPASS, and LCDCPEN bits. 00 01 X X 10 11 LCDCPEN BBYPASS LCDCPMS VSUPPLY[1:0] Table 9-18. VDD Switch Option LCD Power Supply Configuration LCD Operational State 0 Initial VLL2 voltage to VDD level. LCD disabled 1 Internal power supply. VLL2 is generated from VDD. LCD operational 0 Initial VLL3 voltage to VDD level. LCD disabled 1 Internal power supply. VLL3 is generated from VDD. LCD operational Minimum current consumption X X x x 0 Bias voltages not generated. LCD disabled 0 0 1 External power supply for VLCD. Buffered doubler mode. LCD operational Maximum current consumption 0 1 1 External power supply for VLCD. Un-buffered doubler mode. LCD operational 1 0 1 External power supply for VLCD. Buffered tripler mode. LCD operational 1 1 1 External power supply for VLCD. Un-buffered tripler mode. LCD operational Minimum current consumption 0 External power supply for VLL1,VLL2, and VLL3 required. VLCD pin floating. LCD Operational 1 VLCD pin floating. Invalid LCD power configuration X X Figure 9-18 shows that if VSUPPLY[1:0] = 10 or 11, the LCD module is configured for an external power source. If VSUPPLY[1:0] = 00 or 01, the LCD power supply is configured to be internally derived from VDD. 9.4.4.2.1 LCD External Power Supply, VSPUPPLY[1:0] = 10 When VSPUPPLY[1:0] = 10, only the powersw3 signal is asserted and the LCD module is configured to be powered via an external voltage input on VLCD (Recall VLCD is specified to be in the range from 0.9 V to 1.8 V). The figure above shows that VLCD is an input to the voltage divider block and is related to VLL1. The voltage divider block uses the states of LCDCPMS, BBYPASS, and powersw3 to derive a state for VLL1. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 153 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) The output of the voltage divider block is VLL1. VLL1 is connected to the internal charge pump via the Vref. Using the charge pump, the value of VLL1 is tripled and outputted as VLL3. VLL3, a LCD bias voltage, is equal to the voltage required to energize the LCD panel, VLCDON. For 3-V LCD glass, VLL3 should be approximately 3-V; while for 5-V LCD glass, VLL3 should be approximately 5-V. Depending on the LCDCPMS bit configuration, VLL3 will be equal to 3*VLCD or 3*(2/3*VLCD) (see Section 9.4.4, “LCD Charge Pump, Voltage Divider, and Power Supply Operation). Table 9-19 shows the selected VLL1 and VLL3 values based on the input value of VLCD. Table 9-19. VLL1 Typical Values VLCD LCDCPMS = 0 Voltage Doubler LCDCPMS = 1 Voltage Tripler VLL1 = Vref VLL3 = 3 × Vref VLL1 = Vref VLL3 = 3 × Vref 1.4 V (2/3) × 1.4 V 2.8 V 1.4 V 4.2 V 1.5 V (2/3) × 1.5 V 3.0 V 1.5 V 4.5 V 1.7 V (2/3) × 1.7 V 3.3 V 1.67 V 5.0 V 1.8 V (2/3) × 1.8 V 3.6 V 1.8 V 5.4 V In addition to VLL1 and VLL3, VLL2 is also generated internally when the charge pump is enabled (LCDCPEN = 1). For a typical LCD panel, the bias voltages in 1/3 bias mode would be: • V3 = VLL3 = VLCDON = 3 × Vref • V2 = VLL2 = 2 × Vref • V1 = VLL1 = Vref • V0 = VSS NOTE VLCDON is the LCD panel driving voltage required to turn on an LCD segment. Since VLL3 and VLCDON are equivalent, VLL3 should be configured so that it is 3 V or 5 V, depending on the LCD panel specification. 9.4.4.2.2 LCD External Power Supply, VSPUPPLY[1:0] = 11 When VSPUPPLY[1:0] = 11, powersw1, powersw2, and powersw3 are deasserted. Moreover with powersw3 deasserted, the buffer is disabled ((~BBYPASS & pwersw3) = 0), so VLCD will be configured in a tri-state condition. VDD is not available to power the LCD module internally, so the LCD module requires an external power source for VLL1, VLL2, and VLL3 when the charge pump is disabled. If the charge pump is enabled, external power must be applied to either VLL1, VLL2, or VLL3. 9.4.4.2.3 LCD Internal Power Supply, VSUPPLY[1:0] = 00 or 01 VDD is specified to be from 1.8 V to 3.6 V. VDD is used as the LCD module power supply when VSUPPLY[1:0] = 00 or 01(see Table 9-18). When powering the LCD module using VDD, the charge pump must be enabled (LCDCPEN = 1). Table 9-20 provides recommendations regarding configuration of the VSUPPLY[1:0] bit field when using both 3-V and 5-V LCD panels. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 154 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-20. VDD Switch Option VSUPPLY[1:0] 9.4.5 VDD Switch Option Recommend Use for 3-V Recommend Use for 5-V LCD Panels LCD Panels 00 VLL2 is generated from VDD • VLL1 = 1v • VDD = VLL2 = 2v • VLL3 = 3v • VLL1 = 1.67v • VDD = VLL2 = 3.3v • VLL3 = 5v 01 VLL3 is generated from VDD • VLL1 = 1v • VLL2 = 2v • VDD = VLL3 = 3v Invalid LCD power configuration Resets During a reset, the LCD module system is configured in the default mode. The default mode includes the following settings: • LCDEN is cleared, thereby forcing all frontplane and backplane driver outputs to the high impedance state. • 1/4 duty • 1/3 bias • All frontplane enable bits, FP[n]EN, are cleared • LCLK[2:0], VSUPPLY[2:0], BBYPASS, and BRATE[2:0] revert to their reset values 9.4.6 Interrupts When an LCD module frame (LPWAVE = 0) or sub-frame (LPWAVE = 1) frequency interrupt event occurs, the LCDIF bit in the LCDCMD register is asserted. The LCDIF bit remains asserted until the LCD module frame frequency interrupt is cleared by software. The interrupt can be cleared by software by writing a 1 to the LCDIF bit. If a both the LCDIF bit in the LCDCMD register and the LCDIEN bit in the LCDCR1 register are set, an LCD interrupt signal asserts. For both normal waveform and low-power waveform, configured for the same frequency with the same clock configuration. The low-power waveform splits a frame into two subframes with equal duration. See Figure 9-11 through Figure 9-16. When an LCD module frame(LPWAVE=0) or sub-frame(LPWAVE=1) frequency interrupt event occurs, the LCDIF bit in the LCDCMD register is asserted. The LCDIF bit remains asserted until the LCD module frame frequency interrupt is cleared by software. The interrupt can be cleared by software by writing a 1 to the LCDIF bit. 9.5 Initialization Section This section provides a recommended initialization sequence for the LCD module and also includes initialization examples for several possible LCD application scenarios. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 155 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.1 Initialization Sequence The list below provides a recommended initialization sequence for the LCD module. 1. LCDCLKS register a) Configure LCD clock source (SOURCE bit) b) Adjust the clock source to achieve a value for LCDCLK of ~ 32 kHz (CLKADJ[5:0] & DIV16) 2. LCDSUPPLY register a) Enable charge pump (LCDCPEN bit) b) Configure the LCD module for doubler or tripler mode (LCDCPMS bit) c) Configure charge pump clock (CPCADJ[1:0]) d) Configure HDRVBUF e) Configure op amp switch (BBYPASS bit) f) Configure LCD power supply (VSUPPLY[1:0]) 3. LCDCR1 register a) Configure the LCD frame frequency interrupt (LCDIEN bit) b) Configure LCD behavior in low power mode (LCDWAI and LCDSTP3 bits) 4. LCDCR0 register a) Configure LCD duty cycle (DUTY[1:0]) b) Configure LPWAVE c) Select and configure the LCD frame frequency (LCLK[2:0]) 5. LCDBCTL register a) Configure the blink mode to blink individual or blink all segments (BLKMODE bit) b) Configure the blink frequency (BRATE[2:0]) 6. FPENR[5:0] register a) Enable the LCD module frontplane waveform output (FP[40:0]EN bits) 7. LCDCR0 register a) Enable the LCD module (LCDEN bit) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 156 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.2 Initialization Examples This section provides initialization information for configuration of the LCD. Each example details the register and bit field values required in order to achieve the appropriate LCD configuration for a given LCD application scenario. Table 9-21 lists each example and the setup requirements. Table 9-21. LCD Application Scenarios Example LCD Glass Operating LCD Clock Operating Voltage, Source Voltage VDD Required LCD segments LCD Frame Rate Blinking Mode/Rate None Behavior in WAIT/STO3 modes LCD Power Input WAIT: on STOP3: on Power via VLCD 1 1.8-V External 32.768 kHz 3-V 128 30 Hz 2 3.6-V Internal 100 kHz 3-V 99 80 Hz Individual segment 0.5 Hz WAIT: on STOP3: off Power via VDD 3 3.6-V Internal 18886 kHz 5-V 160 60 Hz Individual segment 2.0 Hz WAIT: off STOP3: on Power via VDD 4 1.8-V External 32.768 kHz 5-V 123 30 Hz WAIT: off STOP3: off Power via VLCD all segment 2.0 Hz These examples illustrate the flexibility of the LCD module to be configured to meet a wide range of application requirements including: • • • • • • clock inputs/sources LCD power supply LCD glass operating voltage LCD segment count varied blink modes/frequencies LCD frame rate MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 157 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.2.1 Initialization Example 1 Example 1 LCD setup requirements are reiterated in the following table: Example 1 LCD Glass Operating LCD Clock Operating Voltage, Source Voltage VDD 1.8-V External 32.768 kHz 3-V Required LCD segments LCD Frame Rate Blinking Mode/Rate 128 30 Hz No Blinking Behavior in LCD Power STOP3 and Input WAIT modes WAIT: on STOP3: on Power via VLCD Table 9-22 lists the required setup values required to initialize the LCD as specified by Example 1: Table 9-22. Initialization Register Values for Example 1 Register bit or bit field Binary Value LCDCLKS SOURCE 0 Selects the external clock reference as the LCD clock input External clock reference = 0; Bus clock = 1 DIV16 0 Adjusts the LCD clock input (see table 9-12) CLKADJ[5:0] 000000 Adjusts the LCD clock input (see table 9-12) LCDCPEN 1 Enable the charge pump LCDCPMS 0 For 3-V LCD glass, select doubler mode; Doubler mode = 0; Tripler mode = 1 HDRVBUF X High drive buffer CPCADJ[1:0] XX BBYPASS X Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1 VSUPPLY[1:0] 10 When VSUPPLY[1:0] = 10, the LCD must be externally powered via VLCD (see table 9-16). For 3-V glass, the nominal value of VLCD should be 1.5-V. LCDIEN X LCD Interrupt Enable LCDWAI 0 LCD is “on” in WAIT mode LCDSTP3 0 LCD is “on” in STOP3 mode LCLK[2:0] 100 LPWAVE X Low power waveform DUTY[1:0] 11 For 128 segments (4x32), select 1/4 duty cycle (see table 9-11) BLKMODE X N/A; Blink Segments = 0; Blink All = 1 BRATE[2:0] XXX 00000000 LCDSUPPLY 10XXXX10 LCDCR1 XXXXXX00 LCDCR0 0X100X00 LCDBCTL 0XXXXXXX FPENR[5:0] FPENR0 FPENR1 FPENR2 FPENR3 FPENR4 FPENR5 Comment Configure LCD charge pump clock source For 1/4 duty cycle, select closest value to the desired 30 Hz LCD frame frequency (see table 9-13) N/A 11111111 Only 32 Frontplanes need to be enabled. 11111111 11111111 11111111 00000000 XXXXXXX0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 158 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.2.2 Initialization Example 2 Example 2 LCD setup requirements are reiterated in the following table: Example 2 LCD Glass Operating LCD Clock Operating Voltage, Source Voltage VDD 3.6-V Internal 100 kHz 3-V Required LCD segments 99 LCD Frame Rate Blinking Mode/Rate 80 Hz Individual segment 0.5 Hz Behavior in LCD Power STOP3 and Input WAIT modes WAIT: on STOP3: off Power via VDD Table 9-23 lists the required setup values required to initialize the LCD as specified by Example 2: Table 9-23. Initialization Register Values for Example 2 Register Bit/bit field Binary Value LCDCLKS 10000010 SOURCE 1 Selects the bus clock as the LCD clock input External clock reference = 0; Bus clock = 1 DIV16 0 Adjusts the LCD clock input (see table 9-12) CLKADJ[5:0] 000010 Adjusts the LCD clock input (see table 9-12) LCDCPEN 1 Enable the charge pump LCDCPMS X Don’t care since power is from internal VDD Doubler mode = 0; Tripler mode = 1 HDRVBUF X High drive buffer CPCADJ[1:0] XX BBYPASS X Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1 VSUPPLY[1:0] 01 Power LCD via VDD internal power (see table 9-16). When VSUPPLY[1:0] = 01, VLL3 is generated from VDD . LCDWAI 0 LCD is “on” in WAIT mode LCDSTP3 1 LCD is “off” in STOP3 mode LCLK[2:0] 011 LPWAVE X Low power waveform DUTY[1:0] 10 For 99 segments (3x33), select 1/3 duty cycle (see table 9-11) LCDSUPPLY 1XXXXX01 LCDCR1 XXXXXX01 LCDCR0 0X011X11 Comment Configure LCD charge pump clock source For 1/3 duty cycle, select closest value to the desired 80 Hz LCD frame frequency (see table 9-13). Note the LCD base frequency - 256.2 Hz MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 159 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) Table 9-23. Initialization Register Values for Example 2 (continued) Register Bit/bit field Binary Value LCDBCTL 0XXX0100 BLKMODE 0 BRATE[2:0] 100 FPENR[5:0] FPENR0 FPENR1 FPENR2 FPENR3 FPENR4 FPENR5 Comment Blink individual segments; Blink Segments = 0; Blink All = 1 Using the LCD base frequency for the selected LCD frame frequency, select 0.5 Hz blink frequency (see table 9-15). 11111111 Only 33 Frontplanes need to be enabled. 11111111 11111111 Optionally, if required, 1/4 duty cycle could be used. This option would only 11111111 require 25 frontplane pins to be enabled. 00000001 XXXXXXX0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 160 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.2.3 Initialization Example 3 Example 3 LCD setup requirements are reiterated in the table below: Example 3 LCD Glass Operating LCD Clock Operating Voltage, Source Voltage VDD 3.6-V Internal 18886 kHz 5-V Required LCD segments 160 LCD Frame Rate Blinking Mode/Rate 60 Hz Individual segment 2.0 Hz Behavior in LCD Power STOP3 and Input WAIT modes WAIT: off STOP3: on Power via VDD Table 9-24 lists the required setup values required to initialize the LCD as specified by Example 3: Table 9-24. Initialization Register Values for Example 3 Register Bit/bit field Binary Value LCDCLKS 11100011 SOURCE 1 Selects the bus clock as the LCD clock input External clock reference = 0; Bus clock = 1 DIV16 1 Adjusts the LCD clock input (see table 9-12) CLKADJ[5:0] 100011 Adjusts the LCD clock input (see table 9-12) LCDCPEN 1 Enable the charge pump LCDCPMS X Don’t care since power is from internal VDD Doubler mode = 0; Tripler mode = 1 HDRVBUF X High drive buffer CPCADJ[1:0] XX BBYPASS X Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1 VSUPPLY[1:0] 00 Power LCD via VDD internal power (see table 9-16). When VSUPPLY[1:0] = 00, VLL2 is generated from VDD . LCDWAI 1 LCD is “off” in WAIT mode LCDSTP3 0 LCD is “on” in STOP3 mode LCLK[2:0] 011 LPWAVE X Low power waveform DUTY[1:0] 11 For 160 segments (4x40), select 1/4 duty cycle (see table 9-11) BLKMODE 0 Blink individual segments; Blink Segments = 0; Blink All = 1 BRATE[2:0] 010 LCDSUPPLY 1XXXXX00 LCDCR1 XXXXXX10 LCDCR0 0X011X00 LCDBCTL 0XXX0010 FPENR[5:0] FPENR0 FPENR1 FPENR2 FPENR3 FPENR4 FPENR5 Comment Configure LCD charge pump clock source For 1/4 duty cycle, select closest value to the desired 60 Hz LCD frame frequency (see table 9-13). Note the LCD base frequency - 256.2 Hz Using the LCD base frequency for the selected LCD frame frequency, select 2.0 Hz blink frequency (see table 9-15). 11111111 40 LCD frontplanes need to be enabled. 11111111 11111111 11111111 11111111 XXXXXXX0 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 161 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.5.2.4 Initialization Example 4 Example 3 LCD setup requirements are reiterated in the table below: Example 4 LCD Glass Operating LCD Clock Operating Voltage, Source Voltage VDD 1.8-V External 32.768 kHz 5-V Required LCD segments LCD Frame Rate 123 30 Hz Blinking Mode/Rate Behavior in STOP3 and WAIT modes LCD Power Input all segment 2.0 Hz WAIT: off STOP3: off Power via VLCD Table 9-25 lists the required setup values required to initialize the LCD as specified by Example 4: Table 9-25. Initialization Register Values for Example 4 Register Bit/bit field Binary Value LCDCLKS 00000000 SOURCE 0 Selects the external clock reference as the LCD clock input External clock reference = 0; Bus clock = 1 DIV16 0 Adjusts the LCD clock input (see table 9-12) CLKADJ[5:0] 000000 Adjusts the LCD clock input (see table 9-12) LCDCPEN 1 Enable the charge pump LCDCPMS 1 For 3-V LCD glass, select tripler mode Doubler mode = 0; Tripler mode = 1 HDRVBUF X High drive buffer CPCADJ[1:0] 00 Configure LCD charge pump clock source BBYPASS X Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1 VSUPPLY[1:0] 10 When VSUPPLY[1:0] = 10, the LCD must be externally powered via VLCD (see table 9-16). For 5-V glass, the nominal value of VLCD should be 1.67-V. LCDWAI 0 LCD is “off” in WAIT mode LCDSTP3 0 LCD is “off” in STOP3 mode LCLK[2:0] 010 LPWAVE X Low power waveform DUTY[1:0] 10 For 123 segments (3x41), select 1/3 duty cycle (see table 9-11) BLKMODE 1 Blink all segments; Blink Segments = 0; Blink All = 1 BRATE[2:0] 001 LCDSUPPLY 1100XX10 LCDCR1 XXXXXX00 LCDCR0 0X010X11 LCDBCTL 0XXX1001 FPENR[5:0] FPENR0 FPENR1 FPENR2 FPENR3 FPENR4 FPENR5 Comment For 1/3 duty cycle, select the closest value to the desired 30 Hz LCD frame frequency (see table 9-13). Note the LCD base frequency - 128.1 Hz Using the LCD base frequency for the selected LCD frame frequency, select 2.0 Hz blink frequency (see table 9-15). 11111111 All 41 LCD frontplanes need to be enabled. 11111111 11111111 11111111 11111111 XXXXXXX1 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 162 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.6 Application Information Figure 9-18 is a programmer’s model of the LCD module. The programmer’s model groups the LCD module register bit and bit field into functional groups. The model is a very high level illustration of the LCD module showing the module’s functional hierarchy including initialization and runtime control. Data Bus LCD Segment Display and Blink Control LCD Segment Energize Blink Enable and Command LCDRAM Mode Select Blink LCDRAM LCDBCTL Mode Select LCDDRMS = 0 LCDBCTL Segment Energize BLKMODE LCDDRMS = 1 LCDRAM BLINK FP[40:0]BP[3:0] External Crystal = 32.768 kHz Internal Clock Generator LCDCR1 LCDIEN Initialization Options Module Enable LCDCR0 LCDEN Input Clock Source LCDCLKS SOURCE DIV16 CLKADJ[5:0] Frame Frequency LCDCR0 LCLK[2:0] DUTY[1:0] Blink Rate LCDBCTL BLKMODE BRATE[2:0] (not all LCD pins used) LCD GLASS PANEL FP[40:0] BP[3:0] Segment Blink Enable LCDRAM FP[40:0]BP[3:0] Clear Display LCDMISC LCDCLR BLANK LCD Frame Frequency Interrupt Shown with 7-segment LCD glass hardware LCDMISC LCDIF LCD Pin Enable FPENR[5:0] FP[40:0]EN Power Options LCDCR1 LCDCPMS LCDCPEN LCDMISC BBYPASS VSUPPLY[1:0] HDRVBUF VLCD VLL3 VLL2 VLL1 X LCD Power Pins NOTE: Configured for power using internal VDD CBYLCD Low Power LCDCR1 LCDWAI LCDSTP3 Vcap1 CLCD Vcap2 LCD charge pump capacitance Figure 9-18. LCD Programmer’s 9.6.1 Model Diagram LCD Seven Segment Example Description A description of the connection between the LCD module and a seven segment LCD character is illustrated below to provide a basic example for a LPWAVE = 0 and 1/3 duty cycle LCD implementation. The example use backplane pins (BP0, BP1, BP2) and frontplace pins (FP0, FP1, and FP2). LCDRAM contents and output waveforms are also shown. Output waveforms are illustrated in Figure 9-19 and Figure 9-20. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 163 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) FP CONNECTION a f e g d BP CONNECTION a b f c e BP0 (a, b COMMONED) b g BP1 (c, f, g COMMONED) c d BP2 (d, e COMMONED) FP2 (b, c COMMONED) FP1 (a, d, g COMMONED) FP0 (e, f COMMONED) The segment assignments for each bit in the data registers are: LDAT1 0x0052 F1B3 F1B2 F1B1 F1B0 F0B3 F0B2 F0B1 F0B0 — d g a — e f — FP1 LDAT2 0x0053 FP0 F3B3 F3B2 F3B1 F3B0 F2B3 F2B2 F2B1 F2B0 — — — — — — c b FP2 To display the character “4”: LDAT1 = X010X01X, LDAT2 = XXXXXX11 a LDAT1 0x0052 X 0 1 0 X 0 1 X LDAT2 0x0053 X X X X X X 1 1 f e g d b c X = don’t care Figure 9-19. Waveform Output from LCDRAM Registers MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 164 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.6.1.1 LCD Module Waveforms DUTY = 1/3 1FRAME BP0 V3 V2 V1 V0 — — — F0B2 F0B1 F0B0 0 1 0 F1B2 F1B1 F1B0 0 1 0 F2B2 F2B1 F2B0 0 1 1 BP1 V3 V2 V1 V0 BP2 V3 V2 V1 V0 FP0 V3 V2 V1 V0 FP1 V3 V2 V1 V0 FP2 V3 V2 V1 V0 Figure 9-20. LCD Waveforms (LPWAVE = 0) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 165 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) 9.6.1.2 Segment On Driving Waveform The voltage waveform across the “f” segment of the LCD (between BP1 and FP0) is illustrated in Figure 9-21. As shown in the waveform, the voltage level reaches the value V3 therefore the segment will be on. +V3 +V2 +V1 BP1–FP0 V0 –V1 –V2 –V3 Figure 9-21. “f” Segment Voltage Waveform 9.6.1.3 Segment Off Driving Waveform The voltage waveform across the “e” segment of the LCD (between BP2 and FP0) is illustrated in Figure 9-22. As shown in the waveform, the voltage does not reach the voltage V3 threshold therefore the segment will be off. +V3 +V2 +V1 V0 –V1 –V2 –V3 BP2–FP0 Figure 9-22. “e” Segment Voltage Waveform 9.6.2 LCD Contrast Control Contrast control for the LCD module is achieved when LCD power supply is adjusted above and below the LCD threshold voltage. The LCD threshold voltage is the nominal voltage required to energize the LCD segments. For 3-V LCD glass, the LCD threshold voltage is 3-V; while, for 5-V LCD glass, the LCD threshold voltage is 5-V. By increasing the value of the LCD threshold voltage, the energized segments on the LCD glass will become more opaque. Decreasing the value of the LCD threshold voltage makes the energized segments on the LCD glass become more transparent. The LCD power supply can be adjusted to facilitate contrast control by using external components like a variable resistor. Figure 9-23 shows two circuits that could be used to implement contract control. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 166 Freescale Semiconductor Chapter 9 Liquid Crystal Display Driver (S08LCDV1) NOTE: Contrast control configuration when LCD is powered using external VLCD LCD GLASS PANEL FP[40:0] This is the recommended configuration for contrast control. BP[3:0] LCD Power Supply 9S08LC60 VLCD specified between 0.9 and 1.8 volts. VLCD VLL3 R LCD Power Pins VLL2 VLL1 CBYLCD Vcap1 Vcap2 CLCD LCD charge pump capacitance Figure 9-23. Power Connections for Contrast Control 9.6.3 LCD Power Consumption The following tables show relative power consumption from VDD for the different modes available for the LCD module. Table 26. Relative Power Consumption, 5 V Typical Voltage LCD Display Voltage Range VDD Supply Range VDD Current Consumption Level VLL2 connect to VDD VDD = 3.333 V VDD = 3 V ~ 3.6 V 3 V ~ 3.6 V low Tripler Buffered Mode VLCD = 1.6667 V VLCD = 1.5 V ~ 1.8 V 2.4 V ~ 3.6 V high Tripler Bypassed Mode VLCD = 1.6667 V VLCD = 1.5 V ~ 1.8 V 1.8 V ~ 3.6 V lowest Mode Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel. Table 27. Relative Power Consumption, 3 V Typical Voltage LCD Display Voltage Range VDD Supply Range VDD Current Consumption Level VLL2 connect to VDD VDD = 2 V VDD = 1.8 V ~ 2.2 V 1.8 V ~ 2.2 V high Tripler Buffered Mode VLCD = 1 V VLCD = 0.9 V ~ 1.1 V 2.0 V ~ 3.6 V highest Tripler Bypassed Mode VLCD = 1 V VLCD = 0.9 V ~ 1.1 V 1.8 V ~ 3.6 V lowest VLL3 connect to VDD VDD = 3 V VDD = 2.7 V ~ 3.3 V 2.7 V ~ 3.3 V low VLCD = 1.5 V VLCD = 1.35 V ~ 1.65 V 2.4 V ~ 3.6 V highest Mode Doubler Buffered Mode Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 167 Chapter 9 Liquid Crystal Display Driver (S08LCDV1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 168 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) Chapter 10 Internal Clock Generator (S08ICGV4) 10.1 Introduction The ICG module is used to generate the system clocks for the MC9S08LC60/36/20 MCU. Figure 10-1 shows the clock distribution for the MC9S08LC60/36/20 MCU. Electrical parametric data for the ICG may be found in Appendix. TPMCLK 1-kHz SYSTEM CONTROL LOGIC ICGERCLK TPM1 TPM2 IIC1 SCI SPI1 SPI2 ADC RAM FLASH ACMP RTI FFE ÷2 ICG FIXED FREQ CLOCK (XCLK) ICGOUT ÷2 BUSCLK ICGLCLK* CPU BDC LCD * ICGLCLK is the alternate BDC clock source for the MC9S08LC60 Series. COP ADC has min and max frequency requirements. See Chapter 1, “Introduction” and the Electricals Appendix. FLASH has frequency requirements for program and erase operation. See the Electricals Appendix. Figure 10-1. System Clock Distribution Diagram NOTE Freescale Semiconductor programs a factory trim value for ICGTRM into the FLASH location $FFBE (NVICGTRM). Leaving this address for the ICGTRM value also allows debugger and programmer vendors to perform a manual trim operation and store the resultant ICGTRM value into NVICGTRM for users to access at a later time. The value in NVICGTRM is not automatically loaded and therefore must be copied into ICGTRM by user code. Figure 10-2 shows the MC9S08LC60 Series block diagram with the ICG highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 169 Chapter 10 Internal Clock Generator (S08ICGV4) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 10-2. MC9S08LC60 Series Block Diagram Highlighting the ICGBlock and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 170 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.2 Introduction The ICG provides multiple options for clock sources. This offers a user great flexibility when making choices between cost, precision, current draw, and performance. As seen in Figure 10-3, the ICG consists of four functional blocks. Each of these is briefly described here and then in more detail in a later section. • Oscillator block — The oscillator block provides means for connecting an external crystal or resonator. Two frequency ranges are software selectable to allow optimal startup and stability. Alternatively, the oscillator block can be used to route an external square wave to the system clock. External sources can provide a very precise clock source. The oscillator is capable of being configured for low power mode or high amplitude mode as selected by HGO. • Internal reference generator — The internal reference generator consists of two controlled clock sources. One is designed to be approximately 8 MHz and can be selected as a local clock for the background debug controller. The other internal reference clock source is typically 243 kHz and can be trimmed for finer accuracy via software when a precise timed event is input to the MCU. This provides a highly reliable, low-cost clock source. • Frequency-locked loop — A frequency-locked loop (FLL) stage takes either the internal or external clock source and multiplies it to a higher frequency. Status bits provide information when the circuit has achieved lock and when it falls out of lock. Additionally, this block can monitor the external reference clock and signals whether the clock is valid or not. • Clock select block — The clock select block provides several switch options for connecting different clock sources to the system clock tree. ICGDCLK is the multiplied clock frequency out of the FLL, ICGERCLK is the reference clock frequency from the crystal or external clock source, and FFE (fixed frequency enable) is a control signal used to control the system fixed frequency clock (XCLK). ICGLCLK is the clock source for the background debug controller (BDC). 10.2.1 Features The module is intended to be very user friendly with many of the features occurring automatically without user intervention. To quickly configure the module, go to Section 10.6, “Initialization/Application Information” and pick an example that best suits the application needs. Features of the ICG and clock distribution system: • Several options for the primary clock source allow a wide range of cost, frequency, and precision choices: — 32 kHz–100 kHz crystal or resonator — 1 MHz–16 MHz crystal or resonator — External clock — Internal reference generator • Defaults to self-clocked mode to minimize startup delays • Frequency-locked loop (FLL) generates 8 MHz to 40 MHz (for bus rates up to 20 MHz) — Uses external or internal clock as reference frequency • Automatic lockout of non-running clock sources • Reset or interrupt on loss of clock or loss of FLL lock MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 171 Chapter 10 Internal Clock Generator (S08ICGV4) • • • • • • • Digitally-controlled oscillator (DCO) preserves previous frequency settings, allowing fast frequency lock when recovering from stop3 mode DCO will maintain operating frequency during a loss or removal of reference clock Post-FLL divider selects 1 of 8 bus rate divisors (/1 through /128) Separate self-clocked source for real-time interrupt Trimmable internal clock source supports SCI communications without additional external components Automatic FLL engagement after lock is acquired External oscillator selectable for low power or high gain 10.2.2 Modes of Operation This is a high-level description only. Detailed descriptions of operating modes are contained in Section 10.5, “Functional Description.” • Mode 1 — Off The output clock, ICGOUT, is static. This mode may be entered when the STOP instruction is executed. • Mode 2 — Self-clocked (SCM) Default mode of operation that is entered immediately after reset. The ICG’s FLL is open loop and the digitally controlled oscillator (DCO) is free running at a frequency set by the filter bits. • Mode 3 — FLL engaged internal (FEI) In this mode, the ICG’s FLL is used to create frequencies that are programmable multiples of the internal reference clock. — FLL engaged internal unlocked is a transition state that occurs while the FLL is attempting to lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the target frequency. — FLL engaged internal locked is a state that occurs when the FLL detects that the DCO is locked to a multiple of the internal reference. • Mode 4 — FLL bypassed external (FBE) In this mode, the ICG is configured to bypass the FLL and use an external clock as the clock source. • Mode 5 — FLL engaged external (FEE) The ICG’s FLL is used to generate frequencies that are programmable multiples of the external clock reference. — FLL engaged external unlocked is a transition state that occurs while the FLL is attempting to lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the target frequency. — FLL engaged external locked is a state which occurs when the FLL detects that the DCO is locked to a multiple of the internal reference. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 172 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.2.3 Block Diagram Figure 10-3 is a top-level diagram that shows the functional organization of the internal clock generation (ICG) module. This section includes a general description and a feature list. EXTAL OSCILLATOR (OSC) WITH EXTERNAL REF SELECT ICG CLOCK SELECT ICGERCLK XTAL ICGDCLK REF SELECT VDDA (SEE NOTE 2) FREQUENCY LOCKED LOOP (FLL) DCO OUTPUT CLOCK SELECT /R ICGOUT LOSS OF LOCK AND CLOCK DETECTOR V SSA (SEE NOTE 2) FIXED CLOCK SELECT IRG INTERNAL TYP 243 kHz REFERENCE 8 MHz GENERATORS RG FFE ICGIRCLK LOCAL CLOCK FOR OPTIONAL USE WITH BDC ICGLCLK NOTES: 1. See Table 8-1 for specific use of ICGOUT, FFE, ICGLCLK, ICGERCLK 2. Not all HCS08 microcontrollers have unique supply pins for the ICG. See the device pin assignments. Figure 10-3. ICG Block Diagram 10.3 External Signal Description The oscillator pins are used to provide an external clock source for the MCU. The oscillator pins are gain controlled in low-power mode (default). Oscillator amplitudes in low-power mode are limited to approximately 1 V, peak-to-peak. 10.3.1 EXTAL — External Reference Clock / Oscillator Input If upon the first write to ICGC1, either the FEE mode or FBE mode is selected, this pin functions as either the external clock input or the input of the oscillator circuit as determined by REFS. If upon the first write to ICGC1, either the FEI mode or SCM mode is selected, this pin is not used by the ICG. 10.3.2 XTAL — Oscillator Output If upon the first write to ICGC1, either the FEE mode or FBE mode is selected, this pin functions as the output of the oscillator circuit. If upon the first write to ICGC1, either the FEI mode or SCM mode is MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 173 Chapter 10 Internal Clock Generator (S08ICGV4) selected, this pin is not used by the ICG. The oscillator is capable of being configured to provide a higher amplitude output for improved noise immunity. This mode of operation is selected by HGO = 1. 10.3.3 External Clock Connections If an external clock is used, then the pins are connected as shown Figure 10-4. ICG EXTAL XTAL VSS NOT CONNECTED CLOCK INPUT Figure 10-4. External Clock Connections 10.3.4 External Crystal/Resonator Connections If an external crystal/resonator frequency reference is used, then the pins are connected as shown in Figure 10-5. Recommended component values are listed in the Electrical Characteristics chapter. ICG EXTAL VSS XTAL RS C1 C2 RF CRYSTAL OR RESONATOR Figure 10-5. External Frequency Reference Connection MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 174 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.4 Register Definition Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address assignments for all ICG registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. 10.4.1 R ICG Control Register 1 (ICGC1) 7 6 5 HGO1 RANGE REFS 0 1 0 4 3 2 1 OSCSTEN LOCD 1 0 0 0 CLKS W Reset 0 0 0 = Unimplemented or Reserved Figure 10-6. ICG Control Register 1 (ICGC1) 1 This bit can be written only once after reset. Additional writes are ignored. Table 10-1. ICGC1 Register Field Descriptions Field 7 HGO Description High Gain Oscillator Select — The HGO bit is used to select between low power operation and high gain operation for improved noise immunity. This bit is write-once after reset. 0 Oscillator configured for low power operation. 1 Oscillator configured for high gain operation. 6 RANGE Frequency Range Select — The RANGE bit controls the oscillator, reference divider, and FLL loop prescaler multiplication factor (P). It selects one of two reference frequency ranges for the ICG. The RANGE bit is write-once after a reset. The RANGE bit only has an effect in FLL engaged external and FLL bypassed external modes. 0 Oscillator configured for low frequency range. FLL loop prescale factor P is 64. 1 Oscillator configured for high frequency range. FLL loop prescale factor P is 1. 5 REFS External Reference Select — The REFS bit controls the external reference clock source for ICGERCLK. The REFS bit is write-once after a reset. 0 External clock requested. 1 Oscillator using crystal or resonator requested. 4:3 CLKS Clock Mode Select — The CLKS bits control the clock mode as described below. If FLL bypassed external is requested, it will not be selected until ERCS = 1. If the ICG enters off mode, the CLKS bits will remain unchanged. Writes to the CLKS bits will not take effect if a previous write is not complete. 00 Self-clocked 01 FLL engaged, internal reference 10 FLL bypassed, external reference 11 FLL engaged, external reference The CLKS bits are writable at any time, unless the first write after a reset was CLKS = 0X, the CLKS bits cannot be written to 1X until after the next reset (because the EXTAL pin was not reserved). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 175 Chapter 10 Internal Clock Generator (S08ICGV4) Table 10-1. ICGC1 Register Field Descriptions (continued) Field 2 OSCSTEN 1 LOCD Description Enable Oscillator in Off Mode — The OSCSTEN bit controls whether or not the oscillator circuit remains enabled when the ICG enters off mode. This bit has no effect if HGO = 1 and RANGE = 1. 0 Oscillator disabled when ICG is in off mode unless ENABLE is high, CLKS = 10, and REFST = 1. 1 Oscillator enabled when ICG is in off mode, CLKS = 1X and REFST = 1. Loss of Clock Disable 0 Loss of clock detection enabled. 1 Loss of clock detection disabled. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 176 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.4.2 ICG Control Register 2 (ICGC2) 7 6 5 4 3 2 1 0 R LOLRE MFD LOCRE RFD W Reset 0 0 0 0 0 0 0 0 Figure 10-7. ICG Control Register 2 (ICGC2) Table 10-2. ICGC2 Register Field Descriptions Field Description 7 LOLRE Loss of Lock Reset Enable — The LOLRE bit determines what type of request is made by the ICG following a loss of lock indication. The LOLRE bit only has an effect when LOLS is set. 0 Generate an interrupt request on loss of lock. 1 Generate a reset request on loss of lock. 6:4 MFD Multiplication Factor — The MFD bits control the programmable multiplication factor in the FLL loop. The value specified by the MFD bits establishes the multiplication factor (N) applied to the reference frequency. Writes to the MFD bits will not take effect if a previous write is not complete. Select a low enough value for N such that fICGDCLK does not exceed its maximum specified value. 000 Multiplication factor = 4 001 Multiplication factor = 6 010 Multiplication factor = 8 011 Multiplication factor = 10 100 Multiplication factor = 12 101 Multiplication factor = 14 110 Multiplication factor = 16 111 Multiplication factor = 18 3 LOCRE Loss of Clock Reset Enable — The LOCRE bit determines how the system manages a loss of clock condition. 0 Generate an interrupt request on loss of clock. 1 Generate a reset request on loss of clock. 2:0 RFD Reduced Frequency Divider — The RFD bits control the value of the divider following the clock select circuitry. The value specified by the RFD bits establishes the division factor (R) applied to the selected output clock source. Writes to the RFD bits will not take effect if a previous write is not complete. 000 Division factor = 1 001 Division factor = 2 010 Division factor = 4 011 Division factor = 8 100 Division factor = 16 101 Division factor = 32 110 Division factor = 64 111 Division factor = 128 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 177 Chapter 10 Internal Clock Generator (S08ICGV4) 10.4.3 ICG Status Register 1 (ICGS1) 7 R 6 CLKST 5 4 3 2 1 0 REFST LOLS LOCK LOCS ERCS ICGIF W Reset 1 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-8. ICG Status Register 1 (ICGS1) Table 10-3. ICGS1 Register Field Descriptions Field Description 7:6 CLKST Clock Mode Status — The CLKST bits indicate the current clock mode. The CLKST bits don’t update immediately after a write to the CLKS bits due to internal synchronization between clock domains. 00 Self-clocked 01 FLL engaged, internal reference 10 FLL bypassed, external reference 11 FLL engaged, external reference 5 REFST Reference Clock Status — The REFST bit indicates which clock reference is currently selected by the Reference Select circuit. 0 External Clock selected. 1 Crystal/Resonator selected. 4 LOLS FLL Loss of Lock Status — The LOLS bit is a sticky indication of FLL lock status. 0 FLL has not unexpectedly lost lock since LOLS was last cleared. 1 FLL has unexpectedly lost lock since LOLS was last cleared, LOLRE determines action taken.FLL has unexpectedly lost lock since LOLS was last cleared, LOLRE determines action taken. 3 LOCK FLL Lock Status — The LOCK bit indicates whether the FLL has acquired lock. The LOCK bit is cleared in off, self-clocked, and FLL bypassed modes. 0 FLL is currently unlocked. 1 FLL is currently locked. 2 LOCS Loss Of Clock Status — The LOCS bit is an indication of ICG loss of clock status. 0 ICG has not lost clock since LOCS was last cleared. 1 ICG has lost clock since LOCS was last cleared, LOCRE determines action taken. 1 ERCS External Reference Clock Status — The ERCS bit is an indication of whether or not the external reference clock (ICGERCLK) meets the minimum frequency requirement. 0 External reference clock is not stable, frequency requirement is not met. 1 External reference clock is stable, frequency requirement is met. 0 ICGIF ICG Interrupt Flag — The ICGIF read/write flag is set when an ICG interrupt request is pending. It is cleared by a reset or by reading the ICG status register when ICGIF is set and then writing a logic 1 to ICGIF. If another ICG interrupt occurs before the clearing sequence is complete, the sequence is reset so ICGIF would remain set after the clear sequence was completed for the earlier interrupt. Writing a logic 0 to ICGIF has no effect. 0 No ICG interrupt request is pending. 1 An ICG interrupt request is pending. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 178 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.4.4 R ICG Status Register 2 (ICGS2) 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 DCOS 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 10-9. ICG Status Register 2 (ICGS2) Table 10-4. ICGS2 Register Field Descriptions Field Description 0 DCOS DCO Clock Stable — The DCOS bit is set when the DCO clock (ICG2DCLK) is stable, meaning the count error has not changed by more than nunlock for two consecutive samples and the DCO clock is not static. This bit is used when exiting off state if CLKS = X1 to determine when to switch to the requested clock mode. It is also used in self-clocked mode to determine when to start monitoring the DCO clock. This bit is cleared upon entering the off state. 0 DCO clock is unstable. 1 DCO clock is stable. 10.4.5 R ICG Filter Registers (ICGFLTU, ICGFLTL) 7 6 5 4 0 0 0 0 3 2 1 0 0 0 FLT W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-10. ICG Upper Filter Register (ICGFLTU) Table 10-5. ICGFLTU Register Field Descriptions Field Description 3:0 FLT Filter Value — The FLT bits indicate the current filter value, which controls the DCO frequency. The FLT bits are read only except when the CLKS bits are programmed to self-clocked mode (CLKS = 00). In self-clocked mode, any write to ICGFLTU updates the current 12-bit filter value. Writes to the ICGFLTU register will not affect FLT if a previous latch sequence is not complete. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 179 Chapter 10 Internal Clock Generator (S08ICGV4) 7 6 5 4 3 2 1 0 0 0 0 0 R FLT W Reset 1 1 0 0 Figure 10-11. ICG Lower Filter Register (ICGFLTL) Table 10-6. ICGFLTL Register Field Descriptions Field Description 7:0 FLT Filter Value — The FLT bits indicate the current filter value, which controls the DCO frequency. The FLT bits are read only except when the CLKS bits are programmed to self-clocked mode (CLKS = 00). In self-clocked mode, any write to ICGFLTU updates the current 12-bit filter value. Writes to the ICGFLTU register will not affect FLT if a previous latch sequence is not complete. The filter registers show the filter value (FLT). 10.4.6 ICG Trim Register (ICGTRM) 7 6 5 4 3 2 1 0 R TRIM W POR 1 0 0 0 0 0 0 0 Reset: U U U U U U U U U = Unaffected by MCU reset Figure 10-12. ICG Trim Register (ICGTRM) Table 10-7. ICGTRM Register Field Descriptions Field 7 TRIM Description ICG Trim Setting — The TRIM bits control the internal reference generator frequency. They allow a ±25% adjustment of the nominal (POR) period. The bit’s effect on period is binary weighted (i.e., bit 1 will adjust twice as much as changing bit 0). Increasing the binary value in TRIM will increase the period and decreasing the value will decrease the period. 10.5 Functional Description This section provides a functional description of each of the five operating modes of the ICG. Also discussed are the loss of clock and loss of lock errors and requirements for entry into each mode. The ICG is very flexible, and in some configurations, it is possible to exceed certain clock specifications. When using the FLL, configure the ICG so that the frequency of ICGDCLK does not exceed its maximum value to ensure proper MCU operation. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 180 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.1 Off Mode (Off) Normally when the CPU enters stop mode, the ICG will cease all clock activity and is in the off state. However there are two cases to consider when clock activity continues while the CPU is in stop mode, 10.5.1.1 BDM Active When the BDM is enabled, the ICG continues activity as originally programmed. This allows access to memory and control registers via the BDC controller. 10.5.1.2 OSCSTEN Bit Set When the oscillator is enabled in stop mode (OSCSTEN = 1), the individual clock generators are enabled but the clock feed to the rest of the MCU is turned off. This option is provided to avoid long oscillator startup times if necessary, or to run the RTI from the oscillator during stop3. 10.5.1.3 Stop/Off Mode Recovery Upon the CPU exiting stop mode due to an interrupt, the previously set control bits are valid and the system clock feed resumes. If FEE is selected, the ICG will source the internal reference until the external clock is stable. If FBE is selected, the ICG will wait for the external clock to stabilize before enabling ICGOUT. Upon the CPU exiting stop mode due to a reset, the previously set ICG control bits are ignored and the default reset values applied. Therefore the ICG will exit stop in SCM mode configured for an approximately 8 MHz DCO output (4 MHz bus clock) with trim value maintained. If using a crystal, 4096 clocks are detected prior to engaging ICGERCLK. This is incorporated in crystal start-up time. 10.5.2 Self-Clocked Mode (SCM) Self-clocked mode (SCM) is the default mode of operation and is entered when any of the following conditions occur: • After any reset. • Exiting from off mode when CLKS does not equal 10. If CLKS = X1, the ICG enters this state temporarily until the DCO is stable (DCOS = 1). • CLKS bits are written from X1 to 00. • CLKS = 1X and ICGERCLK is not detected (both ERCS = 0 and LOCS = 1). In this state, the FLL loop is open. The DCO is on, and the output clock signal ICGOUT frequency is given by fICGDCLK / R. The ICGDCLK frequency can be varied from 8 MHz to 40 MHz by writing a new value into the filter registers (ICGFLTH and ICGFLTL). This is the only mode in which the filter registers can be written. If this mode is entered due to a reset, fICGDCLK will default to fSelf_reset which is nominally 8 MHz. If this mode is entered from FLL engaged internal, fICGDCLK will maintain the previous frequency.If this mode is entered from FLL engaged external (either by programming CLKS or due to a loss of external reference clock), fICGDCLK will maintain the previous frequency, but ICGOUT will double if the FLL was unlocked. If this mode is entered from off mode, fICGDCLK will be equal to the frequency of ICGDCLK before MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 181 Chapter 10 Internal Clock Generator (S08ICGV4) entering off mode. If CLKS bits are set to 01 or 11 coming out of the Off state, the ICG enters this mode until ICGDCLK is stable as determined by the DCOS bit. After ICGDCLK is considered stable, the ICG automatically closes the loop by switching to FLL engaged (internal or external) as selected by the CLKS bits. CLKST REFERENCE DIVIDER (/7) ICGIRCLK CLKS RFD CLOCK SELECT CIRCUIT REDUCED FREQUENCY DIVIDER (R) RANGE ICGOUT ICGDCLK FLT MFD 1x DIGITALLY CONTROLLED OSCILLATOR 2x DIGITAL LOOP FILTER SUBTRACTOR FLL ANALOG ICGERCLK CLKST FREQUENCYLOCKED LOOP (FLL) OVERFLOW ICG2DCLK PULSE COUNTER COUNTER ENABLE RANGE LOCK AND LOSS OF CLOCK DETECTOR DCOS LOCK LOLS LOCS ERCS RESET AND INTERRUPT CONTROL LOCD IRQ RESET ICGIF LOLRE LOCRE Figure 10-13. Detailed Frequency-Locked Loop Block Diagram 10.5.3 FLL Engaged, Internal Clock (FEI) Mode FLL engaged internal (FEI) is entered when any of the following conditions occur: • CLKS bits are written to 01 • The DCO clock stabilizes (DCOS = 1) while in SCM upon exiting the off state with CLKS = 01 In FLL engaged internal mode, the reference clock is derived from the internal reference clock ICGIRCLK, and the FLL loop will attempt to lock the ICGDCLK frequency to the desired value, as selected by the MFD bits. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 182 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.4 FLL Engaged Internal Unlocked FEI unlocked is a temporary state that is entered when FEI is entered and the count error (Δn) output from the subtractor is greater than the maximum nunlock or less than the minimum nunlock, as required by the lock detector to detect the unlock condition. The ICG will remain in this state while the count error (Δn) is greater than the maximum nlock or less than the minimum nlock, as required by the lock detector to detect the lock condition. In this state the output clock signal ICGOUT frequency is given by fICGDCLK / R. 10.5.5 FLL Engaged Internal Locked FLL engaged internal locked is entered from FEI unlocked when the count error (Δn), which comes from the subtractor, is less than nlock (max) and greater than nlock (min) for a given number of samples, as required by the lock detector to detect the lock condition. The output clock signal ICGOUT frequency is given by fICGDCLK / R. In FEI locked, the filter value is updated only once every four comparison cycles. The update made is an average of the error measurements taken in the four previous comparisons. 10.5.6 FLL Bypassed, External Clock (FBE) Mode FLL bypassed external (FBE) is entered when any of the following conditions occur: • From SCM when CLKS = 10 and ERCS is high • When CLKS = 10, ERCS = 1 upon entering off mode, and off is then exited • From FLL engaged external mode if a loss of DCO clock occurs and the external reference remains valid (both LOCS = 1 and ERCS = 1) In this state, the DCO and IRG are off and the reference clock is derived from the external reference clock, ICGERCLK. The output clock signal ICGOUT frequency is given by fICGERCLK / R. If an external clock source is used (REFS = 0), then the input frequency on the EXTAL pin can be anywhere in the range 0 MHz to 40 MHz. If a crystal or resonator is used (REFS = 1), then frequency range is either low for RANGE = 0 or high for RANGE = 1. 10.5.7 FLL Engaged, External Clock (FEE) Mode The FLL engaged external (FEE) mode is entered when any of the following conditions occur: • CLKS = 11 and ERCS and DCOS are both high. • The DCO stabilizes (DCOS = 1) while in SCM upon exiting the off state with CLKS = 11. In FEE mode, the reference clock is derived from the external reference clock ICGERCLK, and the FLL loop will attempt to lock the ICGDCLK frequency to the desired value, as selected by the MFD bits. To run in FEE mode, there must be a working 32 kHz–100 kHz or 2 MHz–10 MHz external clock source. The maximum external clock frequency is limited to 10 MHz in FEE mode to prevent over-clocking the DCO. The minimum multiplier for the FLL, from Table 10-12 is 4. Because 4 X 10 MHz is 40MHz, which is the operational limit of the DCO, the reference clock cannot be any faster than 10 MHz. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 183 Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.7.1 FLL Engaged External Unlocked FEE unlocked is entered when FEE is entered and the count error (Δn) output from the subtractor is greater than the maximum nunlock or less than the minimum nunlock, as required by the lock detector to detect the unlock condition. The ICG will remain in this state while the count error (Δn) is greater than the maximum nlock or less than the minimum nlock, as required by the lock detector to detect the lock condition. In this state, the pulse counter, subtractor, digital loop filter, and DCO form a closed loop and attempt to lock it according to their operational descriptions later in this section. Upon entering this state and until the FLL becomes locked, the output clock signal ICGOUT frequency is given by fICGDCLK / (2×R) This extra divide by two prevents frequency overshoots during the initial locking process from exceeding chip-level maximum frequency specifications. After the FLL has locked, if an unexpected loss of lock causes it to re-enter the unlocked state while the ICG remains in FEE mode, the output clock signal ICGOUT frequency is given by fICGDCLK / R. 10.5.7.2 FLL Engaged External Locked FEE locked is entered from FEE unlocked when the count error (Δn) is less than nlock (max) and greater than nlock (min) for a given number of samples, as required by the lock detector to detect the lock condition. The output clock signal ICGOUT frequency is given by fICGDCLK/R. In FLL engaged external locked, the filter value is updated only once every four comparison cycles. The update made is an average of the error measurements taken in the four previous comparisons. 10.5.8 FLL Lock and Loss-of-Lock Detection To determine the FLL locked and loss-of-lock conditions, the pulse counter counts the pulses of the DCO for one comparison cycle (see Table 10-9 for explanation of a comparison cycle) and passes this number to the subtractor. The subtractor compares this value to the value in MFD and produces a count error, Δn. To achieve locked status, Δn must be between nlock (min) and nlock (max). After the FLL has locked, Δn must stay between nunlock (min) and nunlock (max) to remain locked. If Δn goes outside this range unexpectedly, the LOLS status bit is set and remains set until cleared by software or until the MCU is reset. LOLS is cleared by reading ICGS1 then writing 1 to ICGIF (LOLRE = 0), or by a loss-of-lock induced reset (LOLRE = 1), or by any MCU reset. If the ICG enters the off state due to stop mode when ENBDM = OSCSTEN = 0, the FLL loses locked status (LOCK is cleared), but LOLS remains unchanged because this is not an unexpected loss-of-lock condition. Though it would be unusual, if ENBDM is cleared to 0 while the MCU is in stop, the ICG enters the off state. Because this is an unexpected stopping of clocks, LOLS will be set when the MCU wakes up from stop. Expected loss of lock occurs when the MFD or CLKS bits are changed or in FEI mode only, when the TRIM bits are changed. In these cases, the LOCK bit will be cleared until the FLL regains lock, but the LOLS will not be set. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 184 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.9 FLL Loss-of-Clock Detection The reference clock and the DCO clock are monitored under different conditions (see Table 10-8). Provided the reference frequency is being monitored, ERCS = 1 indicates that the reference clock meets minimum frequency requirements. When the reference and/or DCO clock(s) are being monitored, if either one falls below a certain frequency, fLOR and fLOD, respectively, the LOCS status bit will be set to indicate the error. LOCS will remain set until it is acknowledged or until the MCU is reset. LOCS is cleared by reading ICGS1 then writing 1 to ICGIF (LOCRE = 0), or by a loss-of-clock induced reset (LOCRE = 1), or by any MCU reset. If the ICG is in FEE, a loss of reference clock causes the ICG to enter SCM, and a loss of DCO clock causes the ICG to enter FBE mode. If the ICG is in FBE mode, a loss of reference clock will cause the ICG to enter SCM. In each case, the CLKST and CLKS bits will be automatically changed to reflect the new state. If the ICG is in FEE mode when a loss of clock occurs and the ERCS is still set to 1, then the CLKST bits are set to 10 and the ICG reverts to FBE mode. A loss of clock will also cause a loss of lock when in FEE or FEI modes. Because the method of clearing the LOCS and LOLS bits is the same, this would only be an issue in the unlikely case that LOLRE = 1 and LOCRE = 0. In this case, the interrupt would be overridden by the reset for the loss of lock. Table 10-8. Clock Monitoring (When LOCD = 0) Mode CLKS REFST ERCS External Reference Clock Monitored? DCO Clock Monitored? Off 0X or 11 X Forced Low No No SCM (CLKST = 00) FEI (CLKST = 01) FBE (CLKST = 10) FEE (CLKST = 11) 1 2 10 0 Forced Low No No 10 1 Real-Time1 Yes(1) No 0X X Forced Low No Yes2 10 0 Forced High No Yes(2) 10 1 Real-Time Yes Yes(2) 11 X Real-Time Yes Yes(2) 0X X Forced Low No Yes 11 X Real-Time Yes Yes 10 0 Forced High No No 10 1 Real-Time Yes No 11 X Real-Time Yes Yes If ENABLE is high (waiting for external crystal start-up after exiting stop). DCO clock will not be monitored until DCOS = 1 upon entering SCM from off or FLL bypassed external mode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 185 Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.10 Clock Mode Requirements A clock mode is requested by writing to CLKS1:CLKS0 and the actual clock mode is indicated by CLKST1:CLKST0. Provided minimum conditions are met, the status shown in CLKST1:CLKST0 should be the same as the requested mode in CLKS1:CLKS0. Table 10-9 shows the relationship between CLKS, CLKST, and ICGOUT. It also shows the conditions for CLKS = CLKST or the reason CLKS ≠ CLKST. NOTE If a crystal will be used before the next reset, then be sure to set REFS = 1 and CLKS = 1x on the first write to the ICGC1 register. Failure to do so will result in “locking” REFS = 0 which will prevent the oscillator amplifier from being enabled until the next reset occurs. Table 10-9. ICG State Table Actual Mode (CLKST) Off (XX) SCM (00) FEI (01) FBE (10) FEE (11) Desired Mode (CLKS) Range Reference Frequency (fREFERENCE) Comparison Cycle Time ICGOUT Conditions1 for CLKS = CLKST Reason CLKS1 ≠ CLKST Off (XX) X 0 — 0 — — FBE (10) X 0 — 0 — ERCS = 0 SCM (00) X fICGIRCLK/72 8/fICGIRCLK ICGDCLK/R Not switching from FBE to SCM — FEI (01) 0 fICGIRCLK/7(1) 8/fICGIRCLK ICGDCLK/R — DCOS = 0 FBE (10) X fICGIRCLK/7(1) 8/fICGIRCLK ICGDCLK/R — ERCS = 0 FEE (11) X fICGIRCLK/7(1) 8/fICGIRCLK ICGDCLK/R — DCOS = 0 or ERCS = 0 FEI (01) 0 fICGIRCLK/7 8/fICGIRCLK ICGDCLK/R DCOS = 1 — FEE (11) X fICGIRCLK/7 8/fICGIRCLK ICGDCLK/R — ERCS = 0 FBE (10) X 0 — ICGERCLK/R ERCS = 1 — FEE (11) X 0 — ICGERCLK/R — LOCS = 1 & ERCS = 1 0 fICGERCLK 2/fICGERCLK ICGDCLK/R3 ERCS = 1 and DCOS = 1 — 1 fICGERCLK 128/fICGERCLK ICGDCLK/R(2) ERCS = 1 and DCOS = 1 — FEE (11) 1 CLKST will not update immediately after a write to CLKS. Several bus cycles are required before CLKST updates to the new value. 2 The reference frequency has no effect on ICGOUT in SCM, but the reference frequency is still used in making the comparisons that determine the DCOS bit 3 After initial LOCK; will be ICGDCLK/2R during initial locking process and while FLL is re-locking after the MFD bits are changed. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 186 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.5.11 Fixed Frequency Clock The ICG provides a fixed frequency clock output, XCLK, for use by on-chip peripherals. This output is equal to the internal bus clock, BUSCLK, in all modes except FEE. In FEE mode, XCLK is equal to ICGERCLK ÷ 2 when the following conditions are met: • (P × N) ÷ R ≥ 4 where P is determined by RANGE (see Table 10-11), N and R are determined by MFD and RFD respectively (see Table 10-12). • LOCK = 1. If the above conditions are not true, then XCLK is equal to BUSCLK. When the ICG is in either FEI or SCM mode, XCLK is turned off. Any peripherals which can use XCLK as a clock source must not do so when the ICG is in FEI or SCM mode. 10.5.12 High Gain Oscillator The oscillator has the option of running in a high gain oscillator (HGO) mode, which improves the oscillator's resistance to EMC noise when running in FBE or FEE modes. This option is selected by writing a 1 to the HGO bit in the ICGC1 register. HGO is used with both the high and low range oscillators but is only valid when REFS = 1 in the ICGC1 register. When HGO = 0, the standard low-power oscillator is selected. This bit is writable only once after any reset. 10.6 10.6.1 Initialization/Application Information Introduction The section is intended to give some basic direction on which configuration a user would want to select when initializing the ICG. For some applications, the serial communication link may dictate the accuracy of the clock reference. For other applications, lowest power consumption may be the chief clock consideration. Still others may have lowest cost as the primary goal. The ICG allows great flexibility in choosing which is best for any application. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 187 Chapter 10 Internal Clock Generator (S08ICGV4) Table 10-10. ICG Configuration Consideration Clock Reference Source = Internal 1 Clock Reference Source = External FLL Engaged FEI 4 MHz < fBus < 20 MHz. Medium power (will be less than FEE if oscillator range = high) Good clock accuracy (After IRG is trimmed) Lowest system cost (no external components required) IRG is on. DCO is on. 1 FEE 4 MHz < fBus < 20 MHz Medium power (will be less than FEI if oscillator range = low) High clock accuracy Medium/High system cost (crystal, resonator or external clock source required) IRG is off. DCO is on. FLL Bypassed SCM This mode is mainly provided for quick and reliable system startup. 3 MHz < fBus < 5 MHz (default). 3 MHz < fBus < 20 MHz (via filter bits). Medium power Poor accuracy. IRG is off. DCO is on and open loop. FBE fBus range ≤ 8 MHz when crystal or resonator is used. Lowest power Highest clock accuracy Medium/High system cost (Crystal, resonator or external clock source required) IRG is off. DCO is off. The IRG typically consumes 100 μA. The FLL and DCO typically consumes 0.5 to 2.5 mA, depending upon output frequency. For minimum power consumption and minimum jitter, choose N and R to be as small as possible. The following sections contain initialization examples for various configurations. NOTE Hexadecimal values designated by a preceding $, binary values designated by a preceding %, and decimal values have no preceding character. Important configuration information is repeated here for reference. Table 10-11. ICGOUT Frequency Calculation Options Clock Scheme SCM — self-clocked mode (FLL bypassed internal) FBE — FLL bypassed external FEI — FLL engaged internal FEE — FLL engaged external 1 fICGOUT1 P Note fICGDCLK / R NA Typical fICGOUT = 8 MHz immediately after reset fext / R NA (fIRG / 7)* 64 * N / R 64 fext * P * N / R Range = 0 ; P = 64 Range = 1; P = 1 Typical fIRG = 243 kHz Ensure that fICGDCLK, which is equal to fICGOUT * R, does not exceed fICGDCLKmax. Table 10-12. MFD and RFD Decode Table MFD Value Multiplication Factor (N) RFD Division Factor (R) 000 001 010 011 100 4 6 8 10 12 000 001 010 011 100 ÷1 ÷2 ÷4 ÷8 ÷16 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 188 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) Table 10-12. MFD and RFD Decode Table 101 110 111 10.6.2 14 16 18 101 110 111 ÷32 ÷64 ÷128 Example #1: External Crystal = 32 kHz, Bus Frequency = 4.19 MHz In this example, the FLL will be used (in FEE mode) to multiply the external 32 kHz oscillator up to 8.38 MHz to achieve 4.19 MHz bus frequency. After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately 8 MHz on ICGOUT, which corresponds to a 4 MHz bus frequency (fBus). The clock scheme will be FLL engaged, external (FEE). So fICGOUT = fext * P * N / R ; P = 64, fext = 32 kHz Eqn. 10-1 N / R = 8.38 MHz /(32 kHz * 64) = 4 ; we can choose N = 4 and R =1 Eqn. 10-2 Solving for N / R gives: The values needed in each register to set up the desired operation are: ICGC1 = $38 (%00111000) Bit 7 Bit 6 Bit 5 Bits 4:3 Bit 2 Bit 1 Bit 0 HGO RANGE REFS CLKS OSCSTEN LOCD 0 0 1 11 0 0 0 Configures oscillator for low power Configures oscillator for low-frequency range; FLL prescale factor is 64 Oscillator using crystal or resonator is requested FLL engaged, external reference clock mode Oscillator disabled Loss-of-clock detection enabled Unimplemented or reserved, always reads zero ICGC2 = $00 (%00000000) Bit 7 Bits 6:4 Bit 3 Bits 2:0 LOLRE MFD LOCRE RFD 0 Generates an interrupt request on loss of lock 000 Sets the MFD multiplication factor to 4 0 Generates an interrupt request on loss of clock 000 Sets the RFD division factor to ÷1 ICGS1 = $xx This is read only except for clearing interrupt flag ICGS2 = $xx This is read only; should read DCOS = 1 before performing any time critical tasks ICGFLTLU/L = $xx Only needed in self-clocked mode; FLT will be adjusted by loop to give 8.38 MHz DCO clock Bits 15:12 unused 0000 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 189 Chapter 10 Internal Clock Generator (S08ICGV4) Bits 11:0 FLT No need for user initialization ICGTRM = $xx Bits 7:0 TRIM Only need to write when trimming internal oscillator; not used when external crystal is clock source Figure 10-14 shows flow charts for three conditions requiring ICG initialization. RESET INITIALIZE ICG ICGC1 = $38 ICGC2 = $00 CHECK FLL LOCK STATUS. LOCK = 1? QUICK RECOVERY FROM STOP MINIMUM CURRENT DRAW IN STOP RECOVERY FROM STOP OSCSTEN = 1 RECOVERY FROM STOP OSCSTEN = 0 CHECK FLL LOCK STATUS. LOCK = 1? NO CHECK FLL LOCK STATUS. LOCK = 1? NO YES YES NO CONTINUE CONTINUE YES CONTINUE NOTE: THIS WILL REQUIRE THE OSCILLATOR TO START AND STABILIZE. ACTUAL TIME IS DEPENDENT ON CRYSTAL /RESONATOR AND EXTERNAL CIRCUITRY. Figure 10-14. ICG Initialization for FEE in Example #1 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 190 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.6.3 Example #2: External Crystal = 4 MHz, Bus Frequency = 20 MHz In this example, the FLL will be used (in FEE mode) to multiply the external 4 MHz oscillator up to 40-MHz to achieve 20 MHz bus frequency. After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately 8 MHz on ICGOUT which corresponds to a 4 MHz bus frequency (fBus). During reset initialization software, the clock scheme will be set to FLL engaged, external (FEE). So fICGOUT = fext * P * N / R ; P = 1, fext = 4.00 MHz Eqn. 10-3 N / R = 40 MHz /(4 MHz * 1) = 10 ; We can choose N = 10 and R = 1 Eqn. 10-4 Solving for N / R gives: The values needed in each register to set up the desired operation are: ICGC1 = $78 Bit 7 Bit 6 Bit 5 Bits 4:3 Bit 2 Bit 1 Bit 0 HGO RANGE REFS CLKS OSCSTEN LOCD ICGC2 = $30 Bit 7 Bit 6:4 Bit 3 Bit 2:0 (%01111000) 0 1 1 11 0 0 0 Configures oscillator for low power Configures oscillator for high-frequency range; FLL prescale factor is 1 Requests an oscillator FLL engaged, external reference clock mode Disables the oscillator Loss-of-clock detection enabled Unimplemented or reserved, always reads zero (%00110000) LOLRE MFD LOCRE RFD 0 Generates an interrupt request on loss of lock 011 Sets the MFD multiplication factor to 10 0 Generates an interrupt request on loss of clock 000 Sets the RFD division factor to ÷1 ICGS1 = $xx This is read only except for clearing interrupt flag ICGS2 = $xx This is read only. Should read DCOS before performing any time critical tasks ICGFLTLU/L = $xx Not used in this example ICGTRM Not used in this example MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 191 Chapter 10 Internal Clock Generator (S08ICGV4) RECOVERY FROM STOP RESET INITIALIZE ICG ICGC1 = $7A ICGC2 = $30 CHECK FLL LOCK STATUS LOCK = 1? YES SERVICE INTERRUPT SOURCE (fBus = 4 MHz) NO CHECK FLL LOCK STATUS LOCK = 1? NO YES CONTINUE CONTINUE Figure 10-15. ICG Initialization and Stop Recovery for Example #2 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 192 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.6.4 Example #3: No External Crystal Connection, 5.4 MHz Bus Frequency In this example, the FLL will be used (in FEI mode) to multiply the internal 243 kHz (approximate) reference clock up to 10.8 MHz to achieve 5.4 MHz bus frequency. This system will also use the trim function to fine tune the frequency based on an external reference signal. After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately 8 MHz on ICGOUT which corresponds to a 4 MHz bus frequency (fBus). The clock scheme will be FLL engaged, internal (FEI). So fICGOUT = (fIRG / 7) * P * N / R ; P = 64, fIRG = 243 kHz Eqn. 10-5 Solving for N / R gives: N / R = 10.8 MHz /(243/7 kHz * 64) = 4.86 ; We can choose N = 10 and R = 2. Eqn. 10-6 A trim procedure will be required to hone the frequency to exactly 5.4 MHz. An example of the trim procedure is shown in example #4. The values needed in each register to set up the desired operation are: ICGC1 = $28 (%00101000) Bit 7 HGO 0 Bit 6 RANGE 0 Bit 5 REFS 1 Bits 4:3 CLKS 01 Bit 2 OSCSTEN 0 Bit 1 LOCD 0 Bit 0 0 Configures oscillator for low power Configures oscillator for low-frequency range; FLL prescale factor is 64 Oscillator using crystal or resonator requested (bit is really a don’t care) FLL engaged, internal reference clock mode Disables the oscillator Loss-of-clock enabled Unimplemented or reserved, always reads zero ICGC2 = $31 (%00110001) Bit 7 LOLRE 0 Generates an interrupt request on loss of lock Bit 6:4 MFD 011 Sets the MFD multiplication factor to 10 Bit 3 LOCRE 0 Generates an interrupt request on loss of clock Bit 2:0 RFD 001 Sets the RFD division factor to ÷2 ICGS1 = $xx This is read only except for clearing interrupt flag ICGS2 = $xx This is read only; good idea to read this before performing time critical operations ICGFLTLU/L = $xx Not used in this example MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 193 Chapter 10 Internal Clock Generator (S08ICGV4) ICGTRM = $xx Bit 7:0 TRIM Only need to write when trimming internal oscillator; done in separate operation (see example #4) RECOVERY FROM STOP RESET INITIALIZE ICG ICGC1 = $28 ICGC2 = $31 CHECK FLL LOCK STATUS. LOCK = 1? CHECK FLL LOCK STATUS. LOCK = 1? NO YES NO CONTINUE YES CONTINUE NOTE: THIS WILL REQUIRE THE INTERAL REFERENCE CLOCK TO START AND STABILIZE. Figure 10-16. ICG Initialization and Stop Recovery for Example #3 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 194 Freescale Semiconductor Chapter 10 Internal Clock Generator (S08ICGV4) 10.6.5 Example #4: Internal Clock Generator Trim The internally generated clock source is guaranteed to have a period ± 25% of the nominal value. In some cases, this may be sufficient accuracy. For other applications that require a tight frequency tolerance, a trimming procedure is provided that will allow a very accurate source. This section outlines one example of trimming the internal oscillator. Many other possible trimming procedures are valid and can be used. Initial conditions: 1) Clock supplied from ATE has 500 μsec duty period 2) ICG configured for internal reference with 4 MHz bus START TRIM PROCEDURE ICGTRM = $80, n = 1 MEASURE INCOMING CLOCK WIDTH (COUNT = # OF BUS CLOCKS / 4) COUNT < EXPECTED = 500 (RUNNING TOO SLOW) . CASE STATEMENT COUNT = EXPECTED = 500 COUNT > EXPECTED = 500 (RUNNING TOO FAST) ICGTRM = ICGTRM - 128 / (2**n) (DECREASING ICGTRM INCREASES THE FREQUENCY) ICGTRM = ICGTRM + 128 / (2**n) (INCREASING ICGTRM DECREASES THE FREQUENCY) STORE ICGTRM VALUE IN NON-VOLATILE MEMORY CONTINUE n = n+1 YES IS n > 8? NO Figure 10-17. Trim Procedure In this particular case, the MCU has been attached to a PCB and the entire assembly is undergoing final test with automated test equipment. A separate signal or message is provided to the MCU operating under user provided software control. The MCU initiates a trim procedure as outlined in Figure 10-17 while the tester supplies a precision reference signal. If the intended bus frequency is near the maximum allowed for the device, it is recommended to trim using a reduction divisor (R) twice the final value. After the trim procedure is complete, the reduction divisor can be restored. This will prevent accidental overshoot of the maximum clock frequency. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 195 Chapter 10 Internal Clock Generator (S08ICGV4) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 196 Freescale Semiconductor Chapter 11 Timer Pulse-Width Modulator (S08TPMV2) 11.1 Introduction The TPM uses one input/output (I/O) pin per channel, TPMxCHn where x is the TPM number (for example, 1 or 2) and n is the channel number (for example, 0–4). The TPM shares its I/O pins with general-purpose I/O port pins (refer to the Pins and Connections chapter for more information). The MC9S08LC60 Series has two TPM modules Figure 11-1 shows the MC9S08LC60 Series block diagram with the TPMs highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 197 Chapter 11 Timer Pulse-Width Modulator (S08TPMV2) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 11-1. MC9S08LC60 Series Block Diagram Highlighting TPM Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 198 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) 11.1.1 Features The TPM has the following features: • Each TPM may be configured for buffered, center-aligned pulse-width modulation (CPWM) on all channels • Clock sources independently selectable per TPM (multiple TPMs device) • Selectable clock sources (device dependent): bus clock, fixed system clock, external pin • Clock prescaler taps for divide by 1, 2, 4, 8, 16, 32, 64, or 128 • 16-bit free-running or up/down (CPWM) count operation • 16-bit modulus register to control counter range • Timer system enable • One interrupt per channel plus a terminal count interrupt for each TPM module (multiple TPMs device) • Channel features: — Each channel may be input capture, output compare, or buffered edge-aligned PWM — Rising-edge, falling-edge, or any-edge input capture trigger — Set, clear, or toggle output compare action — Selectable polarity on PWM outputs 11.1.2 Block Diagram Figure 11-2 shows the structure of a TPM. Some MCUs include more than one TPM, with various numbers of channels. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 199 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) BUSCLK XCLK TPMxCLK SYNC CLOCK SOURCE SELECT OFF, BUS, XCLK, EXT CLKSB PRESCALE AND SELECT DIVIDE BY 1, 2, 4, 8, 16, 32, 64, or 128 PS2 CLKSA PS1 PS0 CPWMS MAIN 16-BIT COUNTER TOF COUNTER RESET INTERRUPT LOGIC TOIE 16-BIT COMPARATOR TPMxMODH:TPMxMODL ELS0B CHANNEL 0 ELS0A PORT LOGIC 16-BIT COMPARATOR TPMxC0VH:TPMxC0VL CH0F INTERRUPT LOGIC 16-BIT LATCH INTERNAL BUS CHANNEL 1 MS0B MS0A ELS1B ELS1A CH0IE TPMxCH1 PORT LOGIC 16-BIT COMPARATOR CH1F TPMxC1VH:TPMxC1VL INTERRUPT LOGIC 16-BIT LATCH MS1A ELSnB ELSnA ... ... MS1B CH1IE ... CHANNEL n TPMxCH0 TPMxCHn PORT LOGIC 16-BIT COMPARATOR TPMxCnVH:TPMxCnVL CHnF 16-BIT LATCH MSnB MSnA CHnIE INTERRUPT LOGIC Figure 11-2. TPM Block Diagram The central component of the TPM is the 16-bit counter that can operate as a free-running counter, a modulo counter, or an up-/down-counter when the TPM is configured for center-aligned PWM. The TPM counter (when operating in normal up-counting mode) provides the timing reference for the input capture, output compare, and edge-aligned PWM functions. The timer counter modulo registers, TPMxMODH:TPMxMODL, control the modulo value of the counter. (The values 0x0000 or 0xFFFF effectively make the counter free running.) Software can read the counter value at any time without affecting the counting sequence. Any write to either byte of the TPMxCNT counter resets the counter regardless of the data value written. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 200 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) All TPM channels are programmable independently as input capture, output compare, or buffered edge-aligned PWM channels. 11.2 External Signal Description When any pin associated with the timer is configured as a timer input, a passive pullup can be enabled. After reset, the TPM modules are disabled and all pins default to general-purpose inputs with the passive pullups disabled. 11.2.1 External TPM Clock Sources When control bits CLKSB:CLKSA in the timer status and control register are set to 1:1, the prescaler and consequently the 16-bit counter for TPMx are driven by an external clock source, TPMxCLK, connected to an I/O pin. A synchronizer is needed between the external clock and the rest of the TPM. This synchronizer is clocked by the bus clock so the frequency of the external source must be less than one-half the frequency of the bus rate clock. The upper frequency limit for this external clock source is specified to be one-fourth the bus frequency to conservatively accommodate duty cycle and phase-locked loop (PLL) or frequency-locked loop (FLL) frequency jitter effects. On some devices the external clock input is shared with one of the TPM channels. When a TPM channel is shared as the external clock input, the associated TPM channel cannot use the pin. (The channel can still be used in output compare mode as a software timer.) Also, if one of the TPM channels is used as the external clock input, the corresponding ELSnB:ELSnA control bits must be set to 0:0 so the channel is not trying to use the same pin. 11.2.2 TPMxCHn — TPMx Channel n I/O Pins Each TPM channel is associated with an I/O pin on the MCU. The function of this pin depends on the configuration of the channel. In some cases, no pin function is needed so the pin reverts to being controlled by general-purpose I/O controls. When a timer has control of a port pin, the port data and data direction registers do not affect the related pin(s). See the Pins and Connections chapter for additional information about shared pin functions. 11.3 Register Definition The TPM includes: • An 8-bit status and control register (TPMxSC) • A 16-bit counter (TPMxCNTH:TPMxCNTL) • A 16-bit modulo register (TPMxMODH:TPMxMODL) Each timer channel has: • An 8-bit status and control register (TPMxCnSC) • A 16-bit channel value register (TPMxCnVH:TPMxCnVL) Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address assignments for all TPM registers. This section refers to registers and control bits only by their names. A MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 201 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. Some MCU systems have more than one TPM, so register names include placeholder characters to identify which TPM and which channel is being referenced. For example, TPMxCnSC refers to timer (TPM) x, channel n and TPM1C2SC is the status and control register for timer 1, channel 2. 11.3.1 Timer x Status and Control Register (TPMxSC) TPMxSC contains the overflow status flag and control bits that are used to configure the interrupt enable, TPM configuration, clock source, and prescale divisor. These controls relate to all channels within this timer module. 7 R 6 5 4 3 2 1 0 TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0 0 0 0 0 0 0 0 TOF W Reset 0 = Unimplemented or Reserved Figure 11-3. Timer x Status and Control Register (TPMxSC) Table 11-1. TPMxSC Register Field Descriptions Field Description 7 TOF Timer Overflow Flag — This flag is set when the TPM counter changes to 0x0000 after reaching the modulo value programmed in the TPM counter modulo registers. When the TPM is configured for CPWM, TOF is set after the counter has reached the value in the modulo register, at the transition to the next lower count value. Clear TOF by reading the TPM status and control register when TOF is set and then writing a 0 to TOF. If another TPM overflow occurs before the clearing sequence is complete, the sequence is reset so TOF would remain set after the clear sequence was completed for the earlier TOF. Reset clears TOF. Writing a 1 to TOF has no effect. 0 TPM counter has not reached modulo value or overflow 1 TPM counter has overflowed 6 TOIE Timer Overflow Interrupt Enable — This read/write bit enables TPM overflow interrupts. If TOIE is set, an interrupt is generated when TOF equals 1. Reset clears TOIE. 0 TOF interrupts inhibited (use software polling) 1 TOF interrupts enabled 5 CPWMS Center-Aligned PWM Select — This read/write bit selects CPWM operating mode. Reset clears this bit so the TPM operates in up-counting mode for input capture, output compare, and edge-aligned PWM functions. Setting CPWMS reconfigures the TPM to operate in up-/down-counting mode for CPWM functions. Reset clears CPWMS. 0 All TPMx channels operate as input capture, output compare, or edge-aligned PWM mode as selected by the MSnB:MSnA control bits in each channel’s status and control register 1 All TPMx channels operate in center-aligned PWM mode 4:3 CLKS[B:A] Clock Source Select — As shown in Table 11-2, this 2-bit field is used to disable the TPM system or select one of three clock sources to drive the counter prescaler. The external source and the XCLK are synchronized to the bus clock by an on-chip synchronization circuit. 2:0 PS[2:0] Prescale Divisor Select — This 3-bit field selects one of eight divisors for the TPM clock input as shown in Table 11-3. This prescaler is located after any clock source synchronization or clock source selection, so it affects whatever clock source is selected to drive the TPM system. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 202 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) Table 11-2. TPM Clock Source Selection CLKSB:CLKSA TPM Clock Source to Prescaler Input 0:0 No clock selected (TPMx disabled) 0:1 Bus rate clock (BUSCLK) 1:0 Fixed system clock (XCLK) 1:1 External source (TPMxCLK)1,2 1 The maximum frequency that is allowed as an external clock is one-fourth of the bus frequency. 2 If the external clock input is shared with channel n and is selected as the TPM clock source, the corresponding ELSnB:ELSnA control bits should be set to 0:0 so channel n does not try to use the same pin for a conflicting function. Table 11-3. Prescale Divisor Selection 11.3.2 PS2:PS1:PS0 TPM Clock Source Divided-By 0:0:0 1 0:0:1 2 0:1:0 4 0:1:1 8 1:0:0 16 1:0:1 32 1:1:0 64 1:1:1 128 Timer x Counter Registers (TPMxCNTH:TPMxCNTL) The two read-only TPM counter registers contain the high and low bytes of the value in the TPM counter. Reading either byte (TPMxCNTH or TPMxCNTL) latches the contents of both bytes into a buffer where they remain latched until the other byte is read. This allows coherent 16-bit reads in either order. The coherency mechanism is automatically restarted by an MCU reset, a write of any value to TPMxCNTH or TPMxCNTL, or any write to the timer status/control register (TPMxSC). Reset clears the TPM counter registers. R 7 6 5 4 3 2 1 0 Bit 15 14 13 12 11 10 9 Bit 8 0 0 W Reset Any write to TPMxCNTH clears the 16-bit counter. 0 0 0 0 0 0 Figure 11-4. Timer x Counter Register High (TPMxCNTH) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 203 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) R 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 W Reset Any write to TPMxCNTL clears the 16-bit counter. 0 0 0 0 0 0 Figure 11-5. Timer x Counter Register Low (TPMxCNTL) When background mode is active, the timer counter and the coherency mechanism are frozen such that the buffer latches remain in the state they were in when the background mode became active even if one or both bytes of the counter are read while background mode is active. 11.3.3 Timer x Counter Modulo Registers (TPMxMODH:TPMxMODL) The read/write TPM modulo registers contain the modulo value for the TPM counter. After the TPM counter reaches the modulo value, the TPM counter resumes counting from 0x0000 at the next clock (CPWMS = 0) or starts counting down (CPWMS = 1), and the overflow flag (TOF) becomes set. Writing to TPMxMODH or TPMxMODL inhibits TOF and overflow interrupts until the other byte is written. Reset sets the TPM counter modulo registers to 0x0000, which results in a free-running timer counter (modulo disabled). 7 6 5 4 3 2 1 0 Bit 15 14 13 12 11 10 9 Bit 8 0 0 0 0 0 0 0 0 R W Reset Figure 11-6. Timer x Counter Modulo Register High (TPMxMODH) 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R W Reset Figure 11-7. Timer x Counter Modulo Register Low (TPMxMODL) It is good practice to wait for an overflow interrupt so both bytes of the modulo register can be written well before a new overflow. An alternative approach is to reset the TPM counter before writing to the TPM modulo registers to avoid confusion about when the first counter overflow will occur. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 204 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) 11.3.4 Timer x Channel n Status and Control Register (TPMxCnSC) TPMxCnSC contains the channel interrupt status flag and control bits that are used to configure the interrupt enable, channel configuration, and pin function. 7 6 5 4 3 2 CHnF CHnIE MSnB MSnA ELSnB ELSnA 0 0 0 0 0 0 R 1 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 11-8. Timer x Channel n Status and Control Register (TPMxCnSC) Table 11-4. TPMxCnSC Register Field Descriptions Field Description 7 CHnF Channel n Flag — When channel n is configured for input capture, this flag bit is set when an active edge occurs on the channel n pin. When channel n is an output compare or edge-aligned PWM channel, CHnF is set when the value in the TPM counter registers matches the value in the TPM channel n value registers. This flag is seldom used with center-aligned PWMs because it is set every time the counter matches the channel value register, which correspond to both edges of the active duty cycle period. A corresponding interrupt is requested when CHnF is set and interrupts are enabled (CHnIE = 1). Clear CHnF by reading TPMxCnSC while CHnF is set and then writing a 0 to CHnF. If another interrupt request occurs before the clearing sequence is complete, the sequence is reset so CHnF would remain set after the clear sequence was completed for the earlier CHnF. This is done so a CHnF interrupt request cannot be lost by clearing a previous CHnF. Reset clears CHnF. Writing a 1 to CHnF has no effect. 0 No input capture or output compare event occurred on channel n 1 Input capture or output compare event occurred on channel n 6 CHnIE Channel n Interrupt Enable — This read/write bit enables interrupts from channel n. Reset clears CHnIE. 0 Channel n interrupt requests disabled (use software polling) 1 Channel n interrupt requests enabled 5 MSnB Mode Select B for TPM Channel n — When CPWMS = 0, MSnB = 1 configures TPM channel n for edge-aligned PWM mode. For a summary of channel mode and setup controls, refer to Table 11-5. 4 MSnA Mode Select A for TPM Channel n — When CPWMS = 0 and MSnB = 0, MSnA configures TPM channel n for input capture mode or output compare mode. Refer to Table 11-5 for a summary of channel mode and setup controls. 3:2 ELSn[B:A] Edge/Level Select Bits — Depending on the operating mode for the timer channel as set by CPWMS:MSnB:MSnA and shown in Table 11-5, these bits select the polarity of the input edge that triggers an input capture event, select the level that will be driven in response to an output compare match, or select the polarity of the PWM output. Setting ELSnB:ELSnA to 0:0 configures the related timer pin as a general-purpose I/O pin unrelated to any timer channel functions. This function is typically used to temporarily disable an input capture channel or to make the timer pin available as a general-purpose I/O pin when the associated timer channel is set up as a software timer that does not require the use of a pin. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 205 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) Table 11-5. Mode, Edge, and Level Selection CPWMS MSnB:MSnA ELSnB:ELSnA X XX 00 0 00 01 01 Input capture Capture on falling edge only 11 Capture on rising or falling edge 00 Output compare Software compare only Toggle output on compare 10 Clear output on compare 11 Set output on compare 10 XX Capture on rising edge only 10 Edge-aligned PWM X1 1 Configuration Pin not used for TPM channel; use as an external clock for the TPM or revert to general-purpose I/O 01 1X Mode 10 Center-aligned PWM X1 High-true pulses (clear output on compare) Low-true pulses (set output on compare) High-true pulses (clear output on compare-up) Low-true pulses (set output on compare-up) If the associated port pin is not stable for at least two bus clock cycles before changing to input capture mode, it is possible to get an unexpected indication of an edge trigger. Typically, a program would clear status flags after changing channel configuration bits and before enabling channel interrupts or using the status flags to avoid any unexpected behavior. 11.3.5 Timer x Channel Value Registers (TPMxCnVH:TPMxCnVL) These read/write registers contain the captured TPM counter value of the input capture function or the output compare value for the output compare or PWM functions. The channel value registers are cleared by reset. 7 6 5 4 3 2 1 0 Bit 15 14 13 12 11 10 9 Bit 8 0 0 0 0 0 0 0 0 R W Reset Figure 11-9. Timer x Channel Value Register High (TPMxCnVH) 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R W Reset Figure 11-10. Timer Channel Value Register Low (TPMxCnVL) In input capture mode, reading either byte (TPMxCnVH or TPMxCnVL) latches the contents of both bytes into a buffer where they remain latched until the other byte is read. This latching mechanism also resets (becomes unlatched) when the TPMxCnSC register is written. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 206 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) In output compare or PWM modes, writing to either byte (TPMxCnVH or TPMxCnVL) latches the value into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value into the timer channel value registers. This latching mechanism may be manually reset by writing to the TPMxCnSC register. This latching mechanism allows coherent 16-bit writes in either order, which is friendly to various compiler implementations. 11.4 Functional Description All TPM functions are associated with a main 16-bit counter that allows flexible selection of the clock source and prescale divisor. A 16-bit modulo register also is associated with the main 16-bit counter in the TPM. Each TPM channel is optionally associated with an MCU pin and a maskable interrupt function. The TPM has center-aligned PWM capabilities controlled by the CPWMS control bit in TPMxSC. When CPWMS is set to 1, timer counter TPMxCNT changes to an up-/down-counter and all channels in the associated TPM act as center-aligned PWM channels. When CPWMS = 0, each channel can independently be configured to operate in input capture, output compare, or buffered edge-aligned PWM mode. The following sections describe the main 16-bit counter and each of the timer operating modes (input capture, output compare, edge-aligned PWM, and center-aligned PWM). Because details of pin operation and interrupt activity depend on the operating mode, these topics are covered in the associated mode sections. 11.4.1 Counter All timer functions are based on the main 16-bit counter (TPMxCNTH:TPMxCNTL). This section discusses selection of the clock source, up-counting vs. up-/down-counting, end-of-count overflow, and manual counter reset. After any MCU reset, CLKSB:CLKSA = 0:0 so no clock source is selected and the TPM is inactive. Normally, CLKSB:CLKSA would be set to 0:1 so the bus clock drives the timer counter. The clock source for each of the TPM can be independently selected to be off, the bus clock (BUSCLK), the fixed system clock (XCLK), or an external input. The maximum frequency allowed for the external clock option is one-fourth the bus rate. Refer to Section 11.3.1, “Timer x Status and Control Register (TPMxSC)” and Table 11-2 for more information about clock source selection. When the microcontroller is in active background mode, the TPM temporarily suspends all counting until the microcontroller returns to normal user operating mode. During stop mode, all TPM clocks are stopped; therefore, the TPM is effectively disabled until clocks resume. During wait mode, the TPM continues to operate normally. The main 16-bit counter has two counting modes. When center-aligned PWM is selected (CPWMS = 1), the counter operates in up-/down-counting mode. Otherwise, the counter operates as a simple up-counter. As an up-counter, the main 16-bit counter counts from 0x0000 through its terminal count and then continues with 0x0000. The terminal count is 0xFFFF or a modulus value in TPMxMODH:TPMxMODL. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 207 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) When center-aligned PWM operation is specified, the counter counts upward from 0x0000 through its terminal count and then counts downward to 0x0000 where it returns to up-counting. Both 0x0000 and the terminal count value (value in TPMxMODH:TPMxMODL) are normal length counts (one timer clock period long). An interrupt flag and enable are associated with the main 16-bit counter. The timer overflow flag (TOF) is a software-accessible indication that the timer counter has overflowed. The enable signal selects between software polling (TOIE = 0) where no hardware interrupt is generated, or interrupt-driven operation (TOIE = 1) where a static hardware interrupt is automatically generated whenever the TOF flag is 1. The conditions that cause TOF to become set depend on the counting mode (up or up/down). In up-counting mode, the main 16-bit counter counts from 0x0000 through 0xFFFF and overflows to 0x0000 on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When the main 16-bit counter is operating in up-/down-counting mode, the TOF flag gets set as the counter changes direction at the transition from the value set in the modulus register and the next lower count value. This corresponds to the end of a PWM period. (The 0x0000 count value corresponds to the center of a period.) Because the HCS08 MCU is an 8-bit architecture, a coherency mechanism is built into the timer counter for read operations. Whenever either byte of the counter is read (TPMxCNTH or TPMxCNTL), both bytes are captured into a buffer so when the other byte is read, the value will represent the other byte of the count at the time the first byte was read. The counter continues to count normally, but no new value can be read from either byte until both bytes of the old count have been read. The main timer counter can be reset manually at any time by writing any value to either byte of the timer count TPMxCNTH or TPMxCNTL. Resetting the counter in this manner also resets the coherency mechanism in case only one byte of the counter was read before resetting the count. 11.4.2 Channel Mode Selection Provided CPWMS = 0 (center-aligned PWM operation is not specified), the MSnB and MSnA control bits in the channel n status and control registers determine the basic mode of operation for the corresponding channel. Choices include input capture, output compare, and buffered edge-aligned PWM. 11.4.2.1 Input Capture Mode With the input capture function, the TPM can capture the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the TPM latches the contents of the TPM counter into the channel value registers (TPMxCnVH:TPMxCnVL). Rising edges, falling edges, or any edge may be chosen as the active edge that triggers an input capture. When either byte of the 16-bit capture register is read, both bytes are latched into a buffer to support coherent 16-bit accesses regardless of order. The coherency sequence can be manually reset by writing to the channel status/control register (TPMxCnSC). An input capture event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 208 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) 11.4.2.2 Output Compare Mode With the output compare function, the TPM can generate timed pulses with programmable position, polarity, duration, and frequency. When the counter reaches the value in the channel value registers of an output compare channel, the TPM can set, clear, or toggle the channel pin. In output compare mode, values are transferred to the corresponding timer channel value registers only after both 8-bit bytes of a 16-bit register have been written. This coherency sequence can be manually reset by writing to the channel status/control register (TPMxCnSC). An output compare event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request. 11.4.2.3 Edge-Aligned PWM Mode This type of PWM output uses the normal up-counting mode of the timer counter (CPWMS = 0) and can be used when other channels in the same TPM are configured for input capture or output compare functions. The period of this PWM signal is determined by the setting in the modulus register (TPMxMODH:TPMxMODL). The duty cycle is determined by the setting in the timer channel value register (TPMxCnVH:TPMxCnVL). The polarity of this PWM signal is determined by the setting in the ELSnA control bit. Duty cycle cases of 0 percent and 100 percent are possible. As Figure 11-11 shows, the output compare value in the TPM channel registers determines the pulse width (duty cycle) of the PWM signal. The time between the modulus overflow and the output compare is the pulse width. If ELSnA = 0, the counter overflow forces the PWM signal high and the output compare forces the PWM signal low. If ELSnA = 1, the counter overflow forces the PWM signal low and the output compare forces the PWM signal high. OVERFLOW OVERFLOW OVERFLOW PERIOD PULSE WIDTH TPMxC OUTPUT COMPARE OUTPUT COMPARE OUTPUT COMPARE Figure 11-11. PWM Period and Pulse Width (ELSnA = 0) When the channel value register is set to 0x0000, the duty cycle is 0 percent. By setting the timer channel value register (TPMxCnVH:TPMxCnVL) to a value greater than the modulus setting, 100% duty cycle can be achieved. This implies that the modulus setting must be less than 0xFFFF to get 100% duty cycle. Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to either register, TPMxCnVH or TPMxCnVL, write to buffer registers. In edge-PWM mode, values are transferred to the corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have been written and the value in the TPMxCNTH:TPMxCNTL counter is 0x0000. (The new duty cycle does not take effect until the next full period.) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 209 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) 11.4.3 Center-Aligned PWM Mode This type of PWM output uses the up-/down-counting mode of the timer counter (CPWMS = 1). The output compare value in TPMxCnVH:TPMxCnVL determines the pulse width (duty cycle) of the PWM signal and the period is determined by the value in TPMxMODH:TPMxMODL. TPMxMODH:TPMxMODL should be kept in the range of 0x0001 to 0x7FFF because values outside this range can produce ambiguous results. ELSnA will determine the polarity of the CPWM output. pulse width = 2 x (TPMxCnVH:TPMxCnVL) Eqn. 11-1 period = 2 x (TPMxMODH:TPMxMODL); for TPMxMODH:TPMxMODL = 0x0001–0x7FFF Eqn. 11-2 If the channel value register TPMxCnVH:TPMxCnVL is zero or negative (bit 15 set), the duty cycle will be 0%. If TPMxCnVH:TPMxCnVL is a positive value (bit 15 clear) and is greater than the (nonzero) modulus setting, the duty cycle will be 100% because the duty cycle compare will never occur. This implies the usable range of periods set by the modulus register is 0x0001 through 0x7FFE (0x7FFF if generation of 100% duty cycle is not necessary). This is not a significant limitation because the resulting period is much longer than required for normal applications. TPMxMODH:TPMxMODL = 0x0000 is a special case that should not be used with center-aligned PWM mode. When CPWMS = 0, this case corresponds to the counter running free from 0x0000 through 0xFFFF, but when CPWMS = 1 the counter needs a valid match to the modulus register somewhere other than at 0x0000 in order to change directions from up-counting to down-counting. Figure 11-12 shows the output compare value in the TPM channel registers (multiplied by 2), which determines the pulse width (duty cycle) of the CPWM signal. If ELSnA = 0, the compare match while counting up forces the CPWM output signal low and a compare match while counting down forces the output high. The counter counts up until it reaches the modulo setting in TPMxMODH:TPMxMODL, then counts down until it reaches zero. This sets the period equal to two times TPMxMODH:TPMxMODL. COUNT = 0 COUNT = TPMxMODH:TPMx OUTPUT COMPARE (COUNT UP) OUTPUT COMPARE (COUNT DOWN) COUNT = TPMxMODH:TPMx TPM1C PULSE WIDTH 2x 2x PERIOD Figure 11-12. CPWM Period and Pulse Width (ELSnA = 0) Center-aligned PWM outputs typically produce less noise than edge-aligned PWMs because fewer I/O pin transitions are lined up at the same system clock edge. This type of PWM is also required for some types of motor drives. Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers, TPMxMODH, TPMxMODL, TPMxCnVH, and TPMxCnVL, actually write to buffer registers. Values are MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 210 Freescale Semiconductor Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) transferred to the corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have been written and the timer counter overflows (reverses direction from up-counting to down-counting at the end of the terminal count in the modulus register). This TPMxCNT overflow requirement only applies to PWM channels, not output compares. Optionally, when TPMxCNTH:TPMxCNTL = TPMxMODH:TPMxMODL, the TPM can generate a TOF interrupt at the end of this count. The user can choose to reload any number of the PWM buffers, and they will all update simultaneously at the start of a new period. Writing to TPMxSC cancels any values written to TPMxMODH and/or TPMxMODL and resets the coherency mechanism for the modulo registers. Writing to TPMxCnSC cancels any values written to the channel value registers and resets the coherency mechanism for TPMxCnVH:TPMxCnVL. 11.5 TPM Interrupts The TPM generates an optional interrupt for the main counter overflow and an interrupt for each channel. The meaning of channel interrupts depends on the mode of operation for each channel. If the channel is configured for input capture, the interrupt flag is set each time the selected input capture edge is recognized. If the channel is configured for output compare or PWM modes, the interrupt flag is set each time the main timer counter matches the value in the 16-bit channel value register. See the Resets, Interrupts, and System Configuration chapter for absolute interrupt vector addresses, priority, and local interrupt mask control bits. For each interrupt source in the TPM, a flag bit is set on recognition of the interrupt condition such as timer overflow, channel input capture, or output compare events. This flag may be read (polled) by software to verify that the action has occurred, or an associated enable bit (TOIE or CHnIE) can be set to enable hardware interrupt generation. While the interrupt enable bit is set, a static interrupt will be generated whenever the associated interrupt flag equals 1. It is the responsibility of user software to perform a sequence of steps to clear the interrupt flag before returning from the interrupt service routine. 11.5.1 Clearing Timer Interrupt Flags TPM interrupt flags are cleared by a 2-step process that includes a read of the flag bit while it is set (1) followed by a write of 0 to the bit. If a new event is detected between these two steps, the sequence is reset and the interrupt flag remains set after the second step to avoid the possibility of missing the new event. 11.5.2 Timer Overflow Interrupt Description The conditions that cause TOF to become set depend on the counting mode (up or up/down). In up-counting mode, the 16-bit timer counter counts from 0x0000 through 0xFFFF and overflows to 0x0000 on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When the counter is operating in up-/down-counting mode, the TOF flag gets set as the counter changes direction at the transition from the value set in the modulus register and the next lower count value. This corresponds to the end of a PWM period. (The 0x0000 count value corresponds to the center of a period.) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 211 Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2) 11.5.3 Channel Event Interrupt Description The meaning of channel interrupts depends on the current mode of the channel (input capture, output compare, edge-aligned PWM, or center-aligned PWM). When a channel is configured as an input capture channel, the ELSnB:ELSnA control bits select rising edges, falling edges, any edge, or no edge (off) as the edge that triggers an input capture event. When the selected edge is detected, the interrupt flag is set. The flag is cleared by the 2-step sequence described in Section 11.5.1, “Clearing Timer Interrupt Flags.” When a channel is configured as an output compare channel, the interrupt flag is set each time the main timer counter matches the 16-bit value in the channel value register. The flag is cleared by the 2-step sequence described in Section 11.5.1, “Clearing Timer Interrupt Flags.” 11.5.4 PWM End-of-Duty-Cycle Events For channels that are configured for PWM operation, there are two possibilities: • When the channel is configured for edge-aligned PWM, the channel flag is set when the timer counter matches the channel value register that marks the end of the active duty cycle period. • When the channel is configured for center-aligned PWM, the timer count matches the channel value register twice during each PWM cycle. In this CPWM case, the channel flag is set at the start and at the end of the active duty cycle, which are the times when the timer counter matches the channel value register. The flag is cleared by the 2-step sequence described in Section 11.5.1, “Clearing Timer Interrupt Flags.” MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 212 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) 12.1 Introduction Figure 12-1 shows the MC9S08LC60 Series block diagram with the SCI highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 213 Chapter 12 Serial Communications Interface (S08SCIV3) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 12-1. MC9S08LC60 Series Block Diagram Highlighting SCI Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 214 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) Module Initialization: Write: SCIBDH:SCIBDL to set baud rate Write: SCFC1 to configure 1-wire/2-wire, 9/8-bit data, wakeup, and parity, if used. Write; SCIC2 to configure interrupts, enable Rx and Tx, RWU Enable Rx wakeup, SBK sends break character Write: SCIC3 to enable Rx error interrupt sources. Also controls pin direction in 1-wire modes. R8 and T8 only used in 9-bit data modes. Module Use: Wait for TDRE, then write data to SCID Wait for RDRF, then read data from SCID A small number of applications will use RWU to manage automatic receiver wakeup, SBK to send break characters, and R8 and T8 for 9-bit data. SCIBDH SCIBDL SBR7 SBR6 SBR5 SBR12 SBR11 SBR10 SBR9 SBR8 SBR4 SBR3 SBR2 SBR1 SBR0 Baud rate = BUSCLK / (16 x SBR12:SBR0) SCIC1 LOOPS SCISWAI RSRC M WAKE ILT PE PT RIE ILIE TE RE RWU SBK Module configuration TIE SCIC2 TCIE Local interrupt enables Tx and Rx enable SCIS1 TDRE TC RDRF IDLE Interrupt flags Rx wakeup and send break OR NF FE PF Rx error flags BRK13 SCIS2 RAF Configure LIN support options and monitor receiver activity R8 SCIS3 T8 TXDIR TXINV ORIE NEIE FEIE PEIE R1/T1 R0/T0 Local interrupt enables 9th data bits Rx/Tx pin Tx data path direction in polarity single-wire mode SCIID R7/T7 R6/T6 R5/T5 R4/T4 R3/T3 R2/T2 Read: Rx data; write: Tx data Figure 12-2. SCI Module Quick Start MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 215 Chapter 12 Serial Communications Interface (S08SCIV3) 12.1.1 Features Features of SCI module include: • Full-duplex, standard non-return-to-zero (NRZ) format • Double-buffered transmitter and receiver with separate enables • Programmable baud rates (13-bit modulo divider) • Interrupt-driven or polled operation: — Transmit data register empty and transmission complete — Receive data register full — Receive overrun, parity error, framing error, and noise error — Idle receiver detect • Hardware parity generation and checking • Programmable 8-bit or 9-bit character length • Receiver wakeup by idle-line or address-mark • Optional 13-bit break character • Selectable transmitter output polarity 12.1.2 Modes of Operation See Section 12.3, “Functional Description,” for a detailed description of SCI operation in the different modes. • 8- and 9- bit data modes • Stop modes — SCI is halted during all stop modes • Loop mode • Single-wire mode MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 216 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) 12.1.3 Block Diagram Figure 12-3 shows the transmitter portion of the SCI. (Figure 12-4 shows the receiver portion of the SCI.) INTERNAL BUS (WRITE-ONLY) LOOPS SCID – Tx BUFFER 8 7 6 5 4 3 2 1 PT PREAMBLE (ALL 1s) PARITY GENERATION SHIFT ENABLE PE LOAD FROM SCID SHIFT DIRECTION T8 0 START L TO RECEIVE DATA IN TO TxD PIN LSB H 1 × BAUD RATE CLOCK 11-BIT TRANSMIT SHIFT REGISTER LOOP CONTROL TXINV BREAK (ALL 0s) STOP M RSRC SCI CONTROLS TxD TE SBK TRANSMIT CONTROL TXDIR TxD DIRECTION TO TxD PIN LOGIC BRK13 TDRE TIE TC Tx INTERRUPT REQUEST TCIE Figure 12-3. SCI Transmitter Block Diagram MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 217 Chapter 12 Serial Communications Interface (S08SCIV3) Figure 12-4 shows the receiver portion of the SCI. INTERNAL BUS (READ-ONLY) SCID – Rx BUFFER 16 × BAUD RATE CLOCK 11-BIT RECEIVE SHIFT REGISTER LOOPS RSRC SINGLE-WIRE LOOP CONTROL WAKE ILT 8 MSB ALL 1s H DATA RECOVERY FROM RxD PIN 7 6 5 4 3 2 1 START M LSB STOP DIVIDE BY 16 0 L SHIFT DIRECTION WAKEUP LOGIC RWU FROM TRANSMITTER RDRF RIE IDLE Rx INTERRUPT REQUEST ILIE OR ORIE FE FEIE ERROR INTERRUPT REQUEST NF NEIE PE PT PARITY CHECKING PF PEIE Figure 12-4. SCI Receiver Block Diagram MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 218 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) 12.2 Register Definition The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for transmit/receive data. Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address assignments for all SCI registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. 12.2.1 SCI Baud Rate Registers (SCIBDH, SCIBHL) This pair of registers controls the prescale divisor for SCI baud rate generation. To update the 13-bit baud rate setting [SBR12:SBR0], first write to SCIBDH to buffer the high half of the new value and then write to SCIBDL. The working value in SCIBDH does not change until SCIBDL is written. SCIBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first time the receiver or transmitter is enabled (RE or TE bits in SCIC2 are written to 1). R 7 6 5 0 0 0 4 3 2 1 0 SBR12 SBR11 SBR10 SBR9 SBR8 0 0 0 0 0 W Reset 0 0 0 = Unimplemented or Reserved Figure 12-5. SCI Baud Rate Register (SCIBDH) Table 12-1. SCIBDH Register Field Descriptions Field Description 4:0 SBR[12:8] Baud Rate Modulo Divisor — These 13 bits are referred to collectively as BR, and they set the modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in Table 12-2. 7 6 5 4 3 2 1 0 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 0 0 0 0 0 1 0 0 R W Reset Figure 12-6. SCI Baud Rate Register (SCIBDL) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 219 Chapter 12 Serial Communications Interface (S08SCIV3) Table 12-2. SCIBDL Register Field Descriptions Field Description 7:0 SBR[7:0] Baud Rate Modulo Divisor — These 13 bits are referred to collectively as BR, and they set the modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in Table 12-1. 12.2.2 SCI Control Register 1 (SCIC1) This read/write register is used to control various optional features of the SCI system. 7 6 5 4 3 2 1 0 LOOPS SCISWAI RSRC M WAKE ILT PE PT 0 0 0 0 0 0 0 0 R W Reset Figure 12-7. SCI Control Register 1 (SCIC1) Table 12-3. SCIC1 Register Field Descriptions Field 7 LOOPS 6 SCISWAI 5 RSRC 4 M 3 WAKE 2 ILT Description Loop Mode Select — Selects between loop back modes and normal 2-pin full-duplex modes. When LOOPS = 1, the transmitter output is internally connected to the receiver input. 0 Normal operation — RxD and TxD use separate pins. 1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See RSRC bit.) RxD pin is not used by SCI. SCI Stops in Wait Mode 0 SCI clocks continue to run in wait mode so the SCI can be the source of an interrupt that wakes up the CPU. 1 SCI clocks freeze while CPU is in wait mode. Receiver Source Select — This bit has no meaning or effect unless the LOOPS bit is set to 1. When LOOPS = 1, the receiver input is internally connected to the TxD pin and RSRC determines whether this connection is also connected to the transmitter output. 0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins. 1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input. 9-Bit or 8-Bit Mode Select 0 Normal — start + 8 data bits (LSB first) + stop. 1 Receiver and transmitter use 9-bit data characters start + 8 data bits (LSB first) + 9th data bit + stop. Receiver Wakeup Method Select — Refer to Section 12.3.3.2, “Receiver Wakeup Operation” for more information. 0 Idle-line wakeup. 1 Address-mark wakeup. Idle Line Type Select — Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character do not count toward the 10 or 11 bit times of the logic high level by the idle line detection logic. Refer to Section 12.3.3.2.1, “Idle-Line Wakeup” for more information. 0 Idle character bit count starts after start bit. 1 Idle character bit count starts after stop bit. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 220 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) Table 12-3. SCIC1 Register Field Descriptions (continued) Field Description 1 PE Parity Enable — Enables hardware parity generation and checking. When parity is enabled, the most significant bit (MSB) of the data character (eighth or ninth data bit) is treated as the parity bit. 0 No hardware parity generation or checking. 1 Parity enabled. 0 PT Parity Type — Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total number of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in the data character, including the parity bit, is even. 0 Even parity. 1 Odd parity. 12.2.3 SCI Control Register 2 (SCIC2) This register can be read or written at any time. 7 6 5 4 3 2 1 0 TIE TCIE RIE ILIE TE RE RWU SBK 0 0 0 0 0 0 0 0 R W Reset Figure 12-8. SCI Control Register 2 (SCIC2) Table 12-4. SCIC2 Register Field Descriptions Field 7 TIE 6 TCIE Description Transmit Interrupt Enable (for TDRE) 0 Hardware interrupts from TDRE disabled (use polling). 1 Hardware interrupt requested when TDRE flag is 1. Transmission Complete Interrupt Enable (for TC) 0 Hardware interrupts from TC disabled (use polling). 1 Hardware interrupt requested when TC flag is 1. 5 RIE Receiver Interrupt Enable (for RDRF) 0 Hardware interrupts from RDRF disabled (use polling). 1 Hardware interrupt requested when RDRF flag is 1. 4 ILIE Idle Line Interrupt Enable (for IDLE) 0 Hardware interrupts from IDLE disabled (use polling). 1 Hardware interrupt requested when IDLE flag is 1. 3 TE Transmitter Enable 0 Transmitter off. 1 Transmitter on. TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output for the SCI system. When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of traffic on the single SCI communication line (TxD pin). TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress. Refer to Section 12.3.2.1, “Send Break and Queued Idle,” for more details. When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 221 Chapter 12 Serial Communications Interface (S08SCIV3) Table 12-4. SCIC2 Register Field Descriptions (continued) Field Description 2 RE Receiver Enable — When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin. If LOOPS = 1, the RxD pin reverts to being a general-purpose I/O pin even if RE = 1. 0 Receiver off. 1 Receiver on. 1 RWU Receiver Wakeup Control — This bit can be written to 1 to place the SCI receiver in a standby state where it waits for automatic hardware detection of a selected wakeup condition. The wakeup condition is either an idle line between messages (WAKE = 0, idle-line wakeup), or a logic 1 in the most significant data bit in a character (WAKE = 1, address-mark wakeup). Application software sets RWU and (normally) a selected hardware condition automatically clears RWU. Refer to Section 12.3.3.2, “Receiver Wakeup Operation,” for more details. 0 Normal SCI receiver operation. 1 SCI receiver in standby waiting for wakeup condition. 0 SBK Send Break — Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional break characters of 10 or 11 bit times of logic 0 are queued as long as SBK = 1. Depending on the timing of the set and clear of SBK relative to the information currently being transmitted, a second break character may be queued before software clears SBK. Refer to Section 12.3.2.1, “Send Break and Queued Idle,” for more details. 0 Normal transmitter operation. 1 Queue break character(s) to be sent. 12.2.4 SCI Status Register 1 (SCIS1) This register has eight read-only status flags. Writes have no effect. Special software sequences (which do not involve writing to this register) are used to clear these status flags. R 7 6 5 4 3 2 1 0 TDRE TC RDRF IDLE OR NF FE PF 1 1 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 12-9. SCI Status Register 1 (SCIS1) Table 12-5. SCIS1 Register Field Descriptions Field Description 7 TDRE Transmit Data Register Empty Flag — TDRE is set out of reset and when a transmit data value transfers from the transmit data buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read SCIS1 with TDRE = 1 and then write to the SCI data register (SCID). 0 Transmit data register (buffer) full. 1 Transmit data register (buffer) empty. 6 TC Transmission Complete Flag — TC is set out of reset and when TDRE = 1 and no data, preamble, or break character is being transmitted. 0 Transmitter active (sending data, a preamble, or a break). 1 Transmitter idle (transmission activity complete). TC is cleared automatically by reading SCIS1 with TC = 1 and then doing one of the following three things: • Write to the SCI data register (SCID) to transmit new data • Queue a preamble by changing TE from 0 to 1 • Queue a break character by writing 1 to SBK in SCIC2 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 222 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) Table 12-5. SCIS1 Register Field Descriptions (continued) Field Description 5 RDRF Receive Data Register Full Flag — RDRF becomes set when a character transfers from the receive shifter into the receive data register (SCID). To clear RDRF, read SCIS1 with RDRF = 1 and then read the SCI data register (SCID). 0 Receive data register empty. 1 Receive data register full. 4 IDLE Idle Line Flag — IDLE is set when the SCI receive line becomes idle for a full character time after a period of activity. When ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is all 1s, these bit times and the stop bit time count toward the full character time of logic high (10 or 11 bit times depending on the M control bit) needed for the receiver to detect an idle line. When ILT = 1, the receiver doesn’t start counting idle bit times until after the stop bit. So the stop bit and any logic high bit times at the end of the previous character do not count toward the full character time of logic high needed for the receiver to detect an idle line. To clear IDLE, read SCIS1 with IDLE = 1 and then read the SCI data register (SCID). After IDLE has been cleared, it cannot become set again until after a new character has been received and RDRF has been set. IDLE will get set only once even if the receive line remains idle for an extended period. 0 No idle line detected. 1 Idle line was detected. 3 OR Receiver Overrun Flag — OR is set when a new serial character is ready to be transferred to the receive data register (buffer), but the previously received character has not been read from SCID yet. In this case, the new character (and all associated error information) is lost because there is no room to move it into SCID. To clear OR, read SCIS1 with OR = 1 and then read the SCI data register (SCID). 0 No overrun. 1 Receive overrun (new SCI data lost). 2 NF Noise Flag — The advanced sampling technique used in the receiver takes seven samples during the start bit and three samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples within any bit time in the frame, the flag NF will be set at the same time as the flag RDRF gets set for the character. To clear NF, read SCIS1 and then read the SCI data register (SCID). 0 No noise detected. 1 Noise detected in the received character in SCID. 1 FE Framing Error Flag — FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop bit was expected. This suggests the receiver was not properly aligned to a character frame. To clear FE, read SCIS1 with FE = 1 and then read the SCI data register (SCID). 0 No framing error detected. This does not guarantee the framing is correct. 1 Framing error. 0 PF Parity Error Flag — PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in the received character does not agree with the expected parity value. To clear PF, read SCIS1 and then read the SCI data register (SCID). 0 No parity error. 1 Parity error. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 223 Chapter 12 Serial Communications Interface (S08SCIV3) 12.2.5 SCI Status Register 2 (SCIS2) This register has one read-only status flag. Writes have no effect. R 7 6 5 4 3 0 0 0 0 0 2 1 0 0 RAF 0 0 BRK13 W Reset 0 0 0 0 0 0 = Unimplemented or Reserved Figure 12-10. SCI Status Register 2 (SCIS2) Table 12-6. SCIS2 Register Field Descriptions Field 2 BRK13 0 RAF 12.2.6 Description Break Character Length — BRK13 is used to select a longer break character length. Detection of a framing error is not affected by the state of this bit. 0 Break character is 10 bit times (11 if M = 1) 1 Break character is 13 bit times (14 if M = 1) Receiver Active Flag — RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is cleared automatically when the receiver detects an idle line. This status flag can be used to check whether an SCI character is being received before instructing the MCU to go to stop mode. 0 SCI receiver idle waiting for a start bit. 1 SCI receiver active (RxD input not idle). SCI Control Register 3 (SCIC3) 7 R 6 5 4 3 2 1 0 T8 TXDIR TXINV ORIE NEIE FEIE PEIE 0 0 0 0 0 0 0 R8 W Reset 0 = Unimplemented or Reserved Figure 12-11. SCI Control Register 3 (SCIC3) Table 12-7. SCIC3 Register Field Descriptions Field Description 7 R8 Ninth Data Bit for Receiver — When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a ninth receive data bit to the left of the MSB of the buffered data in the SCID register. When reading 9-bit data, read R8 before reading SCID because reading SCID completes automatic flag clearing sequences which could allow R8 and SCID to be overwritten with new data. 6 T8 Ninth Data Bit for Transmitter — When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a ninth transmit data bit to the left of the MSB of the data in the SCID register. When writing 9-bit data, the entire 9-bit value is transferred to the SCI shift register after SCID is written so T8 should be written (if it needs to change from its previous value) before SCID is written. If T8 does not need to change in the new value (such as when it is used to generate mark or space parity), it need not be written each time SCID is written. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 224 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) Table 12-7. SCIC3 Register Field Descriptions (continued) Field 1 Description 5 TXDIR TxD Pin Direction in Single-Wire Mode — When the SCI is configured for single-wire half-duplex operation (LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin. 0 TxD pin is an input in single-wire mode. 1 TxD pin is an output in single-wire mode. 4 TXINV1 Transmit Data Inversion — Setting this bit reverses the polarity of the transmitted data output. 0 Transmit data not inverted 1 Transmit data inverted 3 ORIE Overrun Interrupt Enable — This bit enables the overrun flag (OR) to generate hardware interrupt requests. 0 OR interrupts disabled (use polling). 1 Hardware interrupt requested when OR = 1. 2 NEIE Noise Error Interrupt Enable — This bit enables the noise flag (NF) to generate hardware interrupt requests. 0 NF interrupts disabled (use polling). 1 Hardware interrupt requested when NF = 1. 1 FEIE Framing Error Interrupt Enable — This bit enables the framing error flag (FE) to generate hardware interrupt requests. 0 FE interrupts disabled (use polling). 1 Hardware interrupt requested when FE = 1. 0 PEIE Parity Error Interrupt Enable — This bit enables the parity error flag (PF) to generate hardware interrupt requests. 0 PF interrupts disabled (use polling). 1 Hardware interrupt requested when PF = 1. Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle. 12.2.7 SCI Data Register (SCID) This register is actually two separate registers. Reads return the contents of the read-only receive data buffer and writes go to the write-only transmit data buffer. Reads and writes of this register are also involved in the automatic flag clearing mechanisms for the SCI status flags. 7 6 5 4 3 2 1 0 R R7 R6 R5 R4 R3 R2 R1 R0 W T7 T6 T5 T4 T3 T2 T1 T0 0 0 0 0 0 0 0 0 Reset Figure 12-12. SCI Data Register (SCID) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 225 Chapter 12 Serial Communications Interface (S08SCIV3) 12.3 Functional Description The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote devices, including other MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block. The transmitter and receiver operate independently, although they use the same baud rate generator. During normal operation, the MCU monitors the status of the SCI, writes the data to be transmitted, and processes received data. The following describes each of the blocks of the SCI. 12.3.1 Baud Rate Generation As shown in Figure 12-13, the clock source for the SCI baud rate generator is the bus-rate clock. MODULO DIVIDE BY (1 THROUGH 8191) BUSCLK SBR12:SBR0 BAUD RATE GENERATOR OFF IF [SBR12:SBR0] = 0 DIVIDE BY 16 Tx BAUD RATE Rx SAMPLING CLOCK (16 × BAUD RATE) BAUD RATE = BUSCLK [SBR12:SBR0] × 16 Figure 12-13. SCI Baud Rate Generation SCI communications require the transmitter and receiver (which typically derive baud rates from independent clock sources) to use the same baud rate. Allowed tolerance on this baud frequency depends on the details of how the receiver synchronizes to the leading edge of the start bit and how bit sampling is performed. The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are no such transitions in the full 10- or 11-bit time character frame so any mismatch in baud rate is accumulated for the whole character time. For a Freescale Semiconductor SCI system whose bus frequency is driven by a crystal, the allowed baud rate mismatch is about ±4.5 percent for 8-bit data format and about ±4 percent for 9-bit data format. Although baud rate modulo divider settings do not always produce baud rates that exactly match standard rates, it is normally possible to get within a few percent, which is acceptable for reliable communications. 12.3.2 Transmitter Functional Description This section describes the overall block diagram for the SCI transmitter, as well as specialized functions for sending break and idle characters. The transmitter block diagram is shown in Figure 12-3. The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter output is inverted by setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIC2. This queues a preamble character that is one full character frame of the idle state. The transmitter then remains idle until data is available in the transmit data buffer. Programs store data into the transmit data buffer by writing to the SCI data register (SCID). The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long depending on the setting in the M control bit. For the remainder of this section, we will assume M = 0, MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 226 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) selecting the normal 8-bit data mode. In 8-bit data mode, the shift register holds a start bit, eight data bits, and a stop bit. When the transmit shift register is available for a new SCI character, the value waiting in the transmit data register is transferred to the shift register (synchronized with the baud rate clock) and the transmit data register empty (TDRE) status flag is set to indicate another character may be written to the transmit data buffer at SCID. If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD1 pin, the transmitter sets the transmit complete flag and enters an idle mode, with TxD1 high, waiting for more characters to transmit. Writing 0 to TE does not immediately release the pin to be a general-purpose I/O pin. Any transmit activity that is in progress must first be completed. This includes data characters in progress, queued idle characters, and queued break characters. 12.3.2.1 Send Break and Queued Idle The SBK control bit in SCIC2 is used to send break characters which were originally used to gain the attention of old teletype receivers. Break characters are a full character time of logic 0 (10 bit times including the start and stop bits). A longer break of 13 bit times can be enabled by setting BRK13 = 1. Normally, a program would wait for TDRE to become set to indicate the last character of a message has moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into the shifter (synchronized to the baud rate clock), an additional break character is queued. If the receiving device is another Freescale Semiconductor SCI, the break characters will be received as 0s in all eight data bits and a framing error (FE = 1) occurs. When idle-line wakeup is used, a full character time of idle (logic 1) is needed between messages to wake up any sleeping receivers. Normally, a program would wait for TDRE to become set to indicate the last character of a message has moved to the transmit shifter, then write 0 and then write 1 to the TE bit. This action queues an idle character to be sent as soon as the shifter is available. As long as the character in the shifter does not finish while TE = 0, the SCI transmitter never actually releases control of the TxD1 pin. If there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin that is shared with TxD1 is an output driving a logic 1. This ensures that the TxD1 line will look like a normal idle line even if the SCI loses control of the port pin between writing 0 and then 1 to TE. The length of the break character is affected by the BRK13 and M bits as shown below. Table 12-8. Break Character Length BRK13 M Break Character Length 0 0 10 bit times 0 1 11 bit times 1 0 13 bit times 1 1 14 bit times MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 227 Chapter 12 Serial Communications Interface (S08SCIV3) 12.3.3 Receiver Functional Description In this section, the receiver block diagram (Figure 12-4) is used as a guide for the overall receiver functional description. Next, the data sampling technique used to reconstruct receiver data is described in more detail. Finally, two variations of the receiver wakeup function are explained. The receiver is enabled by setting the RE bit in SCIC2. Character frames consist of a start bit of logic 0, eight (or nine) data bits (LSB first), and a stop bit of logic 1. For information about 9-bit data mode, refer to Section 12.4.1, “8- and 9-Bit Data Modes.” For the remainder of this discussion, we assume the SCI is configured for normal 8-bit data mode. After receiving the stop bit into the receive shifter, and provided the receive data register is not already full, the data character is transferred to the receive data register and the receive data register full (RDRF) status flag is set. If RDRF was already set indicating the receive data register (buffer) was already full, the overrun (OR) status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the program has one full character time after RDRF is set before the data in the receive data buffer must be read to avoid a receiver overrun. When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading SCID. The RDRF flag is cleared automatically by a 2-step sequence which is normally satisfied in the course of the user’s program that handles receive data. Refer to Section 12.3.4, “Interrupts and Status Flags,” for more details about flag clearing. 12.3.3.1 Data Sampling Technique The SCI receiver uses a 16× baud rate clock for sampling. The receiver starts by taking logic level samples at 16 times the baud rate to search for a falling edge on the RxD1 serial data input pin. A falling edge is defined as a logic 0 sample after three consecutive logic 1 samples. The 16× baud rate clock is used to divide the bit time into 16 segments labeled RT1 through RT16. When a falling edge is located, three more samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and not merely noise. If at least two of these three samples are 0, the receiver assumes it is synchronized to a receive character. The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to determine the logic level for that bit. The logic level is interpreted to be that of the majority of the samples taken during the bit time. In the case of the start bit, the bit is assumed to be 0 if at least two of the samples at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at RT8, RT9, and RT10 are 1s. If any sample in any bit time (including the start and stop bits) in a character frame fails to agree with the logic level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive data buffer. The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample clock is resynchronized to bit times. This improves the reliability of the receiver in the presence of noise or mismatched baud rates. It does not improve worst case analysis because some characters do not have any extra falling edges anywhere in the character frame. In the case of a framing error, provided the received character was not a break character, the sampling logic that searches for a falling edge is filled with three logic 1 samples so that a new start bit can be detected almost immediately. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 228 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) In the case of a framing error, the receiver is inhibited from receiving any new characters until the framing error flag is cleared. The receive shift register continues to function, but a complete character cannot transfer to the receive data buffer if FE is still set. 12.3.3.2 Receiver Wakeup Operation Receiver wakeup is a hardware mechanism that allows an SCI receiver to ignore the characters in a message that is intended for a different SCI receiver. In such a system, all receivers evaluate the first character(s) of each message, and as soon as they determine the message is intended for a different receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIC2. When RWU = 1, it inhibits setting of the status flags associated with the receiver, thus eliminating the software overhead for handling the unimportant message characters. At the end of a message, or at the beginning of the next message, all receivers automatically force RWU to 0 so all receivers wake up in time to look at the first character(s) of the next message. 12.3.3.2.1 Idle-Line Wakeup When WAKE = 0, the receiver is configured for idle-line wakeup. In this mode, RWU is cleared automatically when the receiver detects a full character time of the idle-line level. The M control bit selects 8-bit or 9-bit data mode that determines how many bit times of idle are needed to constitute a full character time (10 or 11 bit times because of the start and stop bits). When the RWU bit is set, the idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register full flag, RDRF. It therefore will not generate an interrupt when this idle character occurs. The receiver will wake up and wait for the next data transmission which will set RDRF and generate an interrupt if enabled. The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle bit counter starts after the start bit so the stop bit and any logic 1s at the end of a character count toward the full character time of idle. When ILT = 1, the idle bit counter does not start until after a stop bit time, so the idle detection is not affected by the data in the last character of the previous message. 12.3.3.2.2 Address-Mark Wakeup When WAKE = 1, the receiver is configured for address-mark wakeup. In this mode, RWU is cleared automatically when the receiver detects a logic 1 in the most significant bit of a received character (eighth bit in M = 0 mode and ninth bit in M = 1 mode). Address-mark wakeup allows messages to contain idle characters but requires that the MSB be reserved for use in address frames. The logic 1 MSB of an address frame clears the receivers RWU bit before the stop bit is received and sets the RDRF flag. 12.3.4 Interrupts and Status Flags The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the cause of the interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events. Another interrupt vector is associated with the receiver for RDRF and IDLE events, and a third vector is used for OR, NF, FE, and PF error conditions. Each of these eight interrupt sources can be separately MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 229 Chapter 12 Serial Communications Interface (S08SCIV3) masked by local interrupt enable masks. The flags can still be polled by software when the local masks are cleared to disable generation of hardware interrupt requests. The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit data register empty (TDRE) indicates when there is room in the transmit data buffer to write another transmit character to SCID. If the transmit interrupt enable (TIE) bit is set, a hardware interrupt will be requested whenever TDRE = 1. Transmit complete (TC) indicates that the transmitter is finished transmitting all data, preamble, and break characters and is idle with TxD1 high. This flag is often used in systems with modems to determine when it is safe to turn off the modem. If the transmit complete interrupt enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1. Instead of hardware interrupts, software polling may be used to monitor the TDRE and TC status flags if the corresponding TIE or TCIE local interrupt masks are 0s. When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive data register by reading SCID. The RDRF flag is cleared by reading SCIS1 while RDRF = 1 and then reading SCID. When polling is used, this sequence is naturally satisfied in the normal course of the user program. If hardware interrupts are used, SCIS1 must be read in the interrupt service routine (ISR). Normally, this is done in the ISR anyway to check for receive errors, so the sequence is automatically satisfied. The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD1 line remains idle for an extended period of time. IDLE is cleared by reading SCIS1 while IDLE = 1 and then reading SCID. After IDLE has been cleared, it cannot become set again until the receiver has received at least one new character and has set RDRF. If the associated error was detected in the received character that caused RDRF to be set, the error flags — noise flag (NF), framing error (FE), and parity error flag (PF) — get set at the same time as RDRF. These flags are not set in overrun cases. If RDRF was already set when a new character is ready to be transferred from the receive shifter to the receive data buffer, the overrun (OR) flag gets set instead and the data and any associated NF, FE, or PF condition is lost. 12.4 Additional SCI Functions The following sections describe additional SCI functions. 12.4.1 8- and 9-Bit Data Modes The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the M control bit in SCIC1. In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data register. For the transmit data buffer, this bit is stored in T8 in SCIC3. For the receiver, the ninth bit is held in R8 in SCIC3. For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCID. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 230 Freescale Semiconductor Chapter 12 Serial Communications Interface (S08SCIV3) If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character, it is not necessary to write to T8 again. When data is transferred from the transmit data buffer to the transmit shifter, the value in T8 is copied at the same time data is transferred from SCID to the shifter. 9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the ninth bit. Or it is used with address-mark wakeup so the ninth data bit can serve as the wakeup bit. In custom protocols, the ninth bit can also serve as a software-controlled marker. 12.4.2 Stop Mode Operation During all stop modes, clocks to the SCI module are halted. In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these two stop modes. No SCI module registers are affected in stop3 mode. Note, because the clocks are halted, the SCI module will resume operation upon exit from stop (only in stop3 mode). Software should ensure stop mode is not entered while there is a character being transmitted out of or received into the SCI module. 12.4.3 Loop Mode When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1). Loop mode is sometimes used to check software, independent of connections in the external system, to help isolate system problems. In this mode, the transmitter output is internally connected to the receiver input and the RxD1 pin is not used by the SCI, so it reverts to a general-purpose port I/O pin. 12.4.4 Single-Wire Operation When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or single-wire mode (RSRC = 1). Single-wire mode is used to implement a half-duplex serial connection. The receiver is internally connected to the transmitter output and to the TxD1 pin. The RxD1 pin is not used and reverts to a general-purpose port I/O pin. In single-wire mode, the TXDIR bit in SCIC3 controls the direction of serial data on the TxD1 pin. When TXDIR = 0, the TxD1 pin is an input to the SCI receiver and the transmitter is temporarily disconnected from the TxD1 pin so an external device can send serial data to the receiver. When TXDIR = 1, the TxD1 pin is an output driven by the transmitter. In single-wire mode, the internal loop back connection from the transmitter to the receiver causes the receiver to receive characters that are sent out by the transmitter. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 231 Chapter 12 Serial Communications Interface (S08SCIV3) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 232 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.1 Introduction The MC9S08LC60 Series contains two SPI modules. Figure 13-1 shows the MC9S08LC60 Series block diagram with the SPIs highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 233 Chapter 13 Serial Peripheral Interface (S08SPIV3) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 13-1. MC9S08LC60 Series Block Diagram Highlighting SPI Blocks and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 234 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.1.1 Features Features of the SPI module include: • Master or slave mode operation • Full-duplex or single-wire bidirectional option • Programmable transmit bit rate • Double-buffered transmit and receive • Serial clock phase and polarity options • Slave select output • Selectable MSB-first or LSB-first shifting 13.1.2 Block Diagrams This section includes block diagrams showing SPI system connections, the internal organization of the SPI module, and the SPI clock dividers that control the master mode bit rate. 13.1.2.1 SPI System Block Diagram Figure 13-2 shows the SPI modules of two MCUs connected in a master-slave arrangement. The master device initiates all SPI data transfers. During a transfer, the master shifts data out (on the MOSI pin) to the slave while simultaneously shifting data in (on the MISO pin) from the slave. The transfer effectively exchanges the data that was in the SPI shift registers of the two SPI systems. The SPSCK signal is a clock output from the master and an input to the slave. The slave device must be selected by a low level on the slave select input (SS pin). In this system, the master device has configured its SS pin as an optional slave select output. SLAVE MASTER MOSI MOSI SPI SHIFTER 7 6 5 4 3 2 SPI SHIFTER 1 0 MISO SPSCK CLOCK GENERATOR SS MISO 7 6 5 4 3 2 1 0 SPSCK SS Figure 13-2. SPI System Connections MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 235 Chapter 13 Serial Peripheral Interface (S08SPIV3) The most common uses of the SPI system include connecting simple shift registers for adding input or output ports or connecting small peripheral devices such as serial A/D or D/A converters. Although Figure 13-2 shows a system where data is exchanged between two MCUs, many practical systems involve simpler connections where data is unidirectionally transferred from the master MCU to a slave or from a slave to the master MCU. 13.1.2.2 SPI Module Block Diagram Figure 13-3 is a block diagram of the SPI module. The central element of the SPI is the SPI shift register. Data is written to the double-buffered transmitter (write to SPIxD) and gets transferred to the SPI shift register at the start of a data transfer. After shifting in a byte of data, the data is transferred into the double-buffered receiver where it can be read (read from SPIxD). Pin multiplexing logic controls connections between MCU pins and the SPI module. When the SPI is configured as a master, the clock output is routed to the SPSCK pin, the shifter output is routed to MOSI, and the shifter input is routed from the MISO pin. When the SPI is configured as a slave, the SPSCK pin is routed to the clock input of the SPI, the shifter output is routed to MISO, and the shifter input is routed from the MOSI pin. In the external SPI system, simply connect all SPSCK pins to each other, all MISO pins together, and all MOSI pins together. Peripheral devices often use slightly different names for these pins. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 236 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) PIN CONTROL M SPE MOSI (MOMI) S Tx BUFFER (WRITE SPIxD) ENABLE SPI SYSTEM M SHIFT OUT SPI SHIFT REGISTER SHIFT IN MISO (SISO) S SPC0 Rx BUFFER (READ SPIxD) BIDIROE SHIFT DIRECTION LSBFE SHIFT CLOCK Rx BUFFER FULL Tx BUFFER EMPTY MASTER CLOCK BUS RATE CLOCK CLOCK LOGIC SPIBR CLOCK GENERATOR MSTR SLAVE CLOCK MASTER/SLAVE M SPSCK S MASTER/ SLAVE MODE SELECT MODFEN SSOE MODE FAULT DETECTION SS SPRF SPTEF SPTIE MODF SPIE SPI INTERRUPT REQUEST Figure 13-3. SPI Module Block Diagram 13.1.3 SPI Baud Rate Generation As shown in Figure 13-4, the clock source for the SPI baud rate generator is the bus clock. The three prescale bits (SPPR2:SPPR1:SPPR0) choose a prescale divisor of 1, 2, 3, 4, 5, 6, 7, or 8. The three rate select bits (SPR2:SPR1:SPR0) divide the output of the prescaler stage by 2, 4, 8, 16, 32, 64, 128, or 256 to get the internal SPI master mode bit-rate clock. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 237 Chapter 13 Serial Peripheral Interface (S08SPIV3) BUS CLOCK PRESCALER CLOCK RATE DIVIDER DIVIDE BY 1, 2, 3, 4, 5, 6, 7, or 8 DIVIDE BY 2, 4, 8, 16, 32, 64, 128, or 256 SPPR2:SPPR1:SPPR0 SPR2:SPR1:SPR0 MASTER SPI BIT RATE Figure 13-4. SPI Baud Rate Generation 13.2 External Signal Description The SPI optionally shares four port pins. The function of these pins depends on the settings of SPI control bits. When the SPI is disabled (SPE = 0), these four pins revert to being general-purpose port I/O pins that are not controlled by the SPI. 13.2.1 SPSCK — SPI Serial Clock When the SPI is enabled as a slave, this pin is the serial clock input. When the SPI is enabled as a master, this pin is the serial clock output. 13.2.2 MOSI — Master Data Out, Slave Data In When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this pin is the serial data output. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data input. If SPC0 = 1 to select single-wire bidirectional mode, and master mode is selected, this pin becomes the bidirectional data I/O pin (MOMI). Also, the bidirectional mode output enable bit determines whether the pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and slave mode is selected, this pin is not used by the SPI and reverts to being a general-purpose port I/O pin. 13.2.3 MISO — Master Data In, Slave Data Out When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this pin is the serial data input. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data output. If SPC0 = 1 to select single-wire bidirectional mode, and slave mode is selected, this pin becomes the bidirectional data I/O pin (SISO) and the bidirectional mode output enable bit determines whether the pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and master mode is selected, this pin is not used by the SPI and reverts to being a general-purpose port I/O pin. 13.2.4 SS — Slave Select When the SPI is enabled as a slave, this pin is the low-true slave select input. When the SPI is enabled as a master and mode fault enable is off (MODFEN = 0), this pin is not used by the SPI and reverts to being a general-purpose port I/O pin. When the SPI is enabled as a master and MODFEN = 1, the slave select output enable bit determines whether this pin acts as the mode fault input (SSOE = 0) or as the slave select output (SSOE = 1). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 238 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.3 Modes of Operation 13.3.1 SPI in Stop Modes The SPI is disabled in all stop modes, regardless of the settings before executing the STOP instruction. During either stop1 or stop2 mode, the SPI module will be fully powered down. Upon wake-up from stop1 or stop2 mode, the SPI module will be in the reset state. During stop3 mode, clocks to the SPI module are halted. No registers are affected. If stop3 is exited with a reset, the SPI will be put into its reset state. If stop3 is exited with an interrupt, the SPI continues from the state it was in when stop3 was entered. 13.4 Register Definition The SPI has five 8-bit registers to select SPI options, control baud rate, report SPI status, and for transmit/receive data. Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address assignments for all SPI registers. This section refers to registers and control bits only by their names, and a Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. 13.4.1 SPI Control Register 1 (SPIxC1) This read/write register includes the SPI enable control, interrupt enables, and configuration options. 7 6 5 4 3 2 1 0 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE 0 0 0 0 0 1 0 0 R W Reset Figure 13-5. SPI Control Register 1 (SPIxC1) Table 13-1. SPIxC1 Field Descriptions Field Description 7 SPIE SPI Interrupt Enable (for SPRF and MODF) — This is the interrupt enable for SPI receive buffer full (SPRF) and mode fault (MODF) events. 0 Interrupts from SPRF and MODF inhibited (use polling) 1 When SPRF or MODF is 1, request a hardware interrupt 6 SPE SPI System Enable — Disabling the SPI halts any transfer that is in progress, clears data buffers, and initializes internal state machines. SPRF is cleared and SPTEF is set to indicate the SPI transmit data buffer is empty. 0 SPI system inactive 1 SPI system enabled 5 SPTIE SPI Transmit Interrupt Enable — This is the interrupt enable bit for SPI transmit buffer empty (SPTEF). 0 Interrupts from SPTEF inhibited (use polling) 1 When SPTEF is 1, hardware interrupt requested MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 239 Chapter 13 Serial Peripheral Interface (S08SPIV3) Table 13-1. SPIxC1 Field Descriptions (continued) Field Description 4 MSTR Master/Slave Mode Select 0 SPI module configured as a slave SPI device 1 SPI module configured as a master SPI device 3 CPOL Clock Polarity — This bit effectively places an inverter in series with the clock signal from a master SPI or to a slave SPI device. Refer to Section 13.5.1, “SPI Clock Formats” for more details. 0 Active-high SPI clock (idles low) 1 Active-low SPI clock (idles high) 2 CPHA Clock Phase — This bit selects one of two clock formats for different kinds of synchronous serial peripheral devices. Refer to Section 13.5.1, “SPI Clock Formats” for more details. 0 First edge on SPSCK occurs at the middle of the first cycle of an 8-cycle data transfer 1 First edge on SPSCK occurs at the start of the first cycle of an 8-cycle data transfer 1 SSOE Slave Select Output Enable — This bit is used in combination with the mode fault enable (MODFEN) bit in SPCR2 and the master/slave (MSTR) control bit to determine the function of the SS pin as shown in Table 13-2. 0 LSBFE LSB First (Shifter Direction) 0 SPI serial data transfers start with most significant bit 1 SPI serial data transfers start with least significant bit Table 13-2. SS Pin Function MODFEN SSOE Master Mode Slave Mode 0 0 General-purpose I/O (not SPI) Slave select input 0 1 General-purpose I/O (not SPI) Slave select input 1 0 SS input for mode fault Slave select input 1 1 Automatic SS output Slave select input NOTE Ensure that the SPI should not be disabled (SPE=0) at the same time as a bit change to the CPHA bit. These changes should be performed as separate operations or unexpected behavior may occur. 13.4.2 SPI Control Register 2 (SPIxC2) This read/write register is used to control optional features of the SPI system. Bits 7, 6, 5, and 2 are not implemented and always read 0. R 7 6 5 0 0 0 4 3 MODFEN BIDIROE 0 0 2 1 0 SPISWAI SPC0 0 0 0 W Reset 0 0 0 0 = Unimplemented or Reserved Figure 13-6. SPI Control Register 2 (SPIxC2) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 240 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) Table 13-3. SPIxC2 Register Field Descriptions Field Description 4 MODFEN Master Mode-Fault Function Enable — When the SPI is configured for slave mode, this bit has no meaning or effect. (The SS pin is the slave select input.) In master mode, this bit determines how the SS pin is used (refer to Table 13-2 for more details). 0 Mode fault function disabled, master SS pin reverts to general-purpose I/O not controlled by SPI 1 Mode fault function enabled, master SS pin acts as the mode fault input or the slave select output 3 BIDIROE Bidirectional Mode Output Enable — When bidirectional mode is enabled by SPI pin control 0 (SPC0) = 1, BIDIROE determines whether the SPI data output driver is enabled to the single bidirectional SPI I/O pin. Depending on whether the SPI is configured as a master or a slave, it uses either the MOSI (MOMI) or MISO (SISO) pin, respectively, as the single SPI data I/O pin. When SPC0 = 0, BIDIROE has no meaning or effect. 0 Output driver disabled so SPI data I/O pin acts as an input 1 SPI I/O pin enabled as an output 1 SPISWAI SPI Stop in Wait Mode 0 SPI clocks continue to operate in wait mode 1 SPI clocks stop when the MCU enters wait mode 0 SPC0 13.4.3 SPI Pin Control 0 — The SPC0 bit chooses single-wire bidirectional mode. If MSTR = 0 (slave mode), the SPI uses the MISO (SISO) pin for bidirectional SPI data transfers. If MSTR = 1 (master mode), the SPI uses the MOSI (MOMI) pin for bidirectional SPI data transfers. When SPC0 = 1, BIDIROE is used to enable or disable the output driver for the single bidirectional SPI I/O pin. 0 SPI uses separate pins for data input and data output 1 SPI configured for single-wire bidirectional operation SPI Baud Rate Register (SPIxBR) This register is used to set the prescaler and bit rate divisor for an SPI master. This register may be read or written at any time. 7 R 6 5 4 3 SPPR2 SPPR1 SPPR0 0 0 0 0 2 1 0 SPR2 SPR1 SPR0 0 0 0 0 W Reset 0 0 = Unimplemented or Reserved Figure 13-7. SPI Baud Rate Register (SPIxBR) Table 13-4. SPIxBR Register Field Descriptions Field Description 6:4 SPPR[2:0] SPI Baud Rate Prescale Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate prescaler as shown in Table 13-5. The input to this prescaler is the bus rate clock (BUSCLK). The output of this prescaler drives the input of the SPI baud rate divider (see Figure 13-4). 2:0 SPR[2:0] SPI Baud Rate Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate divider as shown in Table 13-6. The input to this divider comes from the SPI baud rate prescaler (see Figure 13-4). The output of this divider is the SPI bit rate clock for master mode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 241 Chapter 13 Serial Peripheral Interface (S08SPIV3) Table 13-5. SPI Baud Rate Prescaler Divisor SPPR2:SPPR1:SPPR0 Prescaler Divisor 0:0:0 1 0:0:1 2 0:1:0 3 0:1:1 4 1:0:0 5 1:0:1 6 1:1:0 7 1:1:1 8 Table 13-6. SPI Baud Rate Divisor 13.4.4 SPR2:SPR1:SPR0 Rate Divisor 0:0:0 2 0:0:1 4 0:1:0 8 0:1:1 16 1:0:0 32 1:0:1 64 1:1:0 128 1:1:1 256 SPI Status Register (SPIxS) This register has three read-only status bits. Bits 6, 3, 2, 1, and 0 are not implemented and always read 0. Writes have no meaning or effect. R 7 6 5 4 3 2 1 0 SPRF 0 SPTEF MODF 0 0 0 0 0 0 1 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 13-8. SPI Status Register (SPIxS) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 242 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) Table 13-7. SPIxS Register Field Descriptions Field Description 7 SPRF SPI Read Buffer Full Flag — SPRF is set at the completion of an SPI transfer to indicate that received data may be read from the SPI data register (SPIxD). SPRF is cleared by reading SPRF while it is set, then reading the SPI data register. 0 No data available in the receive data buffer 1 Data available in the receive data buffer 5 SPTEF SPI Transmit Buffer Empty Flag — This bit is set when there is room in the transmit data buffer. It is cleared by reading SPIxS with SPTEF set, followed by writing a data value to the transmit buffer at SPIxD. SPIxS must be read with SPTEF = 1 before writing data to SPIxD or the SPIxD write will be ignored. SPTEF generates an SPTEF CPU interrupt request if the SPTIE bit in the SPIxC1 is also set. SPTEF is automatically set when a data byte transfers from the transmit buffer into the transmit shift register. For an idle SPI (no data in the transmit buffer or the shift register and no transfer in progress), data written to SPIxD is transferred to the shifter almost immediately so SPTEF is set within two bus cycles allowing a second 8-bit data value to be queued into the transmit buffer. After completion of the transfer of the value in the shift register, the queued value from the transmit buffer will automatically move to the shifter and SPTEF will be set to indicate there is room for new data in the transmit buffer. If no new data is waiting in the transmit buffer, SPTEF simply remains set and no data moves from the buffer to the shifter. 0 SPI transmit buffer not empty 1 SPI transmit buffer empty 4 MODF Master Mode Fault Flag — MODF is set if the SPI is configured as a master and the slave select input goes low, indicating some other SPI device is also configured as a master. The SS pin acts as a mode fault error input only when MSTR = 1, MODFEN = 1, and SSOE = 0; otherwise, MODF will never be set. MODF is cleared by reading MODF while it is 1, then writing to SPI control register 1 (SPIxC1). 0 No mode fault error 1 Mode fault error detected 13.4.5 SPI Data Register (SPIxD) 7 6 5 4 3 2 1 0 Bit 7 6 5 4 3 2 1 Bit 0 0 0 0 0 0 0 0 0 R W Reset Figure 13-9. SPI Data Register (SPIxD) Reads of this register return the data read from the receive data buffer. Writes to this register write data to the transmit data buffer. When the SPI is configured as a master, writing data to the transmit data buffer initiates an SPI transfer. Data should not be written to the transmit data buffer unless the SPI transmit buffer empty flag (SPTEF) is set, indicating there is room in the transmit buffer to queue a new transmit byte. Data may be read from SPIxD any time after SPRF is set and before another transfer is finished. Failure to read the data out of the receive data buffer before a new transfer ends causes a receive overrun condition and the data from the new transfer is lost. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 243 Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.5 Functional Description An SPI transfer is initiated by checking for the SPI transmit buffer empty flag (SPTEF = 1) and then writing a byte of data to the SPI data register (SPIxD) in the master SPI device. When the SPI shift register is available, this byte of data is moved from the transmit data buffer to the shifter, SPTEF is set to indicate there is room in the buffer to queue another transmit character if desired, and the SPI serial transfer starts. During the SPI transfer, data is sampled (read) on the MISO pin at one SPSCK edge and shifted, changing the bit value on the MOSI pin, one-half SPSCK cycle later. After eight SPSCK cycles, the data that was in the shift register of the master has been shifted out the MOSI pin to the slave while eight bits of data were shifted in the MISO pin into the master’s shift register. At the end of this transfer, the received data byte is moved from the shifter into the receive data buffer and SPRF is set to indicate the data can be read by reading SPIxD. If another byte of data is waiting in the transmit buffer at the end of a transfer, it is moved into the shifter, SPTEF is set, and a new transfer is started. Normally, SPI data is transferred most significant bit (MSB) first. If the least significant bit first enable (LSBFE) bit is set, SPI data is shifted LSB first. When the SPI is configured as a slave, its SS pin must be driven low before a transfer starts and SS must stay low throughout the transfer. If a clock format where CPHA = 0 is selected, SS must be driven to a logic 1 between successive transfers. If CPHA = 1, SS may remain low between successive transfers. See Section 13.5.1, “SPI Clock Formats” for more details. Because the transmitter and receiver are double buffered, a second byte, in addition to the byte currently being shifted out, can be queued into the transmit data buffer, and a previously received character can be in the receive data buffer while a new character is being shifted in. The SPTEF flag indicates when the transmit buffer has room for a new character. The SPRF flag indicates when a received character is available in the receive data buffer. The received character must be read out of the receive buffer (read SPIxD) before the next transfer is finished or a receive overrun error results. In the case of a receive overrun, the new data is lost because the receive buffer still held the previous character and was not ready to accept the new data. There is no indication for such an overrun condition so the application system designer must ensure that previous data has been read from the receive buffer before a new transfer is initiated. 13.5.1 SPI Clock Formats To accommodate a wide variety of synchronous serial peripherals from different manufacturers, the SPI system has a clock polarity (CPOL) bit and a clock phase (CPHA) control bit to select one of four clock formats for data transfers. CPOL selectively inserts an inverter in series with the clock. CPHA chooses between two different clock phase relationships between the clock and data. Figure 13-10 shows the clock formats when CPHA = 1. At the top of the figure, the eight bit times are shown for reference with bit 1 starting at the first SPSCK edge and bit 8 ending one-half SPSCK cycle after the sixteenth SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending on the setting in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms applies for a specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the MOSI input of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 244 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) pin from a master and the MISO waveform applies to the MISO output from a slave. The SS OUT waveform applies to the slave select output from a master (provided MODFEN and SSOE = 1). The master SS output goes to active low one-half SPSCK cycle before the start of the transfer and goes back high at the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a slave. BIT TIME # (REFERENCE) 1 2 ... 6 7 8 BIT 7 BIT 0 BIT 6 BIT 1 ... ... BIT 2 BIT 5 BIT 1 BIT 6 BIT 0 BIT 7 SPSCK (CPOL = 0) SPSCK (CPOL = 1) SAMPLE IN (MISO OR MOSI) MOSI (MASTER OUT) MSB FIRST LSB FIRST MISO (SLAVE OUT) SS OUT (MASTER) SS IN (SLAVE) Figure 13-10. SPI Clock Formats (CPHA = 1) When CPHA = 1, the slave begins to drive its MISO output when SS goes to active low, but the data is not defined until the first SPSCK edge. The first SPSCK edge shifts the first bit of data from the shifter onto the MOSI output of the master and the MISO output of the slave. The next SPSCK edge causes both the master and the slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the third SPSCK edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled, and shifts the second data bit value out the other end of the shifter to the MOSI and MISO outputs of the master and slave, respectively. When CHPA = 1, the slave’s SS input is not required to go to its inactive high level between transfers. Figure 13-11 shows the clock formats when CPHA = 0. At the top of the figure, the eight bit times are shown for reference with bit 1 starting as the slave is selected (SS IN goes low), and bit 8 ends at the last SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending on the setting MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 245 Chapter 13 Serial Peripheral Interface (S08SPIV3) in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms applies for a specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the MOSI input of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output pin from a master and the MISO waveform applies to the MISO output from a slave. The SS OUT waveform applies to the slave select output from a master (provided MODFEN and SSOE = 1). The master SS output goes to active low at the start of the first bit time of the transfer and goes back high one-half SPSCK cycle after the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a slave. BIT TIME # (REFERENCE) 1 2 BIT 7 BIT 0 BIT 6 BIT 1 ... 6 7 8 BIT 2 BIT 5 BIT 1 BIT 6 BIT 0 BIT 7 SPSCK (CPOL = 0) SPSCK (CPOL = 1) SAMPLE IN (MISO OR MOSI) MOSI (MASTER OUT) MSB FIRST LSB FIRST ... ... MISO (SLAVE OUT) SS OUT (MASTER) SS IN (SLAVE) Figure 13-11. SPI Clock Formats (CPHA = 0) When CPHA = 0, the slave begins to drive its MISO output with the first data bit value (MSB or LSB depending on LSBFE) when SS goes to active low. The first SPSCK edge causes both the master and the slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the second SPSCK edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled and shifts the second data bit value out the other end of the shifter to the MOSI and MISO outputs of the master and slave, respectively. When CPHA = 0, the slave’s SS input must go to its inactive high level between transfers. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 246 Freescale Semiconductor Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.5.2 SPI Interrupts There are three flag bits, two interrupt mask bits, and one interrupt vector associated with the SPI system. The SPI interrupt enable mask (SPIE) enables interrupts from the SPI receiver full flag (SPRF) and mode fault flag (MODF). The SPI transmit interrupt enable mask (SPTIE) enables interrupts from the SPI transmit buffer empty flag (SPTEF). When one of the flag bits is set, and the associated interrupt mask bit is set, a hardware interrupt request is sent to the CPU. If the interrupt mask bits are cleared, software can poll the associated flag bits instead of using interrupts. The SPI interrupt service routine (ISR) should check the flag bits to determine what event caused the interrupt. The service routine should also clear the flag bit(s) before returning from the ISR (usually near the beginning of the ISR). 13.5.3 Mode Fault Detection A mode fault occurs and the mode fault flag (MODF) becomes set when a master SPI device detects an error on the SS pin (provided the SS pin is configured as the mode fault input signal). The SS pin is configured to be the mode fault input signal when MSTR = 1, mode fault enable is set (MODFEN = 1), and slave select output enable is clear (SSOE = 0). The mode fault detection feature can be used in a system where more than one SPI device might become a master at the same time. The error is detected when a master’s SS pin is low, indicating that some other SPI device is trying to address this master as if it were a slave. This could indicate a harmful output driver conflict, so the mode fault logic is designed to disable all SPI output drivers when such an error is detected. When a mode fault is detected, MODF is set and MSTR is cleared to change the SPI configuration back to slave mode. The output drivers on the SPSCK, MOSI, and MISO (if not bidirectional mode) are disabled. MODF is cleared by reading it while it is set, then writing to the SPI control register 1 (SPIxC1). User software should verify the error condition has been corrected before changing the SPI back to master mode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 247 Chapter 13 Serial Peripheral Interface (S08SPIV3) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 248 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.1 Introduction The inter-integrated circuit (IIC) provides a method of communication between a number of devices. The interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The maximum communication length and the number of devices that can be connected are limited by a maximum bus capacitance of 400 pF. Figure 14-1 is the MC9S08LC60 Series block diagram with the IIC block highlighted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 249 Chapter 14 Inter-Integrated Circuit (S08IICV1) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 14-1. MC9S08LC60 Series Block Diagram Highlighting IIC Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 250 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.1.1 Features The IIC includes these distinctive features: • Compatible with IIC bus standard • Multi-master operation • Software programmable for one of 64 different serial clock frequencies • Software selectable acknowledge bit • Interrupt driven byte-by-byte data transfer • Arbitration lost interrupt with automatic mode switching from master to slave • Calling address identification interrupt • START and STOP signal generation/detection • Repeated START signal generation • Acknowledge bit generation/detection • Bus busy detection 14.1.2 Modes of Operation The IIC functions the same in normal and monitor modes. A brief description of the IIC in the various MCU modes is given here. • Run mode — This is the basic mode of operation. To conserve power in this mode, disable the module. • Wait mode — The module will continue to operate while the MCU is in wait mode and can provide a wake-up interrupt. • Stop mode — The IIC is inactive in stop3 mode for reduced power consumption. The STOP instruction does not affect IIC register states. Stop2 and stop1 will reset the register contents. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 251 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.1.3 Block Diagram Figure 14-2 is a block diagram of the IIC. ADDRESS DATA BUS INTERRUPT ADDR_DECODE CTRL_REG DATA_MUX FREQ_REG ADDR_REG STATUS_REG DATA_REG INPUT SYNC START STOP ARBITRATION CONTROL CLOCK CONTROL IN/OUT DATA SHIFT REGISTER ADDRESS COMPARE SCL SDA Figure 14-2. IIC Functional Block Diagram 14.2 External Signal Description This section describes each user-accessible pin signal. 14.2.1 SCL — Serial Clock Line The bidirectional SCL is the serial clock line of the IIC system. 14.2.2 SDA — Serial Data Line The bidirectional SDA is the serial data line of the IIC system. 14.3 Register Definition This section consists of the IIC register descriptions in address order. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 252 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address assignments for all IIC registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. 14.3.1 IIC Address Register (IICA) 7 6 5 4 3 2 1 0 0 R ADDR W Reset 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-3. IIC Address Register (IICA) Table 14-1. IICA Register Field Descriptions Field Description 7:1 ADDR[7:1] IIC Address Register — The ADDR contains the specific slave address to be used by the IIC module. This is the address the module will respond to when addressed as a slave. 14.3.2 IIC Frequency Divider Register (IICF) 7 6 5 4 3 2 1 0 0 0 0 R MULT ICR W Reset 0 0 0 0 0 Figure 14-4. IIC Frequency Divider Register (IICF) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 253 Chapter 14 Inter-Integrated Circuit (S08IICV1) Table 14-2. IICA Register Field Descriptions Field Description 7:6 MULT IIC Multiplier Factor — The MULT bits define the multiplier factor mul. This factor is used along with the SCL divider to generate the IIC baud rate. The multiplier factor mul as defined by the MULT bits is provided below. 00 mul = 01 01 mul = 02 10 mul = 04 11 Reserved 5:0 ICR IIC Clock Rate — The ICR bits are used to prescale the bus clock for bit rate selection. These bits are used to define the SCL divider and the SDA hold value. The SCL divider multiplied by the value provided by the MULT register (multiplier factor mul) is used to generate IIC baud rate. IIC baud rate = bus speed (Hz)/(mul * SCL divider) SDA hold time is the delay from the falling edge of the SCL (IIC clock) to the changing of SDA (IIC data). The ICR is used to determine the SDA hold value. SDA hold time = bus period (s) * SDA hold value Table 14-3 provides the SCL divider and SDA hold values for corresponding values of the ICR. These values can be used to set IIC baud rate and SDA hold time. For example: Bus speed = 8 MHz MULT is set to 01 (mul = 2) Desired IIC baud rate = 100 kbps IIC baud rate = bus speed (Hz)/(mul * SCL divider) 100000 = 8000000/(2*SCL divider) SCL divider = 40 Table 14-3 shows that ICR must be set to 0B to provide an SCL divider of 40 and that this will result in an SDA hold value of 9. SDA hold time = bus period (s) * SDA hold value SDA hold time = 1/8000000 * 9 = 1.125 μs If the generated SDA hold value is not acceptable, the MULT bits can be used to change the ICR. This will result in a different SDA hold value. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 254 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) Table 14-3. IIC Divider and Hold Values ICR (hex) SCL Divider SDA Hold Value ICR (hex) SCL Divider SDA Hold Value 00 20 7 20 160 17 01 22 7 21 192 17 02 24 8 22 224 33 03 26 8 23 256 33 04 28 9 24 288 49 05 30 9 25 320 49 06 34 10 26 384 65 07 40 10 27 480 65 08 28 7 28 320 33 09 32 7 29 384 33 0A 36 9 2A 448 65 0B 40 9 2B 512 65 0C 44 11 2C 576 97 0D 48 11 2D 640 97 0E 56 13 2E 768 129 0F 68 13 2F 960 129 10 48 9 30 640 65 11 56 9 31 768 65 12 64 13 32 896 129 13 72 13 33 1024 129 14 80 17 34 1152 193 15 88 17 35 1280 193 16 104 21 36 1536 257 17 128 21 37 1920 257 18 80 9 38 1280 129 19 96 9 39 1536 129 1A 112 17 3A 1792 257 1B 128 17 3B 2048 257 1C 144 25 3C 2304 385 1D 160 25 3D 2560 385 1E 192 33 3E 3072 513 1F 240 33 3F 3840 513 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 255 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.3.3 IIC Control Register (IICC) 7 6 5 4 3 IICEN IICIE MST TX TXAK R W Reset 2 1 0 0 0 0 0 0 RSTA 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-5. IIC Control Register (IICC) Table 14-4. IICC Register Field Descriptions Field Description 7 IICEN IIC Enable — The IICEN bit determines whether the IIC module is enabled. 0 IIC is not enabled. 1 IIC is enabled. 6 IICIE IIC Interrupt Enable — The IICIE bit determines whether an IIC interrupt is requested. 0 IIC interrupt request not enabled. 1 IIC interrupt request enabled. 5 MST Master Mode Select — The MST bit is changed from a 0 to a 1 when a START signal is generated on the bus and master mode is selected. When this bit changes from a 1 to a 0 a STOP signal is generated and the mode of operation changes from master to slave. 0 Slave Mode. 1 Master Mode. 4 TX Transmit Mode Select — The TX bit selects the direction of master and slave transfers. In master mode this bit should be set according to the type of transfer required. Therefore, for address cycles, this bit will always be high. When addressed as a slave this bit should be set by software according to the SRW bit in the status register. 0 Receive. 1 Transmit. 3 TXAK Transmit Acknowledge Enable — This bit specifies the value driven onto the SDA during data acknowledge cycles for both master and slave receivers. 0 An acknowledge signal will be sent out to the bus after receiving one data byte. 1 No acknowledge signal response is sent. 2 RSTA Repeat START — Writing a one to this bit will generate a repeated START condition provided it is the current master. This bit will always be read as a low. Attempting a repeat at the wrong time will result in loss of arbitration. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 256 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.3.4 IIC Status Register (IICS) 7 R 6 5 TCF 4 BUSY IAAS 3 2 0 SRW ARBL 1 0 RXAK IICIF W Reset 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-6. IIC Status Register (IICS) Table 14-5. IICS Register Field Descriptions Field Description 7 TCF Transfer Complete Flag — This bit is set on the completion of a byte transfer. Note that this bit is only valid during or immediately following a transfer to the IIC module or from the IIC module.The TCF bit is cleared by reading the IICD register in receive mode or writing to the IICD in transmit mode. 0 Transfer in progress. 1 Transfer complete. 6 IAAS Addressed as a Slave — The IAAS bit is set when the calling address matches the programmed slave address. Writing the IICC register clears this bit. 0 Not addressed. 1 Addressed as a slave. 5 BUSY Bus Busy — The BUSY bit indicates the status of the bus regardless of slave or master mode. The BUSY bit is set when a START signal is detected and cleared when a STOP signal is detected. 0 Bus is idle. 1 Bus is busy. 4 ARBL Arbitration Lost — This bit is set by hardware when the arbitration procedure is lost. The ARBL bit must be cleared by software, by writing a one to it. 0 Standard bus operation. 1 Loss of arbitration. 2 SRW Slave Read/Write — When addressed as a slave the SRW bit indicates the value of the R/W command bit of the calling address sent to the master. 0 Slave receive, master writing to slave. 1 Slave transmit, master reading from slave. 1 IICIF IIC Interrupt Flag — The IICIF bit is set when an interrupt is pending. This bit must be cleared by software, by writing a one to it in the interrupt routine. One of the following events can set the IICIF bit: • One byte transfer completes • Match of slave address to calling address • Arbitration lost 0 No interrupt pending. 1 Interrupt pending. 0 RXAK Receive Acknowledge — When the RXAK bit is low, it indicates an acknowledge signal has been received after the completion of one byte of data transmission on the bus. If the RXAK bit is high it means that no acknowledge signal is detected. 0 Acknowledge received. 1 No acknowledge received. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 257 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.3.5 IIC Data I/O Register (IICD) 7 6 5 4 3 2 1 0 0 0 0 0 R DATA W Reset 0 0 0 0 Figure 14-7. IIC Data I/O Register (IICD) Table 14-6. IICD Register Field Descriptions Field Description 7:0 DATA Data — In master transmit mode, when data is written to the IICD, a data transfer is initiated. The most significant bit is sent first. In master receive mode, reading this register initiates receiving of the next byte of data. NOTE When transmitting out of master receive mode, the IIC mode should be switched before reading the IICD register to prevent an inadvertent initiation of a master receive data transfer. In slave mode, the same functions are available after an address match has occurred. Note that the TX bit in IICC must correctly reflect the desired direction of transfer in master and slave modes for the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is desired, then reading the IICD will not initiate the receive. Reading the IICD will return the last byte received while the IIC is configured in either master receive or slave receive modes. The IICD does not reflect every byte that is transmitted on the IIC bus, nor can software verify that a byte has been written to the IICD correctly by reading it back. In master transmit mode, the first byte of data written to IICD following assertion of MST is used for the address transfer and should comprise of the calling address (in bit 7–bit 1) concatenated with the required R/W bit (in position bit 0). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 258 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.4 Functional Description This section provides a complete functional description of the IIC module. 14.4.1 IIC Protocol The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices connected to it must have open drain or open collector outputs. A logic AND function is exercised on both lines with external pull-up resistors. The value of these resistors is system dependent. Normally, a standard communication is composed of four parts: • START signal • Slave address transmission • Data transfer • STOP signal The STOP signal should not be confused with the CPU STOP instruction. The IIC bus system communication is described briefly in the following sections and illustrated in Figure 14-8. MSB SCL SDA 1 LSB 2 3 4 5 6 7 START SIGNAL 1 XXX 3 4 5 6 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 7 8 9 READ/ ACK WRITE BIT 1 XX 9 NO STOP ACK SIGNAL BIT MSB AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W CALLING ADDRESS 1 DATA BYTE LSB 2 LSB READ/ ACK WRITE BIT CALLING ADDRESS MSB SDA 9 AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W START SIGNAL SCL 8 MSB LSB 2 3 4 5 6 7 8 9 AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W REPEATED START SIGNAL NEW CALLING ADDRESS READ/ NO STOP SIGNAL WRITE ACK BIT Figure 14-8. IIC Bus Transmission Signals MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 259 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.4.1.1 START Signal When the bus is free; i.e., no master device is engaging the bus (both SCL and SDA lines are at logical high), a master may initiate communication by sending a START signal. As shown in Figure 14-8, a START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle states. 14.4.1.2 Slave Address Transmission The first byte of data transferred immediately after the START signal is the slave address transmitted by the master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired direction of data transfer. 1 = Read transfer, the slave transmits data to the master. 0 = Write transfer, the master transmits data to the slave. Only the slave with a calling address that matches the one transmitted by the master will respond by sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 14-8). No two slaves in the system may have the same address. If the IIC module is the master, it must not transmit an address that is equal to its own slave address. The IIC cannot be master and slave at the same time. However, if arbitration is lost during an address cycle, the IIC will revert to slave mode and operate correctly even if it is being addressed by another master. 14.4.1.3 Data Transfer Before successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction specified by the R/W bit sent by the calling master. All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address information for the slave device Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while SCL is high as shown in Figure 14-8. There is one clock pulse on SCL for each data bit, the MSB being transferred first. Each data byte is followed by a 9th (acknowledge) bit, which is signalled from the receiving device. An acknowledge is signalled by pulling the SDA low at the ninth clock. In summary, one complete data transfer needs nine clock pulses. If the slave receiver does not acknowledge the master in the 9th bit time, the SDA line must be left high by the slave. The master interprets the failed acknowledge as an unsuccessful data transfer. If the master receiver does not acknowledge the slave transmitter after a data byte transmission, the slave interprets this as an end of data transfer and releases the SDA line. In either case, the data transfer is aborted and the master does one of two things: • Relinquishes the bus by generating a STOP signal. • Commences a new calling by generating a repeated START signal. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 260 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.4.1.4 STOP Signal The master can terminate the communication by generating a STOP signal to free the bus. However, the master may generate a START signal followed by a calling command without generating a STOP signal first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while SCL at logical 1 (see Figure 14-8). The master can generate a STOP even if the slave has generated an acknowledge at which point the slave must release the bus. 14.4.1.5 Repeated START Signal As shown in Figure 14-8, a repeated START signal is a START signal generated without first generating a STOP signal to terminate the communication. This is used by the master to communicate with another slave or with the same slave in different mode (transmit/receive mode) without releasing the bus. 14.4.1.6 Arbitration Procedure The IIC bus is a true multi-master bus that allows more than one master to be connected on it. If two or more masters try to control the bus at the same time, a clock synchronization procedure determines the bus clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest one among the masters. The relative priority of the contending masters is determined by a data arbitration procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case, the transition from master to slave mode does not generate a STOP condition. Meanwhile, a status bit is set by hardware to indicate loss of arbitration. 14.4.1.7 Clock Synchronization Because wire-AND logic is performed on the SCL line, a high-to-low transition on the SCL line affects all the devices connected on the bus. The devices start counting their low period and after a device’s clock has gone low, it holds the SCL line low until the clock high state is reached. However, the change of low to high in this device clock may not change the state of the SCL line if another device clock is still within its low period. Therefore, synchronized clock SCL is held low by the device with the longest low period. Devices with shorter low periods enter a high wait state during this time (see Figure 14-9). When all devices concerned have counted off their low period, the synchronized clock SCL line is released and pulled high. There is then no difference between the device clocks and the state of the SCL line and all the devices start counting their high periods. The first device to complete its high period pulls the SCL line low again. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 261 Chapter 14 Inter-Integrated Circuit (S08IICV1) DELAY START COUNTING HIGH PERIOD SCL1 SCL2 SCL INTERNAL COUNTER RESET Figure 14-9. IIC Clock Synchronization 14.4.1.8 Handshaking The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces the master clock into wait states until the slave releases the SCL line. 14.4.1.9 Clock Stretching The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After the master has driven SCL low the slave can drive SCL low for the required period and then release it. If the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low period is stretched. 14.5 Resets The IIC is disabled after reset. The IIC cannot cause an MCU reset. 14.6 Interrupts The IIC generates a single interrupt. An interrupt from the IIC is generated when any of the events in Table 14-7 occur provided the IICIE bit is set. The interrupt is driven by bit IICIF (of the IIC status register) and masked with bit IICIE (of the IIC control register). The IICIF bit must be cleared by software by writing a one to it in the interrupt routine. The user can determine the interrupt type by reading the status register. Table 14-7. Interrupt Summary Interrupt Source Status Flag Local Enable Complete 1-byte transfer TCF IICIF IICIE Match of received calling address IAAS IICIF IICIE Arbitration Lost ARBL IICIF IICIE MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 262 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.6.1 Byte Transfer Interrupt The TCF (transfer complete flag) bit is set at the falling edge of the 9th clock to indicate the completion of byte transfer. 14.6.2 Address Detect Interrupt When the calling address matches the programmed slave address (IIC address register), the IAAS bit in the status register is set. The CPU is interrupted provided the IICIE is set. The CPU must check the SRW bit and set its Tx mode accordingly. 14.6.3 Arbitration Lost Interrupt The IIC is a true multi-master bus that allows more than one master to be connected on it. If two or more masters try to control the bus at the same time, the relative priority of the contending masters is determined by a data arbitration procedure. The IIC module asserts this interrupt when it loses the data arbitration process and the ARBL bit in the status register is set. Arbitration is lost in the following circumstances: • SDA sampled as a low when the master drives a high during an address or data transmit cycle. • SDA sampled as a low when the master drives a high during the acknowledge bit of a data receive cycle. • A START cycle is attempted when the bus is busy. • A repeated START cycle is requested in slave mode. • A STOP condition is detected when the master did not request it. This bit must be cleared by software by writing a one to it. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 263 Chapter 14 Inter-Integrated Circuit (S08IICV1) 14.7 1. 2. 3. 4. 1. 2. 3. 4. 5. 6. 7. Initialization/Application Information Module Initialization (Slave) Write: IICA — to set the slave address Write: IICC — to enable IIC and interrupts Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data Initialize RAM variables used to achieve the routine shown in Figure 14-11 Module Initialization (Master) Write: IICF — to set the IIC baud rate (example provided in this chapter) Write: IICC — to enable IIC and interrupts Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data Initialize RAM variables used to achieve the routine shown in Figure 14-11 Write: IICC — to enable TX Write: IICC — to enable MST (master mode) Write: IICD — with the address of the target slave. (The LSB of this byte will determine whether the communication is master receive or transmit.) Module Use The routine shown in Figure 14-11 can handle both master and slave IIC operations. For slave operation, an incoming IIC message that contains the proper address will begin IIC communication. For master operation, communication must be initiated by writing to the IICD register. Register Model 0 ADDR IICA Address to which the module will respond when addressed as a slave (in slave mode) MULT IICF ICR Baud rate = BUSCLK / (2 x MULT x (SCL DIVIDER)) IICC IICEN IICIE MST TX TXAK RSTA 0 0 BUSY ARBL 0 SRW IICIF RXAK Module configuration IICS TCF IAAS Module status flags IICD DATA Data register; Write to transmit IIC data read to read IIC data Figure 14-10. IIC Module Quick Start MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 264 Freescale Semiconductor Chapter 14 Inter-Integrated Circuit (S08IICV1) Clear IICIF Master Mode ? Y TX N Y RX Tx/Rx ? Arbitration Lost ? N Last Byte Transmitted ? N Clear ARBL Y RXAK=0 ? Last Byte to Be Read ? N N N Y Y IAAS=1 ? Y IAAS=1 ? Y N Address Transfer Y End of Addr Cycle (Master Rx) ? Y Y (Read) 2nd Last Byte to Be Read ? N SRW=1 ? Write Next Byte to IICD Set TXACK =1 Generate Stop Signal (MST = 0) Switch to Rx Mode Dummy Read from IICD Generate Stop Signal (MST = 0) TX Y Set TX Mode Read Data from IICD and Store ACK from Receiver ? N Read Data from IICD and Store Tx Next Byte Write Data to IICD RX TX/RX ? N (Write) N Data Transfer Set RX Mode Switch to Rx Mode Dummy Read from IICD Dummy Read from IICD RTI Figure 14-11. Typical IIC Interrupt Routine MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 265 Chapter 14 Inter-Integrated Circuit (S08IICV1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 266 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.1 Introduction The 12-bit analog-to-digital converter (ADC) is a successive approximation ADC designed for operation within an integrated microcontroller system-on-chip. 15.1.1 ADC Configuration Information The ADC channel assignments, alternate clock function, and hardware trigger function are configured as described in this section for the MC9S08LC60/36/20 Family of devices. 15.1.1.1 Channel Assignments The ADC channel assignments for the MC9S08LC60/36/20 devices are shown in Table 15-1. Reserved channels convert to an unknown value. Table 15-1. ADC Channel Assignment 1 ADCH Channel Input Pin Control ADCH Channel Input Pin Control 00000 AD0 PTA0/ADP0 ADPC0 10000 AD16 VREFL N/A 00001 AD1 PTA1/ADP1 ADPC1 10001 AD17 VREFL N/A 00010 AD2 PTA2/ADP2 ADPC2 10010 AD18 VREFL N/A 00011 AD3 PTA3/ADP3 ADPC3 10011 AD19 VSS N/A 00100 AD4 PTA4/ADP4 ADPC4 10100 AD20 VLCD N/A 00101 AD5 PTA5/ADP5 ADPC5 10101 AD21 VLL1 N/A 00110 AD6 PTA6/ADP6 ADPC6 10110 AD22 VDDASW N/A 00111 AD7 PTA7/ADP7 ADPC7 10111 AD23 VDDA N/A 01000 AD8 VREFL N/A 11000 AD24 VDDSW N/A 01001 AD9 VREFL N/A 11001 AD25 VDD N/A 01010 AD10 VREFL N/A 11010 AD26 Temperature Sensor N/A Internal Bandgap1 01011 AD11 VREFL N/A 11011 AD27 01100 AD12 VREFL N/A 11100 VREFH VREFH N/A N/A 01101 AD13 VREFL N/A 11101 VREFH VREFH N/A 01110 AD14 VREFL N/A 11110 VREFL VREFL N/A 01111 AD15 VREFL N/A 11111 Module Disabled None N/A Requires BGBE =1 in SPMSC1 see Section 5.8.8, “System Power Management Status and Control 1 Register (SPMSC1)”. For value of bandgap voltage reference see Section A.5, “DC Characteristics”. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 267 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.1.1.2 Alternate Clock The ADC is capable of performing conversions using the MCU bus clock, the bus clock divided by two, or the local asynchronous clock (ADACK) within the module. The alternate clock, ALTCLK, input for the MC9S08LC60/36/20 MCU devices is not implemented. 15.1.1.3 Hardware Trigger The ADC hardware trigger, ADHWT, is output from the real-time interrupt (RTI) counter. The RTI counter can be clocked by either ICGERCLK or a nominal 1-kHz clock source within the RTI block. The period of the RTI is determined by the input clock frequency and the RTIS bits. The RTI counter is a free running counter that generates an overflow at the RTI rate determined by the RTIS bits. When the ADC hardware trigger is enabled, a conversion is initiated upon a RTI counter overflow. The RTI can be configured to cause a hardware trigger in MCU run, wait, and stop3. 15.1.1.4 Analog Pin Enables The ADC on MC9S08LC60/36/20 MCU devices contains only one analog pin enable registers, APCTL1. 15.1.1.5 Temperature Sensor To use the on-chip temperature sensor, the user must perform the following: 1. Configure ADC for long sample with a maximum of 1-MHz clock. 2. Convert the bandgap voltage reference channel (AD27). By converting the digital value of the bandgap voltage reference channel using the value of VBG, the user can determine VDD. For value of bandgap voltage, see Section A.5, “DC Characteristics”. 3. Convert the temperature sensor channel (AD26). By using the calculated value of VDD, convert the digital value of AD26 into a voltage, Vtemp Equation 15-1 provides an approximate transfer function of the on-chip temperature sensor for: VDD = 3.0 V, Temp = 25˚C, using the ADC at fADCK = 1.0 MHz, and configured for long sample. TempC = (Vtemp – 0.7013) ÷ (0.0017) Eqn. 15-1 0.0017 is the uncalibrated voltage versus temperature slope in V/˚C. Uncalibrated accuracy of the temperature sensor is approximately ± 12˚C, using Equation 15-1. 4. To improve accuracy, the user should calibrate the bandgap voltage reference and temperature sensor. — Calibrating at 25˚C will improve accuracy to 4.5˚C. — Calibration at three temperature points (–40˚C, 25˚C, and 125˚C) will improve accuracy to ± 2.5˚C. After calibration has been completed, the user must calculate the slope for both hot and cold. In application code, the user would then calculate the temperature using Equation 15-1 and then determine whether the temperature is above or below 25˚C. After determining whether the temperature is above or below 25˚C, the user can recalculate the temperature using either the hot or cold slope value obtained during calibration. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 268 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.1.1.6 Low-Power Mode Operation The ADC is capable of running in stop3 mode but requires LVDSE in SPMSC1 to be set. HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD BKP 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) HCS08 SYSTEM CONTROL RTI COP IRQ LVD USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) IRQ (TPM2) (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM 2-CHANNEL TIMER/PWM VOLTAGE REGULATOR VREFH VREFL VDDAD VSSAD PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 RxD PORT C LOW-POWER OSCILLATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) USER RAM INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 15-1. MC9S08LC60 Series Block Diagram Highlighting ADC Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 269 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.1.2 Features Features of the ADC module include: • Linear successive approximation algorithm with 12 bits resolution • Up to 28 analog inputs • Output formatted in 12-, 10- or 8-bit right-justified format • Single or continuous conversion (automatic return to idle after single conversion) • Configurable sample time and conversion speed/power • Conversion complete flag and interrupt • Input clock selectable from up to four sources • Operation in wait or stop3 modes for lower noise operation • Asynchronous clock source for lower noise operation • Selectable asynchronous hardware conversion trigger • Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value 15.1.3 Block Diagram Figure 15-2 provides a block diagram of the ADC module. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 270 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) ADIV ADLPC MODE ADLSMP ADTRG 2 ADCO ADCH 1 ADCCFG complete COCO ADCSC1 ADICLK Compare true AIEN 3 Async Clock Gen ADACK MCU STOP ADCK ÷2 ALTCLK abort transfer sample initialize ••• AD0 convert Control Sequencer ADHWT Bus Clock Clock Divide AIEN 1 Interrupt COCO 2 ADVIN SAR Converter AD27 VREFH Data Registers Sum VREFL Compare true 3 Compare Value Registers ACFGT Value Compare Logic ADCSC2 Figure 15-2. ADC Block Diagram 15.2 External Signal Description The ADC module supports up to 28 separate analog inputs. It also requires four supply/reference/ground connections. Table 15-2. Signal Properties Name Function AD27–AD0 Analog Channel inputs VREFH High reference voltage VREFL Low reference voltage VDDAD Analog power supply VSSAD Analog ground MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 271 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.2.1 Analog Power (VDDAD) The ADC analog portion uses VDDAD as its power connection. In some packages, VDDAD is connected internally to VDD. If externally available, connect the VDDAD pin to the same voltage potential as VDD. External filtering may be necessary to ensure clean VDDAD for good results. 15.2.2 Analog Ground (VSSAD) The ADC analog portion uses VSSAD as its ground connection. In some packages, VSSAD is connected internally to VSS. If externally available, connect the VSSAD pin to the same voltage potential as VSS. 15.2.3 Voltage Reference High (VREFH) VREFH is the high reference voltage for the converter. In some packages, VREFH is connected internally to VDDAD. If externally available, VREFH may be connected to the same potential as VDDAD, or may be driven by an external source that is between the minimum VDDAD spec and the VDDAD potential (VREFH must never exceed VDDAD). 15.2.4 Voltage Reference Low (VREFL) VREFL is the low reference voltage for the converter. In some packages, VREFL is connected internally to VSSAD. If externally available, connect the VREFL pin to the same voltage potential as VSSAD. 15.2.5 Analog Channel Inputs (ADx) The ADC module supports up to 28 separate analog inputs. An input is selected for conversion through the ADCH channel select bits. 15.3 Register Definition These memory mapped registers control and monitor operation of the ADC: • • • • • • Status and control register, ADCSC1 Status and control register, ADCSC2 Data result registers, ADCRH and ADCRL Compare value registers, ADCCVH and ADCCVL Configuration register, ADCCFG Pin enable registers, APCTL1, APCTL2, APCTL3 15.3.1 Status and Control Register 1 (ADCSC1) This section describes the function of the ADC status and control register (ADCSC1). Writing ADCSC1 aborts the current conversion and initiates a new conversion (if the ADCH bits are equal to a value other than all 1s). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 272 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 7 R 6 5 4 AIEN ADCO 0 0 3 2 1 0 1 1 COCO ADCH W Reset: 0 1 1 1 = Unimplemented or Reserved Figure 15-3. Status and Control Register (ADCSC1) Table 15-3. ADCSC1 Register Field Descriptions Field Description 7 COCO Conversion Complete Flag — The COCO flag is a read-only bit which is set each time a conversion is completed when the compare function is disabled (ACFE = 0). When the compare function is enabled (ACFE = 1) the COCO flag is set upon completion of a conversion only if the compare result is true. This bit is cleared whenever ADCSC1 is written or whenever ADCRL is read. 0 Conversion not completed 1 Conversion completed 6 AIEN Interrupt Enable — AIEN is used to enable conversion complete interrupts. When COCO becomes set while AIEN is high, an interrupt is asserted. 0 Conversion complete interrupt disabled 1 Conversion complete interrupt enabled 5 ADCO Continuous Conversion Enable — ADCO is used to enable continuous conversions. 0 One conversion following a write to the ADCSC1 when software triggered operation is selected, or one conversion following assertion of ADHWT when hardware triggered operation is selected. 1 Continuous conversions initiated following a write to ADCSC1 when software triggered operation is selected. Continuous conversions are initiated by an ADHWT event when hardware triggered operation is selected. 4:0 ADCH Input Channel Select — The ADCH bits form a 5-bit field which is used to select one of the input channels. The input channels are detailed in Figure 15-4. The successive approximation converter subsystem is turned off when the channel select bits are all set to 1. This feature allows for explicit disabling of the ADC and isolation of the input channel from all sources. Terminating continuous conversions this way will prevent an additional, single conversion from being performed. It is not necessary to set the channel select bits to all 1s to place the ADC in a low-power state when continuous conversions are not enabled because the module automatically enters a low-power state when a conversion completes. Figure 15-4. Input Channel Select ADCH Input Select ADCH Input Select 00000 AD0 10000 AD16 00001 AD1 10001 AD17 00010 AD2 10010 AD18 00011 AD3 10011 AD19 00100 AD4 10100 AD20 00101 AD5 10101 AD21 00110 AD6 10110 AD22 00111 AD7 10111 AD23 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 273 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Figure 15-4. Input Channel Select (continued) 15.3.2 ADCH Input Select ADCH Input Select 01000 AD8 11000 AD24 01001 AD9 11001 AD25 01010 AD10 11010 AD26 01011 AD11 11011 AD27 01100 AD12 11100 Reserved 01101 AD13 11101 VREFH 01110 AD14 11110 VREFL 01111 AD15 11111 Module disabled Status and Control Register 2 (ADCSC2) The ADCSC2 register is used to control the compare function, conversion trigger and conversion active of the ADC module. 7 R 6 5 4 ADTRG ACFE ACFGT 0 0 0 ADACT 3 2 0 0 0 0 1 0 R1 R1 0 0 W Reset: 0 = Unimplemented or Reserved 1 Bits 1 and 0 are reserved bits that must always be written to 0. Figure 15-5. Status and Control Register 2 (ADCSC2) Table 15-4. ADCSC2 Register Field Descriptions Field Description 7 ADACT Conversion Active — ADACT indicates that a conversion is in progress. ADACT is set when a conversion is initiated and cleared when a conversion is completed or aborted. 0 Conversion not in progress 1 Conversion in progress 6 ADTRG Conversion Trigger Select — ADTRG is used to select the type of trigger to be used for initiating a conversion. Two types of trigger are selectable: software trigger and hardware trigger. When software trigger is selected, a conversion is initiated following a write to ADCSC1. When hardware trigger is selected, a conversion is initiated following the assertion of the ADHWT input. 0 Software trigger selected 1 Hardware trigger selected MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 274 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Table 15-4. ADCSC2 Register Field Descriptions (continued) Field 5 ACFE 4 ACFGT 15.3.3 Description Compare Function Enable — ACFE is used to enable the compare function. 0 Compare function disabled 1 Compare function enabled Compare Function Greater Than Enable — ACFGT is used to configure the compare function to trigger when the result of the conversion of the input being monitored is greater than or equal to the compare value. The compare function defaults to triggering when the result of the compare of the input being monitored is less than the compare value. 0 Compare triggers when input is less than compare level 1 Compare triggers when input is greater than or equal to compare level Data Result High Register (ADCRH) In 12-bit operation, ADCRH contains the upper four bits of the result of a 12-bit conversion. R 7 6 5 4 3 2 1 0 0 0 0 0 ADR11 ADR10 ADR9 ADR8 0 0 0 0 0 0 0 0 W Reset: = Unimplemented or Reserved Figure 15-6. Data Result High Register (ADCRH) In 10-bit mode, ADCRH contains the upper two bits of the result of a 10-bit conversion. When configured for 10-bit mode, ADR11 – ADR10 are equal to zero. When configured for 8-bit mode, ADR11 – ADR8 are equal to zero. In both 12-bit and 10-bit mode, ADCRH is updated each time a conversion completes except when automatic compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading ADCRH prevents the ADC from transferring subsequent conversion results into the result registers until ADCRL is read. If ADCRL is not read until after the next conversion is completed, then the intermediate conversion result is lost. In 8-bit mode there is no interlocking with ADCRL. In the case that the MODE bits are changed, any data in ADCRH becomes invalid. 15.3.4 Data Result Low Register (ADCRL) ADCRL contains the lower eight bits of the result of a 12-bit or 10-bit conversion, and all eight bits of an 8-bit conversion. This register is updated each time a conversion completes except when automatic compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading ADCRH prevents the ADC from transferring subsequent conversion results into the result registers until ADCRL is read. If ADCRL is not read until the after next conversion is completed, then the intermediate conversion results will be lost. In 8-bit mode, there is no interlocking with ADCRH. In the case that the MODE bits are changed, any data in ADCRL becomes invalid. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 275 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) R 7 6 5 4 3 2 1 0 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 0 0 0 0 0 0 0 0 W Reset: = Unimplemented or Reserved Figure 15-7. Data Result Low Register (ADCRL) 15.3.5 Compare Value High Register (ADCCVH) In 12-bit mode, the ADCCVH register holds the upper four bits of the 12-bit compare value. These bits are compared to the upper four bits of the result following a conversion in 12-bit mode when the compare function is enabled. R 7 6 5 4 0 0 0 0 3 2 1 0 ADCV11 ADCV10 ADCV9 ADCV8 0 0 0 0 W Reset: 0 0 0 0 = Unimplemented or Reserved Figure 15-8. Compare Value High Register (ADCCVH) In 10-bit mode, the ADCCVH register holds the upper two bits of the 10-bit compare value (ADCV9 – ADCV8). These bits are compared to the upper two bits of the result following a conversion in 10-bit mode when the compare function is enabled. In 8-bit mode, ADCCVH is not used during compare. 15.3.6 Compare Value Low Register (ADCCVL) This register holds the lower 8 bits of the 12-bit or 10-bit compare value, or all 8 bits of the 8-bit compare value. Bits ADCV7:ADCV0 are compared to the lower 8 bits of the result following a conversion in 12-bit, 10-bit or 8-bit mode. 7 6 5 4 3 2 1 0 ADCV7 ADCV6 ADCV5 ADCV4 ADCV3 ADCV2 ADCV1 ADCV0 0 0 0 0 0 0 0 0 R W Reset: Figure 15-9. Compare Value Low Register(ADCCVL) 15.3.7 Configuration Register (ADCCFG) ADCCFG is used to select the mode of operation, clock source, clock divide, and configure for low power or long sample time. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 276 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 7 6 5 4 3 2 1 0 R ADLPC ADIV ADLSMP MODE ADICLK W Reset: 0 0 0 0 0 0 0 0 Figure 15-10. Configuration Register (ADCCFG) Table 15-5. ADCCFG Register Field Descriptions Field Description 7 ADLPC Low Power Configuration — ADLPC controls the speed and power configuration of the successive approximation converter. This is used to optimize power consumption when higher sample rates are not required. 0 High speed configuration 1 Low power configuration: {FC31}The power is reduced at the expense of maximum clock speed. 6:5 ADIV 4 ADLSMP 3:2 MODE 1:0 ADICLK Clock Divide Select — ADIV select the divide ratio used by the ADC to generate the internal clock ADCK. Table 15-6 shows the available clock configurations. Long Sample Time Configuration — ADLSMP selects between long and short sample time. This adjusts the sample period to allow higher impedance inputs to be accurately sampled or to maximize conversion speed for lower impedance inputs. Longer sample times can also be used to lower overall power consumption when continuous conversions are enabled if high conversion rates are not required. 0 Short sample time 1 Long sample time Conversion Mode Selection — MODE bits are used to select between 12-, 10- or 8-bit operation. See Table 15-7. Input Clock Select — ADICLK bits select the input clock source to generate the internal clock ADCK. See Table 15-8. Table 15-6. Clock Divide Select ADIV Divide Ratio Clock Rate 00 1 Input clock 01 2 Input clock ÷ 2 10 4 Input clock ÷ 4 11 8 Input clock ÷ 8 Table 15-7. Conversion Modes MODE Mode Description 00 8-bit conversion (N=8) 01 12-bit conversion (N=12) 10 10-bit conversion (N=10) 11 Reserved MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 277 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Table 15-8. Input Clock Select ADICLK 15.3.8 Selected Clock Source 00 Bus clock 01 Bus clock divided by 2 10 Alternate clock (ALTCLK) 11 Asynchronous clock (ADACK) Pin Control 1 Register (APCTL1) The pin control registers are used to disable the I/O port control of MCU pins used as analog inputs. APCTL1 is used to control the pins associated with channels 0–7 of the ADC module. 7 6 5 4 3 2 1 0 ADPC7 ADPC6 ADPC5 ADPC4 ADPC3 ADPC2 ADPC1 ADPC0 0 0 0 0 0 0 0 0 R W Reset: Figure 15-11. Pin Control 1 Register (APCTL1) Table 15-9. APCTL1 Register Field Descriptions Field Description 7 ADPC7 ADC Pin Control 7 — ADPC7 is used to control the pin associated with channel AD7. 0 AD7 pin I/O control enabled 1 AD7 pin I/O control disabled 6 ADPC6 ADC Pin Control 6 — ADPC6 is used to control the pin associated with channel AD6. 0 AD6 pin I/O control enabled 1 AD6 pin I/O control disabled 5 ADPC5 ADC Pin Control 5 — ADPC5 is used to control the pin associated with channel AD5. 0 AD5 pin I/O control enabled 1 AD5 pin I/O control disabled 4 ADPC4 ADC Pin Control 4 — ADPC4 is used to control the pin associated with channel AD4. 0 AD4 pin I/O control enabled 1 AD4 pin I/O control disabled 3 ADPC3 ADC Pin Control 3 — ADPC3 is used to control the pin associated with channel AD3. 0 AD3 pin I/O control enabled 1 AD3 pin I/O control disabled 2 ADPC2 ADC Pin Control 2 — ADPC2 is used to control the pin associated with channel AD2. 0 AD2 pin I/O control enabled 1 AD2 pin I/O control disabled MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 278 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Table 15-9. APCTL1 Register Field Descriptions (continued) Field Description 1 ADPC1 ADC Pin Control 1 — ADPC1 is used to control the pin associated with channel AD1. 0 AD1 pin I/O control enabled 1 AD1 pin I/O control disabled 0 ADPC0 ADC Pin Control 0 — ADPC0 is used to control the pin associated with channel AD0. 0 AD0 pin I/O control enabled 1 AD0 pin I/O control disabled 15.3.9 Pin Control 2 Register (APCTL2) APCTL2 is used to control channels 8–15 of the ADC module. 7 6 5 4 3 2 1 0 ADPC15 ADPC14 ADPC13 ADPC12 ADPC11 ADPC10 ADPC9 ADPC8 0 0 0 0 0 0 0 0 R W Reset: Figure 15-12. Pin Control 2 Register (APCTL2) Table 15-10. APCTL2 Register Field Descriptions Field Description 7 ADPC15 ADC Pin Control 15 — ADPC15 is used to control the pin associated with channel AD15. 0 AD15 pin I/O control enabled 1 AD15 pin I/O control disabled 6 ADPC14 ADC Pin Control 14 — ADPC14 is used to control the pin associated with channel AD14. 0 AD14 pin I/O control enabled 1 AD14 pin I/O control disabled 5 ADPC13 ADC Pin Control 13 — ADPC13 is used to control the pin associated with channel AD13. 0 AD13 pin I/O control enabled 1 AD13 pin I/O control disabled 4 ADPC12 ADC Pin Control 12 — ADPC12 is used to control the pin associated with channel AD12. 0 AD12 pin I/O control enabled 1 AD12 pin I/O control disabled 3 ADPC11 ADC Pin Control 11 — ADPC11 is used to control the pin associated with channel AD11. 0 AD11 pin I/O control enabled 1 AD11 pin I/O control disabled 2 ADPC10 ADC Pin Control 10 — ADPC10 is used to control the pin associated with channel AD10. 0 AD10 pin I/O control enabled 1 AD10 pin I/O control disabled MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 279 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Table 15-10. APCTL2 Register Field Descriptions (continued) Field Description 1 ADPC9 ADC Pin Control 9 — ADPC9 is used to control the pin associated with channel AD9. 0 AD9 pin I/O control enabled 1 AD9 pin I/O control disabled 0 ADPC8 ADC Pin Control 8 — ADPC8 is used to control the pin associated with channel AD8. 0 AD8 pin I/O control enabled 1 AD8 pin I/O control disabled 15.3.10 Pin Control 3 Register (APCTL3) APCTL3 is used to control channels 16–23 of the ADC module. 7 6 5 4 3 2 1 0 ADPC23 ADPC22 ADPC21 ADPC20 ADPC19 ADPC18 ADPC17 ADPC16 0 0 0 0 0 0 0 0 R W Reset: Figure 15-13. Pin Control 3 Register (APCTL3) Table 15-11. APCTL3 Register Field Descriptions Field Description 7 ADPC23 ADC Pin Control 23 — ADPC23 is used to control the pin associated with channel AD23. 0 AD23 pin I/O control enabled 1 AD23 pin I/O control disabled 6 ADPC22 ADC Pin Control 22 — ADPC22 is used to control the pin associated with channel AD22. 0 AD22 pin I/O control enabled 1 AD22 pin I/O control disabled 5 ADPC21 ADC Pin Control 21 — ADPC21 is used to control the pin associated with channel AD21. 0 AD21 pin I/O control enabled 1 AD21 pin I/O control disabled 4 ADPC20 ADC Pin Control 20 — ADPC20 is used to control the pin associated with channel AD20. 0 AD20 pin I/O control enabled 1 AD20 pin I/O control disabled 3 ADPC19 ADC Pin Control 19 — ADPC19 is used to control the pin associated with channel AD19. 0 AD19 pin I/O control enabled 1 AD19 pin I/O control disabled 2 ADPC18 ADC Pin Control 18 — ADPC18 is used to control the pin associated with channel AD18. 0 AD18 pin I/O control enabled 1 AD18 pin I/O control disabled MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 280 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) Table 15-11. APCTL3 Register Field Descriptions (continued) Field Description 1 ADPC17 ADC Pin Control 17 — ADPC17 is used to control the pin associated with channel AD17. 0 AD17 pin I/O control enabled 1 AD17 pin I/O control disabled 0 ADPC16 ADC Pin Control 16 — ADPC16 is used to control the pin associated with channel AD16. 0 AD16 pin I/O control enabled 1 AD16 pin I/O control disabled 15.4 Functional Description The ADC module is disabled during reset or when the ADCH bits are all high. The module is idle when a conversion has completed and another conversion has not been initiated. When idle, the module is in its lowest power state. The ADC can perform an analog-to-digital conversion on any of the software selectable channels. In 12-bit and 10-bit mode, the selected channel voltage is converted by a successive approximation algorithm into a 12-bit digital result. In 8-bit mode, the selected channel voltage is converted by a successive approximation algorithm into a 9-bit digital result. When the conversion is completed, the result is placed in the data registers (ADCRH and ADCRL). In 10-bit mode, the result is rounded to 10 bits and placed in the data registers (ADCRH and ADCRL). In 8-bit mode, the result is rounded to 8 bits and placed in ADCRL. The conversion complete flag (COCO) is then set and an interrupt is generated if the conversion complete interrupt has been enabled (AIEN = 1). The ADC module has the capability of automatically comparing the result of a conversion with the contents of its compare registers. The compare function is enabled by setting the ACFE bit and operates in conjunction with any of the conversion modes and configurations. 15.4.1 Clock Select and Divide Control One of four clock sources can be selected as the clock source for the ADC module. This clock source is then divided by a configurable value to generate the input clock to the converter (ADCK). The clock is selected from one of the following sources by means of the ADICLK bits. • • • • The bus clock, which is equal to the frequency at which software is executed. This is the default selection following reset. The bus clock divided by 2. For higher bus clock rates, this allows a maximum divide by 16 of the bus clock. ALTCLK, as defined for this MCU (See module section introduction). The asynchronous clock (ADACK) – This clock is generated from a clock source within the ADC module. When selected as the clock source this clock remains active while the MCU is in wait or stop3 mode and allows conversions in these modes for lower noise operation. Whichever clock is selected, its frequency must fall within the specified frequency range for ADCK. If the available clocks are too slow, the ADC will not perform according to specifications. If the available clocks MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 281 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) are too fast, then the clock must be divided to the appropriate frequency. This divider is specified by the ADIV bits and can be divide-by 1, 2, 4, or 8. 15.4.2 Input Select and Pin Control The pin control registers (APCTL3, APCTL2, and APCTL1) are used to disable the I/O port control of the pins used as analog inputs.When a pin control register bit is set, the following conditions are forced for the associated MCU pin: • The output buffer is forced to its high impedance state. • The input buffer is disabled. A read of the I/O port returns a zero for any pin with its input buffer disabled. • The pullup is disabled. 15.4.3 Hardware Trigger The ADC module has a selectable asynchronous hardware conversion trigger, ADHWT, that is enabled when the ADTRG bit is set. This source is not available on all MCUs. Consult the module introduction for information on the ADHWT source specific to this MCU. When ADHWT source is available and hardware trigger is enabled (ADTRG=1), a conversion is initiated on the rising edge of ADHWT. If a conversion is in progress when a rising edge occurs, the rising edge is ignored. In continuous convert configuration, only the initial rising edge to launch continuous conversions is observed. The hardware trigger function operates in conjunction with any of the conversion modes and configurations. 15.4.4 Conversion Control Conversions can be performed in 12-bit mode, 10-bit mode or 8-bit mode as determined by the MODE bits. Conversions can be initiated by either a software or hardware trigger. In addition, the ADC module can be configured for low power operation, long sample time, continuous conversion, and automatic compare of the conversion result to a software determined compare value. 15.4.4.1 Initiating Conversions A conversion is initiated: • Following a write to ADCSC1 (with ADCH bits not all 1s) if software triggered operation is selected. • Following a hardware trigger (ADHWT) event if hardware triggered operation is selected. • Following the transfer of the result to the data registers when continuous conversion is enabled. If continuous conversions are enabled a new conversion is automatically initiated after the completion of the current conversion. In software triggered operation, continuous conversions begin after ADCSC1 is written and continue until aborted. In hardware triggered operation, continuous conversions begin after a hardware trigger event and continue until aborted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 282 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.4.4.2 Completing Conversions A conversion is completed when the result of the conversion is transferred into the data result registers, ADCRH and ADCRL. This is indicated by the setting of COCO. An interrupt is generated if AIEN is high at the time that COCO is set. A blocking mechanism prevents a new result from overwriting previous data in ADCRH and ADCRL if the previous data is in the process of being read while in 12-bit or 10-bit MODE (the ADCRH register has been read but the ADCRL register has not). When blocking is active, the data transfer is blocked, COCO is not set, and the new result is lost. In the case of single conversions with the compare function enabled and the compare condition false, blocking has no effect and ADC operation is terminated. In all other cases of operation, when a data transfer is blocked, another conversion is initiated regardless of the state of ADCO (single or continuous conversions enabled). If single conversions are enabled, the blocking mechanism could result in several discarded conversions and excess power consumption. To avoid this issue, the data registers must not be read after initiating a single conversion until the conversion completes. 15.4.4.3 Aborting Conversions Any conversion in progress will be aborted when: • A write to ADCSC1 occurs (the current conversion will be aborted and a new conversion will be initiated, if ADCH are not all 1s). • A write to ADCSC2, ADCCFG, ADCCVH, or ADCCVL occurs. This indicates a mode of operation change has occurred and the current conversion is therefore invalid. • The MCU is reset. • The MCU enters stop mode with ADACK not enabled. When a conversion is aborted, the contents of the data registers, ADCRH and ADCRL, are not altered but continue to be the values transferred after the completion of the last successful conversion. In the case that the conversion was aborted by a reset, ADCRH and ADCRL return to their reset states. 15.4.4.4 Power Control The ADC module remains in its idle state until a conversion is initiated. If ADACK is selected as the conversion clock source, the ADACK clock generator is also enabled. Power consumption when active can be reduced by setting ADLPC. This results in a lower maximum value for fADCK (see the electrical specifications). 15.4.4.5 Sample Time and Total Conversion Time The total conversion time depends on the sample time (as determined by ADLSMP), the MCU bus frequency, the conversion mode (8-bit, 10-bit or 12-bit), and the frequency of the conversion clock (fADCK). After the module becomes active, sampling of the input begins. ADLSMP is used to select between short (3.5 ADCK cycles) and long (23.5 ADCK cycles) sample times.When sampling is complete, the converter is isolated from the input channel and a successive approximation algorithm is performed to determine the MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 283 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) digital value of the analog signal. The result of the conversion is transferred to ADCRH and ADCRL upon completion of the conversion algorithm. If the bus frequency is less than the fADCK frequency, precise sample time for continuous conversions cannot be guaranteed when short sample is enabled (ADLSMP=0). If the bus frequency is less than 1/11th of the fADCK frequency, precise sample time for continuous conversions cannot be guaranteed when long sample is enabled (ADLSMP=1). The maximum total conversion time for different conditions is summarized in Table 15-12. Table 15-12. Total Conversion Time vs. Control Conditions Conversion Type ADICLK ADLSMP Max Total Conversion Time Single or first continuous 8-bit 0x, 10 0 20 ADCK cycles + 5 bus clock cycles Single or first continuous 10-bit or 12-bit 0x, 10 0 23 ADCK cycles + 5 bus clock cycles Single or first continuous 8-bit 0x, 10 1 40 ADCK cycles + 5 bus clock cycles Single or first continuous 10-bit or 12-bit 0x, 10 1 43 ADCK cycles + 5 bus clock cycles Single or first continuous 8-bit 11 0 5 μs + 20 ADCK + 5 bus clock cycles Single or first continuous 10-bit or 12-bit 11 0 5 μs + 23 ADCK + 5 bus clock cycles Single or first continuous 8-bit 11 1 5 μs + 40 ADCK + 5 bus clock cycles Single or first continuous 10-bit or 12-bit 11 1 5 μs + 43 ADCK + 5 bus clock cycles Subsequent continuous 8-bit; fBUS > fADCK xx 0 17 ADCK cycles Subsequent continuous 10-bit or 12-bit; fBUS > fADCK xx 0 20 ADCK cycles Subsequent continuous 8-bit; fBUS > fADCK/11 xx 1 37 ADCK cycles Subsequent continuous 10-bit or 12-bit; fBUS > fADCK/11 xx 1 40 ADCK cycles The maximum total conversion time is determined by the clock source chosen and the divide ratio selected. The clock source is selectable by the ADICLK bits, and the divide ratio is specified by the ADIV bits. For example, in 10-bit mode, with the bus clock selected as the input clock source, the input clock divide-by-1 ratio selected, and a bus frequency of 8 MHz, then the conversion time for a single conversion is: Conversion time = 23 ADCK cyc 8 MHz/1 + 5 bus cyc 8 MHz = 3.5 μs Number of bus cycles = 3.5 μs x 8 MHz = 28 cycles NOTE The ADCK frequency must be between fADCK minimum and fADCK maximum to meet ADC specifications. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 284 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.4.5 Automatic Compare Function The compare function can be configured to check for either an upper limit or lower limit. After the input is sampled and converted, the result is added to the two’s complement of the compare value (ADCCVH and ADCCVL). When comparing to an upper limit (ACFGT = 1), if the result is greater-than or equal-to the compare value, COCO is set. When comparing to a lower limit (ACFGT = 0), if the result is less than the compare value, COCO is set. The value generated by the addition of the conversion result and the two’s complement of the compare value is transferred to ADCRH and ADCRL. Upon completion of a conversion while the compare function is enabled, if the compare condition is not true, COCO is not set and no data is transferred to the result registers. An ADC interrupt is generated upon the setting of COCO if the ADC interrupt is enabled (AIEN = 1). NOTE The compare function can be used to monitor the voltage on a channel while the MCU is in either wait or stop3 mode. The ADC interrupt will wake the MCU when the compare condition is met. 15.4.6 MCU Wait Mode Operation The WAIT instruction puts the MCU in a lower power-consumption standby mode from which recovery is very fast because the clock sources remain active. If a conversion is in progress when the MCU enters wait mode, it continues until completion. Conversions can be initiated while the MCU is in wait mode by means of the hardware trigger or if continuous conversions are enabled. The bus clock, bus clock divided by two, and ADACK are available as conversion clock sources while in wait mode. The use of ALTCLK as the conversion clock source in wait is dependent on the definition of ALTCLK for this MCU. Consult the module introduction for information on ALTCLK specific to this MCU. A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from wait mode if the ADC interrupt is enabled (AIEN = 1). 15.4.7 MCU Stop3 Mode Operation The STOP instruction is used to put the MCU in a low power-consumption standby mode during which most or all clock sources on the MCU are disabled. 15.4.7.1 Stop3 Mode With ADACK Disabled If the asynchronous clock, ADACK, is not selected as the conversion clock, executing a STOP instruction aborts the current conversion and places the ADC in its idle state. The contents of ADCRH and ADCRL are unaffected by stop3 mode. After exiting from stop3 mode, a software or hardware trigger is required to resume conversions. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 285 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.4.7.2 Stop3 Mode With ADACK Enabled If ADACK is selected as the conversion clock, the ADC continues operation during stop3 mode. For guaranteed ADC operation, the MCU’s voltage regulator must remain active during stop3 mode. Consult the module introduction for configuration information for this MCU. If a conversion is in progress when the MCU enters stop3 mode, it continues until completion. Conversions can be initiated while the MCU is in stop3 mode by means of the hardware trigger or if continuous conversions are enabled. A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from stop3 mode if the ADC interrupt is enabled (AIEN = 1). NOTE It is possible for the ADC module to wake the system from low power stop and cause the MCU to begin consuming run-level currents without generating a system level interrupt. To prevent this scenario, software should ensure that the data transfer blocking mechanism (discussed in Section 15.4.4.2, “Completing Conversions) is cleared when entering stop3 and continuing ADC conversions. 15.4.8 MCU Stop1 and Stop2 Mode Operation The ADC module is automatically disabled when the MCU enters either stop1 or stop2 mode. All module registers contain their reset values following exit from stop1 or stop2. Therefore the module must be re-enabled and re-configured following exit from stop1 or stop2. 15.5 Initialization Information This section gives an example which provides some basic direction on how a user would initialize and configure the ADC module. The user has the flexibility of choosing between configuring the module for 8-, 10-, or 12-bit resolution, single or continuous conversion, and a polled or interrupt approach, among many other options. Refer to Table 15-6, Table 15-7, and Table 15-8 for information used in this example. NOTE Hexadecimal values designated by a preceding 0x, binary values designated by a preceding %, and decimal values have no preceding character. 15.5.1 15.5.1.1 ADC Module Initialization Example Initialization Sequence Before the ADC module can be used to complete conversions, an initialization procedure must be performed. A typical sequence is as follows: 1. Update the configuration register (ADCCFG) to select the input clock source and the divide ratio used to generate the internal clock, ADCK. This register is also used for selecting sample time and low-power configuration. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 286 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 2. Update status and control register 2 (ADCSC2) to select the conversion trigger (hardware or software) and compare function options, if enabled. 3. Update status and control register 1 (ADCSC1) to select whether conversions will be continuous or completed only once, and to enable or disable conversion complete interrupts. The input channel on which conversions will be performed is also selected here. 15.5.1.2 Pseudo — Code Example In this example, the ADC module will be set up with interrupts enabled to perform a single 10-bit conversion at low power with a long sample time on input channel 1, where the internal ADCK clock will be derived from the bus clock divided by 1. ADCCFG = 0x98 (%10011000) Bit 7 ADLPC 1 Configures for low power (lowers maximum clock speed) Bit 6:5 ADIV 00 Sets the ADCK to the input clock ÷ 1 Bit 4 ADLSMP 1 Configures for long sample time Bit 3:2 MODE 10 Sets mode at 10-bit conversions Bit 1:0 ADICLK 00 Selects bus clock as input clock source ADCSC2 = 0x00 (%00000000) Bit 7 ADACT 0 Bit 6 ADTRG 0 Bit 5 ACFE 0 Bit 4 ACFGT 0 Bit 3:2 00 Bit 1:0 00 Flag indicates if a conversion is in progress Software trigger selected Compare function disabled Not used in this example Unimplemented or reserved, always reads zero Reserved for Freescale’s internal use; always write zero ADCSC1 = 0x41 (%01000001) Bit 7 COCO 0 Bit 6 AIEN 1 Bit 5 ADCO 0 Bit 4:0 ADCH 00001 Read-only flag which is set when a conversion completes Conversion complete interrupt enabled One conversion only (continuous conversions disabled) Input channel 1 selected as ADC input channel ADCRH/L = 0xxx Holds results of conversion. Read high byte (ADCRH) before low byte (ADCRL) so that conversion data cannot be overwritten with data from the next conversion. ADCCVH/L = 0xxx Holds compare value when compare function enabled APCTL1=0x02 AD1 pin I/O control disabled. All other AD pins remain general purpose I/O pins APCTL2=0x00 All other AD pins remain general purpose I/O pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 287 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) RESET INITIALIZE ADC ADCCFG = $98 ADCSC2 = $00 ADCSC1 = $41 CHECK COCO=1? NO YES READ ADCRH THEN ADCRL TO CLEAR COCO BIT CONTINUE Figure 15-14. Initialization Flowchart for Example 15.6 Application Information This section contains information for using the ADC module in applications. The ADC has been designed to be integrated into a microcontroller for use in embedded control applications requiring an A/D converter. 15.6.1 External Pins and Routing The following sections discuss the external pins associated with the ADC module and how they should be used for best results. 15.6.1.1 Analog Supply Pins The ADC module has analog power and ground supplies (VDDAD and VSSAD) which are available as separate pins on some devices. On other devices, VSSAD is shared on the same pin as the MCU digital VSS, and on others, both VSSAD and VDDAD are shared with the MCU digital supply pins. In these cases, there are separate pads for the analog supplies which are bonded to the same pin as the corresponding digital supply so that some degree of isolation between the supplies is maintained. When available on a separate pin, both VDDAD and VSSAD must be connected to the same voltage potential as their corresponding MCU digital supply (VDD and VSS) and must be routed carefully for maximum noise immunity and bypass capacitors placed as near as possible to the package. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 288 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) In cases where separate power supplies are used for analog and digital power, the ground connection between these supplies must be at the VSSAD pin. This should be the only ground connection between these supplies if possible. The VSSAD pin makes a good single point ground location. 15.6.1.2 Analog Reference Pins In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The high reference is VREFH, which may be shared on the same pin as VDDAD on some devices. The low reference is VREFL, which may be shared on the same pin as VSSAD on some devices. When available on a separate pin, VREFH may be connected to the same potential as VDDAD, or may be driven by an external source that is between the minimum VDDAD spec and the VDDAD potential (VREFH must never exceed VDDAD). When available on a separate pin, VREFL must be connected to the same voltage potential as VSSAD. Both VREFH and VREFL must be routed carefully for maximum noise immunity and bypass capacitors placed as near as possible to the package. AC current in the form of current spikes required to supply charge to the capacitor array at each successive approximation step is drawn through the VREFH and VREFL loop. The best external component to meet this current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor is connected between VREFH and VREFL and must be placed as near as possible to the package pins. Resistance in the path is not recommended because the current will cause a voltage drop which could result in conversion errors. Inductance in this path must be minimum (parasitic only). 15.6.1.3 Analog Input Pins The external analog inputs are typically shared with digital I/O pins on MCU devices. The pin I/O control is disabled by setting the appropriate control bit in one of the pin control registers. Conversions can be performed on inputs without the associated pin control register bit set. It is recommended that the pin control register bit always be set when using a pin as an analog input. This avoids problems with contention because the output buffer will be in its high impedance state and the pullup is disabled. Also, the input buffer draws DC current when its input is not at either VDD or VSS. Setting the pin control register bits for all pins used as analog inputs should be done to achieve lowest operating current. Empirical data shows that capacitors on the analog inputs improve performance in the presence of noise or when the source impedance is high. Use of 0.01 μF capacitors with good high-frequency characteristics is sufficient. These capacitors are not necessary in all cases, but when used they must be placed as near as possible to the package pins and be referenced to VSSA. For proper conversion, the input voltage must fall between VREFH and VREFL. If the input is equal to or exceeds VREFH, the converter circuit converts the signal to $FFF (full scale 12-bit representation), $3FF (full scale 10-bit representation) or $FF (full scale 8-bit representation). If the input is equal to or less than VREFL, the converter circuit converts it to $000. Input voltages between VREFH and VREFL are straight-line linear conversions. There will be a brief current associated with VREFL when the sampling capacitor is charging. The input is sampled for 3.5 cycles of the ADCK source when ADLSMP is low, or 23.5 cycles when ADLSMP is high. For minimal loss of accuracy due to current injection, pins adjacent to the analog input pins should not be transitioning during conversions. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 289 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.6.2 Sources of Error Several sources of error exist for A/D conversions. These are discussed in the following sections. 15.6.2.1 Sampling Error For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given the maximum input resistance of approximately 7kΩ and input capacitance of approximately 5.5 pF, sampling to within 1/4LSB (at 12-bit resolution) can be achieved within the minimum sample window (3.5 cycles @ 8 MHz maximum ADCK frequency) provided the resistance of the external analog source (RAS) is kept below 2 kΩ. Higher source resistances or higher-accuracy sampling is possible by setting ADLSMP (to increase the sample window to 23.5 cycles) or decreasing ADCK frequency to increase sample time. 15.6.2.2 Pin Leakage Error Leakage on the I/O pins can cause conversion error if the external analog source resistance (RAS) is high. If this error cannot be tolerated by the application, keep RAS lower than VDDAD / (2N*ILEAK) for less than 1/4LSB leakage error (N = 8 in 8-bit, 10 in 10-bit or 12 in 12-bit mode). 15.6.2.3 Noise-Induced Errors System noise which occurs during the sample or conversion process can affect the accuracy of the conversion. The ADC accuracy numbers are guaranteed as specified only if the following conditions are met: • There is a 0.1 μF low-ESR capacitor from VREFH to VREFL. • There is a 0.1 μF low-ESR capacitor from VDDAD to VSSAD. • If inductive isolation is used from the primary supply, an additional 1 μF capacitor is placed from VDDAD to VSSAD. • VSSAD (and VREFL, if connected) is connected to VSS at a quiet point in the ground plane. • Operate the MCU in wait or stop3 mode before initiating (hardware triggered conversions) or immediately after initiating (hardware or software triggered conversions) the ADC conversion. — For software triggered conversions, immediately follow the write to the ADCSC1 with a WAIT instruction or STOP instruction. — For stop3 mode operation, select ADACK as the clock source. Operation in stop3 reduces VDD noise but increases effective conversion time due to stop recovery. • There is no I/O switching, input or output, on the MCU during the conversion. There are some situations where external system activity causes radiated or conducted noise emissions or excessive VDD noise is coupled into the ADC. In these situations, or when the MCU cannot be placed in wait or stop3 or I/O activity cannot be halted, these recommended actions may reduce the effect of noise on the accuracy: • Place a 0.01 μF capacitor (CAS) on the selected input channel to VREFL or VSSAD (this will improve noise issues but will affect sample rate based on the external analog source resistance). MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 290 Freescale Semiconductor Chapter 15 Analog-to-Digital Converter (S08ADC12V1) • • Average the result by converting the analog input many times in succession and dividing the sum of the results. Four samples are required to eliminate the effect of a 1LSB, one-time error. Reduce the effect of synchronous noise by operating off the asynchronous clock (ADACK) and averaging. Noise that is synchronous to ADCK cannot be averaged out. 15.6.2.4 Code Width and Quantization Error The ADC quantizes the ideal straight-line transfer function into 4096 steps (in 12-bit mode). Each step ideally has the same height (1 code) and width. The width is defined as the delta between the transition points to one code and the next. The ideal code width for an N bit converter (in this case N can be 8, 10 or 12), defined as 1LSB, is: 1LSB = (VREFH - VREFL) / 2N Eqn. 15-2 There is an inherent quantization error due to the digitization of the result. For 8-bit or 10-bit conversions the code will transition when the voltage is at the midpoint between the points where the straight line transfer function is exactly represented by the actual transfer function. Therefore, the quantization error will be ± 1/2LSB in 8- or 10-bit mode. As a consequence, however, the code width of the first ($000) conversion is only 1/2LSB and the code width of the last ($FF or $3FF) is 1.5LSB. For 12-bit conversions the code transitions only after the full code width is present, so the quantization error is -1LSB to 0LSB and the code width of each step is 1LSB. 15.6.2.5 Linearity Errors The ADC may also exhibit non-linearity of several forms. Every effort has been made to reduce these errors but the system should be aware of them because they affect overall accuracy. These errors are: • Zero-scale error (EZS) (sometimes called offset) — This error is defined as the difference between the actual code width of the first conversion and the ideal code width (1/2LSB in 8-bit or 10-bit modes and 1LSB in 12-bit mode). Note, if the first conversion is $001, then the difference between the actual $001 code width and its ideal (1LSB) is used. • Full-scale error (EFS) — This error is defined as the difference between the actual code width of the last conversion and the ideal code width (1.5LSB in 8-bit or 10-bit modes and 1LSB in 12-bit mode). Note, if the last conversion is $3FE, then the difference between the actual $3FE code width and its ideal (1LSB) is used. • Differential non-linearity (DNL) — This error is defined as the worst-case difference between the actual code width and the ideal code width for all conversions. • Integral non-linearity (INL) — This error is defined as the highest-value the (absolute value of the) running sum of DNL achieves. More simply, this is the worst-case difference of the actual transition voltage to a given code and its corresponding ideal transition voltage, for all codes. • Total unadjusted error (TUE) — This error is defined as the difference between the actual transfer function and the ideal straight-line transfer function, and therefore includes all forms of error. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 291 Chapter 15 Analog-to-Digital Converter (S08ADC12V1) 15.6.2.6 Code Jitter, Non-Monotonicity and Missing Codes Analog-to-digital converters are susceptible to three special forms of error. These are code jitter, non-monotonicity, and missing codes. Code jitter is when, at certain points, a given input voltage converts to one of two values when sampled repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition voltage, the converter yields the lower code (and vice-versa). However, even very small amounts of system noise can cause the converter to be indeterminate (between two codes) for a range of input voltages around the transition voltage. This range is normally around 1/2LSB in 8-bit or 10-bit mode, or around 2 LSB in 12-bit mode, and will increase with noise. This error may be reduced by repeatedly sampling the input and averaging the result. Additionally the techniques discussed in Section 15.6.2.3 will reduce this error. Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code for a higher input voltage. Missing codes are those values which are never converted for any input value. In 8-bit or 10-bit mode, the ADC is guaranteed to be monotonic and to have no missing codes. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 292 Freescale Semiconductor Chapter 16 Analog Comparator (S08ACMPV2) 16.1 Introduction The analog comparator module (ACMP) provides a circuit for comparing two analog input voltages or for comparing one analog input voltage to an internal reference voltage. The comparator circuit is designed to operate across the full range of the supply voltage (rail to rail operation). 16.1.1 ACMP/TPM1 Configuration Information The ACMP module can be configured to connect the output of the analog comparator to TPM1 input capture channel 0 by setting ACIC in SOPT2. With ACIC set, the TPM1CH0 pin is not available externally regardless of the configuration of the TPM1 module Figure 16-1 shows the MC9S08LC60 Series block diagram with the ACMP highlighted. 16.1.2 AMCPO Availability For the MC9S08LC60 Series, the AMCPO pin is not available, so the ACOPE bit in the ACMPSC register is reserved and does not have any effect. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 293 Chapter 16 Analog Comparator (S08ACMPV2) HCS08 CORE INT ADP[7:4] ADP3 ADP2 ADP1 ADP0 4 BKGD 12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) BKP HCS08 SYSTEM CONTROL RTI COP IRQ LVD ANALOG COMPARATOR (ACMP) 8-BIT KEYBOARD INTERRUPT (KBI1) USER FLASH A (LC60 = 32,768 BYTES) (LC36 = 24,576 BYTES) SERIAL PERIPHERAL INTERFACE (SPI1) PTA3/KBI1P3/ADP3/ACMP– ACMP+ PTA2/KBI1P2/ADP2/ACMP+ 8 PTA[1:0]/KBI1P[1:0]/ADP[1:0] SS1 SPSCK1 MISO1 PTB7/KBI2P4/SS1 PTB6/KBI2P3/SPSCK1 MOSI1 SCL IIC MODULE (IIC) USER FLASH B (LC60 = 28,464 BYTES) (LC36 = 12,288 BYTES) ACMP– PORT B RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT PTA[7:4]/KBI1P[7:4]/ADP[7:4] PORT A CPU ON-CHIP ICE DEBUG MODULE (DBG) SDA RESET 3 XTAL USER RAM PTB1/KBI2P1/XTAL PTB0/KBI2P0/EXTAL EXTAL IRQ (TPM1) VLCD VLL1 VLL2 VLL3 VCAP1 LIQUID CRYSTAL DISPLAY DRIVER LCD SERIAL COMMUNICATIONS INTERFACE (SCI) BP[2:0] BP3/FP40 FP[39:0] VSS VREFH VREFL VDDAD VSSAD SS2 SPSCK2 MOSI2 MISO2 TxD VCAP2 VDD SERIAL PERIPHERAL INTERFACE (SPI2) TPMCLK TPM1CH0 TPM1CH1 PORT C (TPM2) 2-CHANNEL TIMER/PWM PTC7/KBI2P7/IRQ/TPMCLK PTC6/BKGD/MS PTC5/KBI2P6/TPM2CH1 PTC4/KBI2P5/TPM2CH0 TPM2CH1 TPM2CH0 2-CHANNEL TIMER/PWM LOW-POWER OSCILLATOR VOLTAGE REGULATOR PTB3/KBI2P2 PTB2/RESET 5 8-BIT KEYBOARD INTERRUPT (KBI2) (LC60 = 4096 BYTES) (LC36 = 2560 BYTES) INTERNAL CLOCK GENERATOR (ICG) PTB5/MOSI1/SCL PTB4/MISO1/SDA RxD PTC3/SS2/TPM1CH1 PTC2/SPSCK2/TPM1CH0 PTC1/MOSI2/TxD PTC0/MISO2/RxD NOTES: 1. Port pins are software configurable with pullup device if input port. 2. Pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1). 3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD. 4. Pin contains integrated pullup device. 5. Input-only RESET is shared with output-only PTB2. Default function after reset is RESET. 6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is output-only PTC7. 7. PTC6/BKGD/MS is an output only pin 8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP. 9. ACMPO is not available. Figure 16-1. MC9S08LC60 Series Block Diagram Highlighting ACMP Block and Pins MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 294 Freescale Semiconductor Chapter 16 Analog Comparator (S08ACMPV2) 16.1.3 Features The ACMP has the following features: • Full rail-to-rail supply operation. • Less than 40 mV of input offset. • Less than 15 mV of hysteresis. • Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator output. • Option to compare to fixed internal bandgap reference voltage. • Option to allow comparator output to be visible on a pin, ACMPO. 16.1.4 Modes of Operation This section defines the ACMP operation in wait, stop, and background debug modes. 16.1.4.1 ACMP in Wait Mode The ACMP continues to run in wait mode if enabled before executing the WAIT instruction. Therefore, the ACMP can be used to bring the MCU out of wait mode if the ACMP interrupt, ACIE, is enabled. For lowest possible current consumption, the ACMP should be disabled by software if not required as an interrupt source during wait mode. 16.1.4.2 ACMP in Stop Modes The ACMP is disabled in all stop modes, regardless of the settings before executing the STOP instruction. Therefore, the ACMP cannot be used as a wake up source from stop modes. During either stop1 or stop2 mode, the ACMP module will be fully powered down. Upon wake-up from stop1 or stop2 mode, the ACMP module will be in the reset state. During stop3 mode, clocks to the ACMP module are halted. No registers are affected. In addition, the ACMP comparator circuit will enter a low power state. No compare operation will occur while in stop3. If stop3 is exited with a reset, the ACMP will be put into its reset state. If stop3 is exited with an interrupt, the ACMP continues from the state it was in when stop3 was entered. 16.1.4.3 ACMP in Active Background Mode When the microcontroller is in active background mode, the ACMP will continue to operate normally. 16.1.5 Block Diagram The block diagram for the analog comparator module is shown Figure 16-2. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 295 Chapter 16 Analog Comparator (S08ACMPV2) Internal Bus Internal Reference ACIE ACBGS ACME ACMP INTERRUPT REQUEST Status & Control Register ACF ACMP+ + – ACMP– set ACF ACMOD ACOPE Interrupt Control Comparator ACMPO Figure 16-2. Analog Comparator (ACMP) Block Diagram MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 296 Freescale Semiconductor Chapter 16 Analog Comparator (S08ACMPV2) 16.2 External Signal Description The ACMP has two analog input pins, ACMP+ and ACMP– and one digital output pin ACMPO. Each of these pins can accept an input voltage that varies across the full operating voltage range of the MCU. As shown in Figure 16-2, the ACMP– pin is connected to the inverting input of the comparator, and the ACMP+ pin is connected to the comparator non-inverting input if ACBGS is a 0. As shown in Figure 16-2, the ACMPO pin can be enabled to drive an external pin. The signal properties of ACMP are shown in Table 16-1. Table 16-1. Signal Properties Signal 16.3 Function I/O ACMP– Inverting analog input to the ACMP. (Minus input) I ACMP+ Non-inverting analog input to the ACMP. (Positive input) I ACMPO Digital output of the ACMP. O Register Definition The ACMP includes one register: • An 8-bit status and control register Refer to the direct-page register summary in the memory section of this data sheet for the absolute address assignments for all ACMP registers.This section refers to registers and control bits only by their names and relative address offsets. Some MCUs may have more than one ACMP, so register names include placeholder characters to identify which ACMP is being referenced. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 297 Chapter 16 Analog Comparator (S08ACMPV2) 16.3.1 ACMP Status and Control Register (ACMPSC) ACMPSC contains the status flag and control bits which are used to enable and configure the ACMP. 7 6 5 4 3 ACME ACBGS ACF ACIE 0 0 0 0 R 2 1 0 ACO ACOPE ACMOD W Reset: 0 0 0 0 = Unimplemented Figure 16-3. ACMP Status and Control Register Table 16-2. ACMP Status and Control Register Field Descriptions Field 7 ACME Description Analog Comparator Module Enable — ACME enables the ACMP module. 0 ACMP not enabled 1 ACMP is enabled 6 ACBGS Analog Comparator Bandgap Select — ACBGS is used to select between the bandgap reference voltage or the ACMP+ pin as the input to the non-inverting input of the analog comparatorr. 0 External pin ACMP+ selected as non-inverting input to comparator 1 Internal reference select as non-inverting input to comparator 5 ACF Analog Comparator Flag — ACF is set when a compare event occurs. Compare events are defined by ACMOD. ACF is cleared by writing a one to ACF. 0 Compare event has not occurred 1 Compare event has occurred 4 ACIE Analog Comparator Interrupt Enable — ACIE enables the interrupt from the ACMP. When ACIE is set, an interrupt will be asserted when ACF is set. 0 Interrupt disabled 1 Interrupt enabled 3 ACO Analog Comparator Output — Reading ACO will return the current value of the analog comparator output. ACO is reset to a 0 and will read as a 0 when the ACMP is disabled (ACME = 0). 2 ACOPE Analog Comparator Output Pin Enable — ACOPE is used to enable the comparator output to be placed onto the external pin, ACMPO. 0 Analog comparator output not available on ACMPO 1 Analog comparator output is driven out on ACMPO 1:0 ACMOD Analog Comparator Mode — ACMOD selects the type of compare event which sets ACF. 00 Encoding 0 — Comparator output falling edge 01 Encoding 1 — Comparator output rising edge 10 Encoding 2 — Comparator output falling edge 11 Encoding 3 — Comparator output rising or falling edge MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 298 Freescale Semiconductor Chapter 16 Analog Comparator (S08ACMPV2) 16.4 Functional Description The analog comparator can be used to compare two analog input voltages applied to ACMP+ and ACMP–; or it can be used to compare an analog input voltage applied to ACMP– with an internal bandgap reference voltage. ACBGS is used to select between the bandgap reference voltage or the ACMP+ pin as the input to the non-inverting input of the analog comparator. The comparator output is high when the non-inverting input is greater than the inverting input, and is low when the non-inverting input is less than the inverting input. ACMOD is used to select the condition which will cause ACF to be set. ACF can be set on a rising edge of the comparator output, a falling edge of the comparator output, or either a rising or a falling edge (toggle). The comparator output can be read directly through ACO. The comparator output can be driven onto the ACMPO pin using ACOPE. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 299 Chapter 16 Analog Comparator (S08ACMPV2) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 300 Freescale Semiconductor Chapter 17 Development Support 17.1 Introduction This chapter describes the single-wire background debug mode (BDM), which uses the on-chip background debug controller (BDC) module, and the independent on-chip real-time in-circuit emulation (ICE) system, which uses the on-chip debug (DBG) module. 17.1.1 Features Features of the BDC module include: • Single pin for mode selection and background communications • BDC registers are not located in the memory map • SYNC command to determine target communications rate • Non-intrusive commands for memory access • Active background mode commands for CPU register access • GO and TRACE1 commands • BACKGROUND command can wake CPU from stop or wait modes • One hardware address breakpoint built into BDC • Oscillator runs in stop mode, if BDC enabled • COP watchdog disabled while in active background mode Features of the ICE system include: • Two trigger comparators: Two address + read/write (R/W) or one full address + data + R/W • Flexible 8-word by 16-bit FIFO (first-in, first-out) buffer for capture information: — Change-of-flow addresses or — Event-only data • Two types of breakpoints: — Tag breakpoints for instruction opcodes — Force breakpoints for any address access • Nine trigger modes: — Basic: A-only, A OR B — Sequence: A then B — Full: A AND B data, A AND NOT B data — Event (store data): Event-only B, A then event-only B — Range: Inside range (A ≤ address ≤ B), outside range (address < A or address > B) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 301 Chapter 17 Development Support 17.2 Background Debug Controller (BDC) All MCUs in the HCS08 Family contain a single-wire background debug interface that supports in-circuit programming of on-chip nonvolatile memory and sophisticated non-intrusive debug capabilities. Unlike debug interfaces on earlier 8-bit MCUs, this system does not interfere with normal application resources. It does not use any user memory or locations in the memory map and does not share any on-chip peripherals. BDC commands are divided into two groups: • Active background mode commands require that the target MCU is in active background mode (the user program is not running). Active background mode commands allow the CPU registers to be read or written, and allow the user to trace one user instruction at a time, or GO to the user program from active background mode. • Non-intrusive commands can be executed at any time even while the user’s program is running. Non-intrusive commands allow a user to read or write MCU memory locations or access status and control registers within the background debug controller. Typically, a relatively simple interface pod is used to translate commands from a host computer into commands for the custom serial interface to the single-wire background debug system. Depending on the development tool vendor, this interface pod may use a standard RS-232 serial port, a parallel printer port, or some other type of communications such as a universal serial bus (USB) to communicate between the host PC and the pod. The pod typically connects to the target system with ground, the BKGD pin, RESET, and sometimes VDD. An open-drain connection to reset allows the host to force a target system reset, which is useful to regain control of a lost target system or to control startup of a target system before the on-chip nonvolatile memory has been programmed. Sometimes VDD can be used to allow the pod to use power from the target system to avoid the need for a separate power supply. However, if the pod is powered separately, it can be connected to a running target system without forcing a target system reset or otherwise disturbing the running application program. BKGD 1 2 GND NO CONNECT 3 4 RESET NO CONNECT 5 6 VDD Figure 17-1. BDM Tool Connector 17.2.1 BKGD Pin Description BKGD is the single-wire background debug interface pin. The primary function of this pin is for bidirectional serial communication of active background mode commands and data. During reset, this pin is used to select between starting in active background mode or starting the user’s application program. This pin is also used to request a timed sync response pulse to allow a host development tool to determine the correct clock frequency for background debug serial communications. BDC serial communications use a custom serial protocol first introduced on the M68HC12 Family of microcontrollers. This protocol assumes the host knows the communication clock rate that is determined by the target BDC clock rate. All communication is initiated and controlled by the host that drives a high-to-low edge to signal the beginning of each bit time. Commands and data are sent most significant bit MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 302 Freescale Semiconductor Chapter 17 Development Support first (MSB first). For a detailed description of the communications protocol, refer to Section 17.2.2, “Communication Details.” If a host is attempting to communicate with a target MCU that has an unknown BDC clock rate, a SYNC command may be sent to the target MCU to request a timed sync response signal from which the host can determine the correct communication speed. BKGD is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup resistor is required. Unlike typical open-drain pins, the external RC time constant on this pin, which is influenced by external capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts. Refer to Section 17.2.2, “Communication Details,” for more detail. When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU into active background mode after reset. The specific conditions for forcing active background depend upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not necessary to reset the target MCU to communicate with it through the background debug interface. 17.2.2 Communication Details The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to indicate the start of each bit time. The external controller provides this falling edge whether data is transmitted or received. BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if 512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU system. The custom serial protocol requires the debug pod to know the target BDC communication clock speed. The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source. The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 303 Chapter 17 Development Support Figure 17-2 shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU. The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal during this period. BDC CLOCK (TARGET MCU) HOST TRANSMIT 1 HOST TRANSMIT 0 10 CYCLES SYNCHRONIZATION UNCERTAINTY EARLIEST START OF NEXT BIT TARGET SENSES BIT LEVEL PERCEIVED START OF BIT TIME Figure 17-2. BDC Host-to-Target Serial Bit Timing MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 304 Freescale Semiconductor Chapter 17 Development Support Figure 17-3 shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the bit time. The host should sample the bit level about 10 cycles after it started the bit time. BDC CLOCK (TARGET MCU) HOST DRIVE TO BKGD PIN HIGH-IMPEDANCE TARGET MCU SPEEDUP PULSE HIGH-IMPEDANCE HIGH-IMPEDANCE PERCEIVED START OF BIT TIME R-C RISE BKGD PIN 10 CYCLES 10 CYCLES EARLIEST START OF NEXT BIT HOST SAMPLES BKGD PIN Figure 17-3. BDC Target-to-Host Serial Bit Timing (Logic 1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 305 Chapter 17 Development Support Figure 17-4 shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 cycles after starting the bit time. BDC CLOCK (TARGET MCU) HOST DRIVE TO BKGD PIN HIGH-IMPEDANCE SPEEDUP PULSE TARGET MCU DRIVE AND SPEED-UP PULSE PERCEIVED START OF BIT TIME BKGD PIN 10 CYCLES 10 CYCLES EARLIEST START OF NEXT BIT HOST SAMPLES BKGD PIN Figure 17-4. BDM Target-to-Host Serial Bit Timing (Logic 0) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 306 Freescale Semiconductor Chapter 17 Development Support 17.2.3 BDC Commands BDC commands are sent serially from a host computer to the BKGD pin of the target HCS08 MCU. All commands and data are sent MSB-first using a custom BDC communications protocol. Active background mode commands require that the target MCU is currently in the active background mode while non-intrusive commands may be issued at any time whether the target MCU is in active background mode or running a user application program. Table 17-1 shows all HCS08 BDC commands, a shorthand description of their coding structure, and the meaning of each command. Coding Structure Nomenclature This nomenclature is used in Table 17-1 to describe the coding structure of the BDC commands. Commands begin with an 8-bit hexadecimal command code in the host-to-target direction (most significant bit first) / = separates parts of the command d = delay 16 target BDC clock cycles AAAA = a 16-bit address in the host-to-target direction RD = 8 bits of read data in the target-to-host direction WD = 8 bits of write data in the host-to-target direction RD16 = 16 bits of read data in the target-to-host direction WD16 = 16 bits of write data in the host-to-target direction SS = the contents of BDCSCR in the target-to-host direction (STATUS) CC = 8 bits of write data for BDCSCR in the host-to-target direction (CONTROL) RBKP = 16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint register) WBKP = 16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 307 Chapter 17 Development Support Table 17-1. BDC Command Summary Command Mnemonic 1 Active BDM/ Non-intrusive Coding Structure Description SYNC Non-intrusive n/a1 Request a timed reference pulse to determine target BDC communication speed ACK_ENABLE Non-intrusive D5/d Enable acknowledge protocol. Refer to Freescale document order no. HCS08RMv1/D. ACK_DISABLE Non-intrusive D6/d Disable acknowledge protocol. Refer to Freescale document order no. HCS08RMv1/D. BACKGROUND Non-intrusive 90/d Enter active background mode if enabled (ignore if ENBDM bit equals 0) READ_STATUS Non-intrusive E4/SS Read BDC status from BDCSCR WRITE_CONTROL Non-intrusive C4/CC Write BDC controls in BDCSCR READ_BYTE Non-intrusive E0/AAAA/d/RD Read a byte from target memory READ_BYTE_WS Non-intrusive E1/AAAA/d/SS/RD Read a byte and report status READ_LAST Non-intrusive E8/SS/RD Re-read byte from address just read and report status WRITE_BYTE Non-intrusive C0/AAAA/WD/d Write a byte to target memory WRITE_BYTE_WS Non-intrusive C1/AAAA/WD/d/SS Write a byte and report status READ_BKPT Non-intrusive E2/RBKP Read BDCBKPT breakpoint register WRITE_BKPT Non-intrusive C2/WBKP Write BDCBKPT breakpoint register GO Active BDM 08/d Go to execute the user application program starting at the address currently in the PC TRACE1 Active BDM 10/d Trace 1 user instruction at the address in the PC, then return to active background mode TAGGO Active BDM 18/d Same as GO but enable external tagging (HCS08 devices have no external tagging pin) READ_A Active BDM 68/d/RD Read accumulator (A) READ_CCR Active BDM 69/d/RD Read condition code register (CCR) READ_PC Active BDM 6B/d/RD16 Read program counter (PC) READ_HX Active BDM 6C/d/RD16 Read H and X register pair (H:X) READ_SP Active BDM 6F/d/RD16 Read stack pointer (SP) READ_NEXT Active BDM 70/d/RD Increment H:X by one then read memory byte located at H:X READ_NEXT_WS Active BDM 71/d/SS/RD Increment H:X by one then read memory byte located at H:X. Report status and data. WRITE_A Active BDM 48/WD/d Write accumulator (A) WRITE_CCR Active BDM 49/WD/d Write condition code register (CCR) WRITE_PC Active BDM 4B/WD16/d Write program counter (PC) WRITE_HX Active BDM 4C/WD16/d Write H and X register pair (H:X) WRITE_SP Active BDM 4F/WD16/d Write stack pointer (SP) WRITE_NEXT Active BDM 50/WD/d Increment H:X by one, then write memory byte located at H:X WRITE_NEXT_WS Active BDM 51/WD/d/SS Increment H:X by one, then write memory byte located at H:X. Also report status. The SYNC command is a special operation that does not have a command code. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 308 Freescale Semiconductor Chapter 17 Development Support The SYNC command is unlike other BDC commands because the host does not necessarily know the correct communications speed to use for BDC communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host: • Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock (The slowest clock is normally the reference oscillator/64 or the self-clocked rate/64.) • Drives BKGD high for a brief speedup pulse to get a fast rise time (This speedup pulse is typically one cycle of the fastest clock in the system.) • Removes all drive to the BKGD pin so it reverts to high impedance • Monitors the BKGD pin for the sync response pulse The target, upon detecting the SYNC request from the host (which is a much longer low time than would ever occur during normal BDC communications): • Waits for BKGD to return to a logic high • Delays 16 cycles to allow the host to stop driving the high speedup pulse • Drives BKGD low for 128 BDC clock cycles • Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD • Removes all drive to the BKGD pin so it reverts to high impedance The host measures the low time of this 128-cycle sync response pulse and determines the correct speed for subsequent BDC communications. Typically, the host can determine the correct communication speed within a few percent of the actual target speed and the communication protocol can easily tolerate speed errors of several percent. 17.2.4 BDC Hardware Breakpoint The BDC includes one relatively simple hardware breakpoint that compares the CPU address bus to a 16-bit match value in the BDCBKPT register. This breakpoint can generate a forced breakpoint or a tagged breakpoint. A forced breakpoint causes the CPU to enter active background mode at the first instruction boundary following any access to the breakpoint address. The tagged breakpoint causes the instruction opcode at the breakpoint address to be tagged so that the CPU will enter active background mode rather than executing that instruction if and when it reaches the end of the instruction queue. This implies that tagged breakpoints can only be placed at the address of an instruction opcode while forced breakpoints can be set at any address. The breakpoint enable (BKPTEN) control bit in the BDC status and control register (BDCSCR) is used to enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0, its default value after reset, the breakpoint logic is disabled and no BDC breakpoints are requested regardless of the values in other BDC breakpoint registers and control bits. The force/tag select (FTS) control bit in BDCSCR is used to select forced (FTS = 1) or tagged (FTS = 0) type breakpoints. The on-chip debug module (DBG) includes circuitry for two additional hardware breakpoints that are more flexible than the simple breakpoint in the BDC module. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 309 Chapter 17 Development Support 17.3 On-Chip Debug System (DBG) Because HCS08 devices do not have external address and data buses, the most important functions of an in-circuit emulator have been built onto the chip with the MCU. The debug system consists of an 8-stage FIFO that can store address or data bus information, and a flexible trigger system to decide when to capture bus information and what information to capture. The system relies on the single-wire background debug system to access debug control registers and to read results out of the eight stage FIFO. The debug module includes control and status registers that are accessible in the user’s memory map. These registers are located in the high register space to avoid using valuable direct page memory space. Most of the debug module’s functions are used during development, and user programs rarely access any of the control and status registers for the debug module. The one exception is that the debug system can provide the means to implement a form of ROM patching. This topic is discussed in greater detail in Section 17.3.6, “Hardware Breakpoints.” 17.3.1 Comparators A and B Two 16-bit comparators (A and B) can optionally be qualified with the R/W signal and an opcode tracking circuit. Separate control bits allow you to ignore R/W for each comparator. The opcode tracking circuitry optionally allows you to specify that a trigger will occur only if the opcode at the specified address is actually executed as opposed to only being read from memory into the instruction queue. The comparators are also capable of magnitude comparisons to support the inside range and outside range trigger modes. Comparators are disabled temporarily during all BDC accesses. The A comparator is always associated with the 16-bit CPU address. The B comparator compares to the CPU address or the 8-bit CPU data bus, depending on the trigger mode selected. Because the CPU data bus is separated into a read data bus and a write data bus, the RWAEN and RWA control bits have an additional purpose, in full address plus data comparisons they are used to decide which of these buses to use in the comparator B data bus comparisons. If RWAEN = 1 (enabled) and RWA = 0 (write), the CPU’s write data bus is used. Otherwise, the CPU’s read data bus is used. The currently selected trigger mode determines what the debugger logic does when a comparator detects a qualified match condition. A match can cause: • Generation of a breakpoint to the CPU • Storage of data bus values into the FIFO • Starting to store change-of-flow addresses into the FIFO (begin type trace) • Stopping the storage of change-of-flow addresses into the FIFO (end type trace) 17.3.2 Bus Capture Information and FIFO Operation The usual way to use the FIFO is to setup the trigger mode and other control options, then arm the debugger. When the FIFO has filled or the debugger has stopped storing data into the FIFO, you would read the information out of it in the order it was stored into the FIFO. Status bits indicate the number of words of valid information that are in the FIFO as data is stored into it. If a trace run is manually halted by writing 0 to ARM before the FIFO is full (CNT = 1:0:0:0), the information is shifted by one position and MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 310 Freescale Semiconductor Chapter 17 Development Support the host must perform ((8 – CNT) – 1) dummy reads of the FIFO to advance it to the first significant entry in the FIFO. In most trigger modes, the information stored in the FIFO consists of 16-bit change-of-flow addresses. In these cases, read DBGFH then DBGFL to get one coherent word of information out of the FIFO. Reading DBGFL (the low-order byte of the FIFO data port) causes the FIFO to shift so the next word of information is available at the FIFO data port. In the event-only trigger modes (see Section 17.3.5, “Trigger Modes”), 8-bit data information is stored into the FIFO. In these cases, the high-order half of the FIFO (DBGFH) is not used and data is read out of the FIFO by simply reading DBGFL. Each time DBGFL is read, the FIFO is shifted so the next data value is available through the FIFO data port at DBGFL. In trigger modes where the FIFO is storing change-of-flow addresses, there is a delay between CPU addresses and the input side of the FIFO. Because of this delay, if the trigger event itself is a change-of-flow address or a change-of-flow address appears during the next two bus cycles after a trigger event starts the FIFO, it will not be saved into the FIFO. In the case of an end-trace, if the trigger event is a change-of-flow, it will be saved as the last change-of-flow entry for that debug run. The FIFO can also be used to generate a profile of executed instruction addresses when the debugger is not armed. When ARM = 0, reading DBGFL causes the address of the most-recently fetched opcode to be saved in the FIFO. To use the profiling feature, a host debugger would read addresses out of the FIFO by reading DBGFH then DBGFL at regular periodic intervals. The first eight values would be discarded because they correspond to the eight DBGFL reads needed to initially fill the FIFO. Additional periodic reads of DBGFH and DBGFL return delayed information about executed instructions so the host debugger can develop a profile of executed instruction addresses. 17.3.3 Change-of-Flow Information To minimize the amount of information stored in the FIFO, only information related to instructions that cause a change to the normal sequential execution of instructions is stored. With knowledge of the source and object code program stored in the target system, an external debugger system can reconstruct the path of execution through many instructions from the change-of-flow information stored in the FIFO. For conditional branch instructions where the branch is taken (branch condition was true), the source address is stored (the address of the conditional branch opcode). Because BRA and BRN instructions are not conditional, these events do not cause change-of-flow information to be stored in the FIFO. Indirect JMP and JSR instructions use the current contents of the H:X index register pair to determine the destination address, so the debug system stores the run-time destination address for any indirect JMP or JSR. For interrupts, RTI, or RTS, the destination address is stored in the FIFO as change-of-flow information. 17.3.4 Tag vs. Force Breakpoints and Triggers Tagging is a term that refers to identifying an instruction opcode as it is fetched into the instruction queue, but not taking any other action until and unless that instruction is actually executed by the CPU. This distinction is important because any change-of-flow from a jump, branch, subroutine call, or interrupt causes some instructions that have been fetched into the instruction queue to be thrown away without being executed. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 311 Chapter 17 Development Support A force-type breakpoint waits for the current instruction to finish and then acts upon the breakpoint request. The usual action in response to a breakpoint is to go to active background mode rather than continuing to the next instruction in the user application program. The tag vs. force terminology is used in two contexts within the debug module. The first context refers to breakpoint requests from the debug module to the CPU. The second refers to match signals from the comparators to the debugger control logic. When a tag-type break request is sent to the CPU, a signal is entered into the instruction queue along with the opcode so that if/when this opcode ever executes, the CPU will effectively replace the tagged opcode with a BGND opcode so the CPU goes to active background mode rather than executing the tagged instruction. When the TRGSEL control bit in the DBGT register is set to select tag-type operation, the output from comparator A or B is qualified by a block of logic in the debug module that tracks opcodes and only produces a trigger to the debugger if the opcode at the compare address is actually executed. There is separate opcode tracking logic for each comparator so more than one compare event can be tracked through the instruction queue at a time. 17.3.5 Trigger Modes The trigger mode controls the overall behavior of a debug run. The 4-bit TRG field in the DBGT register selects one of nine trigger modes. When TRGSEL = 1 in the DBGT register, the output of the comparator must propagate through an opcode tracking circuit before triggering FIFO actions. The BEGIN bit in DBGT chooses whether the FIFO begins storing data when the qualified trigger is detected (begin trace), or the FIFO stores data in a circular fashion from the time it is armed until the qualified trigger is detected (end trigger). A debug run is started by writing a 1 to the ARM bit in the DBGC register, which sets the ARMF flag and clears the AF and BF flags and the CNT bits in DBGS. A begin-trace debug run ends when the FIFO gets full. An end-trace run ends when the selected trigger event occurs. Any debug run can be stopped manually by writing a 0 to ARM or DBGEN in DBGC. In all trigger modes except event-only modes, the FIFO stores change-of-flow addresses. In event-only trigger modes, the FIFO stores data in the low-order eight bits of the FIFO. The BEGIN control bit is ignored in event-only trigger modes and all such debug runs are begin type traces. When TRGSEL = 1 to select opcode fetch triggers, it is not necessary to use R/W in comparisons because opcode tags would only apply to opcode fetches that are always read cycles. It would also be unusual to specify TRGSEL = 1 while using a full mode trigger because the opcode value is normally known at a particular address. The following trigger mode descriptions only state the primary comparator conditions that lead to a trigger. Either comparator can usually be further qualified with R/W by setting RWAEN (RWBEN) and the corresponding RWA (RWB) value to be matched against R/W. The signal from the comparator with optional R/W qualification is used to request a CPU breakpoint if BRKEN = 1 and TAG determines whether the CPU request will be a tag request or a force request. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 312 Freescale Semiconductor Chapter 17 Development Support A-Only — Trigger when the address matches the value in comparator A A OR B — Trigger when the address matches either the value in comparator A or the value in comparator B A Then B — Trigger when the address matches the value in comparator B but only after the address for another cycle matched the value in comparator A. There can be any number of cycles after the A match and before the B match. A AND B Data (Full Mode) — This is called a full mode because address, data, and R/W (optionally) must match within the same bus cycle to cause a trigger event. Comparator A checks address, the low byte of comparator B checks data, and R/W is checked against RWA if RWAEN = 1. The high-order half of comparator B is not used. In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the CPU breakpoint is issued when the comparator A address matches. A AND NOT B Data (Full Mode) — Address must match comparator A, data must not match the low half of comparator B, and R/W must match RWA if RWAEN = 1. All three conditions must be met within the same bus cycle to cause a trigger. In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the CPU breakpoint is issued when the comparator A address matches. Event-Only B (Store Data) — Trigger events occur each time the address matches the value in comparator B. Trigger events cause the data to be captured into the FIFO. The debug run ends when the FIFO becomes full. A Then Event-Only B (Store Data) — After the address has matched the value in comparator A, a trigger event occurs each time the address matches the value in comparator B. Trigger events cause the data to be captured into the FIFO. The debug run ends when the FIFO becomes full. Inside Range (A ≤ Address ≤ B) — A trigger occurs when the address is greater than or equal to the value in comparator A and less than or equal to the value in comparator B at the same time. Outside Range (Address < A or Address > B) — A trigger occurs when the address is either less than the value in comparator A or greater than the value in comparator B. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 313 Chapter 17 Development Support 17.3.6 Hardware Breakpoints The BRKEN control bit in the DBGC register may be set to 1 to allow any of the trigger conditions described in Section 17.3.5, “Trigger Modes,” to be used to generate a hardware breakpoint request to the CPU. TAG in DBGC controls whether the breakpoint request will be treated as a tag-type breakpoint or a force-type breakpoint. A tag breakpoint causes the current opcode to be marked as it enters the instruction queue. If a tagged opcode reaches the end of the pipe, the CPU executes a BGND instruction to go to active background mode rather than executing the tagged opcode. A force-type breakpoint causes the CPU to finish the current instruction and then go to active background mode. If the background mode has not been enabled (ENBDM = 1) by a serial WRITE_CONTROL command through the BKGD pin, the CPU will execute an SWI instruction instead of going to active background mode. 17.4 Register Definition This section contains the descriptions of the BDC and DBG registers and control bits. Refer to the high-page register summary in the device overview chapter of this data sheet for the absolute address assignments for all DBG registers. This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses. 17.4.1 BDC Registers and Control Bits The BDC has two registers: • The BDC status and control register (BDCSCR) is an 8-bit register containing control and status bits for the background debug controller. • The BDC breakpoint match register (BDCBKPT) holds a 16-bit breakpoint match address. These registers are accessed with dedicated serial BDC commands and are not located in the memory space of the target MCU (so they do not have addresses and cannot be accessed by user programs). Some of the bits in the BDCSCR have write limitations; otherwise, these registers may be read or written at any time. For example, the ENBDM control bit may not be written while the MCU is in active background mode. (This prevents the ambiguous condition of the control bit forbidding active background mode while the MCU is already in active background mode.) Also, the four status bits (BDMACT, WS, WSF, and DVF) are read-only status indicators and can never be written by the WRITE_CONTROL serial BDC command. The clock switch (CLKSW) control bit may be read or written at any time. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 314 Freescale Semiconductor Chapter 17 Development Support 17.4.1.1 BDC Status and Control Register (BDCSCR) This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL) but is not accessible to user programs because it is not located in the normal memory map of the MCU. 7 6 R 5 4 3 BKPTEN FTS CLKSW BDMACT ENBDM 2 1 0 WS WSF DVF W Normal Reset 0 0 0 0 0 0 0 0 Reset in Active BDM: 1 1 0 0 1 0 0 0 = Unimplemented or Reserved Figure 17-5. BDC Status and Control Register (BDCSCR) Table 17-2. BDCSCR Register Field Descriptions Field Description 7 ENBDM Enable BDM (Permit Active Background Mode) — Typically, this bit is written to 1 by the debug host shortly after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal reset clears it. 0 BDM cannot be made active (non-intrusive commands still allowed) 1 BDM can be made active to allow active background mode commands 6 BDMACT Background Mode Active Status — This is a read-only status bit. 0 BDM not active (user application program running) 1 BDM active and waiting for serial commands 5 BKPTEN BDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select) control bit and BDCBKPT match register are ignored. 0 BDC breakpoint disabled 1 BDC breakpoint enabled 4 FTS 3 CLKSW Force/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue, the CPU enters active background mode rather than executing the tagged opcode. 0 Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that instruction 1 Breakpoint match forces active background mode at next instruction boundary (address need not be an opcode) Select Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC clock source. 0 Alternate BDC clock source 1 MCU bus clock MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 315 Chapter 17 Development Support Table 17-2. BDCSCR Register Field Descriptions (continued) Field Description 2 WS Wait or Stop Status — When the target CPU is in wait or stop mode, most BDC commands cannot function. However, the BACKGROUND command can be used to force the target CPU out of wait or stop and into active background mode where all BDC commands work. Whenever the host forces the target MCU into active background mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before attempting other BDC commands. 0 Target CPU is running user application code or in active background mode (was not in wait or stop mode when background became active) 1 Target CPU is in wait or stop mode, or a BACKGROUND command was used to change from wait or stop to active background mode 1 WSF Wait or Stop Failure Status — This status bit is set if a memory access command failed due to the target CPU executing a wait or stop instruction at or about the same time. The usual recovery strategy is to issue a BACKGROUND command to get out of wait or stop mode into active background mode, repeat the command that failed, then return to the user program. (Typically, the host would restore CPU registers and stack values and re-execute the wait or stop instruction.) 0 Memory access did not conflict with a wait or stop instruction 1 Memory access command failed because the CPU entered wait or stop mode 0 DVF Data Valid Failure Status — This status bit is not used in the MC9S08LC60 Series because it does not have any slow access memory. 0 Memory access did not conflict with a slow memory access 1 Memory access command failed because CPU was not finished with a slow memory access 17.4.1.2 BDC Breakpoint Match Register (BDCBKPT) This 16-bit register holds the address for the hardware breakpoint in the BDC. The BKPTEN and FTS control bits in BDCSCR are used to enable and configure the breakpoint logic. Dedicated serial BDC commands (READ_BKPT and WRITE_BKPT) are used to read and write the BDCBKPT register but is not accessible to user programs because it is not located in the normal memory map of the MCU. Breakpoints are normally set while the target MCU is in active background mode before running the user application program. For additional information about setup and use of the hardware breakpoint logic in the BDC, refer to Section 17.2.4, “BDC Hardware Breakpoint.” 17.4.2 System Background Debug Force Reset Register (SBDFR) This register contains a single write-only control bit. A serial background mode command such as WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are ignored. Reads always return 0x00. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 316 Freescale Semiconductor Chapter 17 Development Support R 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 BDFR1 W Reset 0 0 0 0 0 0 0 0 = Unimplemented or Reserved 1 BDFR is writable only through serial background mode debug commands, not from user programs. Figure 17-6. System Background Debug Force Reset Register (SBDFR) Table 17-3. SBDFR Register Field Description Field Description 0 BDFR Background Debug Force Reset — A serial active background mode command such as WRITE_BYTE allows an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot be written from a user program. 17.4.3 DBG Registers and Control Bits The debug module includes nine bytes of register space for three 16-bit registers and three 8-bit control and status registers. These registers are located in the high register space of the normal memory map so they are accessible to normal application programs. These registers are rarely if ever accessed by normal user application programs with the possible exception of a ROM patching mechanism that uses the breakpoint logic. 17.4.3.1 Debug Comparator A High Register (DBGCAH) This register contains compare value bits for the high-order eight bits of comparator A. This register is forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1. 17.4.3.2 Debug Comparator A Low Register (DBGCAL) This register contains compare value bits for the low-order eight bits of comparator A. This register is forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1. 17.4.3.3 Debug Comparator B High Register (DBGCBH) This register contains compare value bits for the high-order eight bits of comparator B. This register is forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1. 17.4.3.4 Debug Comparator B Low Register (DBGCBL) This register contains compare value bits for the low-order eight bits of comparator B. This register is forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 317 Chapter 17 Development Support 17.4.3.5 Debug FIFO High Register (DBGFH) This register provides read-only access to the high-order eight bits of the FIFO. Writes to this register have no meaning or effect. In the event-only trigger modes, the FIFO only stores data into the low-order byte of each FIFO word, so this register is not used and will read 0x00. Reading DBGFH does not cause the FIFO to shift to the next word. When reading 16-bit words out of the FIFO, read DBGFH before reading DBGFL because reading DBGFL causes the FIFO to advance to the next word of information. 17.4.3.6 Debug FIFO Low Register (DBGFL) This register provides read-only access to the low-order eight bits of the FIFO. Writes to this register have no meaning or effect. Reading DBGFL causes the FIFO to shift to the next available word of information. When the debug module is operating in event-only modes, only 8-bit data is stored into the FIFO (high-order half of each FIFO word is unused). When reading 8-bit words out of the FIFO, simply read DBGFL repeatedly to get successive bytes of data from the FIFO. It isn’t necessary to read DBGFH in this case. Do not attempt to read data from the FIFO while it is still armed (after arming but before the FIFO is filled or ARMF is cleared) because the FIFO is prevented from advancing during reads of DBGFL. This can interfere with normal sequencing of reads from the FIFO. Reading DBGFL while the debugger is not armed causes the address of the most-recently fetched opcode to be stored to the last location in the FIFO. By reading DBGFH then DBGFL periodically, external host software can develop a profile of program execution. After eight reads from the FIFO, the ninth read will return the information that was stored as a result of the first read. To use the profiling feature, read the FIFO eight times without using the data to prime the sequence and then begin using the data to get a delayed picture of what addresses were being executed. The information stored into the FIFO on reads of DBGFL (while the FIFO is not armed) is the address of the most-recently fetched opcode. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 318 Freescale Semiconductor Chapter 17 Development Support 17.4.3.7 Debug Control Register (DBGC) This register can be read or written at any time. 7 6 5 4 3 2 1 0 DBGEN ARM TAG BRKEN RWA RWAEN RWB RWBEN 0 0 0 0 0 0 0 0 R W Reset Figure 17-7. Debug Control Register (DBGC) Table 17-4. DBGC Register Field Descriptions Field Description 7 DBGEN Debug Module Enable — Used to enable the debug module. DBGEN cannot be set to 1 if the MCU is secure. 0 DBG disabled 1 DBG enabled 6 ARM Arm Control — Controls whether the debugger is comparing and storing information in the FIFO. A write is used to set this bit (and ARMF) and completion of a debug run automatically clears it. Any debug run can be manually stopped by writing 0 to ARM or to DBGEN. 0 Debugger not armed 1 Debugger armed 5 TAG Tag/Force Select — Controls whether break requests to the CPU will be tag or force type requests. If BRKEN = 0, this bit has no meaning or effect. 0 CPU breaks requested as force type requests 1 CPU breaks requested as tag type requests 4 BRKEN Break Enable — Controls whether a trigger event will generate a break request to the CPU. Trigger events can cause information to be stored in the FIFO without generating a break request to the CPU. For an end trace, CPU break requests are issued to the CPU when the comparator(s) and R/W meet the trigger requirements. For a begin trace, CPU break requests are issued when the FIFO becomes full. TRGSEL does not affect the timing of CPU break requests. 0 CPU break requests not enabled 1 Triggers cause a break request to the CPU 3 RWA R/W Comparison Value for Comparator A — When RWAEN = 1, this bit determines whether a read or a write access qualifies comparator A. When RWAEN = 0, RWA and the R/W signal do not affect comparator A. 0 Comparator A can only match on a write cycle 1 Comparator A can only match on a read cycle 2 RWAEN Enable R/W for Comparator A — Controls whether the level of R/W is considered for a comparator A match. 0 R/W is not used in comparison A 1 R/W is used in comparison A 1 RWB R/W Comparison Value for Comparator B — When RWBEN = 1, this bit determines whether a read or a write access qualifies comparator B. When RWBEN = 0, RWB and the R/W signal do not affect comparator B. 0 Comparator B can match only on a write cycle 1 Comparator B can match only on a read cycle 0 RWBEN Enable R/W for Comparator B — Controls whether the level of R/W is considered for a comparator B match. 0 R/W is not used in comparison B 1 R/W is used in comparison B MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 319 Chapter 17 Development Support 17.4.3.8 Debug Trigger Register (DBGT) This register can be read any time, but may be written only if ARM = 0, except bits 4 and 5 are hard-wired to 0s. 7 6 TRGSEL BEGIN 0 0 R 5 4 0 0 3 2 1 0 TRG3 TRG2 TRG1 TRG0 0 0 0 0 W Reset 0 0 = Unimplemented or Reserved Figure 17-8. Debug Trigger Register (DBGT) Table 17-5. DBGT Register Field Descriptions Field Description 7 TRGSEL Trigger Type — Controls whether the match outputs from comparators A and B are qualified with the opcode tracking logic in the debug module. If TRGSEL is set, a match signal from comparator A or B must propagate through the opcode tracking logic and a trigger event is only signalled to the FIFO logic if the opcode at the match address is actually executed. 0 Trigger on access to compare address (force) 1 Trigger if opcode at compare address is executed (tag) 6 BEGIN Begin/End Trigger Select — Controls whether the FIFO starts filling at a trigger or fills in a circular manner until a trigger ends the capture of information. In event-only trigger modes, this bit is ignored and all debug runs are assumed to be begin traces. 0 Data stored in FIFO until trigger (end trace) 1 Trigger initiates data storage (begin trace) 3:0 TRG[3:0] Select Trigger Mode — Selects one of nine triggering modes, as described below. 0000 A-only 0001 A OR B 0010 A Then B 0011 Event-only B (store data) 0100 A then event-only B (store data) 0101 A AND B data (full mode) 0110 A AND NOT B data (full mode) 0111 Inside range: A ≤ address ≤ B 1000 Outside range: address < A or address > B 1001 – 1111 (No trigger) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 320 Freescale Semiconductor Chapter 17 Development Support 17.4.3.9 Debug Status Register (DBGS) This is a read-only status register. R 7 6 5 4 3 2 1 0 AF BF ARMF 0 CNT3 CNT2 CNT1 CNT0 0 0 0 0 0 0 0 0 W Reset = Unimplemented or Reserved Figure 17-9. Debug Status Register (DBGS) Table 17-6. DBGS Register Field Descriptions Field Description 7 AF Trigger Match A Flag — AF is cleared at the start of a debug run and indicates whether a trigger match A condition was met since arming. 0 Comparator A has not matched 1 Comparator A match 6 BF Trigger Match B Flag — BF is cleared at the start of a debug run and indicates whether a trigger match B condition was met since arming. 0 Comparator B has not matched 1 Comparator B match 5 ARMF Arm Flag — While DBGEN = 1, this status bit is a read-only image of ARM in DBGC. This bit is set by writing 1 to the ARM control bit in DBGC (while DBGEN = 1) and is automatically cleared at the end of a debug run. A debug run is completed when the FIFO is full (begin trace) or when a trigger event is detected (end trace). A debug run can also be ended manually by writing 0 to ARM or DBGEN in DBGC. 0 Debugger not armed 1 Debugger armed 3:0 CNT[3:0] FIFO Valid Count — These bits are cleared at the start of a debug run and indicate the number of words of valid data in the FIFO at the end of a debug run. The value in CNT does not decrement as data is read out of the FIFO. The external debug host is responsible for keeping track of the count as information is read out of the FIFO. 0000 Number of valid words in FIFO = No valid data 0001 Number of valid words in FIFO = 1 0010 Number of valid words in FIFO = 2 0011 Number of valid words in FIFO = 3 0100 Number of valid words in FIFO = 4 0101 Number of valid words in FIFO = 5 0110 Number of valid words in FIFO = 6 0111 Number of valid words in FIFO = 7 1000 Number of valid words in FIFO = 8 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 321 Chapter 17 Development Support MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 322 Freescale Semiconductor Appendix A Electrical Characteristics A.1 Introduction This section contains electrical and timing specifications. A.2 Absolute Maximum Ratings Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in Table A-1 may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this section. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pull-up resistor associated with the pin is enabled. Table A-1. Absolute Maximum Ratings Rating Symbol Value Unit Supply voltage VDD –0.3 to +3.8 V Maximum current into VDD IDD 120 mA Digital input voltage VIn –0.3 to VDD + 0.3 V Instantaneous maximum current Single pin limit (applies to all port pins)(1), (2), (3) ID ± 25 mA Tstg –55 to 150 °C Storage temperature range 1 Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp voltages, then use the larger of the two resistance values. 2 All functional non-supply pins are internally clamped to V SS and VDD. 3 Power supply must maintain regulation within operating V DD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if the clock rate is very low which would reduce overall power consumption. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 323 Appendix A Electrical Characteristics A.3 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. Table A-2. Thermal Characteristics Rating Symbol Value Unit Operating temperature range (packaged) TA -40 to 85 °C Thermal resistance 80-pin LQFP 1s 2s2p 64 49 °C/W θJA(1), (2), (3),(4) 64-pin LQFP 1s 2s2p 66 47 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2 Junction to Ambient Natural Convection 3 1s - Single Layer Board, one signal layer 4 2s2p - Four Layer Board, 2 signal and 2 power layers The average chip-junction temperature (TJ) in °C can be obtained from: TJ = TA + (PD × θJA) Eqn. A-1 where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C/W PD = Pint + PI/O Pint = IDD × VDD, Watts — chip internal power PI/O = Power dissipation on input and output pins — user determined For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected) is: PD = K ÷ (TJ + 273°C) Eqn. A-2 Solving Equation A-1 and Equation A-2 for K gives: MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 324 Freescale Semiconductor Appendix A Electrical Characteristics K = PD × (TA + 273°C) + θJA × (PD)2 Eqn. A-3 where K is a constant pertaining to the particular part. K can be determined from Equation A-3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any value of TA. A.4 Electrostatic Discharge (ESD) Protection Characteristics Although damage from static discharge is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with CDF-AEC-Q00 Stress Test Qualification for Automotive Grade Integrated Circuits. (http://www.aecouncil.com/) This device was qualified to AEC-Q100 Rev E. A device is considered to have failed if, after exposure to ESD pulses, the device no longer meets the device specification requirements. Complete dc parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. Table A-3. ESD and Latch-up Test Conditions Model Human Body Machine Latch-up Description Symbol Value Unit Series resistance R1 1500 Ω Storage capacitance C 100 pF Number of pulses per pin — 3 Series resistance R1 0 Ω Storage capacitance C 200 pF Number of pulses per pin — 3 Minimum input voltage limit 1.8 V Maximum input voltage limit 3.6 V Table A-4. ESD and Latch-Up Protection Characteristics No. 1 Rating(1) Symbol Min Max Unit 1 Human body model (HBM) VHBM ± 2000 — V 2 Machine model (MM) VMM ± 200 — V 3 Charge device model (CDM) VCDM ± 500 — V 4 Latch-up current at TA = 85°C ILAT ± 100 — mA Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 325 Appendix A Electrical Characteristics A.5 DC Characteristics This section includes information about power supply requirements, I/O pin characteristics, and power supply current in various operating modes. Table A-5. DC Characteristics (Sheet 1 of 2) (Temperature Range = -40 to 85°C Ambient) Symbol Min Typical(1) Max Unit VDD 1.8 — 3.6 V Minimum RAM retention supply voltage applied to VDD VRAM 1.0(2) — — V Low-voltage detection threshold — high range (VDD falling) (VDD rising) VLVDH 2.02 2.07 2.15 2.23 2.3 2.33 Low-voltage detection threshold — low range (VDD falling) (VDD rising) VLVDL 1.76 1.8 1.88 1.93 1.98 2.04 Low-voltage warning threshold — high range (VDD falling) (VDD rising) VLVWH 2.32 2.32 2.45 2.48 2.6 2.6 Low-voltage warning threshold — low range (VDD falling) (VDD rising) VLVWL 2.02 2.02 2.15 2.21 2.3 2.33 Power on reset (POR) re-arm voltage(2) Mode = stop Mode = run and Wait VRearm 0.20 0.50 0.30 0.80 0.40 1.2 1.20 1.21 V Parameter Supply voltage (run, wait and stop modes.) V V V V V Bandgap voltage reference, VBG 1.18 Input high voltage (VDD > 2.3 V) (all digital inputs) VIH 0.70 × VDD — V Input high voltage (1.8 V ≤ VDD ≤ 2.3 V) (all digital inputs) VIH 0.85 × VDD — V Input low voltage (VDD > 2.3 V) (all digital inputs) VIL — 0.35 × VDD V Input low voltage (1.8 V ≤ VDD ≤ 2.3 V) (all digital inputs) VIL — 0.30 × VDD V Input hysteresis (all digital inputs) Vhys 0.06 × VDD — V Input leakage current (per pin) VIn = VDD or VSS, all input only pins |IIn| — 0.025 1 μA High impedance (off-state) leakage current (per pin) VIn = VDD or VSS, all input/output (all except PTC7) VIn = VDD or VSS, all input/output (PTC7 only) |IOZ| — 0.025 0.025 1 2 μA Internal pullup and pulldown resistors(3) (all port pins and IRQ) RPU 17.5 52.5 kΩ Internal pulldown resistors (all port pins and IRQ) RPD 17.5 52.5 kΩ MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 326 Freescale Semiconductor Appendix A Electrical Characteristics Table A-5. DC Characteristics (Sheet 2 of 2) (Temperature Range = -40 to 85°C Ambient) Parameter Output high voltage (VDD ≥ 1.8 V) IOH = –2 mA (ports A, B, and C) Symbol Min VOH VDD – 0.5 3 4 5 6 7 8 Unit — V — — — Maximum total IOH for all port pins |IOHT| Output low voltage (VDD ≥ 1.8 V) IOL = 2.0 mA (ports A, B, and C) VOL Output low voltage (all port pins) IOL = 10.0 mA (VDD ≥ 2.7 V) IOL = 6 mA (VDD ≥ 2.3 V) IOL = 3 mA (VDD ≥ 1.8 V) 2 Max VDD – 0.5 Output high voltage (all port pins) IOH = –10 mA (VDD ≥ 2.7 V) IOH = –6 mA (VDD ≥ 2.3 V) IOH = –3 mA (VDD ≥ 1.8 V) 1 Typical(1) Maximum total IOL for all port pins IOLT dc injection current(4), (5), (6), (7), (8) VIN < VSS, VIN > VDD Single pin limit Total MCU limit, includes sum of all stressed pins |IIC| Input capacitance (all non-supply pins)(2) CIn — 60 mA — 0.5 V — — — 0.5 0.5 0.5 — 60 mA — — 0.2 5 mA mA — 7 pF Typicals are measured at 25°C. This parameter is characterized and not tested on each device. Measurement condition for pull resistors: VIn = VSS for pullup and VIn = VDD for pulldown. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if clock rate is very low which would reduce overall power consumption. All functional non-supply pins are internally clamped to VSS and VDD. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two values. This parameter is characterized and not tested on each device. IRQ does not have a clamp diode to VDD. Do not drive IRQ above VDD. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 327 Appendix A Electrical Characteristics Pull Up Resistance Pull Down Resistance 36 34 32 32 Resistance (kOhm) Resistance (kOhm) 34 -40C 30 25C 28 70C 26 85C 24 22 30 -40C 28 25C 26 70C 85C 24 22 20 20 1.8 2 2.3 2.7 3 3.6 1.8 2 2.3 VDD (V) 2.7 3 3.6 VDD (V) Figure A-1. Pullup and Pulldown Typical Resistor Values (VDD = 3.0 V) IOL at Vdd = 2.7V -40C IOL (mA) 40 25C 30 70C 20 85C 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 VOL (V) Figure A-2. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C) Typical IOL vs. VOL at VDD = 2.7 V MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 328 Freescale Semiconductor Appendix A Electrical Characteristics VOL vs VDD 350.00 -40C (3mA) 300.00 10mA -40C (6mA) VOL (mV) 250.00 -40C (10mA) 6mA 25C (3mA) 200.00 25C (6mA) 25C (10mA) 150.00 3mA 70C (3mA) 100.00 70C (6mA) 70C (10mA) 50.00 85C (3mA) 85C (6mA) 0.00 1.8 2.3 85C (10mA) 2.7 VDD (V) Figure A-3. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C) Typical VOL vs. VDD IOH at Vdd =2.7V -35 IOH (mA) -30 -25 -40C -20 25C -15 70C -10 85C -5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 VDD-VOH (V) Figure A-4. Typical Low-Side Driver (Source) Characteristics (Ports A, B, and C) Typical IOH vs. VDD – VOH at VDD = 2.7 V MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 329 Appendix A Electrical Characteristics VOH vs VDD -40C (3mA) -40C (6mA) -40C (10mA) 25C (3mA) 25C (6mA) 25C (10mA) 70C (3mA) 70C (6mA) 70C (10mA) 85C (3mA) 85C (6mA) 85C (10mA) 2.700 VOH (mV) 2.500 2.300 2.100 1.900 1.700 1.500 1.8 2.3 2.7 VDD (V) Figure A-5. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C) Typical VOH vs. VDD at Spec IOH A.6 Supply Current Characteristics Table A-6. Supply Current Characteristics VDD (V) Typical(1) Max(2) Temp. (°C) 3 800 μA 1.7 mA 85 2 600 μA 1.3 mA 85 3 5 mA 8.7 mA 85 2 4 mA 6.3 mA 85 3 12 mA 17.2 mA 85 2 10 mA 15.5 mA 85 3 770 nA 10 μA 85 2 600 nA 10 μA 85 3 770 nA 12 μA 85 2 600 nA 12 μA 85 3 840 nA 20 μA 85 2 660 nA 20 μA 85 Internal RTI [clock?] adder to stop2 or stop3(5) 3 350 nA 85 2 350 nA 85 LVI adder to stop3 (LVDSE = LVDE = 1) 3 75 μA 85 2 70 μA 85 Parameter Symbol (3) Run supply current measured at (CPU clock = 2 MHz, fBus = 1 MHz) current (3) Run supply measured at (CPU clock = 16 MHz, fBus = 8 MHz) current (3) Run supply measured at (CPU clock = 40 MHz, fBus = 20 MHz) RIDD RIDD RIDD Stop1 mode supply current S1IDD Stop2 mode supply current S2IDD Stop3 mode supply current(4) S3IDD MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 330 Freescale Semiconductor Appendix A Electrical Characteristics Table A-6. Supply Current Characteristics (continued) Parameter Adder to stop3 for oscillator enabled(6) (OSCSTEN =1) (32 kHz) Adder for loss-of-clock detection (LOCD = 0) 1 2 3 4 5 6 Symbol VDD (V) Typical(1) Max(2) 3 4 μA 85 2 3.5 μA 85 3 9 μA 85 Temp. (°C) Typicals are measured at 25°C. See Table A-6 through Table A-9 for typical curves across voltage/temperature. Values given here are preliminary estimates prior to completing characterization. All modules except ADC active, ICG configured for FBE, and does not include any dc loads on port pins. With LCD and external clock module disabled. Most customers are expected to find that auto-wakeup from stop2 or stop3 can be used instead of the higher current wait mode. Wait mode typical is 560 μA at 3 V and 422 μA at 2V with fBus = 1 MHz. Values given under the following conditions: low range operation (RANGE = 0), low power mode (HGO = 0), clock monitor disabled (LOCD = 1). Figure A-6. Typical Run IDD for FBE FEE Mode, IDD vs. VDD MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 331 Appendix A Electrical Characteristics Typical Room Temp SIDD1 1000 Room Temp SIDD1 (nA) SIDD1 (uA) 900 800 700 600 500 400 1.8 2.1 2.4 2.7 3 3.3 3.6 VDD (V) Figure A-7. Typical Stop1 IDD Typical Room Temp SIDD2 1000 Room Temp SIDD2 (nA) SIDD2 (uA) 900 800 TBD 700 600 500 400 1.8 2.1 2.4 2.7 3 3.3 3.6 VDD (V) Figure A-8. Typical Stop 2 IDD MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 332 Freescale Semiconductor Appendix A Electrical Characteristics Typical Room Temp SIDD3 1000 Room Temp SIDD3 (nA) SIDD3 (uA) 900 800 TBD 700 600 500 400 1.8 2.1 2.4 2.7 3 3.3 3.6 VDD (V) Figure A-9. Typical Stop3 IDD A.7 ADC Characteristics Table A-7. 3 Volt 12-bit ADC Operating Conditions Symbol Min Typ(1) Max Unit Absolute VDDAD 1.8 — 3.6 V Delta to VDD (VDD-VDDAD)(2) ΔVDDAD -100 0 +100 mV Delta to VSS (VSS-VSSAD)2 ΔVSSAD -100 0 +100 mV VDDAD VDDAD V Characteristic Supply voltage Ground voltage Conditions Ref Voltage High (80-pin package only) VREFH Ref Voltage Low (80-pin package only) VREFL VSSAD VSSAD VSSAD V IDDAD — 0.007 0.8 μA Input Voltage VADIN VREFL — VREFH V Input Capacitance CADIN — 4.5 5.5 pF Input Resistance RADIN — 5 7 kΩ Supply Current Comment 1.8 Stop, Reset, Module Off MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 333 Appendix A Electrical Characteristics Table A-7. 3 Volt 12-bit ADC Operating Conditions Min Typ(1) Max — — — — 2 5 10 bit mode fADCK > 4MHz fADCK < 4MHz — — — — 5 10 8 bit mode (all valid fADCK) — — 10 0.4 — 8.0 0.4 — 4.0 Characteristic Analog Source Resistance Conditions Symbol 12 bit mode fADCK > 4MHz fADCK < 4MHz ADC Conversion Clock Freq. Unit Comment kΩ External to MCU RAS High Speed (ADLPC=0) fADCK Low Power (ADLPC=1) MHz 1 Typical values assume VDDAD = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 DC potential difference. SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection ZAS RAS ADC SAR ENGINE RADIN + VADIN VAS + – CAS – RADIN INPUT PIN RADIN INPUT PIN RADIN INPUT PIN CADIN Figure A-10. ADC Input Impedance Equivalency Diagram Table A-8. 3 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) Characteristic Supply Current ADLPC=1 ADLSMP=1 ADCO=1 Conditions C Symbol Min Typ(1) Max Unit T IDDAD — 120 — μA Comment MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 334 Freescale Semiconductor Appendix A Electrical Characteristics Table A-8. 3 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) (continued) C Symbol Min Typ(1) Max Unit Supply Current ADLPC=1 ADLSMP=0 ADCO=1 T IDDAD — 202 — μA Supply Current ADLPC=0 ADLSMP=1 ADCO=1 T IDDAD — 288 — μA Supply Current ADLPC=0 ADLSMP=0 ADCO=1 T IDDAD — 532 — μA — — 1 mA 2 3.3 5 MHz 1.25 2 3.3 tADACK = 1/fADACK — 20 — — 40 — ADCK cycles See Table A-7 for conversion time variances — 3.5 — — 23.5 — — ±3.0 — Characteristic Conditions VDDAD < 3.6V P ADC Asynchronous Clock Source High Speed (ADLPC=0) P Conversion Time (Including sample time) Short Sample (ADLSMP=0) Sample Time Short Sample (ADLSMP=0) fADACK Low Power (ADLPC=1) P tADC Long Sample (ADLSMP=1) P tADS Long Sample (ADLSMP=1) Total Unadjusted Error (80-pin package only) 12 bit mode T 10 bit mode P — ±1 ±2.5 8 bit mode P — ±0.5 ±1.0 Total Unadjusted Error (64-pin package only) 12 bit mode T 10 bit mode P — ±1.5 ±3.5 8 bit mode P — ±0.7 ±1.5 Differential Non-Linearity 12 bit mode T — ±1.75 — 10 bit mode(3) P — ±0.5 ±1.0 8 bit mode3 P — ±0.3 ±0.5 12 bit mode T — ±3 — 10 bit mode T — ±2.5 ±3.5 8 bit mode T — ±1.5 ±2 12 bit mode T — ±1.5 — 10 bit mode P — ±0.5 ±1.5 8 bit mode P — ±0.5 ±0.5 Integral Non-Linearity Zero-Scale Error (80-pin package only) ETUE ETUE DNL INL EZS Comment ADCK cycles LSB2 Includes quantization LSB2 Includes quantization LSB(2) LSB2 LSB2 VADIN = VSSAD MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 335 Appendix A Electrical Characteristics Table A-8. 3 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) (continued) Characteristic Conditions C Symbol EZS Min Typ(1) Max Zero-Scale Error (64-pin package only) 12 bit mode T 10 bit mode P — ±1.5 ±2.1 8 bit mode P — ±0.5 ±0.7 Full-Scale Error (80-pin package only) 12 bit mode T — ±1.0 — 10 bit mode P — ±0.5 ±1 8 bit mode P — ±0.5 ±0.5 12 bit mode T 10 bit mode P — ±1 ±1.5 8 bit mode P — ±0.5 ±0.5 12 bit mode D — ±0.5 — 10 bit mode — — ±0.5 8 bit mode — — ±0.5 — ±2 — 10 bit mode — ±0.2 ±4 8 bit mode — ±0.1 ±1.2 — 1.646 — — 1.769 — — 701.2 — Full-Scale Error (64-pin package only) Quantization Error Input Leakage Error 12 bit mode Temp Sensor Slope -40°C– 25°C Temp Sensor Voltage 25°C D D EFS EFS EQ EIL m 25°C– 125°C D VTEMP25 Unit Comment LSB2 VADIN = VSSAD LSB2 VADIN = VDDAD LSB2 VADIN = VDDAD LSB2 LSB2 Pad leakage(4) * RAS mV/°C mV 1 Typical values assume VDDAD = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2 1 LSB = (V N REFH - VREFL)/2 3 Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes 4 Based on input pad leakage current. Refer to pad electricals. A.8 LCD Characteristics Table A-9. LCD Electricals, 3-V Glass Characteristic Symbol Min Typ Max Unit LCD Supply Voltage VLCD 0.9 - 1.8 V LCD Frame Frequency fRame 25 30 100 Hz Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 336 Freescale Semiconductor Appendix A Electrical Characteristics Table A-9. LCD Electricals, 3-V Glass (continued) Characteristic Symbol Min Typ Max Unit CLCD 100 100 433 nF CBYLCD 100 100 433 nF all segments off, all FP enabled Isegoff — 0.35 — μA half of segments on Iseghalf — 1 — μA all segments on Isegallon — 1 — μA all segments off, all FP enabled Isegoff — 2.65 — μA half of segments on Iseghalf — 3.8 — μA all segments on Isegallon — 3.6 — μA all segments off, all FP enabled Isegoff — 0.2 — μA half of segments on Iseghalf — 0.2 — μA all segments on Isegallon — 0.2 — μA all segments off, all FP enabled Isegoff — 0.15 - μA half of segments on Iseghalf - 0.75 - μA all segments on Isegallon - 0.7 - μA all segments off, all FP enabled Isegoff - 2.7 - μA half of segments on Iseghalf - 3.85 - μA all segments on Isegallon - 3.6 - μA LCD Charge Pump Capacitance LCD Bypass Capacitance LCD Current Consumption VLL2 connect to VDD; VDD = 2 V LCD Current Consumption Trippler Buffered Mode; VDD = 3 V, VLCD = 1.0 V LCD Current Consumption Trippler Bypassed Mode; VDD = 3 V, VLCD = 1.0 V LCD Current Consumption VLL3 connect to VDD; VDD = 3 V LCD Current Consumption Doubler Buffered Mode; VLCD = 1.5 V Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 337 Appendix A Electrical Characteristics Table A-10. LCD Electricals, 5 V Glass Characteristic Symbol Min Typ Max Unit LCD Supply Voltage VLCD 0.9 — 1.8 V LCD Frame Frequency fRame 25 30 100 Hz LCD Charge Pump Capacitance CLCD 100 100 433 nF CBYLCD 100 100 433 nF all segments off, all FP enabled Isegoff — 0.2 — μA half of segments on Iseghalf — 0.95 — μA all segments on Isegallon — 0.67 — μA all segments off, all FP enabled Isegoff — 3.1 — μA half of segments on Iseghalf — 4.2 — μA all segments on Isegallon — 3.6 — μA all segments off, all FP enabled Isegoff — 0.1 — μA half of segments on Iseghalf — 0.1 — μA all segments on Isegallon — 0.1 — μA LCD Bypass Capacitance LCD Current Consumption VLL2 connect to VDD; VDD = 3.3 V LCD Current Consumption Trippler Buffered Mode; VDD = 3 V, VLCD = 1.667 V LCD Current Consumption Trippler Bypassed Mode; VDD = 3 V, VLCD = 1.667 V Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 338 Freescale Semiconductor Appendix A Electrical Characteristics A.9 Internal Clock Generation Module Characteristics ICG EXTAL XTAL RS RF C1 Crystal or Resonator (See Note) C2 NOTE: Use fundamental mode crystal or ceramic resonator only. Table A-11. ICG DC Electrical Specifications (Temperature Range = 0 to 70°C Ambient) Characteristic Symbol Load capacitors C1 C2 Feedback resistor Low range (32k to 100 kHz) High range (1M – 16 MHz) RF Series resistor Low range (32 kHz to 100 kHz) High range (1 MHz to 16 MHz) RS 1 2 Typ(1) Min Max Unit See Note (2) 10 1 0 0 0 0 MΩ MΩ 10 0 kΩ Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value. See crystal or resonator manufacturer’s recommendation. A.9.1 ICG Frequency Specifications Table A-12. ICG Frequency Specifications (VDDA = VDDA (min) to VDDA (max), Temperature Range = 0 to 70°C Ambient) Characteristic Oscillator crystal or resonator (REFS = 1) (Fundamental mode crystal or ceramic resonator) Low range High range, FLL bypassed external (CLKS = 10) High range, FLL engaged external (CLKS = 11) Input clock frequency (CLKS = 11, REFS = 0) Low range High range Input clock frequency (CLKS = 10, REFS = 0) Internal reference frequency (untrimmed) Symbol Min Typical Max Unit flo fhi_byp fhi_eng 32 1 2 — — — 100 16 10 kHz MHz MHz flo fhi_eng 32 2 — — 100 10 kHz MHz fExtal 0 — 40 MHz fICGIRCLK 182.25 243 303.75 kHz MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 339 Appendix A Electrical Characteristics Table A-12. ICG Frequency Specifications (VDDA = VDDA (min) to VDDA (max), Temperature Range = 0 to 70°C Ambient) Characteristic Symbol Min Typical Max Unit 4 tdc 40 — 60 % fICGOUT fExtal (min) flo (min) fExtal (max) fICGDCLKmax (max) MHz Minimum DCO clock (ICGDCLK) frequency fICGDCLKmin 8 Maximum DCO clock (ICGDCLK) frequency fICGDCLKmax Duty cycle of input clock (REFS = 0) Output clock ICGOUT frequency CLKS = 10, REFS = 0 All other cases Self-clock mode (ICGOUT) frequency (1) Self-clock mode reset (ICGOUT) frequency Loss of reference frequency Low range High range — — MHz 40 MHz fICGDCLKmax MHz 10.5 MHz 5 50 25 500 kHz 0.5 1.5 MHz — — ms fSelf fICGDCLKmin fSelf_reset 5.5 fLOR 8 (2) Loss of DCO frequency (3) fLOD Crystal start-up time (4), (5) Low range High range t t — — FLL lock time 4, (6) Low range High range tLockl tLockh — — 5 5 ms FLL frequency unlock range nUnlock –4*N 4*N counts nLock –2*N 2*N counts — 0.2 % fICG CSTL CSTH FLL frequency lock range 430 4 4, (7) measured at fICGOUT Max ICGOUT period jitter, Long term jitter (averaged over 2 ms interval) Internal oscillator deviation from trimmed frequency(8) VDD = 1.8 – 3.6 V, (constant temperature) VDD = 3.0 V ±10%, –40° C to 85° C 1 2 3 4 5 6 7 8 CJitter ACCint — — ± 0.5 ±0.5 ±2 ±2 % Self-clocked mode frequency is the frequency that the DCO generates when the FLL is open-loop. Loss of reference frequency is the reference frequency detected internally, which transitions the ICG into self-clocked mode if it is not in the desired range. Loss of DCO frequency is the DCO frequency detected internally, which transitions the ICG into FLL bypassed external mode (if an external reference exists) if it is not in the desired range. This parameter is characterized before qualification rather than 100% tested. Proper PC board layout procedures must be followed to achieve specifications. This specification applies to the period of time required for the FLL to lock after entering FLL engaged internal or external modes. If a crystal/resonator is being used as the reference, this specification assumes it is already running. Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fICGOUT. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the FLL circuitry via VDDA and VSSA and variation in crystal oscillator frequency increase the CJitter percentage for a given interval. See Figure A-10 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 340 Freescale Semiconductor Appendix A Electrical Characteristics Figure A-11. Internal Oscillator Deviation from Trimmed Frequency A.10 AC Characteristics This section describes ac timing characteristics for each peripheral system. For detailed information about how clocks for the bus are generated, see Chapter 7, “Internal Clock Generator (ICG) Module.” MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 341 Appendix A Electrical Characteristics A.10.1 Control Timing Table A-13. Control Timing Parameter Symbol Min Typical Max Unit Bus frequency (tcyc = 1/fBus) fBus dc — 20 MHz Real-time interrupt internal oscillator period tRTI 700 1300 μs External reset pulse width(1) textrst 1.5 x fSelf_reset — ns Reset low drive(2) trstdrv 34 x fSelf_reset — ns Active background debug mode latch setup time tMSSU 25 — ns Active background debug mode latch hold time tMSH 25 — ns IRQ pulse width(3) tILIH 1.5 x tcyc — ns tRise, tFall — — (4) Port rise and fall time (load = 50 pF) Slew rate control disabled Slew rate control enabled 3 30 ns 1 This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to override reset requests from internal sources. 2 When any reset is initiated, internal circuitry drives the reset pin low for about 34 cycles of f Self_reset and then samples the level on the reset pin about 38 cycles later to distinguish external reset requests from internal requests. 3 This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case. 4 Timing is shown with respect to 20% V DD and 80% VDD levels. Temperature range –40°C to 85°C. textrst RESET PIN Figure A-12. Reset Timing BKGD/MS RESET tMSH tMSSU Figure A-13. Active Background Debug Mode Latch Timing MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 342 Freescale Semiconductor Appendix A Electrical Characteristics tILIH IRQ Figure A-14. IRQ Timing A.10.2 Timer/PWM (TPM) Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. Table A-14. TPM Input Timing Function Symbol Min Max Unit External clock frequency fTPMext dc fBus/4 MHz External clock period tTPMext 4 — tcyc External clock high time tclkh 1.5 — tcyc External clock low time tclkl 1.5 — tcyc tICPW 1.5 — tcyc Input capture pulse width tText tclkh TPMxCHn tclkl Figure A-15. Timer External Clock tICPW TPMxCHn TPMxCHn tICPW Figure A-16. Timer Input Capture Pulse MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 343 Appendix A Electrical Characteristics A.10.3 SPI Timing Table A-12 and Figure A-16 through Figure A-19 describe the timing requirements for the SPI system. Table A-15. SPI Timing No. Function Operating frequency Master Slave Symbol Min Max Unit fop fBus/2048 dc fBus/2 fBus/4 Hz 1 SCK period Master Slave tSCK 2 4 2048 — tcyc tcyc 2 Enable lead time Master Slave tLead 1/2 1 — — tSCK tcyc 3 Enable lag time Master Slave tLag 1/2 1 — — tSCK tcyc 4 Clock (SCK) high or low time Master Slave tWSCK tcyc – 30 tcyc – 30 1024 tcyc — ns ns 5 Data setup time (inputs) Master Slave tSU 15 15 — — ns ns 6 Data hold time (inputs) Master Slave tHI 0 25 — — ns ns 7 Slave access time ta — 1 tcyc 8 Slave MISO disable time tdis — 1 tcyc 9 Data valid (after SCK edge) Master Slave tv — — 25 25 ns ns tHO 0 0 — — ns ns tRI tRO — — tcyc – 25 25 ns ns tFI tFO — — tcyc – 25 25 ns ns 10 Data hold time (outputs) Master Slave 11 Rise time Input Output 12 Fall time Input Output MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 344 Freescale Semiconductor Appendix A Electrical Characteristics SS1 (OUTPUT) 1 2 SCK (CPOL = 0) (OUTPUT) 11 3 4 4 12 SCK (CPOL = 1) (OUTPUT) 5 6 MISO (INPUT) MSB IN2 BIT 6 . . . 1 9 LSB IN 9 MOSI (OUTPUT) MSB OUT2 10 BIT 6 . . . 1 LSB OUT NOTES: 1. SS output mode (DDS7 = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure A-17. SPI Master Timing (CPHA = 0) SS(1) (OUTPUT) 1 2 12 11 11 12 3 SCK (CPOL = 0) (OUTPUT) 4 4 SCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 6 MSB IN(2) 9 MOSI (OUTPUT) PORT DATA BIT 6 . . . 1 LSB IN 10 MASTER MSB OUT(2) BIT 6 . . . 1 MASTER LSB OUT PORT DATA NOTES: 1. SS output mode (DDS7 = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure A-18. SPI Master Timing (CPHA = 1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 345 Appendix A Electrical Characteristics SS (INPUT) 1 12 11 11 12 3 SCK (CPOL = 0) (INPUT) 2 4 4 SCK (CPOL = 1) (INPUT) 8 7 MISO (OUTPUT) 9 SLAVE MSB OUT BIT 6 . . . 1 SLAVE LSB OUT SEE NOTE 6 5 MOSI (INPUT) 10 10 BIT 6 . . . 1 MSB IN LSB IN NOTE: 1. Not defined but normally MSB of character just received Figure A-19. SPI Slave Timing (CPHA = 0) SS (INPUT) 1 3 2 12 11 11 12 SCK (CPOL = 0) (INPUT) 4 4 SCK (CPOL = 1) (INPUT) 9 MISO (OUTPUT) SEE NOTE 7 MOSI (INPUT) 10 SLAVE MSB OUT 5 BIT 6 . . . 1 8 SLAVE LSB OUT 6 MSB IN BIT 6 . . . 1 LSB IN NOTE: 1. Not defined but normally LSB of character just received Figure A-20. SPI Slave Timing (CPHA = 1) MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 346 Freescale Semiconductor Appendix A Electrical Characteristics A.11 FLASH Specifications This section provides details about program/erase times and program-erase endurance for the FLASH memory. Program and erase operations do not require any special power sources other than the normal VDD supply. For more detailed information about program/erase operations, see Chapter 4, “Memory.” Table A-16. FLASH Characteristics Characteristic Symbol Min Supply voltage for program/erase Vprog/erase Supply voltage for read operation 0 < fBus < 8 MHz 0 < fBus < 20 MHz Max Unit 1.8 3.6 V VRead 1.8 2.08 3.6 3.6 V Internal FCLK frequency(1) fFCLK 150 200 kHz Internal FCLK period (1/FCLK) tFcyc 5 6.67 μs Byte program time (random location)(2) tprog 9 tFcyc Byte program time (burst mode)(2) tBurst 4 tFcyc Page erase time(2) tPage 4000 tFcyc Mass erase time(2) tMass 20,000 tFcyc Program/erase endurance(3) TL to TH = –40°C to + 85°C T = 25°C Data retention(4) Typical 10,000 tD_ret 15 — — cycles 100,000 100 — years 1 The frequency of this clock is controlled by a software setting. These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for calculating approximate time to program and erase. 3 Typical endurance for FLASH was evaluated for this product family on the 9S12Dx64. For additional information on how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory. 4 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory. 2 MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 347 Appendix A Electrical Characteristics A.12 EMC Performance Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the MCU resides. Board design and layout, circuit topology choices, location and characteristics of external components as well as MCU software operation all play a significant role in EMC performance. The system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance. A.12.1 Radiated Emissions Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test software. The radiated emissions from the microcontroller are measured in all four package orientations (North, South, East and West). For more detailed information concerning the evaluation results, conditions and setup, please refer to the Radiated RF Emissions test report for this device. The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal to the reported emissions levels. Table 17-7. Radiated RF Emissions Characteristics1 Package 80 LQFP Supply Voltage [V] 3.3 Ambient Temp. [oC] 25 Oscillator Source & Frequency System Bus Frequency Test Frequency Range Emissions Level [Typical]2 Internal 20 MHz 0.150 - 50 MHz 15 50 - 150 MHz 17 150 - 500 MHz 3 500 - 1000 MHz 3 IEC Level3 L - SAE Level4 2 - 0.150 - 50 MHz 10 50 - 150 MHz 12 150 - 500 MHz -3 500 - 1000 MHz -3 IEC Level3 L - SAE Level4 2 - External crystal, 16 MHz 8 MHz Unit dBuV dBuV NOTES: 1. This data based on qualification test results. Not tested in production. 2. The reported emission level is the value of the maximum emission, rounded up to the next whole dB, from among the mesured orienations in each frequency range. 3. IEC levels are as specified in IEC 61967-1 and IEC 61967-2. 4. SAE levels are as specified in SAE J1752/1 and SAE J1752/3. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 348 Freescale Semiconductor Appendix A Electrical Characteristics A.12.2 Conducted Transient Susceptibility Microcontroller transient conducted susceptibility is measured in accordance with an internal Freescale test method. The measurement is performed with the microcontroller installed on a custom EMC evaluation board and running specialized EMC test software designed in compliance with the test method. The conducted susceptibility is determined by injecting the transient signal on each pin of the microcontroller. The transient waveform and injection methodology is in accordance with IEC 61000-4-4 for the electrical fast transient/burst (EFT/B). The transient voltage required to cause performance degradation on any pin in the tested configuration is greater than or equal to the reported levels unless otherwise indicated by footnotes below the table. Table A-17. Conducted Transient Susceptibility Characteristics1 Package 80LQFP Supply Voltage [V] Ambient Temp. [oC] 2.2 25 Oscillator Source & Frequency System Bus Frequency External crystal, 32 kHz 20 MHz Result Amplitude Level [Typical]2 A +/- 4 B none C none D none E none Unit kV NOTES: 1. This data based on qualification test results. Not tested in production. 2. The reported transient immunity voltage ;levels indicate the minimum voltage range for each result type. The susceptibility performance classification is described in Table A-18. Table A-18. Susceptibility Performance Classification Result Performance Criteria A No failure The MCU performs as designed during and after exposure. B Self-recovering failure C Soft failure The MCU does not perform as designed during exposure. The MCU does not return to normal operation until exposure is removed and the RESET pin is asserted. D Hard failure The MCU does not perform as designed during exposure. The MCU does not return to normal operation until exposure is removed and the power to the MCU is cycled. E Damage The MCU does not perform as designed during and after exposure. The MCU cannot be returned to proper operation due to physical damage or other permanent performance degradation. The MCU does not perform as designed during exposure. The MCU returns automatically to normal operation after exposure is removed. MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 349 Appendix A Electrical Characteristics MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 350 Freescale Semiconductor Appendix B Ordering Information and Mechanical Drawings B.1 Ordering Information This section contains ordering numbers for MC9S08LC60 and MC9S08LC36 devices. See below for an example of the device numbering system. Table B-1. Device Numbering System Memory Package Device Number MC9S08LC60 MC9S08LC36 FLASH RAM Type Designator 60K 4K 80 LQFP LK 80 LQFP LK 64 LQFP LH 36K 2K MC 9 S08 LC60 C XX E Pb-free package designator Package designator Status (MC = Fully Qualified) Memory (9 = FLASH-based) Core Temperature range (blank = -40°C to 85°C) Family B.2 Mechanical Drawings The following pages provide mechanical drawings packages available for MC9S08LC60 Series: • 80 LQFP • 64 LQFP Table B-2. Package Information Pin Count Type Designator Document No. 80 LQFP LK 98ASS23174W 64 LQFP LH 98ASS23234W MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 Freescale Semiconductor 351 Appendix B Ordering Information and Mechanical Drawings MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4 352 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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