FREESCALE MPC875CVR133

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Freescale Semiconductor
MPC875EC
Rev. 3.0, 07/2004
MPC875/MPC870
Hardware Specifications
This hardware specification contains detailed information on
power considerations, DC/AC electrical characteristics, and AC
timing specifications for the MPC875/MPC870. The CPU on the
MPC875/MPC870 is a 32-bit PowerPC™ core that incorporates
memory management units (MMUs) and instruction and data
caches and that implements the PowerPC instruction set. This
hardware specification covers the following topics:
1
Overview
The MPC875/MPC870 is a versatile single-chip integrated
microprocessor and peripheral combination that can be used in a
variety of controller applications and communications and
networking systems. The MPC875/MPC870 provides enhanced
ATM functionality over that of other ATM-enabled members of
the MPC860 family.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 7
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal Calculation and Measurement . . . . . . . . . . 11
Power Supply and Power Sequencing . . . . . . . . . . . 13
Mandatory Reset Configurations . . . . . . . . . . . . . . . 14
Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15
IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 44
CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 46
USB Electrical Characteristics . . . . . . . . . . . . . . . . . 67
FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67
Mechanical Data and Ordering Information . . . . . . . 71
Document Revision History . . . . . . . . . . . . . . . . . . . 82
Features
Table 1 shows the functionality supported by the members of the MPC875/MPC870.
Table 1. MPC875/870 Devices
Cache
Ethernet
Part
SCC
SMC
USB
Security
Engine
I Cache
D Cache
10BaseT
10/100
MPC875
8 Kbyte
8 Kbyte
1
2
1
1
1
Yes
MPC870
8 Kbyte
8 Kbyte
—
2
—
1
1
No
2
Features
The MPC875/870 is comprised of three modules that each use the 32-bit internal bus: a MPC8xx core, a system
integration unit (SIU), and a communications processor module (CPM).
The following list summarizes the key MPC875/870 features:
•
•
•
•
•
•
Embedded MPC8xx core up to 133 MHz
Maximum frequency operation of the external bus is 80 MHz (in 1:1 mode)
— The 133-MHz core frequency supports 2:1 mode only.
— The 66-/80-MHz core frequencies support both the 1:1 and 2:1 modes.
Single-issue, 32-bit core (compatible with the PowerPC architecture definition) with thirty-two 32-bit
general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch and without conditional execution.
— 8-Kbyte data cache and 8-Kbyte instruction cache (see Table 1)
– Instruction cache is two-way, set-associative with 256 sets in 2 blocks
– Data cache is two-way, set-associative with 256 sets
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks.
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces
and 16 protection groups
— Advanced on-chip emulation debug mode
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
32 address lines
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank.
— Up to 30 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROMs, Flash EPROMs, and other memory devices
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
MPC875/MPC870 Hardware Specifications, Rev. 3.0
2
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Features
•
•
•
•
•
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbyte–256 Mbyte)
— Selectable write protection
— On-chip bus arbitration logic
General-purpose timers
— Four 16-bit timers or two 32-bit timers
— Gate mode can enable/disable counting.
— Interrupt can be masked on reference match and event capture
Two fast Ethernet controllers (FEC)—Two 10/100 Mbps Ethernet/IEEE 802.3 CDMA/CS that
interface through MII and/or RMII interfaces
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Clock synthesizer
— Decrementer and time base
— Reset controller
— IEEE 1149.1 test access port (JTAG)
Security engine is optimized to handle all the algorithms associated with IPsec, SSL/TLS, SRTP,
802.11i, and iSCSI processing. Available on the MPC875, the security engine contains a
crypto-channel, a controller, and a set of crypto hardware accelerators (CHAs). The CHAs are:
— Data encryption standard execution unit (DEU)
– DES, 3DES
– Two key (K1, K2, K1) or three key (K1, K2, K3)
– ECB and CBC modes for both DES and 3DES
— Advanced encryption standard unit (AESU)
– Implements the Rinjdael symmetric key cipher
– ECB, CBC, and counter modes
– 128-, 192-, and 256-bit key lengths
— Message digest execution unit (MDEU)
– SHA with 160- or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— Master/slave logic, with DMA
– 32-bit address/32-bit data
– Operation at 8xx bus frequency
— Crypto-channel supporting multi-command descriptors
– Integrated controller managing crypto-execution units
– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes
Interrupts
— Six external interrupt request (IRQ) lines
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
3
Features
•
•
•
•
•
•
— 12 port pins with interrupt capability
— 23 internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
Communications processor module (CPM)
— RISC controller
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and
RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— 8-Kbytes of dual-port RAM
— Several serial DMA (SDMA) channels to support the CPM
— Three parallel I/O registers with open-drain capability
On-chip 16 × 16 multiply accumulate controller (MAC)
— One operation per clock (two-clock latency, one-clock blockage)
— MAC operates concurrently with other instructions
— FIR loop—Four clocks per four multiplies
Four baud-rate generators
— Independent (can be connected to any SCC or SMC)
— Allows changes during operation
— Autobaud support option
SCC (serial communication controller)
— Ethernet/IEEE 802.3 optional on the SCC, supporting full 10-Mbps operation
— HDLC/SDLC
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support point-to-point protocol (PPP)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC))
SMC (serial management channel)
— UART (low-speed operation)
— Transparent
Universal serial bus (USB)—Supports operation as a USB function endpoint, a USB host controller, or both
for testing purposes (loopback diagnostics)
— USB 2.0 full-/low-speed compatible
— The USB function mode has the following features:
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
4
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Features
•
•
•
•
•
•
•
•
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— The USB host controller has the following features:
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data
rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
Serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
Inter-integrated circuit (I2C) port
— Supports master and slave modes
— Supports a multiple-master environment
The MPC875 has a time-slot assigner (TSA) that supports one TDM bus (TDMb).
— Allows SCC and SMC to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to two serial channels (one SCC and one SMC)
PCMCIA interface
— Master (socket) interface, release 2.1-compliant
— Supports one independent PCMCIA socket on the MPC875/MPC870
— 8 memory or I/O windows supported
Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two
operate on data
— Supports conditions: = ≠ < >
— Each watchpoint can generate a break point internally.
Normal high and normal low power modes to conserve power
1.8-V core and 3.3-V I/O operation with 5-V TTL compatibility
The MPC875/870 comes in a 256-pin ball grid array (PBGA) package.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
5
Features
The MPC875 block diagram is shown in Figure 1.
Instruction
Bus
8-Kbyte
Instruction Cache
System Interface Unit (SIU)
Unified
Bus
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Memory Controller
External
Internal
Bus Interface Bus Interface
Unit
Unit
8-Kbyte
Data Cache
Load/Store
Bus
System Functions
Data MMU
32-Entry DTLB
PCMCIA-ATA Interface
Slave/Master IF
Security Engine
Fast Ethernet
Controller
Controller
DMAs
DMAs
DMAs
AESU
DEU
MDEU
Channel
FIFOs
10/100
BaseT
Media Access
Control
Parallel I/O
4
Timers
4 Baud Rate
Generators
Parallel Interface Port
MIII/RMII
USB
Timers
Interrupt
8-Kbyte
Controllers Dual-Port RAM
32-Bit RISC Controller
and Program
ROM
SCC4
SMC1
Virtual IDMA
and
Serial DMAs
SPI
I2C
Time Slot Assigner
Serial Interface
Figure 1. MPC875 Block Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
6
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Maximum Tolerated Ratings
The MPC870 block diagram is shown in Figure 2.
Instruction
Bus
8-Kbyte
Instruction Cache
System Interface Unit (SIU)
Unified
Bus
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Memory Controller
External
Internal
Bus Interface Bus Interface
Unit
Unit
8-Kbyte
Data Cache
Load/Store
Bus
System Functions
Data MMU
32-Entry DTLB
PCMCIA-ATA Interface
Slave/Master IF
Fast Ethernet
Controller
DMAs
DMAs
FIFOs
10/100
BaseT
Media Access
Control
Parallel I/O
4
Timers
4 Baud Rate
Generators
Parallel Interface Port
MIII / RMII
Timers
Interrupt
8-Kbyte
Controllers Dual-Port RAM
32-Bit RISC Controller
and Program
ROM
USB
SMC1
Virtual IDMA and
Serial DMAs
SPI
I2C
Serial Interface
Figure 2. MPC870 Block Diagram
3
Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the MPC875/870. Table 2
displays the maximum tolerated ratings, and Table 3 displays the operating temperatures.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
7
Maximum Tolerated Ratings
Table 2. Maximum Tolerated Ratings
Rating
Symbol
Value
Unit
VDDL (core
voltage)
–0.3 to 3.4
V
VDDH (I/O
voltage)
–0.3 to 4
V
VDDSYN
–0.3 to 3.4
V
Difference
between
VDDL and
VDDSYN
<100
mV
Input voltage 2
Vin
GND – 0.3 to
VDDH
V
Storage temperature range
Tstg
–55 to +150
°C
Supply voltage 1
1 The
2
power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than VDDH. This restriction applies to power
up and normal operation (that is, if the MPC875/870 is unpowered, a voltage greater than 2.5 V must not be applied
to its inputs).
Table 3. Operating Temperatures
Rating
Temperature 1 (standard)
Temperature (extended)
Symbol
Value
Unit
TA(min)
0
°C
Tj(max)
95
°C
TA(min)
–40
°C
Tj(max)
100
°C
1 Minimum
temperatures are guaranteed as ambient temperature, TA. Maximum temperatures are guaranteed as
junction temperature, Tj.
This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it
is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (for example, either GND or VDDH).
MPC875/MPC870 Hardware Specifications, Rev. 3.0
8
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC875/870.
Table 4. MPC875/870 Thermal Resistance Data
Rating
Environment
Junction-to-ambient 1
Natural convection
Airflow (200 ft/min)
Symbol
Value
Unit
RθJA 2
43
°C/W
Single-layer board (1s)
Four-layer board (2s2p)
RθJMA
3
29
Single-layer board (1s)
RθJMA3
36
3
26
Four-layer board (2s2p)
RθJMA
Junction-to-board 4
RθJB
20
5
RθJC
10
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
Junction-to-case
Junction-to-package top 6
1 Junction
temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3 Per JEDEC JESD51-6 with the board horizontal.
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
5
Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are
equal, and 2:1, where CPU frequency is twice bus speed.
Table 5. Power Dissipation (PD)
Die Revision
Bus
Mode
1:1
0
2:1
1 Typical
Frequency
Typical 1
Maximum 2
Unit
66 MHz
310
390
mW
80 MHz
350
430
mW
133 MHz
430
495
mW
power dissipation is measured at VDDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
9
DC Characteristics
2 Maximum
power dissipation at VDDL = VDDSYN = 1.9 V, and VDDH is at 3.5 V.
NOTE
The values in Table 5 represent VDDL-based power dissipation and do not
include I/O power dissipation over VDDH. I/O power dissipation varies
widely by application due to buffer current, depending on external
circuitry.
The VDDSYN power dissipation is negligible.
6
DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC875/870.
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
VDDH (I/O)
3.135
3.465
V
VDDL (Core)
1.7
1.9
V
VDDSYN 1
1.7
1.9
V
Difference
between
VDDL and
VDDSYN
—
100
mV
VIH
2.0
3.465
V
VIL
GND
0.8
V
VIHC
0.7 × VDDH
VDDH
V
Input leakage current, Vin = 5.5 V (except TMS, TRST, DSCK and
DSDI pins) for 5-V tolerant pins 1
Iin
—
100
µA
Input leakage current, Vin = VDDH (except TMS, TRST, DSCK, and
DSDI)
IIn
—
10
µA
Input leakage current, Vin = 0 V (except TMS, TRST, DSCK and DSDI
pins)
IIn
—
10
µA
Input capacitance 4
Cin
—
20
pF
Output high voltage, IOH = –2.0 mA, VDDH = 3.0 V
except XTAL and open-drain pins
VOH
2.4
—
V
Output low voltage
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA 5
IOL = 5.3 mA 6
IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
VOL
—
0.5
V
Operating voltage
Input high voltage (all inputs except EXTAL and EXTCLK) 2
Input low
voltage 3
EXTAL, EXTCLK input high voltage
1 The
difference between VDDL and VDDSYN cannot be more than 100 mV.
2 The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], PE(14:31), TDI, TDO, TCK, TRST, TMS, MII1_TXEN, MII_MDIO
3
are 5-V tolerant. The minimum voltage is still 2.0 V.
VIL(max) for the I2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Thermal Calculation and Measurement
4
Input capacitance is periodically sampled.
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(0:1), PA(0:4), PA(6:7), PA(10:11), PA15,
PB19, PB(23:31), PC(6:7), PC(10:13), PC15, PD8, PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL.
6
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
OP(0:3) BADDR(28:30
5
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O
drivers.
NOTE
The VDDSYN power dissipation is negligible.
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature ºC
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ–TA) are possible.
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device-related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
11
Thermal Calculation and Measurement
7.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the
package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages
and especially PBGA packages is strongly dependent on the board temperature. If the board temperature is known,
an estimate of the junction temperature in the environment can be made using the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature ºC
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per the JESD51-2 specification published by JEDEC using a 40
gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by the cooling effects of the thermocouple wire.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
12
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Power Supply and Power Sequencing
7.6 References
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications
(Available from Global Engineering Documents)
800-854-7179 or
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
8
Power Supply and Power Sequencing
This section provides design considerations for the MPC875/870 power supply. The MPC875/870 has a
core voltage (VDDL) and PLL voltage (VDDSYN), which both operate at a lower voltage than the I/O voltage
VDDH. The I/O section of the MPC875/870 is supplied with 3.3 V across VDDH and VSS (GND).
The signals PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15] PD[3:15], TDI,
TDO, TCK, TRST, TMS, MII_TXEN, and MII_MDIO are 5-V tolerant. No input can be more than 2.5 V
greater than VDDH. In addition, 5 V-tolerant pins cannot exceed 5.5 V, and remaining input pins cannot
exceed 3.465 V. This restriction applies to power up/down and normal operation.
One consequence of multiple power supplies is that when power is initially applied, the voltage rails ramp
up at different rates. The rates depend on the nature of the power supply, the type of load on each power
supply, and the manner in which different voltages are derived. The following restrictions apply:
•
•
VDDL must not exceed VDDH during power up and power down.
VDDL must not exceed 1.9 V, and VDDH must not exceed 3.465 V.
These cautions are necessary for the long-term reliability of the part. If they are violated, the electrostatic
discharge (ESD) protection diodes are forward-biased, and excessive current can flow through these diodes.
If the system power supply design does not control the voltage sequencing, the circuit shown in Figure 3
can be added to meet these requirements. The MUR420 Schottky diodes control the maximum potential
difference between the external bus and core power supplies on power up, and the 1N5820 diodes regulate
the maximum potential difference on power down.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
13
Mandatory Reset Configurations
VDDH
VDDL
MUR420
1N5820
Figure 3. Example Voltage Sequencing Circuit
9
Mandatory Reset Configurations
The MPC875/870 requires a mandatory configuration during reset.
If hardware reset configuration word (HRCW) is enabled, the HRCW[DBGC] value needs to be set to binary X1 in
the HRCW and the SIUMCR[DBGC] should be programmed with the same value in the boot code after reset. This
can be done by asserting the RSTCONF during HRESET assertion.
If HRCW is disabled, the SIUMCR[DBGC] should be programmed with binary X1 in the boot code after reset by
negating the RSTCONF during the HRESET assertion.
The MBMR[GPLB4DIS], PAPAR, PADIR, PBPAR, PBDIR, PCPAR, and PCDIR need to be configured with the
mandatory values in Table 7 in the boot code after the reset is negated.
Table 7. Mandatory Reset Configuration of MPC875/870
Register/Configuration
Value
(binary)
Field
HRCW
(Hardware reset configuration word)
HRCW[DBGC]
X1
SIUMCR
(SIU module configuration register)
SIUMCR[DBGC]
X1
MBMR
(Machine B mode register)
MBMR[GPLB4DIS}
0
PAPAR
(Port A pin assignment register)
PAPAR[5:9]
PAPAR[12:13]
0
PADIR
(Port A data direction register)
PADIR[5:9]
PADIR[12:13]
0
PBPAR
(Port B pin assignment register)
PBPAR[14:18]
PBPAR[20:22]
0
PBDIR
(Port B data direction register)
PBDIR[14:8]
PBDIR[20:22]
0
PCPAR
(Port C pin assignment register)
PCPAR[4:5]
PCPAR[8:9]
PCPAR[14]
0
MPC875/MPC870 Hardware Specifications, Rev. 3.0
14
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Layout Practices
Table 7. Mandatory Reset Configuration of MPC875/870 (continued)
Register/Configuration
Value
(binary)
Field
PCDIR
(Port C data direction register)
PCDIR[4:5]
PCDIR[8:9]
PCDIR[14]
0
PDPAR
(Port D pin assignment register)
PDPAR[3:7]
PDPAR[9:5]
0
PDDIR
(Port D data direction register)
PDDIR[3:7]
PDDIR[9:15]
0
10 Layout Practices
Each VDD pin on the MPC875/870 should be provided with a low-impedance path to the board’s supply. Each GND
pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups
of logic on chip. The VDD power supply should be bypassed to ground using at least four 0.1-µF bypass capacitors
located as close as possible to the four sides of the package. Each board designed should be characterized and
additional appropriate decoupling capacitors should be used if required. The capacitor leads and associated printed
circuit traces connecting to chip VDD and GND should be kept to less than half an inch per capacitor lead. At a
minimum, a four-layer board employing two inner layers as VDD and GND planes should be used.
All output pins on the MPC875/870 have fast rise and fall times. Printed circuit (PC) trace interconnection length
should be minimized in order to minimize undershoot and reflections caused by these fast output switching times.
This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches
are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to
the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all unused
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins. For more information, please refer to Section 14.4.3, “Clock Synthesizer Power (VDDSYN,
VSSSYN, VSSSYN1),” of the MPC885 PowerQUICC Family User’s Manual.
11 Bus Signal Timing
The maximum bus speed supported by the MPC875/870 is 80 MHz. Higher-speed parts must be operated in
half-speed bus mode (for example, an MPC875/870 used at 133 MHz must be configured for a 66 MHz bus). Table 8
shows the frequency ranges for standard part frequencies in 1:1 bus mode, and Table 9 shows the frequency ranges
for standard part frequencies in 2:1 bus mode.
Table 8. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode)
Part Frequency
66 MHz
80 MHz
Min
Max
Min
Max
Core frequency
40
66.67
40
80
Bus frequency
40
66.67
40
80
MPC875/MPC870 Hardware Specifications, Rev. 3.0
15
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 9. Frequency Ranges for Standard Part Frequencies (2:1 Bus Mode)
Part Frequency
66 MHz
80 MHz
133 MHz
Min
Max
Min
Max
Min
Max
Core frequency
40
66.67
40
80
40
133
Bus frequency
20
33.33
20
40
20
66
Table 10 provides the bus operation timing for the MPC875/870 at 33, 40, 66, and 80 MHz.
The timing for the MPC875/870 bus shown assumes a 50-pF load for maximum delays and a 0-pF load for minimum
delays. CLKOUT assumes a 100-pF load maximum delay
Table 10. Bus Operation Timings
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B1
Bus period (CLKOUT), see Table 8
—
—
—
—
—
—
—
—
ns
B1a
EXTCLK to CLKOUT phase skew - If
CLKOUT is an integer multiple of
EXTCLK, then the rising edge of EXTCLK
is aligned with the rising edge of CLKOUT.
For a non-integer multiple of EXTCLK, this
synchronization is lost, and the rising
edges of EXTCLK and CLKOUT have a
continuously varying phase skew.
–2
+2
–2
+2
–2
+2
–2
+2
ns
B1b
CLKOUT frequency jitter peak-to-peak
—
1
—
1
—
1
—
1
ns
B1c
Frequency jitter on EXTCLK
—
0.50
—
0.50
—
0.50
—
0.50
%
B1d
CLKOUT phase jitter peak-to-peak
for OSCLK ≥ 15 MHz
—
4
—
4
—
4
—
4
ns
CLKOUT phase jitter peak-to-peak
for OSCLK < 15 MHz
—
5
—
5
—
5
—
5
ns
B2
CLKOUT pulse width low
(MIN = 0.4 × B1, MAX = 0.6 × B1)
12.1
18.2
10.0
15.0
6.1
9.1
5.0
7.5
ns
B3
CLKOUT pulse width high
(MIN = 0.4 × B1, MAX = 0.6 × B1)
12.1
18.2
10.0
15.0
6.1
9.1
5.0
7.5
ns
B4
CLKOUT rise time
—
4.00
—
4.00
—
4.00
—
4.00
ns
B5
CLKOUT fall time
—
4.00
—
4.00
—
4.00
—
4.00
ns
B7
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31) output hold
(MIN = 0.25 × B1)
7.60
—
6.30
—
3.80
—
3.13
—
ns
B7a
CLKOUT to TSIZ(0:1), REG, RSV, BDIP,
PTR output hold (MIN = 0.25 × B1)
7.60
—
6.30
—
3.80
—
3.13
—
ns
B7b
CLKOUT to BR, BG, FRZ, VFLS(0:1),
VF(0:2) IWP(0:2), LWP(0:1), STS output
hold (MIN = 0.25 × B1)
7.60
—
6.30
—
3.80
—
3.13
—
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
16
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B8
CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31) valid
(MAX = 0.25 × B1 + 6.3)
—
13.80
—
12.50
—
10.00
—
9.43
ns
B8a
CLKOUT to TSIZ(0:1), REG, RSV, BDIP,
PTR valid (MAX = 0.25 × B1 + 6.3)
—
13.80
—
12.50
—
10.00
—
9.43
ns
B8b
CLKOUT to BR, BG, VFLS(0:1), VF(0:2),
IWP(0:2), FRZ, LWP(0:1), STS valid 2
(MAX = 0.25 × B1 + 6.3)
—
13.80
—
12.50
—
10.00
—
9.43
ns
B9
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), TSIZ(0:1), REG,
RSV, PTR High-Z
(MAX = 0.25 × B1 + 6.3)
7.60 13.80 6.30 12.50 3.80 10.00 3.13
9.43
ns
B11
CLKOUT to TS, BB assertion
(MAX = 0.25 × B1 + 6.0)
7.60 13.60 6.30 12.30 3.80
9.80
3.13
9.13
ns
B11a
CLKOUT to TA, BI assertion (when driven
by the memory controller or PCMCIA
interface) (MAX = 0.00 × B1 + 9.30 1)
2.50
2.50
9.30
2.50
9.80
2.5
9.3
ns
B12
CLKOUT to TS, BB negation
(MAX = 0.25 × B1 + 4.8)
7.60 12.30 6.30
11.00
3.80
8.50
3.13
7.92
ns
B12a
CLKOUT to TA, BI negation (when driven
by the memory controller or PCMCIA
interface) (MAX = 0.00 × B1 + 9.00)
2.50
9.00
2.50
9.00
2.5
9.00
ns
B13
CLKOUT to TS, BB High-Z
(MIN = 0.25 × B1)
7.60 21.60 6.30 20.30 3.80 14.00 3.13 12.93
ns
B13a
CLKOUT to TA, BI High-Z (when driven by
the memory controller or PCMCIA
interface) (MIN = 0.00 × B1 + 2.5)
2.50 15.00 2.50 15.00 2.50 15.00
2.5
15.00
ns
B14
CLKOUT to TEA assertion
(MAX = 0.00 × B1 + 9.00)
2.50
2.50
9.00
ns
B15
CLKOUT to TEA High-Z
(MIN = 0.00 × B1 + 2.50)
2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00
ns
B16
TA, BI valid to CLKOUT (setup time)
(MIN = 0.00 × B1 + 6.00)
6.00
—
6.00
—
6.00
—
6
—
ns
B16a
TEA, KR, RETRY, CR valid to CLKOUT
(setup time) (MIN = 0.00 × B1 + 4.5)
4.50
—
4.50
—
4.50
—
4.50
—
ns
B16b
BB, BG, BR, valid to CLKOUT (setup time)
2 (4MIN = 0.00 × B1 + 0.00)
4.00
—
4.00
—
4.00
—
4.00
—
ns
B17
CLKOUT to TA, TEA, BI, BB, BG, BR valid
(hold time) (MIN = 0.00 × B1 + 1.00 3)
1.00
—
1.00
—
2.00
—
2.00
—
ns
B17a
CLKOUT to KR, RETRY, CR valid (hold
time) (MIN = 0.00 × B1 + 2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
9.30
9.00
9.00
2.50
2.50
9.00
2.50
9.00
MPC875/MPC870 Hardware Specifications, Rev. 3.0
17
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B18
D(0:31) valid to CLKOUT rising edge
(setup time) 4 (MIN = 0.00 × B1 + 6.00)
6.00
—
6.00
—
6.00
—
6.00
—
ns
B19
CLKOUT rising edge to D(0:31) valid (hold
time) 4 (MIN = 0.00 × B1 + 1.00 5)
1.00
—
1.00
—
2.00
—
2.00
—
ns
B20
D(0:31) valid to CLKOUT falling edge
(setup time) 6(MIN = 0.00 × B1 + 4.00)
4.00
—
4.00
—
4.00
—
4.00
—
ns
B21
CLKOUT falling edge to D(0:31) valid
(hold time) 6 (MIN = 0.00 × B1 + 2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
B22
7.60 13.80 6.30 12.50 3.80 10.00 3.13
CLKOUT rising edge to CS asserted
GPCM ACS = 00 (MAX = 0.25 × B1 + 6.3)
9.43
ns
B22a
CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0
(MAX = 0.00 × B1 + 8.00)
8.00
ns
B22b
CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 0
(MAX = 0.25 × B1 + 6.3)
7.60 13.80 6.30 12.50 3.80 10.00 3.13
9.43
ns
B22c
CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 1
(MAX = 0.375 × B1 + 6.6)
10.90 18.00 10.90 16.00 5.20 12.30 4.69 10.93
ns
B23
CLKOUT rising edge to CS negated
GPCM read access, GPCM write access
ACS = 00, TRLX = 0 & CSNT = 0
(MAX = 0.00 × B1 + 8.00)
2.00
8.00
2.00
8.00
2.00
8.00
2.00
8.00
ns
B24
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 0
(MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B24a
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11 TRLX = 0
(MIN = 0.50 × B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B25
CLKOUT rising edge to OE,
WE(0:3)/BS_B[0:3] asserted
(MAX = 0.00 × B1 + 9.00)
—
9.00
9.00
—
9.00
ns
B26
CLKOUT rising edge to OE negated
(MAX = 0.00 × B1 + 9.00)
2.00
9.00
2.00
9.00
2.00
9.00
2.00
9.00
ns
B27
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25 × B1 – 2.00)
35.90
—
29.30
—
16.90
—
13.60
—
ns
B27a
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50 × B1 – 2.00)
43.50
—
35.50
—
20.70
—
16.75
—
ns
—
8.00
—
8.00
—
9.00
8.00
—
MPC875/MPC870 Hardware Specifications, Rev. 3.0
18
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
—
9.00
—
9.00
—
9.00
—
9.00
ns
9.93
ns
9.93
ns
B28
CLKOUT rising edge to
WE(0:3)/BS_B[0:3] negated GPCM write
access CSNT = 0
(MAX = 0.00 × B1 + 9.00)
B28a
CLKOUT falling edge to
WE(0:3)/BS_B[0:3] negated GPCM write
access TRLX = 0, CSNT = 1, EBDF = 0
(MAX = 0.25 × B1 + 6.80)
B28b
CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1
ACS = 10 or ACS = 11, EBDF = 0
(MAX = 0.25 × B1 + 6.80)
B28c
CLKOUT falling edge to
10.90 18.00 10.90 18.00 5.20 12.30 4.69
WE(0:3)/BS_B[0:3] negated GPCM write
access TRLX = 0, CSNT = 1 write access
TRLX = 0, CSNT = 1, EBDF = 1
(MAX = 0.375 × B1 + 6.6)
11.29
ns
B28d
CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, CSNT = 1,
ACS = 10, or ACS = 11, EBDF = 1
(MAX = 0.375 × B1 + 6.6)
—
18.00
—
18.00
—
12.30
—
11.30
ns
B29
WE(0:3)/BS_B[0:3] negated to D(0:31)
High-Z GPCM write access, CSNT = 0,
EBDF = 0 (MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B29a
WE(0:3)/BS_B[0:3] negated to D(0:31)
High-Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 0
(MIN = 0.50 × B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B29b
CS negated to D(0:31) High-Z GPCM write
access, ACS = 00, TRLX = 0 & CSNT = 0
(MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B29c
CS negated to D(0:31) High-Z GPCM write 13.20
access, TRLX = 0, CSNT = 1, ACS = 10,
or ACS = 11 EBDF = 0
(MIN = 0.50 × B1 – 2.00)
—
10.50
—
5.60
—
4.25
—
ns
B29d
WE(0:3)/BS_B[0:3] negated to D(0:31)
High-Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 0
(MIN = 1.50 × B1 – 2.00)
43.50
—
35.50
—
20.70
—
16.75
—
ns
B29e
CS negated to D(0:31) High-Z GPCM write 43.50
access, TRLX = 1, CSNT = 1, ACS = 10,
or ACS = 11, EBDF = 0
(MIN = 1.50 × B1 – 2.00)
—
35.50
—
20.70
—
16.75
—
ns
7.60 14.30 6.30 13.00 3.80 10.50 3.13
—
14.30
—
13.00
—
10.50
—
MPC875/MPC870 Hardware Specifications, Rev. 3.0
19
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B29f
WE(0:3/BS_B[0:3]) negated to D(0:31)
High-Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 1
(MIN = 0.375 × B1 – 6.30)
5.00
—
3.00
—
0.00
—
0.00
—
ns
B29g
CS negated to D(0:31) High-Z GPCM write
access, TRLX = 0, CSNT = 1 ACS = 10 or
ACS = 11, EBDF = 1
(MIN = 0.375 × B1 – 6.30)
5.00
—
3.00
—
0.00
—
0.00
—
ns
B29h
WE(0:3)/BS_B[0:3] negated to D(0:31)
High-Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 1
(MIN = 0.375 × B1 – 3.30)
38.40
—
31.10
—
17.50
—
13.85
—
ns
B29i
CS negated to D(0:31) (0:3) High-Z GPCM 38.40
write access, TRLX = 1, CSNT = 1,
ACS = 10 or ACS = 11, EBDF = 1
(MIN = 0.375 × B1 – 3.30)
—
31.10
—
17.50
—
13.85
—
ns
B30
CS, WE(0:3)/BS_B[0:3] negated to
A(0:31), BADDR(28:30) invalid GPCM
write access 7 (MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B30a
WE(0:3)/BS_B[0:3] negated to A(0:31),
13.20
BADDR(28:30) invalid GPCM, write
access, TRLX = 0, CSNT = 1, CS negated
to A(0:31) invalid GPCM write access
TRLX = 0, CSNT =1 ACS = 10, or
ACS == 11, EBDF = 0
(MIN = 0.50 × B1 – 2.00)
—
10.50
—
5.60
—
4.25
—
ns
B30b
WE(0:3)/BS_B[0:3] negated to A(0:31)
43.50
Invalid GPCM BADDR(28:30) invalid
GPCM write access, TRLX = 1, CSNT = 1.
CS negated to A(0:31) invalid GPCM write
access TRLX = 1, CSNT = 1, ACS = 10, or
ACS == 11 EBDF = 0
(MIN = 1.50 × B1 – 2.00)
—
35.50
—
20.70
—
16.75
—
ns
B30c
WE(0:3)/BS_B[0:3] negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1. CS negated
to A(0:31) invalid GPCM write access,
TRLX = 0, CSNT = 1 ACS = 10,
ACS == 11, EBDF = 1
(MIN = 0.375 × B1 – 3.00)
8.40
—
6.40
—
2.70
—
1.70
—
ns
B30d
WE(0:3)/BS_B[0:3] negated to A(0:31),
38.67
BADDR(28:30) invalid GPCM write access
TRLX = 1, CSNT =1, CS negated to
A(0:31) invalid GPCM write access TRLX
= 1, CSNT = 1, ACS = 10 or 11, EBDF = 1
—
31.38
—
17.83
—
14.19
—
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
20
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
6.00
1.50
6.00
1.50
6.00
1.50
B31
CLKOUT falling edge to CS valid, as
requested by control bit CST4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50
6.00
ns
B31a
CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00
ns
B31b
CLKOUT rising edge to CS valid, as
requested by control bit CST2 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 8.00)
1.50
1.50
8.00
ns
B31c
CLKOUT rising edge to CS valid, as
requested by control bit CST3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.30)
7.60 13.80 6.30 12.50 3.80 10.00 3.13
9.40
ns
B31d
13.30 18.00 11.30 16.00 7.60 12.30 4.69
CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF = 1
(MAX = 0.375 × B1 + 6.6)
11.30
ns
B32
CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50
6.00
ns
B32a
CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 0
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00
ns
B32b
CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 8.00)
1.50
8.00
ns
B32c
CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00
ns
B32d
13.30 18.00 11.30 16.00 7.60 12.30 4.49
CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF = 1
(MAX = 0.375 × B1 + 6.60)
11.30
ns
B33
CLKOUT falling edge to GPL valid, as
requested by control bit GxT4 in the
corresponding word in the UPM
(MAX = 0.00 × B1 + 6.00)
1.50
6.00
ns
8.00
6.00
8.00
6.00
1.50
1.50
1.50
1.50
8.00
6.00
8.00
6.00
1.50
1.50
1.50
1.50
8.00
6.00
8.00
6.00
1.50
1.50
1.50
MPC875/MPC870 Hardware Specifications, Rev. 3.0
21
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B33a
CLKOUT rising edge to GPL valid, as
requested by control bit GxT3 in the
corresponding word in the UPM
(MAX = 0.25 × B1 + 6.80)
7.60 14.30 6.30 13.00 3.80 10.50 3.13 10.00
ns
B34
A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by control bit CST4
in the corresponding word in the UPM
(MIN = 0.25 × B1 - 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B34a
13.20
A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by control bit CST1
in the corresponding word in the UPM
(MIN = 0.50 × B1 – 2.00)
—
10.50
—
5.60
—
4.25
—
ns
B34b
A(0:31), BADDR(28:30), and D(0:31) to
CS valid, as requested by CST2 in the
corresponding word in UPM
(MIN = 0.75 × B1 – 2.00)
20.70
—
16.70
—
9.40
—
6.80
—
ns
B35
A(0:31), BADDR(28:30) to CS valid, as
requested by control bit BST4 in the
corresponding word in the UPM
(MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B35a
A(0:31), BADDR(28:30), and D(0:31) to
BS valid, as requested by BST1 in the
corresponding word in the UPM
(MIN = 0.50 × B1 – 2.00)
13.20
—
10.50
—
5.60
—
4.25
—
ns
B35b
20.70
A(0:31), BADDR(28:30), and D(0:31) to
BS valid, as requested by control bit BST2
in the corresponding word in the UPM
(MIN = 0.75 × B1 – 2.00)
—
16.70
—
9.40
—
7.40
—
ns
B36
A(0:31), BADDR(28:30), and D(0:31) to
GPL valid, as requested by control bit
GxT4 in the corresponding word in the
UPM (MIN = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.13
—
ns
B37
UPWAIT valid to CLKOUT falling edge 8
(MIN = 0.00 × B1 + 6.00)
6.00
—
6.00
—
6.00
—
6.00
—
ns
B38
CLKOUT falling edge to UPWAIT valid 8
(MIN = 0.00 × B1 + 1.00)
1.00
—
1.00
—
1.00
—
1.00
—
ns
B39
AS valid to CLKOUT rising edge 9
(MIN = 0.00 × B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B40
A(0:31), TSIZ(0:1), RD/WR, BURST, valid
to CLKOUT rising edge
(MIN = 0.00 × B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B41
TS valid to CLKOUT rising edge (setup
time) (MIN = 0.00 × B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
22
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 10. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
B42
CLKOUT rising edge to TS valid (hold
time) (MIN = 0.00 × B1 + 2.00)
B43
AS negation to memory controller signals
negation (MAX = TBD)
Unit
Min
Max
Min
Max
Min
Max
Min
Max
2.00
—
2.00
—
2.00
—
2.00
—
ns
—
TBD
—
TBD
—
TBD
—
TBD
ns
1
For part speeds above 50 MHz, use 9.80 ns for B11a.
The timing required for BR input is relevant when the MPC875/870 is selected to work with the internal bus arbiter.
The timing for BG input is relevant when the MPC875/870 is selected to work with the external bus arbiter.
3
For part speeds above 50 MHz, use 2 ns for B17.
4
The D(0:31) input timings B18 and B19 refer to the rising edge of the CLKOUT in which the TA input signal is asserted.
5 For part speeds above 50 MHz, use 2 ns for B19.
6 The D(0:31) input timings B20 and B21 refer to the falling edge of the CLKOUT. This timing is valid only for read
accesses controlled by chip-selects under control of the user-programmable machine (UPM) in the memory
controller, for data beats where DLT3 = 1 in the RAM words. (This is only the case where data is latched on the falling
edge of CLKOUT.)
7 The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
8 The signal UPWAIT is considered asynchronous to the CLKOUT and synchronized internally. The timings specified in
B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 19.
9 The AS signal is considered asynchronous to the CLKOUT. The timing B39 is specified in order to allow the behavior
specified in Figure 22.
2
MPC875/MPC870 Hardware Specifications, Rev. 3.0
23
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 4 provides the control timing diagram.
.
2.0 V
2.0 V
CLKOUT
0.8 V
0.8 V
A
B
2.0 V
0.8 V
Outputs
2.0 V
0.8 V
A
B
2.0 V
0.8 V
Outputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
A
Maximum output delay specification
B
Minimum output hold time
C
Minimum input setup time specification
D
Minimum input hold time specification
2.0 V
0.8 V
Figure 4. Control Timing
Figure 5 provides the timing for the external clock.
CLKOUT
B1
B3
B1
B4
B2
B5
Figure 5. External Clock Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
24
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 6 provides the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
Output
Signals
B8a
B7a
B9
Output
Signals
B8b
B7b
Output
Signals
Figure 6. Synchronous Output Signals Timing
Figure 7 provides the timing for the synchronous active pull-up and open-drain output signals.
CLKOUT
B13
B11
B12
TS, BB
B13a
B11
B12a
TA, BI
B14
B15
TEA
Figure 7. Synchronous Active Pull-Up Resistor and Open-Drain Outputs Signals Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
25
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 8 provides the timing for the synchronous input signals.
CLKOUT
B16
B17
TA, BI
B16a
B17a
TEA, KR,
RETRY, CR
B16b
B17
BB, BG, BR
Figure 8. Synchronous Input Signals Timing
Figure 9 provides normal case timing for input data. It also applies to normal read accesses under the control of the
user-programmable machine (UPM) in the memory controller.
CLKOUT
B16
B17
TA
B18
B19
D[0:31]
Figure 9. Input Data Timing in Normal Case
MPC875/MPC870 Hardware Specifications, Rev. 3.0
26
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 10 provides the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM
RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
CLKOUT
TA
B20
B21
D[0:31]
Figure 10. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1
Figure 11 through Figure 14 provide the timing for the external bus read controlled by various GPCM factors.
CLKOUT
B11
B12
TS
B8
A[0:31]
B22
B23
CSx
B25
B26
OE
B28
WE[0:3]
B19
B18
D[0:31]
Figure 11. External Bus Read Timing (GPCM Controlled—ACS = 00)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
27
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B24
B25
B26
OE
B18
B19
D[0:31]
Figure 12. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 10)
CLKOUT
B11
B12
TS
B8
B22b
A[0:31]
B23
B22c
CSx
B24a
B25
B26
OE
B18
B19
D[0:31]
Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 11)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
28
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B27
OE
B26
B27a
B22b B22c
B18
B19
D[0:31]
Figure 14. External Bus Read Timing (GPCM Controlled—TRLX = 1, ACS = 10, ACS = 11)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
29
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 15 through Figure 17 provide the timing for the external bus write controlled by various GPCM factors.
CLKOUT
B11
B12
TS
B8
B30
A[0:31]
B22
B23
CSx
B25
B28
WE[0:3]
B26
B29b
OE
B29
B8
B9
D[0:31]
Figure 15. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 0)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
30
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30a B30c
A[0:31]
B22
B23
B28b B28d
CSx
B25
B29c B29g
WE[0:3]
B26
B29a B29f
OE
B28a B28c
B8
B9
D[0:31]
Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
31
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30b B30d
A[0:31]
B22
B23
B28b B28d
CSx
B25
B29e B29i
WE[0:3]
B26
B29d B29h
OE
B29b
B8
B28a B28c
B9
D[0:31]
Figure 17. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
32
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 18 provides the timing for the external bus controlled by the UPM.
CLKOUT
B8
A[0:31]
B31a
B31d
B31
B31c
B31b
CSx
B34
B34a
B34b
B32a B32d
B32
B32c
B32b
BS_A[0:3]
B35 B36
B35a
B33a
B35b
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 18. External Bus Timing (UPM Controlled Signals)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
33
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 19 provides the timing for the asynchronous asserted UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 19. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing
Figure 20 provides the timing for the asynchronous negated UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 20. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
34
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 21 provides the timing for the synchronous external master access controlled by the GPCM.
CLKOUT
B41
B42
TS
B40
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 21. Synchronous External Master Access Timing (GPCM Handled ACS = 00)
Figure 22 provides the timing for the asynchronous external master memory access controlled by the GPCM.
CLKOUT
B39
AS
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 22. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00)
Figure 23 provides the timing for the asynchronous external master control signals negation.
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 23. Asynchronous External Master—Control Signals Negation Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
35
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 11 provides the interrupt timing for the MPC875/870.
Table 11. Interrupt Timing
All Frequencies
Characteristic 1
Num
Unit
Min
1
Max
I39
IRQx valid to CLKOUT rising edge (setup time)
6.00
ns
I40
IRQx hold time after CLKOUT
2.00
ns
I41
IRQx pulse width low
3.00
ns
I42
IRQx pulse width high
3.00
ns
I43
IRQx edge-to-edge time
4xTCLOCKOUT
—
The I39 and I40 timings describe the testing conditions under which the IRQ lines are tested when being defined as
level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The I41, I42, and I43 timings are specified to allow correct functioning of the IRQ lines detection circuitry and have
no direct relation with the total system interrupt latency that the MPC875/870 is able to support.
Figure 24 provides the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 24. Interrupt Detection Timing for External Level Sensitive Lines
Figure 25 provides the interrupt detection timing for the external edge-sensitive lines.
CLKOUT
I41
I42
IRQx
I43
I43
Figure 25. Interrupt Detection Timing for External Edge-Sensitive Lines
MPC875/MPC870 Hardware Specifications, Rev. 3.0
36
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 12 shows the PCMCIA timing for the MPC875/870.
Table 12. PCMCIA Timing
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
A(0:31), REG valid to PCMCIA
strobe asserted 1
(MIN = 0.75 × B1 – 2.00)
20.70
—
16.70
—
9.40
—
7.40
—
ns
P44
A(0:31), REG valid to ALE
negation1
(MIN = 1.00 × B1 – 2.00)
28.30
—
23.00
—
13.20
—
10.50
—
ns
P45
P46
CLKOUT to REG valid
(MAX = 0.25 × B1 + 8.00)
7.60
15.60
6.30
14.30
3.80
11.80
3.13
11.13
ns
P47
CLKOUT to REG invalid
(MIN = 0.25 × B1 + 1.00)
8.60
—
7.30
—
4.80
—
4.125
—
ns
P48
CLKOUT to CE1, CE2 asserted
(MAX = 0.25 × B1 + 8.00)
7.60
15.60
6.30
14.30
3.80
11.80
3.13
11.13
ns
P49
CLKOUT to CE1, CE2 negated
(MAX = 0.25 × B1 + 8.00)
7.60
15.60
6.30
14.30
3.80
11.80
3.13
11.13
ns
CLKOUT to PCOE, IORD, PCWE,
IOWR assert time (MAX =
0.00 × B1 + 11.00)
—
11.00
—
11.00
—
11.00
—
11.00
ns
P50
CLKOUT to PCOE, IORD, PCWE,
IOWR negate time (MAX =
0.00 × B1 + 11.00)
2.00
11.00
2.00
11.00
2.00
11.00
2.00
11.00
ns
P51
P52
CLKOUT to ALE assert time (MAX
= 0.25 × B1 + 6.30)
7.60
13.80
6.30
12.50
3.80
10.00
3.13
9.40
ns
P53
CLKOUT to ALE negate time (MAX
= 0.25 × B1 + 8.00)
—
15.60
—
14.30
—
11.80
—
11.13
ns
P54
PCWE, IOWR negated to D(0:31)
invalid1 (MIN – = 0.25 × B1 – 2.00)
5.60
—
4.30
—
1.80
—
1.125
—
ns
WAITA and WAITB valid to
CLKOUT rising edge1
(MIN = 0.00 × B1 + 8.00)
8.00
—
8.00
—
8.00
—
8.00
—
ns
P55
CLKOUT rising edge to WAITA and
WAITB invalid1 (MIN = 0.00 × B1 +
2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
P56
1 PSST
= 1. Otherwise add PSST times cycle time.
PSHT = 0. Otherwise add PSHT times cycle time.
These synchronous timings define when the WAITA signals are detected in order to freeze (or relieve) the PCMCIA
current cycle. The WAITA assertion will be effective only if it is detected 2 cycles before the PSL timer expiration.
See Chapter 16, “PCMCIA Interface,” in the MPC885 PowerQUICC Family User’s Manual.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
37
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 26 provides the PCMCIA access cycle timing for the external bus read.
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
PCOE, IORD
P52
ALE
B18
B19
D[0:31]
Figure 26. PCMCIA Access Cycles Timing External Bus Read
MPC875/MPC870 Hardware Specifications, Rev. 3.0
38
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 27 provides the PCMCIA access cycle timing for the external bus write.
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
B8
B9
P54
PCWE, IOWR
P52
ALE
D[0:31]
Figure 27. PCMCIA Access Cycles Timing External Bus Write
Figure 28 provides the PCMCIA WAIT signals detection timing.
CLKOUT
P55
P56
WAITA
Figure 28. PCMCIA WAIT Signals Detection Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
39
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 13 shows the PCMCIA port timing for the MPC875/870.
Table 13. PCMCIA Port Timing
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
—
19.00
—
19.00
—
19.00
—
19.00
ns
P57
CLKOUT to OPx valid
(MAX = 0.00 × B1 + 19.00)
P58
HRESET negated to OPx
drive 1(MIN = 0.75 × B1 + 3.00)
25.70
—
21.70
—
14.40
—
12.40
—
ns
P59
IP_Xx valid to CLKOUT rising edge
(MIN = 0.00 × B1 + 5.00)
5.00
—
5.00
—
5.00
—
5.00
—
ns
P60
CLKOUT rising edge to IP_Xx invalid
(MIN = 0.00 × B1 + 1.00)
1.00
—
1.00
—
1.00
—
1.00
—
ns
1 OP2
and OP3 only.
Figure 29 provides the PCMCIA output port timing for the MPC875/870.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 29. PCMCIA Output Port Timing
Figure 30 provides the PCMCIA input port timing for the MPC875/870.
CLKOUT
P59
P60
Input
Signals
Figure 30. PCMCIA Input Port Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
40
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 14 shows the debug port timing for the MPC875/870.
Table 14. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
3 × TCLOCKOUT
—
DSCK clock pulse width
1.25 × TCLOCKOUT
—
D63
DSCK rise and fall times
0.00
D64
DSDI input data setup time
8.00
ns
D65
DSDI data hold time
5.00
ns
D66
DSCK low to DSDO data valid
0.00
15.00
ns
D67
DSCK low to DSDO invalid
0.00
2.00
ns
D61
DSCK cycle time
D62
3.00
ns
Figure 31 provides the input timing for the debug port clock.
DSCK
D61
D62
D61
D62
D63
D63
Figure 31. Debug Port Clock Input Timing
Figure 32 provides the timing for the debug port.
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 32. Debug Port Timings
MPC875/MPC870 Hardware Specifications, Rev. 3.0
41
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Table 15 shows the reset timing for the MPC875/870.
Table 15. Reset Timing
33 MHz
Num
40 MHz
66 MHz
80 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT to HRESET high
impedance (MAX = 0.00 × B1 +
20.00)
—
20.00
—
20.00
—
20.00
—
20.00
ns
R69
CLKOUT to SRESET high
impedance (MAX = 0.00 × B1 +
20.00)
—
20.00
—
20.00
—
20.00
—
20.00
ns
R70
R71
RSTCONF pulse width
(MIN = 17.00 × B1)
515.20
—
425.00
—
257.60
—
212.50
—
ns
—
—
—
—
—
—
—
—
—
R72
—
Configuration data to HRESET
rising edge setup time
(MIN = 15.00 × B1 + 50.00)
504.50
—
425.00
—
277.30
—
237.50
—
ns
R73
Configuration data to RSTCONF 350.00
rising edge setup time
(MIN = 0.00 × B1 + 350.00)
—
350.00
—
350.00
—
350.00
—
ns
R74
Configuration data hold time after
RSTCONF negation
(MIN = 0.00 × B1 + 0.00)
0.00
—
0.00
—
0.00
—
0.00
—
ns
R75
Configuration data hold time after
HRESET negation
(MIN = 0.00 × B1 + 0.00)
0.00
—
0.00
—
0.00
—
0.00
—
ns
R76
HRESET and RSTCONF
asserted to data out drive
(MAX = 0.00 × B1 + 25.00)
—
25.00
—
25.00
—
25.00
—
25.00
ns
R77
RSTCONF negated to data out
high impedance
(MAX = 0.00 × B1 + 25.00)
—
25.00
—
25.00
—
25.00
—
25.00
ns
R78
—
25.00
—
25.00
—
25.00
—
25.00
ns
R79
CLKOUT of last rising edge
before chip three-states
HRESET to data out high
impedance
(MAX = 0.00 × B1 + 25.00)
R80
DSDI, DSCK setup
(MIN = 3.00 × B1)
90.90
—
75.00
—
45.50
—
37.50
—
ns
R81
DSDI, DSCK hold time
(MIN = 0.00 × B1 + 0.00)
0.00
—
0.00
—
0.00
—
0.00
—
ns
SRESET negated to CLKOUT
rising edge for DSDI and DSCK
sample (MIN = 8.00 × B1)
242.40
—
200.00
—
121.20
—
100.00
—
ns
R82
MPC875/MPC870 Hardware Specifications, Rev. 3.0
42
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Bus Signal Timing
Figure 33 shows the reset timing for the data bus configuration.
HRESET
R71
R76
RSTCONF
R73
R74
R75
D[0:31] (IN)
Figure 33. Reset Timing—Configuration from Data Bus
Figure 34 provides the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 34. Reset Timing—Data Bus Weak Drive During Configuration
MPC875/MPC870 Hardware Specifications, Rev. 3.0
43
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
Figure 35 provides the reset timing for the debug port configuration.
CLKOUT
R70
R82
SRESET
R80
R80
R81
R81
DSCK, DSDI
Figure 35. Reset Timing—Debug Port Configuration
12 IEEE 1149.1 Electrical Specifications
Table 16 provides the JTAG timings for the MPC875/870 shown in Figure 36 to Figure 39.
Table 16. JTAG Timing
Num
Characteristic
All
Frequencies
Min
Max
Unit
J82
TCK cycle time
100.00
—
ns
J83
TCK clock pulse width measured at 1.5 V
40.00
—
ns
J84
TCK rise and fall times
0.00
10.00
ns
J85
TMS, TDI data setup time
5.00
—
ns
J86
TMS, TDI data hold time
25.00
—
ns
J87
TCK low to TDO data valid
—
27.00
ns
J88
TCK low to TDO data invalid
0.00
—
ns
J89
TCK low to TDO high impedance
—
20.00
ns
J90
TRST assert time
100.00
—
ns
J91
TRST setup time to TCK low
40.00
—
ns
J92
TCK falling edge to output valid
—
50.00
ns
J93
TCK falling edge to output valid out of high impedance
—
50.00
ns
J94
TCK falling edge to output high impedance
—
50.00
ns
J95
Boundary scan input valid to TCK rising edge
50.00
—
ns
J96
TCK rising edge to boundary scan input invalid
50.00
—
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
44
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 36. JTAG Test Clock Input Timing
TCK
J85
J86
TMS, TDI
J87
J88
J89
TDO
Figure 37. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 38. JTAG TRST Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
45
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
TCK
J92
J94
Output
Signals
J93
Output
Signals
J95
J96
Output
Signals
Figure 39. Boundary Scan (JTAG) Timing Diagram
13 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module (CPM) of
the MPC875/870.
13.1 Port C Interrupt AC Electrical Specifications
Table 17 provides the timings for port C interrupts.
Table 17. Port C Interrupt Timing
33.34 MHz
Num
Characteristic
Unit
Min
Max
35
Port C interrupt pulse width low (edge-triggered mode)
55
—
ns
36
Port C interrupt minimum time between active edges
55
—
ns
Figure 40 shows the port C interrupt detection timing.
36
Port C
(Input)
35
Figure 40. Port C Interrupt Detection Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
46
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
13.2 IDMA Controller AC Electrical Specifications
Table 18 provides the IDMA controller timings as shown in Figure 41 to Figure 44.
Table 18. IDMA Controller Timing
Num
All
Frequencies
Characteristic
Unit
Min
Max
7
—
ns
TBD
—
ns
40
DREQ setup time to clock high
41
DREQ hold time from clock high 1
42
SDACK assertion delay from clock high
—
12
ns
43
SDACK negation delay from clock low
—
12
ns
44
SDACK negation delay from TA low
—
20
ns
45
SDACK negation delay from clock high
—
15
ns
46
TA assertion to falling edge of the clock setup time (applies to external TA)
7
—
ns
1 Applies
to high-to-low mode (EDM=1)
CLKO
(Output)
41
40
DREQ
(Input)
Figure 41. IDMA External Requests Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
47
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 42. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 43. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
MPC875/MPC870 Hardware Specifications, Rev. 3.0
48
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 44. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
13.3 Baud Rate Generator AC Electrical Specifications
Table 19 provides the baud rate generator timings as shown in Figure 45.
Table 19. Baud Rate Generator Timing
Num
All
Frequencies
Characteristic
Min
Max
Unit
50
BRGO rise and fall time
—
10
ns
51
BRGO duty cycle
40
60
%
52
BRGO cycle
40
—
ns
50
50
BRGOX
51
51
52
Figure 45. Baud Rate Generator Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
49
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
13.4 Timer AC Electrical Specifications
Table 20 provides the general-purpose timer timings as shown in Figure 46.
Table 20. Timer Timing
Num
All
Frequencies
Characteristic
Min
Max
Unit
61
TIN/TGATE rise and fall time
10
—
ns
62
TIN/TGATE low time
1
—
clk
63
TIN/TGATE high time
2
—
clk
64
TIN/TGATE cycle time
3
—
clk
65
CLKO low to TOUT valid
3
25
ns
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 46. CPM General-Purpose Timers Timing Diagram
13.5 Serial Interface AC Electrical Specifications
Table 21 provides the serial interface (SI) timings as shown in Figure 47 to Figure 51.
Table 21. SI Timing
All Frequencies
Num
Characteristic
Unit
70
L1RCLKB, L1TCLKB frequency (DSC = 0) 1, 2
71
L1RCLKB, L1TCLKB width low (DSC = 0) 2
3
71a
L1RCLKB, L1TCLKB width high (DSC = 0)
72
L1TXDB, L1ST1 and L1ST2, L1RQ, L1CLKO rise/fall time
73
L1RSYNCB, L1TSYNCB valid to L1CLKB edge (SYNC setup time)
Min
Max
—
SYNCCLK
/2.5
MHz
P + 10
—
ns
P + 10
—
ns
—
15.00
ns
20.00
—
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
50
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
Table 21. SI Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
35.00
—
ns
—
15.00
ns
74
L1CLKB edge to L1RSYNCB, L1TSYNCB, invalid (SYNC hold time)
75
L1RSYNCB, L1TSYNCB rise/fall time
76
L1RXDB valid to L1CLKB edge (L1RXDB setup time)
17.00
—
ns
77
L1CLKB edge to L1RXDB invalid (L1RXDB hold time)
13.00
—
ns
78
L1CLKB edge to L1ST1 and L1ST2 valid 4
10.00
45.00
ns
78A
L1SYNCB valid to L1ST1 and L1ST2 valid
10.00
45.00
ns
79
L1CLKB edge to L1ST1 and L1ST2 invalid
10.00
45.00
ns
80
L1CLKB edge to L1TXDB valid
10.00
55.00
ns
L1TSYNCB valid to L1TXDB valid 4
10.00
55.00
ns
81
L1CLKB edge to L1TXDB high impedance
0.00
42.00
ns
82
L1RCLKB, L1TCLKB frequency (DSC =1)
—
16.00 or
SYNCCLK
/2
MHz
83
L1RCLKB, L1TCLKB width low (DSC =1)
P + 10
—
ns
P + 10
—
ns
—
30.00
ns
1.00
—
L1TCLK
80A
1)3
83a
L1RCLKB, L1TCLKB width high (DSC =
84
L1CLKB edge to L1CLKOB valid (DSC = 1)
L1TSYNCB4
85
L1RQB valid before falling edge of
86
L1GRB setup time2
42.00
—
ns
87
L1GRB hold time
42.00
—
ns
88
L1CLKB edge to L1SYNCB valid (FSD = 00) CNT = 0000, BYT = 0,
DSC = 0)
—
0.00
ns
1 The
ratio SyncCLK/L1RCLKB must be greater than 2.5/1.
specs are valid for IDL mode only.
3 Where P = 1/CLKOUT. Thus for a 25-MHz CLKO1 rate, P = 40 ns.
4 These strobes and TxD on the first bit of the frame become valid after the L1CLKB edge or L1SYNCB, whichever
comes later.
2 These
MPC875/MPC870 Hardware Specifications, Rev. 3.0
51
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLKB
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLKB
(FE=1, CE=1)
(Input)
RFSD=1
75
L1RSYNCB
(Input)
73
74
L1RXDB
(Input)
77
BIT0
76
78
79
L1ST(2-1)
(Output)
Figure 47. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
52
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLKB
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLKB
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNCB
(Input)
73
74
L1RXDB
(Input)
77
BIT0
76
78
79
L1ST(2-1)
(Output)
84
L1CLKOB
(Output)
Figure 48. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
53
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
L1TCLKB
(FE=0, CE=0)
(Input)
71
70
72
L1TCLKB
(FE=1, CE=1)
(Input)
73
TFSD=0
75
L1TSYNCB
(Input)
74
81
80a
L1TXDB
(Output)
BIT0
80
78
79
L1ST(2-1)
(Output)
Figure 49. SI Transmit Timing Diagram (DSC = 0)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
54
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLKB
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLKB
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNCB
(Input)
73
74
L1TXDB
(Output)
81
BIT0
80
78a
79
L1ST(2-1)
(Output)
78
84
L1CLKOB
(Output)
Figure 50. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
55
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
56
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
L1GRB
(Input)
L1RQB
(Output)
L1ST(2-1)
(Output)
L1RXDB
(Input)
L1TXDB
(Output)
L1RSYNCB
(Input)
L1RCLKB
(Input)
80
77
74
2
3
5
72
B15 B14 B13
71
71
4
86
85
76
6
87
B17 B16 B15 B14 B13
B17 B16
73
1
78
B12 B11
B12 B11
7
8
B10
B10
9
D1
D1
10
A
A
11
14
15
16
17
18
B25 B24 B23 B22 B21 B20
13
B27 B26 B25 B24 B23 B22 B21 B20
81
B27 B26
12
19
D2
D2
20
M
M
CPM Electrical Characteristics
Figure 51. IDL Timing
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
CPM Electrical Characteristics
13.6 SCC in NMSI Mode Electrical Specifications
Table 22 provides the NMSI external clock timing.
Table 22. NMSI External Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1/SYNCCLK
—
ns
1/SYNCCLK +5
—
ns
—
15.00
ns
100
RCLK3 and TCLK3 width high 1
101
RCLK3 and TCLK3 width low
102
RCLK3 and TCLK3 rise/fall time
103
TXD3 active delay (from TCLK3 falling edge)
0.00
50.00
ns
104
RTS3 active/inactive delay (from TCLK3 falling edge)
0.00
50.00
ns
105
CTS3 setup time to TCLK3 rising edge
5.00
—
ns
106
RXD3 setup time to RCLK3 rising edge
5.00
—
ns
5.00
—
ns
5.00
—
ns
edge 2
107
RXD3 hold time from RCLK3 rising
108
CD3 setup time to RCLK3 rising edge
1 The
2 Also
ratios SyncCLK/RCLK3 and SyncCLK/TCLK3 must be greater than or equal to 2.25/1.
applies to CD and CTS hold time when they are used as external sync signals.
Table 23 provides the NMSI internal clock timing.
Table 23. NMSI Internal Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
100
RCLK3 and TCLK3 frequency 1
0.00
SYNCCLK/3
MHz
102
RCLK3 and TCLK3 rise/fall time
—
—
ns
103
TXD3 active delay (from TCLK3 falling edge)
0.00
30.00
ns
104
RTS3 active/inactive delay (from TCLK3 falling edge)
0.00
30.00
ns
105
CTS3 setup time to TCLK3 rising edge
40.00
—
ns
106
RXD3 setup time to RCLK3 rising edge
40.00
—
ns
107
RXD3 hold time from RCLK3 rising edge 2
0.00
—
ns
108
CD3 setup time to RCLK3 rising edge
40.00
—
ns
1 The
2 Also
ratios SyncCLK/RCLK3 and SyncCLK/TCLK3 must be greater or equal to 3/1.
applies to CD and CTS hold time when they are used as external sync signals
MPC875/MPC870 Hardware Specifications, Rev. 3.0
57
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
Figure 52 through Figure 54 show the NMSI timings.
RCLK3
102
102
101
106
100
RxD3
(Input)
107
108
CD3
(Input)
107
CD3
(SYNC Input)
Figure 52. SCC NMSI Receive Timing Diagram
TCLK3
102
102
101
100
TxD3
(Output)
103
105
RTS3
(Output)
104
104
CTS3
(Input)
107
CTS3
(SYNC Input)
Figure 53. SCC NMSI Transmit Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
58
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
TCLK3
102
102
101
100
TxD3
(Output)
103
RTS3
(Output)
104
107
104
105
CTS3
(Echo Input)
Figure 54. HDLC Bus Timing Diagram
13.7 Ethernet Electrical Specifications
Table 24 provides the Ethernet timings as shown in Figure 55 to Figure 57.
Table 24. Ethernet Timing
Num
Characteristic
All
Frequencies
Min
Max
Unit
120
CLSN width high
40
—
ns
121
RCLK3 rise/fall time
—
15
ns
122
RCLK3 width low
40
—
ns
80
120
ns
1
123
RCLK3 clock period
124
RXD3 setup time
20
—
ns
125
RXD3 hold time
5
—
ns
126
RENA active delay (from RCLK3 rising edge of the last data bit)
10
—
ns
127
RENA width low
100
—
ns
128
TCLK3 rise/fall time
—
15
ns
129
TCLK3 width low
40
—
ns
130
TCLK3 clock period1
99
101
ns
131
TXD3 active delay (from TCLK3 rising edge)
—
50
ns
132
TXD3 inactive delay (from TCLK3 rising edge)
6.5
50
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
59
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
Table 24. Ethernet Timing (continued)
Num
1
2
All
Frequencies
Characteristic
Min
Max
Unit
133
TENA active delay (from TCLK3 rising edge)
10
50
ns
134
TENA inactive delay (from TCLK3 rising edge)
10
50
ns
138
CLKO1 low to SDACK asserted 2
—
20
ns
139
2
—
20
ns
CLKO1 low to SDACK negated
The ratios SyncCLK/RCLK3 and SyncCLK/TCLK3 must be greater than or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 55. Ethernet Collision Timing Diagram
RCLK3
121
121
124
123
RxD3
(Input)
Last Bit
125
126
127
RENA(CD3)
(Input)
Figure 56. Ethernet Receive Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
60
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
TCLK3
128
128
131
129
121
TxD3
(Output)
132
133
134
TENA(RTS3)
(Input)
RENA(CD3)
(Input)
(NOTE 2)
NOTES:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is negated before TENA or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 57. Ethernet Transmit Timing Diagram
13.8 SMC Transparent AC Electrical Specifications
Table 25 provides the SMC transparent timings as shown in Figure 58.
Table 25. SMC Transparent Timing
Num
1
Characteristic
All
Frequencies
Min
Max
Unit
150
SMCLK clock period 1
100
—
ns
151
SMCLK width low
50
—
ns
151A
SMCLK width high
50
—
ns
152
SMCLK rise/fall time
—
15
ns
153
SMTXD active delay (from SMCLK falling edge)
10
50
ns
154
SMRXD/SMSYNC setup time
20
—
ns
155
RXD1/SMSYNC hold time
5
—
ns
SyncCLK must be at least twice as fast as SMCLK.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
SMCLK
152
152
151
151
150
SMTXD
(Output)
NOTE
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 58. SMC Transparent Timing Diagram
13.9 SPI Master AC Electrical Specifications
Table 26 provides the SPI master timings as shown in Figure 59 and Figure 60.
Table 26. SPI Master Timing
Num
Characteristic
All
Frequencies
Min
Max
Unit
160
MASTER cycle time
4
1024
tcyc
161
MASTER clock (SCK) high or low time
2
512
tcyc
162
MASTER data setup time (inputs)
15
—
ns
163
Master data hold time (inputs)
0
—
ns
164
Master data valid (after SCK edge)
—
10
ns
165
Master data hold time (outputs)
0
—
ns
166
Rise time output
—
15
ns
167
Fall time output
—
15
ns
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
SPICLK
(CI=0)
(Output)
161
167
166
161
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
msb
166
Data
lsb
165
164
167
SPIMOSI
(Output)
msb
166
msb
Data
lsb
msb
Figure 59. SPI Master (CP = 0) Timing Diagram
SPICLK
(CI=0)
(Output)
161
167
166
161
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
166
msb
Data
165
lsb
164
167
SPIMOSI
(Output)
msb
msb
166
Data
lsb
msb
Figure 60. SPI Master (CP = 1) Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
13.10SPI Slave AC Electrical Specifications
Table 27 provides the SPI slave timings as shown in Figure 61 and Figure 62.
Table 27. SPI Slave Timing
Num
All
Frequencies
Characteristic
Min
Max
Unit
170
Slave cycle time
2
—
tcyc
171
Slave enable lead time
15
—
ns
172
Slave enable lag time
15
—
ns
173
Slave clock (SPICLK) high or low time
1
—
tcyc
174
Slave sequential transfer delay (does not require deselect)
1
—
tcyc
175
Slave data setup time (inputs)
20
—
ns
176
Slave data hold time (inputs)
20
—
ns
177
Slave access time
—
50
ns
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
173
181
170
SPICLK
(CI=1)
(Input)
177
181
182
180
SPIMISO
(Output)
msb
178
Data
175
msb
Undef
msb
179
176
SPIMOSI
(Input)
lsb
181 182
Data
lsb
msb
Figure 61. SPI Slave (CP = 0) Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
64
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
170
SPICLK
(CI=0)
(Input)
173
182
181
173
181
SPICLK
(CI=1)
(Input)
177
182
180
SPIMISO
(Output)
msb
Undef
Data
175
178
msb
lsb
179
176
SPIMOSI
(Input)
181 182
msb
Data
msb
lsb
Figure 62. SPI Slave (CP = 1) Timing Diagram
13.11I2C AC Electrical Specifications
Table 28 provides the I2C (SCL < 100 KHz) timings.
Table 28. I2C Timing (SCL < 100 KHZ)
Num
200
Characteristic
SCL clock frequency (slave)
1
All
Frequencies
Unit
Min
Max
0
100
KHz
1.5
100
KHz
200
SCL clock frequency (master)
202
Bus free time between transmissions
4.7
—
µs
203
Low period of SCL
4.7
—
µs
204
High period of SCL
4.0
—
µs
205
Start condition setup time
4.7
—
µs
206
Start condition hold time
4.0
—
µs
207
Data hold time
0
—
µs
208
Data setup time
250
—
ns
209
SDL/SCL rise time
—
1
µs
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
CPM Electrical Characteristics
Table 28. I2C Timing (SCL < 100 KHZ) (continued)
Num
1
All
Frequencies
Characteristic
Min
Max
Unit
210
SDL/SCL fall time
—
300
ns
211
Stop condition setup time
4.7
—
µs
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) × pre_scalar × 2).
The ratio SyncClk/(BRGCLK/pre_scalar) must be greater than or equal to 4/1.
Table 29 provides the I2C (SCL > 100 KHz) timings.
Table 29. I2C Timing (SCL > 100 KHZ)
All Frequencies
Num
200
Characteristic
SCL clock frequency (slave)
(master) 1
Expression
Unit
Min
Max
fSCL
0
BRGCLK/48
Hz
fSCL
BRGCLK/16512
BRGCLK/48
Hz
200
SCL clock frequency
202
Bus free time between transmissions
—
1/(2.2 × fSCL)
—
s
203
Low period of SCL
—
1/(2.2 × fSCL)
—
s
204
High period of SCL
—
1/(2.2 × fSCL)
—
s
205
Start condition setup time
—
1/(2.2 × fSCL)
—
s
206
Start condition hold time
—
1/(2.2 × fSCL)
—
s
207
Data hold time
—
0
—
s
208
Data setup time
—
1/(40 × fSCL)
—
s
209
SDL/SCL rise time
—
—
1/(10 × fSCL)
s
210
SDL/SCL fall time
—
—
1/(33 × fSCL)
s
211
Stop condition setup time
—
1/2(2.2 × fSCL)
—
s
1 SCL
frequency is given by SCL = BrgClk_frequency / ((BRG register + 3) × pre_scalar × 2).
The ratio SyncClk/(Brg_Clk/pre_scalar) must be greater than or equal to 4/1.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
USB Electrical Characteristics
Figure 63 shows the I2C bus timing.
SDA
202
203
204
205
208
207
SCL
206
209
210
211
Figure 63. I2C Bus Timing Diagram
14 USB Electrical Characteristics
This section provides the AC timings for the USB interface.
14.1 USB Interface AC Timing Specifications
The USB Port uses the transmit clock on SCC1. Table 30 lists the USB interface timings.
Table 30. USB Interface AC Timing Specifications
All Frequencies
Name
Characteristic
Unit
Min
US1
US4
USBCLK frequency of operation 1
Low speed
Full speed
USBCLK duty cycle (measured at 1.5 V)
1 USBCLK
Max
MHz
MHz
6
48
45
55
%
accuracy should be ± 500 ppm or better. USBCLK may be stopped to conserve power.
15 FEC Electrical Characteristics
This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing
specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII
signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V.
15.1 MII and Reduced MII Receive Signal Timing
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz +1%. The reduced MII
(RMII) receiver functions correctly up to a RMII_REFCLK maximum frequency of 50 MHz + 1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK
frequency – 1%.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
FEC Electrical Characteristics
Table 31 provides information on the MII receive signal timing.
Table 31. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup
5
—
ns
M2
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
5
—
ns
M3
MII_RX_CLK pulse width high
35%
65%
MII_RX_CLK period
M4
MII_RX_CLK pulse width low
35%
65%
MII_RX_CLK period
M1_R RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR to RMII_REFCLK
MII
setup
4
—
ns
M2_R RMII_REFCLK to RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR
MII
hold
2
—
ns
Figure 64 shows MII receive signal timing.
M3
MII_RX_CLK (input)
M4
MII_RXD[3:0] (inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 64. MII Receive Signal Timing Diagram
15.2 MII and Reduced MII Transmit Signal Timing
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz + 1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK
frequency – 1%.
Table 32 provides information on the MII transmit signal timing.
Table 32. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid
5
—
ns
M6
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid
—
25
ns
M7
MII_TX_CLK pulse width high
35%
65%
MII_TX_CLK period
M8
MII_TX_CLK pulse width low
35%
65%
MII_TX_CLK period
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
FEC Electrical Characteristics
Table 32. MII Transmit Signal Timing (continued)
Num
Characteristic
Min
Max
Unit
M20_R RMII_TXD[1:0], RMII_TX_EN to RMII_REFCLK setup
MII
4
—
ns
M21_R RMII_TXD[1:0], RMII_TX_EN data hold from RMII_REFCLK rising
MII
edge
2
—
ns
Figure 65 shows the MII transmit signal timing diagram.
M7
MII_TX_CLK (input)
M5
M8
MII_TXD[3:0] (outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 65. MII Transmit Signal Timing Diagram
15.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 33 provides information on the MII async inputs signal timing.
Table 33. MII Async Inputs Signal Timing
Num
M9
Characteristic
Min
Max
Unit
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK period
Figure 66 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 66. MII Async Inputs Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
FEC Electrical Characteristics
15.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
Table 34 provides information on the MII serial management channel signal timing. The FEC functions correctly
with a maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation.
Table 34. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10
MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11
MII_MDC falling edge to MII_MDIO output valid (max prop delay)
—
25
ns
M12
MII_MDIO (input) to MII_MDC rising edge setup
10
—
ns
M13
MII_MDIO (input) to MII_MDC rising edge hold
0
—
ns
M14
MII_MDC pulse width high
40%
60%
MII_MDC period
M15
MII_MDC pulse width low
40%
60%
MII_MDC period
Figure 67 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (output)
M10
MII_MDIO (output)
M11
MII_MDIO (input)
M12
M13
Figure 67. MII Serial Management Channel Timing Diagram
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Mechanical Data and Ordering Information
16 Mechanical Data and Ordering Information
Table 35 identifies the packages and operating frequencies available for the MPC875/870.
Table 35. Available MPC875/870 Packages/Frequencies
Package Type
Plastic ball grid array
ZT suffix — Leaded
VR suffix — Lead-Free are available as needed
Plastic ball grid array
CZT suffix — Leaded
CVR suffix — Lead-Free are available as needed
Temperature (Tj) Frequency (MHz)
0°C to 95°C
-40°C to 100°C
Order Number
66
KMPC875ZT66
KMPC870ZT66
MPC875ZT66
MPC870ZT66
80
KMPC875ZT80
KMPC870ZT80
MPC875ZT80
MPC870ZT80
133
KMPC875ZT133
KMPC870ZT133
MPC875ZT133
MPC870ZT133
66
KMPC875CZT66
KMPC870CZT66
MPC875CZT66
MPC870CZT66
133
KMPC875CZT133
KMPC870CZT133
MPC875CZT133
MPC870CZT133
16.1 Pin Assignments
Figure 68 shows the JEDEC pinout of the PBGA package as viewed from the top surface. For additional
information, see the MPC885 PowerQUICC Family User’s Manual.
NOTE
The pin numbering starts with B2 in order to conform to the JEDEC standard for
23-mm body size using a 16 × 16 array.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
71
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Mechanical Data and Ordering Information
NOTE: This is the top view of the device.
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
EXTCLK MODCK1
OP0
ALEA
IPB0
BURST
IRQ6
BR
TEA
BI
CS0
CS3
CS5
N/C
RSTCONFSRESET BADDR29
OP1
AS
ALEB
IRQ2
BB
TS
TA
BDIP
CS2
CE1A
GPLAB3
GPLA0
EXTAL BADDR30
IPB1
BG
GPLA4
GPLA5
WR
CE2A
CS7
WE2
WE1
VSSSYN VDDSYN HRESET BADDR28
IRQ4
IRQ3
CS1
GPLB4
CS4
GPLAB2
WE0
BSA1
BSA2
CS6
OE
BSA0
BSA3
TSIZ0
A31
WE3
TSIZ1
A26
A22
A18
VDDL
A28
A30
A25
A24
A23
A21
A20
A29
A14
A19
A27
A17
A10
A12
A15
A16
MII_MDIO A2
A8
A11
A13
PB26
PB27
A1
A6
A7
A9
B
MODCK2 TEXP
C
IPA7
D
IPA4
IPA2
D31
IPA5
IPA3
D29
D30
IPA6
D7
D28
CLKOUT
D26
IPA0
D22
D6
D24
D25
VDDL
D18
D19
D20
D21
D5
D15
D16
D3
D2
D27
WAITA PORESET XTAL
E
F
IPA1 VSSSYN1
VDDL
VDDL
G
VDDH
VDDH
H
VDDH
GND
VDDH
J
GND
K
D14
GND
VDDL
VDDL
L
GND
VDDH
D0
VDDH
VDDH
M
D11
D9
D12
PE18
IRQ0
VDDH
IRQ7
PA2
VDDL
VDDH
N
D10
D1
D13
VDDL
P
D23
D17
IRQ1
PA0
PA4
PE14
PE31
PC6
PA6
PC11
TDO
PA15
A3
A5
A4
PE25
PA3
PE19
PE28
PE30
PA11
MII_COL
PA7
PA10
TCK
PB28
PC15
A0
PB29
PB31
PE22
R
D4
D8
T
PE26
PD8
PA1
PE27
PE15
PE17
PE21
PC7
PB19
PB24
TDI
TMS
PC12
N/C
PB30
N/C
PE20
PE23 MII-TX-EN PE16
PE29
PE24
PC13
MII-CRS
PC10
PB23
PB25
TRST
GND
PA14
N/C
U
Figure 68. Pinout of the PBGA Package—JEDEC Standard
Table 36 contains a list of the MPC875/870 input and output signals and shows multiplexing and pin assignments.
Table 36. Pin Assignments—JEDEC Standard
Name
Pin Number
Type
A[0:31]
R16, N14, M14, P15, P17, P16, N15, N16, M15, N17, L14, M16,
Bidirectional
L15, M17, K14, L16, L17, K17, G17, K15, J16, J15, G16, J14, H17, Three-state (3.3 V only)
H16, G15, K16, H14, J17, H15, F17
TSIZ0
REG
F16
Bidirectional
Three-state (3.3 V only)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
TSIZ1
G14
Bidirectional
Three-state (3.3 V only)
RD/WR
D13
Bidirectional
Three-state (3.3 V only)
BURST
B9
Bidirectional
Three-state (3.3 V only)
BDIP
GPL_B5
C13
Output
TS
C11
Bidirectional
Active pull-up (3.3 V only)
TA
C12
Bidirectional
Active pull-up (3.3 V only)
TEA
B12
Open-drain
BI
B13
Bidirectional
Active pull-up (3.3 V only)
IRQ2
RSV
C9
Bidirectional
Three-state (3.3 V only)
IRQ4
KR
RETRY
SPKROUT
E9
Bidirectional
Three-state (3.3 V only)
D[0:31]
L5, N3, L3, L2, R2, K2, H3, G2, R3, M3, N2, M2, M4, N4, K5, K3, K4, Bidirectional
P3, J2, J3, J4, J5, H2, P2, H4, H5, G5, L4, G3, F2, F3, E2
Three-state (3.3 V only)
CR
IRQ3
E10
Input
FRZ
IRQ6
B10
Bidirectional
Three-state (3.3 V only)
BR
B11
Bidirectional (3.3 V only)
BG
D10
Bidirectional (3.3 V only)
BB
C10
Bidirectional
Active pull-up (3.3 V only)
IRQ0
M6
Input (3.3 V only)
IRQ1
P5
Input (3.3 V only)
IRQ7
N5
Input (3.3 V only)
CS[0:5]
B14, E11, C14, B15, E13, B16
Output
CS6
CE1_B
F12
Output
CS7
CE2_B
D15
Output
MPC875/MPC870 Hardware Specifications, Rev. 3.0
73
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
WE0
BS_B0
IORD
E15
Output
WE1
BS_B1
IOWR
D17
Output
WE2
BS_B2
PCOE
D16
Output
WE3
BS_B3
PCWE
G13
Output
BS_A[0:3]
F14, E16, E17, F15
Output
GPL_A0
GPL_B0
C17
Output
OE
GPL_A1
GPL_B1
F13
Output
GPL_A[2:3]
GPL_B[2:3]
CS[2–3]
E14, C16
Output
UPWAITA
GPL_A4
D11
Bidirectional (3.3 V only)
UPWAITB
GPL_B4
E12
Bidirectional
GPL_A5
D12
Output
PORESET
D5
Input (3.3 V only)
RSTCONF
C3
Input (3.3 V only)
HRESET
E7
Open-drain
SRESET
C4
Open-drain
XTAL
D6
Analog output
EXTAL
D7
Analog input (3.3 V only)
CLKOUT
G4
Output
EXTCLK
B4
Input (3.3 V only)
TEXP
B3
Output
ALE_A
B7
Output
CE1_A
C15
Output
CE2_A
D14
Output
WAIT_A
D4
Input (3.3 V only)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
74
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
IP_A0
G6
Input (3.3 V only)
IP_A1
F5
Input (3.3 V only)
IP_A2
IOIS16_A
D3
Input (3.3 V only)
IP_A3
E4
Input (3.3 V only)
IP_A4
D2
Input (3.3 V only)
IP_A5
E3
Input (3.3 V only)
IP_A6
F4
Input (3.3 V only)
IP_A7
C2
Input (3.3 V only)
ALE_B
DSCK
C8
Bidirectional
Three-state (3.3 V only)
IP_B[0:1]
IWP[0:1]
VFLS[0:1]
B8, D9
Bidirectional (3.3 V only)
OP0
B6
Bidirectional (3.3 V only)
OP1
C6
Output
OP2
MODCK1
STS
B5
Bidirectional (3.3 V only)
OP3
MODCK2
DSDO
B2
Bidirectional (3.3 V only)
BADDR[28:29]
E8, C5
Output
BADDR30
REG
D8
Output
AS
C7
Input (3.3 V only)
PA15
USBRXD
P14
Bidirectional
PA14
USBOE
U16
Bidirectional
(Optional: open-drain)
PA11
RXD4
MII1-TXD0
RMII1-TXD0
R9
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PA10
MII1-TXERR
TIN4
CLK7
R12
Bidirectional
(Optional: open-drain)
(5-V tolerant)
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Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
PA7
CLK1
BRGO1
TIN1
R11
Bidirectional
PA6
CLK2
TOUT1
P11
Bidirectional
PA4
CTS4
MII1-TXD1
RMII-TXD1
P7
Bidirectional
PA3
MII1-RXER
RMII1-RXER
BRGO3
R5
Bidirectional
(5-V tolerant)
PA2
MII1-RXDV
RMII1-CRS_DV
TXD4
N6
Bidirectional
(5-V tolerant)
PA1
MII1-RXD0
RMII1-RXD0
BRGO4
T4
Bidirectional
(5-V tolerant)
PA0
MII1-RXD1
RMII1-RXD1
TOUT4
P6
Bidirectional
(5-V tolerant)
PB31
SPISEL
MII1 - TXCLK
RMII1-REFCLK
T5
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB30
SPICLK
T17
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB29
SPIMOSI
R17
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB28
SPIMISO
BRGO4
R14
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB27
I2CSDA
BRGO1
N13
Bidirectional
(Optional: open-drain)
PB26
I2CSCL
BRGO2
N12
Bidirectional
(Optional: open-drain)
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Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
PB25
SMTXD1
U13
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB24
SMRXD1
T12
Bidirectional
(Optional: open-drain)
(5-V tolerant)
PB23
SDACK1
SMSYN1
U12
Bidirectional
(Optional: open-drain)
PB19
MII1-RXD3
RTS4
T11
Bidirectional
(Optional: open-drain)
PC15
DREQ0
L1ST1
R15
Bidirectional
(5-V tolerant)
PC13
MII1-TXD3
SDACK1
U9
Bidirectional
(5-V tolerant)
PC12
MII1-TXD2
TOUT1
T15
Bidirectional
(5-V tolerant)
PC11
USBRXP
P12
Bidirectional
PC10
USBRXN
TGATE1
U11
Bidirectional
PC7
CTS4
L1TSYNCB
USBTXP
T10
Bidirectional
(5-V tolerant)
PC6
CD4
L1RSYNCB
USBTXN
P10
Bidirectional
(5-V tolerant)
PD8
RXD4
MII-MDC
RMII-MDC
T3
Bidirectional
(5-V tolerant)
PE31
CLK8
L1TCLKB
MII1-RXCLK
P9
Bidirectional
(Optional: open-drain)
PE30
L1RXDB
MII1-RXD2
R8
Bidirectional
(Optional: open-drain)
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
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Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
PE29
MII2-CRS
U7
Bidirectional
(Optional: open-drain)
PE28
TOUT3
MII2-COL
R7
Bidirectional
(Optional: open-drain)
PE27
L1RQB
MII2-RXERR
RMII2-RXERR
T6
Bidirectional
(Optional: open-drain)
PE26
L1CLKOB
MII2-RXDV
RMII2-CRS_DV
T2
Bidirectional
(Optional: open-drain)
PE25
RXD4
MII2-RXD3
L1ST2
R4
Bidirectional
(Optional: open-drain)
PE24
SMRXD1
BRGO1
MII2-RXD2
U8
Bidirectional
(Optional: open-drain)
PE23
TXD4
MII2-RXCLK
L1ST1
U4
Bidirectional
(Optional: open-drain)
PE22
TOUT2
MII2-RXD1
RMII2-RXD1
SDACK1
P4
Bidirectional
(Optional: open-drain)
PE21
TOUT1
MII2-RXD0
RMII2-RXD0
T9
Bidirectional
(Optional: open-drain)
PE20
MII2-TXER
U3
Bidirectional
(Optional: open-drain)
PE19
L1TXDB
MII2-TXEN
RMII2-TXEN
R6
Bidirectional
(Optional: open-drain)
PE18
SMTXD1
MII2-TXD3
M5
Bidirectional
(Optional: open-drain)
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Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
PE17
TIN3
CLK5
BRGO3
SMSYN1
MII2-TXD2
T8
Bidirectional
(Optional: open-drain)
PE16
L1RCLKB
CLK6
MII2-TXCLK
RMII2-REFCLK
U6
Bidirectional
(Optional: open-drain)
PE15
TGATE1
MII2-TXD1
RMII2-TXD1
T7
Bidirectional
PE14
MII2-TXD0
RMII2-TXD0
P8
Bidirectional
TMS
T14
Input
(5-V tolerant)
TDI
DSDI
T13
Input
(5-V tolerant)
TCK
DSCK
R13
Input
(5-V tolerant)
TRST
U14
Input
(5-V tolerant)
TDO
DSDO
P13
Output
(5-V tolerant)
MII1_CRS
U10
Input
MII_MDIO
M13
Bidirectional
(5-V tolerant)
MII1_TX_EN
RMII1_TX_EN
U5
Output
(5-V tolerant)
MII1_COL
R10
Input
VSSSYN
E5
PLL analog GND
VSSSYN1
F6
PLL analog GND
VDDSYN
E6
PLL analog VDD
GND
H8, H9, H10, H11, J8, J9, J10, J11, K8, K9, K10, K11, L8, L9, L10,
L11, U15
Power
VDDL
F7, F8, F9, F10, F11, H6, H13, J6, J13, K6, K13, L6, L13, N7, N8,
N9, N10, N11
Power
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Mechanical Data and Ordering Information
Table 36. Pin Assignments—JEDEC Standard (continued)
Name
Pin Number
Type
VDDH
G7, G8, G9, G10, G11, G12, H7, H12, J7, J12, K7, K12, L7, L12, M7, Power
M8, M9, M10, M11, M12
N/C
B17, T16, U2, U17
No-connect
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Mechanical Data and Ordering Information
16.2 Mechanical Dimensions of the PBGA Package
Figure 69 shows the mechanical dimensions of the PBGA package.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/870ZTXXX.
Figure 69. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
81
Document Revision History
17 Document Revision History
Table 37 lists significant changes between revisions of this hardware specification.
Table 37. Document Revision History
Revision
Number
Date
0
2/2003
Initial release.
0.1
3/2003
Took out the time-slot assigner and changed the SCC for SCC3 to SCC4.
0.2
5/2003
Changed the package drawing, removed all references to Data Parity. Changed the SPI
Master Timing Specs. 162 and 164. Added the RMII and USB timing. Added the 80-MHz
timing.
0.3
5/2003
Made sure the pin types were correct. Changed the Features list to agree with the
MPC885.
0.4
5/2003
Corrected the signals that had overlines on them. Made corrections on two pins that were
typos.
0.5
5/2003
Changed the pin descriptions for PD8 and PD9.
0.6
5/2003
Changed a few typos. Put back the I2C. Put in the new reset configuration, corrected the
USB timing.
0.7
6/2003
Changed the pin descriptions per the June 22 spec, removed Utopia from the pin
descriptions, changed PADIR, PBDIR, PCDIR and PDDIR to be 0 in the Mandatory
Reset Config.
0.8
8/2003
Added the reference to USB 2.0 to the Features list and removed 1.1 from USB on the
block diagrams.
0.9
8/2003
Changed the USB description to full-/low-speed compatible.
1.0
9/2003
Added the DSP information in the Features list.
Put a new sentence under Mechanical Dimensions.
Fixed table formatting.
Nontechnical edits.
Released to the external web.
1.1
10/2003
Added TDMb to the MPC875 Features list, the MPC875 Block Diagram, added 13.5
Serial Interface AC Electrical Specifications, and removed TDMa from the pin
descriptions.
Changes
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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Document Revision History
Table 37. Document Revision History (continued)
Revision
Number
Date
2.0
12/2003
3.0
1/07/2004
7/19/2004
Changes
Changed DBGC in the Mandatory Reset Configuration to X1.
Changed the maximum operating frequency to 133 MHz.
Put the timing in the 80 MHz column.
Put in the orderable part numbers.
Rounded the timings to hundredths in the 80 MHz column.
Put the pin numbers in footnotes by the maximum currents in Table 6.
Changed 22 and 41 in the Timing.
Put TBD in the Thermal table.
• Added sentence to Spec B1A about EXTCLK and CLKOUT being in Alignment for
Integer Values
• Added a footnote to Spec 41 specifying that EDM = 1
• Added the thermal numbers to Table 4.
• Added RMII1_EN under M1II_EN in Table 36 Pin Assignments
• Added a tablefootnote to Table 6 DC Electrical Specifications about meeting the VIL
Max of the I2C Standard
• Put the new part numbers in the Ordering Information Section
MPC875/MPC870 Hardware Specifications, Rev. 3.0
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83
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MPC875EC
Rev. 3.0
07/2004
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE