SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 D D D D D D D D SN54AHC16540 . . . WD PACKAGE SN74AHC16540 . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family EPIC (Enhanced-Performance Implanted CMOS) Process Operating Range 2-V to 5.5-V VCC Distributed VCC and GND Pins Minimize High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015 Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings 1OE1 1Y1 1Y2 GND 1Y3 1Y4 VCC 1Y5 1Y6 GND 1Y7 1Y8 2Y1 2Y2 GND 2Y3 2Y4 VCC 2Y5 2Y6 GND 2Y7 2Y8 2OE1 description These 16-bit buffers and bus drivers provide a high-performance bus interface for wide data paths. The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE2 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE2 To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54AHC16540 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74AHC16540 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each 8-bit buffer/driver) INPUTS A OUTPUT Y L L H L H L H X X Z X H X Z OE1 OE2 L L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 2000, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 logic symbol† 1OE1 1 & 48 EN1 1OE2 2OE1 2OE2 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2A8 24 & EN2 25 47 1 46 2 1 3 44 5 43 6 41 8 40 9 38 11 37 12 13 36 1 35 2 14 33 16 32 17 30 19 29 20 27 22 26 23 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6 1Y7 1Y8 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 2Y8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE1 1OE2 1A1 1 2OE1 48 47 2OE2 2 1Y1 2A1 24 25 36 To Seven Other Channels 2 POST OFFICE BOX 655303 13 2Y1 To Seven Other Channels • DALLAS, TEXAS 75265 SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 3) SN54AHC16540 VCC VIH Supply voltage High-level input voltage VCC = 2 V VCC = 3 V VCC = 5.5 V VCC = 2 V VIL VI VO IOH Low-level input voltage Output voltage VCC = 2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V VCC = 2 V IOL ∆t/∆v Low-level output current Input transition rise or fall rate MAX 2 5.5 1.5 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V SN74AHC16540 MIN MAX 2 5.5 UNIT V 1.5 2.1 2.1 3.85 3.85 0.5 VCC = 3 V VCC = 5.5 V Input voltage High-level output current MIN V 0.5 0.9 0.9 1.65 1.65 V 0 5.5 0 5.5 V 0 VCC –50 0 VCC –50 mA –4 –4 –8 –8 50 50 4 4 8 8 100 100 20 20 V mA mA mA ns/V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –50 mA VOH IOH = –4 mA IOH = –8 mA IOL = 50 mA VOL IOL = 4 mA IOL = 8 mA II IOZ ICC Ci VI = VCC or GND VO = VCC or GND, VI (OE) = VIL or VIH VI = VCC or GND, VI = VCC or GND MIN TA = 25°C TYP MAX 2V 1.9 2 1.9 1.9 3V 2.9 3 2.9 2.9 4.5 V 4.4 4.5 4.4 4.4 3V 2.58 2.48 2.48 4.5 V 3.94 3.8 VCC IO = 0 SN54AHC16540 MIN MAX SN74AHC16540 MIN MAX UNIT V 3.8 2V 0.1 0.1 0.1 0.1 3V 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 V 4.5 V 0.36 0.5 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V ±0.25 ±2.5 ±2.5 mA 4 40 40 mA 10 pF 5.5 V 5V 2 10 Co VO = VCC or GND 5V 3 * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. pF switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF tsk(o) MIN TA = 25°C TYP MAX MAX MIN MAX 8.4** 1** 10** 1 10 4.8** 8.4** 1** 10** 1 10 6.8** 10.6** 1** 12.5** 1 12.5 6.8** 10.6** 1** 12.5** 1 12.5 6.8** 11.5** 1** 12.5** 1 12.5 6.8** 11.5** 1** 12.5** 1 12.5 7.7 11 1 12.5 1 12.5 7.3 11 1 12.5 1 12.5 9.7 14.1 1 16 1 16 7.1 14.1 1 16 1 16 9.4 14 1 16 1 16 9.7 14 1 16 1 16 CL = 50 pF 1.5*** PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 SN74AHC16540 MIN 4.8** ** On products compliant to MIL-PRF-38535, this parameter is not production tested. *** On products compliant to MIL-PRF-38535, this parameter does not apply. 4 SN54AHC16540 • DALLAS, TEXAS 75265 1.5 UNIT ns ns ns ns ns ns ns SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF tsk(o) MIN TA = 25°C TYP MAX SN54AHC16540 SN74AHC16540 MIN MAX MIN MAX 3.7* 6* 1* 7* 1 7 3.7* 6* 1* 7* 1 7 4.7* 7.3* 1* 8.5* 1 8.5 4.7* 7.3* 1* 8.5* 1 8.5 4.5* 7.2* 1* 8.5* 1 8.5 4.5* 7.2* 1* 8.5* 1 8.5 5.2 8 1 9 1 8.5 5.2 8 1 9 1 8.5 6.2 9.3 1 10.5 1 10.5 6.2 9.3 1 10.5 1 10.5 6 9.2 1 10.5 1 10.5 6 9.2 1 10.5 1 10.5 1** CL = 50 pF 1 UNIT ns ns ns ns ns ns ns * On products compliant to MIL-PRF-38535, this parameter is not production tested. ** On products compliant to MIL-PRF-38535, this parameter does not apply. noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHC16540 PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.6 V Quiet output, minimum dynamic VOL –0.3 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.7 V High-level dynamic input voltage 3.5 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. V 1.5 V TYP UNIT operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, f = 1 MHz 13 pF PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54AHC16540, SN74AHC16540 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS331F – MARCH 1996 – REVISED JANUARY 2000 PARAMETER MEASUREMENT INFORMATION RL = 1 kΩ From Output Under Test Test Point From Output Under Test S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL VCC Output Control Output Waveform 1 S1 at VCC (see Note B) 50% VCC 0V tPZL VOH 50% VCC VOL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AHC16540DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHC16540DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHC16540DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AHC16540DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC16540DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC16540DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC16540DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC16540DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AHC16540DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN74AHC16540DGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHC16540DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74AHC16540DGVR TVSOP DGV 48 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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