SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
D Member of the Texas Instruments
D
D
D
D
D
D
D
D
D
D
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus Family
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 4.1 ns at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Supports Mixed-Mode Signal Operation on
All Ports (5-V Input/Output Voltage With
3.3-V VCC)
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
description/ordering information
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
This 16-bit buffer/driver is designed for 1.65-V to
3.6-V VCC operation.
The SN74LVCH16244A is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and
symmetrical active-low output-enable (OE) inputs.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TOP-SIDE
MARKING
Tube
SN74LVCH16244ADL
Tape and reel
SN74LVCH16244ADLR
TSSOP − DGG
Tape and reel
SN74LVCH16244ADGGR
LVCH16244A
TVSOP − DGV
Tape and reel
SN74LVCH16244ADGVR
LDH244A
SSOP − DL
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
VFBGA − GQL
VFBGA − ZQL (Pb-free)
LVCH16244A
SN74LVCH16244AGQLR
Tape and reel
SN74LVCH16244AZQLR
LDH244A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
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1
SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
description/ordering information (continued)
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator
in a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
GQL OR ZQL PACKAGE
(TOP VIEW)
1
2
3
4
5
terminal assignments
6
1
2
3
5
6
A
A
1OE
NC
NC
NC
NC
2OE
B
B
1Y2
1Y1
GND
GND
1A1
1A2
C
C
1Y4
1Y3
2Y1
VCC
GND
1A4
2Y2
VCC
GND
1A3
D
2A1
2A2
E
2Y4
2Y3
2A3
2A4
D
E
F
G
H
J
K
F
3Y1
3Y2
3A2
3A1
G
3Y3
3Y4
GND
GND
3A4
3A3
H
4Y1
4Y2
4A1
4Y3
4Y4
VCC
GND
4A2
J
VCC
GND
4A4
4A3
K
4OE
NC
NC
NC
NC
3OE
NC − No internal connection
FUNCTION TABLE
(each 4-bit buffer)
INPUTS
2
4
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
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SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
3OE
47
2
46
3
44
5
43
6
1Y1
3A1
1Y2
3A2
1Y3
3A3
1Y4
3A4
48
4OE
41
8
40
9
38
11
37
12
2Y1
4A1
2Y2
4A2
2Y3
4A3
2Y4
4A4
25
36
13
35
14
33
16
32
17
3Y1
3Y2
3Y3
3Y4
24
30
19
29
20
27
22
26
23
4Y1
4Y2
4Y3
4Y4
Pin numbers shown are for the DGG, DGV, and DL packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
GQL/ZQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . 42°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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3
SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
recommended operating conditions (see Note 4)
Operating
VCC
VIH
Supply voltage
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
High-level input voltage
VCC = 2.7 V to 3.6 V
VCC = 1.65 V to 1.95 V
VIL
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
MAX
1.65
3.6
UNIT
V
1.5
0.65 × VCC
1.7
V
2
0.35 × VCC
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
Low-level input voltage
VI
MIN
0.7
V
0.8
0
5.5
V
High or low state
0
3-state
0
VCC
5.5
V
VCC = 1.65 V
VCC = 2.3 V
−4
VCC = 2.7 V
VCC = 3 V
−12
−8
mA
−24
VCC = 1.65 V
VCC = 2.3 V
4
VCC = 2.7 V
VCC = 3 V
12
8
mA
24
10
ns/V
TA
Operating free-air temperature
−40
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −100 µA
IOH = −4 mA
VOH
VCC
MIN
1.65 V to 3.6 V
1.65 V
VCC−0.2
1.2
2.3 V
1.7
2.7 V
2.2
3V
2.4
3V
2.2
IOH = −8 mA
IOH = −12 mA
IOH = −24 mA
IOL = 100 µA
VOL
II
0.2
1.65 V
0.45
2.3 V
0.7
IOL = 12 mA
IOL = 24 mA
2.7 V
0.4
3V
0.55
VI = 0 to 5.5 V
VI = 0.58 V
3.6 V
±5
V
µA
15
1.65 V
−15
45
2.3 V
VI = 1.7 V
VI = 0.8 V
µA
−45
75
3V
Ioff
VI or VO = 5.5 V
IOZ
VO = 0 to 5.5 V
ICC
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V§
IO = 0
One input at VCC − 0.6 V,
Other inputs at VCC or GND
Co
UNIT
V
IOL = 4 mA
IOL = 8 mA
VI = 2 V
VI = 0 to 3.6 V‡
∆ICC
Ci
MAX
1.65 V to 3.6 V
VI = 1.07 V
VI = 0.7 V
II(hold)
TYP†
−75
3.6 V
±500
0
±10
µA
3.6 V
±10
µA
20
3.6 V
20
2.7 V to 3.6 V
VI = VCC or GND
VO = VCC or GND
500
µA
A
µA
3.3 V
5.5
pF
3.3 V
6
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the bus-hold maximum dynamic current required to switch the input from one state to another.
§ This applies in the disabled state only.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
UNIT
A
Y
1.5
6.6
1
3.9
1
4.7
1.1
4.1
ns
ten
OE
Y
1.5
7.5
1
4.7
1
5.8
1
4.6
ns
tdis
OE
Y
1.5
10.3
1
5.3
1
6.2
1.8
5.8
ns
1
ns
tsk(o)
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5
SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
operating characteristics, TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
6
Power dissipation capacitance
per buffer/driver
VCC = 1.8 V
TYP
Outputs enabled
Outputs disabled
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• DALLAS, TEXAS 75265
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
33
32
35
2
2
3
UNIT
pF
SCAS313N − NOVEMBER 1993 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
RL
From Output
Under Test
CL
(see Note A)
VLOAD
Open
S1
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
tPHL
VOH
VM
Output
VM
VOL
tPHL
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VM
VM
VM
0V
tPLZ
tPZL
VLOAD/2
VM
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
tPZH
VOH
Output
VI
Output
Control
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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7
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
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1
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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1
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