CD54/74AC245, CD54/74ACT245 Data sheet acquired from Harris Semiconductor SCHS245B Octal-Bus Transceiver, Three-State, Non-Inverting September 1998 - Revised October 2000 Features Description • Buffered Inputs The ’AC245 and ’ACT245 are octal-bus transceivers that utilize Advanced CMOS Logic technology. They are noninverting three-state bidirectional transceiver-buffers intended for two-way transmission from “A” bus to “B” bus or “B” bus to “A”. The logic level present on the direction input (DIR) determines the data direction. When the output enable input (OE) is HIGH, the outputs are in the high-impedance state. • Typical Propagation Delay - 4ns at VCC = 5V, TA = 25oC, CL = 50pF • Exceeds 2kV ESD Protection per MIL-STD-883, Method 3015 [ /Title (CD74 AC245 , CD74 ACT24 5) /Subject (OctalBus Transceiver, ThreeState, NonInverting) /Autho r () /Keywords (Harris Semiconductor, Advan ced CMOS , Harris Semicon- • SCR-Latchup-Resistant CMOS Process and Circuit Design Ordering Information • Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption PART NUMBER • Balanced Propagation Delays • AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply • ±24mA Output Drive Current - Fanout to 15 FAST™ ICs - Drives 50Ω Transmission Lines TEMP. RANGE (oC) PACKAGE CD54AC245F3A -55 to 125 20 Ld CERDIP CD74AC245E -55 to 125 20 Ld PDIP CD74AC245M -55 to 125 20 Ld SOIC CD74AC245SM -55 to 125 20 Ld SSOP CD54ACT245F3A -55 to 125 20 Ld CERDIP CD74ACT245E -55 to 125 20 Ld PDIP CD74ACT245M -55 to 125 20 Ld SOIC CD74ACT245SM -55 to 125 20 Ld SSOP NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. Pinout CD54AC245, CD54ACT245 (CERDIP) CD74AC245, CD74ACT245 (PDIP, SOIC, SSOP) TOP VIEW DIR 1 A0 2 19 OE A1 3 18 B0 A2 4 17 B1 A3 5 16 B2 A4 6 15 B3 A5 7 14 B4 A6 8 13 B5 A7 9 12 B6 GND 10 11 B7 20 VCC CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FAST™ is a Trademark of Fairchild Semiconductor. Copyright © 2000, Texas Instruments Incorporated 1 CD54/74AC245, CD54/74ACT245 Functional Diagram A0 A1 A2 A3 A4 A5 A6 A7 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 B0 B1 B2 B3 B4 B5 B6 B7 1 DIR 19 OE TRUTH TABLE CONTROL INPUTS OE DIR OPERATION L L B Data to A Bus L H A Data to B Bus H X Isolation H = High Level, L = Low Level, X = Irrelevant To prevent excess currents in the High-Z (isolation) modes, all I/O terminals should be terminated with 10kΩ to 1MΩ resistors. 2 CD54/74AC245, CD54/74ACT245 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA Thermal Resistance (Typical, Note 5) θJA (oC/W) E Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 M Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 SM Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4) AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. For up to 4 outputs per device, add ±25mA for each additional output. 4. Unless otherwise specified, all voltages are referenced to ground. 5. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VIH - - 1.5 1.2 - 1.2 - 1.2 - V 3 2.1 - 2.1 - 2.1 - V 5.5 3.85 - 3.85 - 3.85 - V 1.5 - 0.3 - 0.3 - 0.3 V 3 - 0.9 - 0.9 - 0.9 V 5.5 - 1.65 - 1.65 - 1.65 V 1.5 1.4 - 1.4 - 1.4 - V AC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage VIL VOH - VIH or VIL - -0.05 -0.05 3 2.9 - 2.9 - 2.9 - V -0.05 4.5 4.4 - 4.4 - 4.4 - V -4 3 2.58 - 2.48 - 2.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 3 CD54/74AC245, CD54/74ACT245 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Low Level Output Voltage -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V 0.05 3 - 0.1 - 0.1 - 0.1 V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 12 3 - 0.36 - 0.44 - 0.5 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V Input Leakage Current II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 V High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V ACT TYPES Low Level Output Voltage VOL VIH or VIL II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State or Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 mA Input Leakage Current Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load NOTES: 6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC. 4 CD54/74AC245, CD54/74ACT245 ACT Input Load Table INPUT UNIT LOAD An, Bn 0.83 OE 0.64 DIR 0.25 NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications Table, e.g., 2.4mA max at 25oC. Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) -40oC TO 85oC PARAMETER -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS tPLH, tPHL 1.5 - - 96 - - 106 ns 3.3 (Note 9) 3.2 - 10.8 3 - 11.9 ns 5 (Note 10) 2.2 - 7.7 2.1 - 8.5 ns 1.5 - - 159 - - 175 ns 3.3 4.7 - 15.9 4.4 - 17.5 ns 5 3.7 - 12.7 3.5 - 14 ns 1.5 - - 159 - - 175 ns 3.3 5.6 - 19 5.3 - 21 ns 5 3.7 - 12.7 3.5 - 14 ns AC TYPES Propagation Delay, Data to Output Propagation Delay, Output Disable to Output Propagation Delay, Output Enable to Output tPLZ, tPHZ tPZL, tPZH Minimum (Valley) VOH During Switching of Other Outputs (Output Under Test Not Switching) VOHV See Figure 1 5 - 4 at 25oC - - 4 at 25oC - V Maximum (Peak) VOL During Switching of Other Outputs (Output Under Test Not Switching) VOLP See Figure 1 5 - 1 at 25oC - - 1 at 25oC - V Three-State Output Capacitance CO - - 15 - - 15 - pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 57 - - 57 - pF Propagation Delay, Data to Output tPLH, tPHL 5 (Note 10) 2.7 - 9.1 2.5 - 10 ns Propagation Delay, Output Disable to Output tPLZ, tPHZ 5 3.7 12.7 3.5 14 ns Propagation Delay, Output Enable to Output tPZL, tPZH 5 3.8 13.1 3.6 14.4 ns Minimum (Valley) VOH During Switching of Other Outputs (Output Under Test Not Switching) VOHV See Figure 1 5 - 4 at 25oC - - 4 at 25oC - V Maximum (Peak) VOL During Switching of Other Outputs (Output Under Test Not Switching) VOLP See Figure 1 5 - 1 at 25oC - - 1 at 25oC - V Power Dissipation Capacitance ACT TYPES 5 CD54/74AC245, CD54/74ACT245 Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) (Continued) -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS Three-State Output Capacitance CO - - 15 - - 15 - pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 57 - - 57 - pF PARAMETER Power Dissipation Capacitance NOTES: 8. Limits tested 100% 9. 3.3V Min is at 3.6V, Max is at 3V. 10. 5V Min is at 5.5V, Max is at 4.5V. 11. CPD is used to determine the dynamic power consumption per channel. AC: PD = VCC2 fi (CPD + CL) ACT: PD = VCC2 fi (CPD + CL) + VCC ∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage. VOH OTHER OUTPUTS VOL VOH VOHV OUTPUT UNDER TEST VOLP VOL NOTES: 12. Input pulses have the following characteristics: PRR ≤ 1MHz, tr = 3ns, SKEW 1ns. 13. R.F. fixture with 700MHz design rules required. IC should be soldered into test board and bypassed with 0.1µF capacitor. Scope and probes require 700MHz bandwidth. FIGURE 1. SIMULTANEOUS SWITCHING TRANSIENT WAVEFORMS 6 CD54/74AC245, CD54/74ACT245 tf = 3ns tr = 3ns INPUT LEVEL 90% OUTPUTS DISABLED VS 10% tPLZ GND tPZL OUTPUT: LOW TO OFF TO LOW VS 0.2 VCC tPHZ VOL (≠ VCC) tPZH 0.8 VCC VS OUTPUT: HIGH TO OFF TO HIGH OUTPUTS ENABLED OUTPUTS DISABLED OUTPUTS ENABLED GND (tPHZ, tPZH) OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE OPEN (tPHL, tPLH) 2 VCC (tPLZ, tPZL) RL 500Ω (OPEN DRAIN) OUT RL CL 500Ω 50pF (NOTE 14) DUT WITH THREESTATE OUTPUT NOTE: 14. For AC Series only: When VCC = 1.5V, RL = 1kΩ. FIGURE 2. THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUIT tr = 3ns tf = 3ns INPUT LEVEL 90% VS 10% An GND tPHL tPLH VS Bn FIGURE 3. PROPAGATION DELAY TIMES OUTPUT RL (NOTE) 500Ω DUT OUTPUT LOAD CL 50pF NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ. AC ACT VCC 3V Input Switching Voltage, VS 0.5 VCC 1.5V Output Switching Voltage, VS 0.5 VCC 0.5 VCC Input Level FIGURE 4. PROPAGATION DELAY TIMES 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54AC245F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54ACT245F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD74AC245E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC245EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC245M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245SM OBSOLETE SSOP DB 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245SM96 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245SM96E4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC245SM96G4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT245EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT245M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245SM OBSOLETE SSOP DB 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245SM96 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245SM96E4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT245SM96G4 ACTIVE SSOP DB 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Oct-2007 Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC245M96 DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CD74AC245SM96 DB 20 SITE 41 330 16 8.2 7.5 2.5 12 16 Q1 CD74ACT245M96 DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CD74ACT245SM96 DB 20 SITE 41 330 16 8.2 7.5 2.5 12 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) CD74AC245M96 DW 20 SITE 41 346.0 346.0 41.0 CD74AC245SM96 DB 20 SITE 41 346.0 346.0 33.0 CD74ACT245M96 DW 20 SITE 41 346.0 346.0 41.0 CD74ACT245SM96 DB 20 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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