ASM2P2304NZ June 2005 rev 0.4 Four Output PCI-X and General Purpose Buffer Features Functional Description One input to four Output Buffer/Driver General-purpose or PCI-X clock buffer The ASM2P2304NZ is a low-cost buffer designed to Buffers all frequencies from DC to 140 MHz distribute Output-to-output skew less than 100 pS applications. The device operates at 3.3V and outputs can Space-saving 8-pin TSSOP Package run up to 140 MHz. 3.3V operation high-speed clocks for PCI-X and other Table 1. Function Table. Inputs Outputs BUF_IN OE Output [1:4] L H L H L L H H L L L H Block Diagram OE Logic Control BUF_ IN OUTPUT 1 OUTPUT 2 OUTPUT 3 OUTPUT 4 Alliance Semiconductor 2575, Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. ASM2P2304NZ June 2005 rev 0.4 Pin Configuration 8 TSSOP Top V iew BUF_IN 1 OE 2 ASM2P2304NZ 8 OUTPUT 4 7 OUTPUT 3 OUTPUT 1 3 6 VDD GND 4 5 OUTPUT 2 Pin Description Pin # Pin Name Type 1 BUF_IN I Input clock. 5V Tolerant Input 2 OE I Input pin for Output Enable, active HIGH. 3 Output 1 O Output 1 4 GND P Ground 5 Output 2 O Output 2 6 VDD P 3.3V Voltage Supply 7 Output 3 O Output 3 8 Output 4 O Output 4 Description Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 2 of 8 ASM2P2304NZ June 2005 rev 0.4 Absolute Maximum Ratings Parameter Min Max Unit Supply Voltage to Ground Potential -0.5 7 V DC Input Voltage (Except REF) -0.5 VDD + 0.5 V DC Input Voltage (REF) -0.5 7 V Storage Temperature -65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22- A114-B) 2000 V Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device reliability. Operating Conditions Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) -40 85 °C CL Load Capacitance - 25 pF CIN Input Capacitance - 7 pF BUF_IN, OUTPUT [1:4] Operating Frequency DC 140 MHz tPU Power-up time for all VDD's to reach minimum specified Voltage (Power ramps must be monotonic) 0.05 50 mS Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 3 of 8 ASM2P2304NZ June 2005 rev 0.4 Electrical Characteristics Parameter Description VIL Input LOW Voltage VIH Input HIGH Voltage IIL Input LOW Current IIH Input HIGH Current VOL Output LOW Voltage VOH IDD Test Conditions Min Max Unit 1 - 0.8 V 1 2.0 - V VIN = 0V –5 5 KA VIN= VDD –5 5 KA IOL= 24 mA - 0.8 V IOL= 12 mA - 0.55 V IOH= –24 mA 2.0 - V IOH= –12 mA 2.4 - V Unloaded outputs at 66.66 MHz - 25 mA 2 Output HIGH Voltage Supply Current 2 3 Switching Characteristics for Commercial and Industrial Temperature Devices Parameter Name Description 2 Measured at 1.5V Min Typ Max Unit 40.0 50.0 60.0 % tD Duty Cycle = t2 ÷t1 t3 Rise Time Measured between 0.8V and 2.0V - - 1.50 nS t4 Fall Time 2 Measured between 0.8V and 2.0V - - 1.50 nS t5 Output to Output Skew All outputs equally loaded - - 200 pS t6 Propagation Delay, BUF_IN Rising Edge to 2 OUTPUT Rising Edge Measured at VDD/2 2.5 3.5 5 nS 2 2 Note: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 4 of 8 ASM2P2304NZ June 2005 rev 0.4 Switching Waveforms Duty Cycle Timing All Outputs Rise/Fall Time Output-Output Skew Input-Output Propagation Delay Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 5 of 8 ASM2P2304NZ June 2005 rev 0.4 Package Information 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 O 0° 8° 0° 8° Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 6 of 8 ASM2P2304NZ June 2005 rev 0.4 Ordering Codes Part Number Marking Package Type Temperature ASM2P2304NZF-08-TT 2P2304NZF 8-pin TSSOP, Pb Free Commercial ASM2P2304NZF-08-TR 2P2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Commercial ASM2I2304NZF-08-TT 2I2304NZF 8-pin TSSOP, Pb Free Industrial ASM2I2304NZF-08-TR 2I2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Industrial ASM2P2304NZG-08-TT 2P2304NZG 8-pin TSSOP, Green Commercial ASM2P2304NZG-08-TR 2P2304NZG 8-pin TSSOP - Tape and Reel, Green Commercial ASM2I2304NZG-08-TT 2I2304NZG 8-pin TSSOP, Green Industrial ASM2I2304NZG-08-TR 2I2304NZG 8-pin TSSOP - Tape and Reel, Green Industrial Device Ordering Information A S M 2 P 2 3 0 4 N Z F - 0 8 - T R R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 7 of 8 ASM2P2304NZ June 2005 rev 0.4 Alliance Semiconductor Corporation 2575, Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Part Number: ASM2P2304NZ Document Version: 0.4 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. 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Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 8 of 8