PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 REMOTE 8-BIT I/O EXPANDER FOR I2C BUS FEATURES 1 • • • • • Low Standby-Current Consumption of 10 µA Max I2C to Parallel-Port Expander Open-Drain Interrupt Output Compatible With Most Microcontrollers Latched Outputs With High-Current Drive Capability for Directly Driving LEDs Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • 13 5 12 6 11 7 10 8 9 12 P6 11 P5 10 P4 A2 4 9 GND P7 1 20 DGV OR PW PACKAGE (TOP VIEW) 19 P6 18 NC 2 3 4 17 P5 16 P4 5 8 15 GND 14 P3 13 NC 9 12 P2 6 7 10 11 P1 4 VCC 1 A0 2 A1 3 SCL NC SDA VCC A0 A1 NC A2 P0 14 13 P7 3 15 SCL 15 P1 6 2 P2 7 P3 8 16 16 SDA 1 P0 5 A0 A1 A2 P0 P1 P2 P3 GND VCC SDA SCL INT P7 P6 P5 P4 14 INT RGT PACKAGE (TOP VIEW) DW OR N PACKAGE (TOP VIEW) INT RGY PACKAGE (TOP VIEW) INT SCL NC SDA VCC A0 A1 NC A2 P0 1 20 2 19 3 18 4 5 17 16 6 15 7 14 8 13 9 12 10 11 P7 P6 NC P5 P4 GND P3 NC P2 P1 NC – No internal connection NC – No internal connection DESCRIPTION/ORDERING INFORMATION This 8-bit input/output (I/O) expander for the two-line bidirectional bus (I2C) is designed for 2.5-V to 6-V VCC operation. The PCF8574 provides general-purpose remote I/O expansion for most microcontroller families via the I2C interface [serial clock (SCL), serial data (SDA)]. The device features an 8-bit quasi-bidirectional I/O port (P0–P7), including latched outputs with high-current drive capability for directly driving LEDs. Each quasi-bidirectional I/O can be used as an input or output without the use of a data-direction control signal. At power on, the I/Os are high. In this mode, only a current source to VCC is active. An additional strong pullup to VCC allows fast rising edges into heavily loaded outputs. This device turns on when an output is written high and is switched off by the negative edge of SCL. The I/Os should be high before being used as inputs. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2008, Texas Instruments Incorporated PCF8574 SCPS068G – JULY 2001 – REVISED MAY 2008 ............................................................................................................................................................... www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) The PCF8574 provides an open-drain output (INT) that can be connected to the interrupt input of a microcontroller. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time, tiv, INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed to the original setting or data is read from, or written to, the port that generated the interrupt. Resetting occurs in the read mode at the acknowledge bit after the rising edge of the SCL signal, or in the write mode at the acknowledge bit after the high-to-low transition of the SCL signal. Interrupts that occur during the acknowledge clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting is detected and, after the next rising clock edge, is transmitted as INT. Reading from, or writing to, another device does not affect the interrupt circuit. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C bus. Therefore, the PCF8574 can remain a simple slave device. ORDERING INFORMATION PACKAGE (1) (2) TA PDIP – N Tube of 25 QFN – RGT Reel of 3000 QFN – RGY Reel of 1000 Tube of 40 –40°C to 85°C SOIC – DW Reel of 2000 Tube of 70 TSSOP – PW Reel of 2000 TVSOP – DGV (1) (2) 2 Reel of 2000 ORDERABLE PART NUMBER PCF8574N TOP-SIDE MARKING PCF8574N PCF8574NE4 PCF8574RGTR PCF8574RGYR PCF8574RGYRG4 ZWJ PF574 PCF8574DW PCF8574DWE4 PCF8574DWR PCF8574 PCF8574DWRE4 PCF8574PW PCF8574PWE4 PCF8574PWR PF574 PCF8574PWRE4 PCF8574DGVR PCF8574DGVRE4 PF574 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 LOGIC DIAGRAM (POSITIVE LOGIC) PCF8574 INT A0 A1 A2 SCL SDA 13 Interrupt Logic LP Filter 1 4 2 P0 5 P1 3 6 14 15 I2C Bus Control Input Filter P2 7 Shift Register 8 Bit I/O Port P3 9 P4 10 P5 11 P6 12 P7 Write Pulse VCC GND Read Pulse 16 8 Power-On Reset Pin numbers shown are for the DW and N packages. SIMPLIFIED SCHEMATIC DIAGRAM OF EACH P-PORT INPUT/OUTPUT VCC Write Pulse 100 µA Data From Shift Register D Q FF P0−P7 CI S Power-On Reset D Q GND FF Read Pulse CI S To Interrupt Logic Data to Shift Register Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 3 PCF8574 SCPS068G – JULY 2001 – REVISED MAY 2008 ............................................................................................................................................................... www.ti.com I2C Interface I2C communication with this device is initiated by a master sending a start condition, a high-to-low transition on the SDA I/O while the SCL input is high. After the start condition, the device address byte is sent, most-significant bit (MSB) first, including the data direction bit (R/W). This device does not respond to the general call address. After receiving the valid address byte, this device responds with an acknowledge, a low on the SDA I/O during the high of the acknowledge-related clock pulse. The address inputs (A0–A2) of the slave device must not be changed between the start and the stop conditions. The data byte follows the address acknowledge. If the R/W bit is high, the data from this device are the values read from the P port. If the R/W bit is low, the data are from the master, to be output to the P port. The data byte is followed by an acknowledge sent from this device. If other data bytes are sent from the master, following the acknowledge, they are ignored by this device. Data are output only if complete bytes are received and acknowledged. The output data will be valid at time, tpv, after the low-to-high transition of SCL and during the clock cycle for the acknowledge. A stop condition, which is a low-to-high transition on the SDA I/O while the SCL input is high, is sent by the master. Interface Definition BYTE BIT 7 (MSB) 2 I C slave address I/O data bus 4 6 5 4 3 2 1 0 (LSB) L H L L A2 A1 A0 R/W P7 P6 P5 P4 P3 P2 P1 P0 Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 Figure 1 and Figure 2 show the address and timing diagrams for the write and read modes, respectively. Integral Multiples of Two Bytes SCL 1 2 3 4 6 5 7 8 1 2 3 4 5 6 7 ACK From Slave Start Condition R/W S 0 1 0 0 1 2 3 4 0 A P7 6 7 8 ACK From Slave Data A2 A1 A0 5 ACK From Slave Slave Address SDA 8 P6 Data 1 P0 A P7 P0 A P5 Write to Port Data A0 and B0 Valid Data Output Voltage tpv P5 Output Voltage IOH P5 Pullup Output Current IOHT INT tir Figure 1. Write Mode (Output) SCL 1 2 3 4 5 6 7 8 R/W SDA S 0 1 0 0 A2 A1 A0 1 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 ACK From Master ACK From Slave A 1 P7 P6 P5 P4 P3 P2 P1 P0 A P7 ACK From Master P6 P5 P4 P3 P2 P1 P0 A P7 P6 Read From Port Data Into Port P7 to P0 P7 to P0 th tsu INT tiv tir tir A low-to-high transition of SDA while SCL is high is defined as the stop condition (P). The transfer of data can be stopped at any moment by a stop condition. When this occurs, data present at the latest ACK phase is valid (output mode). Input data is lost. Figure 2. Read Mode (Input) Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 5 PCF8574 SCPS068G – JULY 2001 – REVISED MAY 2008 ............................................................................................................................................................... www.ti.com Address Reference INPUTS I2C BUS SLAVE ADDRESS A2 A1 A0 L L L 32 (decimal), 20 (hexadecimal) L L H 33 (decimal), 21 (hexadecimal) L H L 34 (decimal), 22 (hexadecimal) L H H 35 (decimal), 23 (hexadecimal) H L L 36 (decimal), 24 (hexadecimal) H L H 37 (decimal), 25 (hexadecimal) H H L 38 (decimal), 26 (hexadecimal) H H H 39 (decimal), 27 (hexadecimal) Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 VCC + 0.5 V VO Output voltage range (2) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 –20 mA IOK Input/output clamp current VO < 0 or VO > VCC IOL Continuous output low current VO = 0 to VCC IOH Continuous output high current VO = 0 to VCC Continuous current through VCC or GND θJA Package thermal impedance (1) (2) (3) (4) µA 50 mA –4 mA ±100 mA DGV package (3) 92 DW package (3) 57 N package (3) 67 PW package (3) 83 RGT package (4) 53 RGY package (4) Tstg ±400 Storage temperature range °C/W 37 –65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions MIN MAX 2.5 6 V High-level input voltage 0.7 × VCC VCC + 0.5 V Low-level input voltage –0.5 0.3 × VCC VCC Supply voltage VIH VIL IOH High-level output current IOL Low-level output current TA Operating free-air temperature 6 –40 Submit Documentation Feedback UNIT V –1 mA 25 mA 85 °C Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Input diode clamp voltage II = –18 mA VPOR Power-on reset voltage (2) VI = VCC or GND, IOH P port VO = GND IOHT P-port transient pullup current High during acknowledge, VOH = GND SDA VO = 0.4 V P port VO = 1 V INT VO = 0.4 V IOL VCC 2.5 V to 6 V IO = 0 MIN TYP (1) 6V 2.5 V to 6 V 30 2.5 V 2.5 V to 6 V INT ICC Ci 300 Cio VI = VCC or GND (1) (2) µA mA 25 mA 3 5V 10 2.5 V to 6 V 1.6 2.5 V to 6 V ±5 µA ±5 VI ≥ VCC or VI ≤GND Operating mode VI = VCC or GND, IO = 0, Standby mode VI = VCC or GND, IO = 0 SCL VI = VCC or GND P port V ±5 P port SDA 2.4 –1 A0, A1, A2 IIHL UNIT V 1.3 SCL, SDA II MAX –1.2 2.5 V to 6 V fSCL = 100 kHz 6V 2.5 V to 6 V VIO = VCC or GND 2.5 V to 6 V ±400 40 100 2.5 10 1.5 7 3 7 4 10 µA µA pF pF All typical values are at VCC = 5 V, TA = 25°C. The power-on reset circuit resets the I2C-bus logic with VCC < VPOR and sets all I/Os to logic high (with current source to VCC). I2C Interface Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) MIN fscl I2C clock frequency 2 tsch I C clock high time tscl I2C clock low time tsp I2C spike time I C serial data setup time tsdh I2C serial data hold time ticr I2C input rise time ticf I2C input fall time UNIT 100 kHz µs 4 µs 4.7 100 2 tsds MAX 250 ns 0 2 ns ns 1 µs 0.3 µs tocf I C output fall time (10-pF to 400-pF bus) tbuf I2C bus free time between stop and start 4.7 300 µs tsts I2C start or repeated start condition setup 4.7 µs µs 2 tsth I C start or repeated start condition hold 4 tsps I2C stop condition setup 4 tvd Valid data time Cb SCL low to SDA output valid 2 I C bus capacitive load µs 3.4 µs 400 pF Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 ns 7 PCF8574 SCPS068G – JULY 2001 – REVISED MAY 2008 ............................................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) SCL P port MIN MAX µs tpv Output data valid tsu Input data setup time P port SCL 0 th Input data hold time P port SCL 4 tiv Interrupt valid time P port INT 4 µs tir Interrupt reset delay time SCL INT 4 µs 8 Submit Documentation Feedback 4 UNIT µs µs Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION VCC RL = 1 kΩ DUT Pn CL = 10 pF to 400 pF LOAD CIRCUIT 2 Bytes for Complete Device Programming Stop Condition (P) Start Condition (S) Bit 7 MSB Bit 0 LSB (R/W) Bit 6 tscl Stop Condition (P) Acknowledge (A) tsch 0.7 × VCC SCL 0.3 × VCC ticr tPHL ticf tbuf tsts tPLH tsp 0.7 × VCC SDA 0.3 × VCC ticf ticr tsth tsdh tsds Start or Repeat Start Condition tsps Repeat Start Condition Stop Condition VOLTAGE WAVEFORMS 2 Figure 3. I C Interface Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 9 PCF8574 SCPS068G – JULY 2001 – REVISED MAY 2008 ............................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Acknowledge From Slave Start Condition Acknowledge From Slave R/W Slave Address S Data From Port 0 1 0 0 A2 A1 A0 1 A 1 2 3 4 A 5 6 7 8 Data From Port Data 1 A Data 3 1 P A tir tir B B INT A tiv tsps A Data Into Port Data 1 Data 2 0.7 × VCC INT 0.3 × VCC Data 3 0.7 × VCC SCL R/W A tiv 0.3 × VCC tir 0.7 × VCC Pn 0.7 × VCC INT 0.3 × VCC 0.3 × VCC View A−A View B−B Figure 4. Interrupt Voltage Waveforms SCL 0.7 × VCC W A D 0.3 × VCC Slave Acknowledge SDA Pn ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ Unstable Data tpv Last Stable Bit Figure 5. I2C Write Voltage Waveforms 10 Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 PCF8574 www.ti.com ............................................................................................................................................................... SCPS068G – JULY 2001 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC VCC RL = 1 kΩ DUT RL = 4.7 kΩ SDA DUT INT CL = 10 pF to 400 pF CL = 10 pF to 400 pF GND GND SDA LOAD CONFIGURATION INTERRUPT LOAD CONFIGURATION Figure 6. Load Circuits Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): PCF8574 11 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PCF8574DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DWE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type PCF8574NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type PCF8574PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574RGTR ACTIVE QFN RGT 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574RGTRG4 ACTIVE QFN RGT 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PCF8574RGYR ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PCF8574RGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) Lead/Ball Finish MSL Peak Temp (3) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device PCF8574DGVR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 PCF8574DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PCF8574PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 PCF8574RGTR QFN RGT 16 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2 PCF8574RGYR VQFN RGY 20 3000 180.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PCF8574DGVR TVSOP DGV 20 2000 346.0 346.0 29.0 PCF8574DWR SOIC DW 16 2000 346.0 346.0 33.0 PCF8574PWR TSSOP PW 20 2000 346.0 346.0 33.0 PCF8574RGTR QFN RGT 16 3000 370.0 355.0 55.0 PCF8574RGYR VQFN RGY 20 3000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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