MICROCHIP PIC18LF25K22

PIC18(L)F2XK22/4XK22
Flash Memory Programming Specification
1.0
DEVICE OVERVIEW
2.1
This
document
includes
the
programming
specifications for the following devices:
• PIC18F23K22
• PIC18LF23K22
• PIC18F24K22
• PIC18LF24K22
• PIC18F25K22
• PIC18LF25K22
• PIC18F26K22
• PIC18LF26K22
• PIC18F43K22
• PIC18LF43K22
• PIC18F44K22
• PIC18LF44K22
• PIC18F45K22
• PIC18LF45K22
• PIC18F46K22
• PIC18LF46K22
2.0
PROGRAMMING OVERVIEW
The PIC18(L)F2XK22/4XK22 devices can be
programmed using either the high-voltage In-Circuit
Serial Programming™ (ICSP™) method or the lowvoltage ICSP method. Both methods can be done with
the device in the users’ system. The low-voltage ICSP
method is slightly different than the high-voltage
method and these differences are noted where
applicable. This programming specification applies to
the PIC18(L)F2XK22/4XK22 devices in all package
types.
 2010 Microchip Technology Inc.
Hardware Requirements
In High-Voltage ICSP mode, the PIC18(L)F2XK22/
4XK22 devices require two programmable power
supplies: one for VDD and one for MCLR/VPP/RE3.
Both supplies should have a minimum resolution of
0.25V. Refer to Section 6.0 “AC/DC Characteristics
Timing Requirements for Program/Verify Test
Mode” for additional information.
2.1.1
LOW-VOLTAGE ICSP
PROGRAMMING
In Low-Voltage ICSP mode, the PIC18(L)F2XK22/
4XK22 devices can be programmed using a single VDD
source in the operating range. The MCLR/VPP/RE3
does not have to be brought to a different voltage, but
can instead be left at the normal operating voltage.
Refer to Section 2.6 “Entering and Exiting LowVoltage ICSP Program/Verify Mode” for additional
hardware parameters.
Note 1: The High-Voltage ICSP mode is always
available, regardless of the state of the
LVP bit, by applying VIHH to the MCLR/
VPP/RE3 pin.
2: While in Low-Voltage ICSP mode, MCLR
is always enabled, regardless of the
MCLRE bit, and the RE3 pin can no
longer be used as a general purpose
input.
Advance Information
DS41398B-page 1
PIC18(L)F2XK22/4XK22
2.2
Pin Diagrams
The pin diagrams for the PIC18(L)F2XK22/4XK22
family are shown in Figures 2-1 through 2-5.
TABLE 2-1:
PIN DESCRIPTIONS (DURING PROGRAMMING): PIC18(L)F2XK22/4XK22
Pin Name
During Programming
Pin Name
Pin Type
Pin Description
MCLR/VPP/RE3
VPP
P
Programming Enable
VDD(1)
VSS(1)
VDD
P
Power Supply
VSS
P
Ground
RB6
PGC
I
Serial Clock
RB7
PGD
I/O
Serial Data
Legend: I = Input, O = Output, P = Power
Note 1: All power supply (VDD) and ground (VSS) pins must be connected.
FIGURE 2-1:
28-PIN SDIP, SSOP AND SOIC PIN DIAGRAMS
SDIP, SSOP, SOIC (300 MIL)
Note:
28
27
26
1
2
3
4
5
6
7
8
9
10
11
PIC18F2XK22
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
RA4
RA5
VSS
OSC1
OSC2
RC0
RC1
RC2
RC3
25
24
23
22
21
20
19
18
12
17
13
14
16
15
RB7/PGD
RB6/PGC
RB5
RB4
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC6
RC5
RC4
The following devices are included in 28-pin SDIP, SSOP and SOIC parts: PIC18F23K22, PIC18LF23K22,
PIC18F24K22, PIC18LF24K22, PIC18F25K22, PIC18LF25K22, PIC18F26K22, PIC18LF26K22.
DS41398B-page 2
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
28-PIN QFN AND UQFN PIN DIAGRAMS
RA1
RA0
28-Pin QFN, UQFN
MCLR/VPP/RE3
RB7/PGD
RB6/PGC
RB5
RB4
FIGURE 2-2:
28 27 26 25 24 23 22
1
2
3
4
5
6
7
PIC18F2XK22
8 9 10 11 12 13 14
21
20
19
18
17
16
15
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RA2
RA3
RA4
RA5
VSS
OSC1
OSC2
Note 1:
The following devices are included in 28-pin QFN parts: PIC18F23K22, PIC18LF23K22, PIC18F24K22,
PIC18LF24K22, PIC18F25K22, PIC18LF25K22, PIC18F26K22, PIC18LF26K22.
2:
The following devices are included in 28-pin UQFN parts: PIC18F23K22, PIC18LF23K22, PIC18F24K22,
PIC18LF24K22.
FIGURE 2-3:
40-PIN PDIP PIN DIAGRAMS
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
RA4
RA5
RE0
RE1
RE2
VDD
VSS
OSC1
OSC2
RC0
RC1
RC2
RC3
RD0
RD1
Note:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PIC18F4XK22
40-PIN PDIP (600 MIL)
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
RB7/PGD
RB6/PGC
RB5
RB4
RB3
RB2
RB1
RB0
VDD
VSS
RD7
RD6
RD5
RD4
RC7
RC6
RC5
RC4
RD3
RD2
The following devices are included in 40-pin PDIP parts: PIC18F43K22, PIC18LF43K22, PIC18F44K22,
PIC18LF44K22, PIC18F45K22, PIC18LF45K22, PIC18F46K22, PIC18LF46K22.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 3
PIC18(L)F2XK22/4XK22
FIGURE 2-4:
44-PIN TQFP PIN DIAGRAMS
44
43
42
41
40
39
38
37
36
35
34
RC6
RC5
RC4
RD3
RD2
RD1
RD0
RC3
RC2
RC1
NC
44-PIN TQFP
1
2
3
4
5 PIC18F4XK22
6
7
8
9
10
11
NC
RC0
OSC2
OSC1
VSS
VDD
RE2
RE1
RE0
RA5
RA4
33
32
31
30
29
28
27
26
25
24
23
NC
NC
RB4
RB5
RB6/PGC
RB7/PGD
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
12
13
14
15
16
17
18
19
20
21
22
RC7
RD4
RD5
RD6
RD7
VSS
VDD
RB0
RB1
RB2
RB3
Note:
The following devices are included in 44-pin TQFP parts: PIC18F43K22, PIC18LF43K22,
PIC18F44K22, PIC18LF44K22, PIC18F45K22, PIC18LF45K22, PIC18F46K22, PIC18LF46K22.
FIGURE 2-5:
44-PIN QFN PIN DIAGRAMS
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5 PIC18F4XK22
6
7
8
9
10
11
OSC2
OSC1
VSS
VSS
VDD
VDD
RE2
RE1
RE0
RA5
RA4
RB3
NC
RB4
RB5
RB6/PGC
RB7/PGD
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
RC7
RD4
RD5
RD6
RD7
VSS
VDD
VDD
RB0
RB1
RB2
44
43
42
41
40
39
38
37
36
35
34
RC6
RC5
RC4
RD3
RD2
RD1
RD0
RC3
RC2
RC1
RC0
44-PIN QFN
Note:
The following devices are included in 44-pin QFN parts: PIC18F43K22, PIC18LF43K22, PIC18F44K22,
PIC18LF44K22, PIC18F45K22, PIC18LF45K22, PIC18F46K22, PIC18LF46K22.
DS41398B-page 4
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
2.3
Memory Maps
TABLE 2-2:
For PIC18(L)FX3K22 devices, the code memory space
extends from 000000h to 001FFFh (8 Kbytes) in two 4Kbyte blocks. Addresses 000000h through 0001FFh,
however, define a “Boot Block” region that is treated
separately from Block 0. All of these blocks define code
protection boundaries within the code memory space.
IMPLEMENTATION OF CODE
MEMORY
Device
Code Memory Size (Bytes)
PIC18F23K22
PIC18LF23K22
PIC18F43K22
000000h-001FFFh (8K)
PIC18LF43K22
FIGURE 2-6:
MEMORY MAP AND THE CODE MEMORY SPACE FOR PIC18(L)FX3K22
DEVICES
000000h
01FFFFh
Code Memory
MEMORY SIZE/DEVICE
8 Kbytes
(PIC18(L)FX3K22)
Boot Block
Unimplemented
Read as ‘0’
Address
Range
000000h
0001FFh
000200h
Block 0
000FFFh
001000h
Block 1
001FFFh
200000h
Unimplemented
Read ‘0’s
Configuration
and ID
Space
01FFFFh
3FFFFFh
Note:
Sizes of memory areas not to scale.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 5
PIC18(L)F2XK22/4XK22
For PIC18(L)FX4K22 devices, the code memory space
extends from 000000h to 003FFFh (16 Kbytes) in two
4-Kbyte blocks. Addresses 000000h through 0007FFh,
however, define a “Boot Block” region that is treated
separately from Block 0. All of these blocks define code
protection boundaries within the code memory space.
TABLE 2-3:
IMPLEMENTATION OF CODE
MEMORY
Device
Code Memory Size (Bytes)
PIC18F24K22
PIC18LF24K22
000000h-003FFFh (16K)
PIC18F44K22
PIC18LF44K22
FIGURE 2-7:
MEMORY MAP AND THE CODE MEMORY SPACE FOR PIC18(L)FX4K22
DEVICES
000000h
01FFFFh
Code Memory
MEMORY SIZE/DEVICE
16 Kbytes
(PIC18(L)FX4K22)
Boot Block
Unimplemented
Read as ‘0’
Address
Range
000000h
0007FFh
000800h
Block 0
001FFFh
002000h
Block 1
003FFFh
200000h
Unimplemented
Read ‘0’s
Configuration
and ID
Space
01FFFFh
3FFFFFh
Note:
DS41398B-page 6
Sizes of memory areas not to scale.
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
For PIC18(L)FX5K22 devices, the code memory space
extends from 000000h to 007FFFh (32 Kbytes) in four
8-Kbyte blocks. Addresses 000000h through 0007FFh,
however, define a “Boot Block” region that is treated
separately from Block 0. All of these blocks define code
protection boundaries within the code memory space.
TABLE 2-4:
IMPLEMENTATION OF CODE
MEMORY
Device
Code Memory Size (Bytes)
PIC18F25K22
PIC18LF25K22
PIC18F45K22
000000h-007FFFh (32K)
PIC18LF45K22
FIGURE 2-8:
MEMORY MAP AND THE CODE MEMORY SPACE FOR PIC18(L)FX5K22
DEVICES
000000h
01FFFFh
Code Memory
MEMORY SIZE/DEVICE
32 Kbytes
(PIC18(L)FX5K22)
Boot Block
Unimplemented
Read as ‘0’
Address
Range
000000h
0007FFh
000800h
Block 0
001FFFh
002000h
Block 1
003FFFh
004000h
Block 2
200000h
005FFFh
006000h
Block 3
007FFFh
Configuration
and ID
Space
Unimplemented
Read ‘0’s
01FFFFh
3FFFFFh
Note:
Sizes of memory areas not to scale.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 7
PIC18(L)F2XK22/4XK22
For PIC18(L)FX6K22 devices, the code memory space
extends from 000000h to 00FFFFh (64 Kbytes) in four
16-Kbyte blocks. Addresses 000000h through
0007FFh, however, define a “Boot Block” region that is
treated separately from Block 0. All of these blocks
define code protection boundaries within the code
memory space.
TABLE 2-5:
IMPLEMENTATION OF CODE
MEMORY
Device
Code Memory Size (Bytes)
PIC18F26K22
PIC18LF26K22
000000h-00FFFFh (64K)
PIC18F46K22
PIC18LF46K22
FIGURE 2-9:
MEMORY MAP AND THE CODE MEMORY SPACE FOR PIC18(L)FX6K22
DEVICES
000000h
01FFFFh
Code Memory
MEMORY SIZE/DEVICE
64 Kbytes
(PIC18(L)FX6K22)
Boot Block
Unimplemented
Read as ‘0’
Address
Range
000000h
0007FFh
000800h
Block 0
003FFFh
004000h
Block 1
007FFFh
008000h
Block 2
200000h
00BFFFh
00C000h
Block 3
0FFFFh
Configuration
and ID
Space
Unimplemented
Read ‘0’s
01FFFFh
3FFFFFh
Note:
DS41398B-page 8
Sizes of memory areas not to scale.
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
In addition to the code memory space, there are three
blocks in the configuration and ID space that are
accessible to the user through table reads and table
writes. Their locations in the memory map are shown in
Figure 2-10.
Users may store identification information (ID) in eight
ID registers. These ID registers are mapped in
addresses 200000h through 200007h. The ID locations
read out normally, even after code protection is applied.
Locations 300000h through 30000Dh are reserved for
the Configuration bits. These bits select various device
options and are described in Section 5.0 “Configuration Word”. These Configuration bits read out
normally, even after code protection.
Locations 3FFFFEh and 3FFFFFh are reserved for the
device ID bits. These bits may be used by the
programmer to identify what device type is being
programmed and are described in Section 5.0
“Configuration Word”. These device ID bits read out
normally, even after code protection.
FIGURE 2-10:
2.3.1
MEMORY ADDRESS POINTER
Memory in the address space, 0000000h to 3FFFFFh,
is addressed via the Table Pointer register, which is
comprised of three Pointer registers:
• TBLPTRU, at RAM address 0FF8h
• TBLPTRH, at RAM address 0FF7h
• TBLPTRL, at RAM address 0FF6h
TBLPTRU
TBLPTRH
TBLPTRL
Addr[21:16]
Addr[15:8]
Addr[7:0]
The 4-bit command, ‘0000’ (core instruction), is used to
load the Table Pointer prior to using any read or write
operations.
CONFIGURATION AND ID LOCATIONS FOR PIC18(L)F2XK22/4XK22 DEVICES
000000h
01FFFFh
Code Memory
Unimplemented
Read as ‘0’
1FFFFFh
Configuration
and ID
Space
2FFFFFh
ID Location 1
200000h
ID Location 2
200001h
ID Location 3
200002h
ID Location 4
200003h
ID Location 5
200004h
ID Location 6
200005h
ID Location 7
200006h
ID Location 8
200007h
CONFIG1L
300000h
CONFIG1H
300001h
CONFIG2L
300002h
CONFIG2H
300003h
CONFIG3L
300004h
CONFIG3H
300005h
CONFIG4L
300006h
CONFIG4H
300007h
CONFIG5L
300008h
CONFIG5H
300009h
CONFIG6L
30000Ah
CONFIG6H
30000Bh
CONFIG7L
30000Ch
CONFIG7H
30000Dh
Device ID1
3FFFFEh
Device ID2
3FFFFFh
3FFFFFh
Note:
Sizes of memory areas are not to scale.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 9
PIC18(L)F2XK22/4XK22
2.4
High-Level Overview of the
Programming Process
2.5
Entering and Exiting High-Voltage
ICSP Program/Verify Mode
Figure 2-11 shows the high-level overview of the
programming process. First, a Bulk Erase is performed.
Next, the code memory, ID locations and data
EEPROM are programmed. These memories are then
verified to ensure that programming was successful. If
no errors are detected, the Configuration bits are then
programmed and verified.
As shown in Figure 2-12, the High-Voltage ICSP
Program/Verify mode is entered by holding PGC and
PGD low and then raising MCLR/VPP/RE3 to VIHH
(high voltage). Once in this mode, the code memory,
data EEPROM, ID locations and Configuration bits can
be accessed and programmed in serial fashion.
Figure 2-13 shows the exit sequence.
FIGURE 2-11:
The sequence that enters the device into the Program/
Verify mode places all unused I/Os in the high-impedance
state.
HIGH-LEVEL
PROGRAMMING FLOW
Start
FIGURE 2-12:
ENTERING HIGH-VOLTAGE
PROGRAM/VERIFY MODE
Perform Bulk
Erase
P12
P13
P1
D110
Program Memory
MCLR/VPP/RE3
Program IDs
VDD
PGD
Program Data EE
PGC
PGD = Input
Verify Program
Verify IDs
FIGURE 2-13:
EXITING HIGH-VOLTAGE
PROGRAM/VERIFY MODE
P16
Verify Data
MCLR/VPP/RE3
Program
Configuration Bits
P17
P1
D110
VDD
Verify
Configuration Bits
Done
PGD
PGC
PGD = Input
DS41398B-page 10
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
2.6
Entering and Exiting Low-Voltage
ICSP Program/Verify Mode
Once the key sequence is complete, VIH must be
applied to MCLR and held at that level for as long as
Program/Verify mode is to be maintained. An interval of
at least time P20 and P15 must elapse before presenting data on PGD. Signals appearing on PGD before
P15 has elapsed may not be interpreted as valid.
Low-voltage
entry
into
ICSP
modes
for
PIC18(L)F2XK22/4XK22 devices is somewhat different
than previous PIC18 devices. As shown in Figure 2-14,
entering ICSP Program/Verify mode requires three
steps:
1.
2.
3.
On successful entry, the program memory can be
accessed and programmed in serial fashion. While in
the Program/Verify mode, all unused I/Os are placed in
the high-impedance state.
Voltage is briefly applied to the MCLR pin.
A 32-bit key sequence is presented on PGD.
Voltage is reapplied to MCLR.
Exiting Program/Verify mode is done by removing VIH
from MCLR, as shown in Figure 2-15. The only
requirement for exit is that an interval, P16, should
elapse between the last clock and the program signals
on PGC and PGD before removing VIH.
The programming voltage applied to MCLR is VIH, or
usually, VDD. There is no minimum time requirement for
holding at VIH. After VIH is removed, an interval of at
least P18 must elapse before presenting the key
sequence on PGD.
When VIH is reapplied to MCLR, the device will enter
the ordinary operational mode and begin executing the
application instructions.
The key sequence is a specific 32-bit pattern,
‘0100 1101 0100 0011 0100 1000 0101 0000’
(more easily remembered as 4D434850h in hexadecimal). The device will enter Program/Verify mode
only if the sequence is valid. The Most Significant bit of
the most significant nibble must be shifted in first.
FIGURE 2-14:
ENTERING LOW-VOLTAGE PROGRAM/VERIFY MODE
P13
P20
MCLR
P15
VIH
VIH
VDD
Program/Verify Entry Code = 4D434850h
PGD
0
1
0
0
1
b31
b30
b29
b28
b27
...
0
0
0
0
b3
b2
b1
b0
PGC
P2B
P2A
P18
FIGURE 2-15:
EXITING LOW-VOLTAGE
PROGRAM/VERIFY MODE
P16
VIH
MCLR
VDD
PGD
VIH
PGC
PGD = Input
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 11
PIC18(L)F2XK22/4XK22
2.7
Serial Program/Verify Operation
2.7.2
The core instruction passes a 16-bit instruction to the
CPU core for execution. This is needed to set up
registers as appropriate for use with other commands.
The PGC pin is used as a clock input pin and the PGD
pin is used for entering command bits and data input/
output during serial operation. Commands and data are
transmitted on the rising edge of PGC, latched on the
falling edge of PGC and are Least Significant bit (LSb)
first.
2.7.1
CORE INSTRUCTION
TABLE 2-6:
4-BIT COMMANDS
4-Bit
Command
Description
All instructions are 20 bits, consisting of a leading 4-bit
command followed by a 16-bit operand, which depends
on the type of command being executed. To input a
command, PGC is cycled four times. The commands
needed for programming and verification are shown in
Table 2-6.
Depending on the 4-bit command, the 16-bit operand
represents 16 bits of input data or 8 bits of input data
and 8 bits of output data.
Throughout this specification, commands and data are
presented as illustrated in Table 2-7. The 4-bit
command is shown Most Significant bit (MSb) first. The
command operand, or “Data Payload”, is shown
<MSB><LSB>. Figure 2-16 demonstrates how to
serially present a 20-bit command/operand to the
device.
FIGURE 2-16:
COMMANDS FOR
PROGRAMMING
Core Instruction
(Shift in16-bit instruction)
0000
Shift out TABLAT register
0010
Table Read
1000
Table Read, post-increment
1001
Table Read, post-decrement
1010
Table Read, pre-increment
1011
Table Write
1100
Table Write, post-increment by 2
1101
Table Write, start programming,
post-increment by 2
1110
Table Write, start programming
1111
TABLE 2-7:
SAMPLE COMMAND
SEQUENCE
4-Bit
Command
Data
Payload
1101
3C 40
Core Instruction
Table Write,
post-increment by 2
TABLE WRITE, POST-INCREMENT TIMING DIAGRAM (1101)
P2
1
2
3
4
P2A
P2B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
2
1
3
4
PGC
P5A
P5
P4
P3
PGD
1
0
1
1
0
0
0
0
4-bit Command
0
0
0
1
0
0
0
1
4
C
16-bit Data Payload
1
1
1
0
0
n
n
n
n
3
Fetch Next 4-bit Command
PGD = Input
DS41398B-page 12
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
3.0
DEVICE PROGRAMMING
Programming includes the ability to erase or write the
various memory regions within the device.
In all cases, except high-voltage ICSP Bulk Erase, the
EECON1 register must be configured in order to
operate on a particular memory region.
When using the EECON1 register to act on code
memory, the EEPGD bit must be set (EECON1<7> = 1)
and the CFGS bit must be cleared (EECON1<6> = 0).
The WREN bit must be set (EECON1<2> = 1) to
enable writes of any sort (e.g., erases) and this must be
done prior to initiating a write sequence. The FREE bit
must be set (EECON1<4> = 1) in order to erase the
program space being pointed to by the Table Pointer.
The erase or write sequence is initiated by setting the
WR bit (EECON1<1> = 1). It is strongly recommended
that the WREN bit only be set immediately prior to a
program or erase.
3.1
3.1.1
ICSP Erase
HIGH-VOLTAGE ICSP BULK ERASE
Erasing code or data EEPROM is accomplished by
configuring two Bulk Erase Control registers located at
3C0004h and 3C0005h. Code memory may be erased
portions at a time, or the user may erase the entire
device in one action. Bulk Erase operations will also
clear any code-protect settings associated with the
memory block erased. Erase options are detailed in
Table 3-1. When any one or more blocks of code space
are code protected, then all code blocks will be erased
by default. If data EEPROM is code-protected
(CPD = 0), the user must request an erase of data
EEPROM (e.g., 0084h as shown in Table 3-1).
TABLE 3-1:
The code sequence to erase the entire device is shown
in Table 3-2 and the flowchart is shown in Figure 3-1.
Note:
A Bulk Erase is the only way to reprogram
code-protect bits from an “on” state to an
“off” state.
TABLE 3-2:
BULK ERASE COMMAND
SEQUENCE
4-Bit
Command
Data
Payload
0000
0E 3C
MOVLW 3Ch
0000
6E F8
MOVWF TBLPTRU
0000
0E 00
MOVLW 00h
0000
6E F7
MOVWF TBLPTRH
0000
0E 05
MOVLW 05h
0000
6E F6
MOVWF TBLPTRL
1100
0F 0F
Write 0Fh to 3C0005h
0000
0E 3C
MOVLW 3Ch
0000
6E F8
MOVWF TBLPTRU
0000
0E 00
MOVLW 00h
0000
6E F7
MOVWF TBLPTRH
0000
0E 04
MOVLW 04h
0000
6E F6
MOVWF TBLPTRL
1100
8F 8F
Write 8F8Fh TO 3C0004h
to erase entire device.
0000
00 00
NOP
0000
00 00
Hold PGD low until erase
completes.
Core Instruction
BULK ERASE OPTIONS
Description
Data
(3C0005h:3C0004h)
Chip Erase
0F8Fh
Erase User ID
0088h
Erase Data EEPROM
0084h
Erase Boot Block
0081h
Erase Config Bits
0082h
Erase Code EEPROM Block 0
0180h
Erase Code EEPROM Block 1
0280h
Erase Code EEPROM Block 2
0480h
Erase Code EEPROM Block 3
0880h
FIGURE 3-1:
The actual Bulk Erase function is a self-timed
operation. Once the erase has started (falling edge of
the 4th PGC after the NOP command), serial execution
will cease until the erase completes (parameter P11).
During this time, PGC may continue to toggle but PGD
must be held low.
 2010 Microchip Technology Inc.
Advance Information
BULK ERASE FLOW
Start
Write 0F0Fh
to 3C0005h
Write 8F8Fh to
3C0004h to Erase
Entire Device
Delay P11 + P10
Time
Done
DS41398B-page 13
PIC18(L)F2XK22/4XK22
FIGURE 3-2:
BULK ERASE TIMING DIAGRAM
P10
1
2
3
4
2
1
15 16
1
2
4
3
1
2
15 16
1
2
3
4
1
2
n
n
PGC
PGD
0
0
1
1
4-bit Command
P5
P5A
P5
1
1
0
0
16-bit
Data Payload
0
0
0
0
4-bit Command
P5A
0
0
0
0
16-bit
Data Payload
P11
0
0
0
0
4-bit Command
Erase Time
16-bit
Data Payload
PGD = Input
3.1.2
LOW-VOLTAGE ICSP BULK ERASE
When using low-voltage ICSP, the part must be
supplied by the voltage specified in parameter D111 if a
Bulk Erase is to be executed. All other Bulk Erase
details as described above apply.
If it is determined that a program memory erase must
be performed at a supply voltage below the Bulk Erase
limit, refer to the erase methodology described in
Section 3.1.3 “ICSP Row Erase” and Section 3.2.1
“Modifying Code Memory”.
If it is determined that a data EEPROM erase must be
performed at a supply voltage below the Bulk Erase
limit, follow the methodology described in Section 3.3
“Data EEPROM Programming” and write ‘1’s to the
array.
3.1.3
Regardless of whether high or low-voltage ICSP is
used, it is possible to erase one row (64 bytes of data),
provided the block is not code or write-protected. Rows
are located at static boundaries beginning at program
memory address 000000h, extending to the internal
program memory limit (see Section 2.3 “Memory
Maps”).
The Row Erase duration is self-timed. After the WR bit
in EECON1 is set, two NOPs are issued. Erase starts
upon the 4th PGC of the second NOP. It ends when the
WR bit is cleared by hardware.
The code sequence to Row Erase is shown in Table 3-3.
The flowchart shown in Figure 3-3 depicts the logic
necessary to completely erase the device. The timing
diagram for Row Erase is identical to the data EEPROM
write timing shown in Figure 3-7.
Note:
DS41398B-page 14
ICSP ROW ERASE
Advance Information
The TBLPTR register can point at any byte
within the row intended for erase.
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 3-3:
4-bit
Command
ERASE CODE MEMORY CODE SEQUENCE
Data Payload
Core Instruction
Step 1: Direct access to code memory and enable writes.
8E A6
9C A6
84 A6
0000
0000
0000
BSF
BCF
BSF
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
Step 2: Point to first row in code memory.
6A F8
6A F7
6A F6
0000
0000
0000
CLRF
CLRF
CLRF
TBLPTRU
TBLPTRH
TBLPTRL
Step 3: Enable erase and erase single row.
88 A6
82 A6
00 00
00 00
0000
0000
0000
0000
BSF
BSF
NOP
NOP
EECON1, FREE
EECON1, WR
Erase starts on the 4th clock of this instruction
Step 4: Poll WR bit. Repeat until bit is clear.
0000
0000
0000
0010
50 A6
6E F5
00 00
<MSB><LSB>
MOVF EECON1, W, 0
MOVWF TABLAT
NOP
Shift out data(1)
Step 5: Hold PGC low for time P10.
Step 6: Repeat step 3 with Address Pointer incremented by 64 until all rows are erased.
Step 7: Disable writes.
0000
Note 1:
94 A6
BCF EECON1, WREN
See Figure 4-4 for details on shift out data timing.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 15
PIC18(L)F2XK22/4XK22
FIGURE 3-3:
SINGLE ROW ERASE CODE MEMORY FLOW
Start
Addr = 0
Configure
Device for
Row Erases
Perform Erase
Sequence
Addr = Addr + 64
WR Bit
Clear?
No
Yes
No
All
Rows
done?
Yes
Done
DS41398B-page 16
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
3.2
Code Memory Programming
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time
specified by parameter P10 to allow high-voltage
discharge of the memory array.
Programming code memory is accomplished by first
loading data into the write buffer and then initiating a
programming sequence. The write and erase buffer
sizes shown in Table 3-4 can be mapped to any
location of the same size beginning at 000000h. The
actual memory write sequence takes the contents of
this buffer and programs the proper amount of code
memory that contains the Table Pointer.
The code sequence to program a device is shown in
Table 3-5. The flowchart shown in Figure 3-4 depicts
the logic necessary to completely write the device. The
timing diagram that details the Start Programming
command and parameters P9 and P10 is shown in
Figure 3-5.
The programming duration is externally timed and is
controlled by PGC. After a Start Programming
command is issued (4-bit command, ‘1111’), a NOP is
issued, where the 4th PGC is held high for the duration
of the programming time, P9.
TABLE 3-4:
Note:
The TBLPTR register must point to the
same region when initiating the
programming sequence as it did when the
write buffers were loaded.
WRITE AND ERASE BUFFER SIZES
Devices
PIC18F23K22
PIC18F24K22
PIC18F25K22
PIC18F26K22
TABLE 3-5:
4-bit
Command
PIC18F43K22
PIC18F44K22
PIC18F45K22
PIC18F46K22
PIC18LF23K22
PIC18LF24K22
PIC18LF25K22
PIC18LF26K22
Write Buffer Size
(bytes)
Erase Size
(bytes)
64
64
PIC18LF43K22
PIC18LF44K22
PIC18LF45K22
PIC18LF46K22
WRITE CODE MEMORY CODE SEQUENCE
Data Payload
Core Instruction
Step 1: Direct access to code memory.
0000
0000
0000
8E A6
9C A6
84 A6
BSF
BCF
BSF
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
<Addr[21:16]>
TBLPTRU
<Addr[15:8]>
TBLPTRH
<Addr[7:0]>
TBLPTRL
Step 2: Point to row to write.
0000
0000
0000
0000
0000
0000
0E <Addr[21:16]>
6E F8
0E <Addr[15:8]>
6E F7
0E <Addr[7:0]>
6E F6
Step 3: Load write buffer. Repeat for all but the last two bytes.
1101
<MSB><LSB>
Write 2 bytes and post-increment address by 2.
Step 4: Load write buffer for last two bytes and start programming.
1111
0000
<MSB><LSB>
00 00
Write 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
To continue writing data, repeat steps 2 through 4, where the Address Pointer is incremented by 2 at each iteration of
the loop.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 17
PIC18(L)F2XK22/4XK22
FIGURE 3-4:
PROGRAM CODE MEMORY FLOW
Start
N=1
LoopCount = 0
Configure
Device for
Writes
Load 2 Bytes
to Write
Buffer at <Addr>
N=N+1
All
bytes
written?
No
Yes
N=1
LoopCount =
LoopCount + 1
Start Write Sequence
and Hold PGC
High until Done
and Wait P9
Hold PGC Low
for Time P10
All
locations
done?
No
Yes
Done
FIGURE 3-5:
TABLE WRITE AND START PROGRAMMING INSTRUCTION
TIMING DIAGRAM (1111)
P10
1
2
3
4
1
3
2
4
5
6
15
16
1
2
3
4
PGC
1
2
3
(1)
P9
P5A
P5
PGD
1
1
1
1
4-bit Command
n
n
n
n
n
n
n
n
16-bit Data Payload
0
0
0
0
4-bit Command
0
Programming Time
0
0
16-bit
Data Payload
PGD = Input
Note
1:
Use P9A for User ID and Configuration Word programming.
DS41398B-page 18
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
3.2.1
MODIFYING CODE MEMORY
The previous programming example assumed that the
device has been Bulk Erased prior to programming
(see Section 3.1.1 “High-Voltage ICSP Bulk Erase”).
It may be the case, however, that the user wishes to
modify only a section of an already programmed
device.
TABLE 3-6:
The appropriate number of bytes required for the erase
buffer must be read out of code memory (as described
in Section 4.2 “Verify Code Memory and ID Locations”) and buffered. Modifications can be made on
this buffer. Then, the block of code memory that was
read out must be erased and rewritten with the
modified data.
The WREN bit must be set if the WR bit in EECON1 is
used to initiate a write sequence.
MODIFYING CODE MEMORY
4-bit
Command
Data Payload
Core Instruction
Step 1: Direct access to code memory.
0000
0000
8E A6
9C A6
BSF
BCF
EECON1, EEPGD
EECON1, CFGS
Step 2: Read code memory into buffer (Section 4.1 “Read Code Memory, ID Locations and Configuration Bits”).
Step 3: Set the Table Pointer for the block to be erased.
0000
0000
0000
0000
0000
0000
0E <Addr[21:16]>
6E F8
0E <Addr[8:15]>
6E F7
0E <Addr[7:0]>
6E F6
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
<Addr[21:16]>
TBLPTRU
<Addr[8:15]>
TBLPTRH
<Addr[7:0]>
TBLPTRL
Step 4: Enable memory writes and setup an erase.
0000
0000
84 A6
88 A6
BSF
BSF
EECON1, WREN
EECON1, FREE
88 A6
82 A6
00 00
00 00
BSF
BSF
NOP
NOP
EECON1, FREE
EECON1, WR
Step 5: Initiate erase.
0000
0000
0000
0000
Erase starts on the 4th clock of this instruction
Step 6: Poll WR bit. Repeat until bit is clear.
0000
0000
0000
0000
50 A6
6E F5
00 00
<MSB><LSB>
MOVF
EECON1, W, 0
MOVWF
TABLAT
NOP
Shift out data(1)
Step 7: Load write buffer. The correct bytes will be selected based on the Table Pointer.
0000
0000
0000
0000
0000
0000
1101
•
•
•
1111
0000
0E <Addr[21:16]>
6E F8
0E <Addr[8:15]>
6E F7
0E <Addr[7:0]>
6E F6
<MSB><LSB>
•
•
•
<MSB><LSB>
00 00
MOVLW <Addr[21:16]>
MOVWF TBLPTRU
MOVLW <Addr[8:15]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2.
Repeat as many times as necessary to fill the write buffer
Write 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
To continue modifying data, repeat Steps 2 through 6, where the Address Pointer is incremented by the appropriate number of bytes
(see Table 3-4) at each iteration of the loop. The write cycle must be repeated enough times to completely rewrite the contents of the
erase buffer.
Step 8: Disable writes.
0000
94 A6
 2010 Microchip Technology Inc.
BCF
EECON1, WREN
Advance Information
DS41398B-page 19
PIC18(L)F2XK22/4XK22
3.3
Data EEPROM Programming
FIGURE 3-6:
PROGRAM DATA FLOW
Start
Data EEPROM is accessed one byte at a time via an
Address Pointer (register pair EEADRH:EEADR) and a
data latch (EEDATA). Data EEPROM is written by
loading EEADRH:EEADR with the desired memory
location, EEDATA with the data to be written and initiating a memory write by appropriately configuring the
EECON1 register. A byte write automatically erases the
location and writes the new data (erase-before-write).
Set Address
Set Data
Enable Write
When using the EECON1 register to perform a data
EEPROM write, both the EEPGD and CFGS bits must
be cleared (EECON1<7:6> = 00). The WREN bit must
be set (EECON1<2> = 1) to enable writes of any sort
and this must be done prior to initiating a write
sequence. The write sequence is initiated by setting the
WR bit (EECON1<1> = 1).
Start Write
Sequence
The write begins on the falling edge of the 24th PGC
after the WR bit is set. It ends when the WR bit is
cleared by hardware.
Yes
No
After the programming sequence terminates, PGC
must be held low for the time specified by parameter
P10 to allow high-voltage discharge of the memory
array.
FIGURE 3-7:
No
WR bit
clear?
done?
Yes
Done
DATA EEPROM WRITE TIMING DIAGRAM
P10
1
2
3
4
1
2
1
15 16
2
PGC
PGD
0
0
0
P5A
P5A
P5
P11A
n
0
4-bit Command
2 NOP commands
BSF EECON1, WR
Poll WR bit, Repeat until Clear
(see below)
n
16-bit Data
Payload
PGD = Input
1
2
3
4
1
2
15 16
1
2
3
4
1
2
15 16
PGC
P5
P5
P5A
P5A
Poll WR bit
PGD
0
0
0
0
4-bit Command
0
MOVF EECON1, W, 0
0
0
0
4-bit Command
PGD = Input
DS41398B-page 20
Advance Information
MOVWF TABLAT
Shift Out Data
(see Figure 4-4)
PGD = Output
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 3-7:
PROGRAMMING DATA MEMORY
4-bit
Command
Data Payload
Core Instruction
Step 1: Direct access to data EEPROM.
9E A6
9C A6
0000
0000
BCF EECON1, EEPGD
BCF EECON1, CFGS
Step 2: Set the data EEPROM Address Pointer.
0000
0000
0000
0000
0E <Addr>
6E A9
OE <AddrH>
6E AA
MOVLW
MOVWF
MOVLW
MOVWF
<Addr>
EEADR
<AddrH>
EEADRH
Step 3: Load the data to be written.
0E <Data>
6E A8
0000
0000
MOVLW <Data>
MOVWF EEDATA
Step 4: Enable memory writes.
0000
84 A6
BSF EECON1, WREN
82 A6
00 00
00 00
BSF EECON1, WR
NOP
NOP ;write starts on 4th clock of this instruction
Step 5: Initiate write.
0000
0000
0000
Step 6: Poll WR bit, repeat until the bit is clear.
0000
0000
0000
0010
50 A6
6E F5
00 00
<MSB><LSB>
MOVF EECON1, W, 0
MOVWF TABLAT
NOP
Shift out data(1)
Step 7: Hold PGC low for time P10.
Step 8: Disable writes.
0000
94 A6
BCF EECON1, WREN
Repeat steps 2 through 8 to write more data.
Note 1: See Figure 4-4 for details on shift out data timing.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 21
PIC18(L)F2XK22/4XK22
3.4
ID Location Programming
The ID locations are programmed much like the code
memory. The ID registers are mapped in addresses
200000h through 200007h. These locations read out
normally even after code protection.
Note:
The user only needs to fill the first 8 bytes
of the write buffer in order to write the ID
locations.
In order to modify the ID locations, refer to the
methodology described in Section 3.2.1 “Modifying
Code Memory”. As with code memory, the ID
locations must be erased before being modified.
When VDD is below the minimum for Bulk Erase
operation, ID locations can be cleared with the Row
Erase method described in Section 3.1.3 “ICSP Row
Erase”.
Table 3-8 demonstrates the code sequence required to
write the ID locations.
TABLE 3-8:
4-bit
Command
WRITE ID SEQUENCE
Data Payload
Core Instruction
Step 1: Direct access to code memory.
0000
0000
0000
8E A6
9C A6
84 A6
BSF EECON1, EEPGD
BCF EECON1, CFGS
BSF EECON1, WREN
Step 2: Set Table Pointer to ID. Load write buffer with 8 bytes and write.
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
DS41398B-page 22
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
00 00
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
Write
Write
Write
Write
NOP -
20h
TBLPTRU
00h
TBLPTRH
00h
TBLPTRL
2 bytes and post-increment address by
2 bytes and post-increment address by
2 bytes and post-increment address by
2 bytes and start programming.
hold PGC high for time P9 and low for
Advance Information
2.
2.
2.
time P10.
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
3.5
Boot Block Programming
3.6
The code sequence detailed in Table 3-5 should be
used, except that the address used in “Step 2” will be in
the range of 000000h to 0007FFh.
Configuration Bits Programming
Unlike code memory, the Configuration bits are
programmed a byte at a time. The Table Write, Begin
Programming 4-bit command (‘1111’) is used, but only
8 bits of the following 16-bit payload will be written. The
LSB of the payload will be written to even addresses
and the MSB will be written to odd addresses. The
code sequence to program two consecutive configuration locations is shown in Table 3-9. See Figure 3-5 for
the timing diagram.
Note:
TABLE 3-9:
4-bit
Command
The address must be explicitly written for
each byte programmed. The addresses
can not be incremented in this mode.
SET ADDRESS POINTER TO CONFIGURATION LOCATION
Data Payload
Core Instruction
Step 1: Direct access to config memory.
8E A6
8C A6
84 A6
0000
0000
0000
BSF EECON1, EEPGD
BSF EECON1, CFGS
BSF EECON1, WREN
Step 2(1): Set Table Pointer for config byte to be written. Write even/odd addresses.
0E 30
6E F8
0E 00
6E F7
0E 00
6E F6
<MSB ignored><LSB>
00 00
0E 01
6E F6
<MSB><LSB ignored>
00 00
0000
0000
0000
0000
0000
0000
1111
0000
0000
0000
1111
0000
Note 1:
MOVLW 30h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPRTH
MOVLW 00h
MOVWF TBLPTRL
Load 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
MOVLW 01h
MOVWF TBLPTRL
Load 2 bytes and start programming.
NOP - hold PGC high for time P9A and low for time P10.
Enabling the write protection of Configuration bits (WRTC = 0 in CONFIG6H) will prevent further writing of
Configuration bits. Always write all the Configuration bits before enabling the write protection for
Configuration bits.
FIGURE 3-8:
CONFIGURATION PROGRAMMING FLOW
Start
Start
Load Even
Configuration
Address
Load Odd
Configuration
Address
Program
LSB
Program
MSB
Delay P9 and P10
Time for Write
Delay P9 and P10
Time for Write
Done
Done
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 23
PIC18(L)F2XK22/4XK22
4.0
READING THE DEVICE
4.1
Read Code Memory, ID Locations
and Configuration Bits
PGC of the operand to allow PGD to transition from an
input to an output. During this time, PGC must be held
low (see Figure 4-1). This operation also increments
the Table Pointer by one, pointing to the next byte in
code memory for the next read.
Code memory is accessed one byte at a time via the
4-bit command, ‘1001’ (table read, post-increment).
The contents of memory pointed to by the Table Pointer
(TBLPTRU:TBLPTRH:TBLPTRL) are serially output on
PGD.
This technique will work to read any memory in the
000000h to 3FFFFFh address space, so it also applies
to the reading of the ID and Configuration registers.
Note:
When table read protection is enabled, the
first read access to a protected block
should be discarded and the read repeated
to retrieve valid data. Subsequent reads of
the same block can be performed normally.
The 4-bit command is shifted in LSb first. The read is
executed during the next 8 clocks, then shifted out on
PGD during the last 8 clocks, LSb to MSb. A delay of
P6 must be introduced after the falling edge of the 8th
TABLE 4-1:
READ CODE MEMORY SEQUENCE
4-bit
Command
Data Payload
Core Instruction
Step 1: Set Table Pointer
0E <Addr[21:16]>
6E F8
0E <Addr[15:8]>
6E F7
0E <Addr[7:0]>
6E F6
0000
0000
0000
0000
0000
0000
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
Addr[21:16]
TBLPTRU
<Addr[15:8]>
TBLPTRH
<Addr[7:0]>
TBLPTRL
Step 2: Read memory and then shift out on PGD, LSb to MSb
00 00
1001
FIGURE 4-1:
TBLRD *+
TABLE READ POST-INCREMENT INSTRUCTION TIMING DIAGRAM (1001)
1
2
3
4
1
2
3
4
5
6
7
9
8
10
11
12
13
14
15
1
16
2
3
4
PGC
P5
P5A
P6
P14
(Note 1)
PGD
1
0
0
LSb 1
1
2
3
4
5
6
MSb
Note 1:
n
n
n
Fetch Next 4-bit Command
Shift Data Out
PGD = Input
n
PGD = Output
PGD = Input
Magnification of the high-impedance delay between PGC and PGD is shown in Figure 4-6.
DS41398B-page 24
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
4.2
Verify Code Memory and ID
Locations
The verify step involves reading back the code memory
space and comparing it against the copy held in the
programmer’s buffer. Memory reads occur a single byte
at a time, so two bytes must be read to compare
against the word in the programmer’s buffer. Refer to
Section 4.1 “Read Code Memory, ID Locations and
Configuration Bits” for implementation details of
reading code memory.
FIGURE 4-2:
The Table Pointer must be manually set to 200000h
(base address of the ID locations) once the code
memory has been verified. The post-increment feature
of the table read 4-bit command can not be used to
increment the Table Pointer beyond the code memory
space. In a 64-Kbyte device, for example, a postincrement read of address FFFFh will wrap the Table
Pointer back to 000000h, rather than point to
unimplemented address 010000h.
VERIFY CODE MEMORY FLOW
Start
Set TBLPTR = 0
Set TBLPTR = 200000h
Read Low Byte
with Post-increment
Read Low Byte
with Post-Increment
Read High Byte
with Post-increment
Does
Word = Expect
data?
Yes
No
All
code memory
verified?
Increment
Pointer
No
Read High byte
with Post-Increment
Does
Word = Expect
data?
Failure,
Report
Error
No
Failure,
Report
Error
Yes
No
All
ID locations
verified?
Yes
Yes
Done
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 25
PIC18(L)F2XK22/4XK22
4.3
Verify Configuration Bits
FIGURE 4-3:
READ DATA EEPROM
FLOW
A configuration address may be read and output on
PGD via the 4-bit command, ‘1001’. Configuration data
is read and written in a byte-wise fashion, so it is not
necessary to merge two bytes into a word prior to a
compare. The result may then be immediately
compared to the appropriate configuration data in the
programmer’s memory for verification. Refer to
Section 4.1 “Read Code Memory, ID Locations and
Configuration Bits” for implementation details of
reading configuration data.
4.4
Start
Set
Address
Read
Byte
Read Data EEPROM Memory
Move to TABLAT
Data EEPROM is accessed one byte at a time via an
Address Pointer (register pair EEADRH:EEADR) and a
data latch (EEDATA). Data EEPROM is read by loading
EEADRH:EEADR with the desired memory location
and initiating a memory read by appropriately configuring the EECON1 register. The data will be loaded into
EEDATA, where it may be serially output on PGD via
the 4-bit command, ‘0010’ (Shift Out Data Holding
register). A delay of P6 must be introduced after the
falling edge of the 8th PGC of the operand to allow
PGD to transition from an input to an output. During this
time, PGC must be held low (see Figure 4-4).
Shift Out Data
No
done?
Yes
Done
The command sequence to read a single byte of data
is shown in Table 4-2.
TABLE 4-2:
4-bit
Command
READ DATA EEPROM MEMORY
Data Payload
Core Instruction
Step 1: Direct access to data EEPROM.
9E A6
9C A6
0000
0000
BCF EECON1, EEPGD
BCF EECON1, CFGS
Step 2: Set the data EEPROM Address Pointer.
0E <Addr>
6E A9
OE <AddrH>
6E AA
0000
0000
0000
0000
MOVLW
MOVWF
MOVLW
MOVWF
<Addr>
EEADR
<AddrH>
EEADRH
Step 3: Initiate a memory read.
80 A6
0000
BSF EECON1, RD
Step 4: Load data into the Serial Data Holding register.
50 A8
6E F5
00 00
<MSB><LSB>
0000
0000
0000
0010
Note 1:
MOVF EEDATA, W, 0
MOVWF TABLAT
NOP
Shift Out Data(1)
The <LSB> is undefined. The <MSB> is the data.
DS41398B-page 26
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
FIGURE 4-4:
1
SHIFT OUT DATA HOLDING REGISTER TIMING DIAGRAM (0010)
2
3
4
1
2
3
4
5
6
7
9
8
10
11 12 13
(Note 1)
2
1
14 15 16
3
4
PGC
P5
P5A
P6
P14
(Note 1)
PGD
0
1
0
LSb 1
0
2
3
4
5
MSb
6
Note
1:
PGD = Output
HIGH-IMPEDANCE DELAY
P3
n
PGD = Input
PGC
MSb
n
4.6
Blank Check
The term “Blank Check” means to verify that the device
has no programmed memory cells. All memories must
be verified: code memory, data EEPROM, ID locations
and Configuration bits. The device ID registers
(3FFFFEh:3FFFFFh) should be ignored.
2
1
A “blank” or “erased” memory cell will read as a ‘1’.
Therefore, Blank Checking a device merely means to
verify that all bytes read as FFh except the Configuration bits. Unused (reserved) Configuration bits will read
‘0’ (programmed). Refer to Table 5-1 for blank configuration expect data for the various PIC18(L)F2XK22/
4XK22 devices.
n
P19
4.5
n
Magnification of the High-Impedance delay between PGC and PGD is shown in Figure 4-5.
FIGURE 4-5:
PGD
n
Fetch Next 4-bit Command
Shift Data Out
PGD = Input
n
Verify Data EEPROM
A data EEPROM address may be read via a sequence
of core instructions (4-bit command, ‘0000’) and then
output on PGD via the 4-bit command, ‘0010’ (TABLAT
register). The result may then be immediately
compared to the appropriate data in the programmer’s
memory for verification. Refer to Section 4.4 “Read
Data EEPROM Memory” for implementation details of
reading data EEPROM.
Given that Blank Checking is merely code and data
EEPROM verification with FFh expect data, refer to
Section 4.4 “Read Data EEPROM Memory” and
Section 4.2 “Verify Code Memory and ID Locations”
for implementation details.
FIGURE 4-6:
BLANK CHECK FLOW
Start
Blank Check Device
Is
device
blank?
Yes
Continue
No
Abort
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 27
PIC18(L)F2XK22/4XK22
5.0
CONFIGURATION WORD
5.2
The device ID word for the PIC18(L)F2XK22/4XK22
devices is located at 3FFFFEh:3FFFFFh. These bits
may be used by the programmer to identify what device
type is being programmed and read out normally, even
after code or read protection. See Table 5-2 for a
complete list of device ID values.
The PIC18(L)F2XK22/4XK22 devices have several
Configuration Words. These bits can be set or cleared
to select various device configurations. All other memory areas should be programmed and verified prior to
setting Configuration Words. These bits may be read
out normally, even after read or code protection. See
Table 5-1 for a list of Configuration bits and device IDs
and Table 5-3 for the Configuration bit descriptions.
5.1
Device ID Word
FIGURE 5-1:
READ DEVICE ID WORD
FLOW
User ID Locations
Start
A user may store identification information (ID) in eight
ID locations mapped in 200000h:200007h. It is
recommended that the Most Significant nibble of each
ID be Fh. In doing so, if the user code inadvertently tries
to execute from the ID space, the ID data will execute
as a NOP.
Set TBLPTR = 3FFFFE
Read Low Byte
with Post-Increment
Read High Byte
with Post-Increment
Done
TABLE 5-1:
CONFIGURATION BITS AND DEVICE IDs
File Name
Bit 7
Bit 6
Bit 5
FCMEN PRI_CLK_EN
Bit 4
Bit 2
Bit 1
Bit 0
Default/
Unprogrammed
Value
FOSC2
FOSC1
FOSC0
0010 0101
Bit 3
300001h
CONFIG1H
IESO
300002h
CONFIG2L
—
—
—
300003h
CONFIG2H
—
—
WDTPS3
300005h
CONFIG3H MCLRE
—
P2BMX
T3CMX
300006h
CONFIG4L DEBUG XINST
—
—
—
LVP
—
STVREN
10-- -1-1
300008h
CONFIG5L
—
—
—
—
CP3(1)
CP2(1)
CP1
CP0
---- 1111
300009h
CONFIG5H
CPD
CPB
—
—
—
—
—
—
11-- ----
30000Ah
CONFIG6L
—
—
—
—
WRT3(1)
WRT2(1)
WRT1
WRT0
---- 1111
—
—
PLLEN
FOSC3
BORV1
BORV0
BOREN1 BOREN0 PWRTEN
WDTPS2 WDTPS1 WDTPS0 WDTEN1 WDTEN0
HFOFST CCP3MX PBADEN CCP2MX
---1 1111
--11 1111
1-11 1111
WRTB
WRTC
—
—
—
—
—
CONFIG7H
—
EBTRB
—
—
—
—
—
—
-1-- ----
DEVID1(2)
DEV2
DEV1
DEV0
REV4
REV3
REV2
REV1
REV0
See Table 5-2
3FFFFFh
DEVID2(2)
DEV10
DEV9
DEV8
DEV7
DEV6
DEV5
DEV4
DEV3
See Table 5-2
Legend:
Note 1:
x = unknown, u = unchanged, – = unimplemented. Shaded cells are unimplemented, read as ‘0’.
These bits are only implemented on specific devices. Refer to Section 2.3 “Memory Maps” to determine which bits
apply based on available memory.
DEVID registers are read-only and cannot be programmed by the user.
30000Bh
CONFIG6H WRTD
30000Ch
CONFIG7L
30000Dh
3FFFFEh
2:
DS41398B-page 28
EBTR3(1) EBTR2(1)
Advance Information
—
—
111- ----
EBTR1
EBTR0
---- 1111
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 5-2:
DEVICE ID VALUE
Device
PIC18F45K22
Device ID Value
DEVID2
DEVID1
55h
000x xxxx
PIC18LF45K22
55h
001x xxxx
PIC18F25K22
55h
010x xxxx
PIC18LF25K22
55h
011x xxxx
PIC18F23K22
57h
010x xxxx
PIC18LF23K22
57h
011x xxxx
PIC18F24K22
56h
010x xxxx
PIC18LF24K22
56h
011x xxxx
PIC18F26K22
54h
010x xxxx
PIC18LF26K22
54h
011x xxxx
PIC18F43K22
57h
000x xxxx
PIC18LF43K22
57h
001x xxxx
PIC18F44K22
56h
000x xxxx
PIC18LF44K22
56h
001x xxxx
PIC18F46K22
54h
000x xxxx
PIC18LF46K22
54h
001x xxxx
Note:
The ‘x’s in DEVID1 contain the device revision code.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 29
PIC18(L)F2XK22/4XK22
TABLE 5-3:
Bit Name
PIC18(L)F2XK22/4XK22 BIT DESCRIPTIONS
Configuration
Words
Description
IESO
CONFIG1H
Internal External Switchover bit
1 = Internal External Switchover mode enabled
0 = Internal External Switchover mode disabled
FCMEN
CONFIG1H
Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor enabled
0 = Fail-Safe Clock Monitor disabled
PRICLKEN
CONFIG1H
1 = Primary clock enabled
0 = Primary clock disabled
FOSC<3:0>
CONFIG1H
Oscillator Selection bits
1111 = External RC oscillator, CLKOUT function on OSC2
1110 = External RC oscillator, CLKOUT function on OSC2
1101 = EC oscillator (low power)
1100 = EC oscillator, CLKOUT function on OSC2 (low power)
1011 = EC oscillator (medium power, 4 MHz-16 MHz)
1010 = EC oscillator, CLKOUT function on OSC2 (medium power, 4 MHz-16 MHz)
1001 = Internal RC oscillator, CLKOUT function on OSC2
1000 = Internal RC oscillator
0111 = External RC oscillator
0110 = External RC oscillator, CLKOUT function on OSC2
0101 = EC oscillator (high power, >16 MHz)
0100 = EC oscillator, CLKOUT function on OSC2 (high power, >16 MHz)
0011 = HS oscillator (medium power, 4 MHz-16 MHz)
0010 = HS oscillator (high power, >16 MHz)
0001 = XT oscillator
0000 = LP oscillator
BORV<1:0>
CONFIG2L
Brown-out Reset Voltage bits
11 = VBOR set to 1.9V
10 = VBOR set to 2.2V
01 = VBOR set to 2.5V
00 = VBOR set to 2.85V
BOREN<1:0>
CONFIG2L
Brown-out Reset Enable bits
11 = Brown-out Reset enabled in hardware only (SBOREN is disabled)
10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode
(SBOREN is disabled)
01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled)
00 = Brown-out Reset disabled in hardware and software
PWRTEN
CONFIG2L
Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
.
DS41398B-page 30
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 5-3:
PIC18(L)F2XK22/4XK22 BIT DESCRIPTIONS (CONTINUED)
Bit Name
Configuration
Words
WDTPS<3:0>
CONFIG2H
Watchdog Timer Postscaler Select bits
1111 = 1:32,768
1110 = 1:16,384
1101 = 1:8,192
1100 = 1:4,096
1011 = 1:2,048
1010 = 1:1,024
1001 = 1:512
1000 = 1:256
0111 = 1:128
0110 = 1:64
0101 = 1:32
0100 = 1:16
0011 = 1:8
0010 = 1:4
0001 = 1:2
0000 = 1:1
WDTEN<1:0>
CONFIG2H
Watchdog Timer Enable bits
11 = WDT enabled in hardware; SWDTEN bit is disabled
10 = WDT controlled by the SWDTEN bit
01 = WDT enabled when device is active, disabled when device is in Sleep;
SWDTEN bit is disabled
00 = WDT disabled in hardware; SWDTEN bit is disabled
MCLRE
CONFIG3H
MCLR Pin Enable bit
1 = MCLR pin enabled, RE3 input pin disabled
0 = RE3 input pin enabled, MCLR pin disabled
P2BMX
CONFIG3H
CCP2 B Output MUX bit
On 28-pin devices:
1 = P2B is on RB5
0 = P2B is on RC0
On 40-pin devices:
1 = P2B is on RD2
0 = P2B is on RC0
T3CMX
CONFIG3H
1 = T3CKI is on RC0
0 = T3CKI is on RB5
HFOFST
CONFIG3H
HFINTOSC Fast Start bit
1 = HFINTOSC output is not delayed
0 = HFINTOSC output is delayed until oscillator is stable (IOFS = 1)
CCP3MX
CONFIG3H
CCP3 MUX bit
On 28-pin devices:
1 = CCP3 input/output is multiplexed with RB5
0 = CCP3 input/output is multiplexed with RC6
On 40-pin devices:
1 = CCP3 input/output is multiplexed with RB5
0 = CCP3 input/output is multiplexed with RE0
PBADEN
CONFIG3H
PORTB A/D Enable bit
1 = PORTB A/D<5:0> pins are configured as analog input channels on Reset
0 = PORTB A/D<5:0> pins are configured as digital I/O on Reset
CCP2MX
CONFIG3H
CCP2 MUX bit
1 = CCP2 input/output is multiplexed with RC1
0 = CCP2 input/output is multiplexed with RB3
Description
.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 31
PIC18(L)F2XK22/4XK22
TABLE 5-3:
Bit Name
PIC18(L)F2XK22/4XK22 BIT DESCRIPTIONS (CONTINUED)
Configuration
Words
Description
DEBUG
CONFIG4L
Background Debugger Enable bit
1 = Background debugger disabled, RB6 and RB7 configured as general
purpose I/O pins
0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug
XINST
CONFIG4L
Extended Instruction Set Enable bit
1 = Instruction set extension and Indexed Addressing mode enabled
0 = Instruction set extension and Indexed Addressing mode disabled
(Legacy mode)
LVP
CONFIG4L
Low-Voltage Programming Enable bit
If MCLRE = 1, then:
1 = Low-Voltage Programming enabled
0 = Low-Voltage Programming disabled
If MCLRE = 0, then:
LVP is disabled
STVREN
CONFIG4L
Stack Overflow/Underflow Reset Enable bit
1 = Reset on stack overflow/underflow enabled
0 = Reset on stack overflow/underflow disabled
.
DS41398B-page 32
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 5-3:
Bit Name
PIC18(L)F2XK22/4XK22 BIT DESCRIPTIONS (CONTINUED)
Configuration
Words
Description
CP3
CONFIG5L
Code Protection bits (Block 3 code memory area)
1 = Block 3 is not code-protected
0 = Block 3 is code-protected
CP2
CONFIG5L
Code Protection bits (Block 2 code memory area)
1 = Block 2 is not code-protected
0 = Block 2 is code-protected
CP1
CONFIG5L
Code Protection bits (Block 1 code memory area)
1 = Block 1 is not code-protected
0 = Block 1 is code-protected
CP0
CONFIG5L
Code Protection bits (Block 0 code memory area)
1 = Block 0 is not code-protected
0 = Block 0 is code-protected
CPD
CONFIG5H
Code Protection bits (Data EEPROM)
1 = Data EEPROM is not code-protected
0 = Data EEPROM is code-protected
CPB
CONFIG5H
Code Protection bits (Boot Block memory area)
1 = Boot Block is not code-protected
0 = Boot Block is code-protected
WRT3
CONFIG6L
Write Protection bits (Block 3 code memory area)
1 = Block 3 is not write-protected
0 = Block 3 is write-protected
WRT2
CONFIG6L
Write Protection bits (Block 2 code memory area)
1 = Block 2 is not write-protected
0 = Block 2 is write-protected
WRT1
CONFIG6L
Write Protection bits (Block 1 code memory area)
1 = Block 1 is not write-protected
0 = Block 1 is write-protected
WRT0
CONFIG6L
Write Protection bits (Block 0 code memory area)
1 = Block 0 is not write-protected
0 = Block 0 is write-protected
WRTD
CONFIG6H
Write Protection bit (Data EEPROM)
1 = Data EEPROM is not write-protected
0 = Data EEPROM is write-protected
WRTB
CONFIG6H
Write Protection bit (Boot Block memory area)
1 = Boot Block is not write-protected
0 = Boot Block is write-protected
WRTC
CONFIG6H
Write Protection bit (Configuration registers)
1 = Configuration registers are not write-protected
0 = Configuration registers are write-protected
.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 33
PIC18(L)F2XK22/4XK22
TABLE 5-3:
Bit Name
PIC18(L)F2XK22/4XK22 BIT DESCRIPTIONS (CONTINUED)
Configuration
Words
Description
EBTR3
CONFIG7L
Table Read Protection bit (Block 3 code memory area)
1 = Block 3 is not protected from table reads executed in other blocks
0 = Block 3 is protected from table reads executed in other blocks
EBTR2
CONFIG7L
Table Read Protection bit (Block 2 code memory area)
1 = Block 2 is not protected from table reads executed in other blocks
0 = Block 2 is protected from table reads executed in other blocks
EBTR1
CONFIG7L
Table Read Protection bit (Block 1 code memory area)
1 = Block 1 is not protected from table reads executed in other blocks
0 = Block 1 is protected from table reads executed in other blocks
EBTR0
CONFIG7L
Table Read Protection bit (Block 0 code memory area)
1 = Block 0 is not protected from table reads executed in other blocks
0 = Block 0 is protected from table reads executed in other blocks
EBTRB
CONFIG7H
Table Read Protection bit (Boot Block memory area)
1 = Boot Block is not protected from table reads executed in other blocks
0 = Boot Block is protected from table reads executed in other blocks
DEV<10:3>
DEVID2
Device ID bits
These bits are used with the DEV<2:0> bits in the DEVID1 register to
identify part number.
DEV<2:0>
DEVID1
Device ID bits
These bits are used with the DEV<10:3> bits in the DEVID2 register to
identify part number.
REV<4:0>
DEVID1
Revision ID bits
These bits are used to indicate the revision of the device.
.
DS41398B-page 34
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
5.3
Single-Supply ICSP Programming
The LVP bit in Configuration register, CONFIG4L,
enables
Single-Supply
(Low-Voltage)
ICSP
Programming. The LVP bit defaults to a ‘1’ (enabled)
from the factory.
If Single-Supply Programming mode is not used, the
LVP bit can be programmed to a ‘0’. However, the LVP
bit may only be programmed by entering the HighVoltage ICSP mode, where MCLR/VPP/RE3 is raised
to VIHH. Once the LVP bit is programmed to a ‘0’, only
the High-Voltage ICSP mode is available and only the
High-Voltage ICSP mode can be used to program the
device.
Note 1: The High-Voltage ICSP mode is always
available, regardless of the state of the
LVP bit, by applying VIHH to the MCLR/
VPP/RE3 pin.
5.4
Embedding Configuration Word
Information in the HEX File
To allow portability of code, a PIC18(L)F2XK22/4XK22
programmer is required to read the Configuration Word
locations from the hex file. If Configuration Word
information is not present in the hex file, then a simple
warning message should be issued. Similarly, while
saving a hex file, all Configuration Word information
must be included. An option to not include the
Configuration Word information may be provided.
When embedding Configuration Word information in
the hex file, it should start at address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
5.5
Embedding Data EEPROM
Information In the HEX File
To allow portability of code, a PIC18(L)F2XK22/4XK22
programmer is required to read the data EEPROM
information from the hex file. If data EEPROM information is not present, a simple warning message should
be issued. Similarly, when saving a hex file, all data
EEPROM information must be included. An option to
not include the data EEPROM information may be provided. When embedding data EEPROM information in
the hex file, it should start at address F00000h.
Microchip Technology Inc. believes that this feature is
important for the benefit of the end customer.
5.6
Checksum Computation
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The Configuration Word, appropriately masked
• ID locations (Only if any portion of program
memory is code-protected)
The Least Significant 16 bits of this sum are the
checksum.
Code protection limits access to program memory by
both external programmer (code-protect) and code
execution (table read protect). The ID locations, when
included in a code protected checksum, contain the
checksum of an unprotected part. The unprotected
checksum is distributed: one nibble per ID location.
Each nibble is right justified.
Table 5-4 describes how to calculate the checksum for
each device.
Note:
 2010 Microchip Technology Inc.
Advance Information
The
checksum
calculation
differs
depending on the code-protect setting.
Since the code memory locations read out
differently depending on the code-protect
setting, the table describes how to
manipulate the actual code memory
values to simulate the values that would
be read from a protected device. When
calculating a checksum by reading a
device, the entire code memory can
simply be read and summed. The
Configuration Word and ID locations can
always be read.
DS41398B-page 35
PIC18(L)F2XK22/4XK22
TABLE 5-4:
Device
CHECKSUM COMPUTATION
CodeProtect
Blank
Value
0xAA at 0
and Max
Address
None
SUM[0000:01FF]+SUM[0200:0FFF]+SUM[1000:1FFF]+
(CONFIG1L & 00h)+
(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 03h)+(CONFIG5H & C0h)+
(CONFIG6L & 03h)+(CONFIG6H & E0h)+(CONFIG7L & 03h)+
(CONFIG7H & 40h)
E3B0
E306
Boot
Block
SUM[0200:0FFF]+SUM[1000:1FFF]+
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+
(CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+
(CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID
E58C
E532
Boot/ SUM[1000:1FFF]+(CONFIG1L & 00h)+
Block 0 (CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 03h)+(CONFIG5H & C0h)+
(CONFIG6L & 03h)+(CONFIG6H & E0h)+(CONFIG7L & 03h)+
(CONFIG7H & 40h)+SUM_ID
F38B
F331
PIC18FX3K22
PIC18LFX3K22
All
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+
(CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+
(CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID
0389
0384
None
SUM[0000:07FF]+SUM[0800:1FFF]+SUM[2000:3FFF]+
(CONFIG1L & 00h)+
(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 03h)+(CONFIG5H & C0h)+
(CONFIG6L & 03h)+(CONFIG6H & E0h)+(CONFIG7L & 03h)+
(CONFIG7H & 40h)
C3B0
C306
Boot
Block
SUM[0800:1FFF]+SUM[2000:3FFF]+
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+
(CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+
(CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID
CB8A
CB30
Boot/ SUM[2000:3FFF]+(CONFIG1L & 00h)+
Block 0 (CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 03h)+(CONFIG5H & C0h)+
(CONFIG6L & 03h)+(CONFIG6H & E0h)+(CONFIG7L & 03h)+
(CONFIG7H & 40h)+SUM_ID
D389
D32F
0387
0382
PIC18FX4K22
PIC18LFX4K22
All
Legend:
Checksum
Item
CONFIGx
SUM[a:b]
SUM_ID
+
&
DS41398B-page 36
=
=
=
=
=
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 03h)+
(CONFIG5H & C0h)+(CONFIG6L & 03h)+(CONFIG6H & E0h)+
(CONFIG7L & 03h)+(CONFIG7H & 40h)+SUM_ID
Description
Configuration Word
Sum of locations, a to b inclusive
Byte-wise sum of lower four bits of all customer ID locations
Addition
Bit-wise AND
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
TABLE 5-4:
Device
CHECKSUM COMPUTATION (CONTINUED)
CodeProtect
Checksum
0xAA at 0
and Max
Address
None
SUM[0000:07FF]+SUM[0800:1FFF]+SUM[2000:3FFF]+
SUM[4000:5FFF]+SUM[6000:7FFF]+(CONFIG1L & 00h)+
(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+(CONFIG5H & C0h)+
(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+(CONFIG7L & 0Fh)+
(CONFIG7H & 40h)
83D4
832A
Boot
Block
SUM[0800:1FFF]+SUM[2000:3FFF]+SUM[4000:5FFF]+SUM[6000:7FFF]+
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+
(CONFIG5H & C0h)+(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+
(CONFIG7L & 0Fh)+(CONFIG7H & 40h)+SUM_ID
8BB0
8B56
C3AD
C353
PIC18FX5K22
PIC18LFX5K22
Boot/ SUM[4000:5FFF]+SUM[6000:7FFF]+(CONFIG1L & 00h)+
Block 0/ (CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
Block 1 (CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+(CONFIG5H & C0h)+
(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+(CONFIG7L & 0Fh)+
(CONFIG7H & 40h)+SUM_ID
All
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+
(CONFIG5H & C0h)+(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+
(CONFIG7L & 0Fh)+(CONFIG7H & 40h)+SUM_ID
03A1
039C
None
SUM[0000:07FF]+SUM[0800:3FFF]+SUM[4000:7FFF]+
SUM[8000:BFFF]+SUM[C000:FFFF]+(CONFIG1L & 00h)+
(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
(CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+(CONFIG5H & C0h)+
(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+(CONFIG7L & 0Fh)+
(CONFIG7H & 40h)
03D4
032A
Boot
Block
SUM[0800:3FFF]+SUM[4000:7FFF]+SUM[8000:BFFF]+SUM[C000:FFFF]
+
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+
(CONFIG5H & C0h)+(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+
(CONFIG7L & 0Fh)+(CONFIG7H & 40h)+SUM_ID
0BA8
0B4E
43A5
434B
0399
0394
PIC18FX6K22
PIC18LFX6K22
Boot/ SUM[8000:BFFF]+SUM[C000:FFFF]+(CONFIG1L & 00h)+
Block 0/ (CONFIG1H & FFh)+(CONFIG2L & 1Fh)+(CONFIG2H & 3Fh)+
Block 1 (CONFIG3L & 00h)+(CONFIG3H & BFh)+(CONFIG4L & C5h)+
(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+(CONFIG5H & C0h)+
(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+(CONFIG7L & 0Fh)+
(CONFIG7H & 40h)+SUM_ID
All
Legend:
Blank
Value
Item
CONFIGx
SUM[a:b]
SUM_ID
+
&
=
=
=
=
=
(CONFIG1L & 00h)+(CONFIG1H & FFh)+(CONFIG2L & 1Fh)+
(CONFIG2H & 3Fh)+(CONFIG3L & 00h)+(CONFIG3H & BFh)+
(CONFIG4L & C5h)+(CONFIG4H & 00h)+(CONFIG5L & 0Fh)+
(CONFIG5H & C0h)+(CONFIG6L & 0Fh)+(CONFIG6H & E0h)+
(CONFIG7L & 0Fh)+(CONFIG7H & 40h)+SUM_ID
Description
Configuration Word
Sum of locations, a to b inclusive
Byte-wise sum of lower four bits of all customer ID locations
Addition
Bit-wise AND
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 37
PIC18(L)F2XK22/4XK22
6.0
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/
VERIFY TEST MODE
Standard Operating Conditions
Operating Temperature: 25C is recommended
Param
No.
Sym.
Characteristic
Min.
D110
VIHH
High-Voltage Programming Voltage on MCLR/VPP/RE3
D111
VDD
Supply Voltage During Programming
PIC18LF
PIC18F
Max.
Units
Conditions
VDD + 4.5
9
V
1.80
3.60
V
Row Erase/Write
2.7
3.60
V
Bulk Erase operations
1.8
5.5
V
Row Erase/Write
2.7
5.5
V
Bulk Erase operations
—
300
A
D112
IPP
Programming Current on MCLR/VPP/RE3
D113
IDDP
Supply Current During Programming
—
10
mA
D031
VIL
Input Low Voltage
VSS
0.2 VDD
V
D041
VIH
Input High Voltage
0.8 VDD
VDD
V
D080
VOL
Output Low Voltage
—
0.6
V
IOL = 8.5 mA @ 3.0V
D090
VOH
Output High Voltage
VDD – 0.7
—
V
IOH = 3.0 mA @ 3.0V
D012
CIO
Capacitive Loading on I/O pin (PGD)
—
50
pF
To meet AC specifications
P1
TR
MCLR/VPP/RE3 Rise Time to enter Program/Verify mode
—
1.0
s
(Note 1)
P2
TPGC
Serial Clock (PGC) Period
100
—
ns
VDD = 3.6V
1
—
s
VDD = 1.8V
40
—
ns
VDD = 3.6V
400
—
ns
VDD = 1.8V
P2A
P2B
TPGCL
TPGCH
Serial Clock (PGC) Low Time
Serial Clock (PGC) High Time
40
—
ns
VDD = 3.6V
400
—
ns
VDD = 1.8V
P3
TSET1
Input Data Setup Time to Serial Clock 
15
—
ns
P4
THLD1
Input Data Hold Time from PGC
15
—
ns
P5
TDLY1
Delay between 4-bit Command and Command Operand
40
—
ns
P5A
TDLY1A Delay between 4-bit Command Operand and
next 4-bit Command
40
—
ns
P6
TDLY2
Delay between Last PGC  of Command Byte to First
PGC  of Read of Data Word
20
—
ns
P9
TDLY5
PGC High Time (minimum programming time)
1
—
ms
Externally Timed
P9A
TDLY5A PGC High Time
ms
Configuration Word
programming time
P10
TDLY6
PGC Low Time after Programming
(high-voltage discharge time)
200
—
s
P11
TDLY7
Delay to allow Self-Timed Bulk Erase to occur PIC18(L)F
X5/X6
15
—
ms
PIC18(L)F
X3/X4
12
—
ms
5
P11A
TDRWT Data Write Polling Time
4
—
ms
P11B
TDLY7B Delay for Self-Timed Memory Write
2
—
ms
P12
THLD2
Input Data Hold Time from MCLR/VPP/RE3 
2
—
s
P13
TSET2
VDD Setup Time to MCLR/VPP/RE3 
100
—
ns
Note 1:
Do not allow excess time when transitioning MCLR between VIL and VIHH; this can cause spurious program executions
to occur. The maximum transition time is:
1 TCY + TPWRT (if enabled) + 1024 TOSC (for LP, HS, HS/PLL and XT modes only) + 2 ms (for HS/PLL mode only) + 1.5
s (for EC mode only) where TCY is the instruction cycle time, TPWRT is the Power-up Timer period and TOSC is the
oscillator period. For specific values, refer to the Electrical Characteristics section of the device data sheet for the
particular device.
DS41398B-page 38
Advance Information
 2010 Microchip Technology Inc.
PIC18(L)F2XK22/4XK22
Standard Operating Conditions
Operating Temperature: 25C is recommended
Param
No.
Sym.
Characteristic
Min.
Max.
Units
P14
TVALID
Data Out Valid from PGC 
10
—
ns
P15
THLD4
Input data hold time from MCLR 
400
—
s
P16
TDLY8
Delay between Last PGC  and MCLR/VPP/RE3 
0
—
s
P17
THLD3
MCLR/VPP/RE3 to VDD 
—
100
ns
P18
TKEY1
Delay from First MCLR to first PGC for Key Sequence
on PGD
1
—
ms
P19
THIZ
Delay from PGC to PGD High-Z
3
10
ns
P20
TKEY2
Delay from Last PGC for Key Sequence on PGD to
Second MCLR 
40
—
ns
Note 1:
Conditions
Do not allow excess time when transitioning MCLR between VIL and VIHH; this can cause spurious program executions
to occur. The maximum transition time is:
1 TCY + TPWRT (if enabled) + 1024 TOSC (for LP, HS, HS/PLL and XT modes only) + 2 ms (for HS/PLL mode only) + 1.5
s (for EC mode only) where TCY is the instruction cycle time, TPWRT is the Power-up Timer period and TOSC is the
oscillator period. For specific values, refer to the Electrical Characteristics section of the device data sheet for the
particular device.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 39
PIC18(L)F2XK22/4XK22
NOTES:
DS41398B-page 40
Advance Information
 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-156-7
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 41
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/05/10
DS41398B-page 42
Advance Information
 2010 Microchip Technology Inc.