TI TMP302ADRLR

TMP302A, TMP302B
TMP302C, TMP302D
SOT563
www.ti.com................................................................................................................................................ SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009
Easy-to-Use, Low-Power, Low-Supply
TEMPERATURE SWITCH in MicroPackage
Check for Samples: TMP302A TMP302B TMP302C TMP302D
FEATURES
DESCRIPTION
•
•
•
The TMP302x is a temperature switch in a
micropackage (SOT563). The TMP302x offers low
power (15μA max) and ease-of-use through
pin-selectable trip points and hysteresis.
1
2
•
•
•
•
LOW POWER: 15μA (max)
SOT563 PACKAGE: 1,6mm x 1,6mm x 0,6mm
TRIP-POINT ACCURACY: ±0.2°C (typ) from
+40°C to +125°C
PIN-SELECTABLE TRIP POINTS
OPEN-DRAIN OUTPUT
SELECTABLE HYSTERESIS: 5°C/10°C
LOW SUPPLY VOLTAGE RANGE: 1.4V to 3.6V
APPLICATIONS
•
•
•
•
•
•
•
•
CELL PHONE HANDSETS
PORTABLE MEDIA PLAYERS
CONSUMER ELECTRONICS
SERVERS
POWER-SUPPLY SYSTEMS
DC-DC MODULES
THERMAL MONITORING
ELECTRONIC PROTECTION SYSTEMS
These devices require no additional components for
operation; they can function independent of
microprocessors or microcontrollers.
The TMP302x is available in several different
versions. For additional trip points, contact a TI
representative.
TMP302 Available Versions (1)
(1)
DEVICE
SELECTABLE TRIP POINTS (°C)
TMP302A
50, 55, 60, 65
TMP302B
70, 75, 80, 85
TMP302C
90, 95, 100, 105
TMP302D
110, 115, 120, 125
For other available trip points, please contact a TI
representative.
TRIP THRESHOLD ACCURACY
40
35
DRL PACKAGE
SOT563-6
(TOP VIEW)
Population
30
25
20
TRIPSET0 1
6
TRIPSET1
GND
2
5
VS
OUT
3
4
HYSTSET
15
10
5
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
Accuracy (°C)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TMP302A, TMP302B
TMP302C, TMP302D
SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009................................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
(1)
PRODUCT
TRIP POINTS (°C)
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE MARKING
TMP302A
50, 55, 60, 65
SOT563
DRL
OCP
TMP302B
70, 75, 80, 85
SOT563
DRL
OCT
TMP302C
90, 95, 100, 105
SOT563
DRL
OCR
TMP302D
110, 115, 120, 125
SOT563
DRL
OCS
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage
TMP302A, TMP302B,
TMP302C, TMP302D
UNIT
+3.6
V
–0.5 to VS + 0.5
V
Input Pins, Voltage
TRIPSET0, TRIPSET1, HYSTSET
Output Pin, Voltage
OUT
–0.5 to +3.6
V
Output Pin, Current
OUT
10
mA
Operating Temperature
–55 to +130
°C
Storage Temperature Range
–60 to +150
°C
Junction Temperature Range
+150
°C
Human Body Model (HBM)
2000
V
Charged-Device Model (CDM)
1000
V
Machine Model (MM)
200
V
ESD Rating:
(1)
2
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TMP302A TMP302B TMP302C TMP302D
TMP302A, TMP302B
TMP302C, TMP302D
www.ti.com................................................................................................................................................ SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +125°C, and VS = +1.4V to +3.6V, unless otherwise noted.
TMP302
PARAMETER
TEST CONDITIONS
MIN
(1)
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
Trip Point Accuracy
TA = +40°C to +125°C
vs. Supply
Trip Point Hysteresis
±0.2
±2
°C
±0.2
±0.5
°C/V
HYSTSET = GND
5
°C
HYSTSET = VS
10
°C
TRIPSET1 = GND, TRIPSET0 = GND
Default
°C
TRIPSET1 = GND, TRIPSET0 = VS
Default + 5
°C
TRIPSET1 = VS, TRIPSET0 = GND
Default + 10
°C
TRIPSET1 = VS, TRIPSET0 = VS
Default + 15
°C
TEMPERATURE TRIP POINT SET
Temperature Trip Point Set
HYSTERESIS SET INPUT
Input Logic Levels:
VIH
0.7 × (VS)
VS
V
VIL
–0.5
0.3 × (VS)
V
1
µA
Input Current:
IIN
0 < VIN < 3.6V
DIGITAL OUTPUT
Output Logic Level:
VOL
VS > 2V, IOL = 3mA
0
0.4
V
VS < 2V, IOL = 3mA
0
0.2 × (VS)
V
POWER SUPPLY
Operating Supply Range
Quiescent Current
1.4
IQ
8
VS = 3.3V, TA = +50°C
3.6
V
15
µA
7
µA
TEMPERATURE RANGE
Specified Range
–40
+125
°C
Operating Range
–55
+130
°C
Thermal Resistance
θJA
SOT563
(1)
JEDEC Low-K Board
+260
°C/W
100% of all units are production tested at TA = +25°C. Over temperature specifications are specified by design.
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): TMP302A TMP302B TMP302C TMP302D
3
TMP302A, TMP302B
TMP302C, TMP302D
SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C and VS = 3.3V, unless otherwise noted.
TRIP ACCURACY ERROR vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
2.0
16
30 Typical Units
14
Quiescent Current (mA)
Trip Accuracy (°C)
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
12
VS = 3.3V
10
VS = 3.6V
8
6
4
VS = 1.4V
2
-2.0
0
40
50
60
70
80
90
100
110
120
130
-75
-50
0
-25
25
50
75
100
125
150
Temperature (°C)
Temperature (°C)
Figure 1.
Figure 2.
TEMPERATURE STEP RESPONSE IN PERFLUORINATED FLUID
AT +100°C vs TIME
THERMAL STEP RESPONSE IN AIR AT +100°C vs TIME
100
120
90
80
Temperature (°C)
Temperature (°C)
100
80
60
40
70
60
50
40
30
20
20
10
0
0
0
5
10
15
20
25
0
30
20
40
60
80
100 120 140 160 180 200
Time (s)
Figure 3.
Figure 4.
TRIP THRESHOLD ACCURACY
OUTPUT LOGIC LEVEL LOW VOL vs TEMPERATURE
400
35
350
30
300
25
250
VOL (mV)
40
20
15
VS = 1.4V
IOL = 2mA
200
150
10
100
5
50
0
0
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Population
Time (s)
-75
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Accuracy (°C)
Figure 5.
4
Submit Documentation Feedback
Figure 6.
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TMP302A TMP302B TMP302C TMP302D
TMP302A, TMP302B
TMP302C, TMP302D
www.ti.com................................................................................................................................................ SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VS = 3.3V, unless otherwise noted.
POWER-UP AND POWER-DOWN RESPONSE
POWER-UP, TRIP, AND POWER-DOWN RESPONSE
TMP302A, TA = +55°C
TRIPSET1 = TRIPSET0 = GND
OUT
Voltage (2V/div)
Voltage (2V/div)
OUT
VS
VS
Time (8ms/div)
Time (10ms/div)
Figure 7.
Figure 8.
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): TMP302A TMP302B TMP302C TMP302D
5
TMP302A, TMP302B
TMP302C, TMP302D
SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009................................................................................................................................................ www.ti.com
APPLICATION INFORMATION
The TMP302 temperature switch is optimal for
ultralow-power battery applications that require
accurate trip thresholds. The trip thresholds are
programmable to four different settings using the
TRIPSET1 and TRIPSET0 pins. Table 1 shows the pin
settings versus trip points.
Table 1. Trip Point vs TRIPSET1 and TRIPSET0
TRIPSET1
TRIPSET0
TMP302A
TMP302B
TMP302C
TMP302D
GND
GND
+50°C
+70°C
+90°C
+110°C
GND
VS
+55°C
+75°C
+95°C
+115°C
VS
GND
+60°C
+80°C
+100°C
+120°C
VS
VS
+65°C
+85°C
+105°C
+125°C
The typical thermal response time for the TMP302 is
about 250ms. This period is the minimum time frame
that it takes for the open-drain output (OUT) to
change its state from low to high (or vice-versa) while
the device is active. A maximum low output voltage is
defined as a voltage level equivalent to 0.2 × VS;
likewise, a minimum high output voltage is defined as
0.8 × VS. It is important to note that an exception to
the nominal 250ms response time occurs on power
up—in this case, it is possible to achieve a thermal
response in as little as 35ms.
HYSTSET
If the temperature trip threshold is crossed, the
open-drain output (OUT) goes low and does not
return to its original high state (that is, VS) until the
temperature returns to a value within a hysteresis
window set by the HYSTSET pin. The HYSTSET pin
allows the user to choose between a +5°C and a
+10°C hysteresis window. Table 2 shows the
hysteresis window that corresponds to the HYSTSET
setting.
Table 2. HYSTSET Window
HYSTSET
THRESHOLD HYSTERESIS
GND
+5°C
VS
+10°C
For the specific case of the TMP302A, if the HYSTSET
pin is set to +10°C (that is, connected to VS) and the
device is configured with a +60°C trip point (TRIPSET1
= VS, TRIPSET0 = GND), once this threshold is
exceeded the output does not return to its original
high state until it reaches +50°C. This case is more
clearly illustrated in Figure 9.
OUT
CONFIGURING THE TMP302
The TMP302 is simple to configure. The only external
components that it requires are a bypass capacitor
and pull-up resistor. Power-supply bypassing is
strongly recommended; use a 0.1µF capacitor placed
as close as possible to the supply pin. To minimize
the internal power dissipation of the TMP302, use a
pull-up resistor value greater than 10kΩ from OUT to
VS. Refer to Table 1 for trip point temperature
configuration. The TRIPSET pins can be toggled
dynamically; however, the voltage of these pins must
not exceed VS. To ensure a proper logic high, the
voltage must not drop below 0.7V × VS.
VDD
+50°C
+60°C
TTRIP
Figure 9. TMP302A; HYSTSET = VS; TRIPSET1 = VS,
TRIPSET0 = GND
6
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TMP302A TMP302B TMP302C TMP302D
PACKAGE OPTION ADDENDUM
www.ti.com
17-Sep-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TMP302ADRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302ADRLT
ACTIVE
SOT
DRL
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302BDRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302BDRLT
ACTIVE
SOT
DRL
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302CDRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302CDRLT
ACTIVE
SOT
DRL
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302DDRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP302DDRLT
ACTIVE
SOT
DRL
6
250
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Sep-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TMP302ADRLR
SOT
DRL
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
4000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302ADRLT
SOT
DRL
6
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302BDRLR
SOT
DRL
6
4000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302BDRLT
SOT
DRL
6
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302CDRLR
SOT
DRL
6
4000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302DDRLR
SOT
DRL
6
4000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP302DDRLT
SOT
DRL
6
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Sep-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP302ADRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TMP302ADRLT
SOT
DRL
6
250
202.0
201.0
28.0
TMP302BDRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TMP302BDRLT
SOT
DRL
6
250
202.0
201.0
28.0
TMP302CDRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TMP302DDRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TMP302DDRLT
SOT
DRL
6
250
202.0
201.0
28.0
Pack Materials-Page 2
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