Data sheet acquired from Harris Semiconductor SCHS285A – Revised November 1999 The CD54/74AC540, -541, and CD54/74ACT540, -541 octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT540 are inverting 3-state buffers having two active-LOW output enables. The CD54/74AC/ACT541 are non-inverting 3-state buffers having two active-LOW output enables. The CD74AC540, -541, and CD74ACT540, -541 are supplied in 20-lead dual-in-line plastic packages (E suffix) and in 20-lead dual-in-line small-outline plastic packages (M suffix). Both package types are operable over the following temperature ranges: Industrial (–40 to +85°C) and Extended Industrial/Military (–55 to +125°C). The CD54AC540, -541, and CD54ACT540, -541, available in chip form (H suffix), are operable over the –55 to +125°C temperature range. L H Z Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MAXIMUM RATINGS, Absolute-Maximum Values: DC SUPPLY-VOLTAGE (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 to 6 V DC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA DC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC VCC OR GROUND CURRENT (ICC or IGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA* PACKAGE THERMAL IMPEDANCE, θJA (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to +150°C LEAD TEMPERATURE (DURING SOLDERING): At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°C Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . +300°C * For up to 4 outputs per device: add ±25 mA for each additional output. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54AC541F3A ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54ACT540F3A ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD54ACT541F3A ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC CD74AC540M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC540ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74AC541EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74AC541M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541ME4 ACTIVE SOIC DW 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541SM OBSOLETE SSOP DB 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541SM96 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC541SM96E4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT540E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74ACT540M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT540M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT540M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT540ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT541E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74ACT541EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74ACT541M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT541M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT541M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT541ME4 ACTIVE SOIC DW 20 CU NIPDAU Level-1-260C-UNLIM CD74ACT541SM OBSOLETE SSOP DB 20 CD74ACT541SM96 ACTIVE SSOP DB 20 25 25 Green (RoHS & no Sb/Br) TBD 2000 Green (RoHS & Addendum-Page 1 Call TI CU NIPDAU Call TI Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status (1) Package Type Package Drawing CD74ACT541SM96E4 ACTIVE SSOP DB Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. 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