HD74HC83 4-Bit Binary Full Adder (with Fast Carry) Description This improved full adder performs the addition of two 4-bit binary numbers. The sum ( ) output are provided for each bit and the resultant carry (C4) is obtained from the fourth bit. This adder features full internal look ahead across all four bit generating the carry term in ten nanoseconds typically. This provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation. Features • • • • • High Speed Operation: tpd (Ai or Bi to Zi ) = 16 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) HD74HC83 Function Table Outputs Inputs When C0 = L/When C2 = L When C0 = H/When C2 = H A1/A3 B1/B3 A2/A4 B2/B4 ∑1/∑3 ∑2/∑4 C2/C4 ∑1/∑3 ∑2/∑4 C2/C4 L L L L L L L H L L H L L L H L L L H L L H L L H L L L H L H H L L L H L H H L L L H L L H L H H L H L H L H H L L L H L H H L H H L L L H H H H L L L H H L H L L L H L H L H H L H L L H H H L L L H L H L H H H L L L H H H L H L L H H L H L L H H L L H H L H H L H H H L H L H H L H H H H L H L H H H H H H L H H H H H H : L : X : Note: 2 High level Low level Irrelevant Input conditions at A 1, B1, A2, B2 and C 0 are used to determine outputs ∑1 and ∑2 and the value of the internal carry C2. The value at C 2, A3, B3, A4 and B4 are than used to determine outputs ∑3, ∑4 and C 4 HD74HC83 Pin Arrangement A4 1 16 B4 B4 Σ4 15 Σ4 A3 C4 14 C4 B3 C0 13 C0 Σ3 2 A4 Σ3 A3 3 B3 4 VCC 5 12 GND Σ2 6 Σ2 B2 7 B2 A2 B1 11 B1 A1 Σ1 10 A1 9 Σ1 A2 8 (Top view) 3 HD74HC83 Block Diagram (1//2) C4 B4 A4 Σ4 B3 A3 Σ3 B2 A2 Σ2 B1 A1 C0 4 Σ1 HD74HC83 DC Characteristics Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — 2.0 — — 0.5 — 0.5 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 1.9 2.0 — 1.9 — 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — I OH = –4 mA 6.0 5.68 — — 5.63 — I OH = –5.2 mA 2.0 — 0.0 0.1 — 0.1 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 I OL = 4 mA 6.0 — — 0.26 — 0.33 I OL = 5.2 mA VIL Output voltage VOH VOL Test Conditions V V V Vin = VIH or VIL I OH = –20 µA Vin = VIH or VIL I OL = 20 µA Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply current I CC 6.0 — — 4.0 40 µA Vin = VCC or GND, Iout = 0 µA — 5 HD74HC83 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C VCC (V) Min Typ Max Min Max Unit Test Conditions Propagation delay t PLH 2.0 — — 150 — 190 ns C0 to ∑i time 4.5 — 19 30 — 38 6.0 — — 26 — 33 t PLH 2.0 — — 150 — 190 ns Ai or Bi to ∑i t PHL 4.5 — 16 30 — 38 6.0 — — 26 — 33 t PLH 2.0 — — 150 — 190 ns C0 to C4 t PHL 4.5 — 17 30 — 38 6.0 — — 26 — 33 t PLH 2.0 — — 150 — 190 ns Ai or Bi to C4 t PHL 4.5 — 18 30 — 38 6.0 — — 26 — 33 Item Symbol t PHL Output rise/fall t TLH 2.0 — — 75 — 95 time t THL 4.5 — 5 15 — 19 6.0 — — 13 — 16 — — 5 10 — 10 Input capacitance 6 Cin ns pF Unit: mm 19.20 20.00 Max 1 7.40 Max 9 6.30 16 8 1.3 0.48 ± 0.10 2.54 Min 5.06 Max 2.54 ± 0.25 0.51 Min 1.11 Max 7.62 + 0.13 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Weight (reference value) DP-16 Conforms Conforms 1.07 g Unit: mm 10.06 10.5 Max 9 1 8 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 16 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA — Conforms 0.24 g Unit: mm 9.9 10.3 Max 9 1 8 0.635 Max *0.42 ± 0.08 0.40 ± 0.06 0.15 *0.22 ± 0.03 0.20 ± 0.03 1.27 0.11 0.14 +– 0.04 1.75 Max 3.95 16 0.10 6.10 +– 0.30 1.08 0° – 8° 0.67 0.60 +– 0.20 0.25 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DN Conforms Conforms 0.15 g Cautions 1. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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