TI SN74AUC32245ZKER

SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
FEATURES
•
•
•
•
Member of the Texas Instruments Widebus+™
Family
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
•
•
•
•
•
Max tpd of 2 ns at 1.8 V
Low Power Consumption, 40-µA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This 32-bit noninverting bus transceiver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for
1.65-V to 1.95-V VCC operation.
The SN74AUC32245 is designed for asynchronous communication between data buses. The control-function
implementation minimizes external timing requirements.
This device can be used as four 8-bit transceivers, two 16-bit transceivers, or one 32-bit transceiver. It allows
data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses
are effectively isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
LFBGA – GKE
Tape and reel
ORDERABLE PART NUMBER
SN74AUC32245GKER
TOP-SIDE MARKING
MM245
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated
SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
GKE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
TERMINAL ASSIGNMENTS
2
1
2
3
4
5
6
A
1B2
1B1
B
1B4
1B3
1DIR
1OE
1A1
1A2
GND
GND
1A3
C
1B6
1A4
1B5
VCC
VCC
1A5
D
1A6
1B8
1B7
GND
GND
1A7
1A8
E
2B2
2B1
GND
GND
2A1
2A2
F
2B4
2B3
VCC
VCC
2A3
2A4
G
2B6
2B5
GND
GND
2A5
2A6
H
2B7
2B8
2DIR
2OE
2A8
2A7
J
3B2
3B1
3DIR
3OE
3A1
3A2
K
3B4
3B3
GND
GND
3A3
3A4
L
3B6
3B5
VCC
VCC
3A5
3A6
M
3B8
3B7
GND
GND
3A7
3A8
N
4B2
4B1
GND
GND
4A1
4A2
P
4B4
4B3
VCC
VCC
4A3
4A4
R
4B6
4B5
GND
GND
4A5
4A6
T
4B7
4B8
4DIR
4OE
4A8
4A7
SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
FUNCTION TABLE
(EACH 8-BIT SECTION)
INPUTS
OPERATION
OE DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
A3
2DIR
A4
1A1
H4
1OE
A5
2A1
A2
H3
E5
E2
1B1
To Seven Other Channels
3DIR
J3
4DIR
T4
4A1
J2
T3
3OE
J5
To Seven Other Channels
2B1
To Seven Other Channels
J4
3A1
2OE
4OE
N5
N2
3B1
4B1
To Seven Other Channels
3
SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
–0.5
3.6
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Output voltage range (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal
Tstg
Storage temperature range
(1)
(2)
(3)
impedance (3)
–65
V
40
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
MIN
MAX
0.8
2.7
Low-level input voltage
VI
Input voltage
0.65 × VCC
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
4
V
1.7
0
0.35 × VCC
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VO
V
VCC
VCC = 0.8 V
VIL
UNIT
V
0.7
0
3.6
Active state
0
VCC
3-state
0
3.6
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC = 1.4 V
–5
VCC = 1.65 V
–8
VCC = 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
9
–40
V
V
mA
mA
5
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VOL
MIN TYP (1) MAX
VCC
IOH = –100 µA
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 µA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
IOL = 9 mA
2.3 V
0.6
UNIT
VCC – 0.1
0.55
V
0.2
0.25
V
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
IOZ (2)
VO = VCC or GND
2.7 V
±10
µA
ICC
VI = VCC or GND,
40
µA
Ci
VI = VCC or GND
2.5 V
3
pF
Cio
VO = VCC or GND
2.5 V
7
pF
II
(1)
(2)
All inputs
IO = 0
0.8 V to 2.7 V
All typical values are at TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
MIN
MAX
MIN
TYP
MAX
MIN
MAX
tpd
A or B
B or A
5.6
0.5
3.1
0.5
2
0.5
1.5
2
0.4
1.9
ns
ten
OE
A or B
10
0.7
4.6
0.7
3.1
0.7
2.1
3.1
0.7
2.6
ns
tdis
OE
A or B
12.8
0.8
6.8
0.8
5
0.8
3.4
4.8
0.5
2.9
ns
PARAMETER
UNIT
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power
dissipation
capacitance
Outputs
enabled
Outputs
disabled
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
22
23
24
25
29
1
1
1
1
1
f = 10 MHz
UNIT
pF
5
SN74AUC32245
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES410C – AUGUST 2002 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
GND
CL
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
Open
RL
LOAD CIRCUIT
VCC
CL
RL
V∆
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tw
tsu
th
VCC
VCC/2
Input
VCC/2
VCC
VCC/2
Data Input
VCC/2
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VCC/2
VCC/2
VOL
tPHL
VOH
Output
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLZ
VCC
VCC/2
tPZH
VCC/2
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VCC/2
VCC/2
tPZL
VOH
Output
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VCC/2
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
11-Sep-2007
PACKAGING INFORMATION
Status (1)
Package
Type
Package
Drawing
SN74AUC32245GKER
NRND
LFBGA
GKE
96
1000
SN74AUC32245ZKER
ACTIVE
LFBGA
ZKE
96
1000 Green (RoHS &
no Sb/Br)
Orderable Device
Pins Package Eco Plan (2)
Qty
TBD
Lead/Ball Finish
MSL Peak Temp (3)
SNPB
Level-3-220C-168 HR
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AUC32245GKER
GKE
96
SITE 32
330
24
5.7
13.7
2.0
8
24
Q1
SN74AUC32245ZKER
ZKE
96
SITE 32
330
24
5.7
13.7
2.0
8
24
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74AUC32245GKER
GKE
96
SITE 32
346.0
346.0
41.0
SN74AUC32245ZKER
ZKE
96
SITE 32
346.0
346.0
41.0
Pack Materials-Page 2
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