HMC265LM3 v01.1201 MICROWAVE CORPORATION GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Typical Applications Features The HMC265LM3 is ideal for: Integrated LO Amplifier: -4 dBm Input • 20 and 31 GHz Microwave Radios Sub-Harmonically Pumped (x2) LO • Downconverter for Point to Point Radios High 2LO/RF Isolation: > 28 dB • LMDS and SATCOM LM3 SMT Package Functional Diagram General Description The HMC265LM3 is a 20 - 31 GHz surface mount sub-harmonically pumped (x2) MMIC mixer downconverter with integrated LO and IF amplifiers in a SMT leadless chip carrier package. The 2LO to RF and IF isolations are an excellent 28 to 47 dB, eliminating the need for additional filtering. The LO amplifier is a single bias (+3V to +4V) two stage design with only -4 dBm drive requirement. All data is with the non-hermetic, epoxy sealed LM3 packaged device mounted in a 50 ohm test fixture. Utilizing the HMC265LM3 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. MIXERS - SMT 12 Electrical Specifications, TA = +25° C, As a Function of Vdd Parameter IF = 2 GHz LO = -4 dBm & Vdd = +4V IF = 2 GHz LO = -4 dBm & Vdd = +4V IF = 2 GHz LO = -4 dBm & Vdd = +3V Min. Min. Min. Typ. Max. Typ. Max. Typ. Frequency Range, RF 20 - 31 27 - 30 21 - 30 GHz Frequency Range, LO 10 - 15.5 13.5 - 15 10.5 - 15 GHz Frequency Range, IF 0.7 - 3 0.7 - 3 0.8 - 2.8 GHz 3 dB 13 dB Conversion Gain (RF to IF) -2 Noise Figure (SSB) 3 0 13 4 -1 13 2LO to RF Isolation 21 28 28 35 20 28 dB 2LO to IF Isolation 39 47 40 48 38 47 dB IP3 (Input) 2 8 6 10 2 8 dBm 1 dB Compression (Input) -1 +2 0 +3 0 dBm 50 40 mA Supply Current (Idd) 50 *Unless otherwise noted, all measurements performed as downconverter, IF= 2 GHz. 12 - 94 Units Max. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com HMC265LM3 v01.1201 MICROWAVE CORPORATION GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Conversion Gain vs. Temperature @ LO = -4 dBm, Vdd= +3V 10 10 5 5 0 -5 -10 +25C -40C +85C -15 -20 0 -5 -10 +25C -40C +85C -15 -20 18 20 22 24 26 28 30 32 34 18 20 22 24 RF FREQUENCY (GHz) Conversion Gain vs. LO Drive @ Vdd = +4V 30 32 34 10 5 0 dBm -4 dBm 5 CONVERSION GAIN (dB) CONVERSION GAIN (dB) 28 Conversion Gain vs. LO Drive @ Vdd = +3V 10 0 -8 dBm -5 -6 dBm -10 -2 dBm -15 -20 -4 dBm 0 dBm 0 -8 dBm -5 -6 dBm -10 -2 dBm -15 12 -20 18 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 24 26 28 30 32 34 RF FREQUENCY (GHz) Isolation @ LO = -4 dBm, Vdd = +4V Isolation @ LO = -4 dBm, Vdd = +3V 10 10 LO/RF LO/RF 0 0 RF/IF -10 LO/IF ISOLATION (dB) -10 ISOLATION (dB) 26 RF FREQUENCY (GHz) MIXERS - SMT CONVERSION GAIN (dB) CONVERSION GAIN (dB) Conversion Gain vs. Temperature @ LO = -4 dBm, Vdd= +4V -20 -30 2LO/RF -40 -50 RF/IF LO/IF -20 -30 2LO/RF -40 -50 -60 2LO/IF -60 2LO/IF -70 -70 18 20 22 24 26 28 RF FREQUENCY (GHz) 30 32 34 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 95 HMC265LM3 v01.1201 MICROWAVE CORPORATION GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Input P1dB @ LO = -4 dBm, Vdd = +4V Input IP3 vs. LO Drive @ Vdd = +4V * 5 20 4 -2 dBm 3 INPUT P1dB (dBm) INPUT IP3 (dBm) 16 12 8 2 1 0 -1 -2 -6 dBm 4 -3 -4 dBm -4 0 20 22 24 26 28 30 32 18 34 20 22 24 RF FREQUENCY (GHz) 26 28 30 34 IF Return Loss @ LO = -4 dBm, Vdd = +4V 0 -2 -4 -4 RETURN LOSS (dB) 0 -2 -6 -8 -10 -12 -14 -16 -6 -8 -10 -12 -14 -16 RF LO -18 -18 -20 -20 0 5 10 15 20 25 30 35 0 1 2 FREQUENCY (GHz) 3 4 IF FREQUENCY (GHz) IF Bandwidth @ LO = -4 dBm IF CONVERSION GAIN (dB) 10 5 0 -5 -10 Vdd = +3V Vdd = +4V -15 -20 0 1 2 3 4 5 6 IF FREQUENCY (GHz) * Two-tone input power = -10 dBm each tone, 1 MHz spacing. 12 - 96 32 RF FREQUENCY (GHz) RF & LO Return Loss @ LO = -4 dBm, Vdd = +4V RETURN LOSS (dB) MIXERS - SMT 12 -5 18 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 5 6 MICROWAVE CORPORATION HMC265LM3 v01.1201 GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Absolute Maximum Ratings RF / IF Input (Vdd = +5V) +13 dBm LO Drive (Vdd = +5V) +13 dBm Vdd 5.5V Continuous Pdiss (Ta = 85 °C) (derate 2.52 mW/°C above 85 °C) 227 mW Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C 12 MIXERS - SMT Outline Drawing NOTES: 1. MATERIAL: PLASTIC 2. PLATING: GOLD OVER NICKEL 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. ALL TOLERANCES ARE ± 0.005 [± 0.13]. 5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND. 6. • INDICATES PIN 1 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 97 MICROWAVE CORPORATION HMC265LM3 v01.1201 GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Pin Description Function Description 1, 2 N/C This pin may be connected to the housing ground or left unconnected. 3 Vdd Power supply for the LO Amplifier. An external RF bypass capacitor of 100 - 330 pF is required as close to the package as possible. 4 RF RF Port. This pin is AC coupled and matched to 50 Ohm from 20 - 30 GHz. 5 IF IF Port. This pin is AC coupled and matched to 50 Ohm from 0.7 - 3 GHz. 6 LO LO Port. This pin is AC coupled and matched to 50 Ohm from 10 - 15 GHz. 7 GND Must be soldered to PCB RF ground. Interface Schematic MIXERS - SMT 12 Pin Number 12 - 98 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION HMC265LM3 v01.1201 GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Evaluation PCB The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground (GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. MIXERS - SMT 12 Evaluation Circuit Board Layout Design Details Layout Technique Micro Strip to CPWG Material Rogers 4003 with 1/2 oz. Cu Dielectric Thickness 0.008” (0.20 mm) Microstrip Line Width 0.018” (0.46 mm) CPWG Line Width 0.016” (0.41 mm) CPWG Line to GND Gap 0.005” (0.13 mm) Ground Via Hole Diameter 0.008” (0.20 mm) C1 100 pF Capacitor, 0402 Pkg. LM3 package mounted to evaluation PCB For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 99 MICROWAVE CORPORATION v01.1201 HMC265LM3 GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz Suggested LM3-01 PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm) MIXERS - SMT 12 12 - 100 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION HMC265LM3 v01.1201 GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz HMC265LM3 Recommended SMT Attachment Technique Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. LM3 devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas. 200 0 175 150 125 100 75 50 25 0 1 2 3 4 5 TIME (min) 6 7 8 Static Sensitivity: Follow ESD precautions to protect against ESD strikes. General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended. Solder Paste Solder paste should be selected based on the user’s experience and be compatible with the metallization systems used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes. Solder Paste Application 12 MIXERS - SMT Follow these precautions to avoid permanent damage: 225 TEMPERATURE ( C) The HMC LM3 package was designed to be compatible with high volume surface mount PCB assembly processes. The LM3 package requires a specific mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB layout pattern can be found on each LM3 product data sheet. It can also be provided as an electronic drawing upon request from Hittite Sales & Application Engineering. Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies. Solder Reflow The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder reflow profile is suggested above. Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location of the device. Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of 235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C. Cleaning A water-based flux wash may be used. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 12 - 101