SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 FEATURES SN54LV138A . . . J OR W PACKAGE SN74LV138A . . . D, DB, DGV, NS OR PW PACKAGE (TOP VIEW) 2 16 15 3 14 4 13 5 12 6 11 7 10 8 9 • SN54LV138A . . . FK PACKAGE (TOP VIEW) VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 B C G2A G2B G1 Y7 1 16 B A NC VCC Y0 SN74LV138A . . . RGY PACKAGE (TOP VIEW) 2 15 3 4 14 13 5 12 6 11 10 7 8 9 C G2A NC G2B G1 Y0 Y1 Y2 Y3 Y4 Y5 4 3 2 1 20 19 18 5 6 17 16 7 8 15 14 9 10 11 12 13 Y1 Y2 NC Y3 Y4 Y7 GND NC Y6 Y5 1 • VCC A B C G2A G2B G1 Y7 GND Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Y6 • • A • 2-V to 5.5-V VCC Operation Max tpd of 9.5 ns at 5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 3.3 V, TA = 25°C Support Mixed-Mode Voltage Operation on All Ports GND • • • NC − No internal connection DESCRIPTION/ORDERING INFORMATION The 'LV138A devices are 3-line to 8-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY SN74LV138ARGYR Tube of 40 SN74LV138AD Reel of 2500 SN74LV138ADR SOP – NS Reel of 2000 SN74LV138ANSR 74LV138A SSOP – DB Reel of 2000 SN74LV138ADBR LV138A Tube of 90 SN74LV138APW Reel of 2000 SN74LV138APWR TSSOP – PW –55°C to 125°C (1) TOP-SIDE MARKING Reel of 1000 SOIC – D –40°C to 85°C ORDERABLE PART NUMBER LV138A LV138A LV138A Reel of 250 SN74LV138APWT TVSOP – DGV Reel of 2000 SN74LV138ADGVR LV138A CDIP – J Tube of 25 SNJ54LV138AJ SNJ54LV138AJ CFP – W Tube of 150 SNJ54LV138AW SNJ54LV138AW LCCC – FK Tube of 55 SNJ54LV138AFK SNJ54LV138AFK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2005, Texas Instruments Incorporated SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) These devices are designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible. The conditions at the binary-select inputs (A, B, C) and the three enable inputs (G1, G2A, G2B) select one of eight output lines. The two active-low (G2A, G2B) and one active-high (G1) enable inputs reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. FUNCTION TABLE 2 ENABLE INPUTS SELECT INPUTS G1 G2A G2B C B A Y0 Y1 Y20 OUTPUTS Y3 Y4 Y5 Y6 Y7 X H X X X X H H H H H H H H X X H X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 15 A 1 14 Select Inputs B 13 3 12 11 10 Enable Inputs 6 4 G2A G2B Y1 2 C G1 Y0 9 7 Y2 Y3 Data Outputs Y4 Y5 Y6 Y7 5 Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages. 3 SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V –0.5 7 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Output voltage range (2) (3) IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA Continuous current through VCC or GND D package (4) 73 DB package (4) θJA Package thermal impedance 82 DGV package (4) 120 NS package (4) 64 PW package (4) 108 RGY package (5) Tstg (1) (2) (3) (4) (5) 4 Storage temperature range V °C/W 39 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 5.5 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7 The package thermal impedance is calculated in accordance with JESD 51-5. SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 Recommended Operating Conditions (1) SN54LV138A (2) VCC Supply voltage VCC = 2 V VIH High-level input voltage MIN MAX 2 5.5 Low-level input voltage MIN MAX 2 5.5 1.5 1.5 VCC = 2.3 V to 2.7 V VCC × 0.7 VCC × 0.7 VCC = 3 V to 3.6 V VCC × 0.7 VCC × 0.7 VCC = 4.5 V to 5.5 V VCC × 0.7 VCC × 0.7 VCC = 2 V VIL SN74LV138A UNIT V V 0.5 0.5 VCC = 2.3 V to 2.7 V VCC × 0.3 VCC × 0.3 VCC = 3 V to 3.6 V VCC × 0.3 VCC × 0.3 VCC = 4.5 V to 5.5 V VCC × 0.3 VCC × 0.3 V VI Input voltage 0 5.5 0 5.5 VO Output voltage 0 VCC 0 VCC V –50 –50 µA VCC = 2.3 V to 2.7 V –2 –2 VCC = 3 V to 3.6 V –6 –6 –12 –12 50 50 2 2 VCC = 2 V IOH High-level output current VCC = 4.5 V to 5.5 V VCC = 2 V IOL Low-level output current ∆t/∆v Input transition rise or fall rate VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V 6 6 VCC = 4.5 V to 5.5 V 12 12 VCC = 2.3 V to 2.7 V 200 200 VCC = 3 V to 3.6 V 100 100 20 20 VCC = 4.5 V to 5.5 V TA (1) (2) Operating free-air temperature –55 125 –40 85 V mA µA mA ns/V °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Product Preview Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS IOH = –50 µA 2 V to 5.5 V IOH = –2 mA 2.3 V IOH = –6 mA IOH = –12 mA VOL SN54LV138A (1) MIN SN74LV138A TYP MAX MIN VCC – 0.1 VCC – 0.1 2 2 3V 2.48 2.48 4.5 V 3.8 TYP MAX 3.8 2 V to 5.5 V 0.1 0.1 IOL = 2 mA 2.3 V 0.4 0.4 IOL = 6 mA 3V 0.44 0.44 4.5 V II VI = 5.5 V or GND ICC VI = VCC or GND, Ioff VI or VO = 0 to 5.5 V Ci VI = VCC or GND IO = 0 UNIT V IOL = 50 µA IOL = 12 mA (1) VCC V 0.55 0.55 0 to 5.5 V ±1 ±1 µA 5.5 V 20 20 µA 0 5 5 µA 3.3 V 2.1 2.1 pF Product Preview 5 SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 Switching Characteristics over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE MAX MIN MAX MIN MAX A, B, or C 11.7 (2) 17.6 (2) 1 (2) 21 (2) 1 21 G1 12.3 (2) 19.2 (2) 1 (2) 22 (2) 1 22 11.4 (2) 18.2 (2) 1 (2) 21 (2) 1 21 14.9 21.4 1 25 1 25 15.7 22.6 1 26 1 26 14.8 22 1 25 1 25 CL = 15 pF A, B, or C G1 Y CL = 50 pF G2A or G2B (1) (2) SN74LV138A TYP Y MIN G2A or G2B tpd SN54LV138A (1) TA = 25°C UNIT ns ns Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. Switching Characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tpd tpd FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE SN74LV138A TYP MAX MIN MAX MIN MAX A, B, or C 8.1 (2) 11.4 (2) 1 (2) 13.5 (2) 1 13.5 G1 8.4 (2) 12.8 (2) 1 (2) 15 (2) 1 15 G2A or G2B 7.8 (2) 11.4 (2) 1 (2) 13.5 (2) 1 13.5 A, B, or C 10.3 15.8 1 18 1 18 10.6 16.3 1 18.5 1 18.5 10 14.9 1 17 1 17 Y G1 Y MIN CL = 15 pF CL = 50 pF G2A or G2B (1) (2) SN54LV138A (1) TA = 25°C UNIT ns ns Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. Switching Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE MAX MIN MAX MIN MAX A, B, or C 5.6 (2) 8.1 (2) 1 (2) 9.5 (2) 1 9.5 G1 5.7 (2) 8.1 (2) 1 (2) 9.5 (2) 1 9.5 5.4 (2) 8.1 (2) 1 (2) 9.5 (2) 1 9.5 7 10.1 1 11.5 1 11.5 7.1 10.1 1 11.5 1 11.5 6.8 10.1 1 11.5 1 11.5 Y CL = 15 pF A, B, or C G1 Y G2A or G2B (1) (2) CL = 50 pF MIN SN74LV138A TYP G2A or G2B tpd SN54LV138A (1) TA = 25°C UNIT ns ns Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. Operating Characteristics TA = 25°C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS CL = 50 pF, f = 10 MHz VCC TYP 3.3 V 16.8 5V 19.1 UNIT pF SN54LV138A, SN74LV138A 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS www.ti.com SCLS395L – APRIL 1998 – REVISED AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test Test Point RL = 1 kΩ From Output Under Test CL (see Note A) S1 Open TEST GND CL (see Note A) LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS VCC 50% VCC Timing Input 0V tw tsu VCC 50% VCC Input 50% VCC th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC tPLH tPHL 50% VCC tPHL 50% VCC VOL VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V tPLZ ≈VCC Output Waveform 1 S1 at VCC (see Note B) 50% VCC tPZH tPLH 50% VCC 50% VCC tPZL VOH In-Phase Output Out-of-Phase Output 0V VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuits and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV138AD ACTIVE SOIC D 16 SN74LV138ADBR ACTIVE SSOP DB SN74LV138ADBRE4 ACTIVE SSOP SN74LV138ADBRG4 ACTIVE SN74LV138ADE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138APWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ARGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LV138ARGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.6 2.5 12.0 16.0 Q1 SN74LV138ADBR SSOP DB 16 2000 330.0 16.4 8.2 SN74LV138ADGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74LV138ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LV138ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LV138APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV138APWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LV138ARGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LV138ADBR SSOP DB 16 2000 346.0 346.0 33.0 SN74LV138ADGVR TVSOP DGV 16 2000 346.0 346.0 29.0 SN74LV138ADR SOIC D 16 2500 333.2 345.9 28.6 SN74LV138ANSR SO NS 16 2000 346.0 346.0 33.0 SN74LV138APWR TSSOP PW 16 2000 346.0 346.0 29.0 SN74LV138APWT TSSOP PW 16 250 346.0 346.0 29.0 SN74LV138ARGYR VQFN RGY 16 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated