TI SN74BCT2241DW

SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
D
D
D
D
D
DW, N OR NS PACKAGE
(TOP VIEW)
Operating Voltage Range of 4.5 V to 5.5 V
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
Output Ports Have Equivalent 33-Ω Series
Resistors, So No External Resistors Are
Required
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
This SN74BCT2241 is designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the
’BCT2240 and ’BCT2244 devices, this device provides the choice of selected combinations of inverting and
noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE
inputs. This device features high fan-out and improved fan-in.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking/current-sourcing capability of the driver.
The outputs, which are designed to source or sink up to 12 mA, include 33-Ω series resistors to reduce overshoot
and undershoot.
ORDERING INFORMATION
PDIP – N
0°C to 70°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC – DW
Tube
SN74BCT2241N
Tube
SN74BCT2241DW
Tape and reel
SN74BCT2241DWR
TOP-SIDE
MARKING
SN74BCT2241N
BCT2241
SOP – NS
Tape and reel
SN74BCT2241NSR
BCT2241
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLES
INPUTS
1OE
1A
OUTPUT
1Y
L
H
H
L
L
L
H
X
Z
INPUTS
2OE
2A
OUTPUT
2Y
H
H
H
H
L
L
L
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
2
18
4
16
6
14
8
12
1Y1
1Y2
1Y3
1Y4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
schematic of Y outputs
VCC
Output
GND
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC
Input clamp current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
NOM
MAX
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
V
Input clamp current
–18
mA
IOH
IOL
High-level output current
–12
mA
Low-level output current
12
mA
High-level input voltage
2
V
V
TA
Operating free-air temperature
0
70
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
MIN
II = –18 mA
IOH = –1 mA
VCC = 4
4.5
5V
2.4
IOH = –12 mA
IOH = –3 mA
VCC = 4.75 V,
TYP†
MAX
UNIT
–1.2
V
3.3
V
2
2.7
VOL
VCC = 4
4.5
5V
IOL = 1 mA
IOL = 12 mA
0.15
0.5
0.42
0.8
II
VCC = 5.5 V,
VI = 7 V
0.1
IIH
IIL
VCC = 5.5 V,
VI = 2.7 V
20
µA
VCC = 5.5 V,
VI = 0.5 V
–1
mA
IOZH
VCC = 5.5 V,
VO = 2.7 V
50
µA
IOZL
IOS‡
VCC = 5.5 V,
VO = 0.5 V
VCC = 5.5 V,
VO = 0
ICCH
ICCL
VCC = 5.5 V,
VCC = 5.5 V,
Outputs open
Outputs open
ICCZ
Ci
VCC = 5.5 V,
VCC = 5 V,
Outputs open
VI = 2.5 V or 0.5 V
VCC = 5 V,
VO = 2.5 V or 0.5 V
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
mA
–50
µA
–225
mA
23
37
mA
48
76
mA
6
9
mA
–100
Co
V
6
pF
11
pF
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE or OE
Y
tPHZ
tPLZ
OE or OE
Y
PARAMETER
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 5 V,
TA = 25°C
MIN
MAX
4.4
1.1
4.9
4.9
6.6
2.9
6.9
2.7
6
7.8
2.7
8.9
4.1
7.7
9.4
4.1
10.3
2.5
5.2
7.2
2.5
8.7
3.2
7.1
9.5
3.2
11.3
MIN
TYP
MAX
1.1
3
2.9
UNIT
ns
ns
ns
SN74BCT2241
OCTAL BUFFER AND LINE/MOS DRIVER
WITH 3-STATE OUTPUTS
SCBS035D – SEPTEMBER 1988 – REVISED MARCH 2003
PARAMETER MEASUREMENT INFORMATION
7 V (tPZL, tPLZ, O.C.)
S1
Open
(all others)
From Output
Under Test
Test
Point
CL
(see Note A)
R1
From Output
Under Test
R1
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
RL = R1 = R2
LOAD CIRCUIT FOR
3-STATE AND OPEN-COLLECTOR OUTPUTS
High-Level
Pulse
(see Note B)
3V
Timing Input
(see Note B)
3V
1.5 V
1.5 V
0V
1.5 V
tw
0V
Data Input
(see Note B)
3V
th
tsu
Low-Level
Pulse
3V
1.5 V
1.5 V
0V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
3V
Input
(see Note B)
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
(see Note D)
VOH
1.5 V
1.5 V
VOL
VOH
1.5 V
1.5 V
0V
tPLZ
1.5 V
Waveform 1
(see Notes C and D)
3.5 V
VOL
tPHZ
tPLH
1.5 V
1.5 V
tPZL
tPHL
tPHL
Out-of-Phase
Output
(see Note D)
Output
Control
(low-level enable)
0.3 V
tPZH
Waveform 2
(see Notes C and D)
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (see Note D)
VOH
1.5 V
0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2.5 ns, duty cycle = 50%.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
E. When measuring propagation delay times of 3-state outputs, switch S1 is open.
F. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74BCT2241DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT2241NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT2241NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2241NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
24-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74BCT2241DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74BCT2241NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74BCT2241DWR
DW
20
MLA
333.2
333.2
31.75
SN74BCT2241NSR
NS
20
MLA
333.2
333.2
31.75
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated