SP0103BE3
“Zero Height” Amplified SiSonic™ Microphone Specification
Knowles Acoustics
1151 Maplewood Drive
Itasca, IL 60143
Knowles Acoustics, a division of Knowles
Electronics, LLC.
Revision: A
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SP0103BE3
1. DESCRIPTION AND APPLICATION
1.1 Description
Zero Height Amplified Surface Mount Silicon Microphone
1.2 Application
Hand held telecommunication devices
2. PART MARKING
Identification Number Convention
Identification
Number
S
1
2
4
5
6
3
S: Manufacturing Location
“S” – Knowles Electronics Suzhou
Suzhou, China
“No Alpha Character” – Knowles Electronics Itasca
Itasca, IL USA
Pin 1
“E” – Engineering Samples
Digits 1 – 6: Job Identification Number
3. TEMPERATURE RANGE
3.1 Operating Temperature Range: -40°C to +100°C
3.2 Storage Temperature Range:
-40°C to +100°C
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Electronics, LLC.
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SP0103BE3
4. ACOUSTIC & ELECTRICAL SPECIFICATIONS
Limits
Symbol
Directivity
Condition
Unit
Min.
Nom.
Max.
Omni-directional
Sensitivity
S
@ 1kHz (0dB=1V/Pa)
-26
-22
-18
dB
Output impedance
ZOUT
@ 1kHz (0dB=1V/Pa)
n/a
n/a
100
Ω
Current Consumption
IDSS
across 1.5 to 5.5 volts
0.100
n/a
0.350
mA
Signal to Noise Ratio
S/N
@ 1kHz (0dB=1V/Pa)
55
59
n/a
dB
Supply Voltage
Vs
1.5
n/a
5.5
V
Typical Input Referred
Noise
ENL
n/a
35
n/a
dBA SPL
Sensitivity Loss across
Voltage
Maximum Input Sound
Level
A-weighted
Change in sensitivity over 5.5v
to 1.5v
No Change Across Voltage
Range
At 100dB SPL, THD < 1%
At 115dB SPL, THD = < 10%
Contact Resistance
dB
dB
100
Ohms
5. FREQUENCY RESPONSE CURVE
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Electronics, LLC.
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SP0103BE3
6. MECHANICAL SPECIFICATIONS
Item
Dim.
Tol.
(+/-)
Units
Height
1.65
+0.20
-0.10
mm
Length
6.15
0.10
mm
Width
3.76
0.10
mm
Weight
0.09
Coplanarity
< 0.1
grams
mm
Side View
Top View
Pin Output
Pin #
Function
1
Output
2
Gain Control
3
Ground
4
Power
Bottom View
(Note: Tolerance +/-0.15mm unless otherwise specified)
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Electronics, LLC.
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SP0103BE3
7. RECOMMENDED CUSTOMER LAND PATTERN
*
* Note: Minimum PCB Hole Diameter: 1.02 mm
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SP0103BE3
8. RECOMMENDED SOLDER STENCIL PATTERN
Notes:
•
The design requires that an acoustic seal be established between the SiSonic and customer PCB. This
is accomplished via a solder seal.
•
Solder Stencil Thickness = 0.127 min to 0.178 max
•
Stencil Material = Stainless Steel
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Electronics, LLC.
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SP0103BE3
9. RECOMMENDED INTERFACE CIRCUIT
V+
Term 4 = Vdd
Vout
Term 1 = Output
R1 = 22kΩ
R2 = 2.4kΩ
Term 3 = Ground
Term 2 = Gain Control
R3 (set by customer)
C1 (set by customer)
Desired Gain
Pin 2 Termination Method
Unity Gain (0dB)
Tie Terminal 2 directly to Output (Terminal 1).
20dB Gain
Tie Terminal 2 through C1 (0.47uF) to Ground.
Adjustable Gain
Add R3 and C1. Use formulas provided to calculate
settings, or contact Knowles for support.
Setting Gain Formulas:
Gain of non-inverting Op-Amp is determined as:
G=1+ {R1 / (R2 + R3)}
Gain(dB) = 20 * log(G)
High-pass-filter Corner Frequency:
C.F. = 1 / {2* p*(R2 + R3) * C1}
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Electronics, LLC.
Revision: A
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SP0103BE3
10. PACKAGING DETAIL
Pin 1 Location
Model Number
Suffix
Reel
Diameter
Qty per
Reel
SP0103BE3
-5
7”
900
SP0103BE3
-4
13”
3,600
Tape & Reel
Available in 13” and 7” diameter.
Leader
Length
800mm or minimum of 100 empty
pockets
Label
Label applied to external package
and direct to reel. Per JEDEC.
Empty Units
No consecutive empty pockets; No
more than 3 empty pockets per reel.
(Does not include empty pockets for
leader/follower)
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Electronics, LLC.
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SP0103BE3
11. SOLDER REFLOW PROFILE
Notes:
1.
Maximum condition = 260 C for 30
seconds.
2.
Do not pull a vacuum over the port
hole of the microphone. Pulling a
vacuum over the port hole can
damage the device.
3.
Do not board wash after the reflow
process. Board washing and
cleaning agents can damage the
device. Do not expose to ultrasonic
processing or cleaning.
4.
Number of Reflow = recommend no
more than 2 cycles.
12. ADDITIONAL NOTES
(A)
(B)
(C)
Packaging (reference SiSonic_Packaging_Spec.pdf)
Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened
moisture sensitivity bag under environmental conditions of 30ºC, 60% R.H.
Exposure: Devices should not be exposed to high humidity, high temperature environment.
Customer should follow standard baking times as stated in JEDEC J-STD -033A, reference
Class 2A.
Out of bag: 90 days out of ESD moisture sensitive bag, assuming 30C/60% RH as
maximum.
Baking Condition: After 90 days, refer to JEDEC J-STD-033A for recommend baking times
and temperatures.
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Electronics, LLC.
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SP0103BE3
13. RELIABILITY SPECIFICATIONS
Note: After test conditions are performed, the sensitivity of the microphone shall not deviate more
than 3dB from its initial value.
Test
Description
Thermal Shock
Microphone unit must operate when exposed to air-to-air thermal shock 100 cycles,
from –40ºC to +125ºC. (IEC 68-2-4),
High Temperature Storage
Test
Microphone unit must maintain sensitivity after storage at +105ºC for 1,000 hours. (IEC
68-2-2 Test Ba)
Low Temperature Storage
Test
Microphone unit must maintain sensitivity after storage at –40ºC for 1,000 hours. (IEC
68-2-1 Test Aa)
High Temperature Operating
Test
Microphone unit must operate within sensitivity specifications for 1,000 hours at 105ºC.
(IEC 68-2-2 Test Ba)
Low Temperature Operating
Test
Microphone unit must operate within sensitivity specifications for 1,000 hours at –40ºC.
(IEC 68-2-1 Test Aa)
Humidity Test
Tested under Bias at 85ºC/85% R.H. for 1,000 hours. (JESD22-A101A-B)
Vibration Test
Microphone unit must operate under test condition: 4 cycles, from 20 to 2,000 Hz in
each direction (x,y,z), 48 minutes, using peak acceleration of 20 G (+20%, -0%). (MIL
883E, method 2007.2, A)
Electrostatic Discharge
Tested to 8kV direct contact discharge or 15kV air discharge as specified by IEC 10004-2, level 3 and level 4.
Reflow
Microphone is tested to 5 passes through reflow oven, with microphone mounted
upside-down under conditions of 260ºC for 30 seconds maximum.
Mechanical Shock
Microphone must operate after exposure to shock test of 10,000 G per IEC 68-2-27, Ea.
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Electronics, LLC.
Revision: A
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SP0103BE3
14. SPECIFICATION REVISIONS
Revision
Detailed Specification Changes
Date
A
Initial Release
12-01-04
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Electronics, LLC.
Revision: A
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