TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME M1E/M1D-95 DUAL TONE WIRELESS DOOR BELL 遥控门铃 IC FEATURES 功能叙述 M1D-95 D2 WEST MINISTER D1 DING DING D0 DING DONG • 3 door chime sound. APPLICATION 产品应用 • Door bell system. 门铃系统. ELECTRICAL CHARACTERISTICS 电气规格 Characteristics 工作电压 Operating Voltage Sym. ( @VDD=4.5V unless otherwise specified ) VDD Min. 2.4 Typ. 4.5 Max. 5 Unit V 工作电流 Operating Current IOP ─ 0.3 1 mA No load 静态电流 Quiescent Current 推动电流 Driving Current ISB ─ 1 1 10 ─ @ VDS=1.2V 振荡频率 Oscillator Frequency 工作温度 Operating Temperature FOSC ─ 80 μA mA KHz External±30% IOL ─ 0 Temp. 25 ─ 60 REMARKS ℃ APPLICATION DIAGRAM 参考电路图 M1E A0 1 VDD 18 M1D-95 IR / RF A0 VDD IR / RF 16 DO A1 A1 A2 X A3 Y A4 Rosc A5 A6 D2 A6 A7 D1 A7 Rosc VDD DIN A4 D3 10 X A3 TE 9 Y A2 A5 VSS 1 OUT 1K VSS 8 9 D0 * Rosc ~ M1E : 270KΩ; M1D-95 : 390KΩ * All specs and applications shown above subject to change without prior notice. ( 以上电路及规格仅供参考,本公司得径行修正 ) 1/3 2004-10-06 TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME M1E/M1D-95 DUAL TONE WIRELESS DOOR BELL 遥控门铃 IC APPLICATION DIAGRAM 参考电路图 CHIP FORM VDD A0 IR / RF A1 DO Y A2 A3 Rosc M1E A4 1.74 x 1.74 mm2 底=VDD A5 SOUND D2 WEST MINISTER D1 DING DONG D0 DING DONG X TE A6 D3 A7 D2 VSS D1 D0 VDD Rosc Y IR / RF A0 A1 A2 A3 A4 X M1D-95 DIN 2.00 x1.39 mm2 底=VDD VDD A5 OUT A6 1K VSS A7 * Rosc ~ M1E : 270KΩ; M1D-95 : 390KΩ *All specs and applications shown above subject to change without prior notice. ( 以上电路及规格仅供参考,本公司得径行修正 ) 2/3 2004-10-06 TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. DOOR CHIME M1E/M1D-95 DUAL TONE WIRELESS DOOR BELL 遥控门铃 IC ASSIGNMENT & POSITION 5 6 7 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 8 (M1D-95) 4 9 Y X ( 0,0 ) 3 2 10 1 16 15 14 13 12 11 NAME A0 VDD TEST3 OSC2 OSC1 DIM BZ TEST VSS A7 A6 A5 A4 A3 A2 A1 X -561 -560.25 -562.5 -560.25 -317.25 -163.5 559.5 559.5 559.5 559.5 559.5 379.5 198.75 23.25 -150 -325.5 UNIT : um Y -870 -723.75 -585.75 537 870 869.25 869.25 636.75 480 717.75 -872 -867.75 -867.75 -868.5 -867.75 -868.5 * CHIP SIZE ~ 2.00 x 1.39 mm2 * IC substrate should be connected to VDD in PCB (PCB 上 IC 必须接 VDD) 3/3 2004-10-06 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961