Modem SmartACFL V.90/K56flex/V.34/V.32bis Modem Device Sets with Microcontroller (L2702), Modem Data Pump (P9373), SmartDAA (20463), and Optional Voice Codec (20437) for Low Power Applications The Conexant SmartACFL V.90/K56flex Modem Device Set with SmartDAA technology supports analog data up to 56 Kbps, analog fax to 14.4 Kbps, telephone answering machine (TAM), V.80 synchronous access mode, onboard DSVD, voice/speakerphone (optional), and cellular/GSM operation. Serial, parallel, or PC Card host interface operation is supported depending on the selected model (Table 1). The modem supports ITU-T V.90/K56flex, V.34 and V.32bis data modulations and is designed to operate with dial-up telephone lines in the U.S. and worldwide. PC Card and parallel host interface models also support analog cellular direct connect and GSM direct connect. Low profile, small TQFP packages and low voltage operation with low power consumption make this device set ideal for laptop, notebook, and palmtop applications using the parallel host or serial DTE interface with the MCU, or the PC Card interface with the MCUP. The SmartACFL device set consists of a Microcontroller (MCU or MCUP) in a 128-pin TQFP, a Modem Data Pump (MDP) in a 100-pin TQFP, and a Line Side Device (LSD) (SmartDAA device) in a 32-pin TQFP. The optional Voice Codec (VC), in a 32-pin TQFP, supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset. Figure 1 identifies the major hardware signal interfaces. The MCUP supports two peripheral channels, one channel for the modem and a second channel for an optional user-defined function (Function 2). Conexant's SmartDAA technology (patent pending) eliminates the need for a costly line transformer, relays, and opto-isolators typically used in discrete DAA (Data Access Arrangement) implementations. The SmartDAA architecture also simplifies product implementation by eliminating the need for country-specific components enabling worldwide homologation of a single modem board design and a single bill of materials (BOM). The SmartDAA system-powered DAA operates reliably without drawing power from the line, unlike line-powered DAAs that operate poorly when line current is insufficient due to long lines or poor line conditions. Enhanced features, such as monitoring of local extension status without going off-hook, are also supported. Incorporating Conexant’s proprietary Digital Isolation Barrier (DIB) design (patent pending) and other innovative DAA features, the SmartDAA architecture simplifies application design, minimizes layout area, and reduces component cost. Data Sheet (Preliminary) Features • V.90 data/V.17 fax modem • SmartDAA technology − System side powered DAA operates under poor line current supply conditions − Wake-on-ring − Ring detection − Line polarity reversal detection − Line current loss detection − Pulse dialing − Call waiting detection − Digital PBX line protection − Meets world-wide DC VI Masks requirements − Caller ID detection • Data/Fax/Voice call discrimination • Hardware-based modem controller • Hardware-based digital signal processor (DSP) • Voice/full-duplex speakerphone mode (S models) • V.70 DSVD using optional RCDSVD SCP (S models) • World-wide operation • Industry standard communication commands • Selectable parallel/serial interface with speeds up to 230.4 kbps − Parallel 16550A UART-compatible interface − Serial ITU-T V.24 (EIA/TIA-232-E) • V.80 synchronous access mode • Direct mode (serial interface) • Synchronous data mode (serial interface) • V.22 bis fast connect • Analog cellular direct connect • GSM direct connect • Sleep mode • Thin packages support low profile designs • +3.3V operation with +5V tolerant digital inputs Conexant Proprietary Information Doc. No.100444A December 21, 1999 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Table 1. SmartACFL Modem Models and Functions Model/Order/Part Numbers Marketing Name Device Set Order No. MCU [128-Pin TQFP] Part No. Supported Functions MDP [100-Pin TQFP] Part No. LSD [32-Pin TQFP] Part No. Optional Voice Codec (VC) [32-Pin TQFP] Part No. V.90/K56fle x Data V.34 Data V.32 bis Data, V.17 Fax, Fax Cl 1, Fax Cl 2, TAM, W-W, V.80 Voice/ FDSP SmartACFL/56S-PCC DS56-L492-001 L2702-12 P9373-11 20463-11 20437-11 Y Y Y Y SmartACFL/56-PCC DS56-L492-011 L2702-12 P9373-11 20463-11 — Y Y Y — SmartACFL/56S DS56-L492-021 L2702-15 P9373-11 20463-11 20437-11 Y Y Y Y SmartACFL/56 DS56-L492-031 L2702-15 P9373-11 20463-11 — Y Y Y — Notes: 1. Model options: S PCC 56 33 14 Voice and speakerphone PC Card host interface (serial DTE/parallel host if not PCC) 56 kbps max. rate per V.90 33.6 kbps max. rate per V.34 14.4 kbps max. rate per V.32bis 2. Supported functions (Y = Supported; — = Not supported): TAM Telephone answering machine support (handset support requires S model) Fax Cl 1 and Cl 2 Fax Class 1 and Fax Class 2 support FDSP Full-duplex speakerphone Revision History Revision A Date 12/21/99 Comments Initial public release of document Copyright © Conexant Systems, Inc., 1999. All Rights Reserved. Information in this document is provided in connection with Conexant Systems, Inc. ("Conexant") products. These materials are provided by Conexant as a service to its customers and may be used for informational purposes only. Conexant assumes no responsibility for errors or omissions in these materials. Conexant may make changes to specifications and product descriptions at any time, without notice. Conexant makes no commitment to update the information contained herein. Conexant shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Conexant’s Terms and Conditions of Sale for such products, Conexant assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF CONEXANT PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Conexant further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. Conexant shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. Conexant products are not intended for use in medical, life saving or life sustaining applications. Conexant customers using or selling Conexant products for use in such applications do so at their own risk and agree to fully indemnify Conexant for any damages resulting from such improper use or sale. The following are trademarks of Conexant Systems, Inc.: Conexant, the Conexant C symbol, “What’s Next in Communications Technologies”, SmartDAA, SmartHSF, and SmartACFL. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Reader Response: Conexant strives to produce quality documentation and welcomes your feedback. Please send comments and suggestions to [email protected]. For technical questions, contact your local Conexant sales office or field applications engineer. 2 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Introduction (continued) Applications The optional Voice Codec (VC) supports voice/fullduplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset. The optional RCDSVD Speech Codec Processor (SCP) supports DSVD. • • • • • • The modem operates by executing firmware from external 1 Mbit (128k X 8) RAM and 2 Mbit (256k X 8) ROM/Flash ROM. The 33S and 14S models can alternatively use external 1 Mbit or 2 Mbit ROM/Flash ROM and the MCU’s internal 32K X 8 RAM. For GSM support the ROM size is doubled. SmartACFL PC Cards Embedded systems Serial box modems Set top boxes Point of sales terminals Remote monitoring and data collection systems Accelerator kits and reference designs are available in electronic form to minimize application design time and costs. The design package includes schematics, bill of materials (BOM), board layout files in Gerber format, and complete documentation. The design is pretested to pass FCC Part 15, Part 68, and CTR 21 for immediate manufacturing. Microcontroller Unit (MCU) L2702: 128-Pin TQFP SmartDAA Interface Central Processor Unit (MCU) MDP Interface DAA Hardware Modem Data Pump (MDP) P9373: 100-Pin TQFP Line Side Device (LSD) 20463: 32-Pin TQFP Digital Isolation Barrier (DIB) (OEM supplied) Rectifier and Filter Components Line Side DIB Interface (LSDI) Modem Data Pump (MDP) TIP RING HS Hybrid Components (Optional) Voice Codec (VC) 20437: 32-Pin TQFP (Optional) PCCard/Parallel/ Serial DTE Interface (Mic/Speaker) SPEAKER Interface (Optional) MIC SPEAKER Cellular Interface Cellular and GSM Interface GSM Interface Digital Speaker Circuit (Optional) Serial EEPROM Interface Telephone Line MCU Interface Host Interface Internal RAM Codec Telephone Line Interface Electronic Inductor, Diode Bridge, Protection & EMI, Impedance Components SOUNDUCER Serial EEPROM 2K (256 x 8) to SPEAKER 32K (4K x 8) (Optional) RAM 1M (128K x 8) Expansion Memory Bus Interface ROM/Flash ROM 2M (256K x 8) 4M (512K X 8)* * = GSM Support MD251F2_FID Figure 1. SmartACFL Modem Major Interfaces Doc. No. 100444A Conexant Proprietary Information 3 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Detailed Features General Modem Features • Downloadable Architecture − Downloadable MCU firmware from the host/DTE − Downloadable MDP code modules from the MCU, transparent to the host • V.90 data modem with receive rates up to 56k bps and send rates up to V.34 rates − ITU-T V.90, K56flex, V.34 (33.6 kbps), V.32 bis, V.32, V.22 bis, V.22, V.23, and V.21; Bell 212A and 103 − V.42 LAPM and MNP 2-4 error correction − V.42 bis and MNP 5 data compression − MNP 10EC™ enhanced cellular performance − V.250 (ex V.25 ter) and V.251 (ex V.25 ter Annex A) commands • V.22 bis fast connect • Analog cellular direct connect • GSM direct connect • V.17 fax modem with send and receive rates up to 14.4 kbps − ITU-T V.17, V.29, V.27 ter, and V.21 ch. 2 − EIA/TIA 578 Class 1 and T.30 Class 1.0 commands • V.80 synchronous access mode supports hostcontrolled communication protocols with H.324 interface support • Data/Fax/Voice call discrimination • Hardware-based modem controller • Worldwide operation − US/Japan/Canada/TBR21 and other countries − Caller ID and distinctive ring detection − Call progress, blacklisting • Telephony/TAM − V.253 commands − 8-bit µ-Law/A-Law coding (G.711) − 8-bit/16-bit linear coding − 8 kHz sample rate − Concurrent DTMF, ring, and Caller ID detection • Full-duplex speakerphone mode (S models) − Microphone and speaker interface − Telephone handset or headset interface − Acoustic and line echo cancellation − Microphone gain and muting − Speaker volume control and muting • PC Card interface (MCUP only) supports two functions with programmable I/O and window size • JTAG Boundary Scan support 4 • Built-in host/DTE interface with speeds up to 230.4 kbps − Parallel 16550A UART-compatible interface (MCU) − Serial ITU-T V.24 (EIA/TIA-232-E) (MCU) − PC Card (MCUP) • Flow control and speed buffering • Automatic format/speed sensing • Serial sync/async data; parallel async data • Sleep mode • Thin packages support low profile designs (1.6 mm max. height) • MCU (L2702): 128-pin TQFP • MDP (P9373): 100-pin TQFP • LSD (20463): 32-pin TQFP • VC (20437): 32-pin TQFP Description General The SmartACFL device set, comprised of separate microcontroller (MCU), modem data pump (MDP), and line side device (LSD) devices, provides the processing core for a complete modem design. The optional Voice Codec (VC) supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset (S models). The S model can also be ordered with an RCDSVD Speech Codec Processor (SCP) in a 100-pin PQFP to support DSVD. Modem operation, including dialing, call progress, telephone line interface, telephone handset interface, voice/speakerphone interface, and host interface functions are supported and controlled through the V.250, V.251, and V.253-compatible command set. The modem hardware connects to the host via a parallel, serial, or PC Card interface. The OEM adds discrete components as required by the modem model and the application to complete the system (Table 1). These components may include a crystal circuit, EEPROM, DIB components, telephone line interface, optional voice/speakerphone interface, and optional cellular/GSM interface. Parallel interface operation, including cellular and GSM support, is selected by PARIF input high. Serial interface operation is selected by PARIF input low. Cellular operation is selected by LINE/CELL input low. GSM operation is selected by LINE/GSM input low. Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Data/Fax Modes In V.90/K56flex data modem mode, the modem can receive data from a digitally connected central site modem (CSM) at line speeds up to 56 kbps. Asymmetrical data transmission supports sending data up to V.34 rates; this mode can fallback to fullduplex V.34 mode, and to lower rates as dictated by line conditions. In V.34 data mode, the modem operates at line speeds up to 33.6 kbps. Error correction (V.42/MNP 2-4) and data compression (V.42 bis/MNP 5) maximize data transfer integrity and boost average data throughput up to 230.4 kbps. Non-errorcorrecting mode is also supported. Data modem modes perform complete handshake and data rate negotiations. Using V.34 modulation to optimize modem configuration for line conditions, the modem can connect at the highest data rate that the channel can support from 33600 bps down to 2400 bps with automatic fallback. Automode operation in V.34 is provided in accordance with PN3320 and in V.32 bis in accordance with PN2330. All tone and pattern detection functions required by the applicable ITU or Bell standard are supported. In V.32 bis mode, the modem operates at line speeds up to 14.4 kbps. In V.22 bis fast connect mode, the modem can connect at 2400 bps with a very short training time, which is very efficient for small data transfers. In fax modem mode, the modem can operate in 2wire, half-duplex, synchronous mode and can support Group 3 facsimile send and receive speeds of 14400, 12000, 9600, 7200, 4800, and 2400 bps. Fax data transmission and reception performed by the modem are controlled and monitored through the EIA/TIA-578 Fax Class 1, T.30 Fax Class 1.0, or Fax Class 2 command interface. Full HDLC formatting, zero insertion/deletion, and CRC generation/checking are provided. Both transmit and receive fax data are buffered within the modem. Data transfer to and from DTE is flow controlled by XON/XOFF and RTS/CTS. Doc. No. 100444A SmartACFL Synchronous Access Mode (SAM) - Video Conferencing V.80 Synchronous Access Mode between the modem and the host/DTE is provided for hostcontrolled communication protocols, e.g., H.324 video conferencing applications. Voice-call-first (VCF) before switching to a videophone call is also supported. Worldwide Operation The modem operates in US/Japan/Canada/TBR21 and other countries. Country dependent parameters for functions such as dialing, carrier transmit level, calling tone, call progress tone detection, answer tone detection, blacklisting, and relay control are programmable by ConfigurACE II for Windows. SmartDAA technology allows a single PCB design and single BOM to be homologated worldwide. Advanced features such as digital PBX protection are also supported. TAM Mode TAM Mode features include 8-bit µ-Law, A-Law, and linear coding at 8 kHz sample rate. Full-duplex voice supports concurrent voice receive and transmit. Tone detection and generation, call discrimination, and concurrent DTMF detection are also supported. ADPCM (4-bit IMA) coding is supported to meet Microsoft WHQL logo requirements. TAM Mode is supported by three submodes: 1. Online Voice Command Mode supports connection to the telephone line or, for the S model, a handset. 2. Voice Receive Mode supports recording voice or audio data input from the telephone line or, for the S model, a microphone/handset. 3. Voice Transmit Mode supports playback of voice or audio data to the telephone line or, for the S model, a speaker/handset. Conexant Proprietary Information 5 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications The voice interface can be in the form of a headset, handset or a microphone and speaker (half-duplex speakerphone). Handset echo cancellation supports handset use through a hybrid. Voice/Speakerphone Mode (S Models) S models include additional telephone handset, external microphone, and external speaker interfaces that support voice and full-duplex speakerphone operation. Hands-free full-duplex telephone operation is supported in Speakerphone Mode under host control. Speakerphone Mode features an advanced proprietary speakerphone algorithm which supports full-duplex voice conversation with acoustic, line, and handset echo cancellation. Parameters are constantly adjusted to maintain stability with automatic fallback from full-duplex to pseudo-duplex operation. The speakerphone algorithm allows position independent placement of microphone and speaker. The host can separately control volume, muting, and AGC in microphone and speaker channels. V.70 DSVD Mode using RCDSVD SCP Device (S Models) GSM (Parallel Host or PC Card Interface) GSM operation requires installation of 4M (512k x 8) ROM (56 models) or 2M ROM (33 and 14 models). ON-board DSVD is not available when the 4 Mbit ROM is installed since the MCU port PB5 is used for address line 18 rather than RCDSVD SCP chip select output (~SVOSEL). Features supported in GSM operation include: On-board DSVD operation requires installation of the optional RCDSVD SCP (R6715-14). GSM operation is not available when the RCDSVD SCP is connected because MCU port PB5 is used for SCP chip select output (~SVDSEL) rather than address line A18 output which is needed to support the 4M ROM. DSVD provides full-duplex digital simultaneous voice and data over a single telephone line. DSVD uses codecs in the RCDSVD SCP to code (compress) analog speech signals on the RCDSVD LINEIN pin or MICIN pin for passing to the modem controller in digitized form. DSVD also decodes (decompresses) coded speech received from the modem controller for routing to the RCDSVD LINEOUT pin or SPKP/SPKN pins in analog form. • Data modem − V.21, V.23, V.22, V.22 bis, V.32 − ISDN interoperability: 300 bps to 9600 bps • Transparent asynchronous mode up to 9600 bps • Non-transparent mode (RLP) up to 9600 bps • Fax modem send and receive rate up to 9600 bps • AT GSM commands (ETSI 07.07) • GSM direct connect • Firmware interface for OEM-provided phone driver • Automatic GSM cable presence detection • Built-in parallel host (16550A UART) interface Sleep Mode Sleep mode is supported in the modem device set and the RCDSVD SCP device. Additional Information DSVD operates in accordance with ITU-T interoperable G.729 and G.729 Annex A with interoperable G.729 Annex B. Voice activity detection supports speech coding at an average bit rate significantly lower than 8.0 kbps. DSVD decoder timing recovery algorithm compensates for clock skew, asynchronous host-todecoder data transfer delay, intervening variable length data block transmission delay, and loss of encoded speech data. 6 In Handset Mode, the RCDSVD SCP interfaces to the telephone interface circuit using the Line Input (LINEIN) and Line Out (LINEOUT) lines. In Headset or Speakerphone Mode, the RCDSVD SCP interfaces to the audio interface circuit using the Microphone Input (MICIN) and Speaker out (SPKR) lines. Additional information is described in the SmartACFL Modem Device Family with SmartDAA Technology for Low Power Applications Designer’s Guide (Doc. No. 100446) and the Command Reference Manual (Doc. No. 100500). Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Hardware Description SmartDAA technology (patent pending) eliminates the need for a costly analog transformer, relays, and opto-isolators that are typically used in discrete DAA implementations. The programmable SmartDAA architecture simplifies product implementation in worldwide markets by eliminating the need for country-specific components. Microcontroller (MCU/MCUP) The microcontroller is a Conexant 8-bit microcomputer with pins to support serial DTE/parallel host bus/PC Card, MDP, voice/TAM, speakerphone, and RCDSVD SCP interface operation. The operating voltage is +3.3V with +5V tolerant inputs. The MCUP incorporates a built-in PC Card interface and CIS memory allowing the MCUP to directly connect to the PC Card 68-pin socket without requiring external PICA and CIS devices. The MCU connects to the DTE/host via a V.24 (EIA/TIA-232-E) serial DTE interface or a parallel host bus depending on installed firmware, whereas the MCUP connects to a PC Card socket via built-in PC Card interface. Unless otherwise stated, references to general microcontroller functions include both the MCUP and MCU. The MCU performs the command processing and host interface functions. The crystal frequency is 28.224 MHz. The MCU outputs a 28.224 MHz clock to the MDP eliminating need for a separate MDP crystal circuit. The MCU connects to the MDP via dedicated lines and the external bus. The external bus also connects to OEM-supplied RAM (56 models), ROM/flash ROM, and to the optional RCDSVD SCP. The MCU connects to a serial EEPROM over a dedicated serial interface. Doc. No. 100444A SmartACFL Two independent functions are supported; the modem function and an optional user-defined Function 2. A Card Option Configuration Register and a Configuration and Status Register for each function allow independent configuration/control and status reporting of the respective function. The MCUP PC Card interface features include: • PC Card interface logic and memory − Internal 512-byte Card Information Structure (CIS) provides the tuple information needed to define the PC Card functionality. − CIS Table is configurable from ROM/flash memory (default) or from NVRAM (option) − Address decode logic • Modem Function − Decoding for standard COM ports in Overlapping I/O Address Mode − Independent I/O Address Mode support − Power-down mode control − Digital speaker pass-through − Supports two ring handling methods − Ring Indicate pass-through to Status Change − Six 8-bit Modem Function Card Configuration Registers Configuration Option Register (full support) Configuration and Status Register (full support) Pin Replacement Register (CREADY and RREADY) Extended Status Register (RIEvt and RIEnab) I/O Base Register 0 I/O Base Register 1 • Optional User-defined Function 2 − Reset and chip select control − Power-down mode control − 16-bit data transfer control − Disable EEPROM control − Interrupt request pass through − Four 8-bit Card Configuration Registers Configuration Option Register (full support) Configuration and Status Register (full support) I/O Base Register 0 I/O Base Register 1 • MCU and MCUP packaged in 128-pin TQFP Conexant Proprietary Information 7 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Modem Data Pump (MDP) RCDSVD Speech Codec Processor (SCP) (Optional) The Modem Data Pump (MDP) supports data/fax modem, voice record from and playback to the telephone line, and optional voice/full-duplex speakerphone operation. The MDP communicates with the MCU via parallel bus, serial data and clock, and serial voice (optional) signals. Downloadable architecture allows upgrading of MDP code from the MCU. The RCDSVD SCP (R6715-14), required for onboard DSVD operation, is packaged in a 100-pin PQFP. The 56.448 MHz crystal frequency is supplied by the MDP XCLK output. MCU/MCUP Firmware MCU/MCUP firmware performs processing of general modem control, command sets, data modem, error correction and data compression (ECC), fax class 1, fax class 2, DSVD, voice/audio/TAM/speakerphone, W-class, V.80, analog cellular, GSM, and serial DTE/parallel host/PC Card interface functions according to modem models (Table 1). The MDP, packaged in a 100-pin TQFP, includes a modem controller interface, a digital signal processor (DSP), a voice codec (VC) interface, and a SmartDAA Interface. The MDP performs telephone line signal modulation/demodulation in a hardware DSP which reduces computational load on the host processor. Downloadable architecture allows updating of MDP executable code. Configurations of the modem firmware are provided to support parallel host bus interface (MCU), serial DTE interface (MCU) or PC Card interface (MCUP) operation. The modem firmware is provided in object code form for the OEM to program into external ROM/flash ROM. The modem firmware may also be provided in source code form under a source code addendum license agreement. The SmartDAA Interface communicates with, and supplies power and clock to, the LSD through the DIB. The input clock frequency is 28.224 MHz and is supplied by the MCU. The operating voltage is +3.3V with +5V tolerant inputs. ADPCM voice processing is supported. Downloading of MDP code from the MCU is supported. Digital Isolation Barrier (DIB) (OEM Supplied) The DIB electrically DC isolates the MDP from the LSD. The MDP is connected to a fixed digital ground and operates with standard CMOS logic levels. The LSD is connected to a floating ground and can tolerate high voltage input (compatible with telephone line and typical surge requirements). A digital transformer (DXFMR) in the DIB power channel couples power and clock digital waveforms from the MDP to the LSD. The DIB data channel supports bidirectional halfduplex serial transfer of data, control, and status information between the MDP and the LSD over two lines. 8 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications SmartACFL SmartDAA Line Side Device (LSD) The LSD includes a Line Side DIB Interface (LSDI), a coder/decoder (codec), and a Telephone Line Interface (TLI). The LSDI communicates with, and receives power and clock from, the SmartDAA interface in the MDP through the DIB. LSD power is received from the top of the DIB DXFMR secondary winding through a half-wave rectifying diode and capacitive power filter circuit. The CLK input is also accepted from the top of the DXFMR secondary winding through a capacitor and a resistor in series. Information is transferred between the LSD and the MDP through the DIB_P and DIB_N pins. These pins connect to the MDP DIB_DATAP and DIB_DATAN pins, respectively, through the DIB. The TLI integrates DAA and direct telephone line interface functions and connects directly to the line TIP and RING pins, as well as to external line protection components. Direct LSD connection to TIP and RING allows realtime measurement of telephone line parameters, such as the telephone central office (CO) battery voltage and individual telephone line (copper wire) resistance. Direct LSD connection also allows dynamic regulation of the off-hook TIP and RING voltage and total current drawn from the CO. This allows the modem to maintain compliance with U.S. and worldwide regulations and to actively control the DAA power dissipation. Voice Codec (VC) The optional VC, packaged in a 32-pin TQFP, supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset. Doc. No. 100444A Conexant Proprietary Information 9 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications ~DTR GND XTLI VDD XTLO GND NC ~STPMODE ~DSR ~CTS ~RLSD ~DRSOUT ~AAIND ~RI ~TM ~RDL NC ~NMI PD2 ~AL ~RTS DPIRQ ~RLY1 ~RLY2 ~RLY3 ~RLY4 LCS PE5 PARIF ~EXTOH ~DTRIND PD1 ~ROMSEL ~DPSEL A16 A15 A14 A13 A12 A11 A10 A9 A8 VDD A7 A6 A5 A4 A3 A2 A1 A0 TDI TDO TMS TRSTP TCK GND D7 D6 D5 D4 D3 D2 D1 D0 ~TST NVMCLK ~RXD ~DPRXD ~TXCLK ~RXCLK/~SCPIRQ ~WRITE ~READ NC NC NC 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 GND VGG DV1TP CLKOUT NC NC NC NC NC RINGD NVMDATA ~TXD ~MRES ~RES NC NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 NC NC NC NC NC 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 NC NC GND NC NC NC NC NC NC NC NC NC NC NC NC NC PG3 PG2 PG1 PG0 GND ~TMIND ~WKRESOUT ~SCPSEL A17 ~RAMSEL MCU/MCUP (L2702) Pinout Diagrams 1156F3-4 PO-MCU-Ser-128T Figure 2. MCU Pin Signals - Serial DTE Interface 128-Pin TQFP 10 Conexant Proprietary Information Doc. No. 100444A SmartACFL ~HCS GND XTLI VDD XTLO GND NC ~STPMODE HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 NC ~NMI HA0 HA1 Cellular GSM RCDSVD Firmware option ~CELBSY/RXDCLK CELCLK/GSMINP0/~SCPIRQ ~WRITE ~READ NC NC NC GND VGG DV1TP CLKOUT NC NC NC NC NC RINGD NVMDATA GSMRXD ~MRES ~RES NC NC NC NC NC NC 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 HA2 ~HWT ~HRD DPIRQ ~RLY1/CTRL0 ~RLY2/CTRL1/CTRL0 ~RLY3/CELBSY ~RLY4 LCS CELDATA PARIF DAA/CELL or ~EXTOH NC NC NC 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 NC NC GND NC NC NC NC NC NC NC NC NC NC NC NC NC PG3 PG2 PG1 PG0 GND HINT ~WKRESOUT A18/~SCPSEL A17 ~RAMSEL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications ~ROMSEL ~DPSEL A16 A15 A14 A13 A12 A11 A10 A9 A8 VDD A7 A6 A5 A4 A3 A2 A1 A0 TDI TDO TMS TRSTP TCK GND D7 D6 D5 D4 D3 D2 D1 D0 ~TST NVMCLK/TXDCLK GSMTXD DAA/GSM 1156F3-5 PO-MCU-Par-128T Figure 3. MCU Pin Signals - Parallel Host Interface - 128-Pin TQFP Doc. No. 100444A Conexant Proprietary Information 11 V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications RINT_RC RINGIN ~STSCHG ~WRITE ~READ ~CH2CS ~IREQ2 ~PWRDWN2 PD4 GND XTLI VDD XTLO GND ~RESOUT2 PD3 HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 ~WAIT ~NMI HA0 HA1 Cellular GSM RCDSVD Firmware option ~CELBSY/RXDCLK CELCLK/GSMINP0/~SCPIRQ SPKROUT ~INPACK ~IREQ GND VGG DV1TP CLKOUT ~CE2 A0OUT ~IO16E ~IOIS16 ~DISEEP RINGOUT NVMDATA GSMRXD ~MRES POR_RC 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 MRDY SPKRIN RESET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 HA2 ~IOWR ~IORD DPIRQ ~RLY1/CTRL0 ~RLY2/CTRL1/CTRL0 ~RLY3/CELBSY ~RLY4 LCS CELDATA PARIF DAA/CELL or EXTOH ~OE ~WE 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 ~REG ~CE1 GND HA11 HA10 HA9 HA8 HA7 HA6 HA5 HA4 HA3 HA15 HA14 HA13 HA12 PG3 PG2 PG1 PG0 GND HINT READY A18/~SCPSEL A17 ~RAMSEL SmartACFL ~ROMSEL ~DPSEL A16 A15 A14 A13 A12 A11 A10 A9 A8 VDD A7 A6 A5 A4 A3 A2 A1 A0 TDI TDO TMS TRSTP TCK GND D7 D6 D5 D4 D3 D2 D1 D0 ~TST NVMCLK/TXDCLK GSMTXD DAA/GSM 1156F3-6 PO-MCUP-128T Figure 4. MCUP Pin Signals - PC Card Interface - 128-Pin TQFP 12 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications LSD Interface (Through DIB) MDP (P9373) Hardware Pins and Signals The DIB interface signals are: General • • • • The major functional application signals are summarized below. System Control and Status The following discrete signals are used by the host to control and monitor MDP operation: • • • • • SmartACFL Wakeup Reset (WKRES#); input Interrupt Request for MDP Interface (IRQ); output Raw Ring (SSD_RING#); output Ring Wake Reset (SSD_RINGWAKE#); output SmartDAA Interrupt for SmartDAA Interface (SSD_INT); output Digital Speaker Interface The following output is used for audible call progress or carrier monitoring in Data/Fax mode only where sound quality is not important. • Digital Speaker Output (DSPKOUT); output Clock and Power Positive (PWRCLKP); output Clock and Power Negative (PWRCLKN); output Data Positive (DIB_DATAP); input/output Data Negative (DIB_DATAN); input/output VC Interface The VC interface signals are: • • • • • • • Sleep (IASLEEP); output Master Clock (M_CLK); output Voice Serial Clock (V_SCLK); output Voice Serial Control (V_CTRL); output Voice Serial Frame Sync (V_STROBE); input Voice Serial Transmit Data (V_TXSIN); output Voice Serial Receive Data (V_RXOUT); input MDP Signal Interface and Pin Assignments The MDP (P9373) 100-pin TQFP hardware interface signals are shown in Figure 5. The MDP (P9373) 100-pin TQFP pin signals are shown in Figure 6. Host Parallel Bus Interface The parallel address, data, and control signals are: • • • • • Address Lines (A[6:0]); input Data Lines (D[7:0]), input/output Chip Select (CS#); input Read Enable (READ#); input Write Enable (WRITE#); output Host Serial Data Interface The serial data and clock signals are: • • • • Receive Data (RXD); output Receive Data Clock (RXCLK); output Transmit Data (TXD); input Transmit Data Clock (TXCLK); output Host Serial Voice Interface (S models) The serial data and clock signals are: • • • • Serial Data Out (SI_DD); output Serial Data In (SI_DU); input Serial Shift Clock (SI_CLK); input Sample Shift Clock (SI_FRAME); input Doc. No. 100444A Conexant Proprietary Information 13 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications DSPKOUT 48 MCU:CLKOUT 14 15 RCDSVD: XTLI (OPTIONAL) NC 67 66 65 64 62 61 60 59 53 52 51 50 49 25 40 55 56 57 35 MCU PARALLEL BUS INTERFACE 96 27 95 9 70 MCU 36 42 38 44 33 MCU SERIAL DATA AND CLOCK INTERFACE 24 23 20 34 MCU SERIAL VOICE INTERFACE PWRCLKP CLKIN PWRCLKP XCLK YCLK DIB_DATAP DIB_DATAN D0 (PC0) D1 (PC1) D2 (PC2) D3 (PC3) D4 (PC4) D5 (PC5) D6 (PC6) D7 (PC7) A0 (PD0) A1 (PD1) A2 (PD2) A3 (PD3) A4 (PD4) A5 A6 CS# (PD5) WRITE# (PD6) READ# (PD7) IRQ (PB5) IASLEEP M_CLK (PB0) V_SCLK (SR2CLK) V_STROBE (SA2CLK) V_TXSIN (SR3OUT) V_RXOUT (SR3IN) V_CTRL (SR2IO) MODEM DATA PUMP (MDP) P9373 100-PIN TQFP RESET# WKRES# SSD_RING# SSD_RINGWAKE# SSD_INT TXD (PA2) TXCLK (PA3) RXD (PA6) RXCLK (PA7) GP00 SI_FRAME (SA4CLK) SI_CLK (SR4CLK) SI_DU (SR8IN) SI_DD (SR8OUT) VCC NC 94 PLLVSS VDD VDD VDD VDD VDD VDD VDD VDD DDC 92 DIGITAL ISOLATION BARRIER (DIB) 93 90 89 97 5 3 1 4 2 6 SLEEP M_CLKIN M_SCK M_STROBE M_TXSIN M_RXOUT M_CNTRLSIN 98 VOICE CODEC (VC) 20437 32-PIN TQFP (OPTIONAL) +3.3V +3.3V 99 10K M_CTRL (SR1IO) M_RXOUT (SR4IN) M_TXSIN (SR4OUT) V_CLKIN (IA2CLK) M_CLKIN (IA1CLK) M_STROBE (SA1CLK) PB1 PF6 PF7 GP01 RESERVED RESERVED RESERVED RESERVED NC NC NC NC LPO_RC DIGITAL SPEAKER OUTPUT 1uF TESTP XYCNT 53.6K 84 PLLVDD 87 VGG GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 18 19 100 12 81 29 86 82 78 28 43 30 16 76 77 79 71 72 74 75 7 17 32 45 46 58 69 83 26 NC +3.3V +5V/+3.3V 8 10 11 13 21 22 31 37 39 41 47 54 63 68 73 80 85 88 91 100444A, fig5, mdp_his_p93_100t Figure 5. MDP (P9373) 100-Pin TQFP Hardware Interface Signals 14 Conexant Proprietary Information Doc. No. 100444A RESERVED RESERVED 77 76 78 GND RESERVED PB1 80 SmartACFL 79 M_STROBE (SA1CLK) M_TXSIN (SR4OUT) 82 81 LPO_RC VDD 84 83 M_CLKIN (IA1CLK) GND 86 85 GND DSPKOUT 88 DIB_DATAP DIB_DATAN 90 89 87 PWRCLKP GND 92 91 DCC PWRCLKN 94 93 RESET# SSD_RING# 96 95 PLLVDD IASLEEP 98 97 PLLVSS 100 99 M_CTRL (SR1IO) V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications V_STROBE (SA2CLK) V_RXOUT (SR3IN) 1 75 NC 2 74 NC V_SCLK (SR2CLK) V_TXSIN (SR3OUT) 3 4 73 72 NC M_CLK (PB0) V_CTRL (SR2IO) VDD 5 71 NC 6 7 70 SSD_INT VDD GND SSD_RINGWAKE# 69 GND 8 68 GND 9 67 D0 (PC0) GND 10 66 GND 11 65 D1 (PC1) D2 (PC2) M_RXOUT (SR4IN) 12 64 D3 (PC3) GND 13 63 GND XCLK 14 62 D4 (PC4) YCLK RESERVED VDD 15 16 61 17 59 D5 (PC5) D6 (PC6) D7 (PC7) TESTP 18 58 VDD XYCNT 19 57 READ# (PD7) P9373 60 SI_DU (SR8IN) 20 56 GND 21 55 WRITE# (PD6) CS# (PD5) GND 22 SI_CLK (SR4CLK) 23 54 53 A0 (PD0) 44 45 46 47 48 49 50 RXCLK (PA7) VDD VDD GND CLKIN A4 (PD4) A3 (PD3) 42 43 TXCLK (PA3) PF7 40 A6 GND 41 38 39 RXD (PA6) GND 36 37 TXD (PA2) GND 34 35 SI_DD (SR8OUT) IRQ (PB5) 32 33 VDD GP00 30 GP01 GND 31 28 29 PF6 V_CLKIN (IA2CLK) 26 51 27 52 25 VGG 24 A5 WKRES# SI_FRAME (SA4CLK) GND A1 (PD1) A2 (PD2) MD248F4 PO-HSD-100TQFP Figure 6. MDP (P9373) 100-Pin TQFP Pin Signals Doc. No. 100444A Conexant Proprietary Information 15 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications LSD Hardware Pins and Signals MDP Interface (Through DIB) The DIB interface signals are: • • • • • Clock (CLK); input Digital Power (PWR+); input power Digital Ground (DGND); digital ground Data Positive (DIB_P); input Data Negative (DIB_N); input Telephone Line Interface The telephone line interface signals are: • • • • • • • • • • • • • • • • • RING AC Coupled (RAC1); input TIP AC Coupled (TAC1); input Electronic Inductor Resistor (EIR); output TIP and RING DC Measurement (TRDC); input DAC Output Voltage (DAC); output Electronic Inductor Capacitor (EIC) Electronic Inductor Output (EIO) Electronic Inductor Feedback (EIF) Resistive Divider Midpoint (DCF) Transmit Analog Output (TXA); output Receive Analog Input (RXI); input Receiver Gain (RXG); output MOV Enable (MOVEN); output World-wide Impedance 0 (ZW0); input US Impedance 0 (ZUS0); input Transmit Feedback (TXF); input Transmit Output (TXO); output LSD Signal Interface and Pin Assignments The LSD (20463) 32-pin TQFP hardware interface signals are shown by major interface in Figure 7. The LSD (20463) 32-pin TQFP pin signals are shown in Figure 8. 16 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications RAC1 TAC1 EIR EIC DAC TRDC EIO EIF RXG RXI TXA DIGITAL ISOLATION BARRIER (DIB) 27 1K 10 pF 10 NC POWER AND CLOCK CHANNEL 24 26 PWRCLKP 0.1uF 10uF 25 23 DATA CHANNEL DIB_DATAN 10 pF 10 pF CLK MOVEN (GPIO1) Ring In Filter 15 2 6 5 21 22 Electronic Inductor, Offhook, Pulse Dial, and TIP and RING VI Control 4 3 18 Echo Cancellation and Receiver AVDD DVDD LINE SIDE DEVICE ZW0 (LSD) ZUS0 20463 TXO TXF 32-PIN TQFP DGND AGND DCF Safety and EMI Protection RJ11 Jack TIP RING AGND_LSD Pulse Dial Voltage Protection (Country Specific) 32 PWR+ 0.1uF PWRCLKN DIB_DATAP 31 9 11 SmartACFL 14 17 20 19 Impedance Matching and Transmitter 16 GND_LSD 1 K AGND_LSD 28 1 K 29 AGND_LSD DIB_P VREF 8 DIB_N 0.1uF VC 10 uF 7 0.1uF AGND_LSD AGND_LSD RBIAS 13 143K AGND_LSD GPIO2 POR 1 30 NC VDD 100444A_HIS_20463_Smart ACFL DVDD DGND DIB_N DIB_P CLK 27 26 25 30 29 28 MOVEN (GPIO1) 32 31 PWR+ POR Figure 7. LSD (20463) 32-Pin TQFP Hardware Interface Signals GPIO2 1 24 EIC RXI 2 3 23 22 AVDD AGND EIF RXG 4 TRDC DAC VC VREF 5 6 21 20 19 TXO TXF 18 17 TXA ZUS0 20463 12 15 16 TAC2 RBIAS ZW0 EIR DCF 13 14 9 10 11 RAC2 TAC1 RAC1 7 8 EIO MD245F6 PO-20463-32T Figure 8. LSD (20463) 32-Pin TQFP Pin Signals Doc. No. 100444A Conexant Proprietary Information 17 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications VC (20437) Hardware Pins and Signals (S Models) General Microphone and analog speaker interface signals, as well as telephone handset/head interface signals are provided to support functions such as speakerphone mode, telephone emulation, microphone voice record, speaker voice playback, and call progress monitor. Speakerphone Interface The following signals are supported: • Speaker Out (M_SPKR_OUT); analog output Should be used in speakerphone designs where sound quality is important. • Microphone (M_MIC_IN); analog input Telephone Handset/Headset Interface • Telephone Input (M_LINE_IN), input (TELIN) – Optional connection to a telephone handset a telephone handset interface circuit. • Telephone output (M_LINE_OUTP); output (TELOUT) - Optional connection to a telephone handset interface circuit. • Center Voltage (VC_HANDSET); output reference voltage. MDP Interface The following interface signals are supported: • • • • • • • • Reset (POR); input Sleep (SLEEP); input Master Clock (M_CLKIN); input. Serial Clock (M_SCK); output. Control (M_CNTRLSIN); input Serial Frame Sync (M_STROBE); output. Serial Transmit Data (M_TXSIN); input. Serial Receive Data (M_RXOUT); output. VC Interface Signals and Pin Assignments The VC (20437) 32-pin TQFP hardware interface signals are shown by major interface in Figure 9. The VC (20437) 32-pin TQFP pin signals are shown in Figure 10. 18 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications MODEM DATA PUMP (MSD) 1 4 19 21 23 20 22 18 IASLEEP DRESET# M_CLK V_SCLK V_STROBE V_TXSIN V_RXOUT V_CTRL 2 M_DIG_SPEAKER SLEEP POR M_CLKIN M_SCK M_STROBE M_TXSIN M_RXOUT M_CNTRLSIN 14 9 M_LINE_IN M_LINE_OUTP 10 M_LINE_OUTM 17 25 +3.3V 5 VAA (+3.3V) 28 26 VDD VDD MAVDD NC 13 3 M_MIC_IN M_SPKR_OUT MIC SPK OUT AUDIO CIRCUIT TELIN TELOUT HANDSET INTERFACE NC 11 VREF VOICE CODEC (VC) 20437 32-PIN TQFP SmartACFL FERRITE VC_HAND 0.1 VC 10 12 FERRITE 0.1 10 VSS SET3V_BAR2 GND AGND 6 27 M_MIC_BIAS M_RELAYA M_RELAYB M_ACT90 M_1BIT_OUT D_LPBK_BAR NC NC NC MAVSS VSUB AGND 15 24 16 29 30 31 7 8 32 NC MD248F7 20437-HIS 25 VSUB SET3V_BAR2 VDD 26 M_ACT90 VSS 29 28 27 NC D_LPBK_BAR M_1BIT_OUT 32 31 30 Figure 9. VC (20437) 32-Pin TQFP Hardware Interface Signals 24 23 1 M_RELAYA M_STROBE SLEEP M_DIG_SPEAKER M_SPKR_OUT 2 3 22 M_RXOUT POR 4 21 M_SCK MAVDD MAVSS NC 5 20 6 19 M_TXSIN M_CLKIN 7 NC 8 18 17 M_CNTRLSIN VDD 12 13 14 15 16 VC M_MIC_IN M_LINE_IN M_MIC_BIAS M_RELAYB 9 10 11 M_LINE_OUTP M_LINE_OUTM VREF 20437 MD241F8 PO-20437_32T Figure 10. VC (20437) 32-Pin TQFP Pin Signals Doc. No. 100444A Conexant Proprietary Information 19 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications Electrical and Environmental Specifications Table 2. Operating Conditions Parameter Symbol Limits Units VDD MCU, MDP, VC: +3.0 to +3.6 VDC TA -0 to +70 °C Symbol Limits Units Supply Voltage VDD -0.5 to +4.6 VDC Input Voltage VIN -0.5 to (VIO +0.5)* VDC TSTG -55 to +125 °C Analog Inputs VIN -0.3 to (VAA + 0.5) VDC Voltage Applied to Outputs in High Impedance (Off) State VHZ -0.5 to (VIO +0.5)* VDC DC Input Clamp Current IIK ±20 mA DC Output Clamp Current IOK ±20 mA Static Discharge Voltage (25°C) VESD ±2500 VDC Latch-up Current (25°C) ITRIG ±400 mA Supply Voltage Operating Temperature Range Table 3. Absolute Maximum Ratings Parameter Storage Temperature Range * VIO = +3.3V ± 0.3V or +5V ± 5%. Table 4. Current and Power Requirements Mode Typ Current (Ityp) (mA) Max Current (Imax) (mA) Typ Power (Ptyp) (mW) Max Power (Pmax) (mW) Notes MCU (L2702-xx) Normal Mode TBD TBD TBD TBD f = 28.224 MHz Sleep Mode TBD TBD TBD TBD f = 28.224 MHz Stop Mode TBD TBD TBD TBD f = 0 MHz MDP (P9373) Normal Mode TBD TBD TBD TBD f = 28.224 MHz Sleep Mode TBD TBD TBD TBD f = 28.224 MHz Stop Mode TBD TBD TBD TBD f = 0 MHz TBD TBD TBD TBD Normal Mode: On-hook, idle, waiting for ring TBD TBD TBD TBD Low Power Mode TBD TBD TBD TBD LSD (20463) Normal Mode: Off-hook, normal data connection VC (20437) 1. 2. 3. 4. 5. 6. 7. 20 Normal Mode TBD TBD TBD TBD Sleep Mode TBD TBD TBD TBD Stop Mode TBD TBD TBD TBD Operating voltage: VDD = +3.3V ± 0.3V. Test conditions: VDD = +3.3V for typical values; VDD = +3.6V for maximum values. Input Ripple ≤ 0.1 Vpeak-peak. f = Internal frequency. Stop Mode is the same as Sleep Mode with clocks turned off. Typical current (Ityp) estimated; Max current estimated from Ityp: Imax = Ityp * 1.1. Typical power (Ptyp) computed from Ityp: Ptyp = Ityp * 3.3V; Max power (Pmax) computed from Imax: Pmax = Imax * 3.6V. Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications SmartACFL Package Dimensions The package dimensions are shown in Figure 11 (128-pin TQFP), Figure 12 (100-pin TQFP) and Figure 13 (32-pin TQFP). E E1 E2 PIN 1 REF D D1 D1 D2 e b Dim. A A1 A2 DETAIL A E1 D D1 D2 E E1 E2 A2 0.15 0.05 1.4 REF 22.25 21.75 20.0 REF 0.0630 MAX 0.0020 0.8563 0.8760 0.7874 REF 18.5 REF 16.25 15.75 14.0 REF 0.0059 0.0551 REF 0.7283 REF 0.6201 0.6398 0.5512 REF 12.5 REF 0.4921 REF 0.0197 0.0295 L1 0.75 0.5 1.0 REF e 0.50 BSC 0.0197 BSC L A Inches Max. Min. Millimeters Max. Min. 1.6 MAX 0.0394 REF b 0.17 0.27 0.0067 0.0106 c 0.17 0.11 0.08 MAX 0.0043 0.0067 Coplanarity 0.0031 MAX Ref: 128-PIN TQFP (GP00-D264) c A1 L * Metric values (millimeters) should be used for PCB layout. English values (inches) are converted from metric values and may include round-off errors. L1 DETAIL A PD-TQFP-128 (040395) Figure 11. Package Dimensions - 128-Pin TQFP Doc. No. 100444A Conexant Proprietary Information 21 SmartACFL V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications 16.00 ± 0.15 14.00 ± 0.05 12.00 REF 14.00 ± 0.05 13.87 ± 0.05 16.00 ± 0.15 14.00 ± 0.05 12.00 REF PIN 1 REF 0.22 ± 0.05 0.500 BSC 13.87 ± 0.05 DETAIL A 14.00 ± 0.05 0.50 REF 1.00 ± .05 0.14 ± .03 0.60 +0.15, -0.10 0.10 ± .05 Ref. 100-PIN TQFP (GP00-D530) COPLANARITY = 0.08 MAX. 1.00 REF DETAIL A PD-TQFP-100-D530 (032699) Figure 12. Package Dimensions - 100-Pin TQFP 22 Conexant Proprietary Information Doc. No. 100444A V.90/K56flex Modem Device Sets with SmartDAA Technology for Low Power Applications SmartACFL D D1 D2 PIN 1 REF D D1 D1 D2 b e DETAIL A Dim. A A1 D1 A2 D D1 A A2 Inches Max. Min. Millimeters Max. Min. 1.6 MAX 0.0630 MAX 0.15 0.05 1.4 REF 0.0020 9.25 8.75 7.0 REF 0.3445 0.0059 0.0551 REF 0.3642 0.2756 REF D2 5.6 REF L 0.0197 0.0295 L1 0.75 0.5 1.0 REF e 0.80 BSC 0.0315 BSC 0.2205 REF 0.0394 REF b 0.30 0.40 0.0118 0.0157 c 0.19 0.13 0.10 MAX 0.0051 0.0075 Coplanarity 0.004 MAX Ref: 32-PIN TQFP (GP00-D262) c A1 * Metric values (millimeters) should be used for PCB layout. English values (inches) are converted from metric values and may include round-off errors. L L1 DETAIL A PD-TQFP-32 (040395) Figure 13. Package Dimensions - 32-Pin TQFP Doc. No. 100444A Conexant Proprietary Information 23 Further Information: [email protected] 1-800-854-8099 (North America) 33-14-906-3980 (International) Web Site www.conexant.com Hong Kong Phone: (852) 2 827 0181 Fax: (852) 2 827 6488 India Phone: (91 11) 692 4780 Fax: (91 11) 692 4712 World Headquarters Conexant Systems, Inc. 4311 Jamboree Road, P.O. 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